CN113383282B - 校正离子注入半导体制造工具中的部件故障 - Google Patents

校正离子注入半导体制造工具中的部件故障 Download PDF

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CN113383282B
CN113383282B CN202080012043.5A CN202080012043A CN113383282B CN 113383282 B CN113383282 B CN 113383282B CN 202080012043 A CN202080012043 A CN 202080012043A CN 113383282 B CN113383282 B CN 113383282B
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window
sensor data
ion implantation
components
fault
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CN113383282A (zh
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廖天庆
西马·迪达里
哈里克里希南·拉贾戈帕尔
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Applied Materials Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
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    • G—PHYSICS
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    • G06N3/00—Computing arrangements based on biological models
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    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
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    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/0985—Hyperparameter optimisation; Meta-learning; Learning-to-learn
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/28—Databases characterised by their database models, e.g. relational or object models
    • G06F16/284—Relational databases
    • G06F16/285—Clustering or classification
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/20—Ensemble learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/048—Activation functions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/01—Dynamic search techniques; Heuristics; Dynamic trees; Branch-and-bound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30405—Details
    • H01J2237/30427—Details using neural networks or fuzzy logic

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
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  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Automation & Control Theory (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202080012043.5A 2019-01-31 2020-01-17 校正离子注入半导体制造工具中的部件故障 Active CN113383282B (zh)

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US16/264,034 2019-01-31
US16/264,034 US11348813B2 (en) 2019-01-31 2019-01-31 Correcting component failures in ion implant semiconductor manufacturing tool
PCT/US2020/014197 WO2020159730A1 (en) 2019-01-31 2020-01-17 Correcting component failures in ion implant semiconductor manufacturing tool

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210133213A1 (en) * 2019-10-31 2021-05-06 Vettd, Inc. Method and system for performing hierarchical classification of data
WO2020210227A1 (en) * 2019-04-11 2020-10-15 Presenso, Ltd. Detection and prediction of machine failures using online machine learning
US11226805B2 (en) * 2019-07-31 2022-01-18 Dell Products L.P. Method and system for predicting upgrade completion times in hyper-converged infrastructure environments
JP7414589B2 (ja) * 2020-03-04 2024-01-16 住友重機械イオンテクノロジー株式会社 イオン注入装置およびモデル生成方法
CN116457802A (zh) * 2020-10-30 2023-07-18 日立数据管理有限公司 利用未被标记的传感器数据对工业系统中的罕见故障的自动实时检测、预测和阻止
CN112560327B (zh) * 2020-11-13 2024-03-12 盐城工学院 一种基于深度梯度下降森林的轴承剩余寿命预测方法
CN116762045A (zh) * 2020-12-02 2023-09-15 日立能源瑞士股份公司 高压设备的预断
JPWO2022224693A1 (enExample) * 2021-04-19 2022-10-27
EP4242904A3 (en) * 2021-07-02 2023-11-01 Comet AG Method for machine learning a detection of at least one irregularity in a plasma system
US20230008072A1 (en) * 2021-07-08 2023-01-12 Applied Materials, Inc. Method and mechanism for contact-free process chamber characterization
US12247283B2 (en) * 2021-07-09 2025-03-11 Applied Materials, Inc. Method and apparatus for controlled ion implantation
KR20240063109A (ko) * 2021-09-02 2024-05-09 에이에스엠엘 네델란즈 비.브이. 선택된 패턴 세트를 평가하는 방법
US20230113095A1 (en) * 2021-10-13 2023-04-13 Applied Materials, Inc. Verification for improving quality of maintenance of manufacturing equipment
CN114492184A (zh) * 2022-01-21 2022-05-13 北京科技大学 一种时频域分析航空发动机剩余使用寿命预测方法及装置
US11892821B2 (en) * 2022-03-15 2024-02-06 Applied Materials, Inc. Communication node to interface between evaluation systems and a manufacturing system
WO2023181265A1 (ja) * 2022-03-24 2023-09-28 株式会社日立ハイテク 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
CN116046078A (zh) * 2023-03-31 2023-05-02 东莞市楷德精密机械有限公司 一种半导体清洗设备的故障监测预警方法及系统
US20240355592A1 (en) * 2023-04-24 2024-10-24 Applied Materials, Inc. Uniform plasma processing with a linear plasma source
US11995401B1 (en) 2023-04-30 2024-05-28 The Strategic Coach Inc. Systems and methods for identifying a name
WO2025064622A1 (en) * 2023-09-19 2025-03-27 Eli Lilly And Company Downtime prediction for management of machines in manufacturing network
CN117421679B (zh) * 2023-10-08 2024-06-18 宁波创基机械股份有限公司 一种注塑机周期管控方法、装置、电子设备及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2882796A1 (en) * 2007-05-16 2009-02-12 Power Analytics Corporation Real-time predictive systems for intelligent energy monitoring and management of electrical power networks
CN105353702A (zh) * 2015-11-17 2016-02-24 国家电网公司 高压设备智能监控系统

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613015A (ja) * 1992-06-25 1994-01-21 Nissin Electric Co Ltd イオン注入装置
JPH08153486A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd イオン注入装置
JP3265969B2 (ja) * 1995-07-07 2002-03-18 日新電機株式会社 イオン注入制御装置
JPH1012180A (ja) * 1996-06-17 1998-01-16 Nissin Electric Co Ltd イオン注入装置のファラディ
US6055460A (en) * 1997-08-06 2000-04-25 Advanced Micro Devices, Inc. Semiconductor process compensation utilizing non-uniform ion implantation methodology
US6895293B2 (en) 2000-09-14 2005-05-17 Applied Materials, Inc. Fault detection and virtual sensor methods for tool fault monitoring
JP2003077907A (ja) 2001-08-31 2003-03-14 Toshiba Corp 生産装置の異常停止回避方法及び異常停止回避システム
US6960774B2 (en) 2003-11-03 2005-11-01 Advanced Micro Devices, Inc. Fault detection and control methodologies for ion implantation processes, and system for performing same
US8078552B2 (en) * 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
US7755066B2 (en) * 2008-03-28 2010-07-13 Varian Semiconductor Equipment Associates, Inc. Techniques for improved uniformity tuning in an ion implanter system
US8501631B2 (en) * 2009-11-19 2013-08-06 Lam Research Corporation Plasma processing system control based on RF voltage
CN109283800B (zh) * 2014-02-12 2021-01-01 Asml荷兰有限公司 过程窗口的优化方法
JP6151227B2 (ja) 2014-08-25 2017-06-21 株式会社東芝 異常検知システム及び半導体デバイスの製造方法
US9508529B2 (en) * 2014-10-23 2016-11-29 Lam Research Corporation System, method and apparatus for RF power compensation in a plasma processing system
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US10984338B2 (en) * 2015-05-28 2021-04-20 Raytheon Technologies Corporation Dynamically updated predictive modeling to predict operational outcomes of interest
FR3046265B1 (fr) * 2015-12-29 2018-08-10 Thales Systeme de surveillance d'une installation industrielle ; procedes de configuration et de surveillance associes
US20170364818A1 (en) * 2016-06-17 2017-12-21 Business Objects Software Ltd. Automatic condition monitoring and anomaly detection for predictive maintenance
US10490116B2 (en) * 2016-07-06 2019-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, and display system
KR101744194B1 (ko) 2016-08-19 2017-06-09 인하대학교 산학협력단 반도체 fab 제조공정에서 유클리드 거리를 활용한 웨이퍼 자동 불량 검사 분류 예측 장치 및 방법
CN109791511A (zh) 2016-09-29 2019-05-21 惠普发展公司，有限责任合伙企业 部件故障预测
CN106354123A (zh) * 2016-11-01 2017-01-25 武汉理工大学 基于物联网的大型机械设备故障自动检测系统
TWI632441B (zh) 2017-01-20 2018-08-11 財團法人工業技術研究院 機台的預診斷方法及預診斷裝置
JP6860406B2 (ja) 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
CN107024267A (zh) * 2017-04-12 2017-08-08 无锡研测技术有限公司 基于径向基神经网络的称重设备传感器故障检测方法
CN107238507B (zh) * 2017-06-20 2019-12-31 佛山市南海区广工大数控装备协同创新研究院 一种基于深度学习的工业设备故障预测方法
CN108304941A (zh) * 2017-12-18 2018-07-20 中国软件与技术服务股份有限公司 一种基于机器学习的故障预测方法
CN109102189B (zh) * 2018-08-10 2022-02-11 杨璇 一种电气设备健康管理系统和方法
JP7233201B2 (ja) 2018-11-20 2023-03-06 東京エレクトロン株式会社 搬送ユニットの監視方法及び監視装置並びに監視用モデル

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2882796A1 (en) * 2007-05-16 2009-02-12 Power Analytics Corporation Real-time predictive systems for intelligent energy monitoring and management of electrical power networks
CN105353702A (zh) * 2015-11-17 2016-02-24 国家电网公司 高压设备智能监控系统

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US20220301903A1 (en) 2022-09-22
KR102539586B1 (ko) 2023-06-01
JP2023085255A (ja) 2023-06-20
CN119398192A (zh) 2025-02-07
TW202329188A (zh) 2023-07-16
US11862493B2 (en) 2024-01-02
TW202044314A (zh) 2020-12-01
US20200251360A1 (en) 2020-08-06
TWI851071B (zh) 2024-08-01
US11348813B2 (en) 2022-05-31
KR20230084317A (ko) 2023-06-12
JP7238146B2 (ja) 2023-03-13
KR102731064B1 (ko) 2024-11-14
WO2020159730A1 (en) 2020-08-06
JP2022523101A (ja) 2022-04-21
JP7472344B2 (ja) 2024-04-22
KR20210109673A (ko) 2021-09-06
CN113383282A (zh) 2021-09-10
TWI797418B (zh) 2023-04-01

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