JP2023050794A - cable connection structure - Google Patents

Abstract

To provide a cable connection structure capable of easily suppressing air bubble occurrence in an embedding member.SOLUTION: A cable connection structure comprises: an electronic part having four electrodes 532 on an electrode formation plane 531; four solders 6 provided on four electrode planes 532s; a cable having four electric wires 30 each of which is connected to one of four solders 6; and an embedding member 4 embedding the four solders 6 and the four electric wires 30. As a boundary between the solder 6 and the electric wires 30, in view from a normal line X of the electrode formation plane 531, there is formed an eccentric boundary 8 which is eccentric to a distant side from the at least another one boundary 8 to the electrode plane 532s. In view from the normal direction X, a direction where a center C1 of the eccentric boundary 8 and a center C2 of the electrode plane 532s are arranged, is an arrangement direction, and the center C1 side to the center C2 is an eccentric side, the solders 6 are configured so that a width W1 in the arrangement direction on a part on a non-eccentric side from the eccentric boundary 8 is greater than a width W2 of the arrangement direction on a part on the eccentric side from the eccentric boundary 8.SELECTED DRAWING: Figure 11

Description

The present invention relates to a cable connecting structure.

Patent Document 1 discloses an endoscope including an imaging device having an imaging element and a coaxial cable having four electric wires connected to four electrodes arranged vertically and horizontally on an electrode forming surface of the imaging device. is disclosed. In the endoscope described in Patent Document 1, the ends of the plurality of electric wires on the side of the electrode forming surface are embedded in an embedding member made of adhesive or the like.

JP 2019-180603 A

However, in the endoscope described in Patent Document 1, the molten resin forming the embedded member is difficult to enter the gaps between the electric wires, and there is a possibility that air bubbles are formed in the embedded member after curing. When air bubbles are formed in the embedded member, the air bubbles expand or contract due to, for example, changes in temperature or air pressure, and external pressure is likely to be applied to the connecting portion.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a cable connection structure that can easily suppress the formation of air bubbles in an embedded member.

In order to achieve the above objects, the present invention provides an electronic component having a plurality of electrodes on an electrode forming surface, a plurality of solders provided on the respective electrode surfaces of the plurality of electrodes, and a cable having a plurality of connected electric wires; and an embedding member for embedding the plurality of solders and the plurality of electric wires, which is formed by curing molten resin filled around the plurality of solders and the plurality of electric wires. and, as a boundary portion between the solder and the electric wire, there is an eccentric boundary portion that is eccentric with respect to the electrode surface when viewed from the normal direction of the electrode forming surface, and the eccentric boundary portion is , the electrode surface is eccentric to the side far from at least one other boundary, and the direction in which the center of the eccentric boundary and the center of the electrode surface line up when viewed from the normal direction The eccentric boundary portion is defined as the eccentric side, and the side opposite to the eccentric side is the anti-eccentric side. wherein the width in the alignment direction of the portion on the anti-eccentric side from the eccentric boundary portion is larger than the width in the alignment direction of the portion on the eccentric side from the eccentric boundary portion I will provide a.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the cable connection structure which tends to suppress that a bubble is formed in an embedding member.

1 is a schematic configuration diagram of an endoscope system provided with a cable connection structure according to a first embodiment; FIG. FIG. 4 is an end view showing the tip surface of the camera head in the first embodiment; FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2; 4 is an enlarged plan view of the periphery of a connection portion between a cable and an imaging device of the cable connection structure according to the first embodiment; FIG. 4 is an enlarged side view of the periphery of a connection portion between a cable of the cable connection structure and the imaging device in the first embodiment; FIG. FIG. 2 is an enlarged perspective view of the periphery of a connecting portion between a cable of a cable connecting structure and an imaging device in the first embodiment, omitting the illustration of an embedding member; FIG. 5 is a cross-sectional view taken along line VII-VII in FIG. 4, and is a cross-sectional view passing through the boundary between the solder and the wire. FIG. 5 is a cross-sectional view taken along line VIII-VIII of FIG. 4; FIG. 5 is a cross-sectional view taken along line IX-IX in FIG. 4; 1 is a cross-sectional view of a cable connection structure including a separation region and an access region for wires in the first embodiment; FIG. 11 is an enlarged view enlarging the vicinity of the solder in FIG. 10; FIG. FIG. 8 is an enlarged view enlarging the vicinity of the solder located on the upper left of FIG. 7; FIG. 10 is a side view of the cable showing a bending step of the cable connection structure in the first embodiment; FIG. 10 is a plan view showing a step of aligning the cable connection structure in the first embodiment; FIG. 10 is a front view showing a step of aligning the cable connection structure in the first embodiment; FIG. 4 is a plan view showing a joining step of the cable connection structure in the first embodiment; FIG. 10 is an enlarged side view of the periphery of a connecting portion between a cable of a cable connection structure and an imaging device in the second embodiment;

[First embodiment]
A first embodiment of the present invention will be described with reference to FIGS. 1 to 16. FIG. It should be noted that the embodiment described below is shown as a preferred specific example for carrying out the present invention, and there are portions that specifically illustrate various technically preferable technical matters. , the technical scope of the present invention is not limited to this specific embodiment.

FIG. 1 is a schematic configuration diagram of an endoscope system 10 provided with the cable connection structure of this embodiment. The endoscope system 10 includes an endoscope 100, an image processing device 15 that processes image information obtained by the endoscope 100, and a display device 16 that displays an image processed by the image processing device 15 on a screen 161. and a liquid supply device 17 for discharging camera lens cleaning liquid or the like in accordance with the operation of a foot switch 171 .

The endoscope 100 includes an operation section 11 , an insertion tube 12 and a camera head 13 . The operation part 11 is a part operated by a doctor. The operation unit 11 is connected to the image processing device 15 via a communication cable 14 and connected to the liquid supply device 17 via a hose 18 . The insertion tube 12 connects the operation section 11 and the camera head 13 . The length of the insertion tube 12 is, for example, 1 m or more and 4 m or less. The camera head 13 is inserted into the subject's body together with part of the insertion tube 12 . Hereinafter, the side where the camera head 13 is positioned with respect to the insertion tube 12 is called the distal side, and the opposite side is sometimes called the proximal side.

FIG. 2 is an end view showing the tip surface of the camera head 13. As shown in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. The camera head 13 has an outer cylindrical body 131 made of resin and a cover body 132 that closes the front end surface of the outer cylindrical body 131 . Inside the outer cylindrical body 131 and the insertion tube 12, a tube 19 for circulating the liquid supplied from the liquid supply device 17, an optical fiber (not shown), and a cable 3, which will be described later, are inserted. Further, inside the outer cylindrical body 131, an imaging device 5, which will be described later, is arranged.

The cover body 132 is formed with a through hole 132a into which the tip of the imaging device 5 is fitted and a through hole 132b into which the tip of the tube 19 is fitted. Further, the cover body 132 is provided with an irradiation window 132c that emits irradiation light for irradiating the imaging target region. Light guided by an optical fiber (not shown) is irradiated through the irradiation window 132c.

As shown in FIG. 3, the imaging device 5 includes a cylindrical body 51, a translucent imaging window 52 fixed to one end of the cylindrical body 51, an imaging device 53 fixed to the other end of the cylindrical body 51, and It has a plurality of lenses 54 arranged between the imaging window 52 and the imaging device 53 . The imaging element 53 can be, for example, a CMOS image sensor, a CCD (Charge-Coupled Device) image sensor, or the like. The imaging device 5 converts the information of the optical image formed on the imaging device 53 into an electrical signal and outputs the electrical signal to the image processing device 15 through the cable 3 .

FIG. 4 is an enlarged plan view of the periphery of the connecting portion between the cable 3 of the cable connection structure 1 and the imaging device 5. As shown in FIG. FIG. 5 is an enlarged side view of the periphery of the connecting portion between the cable 3 of the cable connection structure 1 and the imaging device 5. As shown in FIG. FIG. 6 is an enlarged perspective view of the periphery of the connecting portion between the cable 3 and the imaging device 5 of the cable connection structure 1, omitting an embedded member (see reference numeral 4 in FIGS. 4, 5, etc.) to be described later. It is a diagram. 7 is a cross-sectional view taken along line VII--VII in FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 4. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 4. FIG.

As shown in FIGS. 6 to 8, four electrodes 532 are formed on an electrode forming surface 531, which is a surface on the proximal side of the imaging device 5. As shown in FIG. As shown in FIG. 7, the electrode forming surface 531 is formed in a rectangular shape, and the length L of each side can be set to 0.6 mm or more and 1.1 mm or less, for example. The four electrodes 532 are formed as electrodes of the imaging device 53 .

As shown in FIG. 7, the four electrodes 532 are arranged on an imaginary circle C with one point on the electrode forming surface 531 as the center C0, and are arranged at four vertexes of the square. In this embodiment, the four electrodes 532 are a power supply electrode 532a for powering the imaging device 5 and an information output electrode 532b for outputting an imaging signal converted from the information of the optical image coupled to the imaging element 53. , a command receiving electrode 532c for receiving a command signal for causing a predetermined operation (such as an imaging operation) in the imaging device 5, and a ground electrode 532d connected to the ground potential. Also, as shown in FIGS. 4, 5, and 7, the shortest distance SD1 between the electrodes 532 adjacent in the circumferential direction along the virtual circle C can be, for example, 0.1 mm or more and 0.3 mm or less. . A cable 3 is arranged so as to be electrically connected to each of the four electrodes 532 .

As shown in FIG. 9, the cable 3 includes four electric wires 30 connected to four electrodes 532, a shield conductor 36 that collectively covers the four electric wires 30, and an outer sheath 37 that covers the shield conductor 36. It is a multi-core cable. The four electric wires 30 include three coaxial wires 31 and one drain wire 32 .

The three coaxial lines 31 are a power supply coaxial line 31a connected to the power supply electrode 532a, an information transmission coaxial line 31b connected to the information output electrode 532b, and a command transmission coaxial line connected to the command reception electrode 532c. line 31c. The power supply coaxial line 31a supplies the imaging device 5 with electric power for power supply. The information transmission coaxial line 31b transmits the imaging signal output from the information output electrode 532b. The command transmission coaxial line 31c transmits a command signal output from the command reception electrode 532c. Hereinafter, the coaxial line 31a for power supply, the coaxial line for information transmission 31b, and the coaxial line for command transmission 31c will simply be referred to as the coaxial line 31 unless otherwise specified.

The coaxial line 31 includes an inner conductor 311 as a core wire, an inner insulator 312 covering the outer circumference of the inner conductor 311 , and an outer conductor 313 covering the outer circumference of the inner insulator 312 . The internal conductor 311 is a twisted wire obtained by twisting a plurality of strands 311a. The diameter of the inner conductor 311 is 0.1 mm or less. More specifically, the diameter of the inner conductor 311 can be, for example, 40 to 46 AWG (0.048 mm or more and 0.093 mm or less in diameter). AWG is an abbreviation for American Wire Gauge. In addition, when the inner conductor 311 is composed of a stranded wire as in this embodiment, the diameter of the inner conductor 311 is the diameter of the circumscribed circle of the plurality of strands forming the inner conductor 311 .

An internal insulator 312 surrounding the internal conductor 311 is made of an electrically insulating resin. The diameter of the inner insulator 312 can be, for example, greater than or equal to 0.1 mm and less than or equal to 0.25 mm.

The outer conductor 313 is configured by spirally winding a plurality of strands 313 a laterally so as to be in contact with the outer peripheral surface of the inner insulator 312 . In addition, the outer conductor 313 may be configured by braiding a plurality of strands, or may be configured by a metal foil covering the outer peripheral surface of the inner insulator 312 . Alternatively, the outer conductor 313 may be configured by vertically or horizontally winding a conductive tape, which is a strip made of resin and has a conductive layer formed on one side or both sides thereof, around the inner insulator 312 .

The drain line 32 is connected to the ground electrode 532d. The drain wire 32 is formed by twisting a plurality of strands 32a. The drain wire 32 does not have an electrically insulating coating, is electrically connected to the outer conductor 313 of each coaxial line 31 and the shield conductor 36, and has a ground potential.

The shield conductor 36 is configured by spirally winding a plurality of strands 36a of the coaxial line 31 horizontally. The shield conductor 36 may be composed of a braided wire obtained by braiding a plurality of strands, or may be composed of a metal foil arranged on the inner peripheral surface of the outer cover 37 . Alternatively, the shield conductor 36 may be configured by vertically or horizontally winding a conductive tape, in which a conductive layer is formed on one side or both sides of a strip made of resin, around the four electric wires 30 .

The jacket 37 collectively covers the four wires 30 and the shield conductors 36 except for the ends on the electrode forming surface 531 side. The outer skin 37 is made of, for example, an electrically insulating resin in a cylindrical shape. The shield conductor 36 and the outer conductors 313 of the three coaxial lines 31 are cut at the tip position of the outer sheath 37, and as shown in FIGS. Conductor 311 and inner insulator 312 as well as drain wire 32 are exposed.

The part of the coaxial line 31 exposed from the outer skin 37 to the tip side consists of the exposed insulation part 314 where the inner insulator 312 is exposed from the outer conductor 313 and the outer skin 37 to the tip side, and the side of the inner conductor 311 connected to the electrode 532 . The end portion has a conductor exposed portion 315 exposed from the inner insulator 312 to the tip side. The insulating exposed portion 314 is longer than the conductor exposed portion 315 . In each coaxial line 31 , the tip positions of the insulating exposed portions 314 are at the same position in the normal direction of the electrode forming surface 531 . Hereinafter, the normal direction of the electrode formation surface 531 will be referred to as the X direction. The distal end portion of the exposed conductor portion 315 and the distal end portion of the drain wire 32 and the electrode 532 are mechanically and electrically connected using the solder 6 provided on the electrode surface 532s, which is the surface on the proximal end side of the electrode 532. It is connected. In addition, the entire parts of the four electric wires 30 exposed from the outer cover 37 to the distal end side are embedded in the embedding member 4 to be described later.

As shown in FIGS. 4 to 6, the four electric wires 30 are separated electric wires 300 having portions inside the embedded member 4 that are separated from each other as the distance from the electrode forming surface 531 increases in the X direction. In this embodiment, the four electric wires 30 are arranged in the embedded member 4 so as to have separated regions 33 that are separated from each other from the electrode forming surface 531 toward the outer skin 37 side, and approaching regions 34 that are closer to each other from the separated region 33 toward the outer skin 37 side. have inside

As shown in FIGS. 7 and 8, the four spaced regions 33 are inclined radially outward in the X direction as they become more distant from the electrode forming surface 531 . The radially outer side is the radially outer side of the virtual circle C described above, and is also the radially outer side of the cable 3 in this embodiment. As shown in FIGS. 4 and 5, the respective isolated regions 33 of the four electric wires 30 are formed linearly.

In the three coaxial wires 31 out of the four electric wires 30, the access region 34 is a covered wire portion (that is, an exposed insulation portion 314) in which an inner conductor 311 as a core wire is covered with an insulator (that is, an inner insulator 312). ), and the separation region 33 is constituted by a bare wire portion (ie, exposed conductor portion 315) of the inner conductor 311 exposed from the insulator (ie, inner insulator 312).

The three coaxial lines 31 are bent so as to protrude radially outward at the root portion of the exposed conductor portion 315 (that is, the end portion of the exposed conductor portion 315 on the side of the exposed insulation portion 314). A separation area 33 and an access area 34 are separated by a boundary. That is, in the three coaxial lines 31 , the separated region 33 is composed only of the exposed conductor portion 315 , and the approaching region 34 is composed mainly of the exposed insulating portion 314 although the distal end portion is composed of the exposed conductor portion 315 . It is configured. Further, the drain wire 32 is also formed with a bent portion 35 that is bent so as to protrude radially outward. The bent portion 35 of the wire 30 is bent so as to protrude in a direction away from the wire 30 adjacent in the circumferential direction along the virtual circle C. As shown in FIG.

FIG. 10 is a cross-sectional view of cable connection structure 1 including spaced regions 33 and access regions 34 of wires 30 . As shown in FIG. 10, in the wire 30, the angle α between the longitudinal direction of the spaced region 33 and the longitudinal direction of the approaching region 34 can be, for example, 3° or more and 15° or less. Also, the angle β formed between the separation region 33 and the X direction can be, for example, 10° or more and 45° or less.

As shown in FIGS. 4 to 6, the bent portions 35 of the four electric wires 30 are located at the same positions in the X direction. As shown in FIGS. 4 and 5, the shortest distance SD2 between the bent portions 35 of the electric wires 30 adjacent in the circumferential direction along the virtual circle C is greater than the shortest distance SD1, and is 0.25 mm or more and 0.75 mm or less. can do. In this embodiment, the entire bent portion 35 is located radially outside the electrode 532 to which the bent portion 35 is connected.

As shown in FIG. 7, when viewed from the X direction, the boundary portion 8 between the solder 6 and the wire 30 is positioned radially outwardly eccentric with respect to the electrode surface 532s. That is, when viewed from the X direction, the center of the boundary portion 8 (see symbol C1 in FIGS. 11 and 12 to be described later) is located radially outside the center C2 of the electrode surface 532s. As a result, when viewed in the X direction, each boundary 8 is eccentric to the electrode surface 532s on the far side from all the other boundaries 8 . In this way, when viewed from the X direction, the boundary portion 8 that is eccentric to the electrode surface 532s farther from at least one other boundary portion 8 is called an eccentric boundary portion. In this embodiment, all the boundary portions 8 are eccentric boundary portions, and hereinafter the boundary portions 8 are also referred to as eccentric boundary portions 8 . In the description of a specific eccentric boundary portion 8, the electric wire 30, the solder 6, the electrode 532, the electrode surface 532s, etc. are referred to as the electric wire 30, the solder, etc. electrically connected to the eccentric boundary portion 8, unless otherwise specified. 6, electrode 532, electrode surface 532s.

A boundary portion 8 is a boundary between the solder 6 and the electric wire 30 when viewed from the outside. That is, the boundary portion 8 is a portion where the surface of the solder 6 and the electric wire 30 come into contact with each other, and is formed in the shape of a closed curve. The center C1 of the boundary portion 8 means the center of gravity (that is, the geometric center) of the two-dimensional figure surrounded by the closed curve. In this embodiment, the electrode surface 532s is formed in a circular shape, and the center C2 of the electrode surface 532s is the center of the circle. It is assumed that the center of gravity of the electrode surface 532s is meant. 7 and 8 show an example in which the solder 6 is applied over the entire surface of the electrode surface 532s, and the outer shape position of the solder 6 when viewed from the base end side coincides with the outer shape position of the electrode surface 532s. .

FIG. 11 is an enlarged view of solder 6 and its vicinity in FIG. FIG. 12 is an enlarged view of solder 6 and its vicinity located at the upper left of FIG. The solder 6 forming the eccentric boundary portion 8 has a radial width W1 at a radially inner portion of the eccentric boundary portion 8 larger than a radial width W2 at a radially outer portion of the eccentric boundary portion 8 . The width W1 can be two or more times the width W2, and can be ten or more times the width W2.

A surface 61 of the solder 6 located radially inside the eccentric boundary 8 in a cross section (for example, FIGS. 10 and 11) passing through the center C1 of the eccentric boundary 8 and the center C2 of the electrode surface 532s and parallel to the X direction. and the radial direction is smaller than the angle θ2 formed between the surface 62 of the solder 6 located radially outside the eccentric boundary portion 8 and the radial direction. If the cross-sectional shape of the surface 61 is not linear but curved, the angle θ1 is the angle formed between the most distal portion of the surface 61 and the radial direction. Similarly, when the cross-sectional shape of the surface 62 is not linear but curved, the angle θ2 is the angle formed between the most distal portion of the surface 62 and the radial direction.

The embedded member 4 embeds the entire portions of the four electric wires 30 exposed from the outer cover 37 , including the connecting portions between the electric wires 30 and the electrodes 532 . The embedded member 4 is formed from the electrode forming surface 531 to the tip surface 371 of the outer cover 37 in the X direction. The embedded member 4 is also filled in the inner peripheral sides of the four electric wires 30 . The part of the embedded member 4 that is arranged on the inner peripheral side of the four electric wires 30 extends to the vicinity of the tip surface 371 of the outer cover 37 .

The distal end side of the embedded member 4 is disposed on substantially the entire electrode forming surface 531 so as not to protrude from the electrode forming surface 531 , and the proximal end side of the embedded member 4 is disposed on the distal end surface 371 of the outer skin 37 . . The embedded member 4 is formed so that its outer diameter decreases toward the outer skin 37 side. As shown in FIG. 9, when viewed from the X direction, the embedded member 4 is located at the same position as the outer contour of the electrode forming surface 531 or inside the outer contour of the electrode forming surface 531 . In this embodiment, as described above, the tip side of the embedded member 4 is formed on substantially the entire electrode forming surface 531 , and when viewed from the X direction, the contour of the embedded member 4 is substantially the same as the electrode forming surface 531 . formed at the same position.

The embedded member 4 is made of an insulating material, such as an adhesive such as acrylate, or a resin such as epoxy resin. Further, in this embodiment, the embedded member 4 has a viscosity of 900 mPa·s or more and 2000 mPa·s or less in a molten state before curing.

Next, an example of a method for manufacturing the cable connection structure 1 of this embodiment will be described with reference to FIGS. 13 to 16. FIG. In the method for manufacturing the cable connection structure 1 of the present embodiment, the bending process, the alignment process, the joining process, and the embedding process are performed in this order, but the present invention is not limited to this. good too.

FIG. 13 is a side view of the cable 3 showing the bending process of the cable connection structure 1. FIG. In the bending step, the root portions of the exposed conductor portions 315 of the four wires 30 protruding from the outer cover 37 are bent to form the bent portions 35 in each of the four wires 30 . It is also possible to apply solder to each of the exposed conductor portion 315 and the drain wire 32 before the bending process. As a result, the exposed conductor portion 315 and the drain wire 32 can be prevented from untwisting during the bending process, and the exposed conductor portion 315 and the drain wire 32 can be easily bent.

FIG. 14 is a plan view showing the alignment process of the cable connection structure 1. FIG. FIG. 15 is a front view showing the alignment process of the cable connection structure 1. FIG. As shown in FIG. 14, in the alignment step, first, the positions of the imaging device 5, in which the solder 6 is provided to each of the four electrodes 532, and the cable 3 are aligned in the two-dimensional direction perpendicular to the X direction. Here, the electrode forming surface 531 and the tip surface 371 of the jacket 37 of the cable 3 are arranged to face each other in the X direction.

Then, as shown in FIGS. 14 and 15, each of the four wires 30 protruding from the outer cover 37 in random directions is gripped by the chuck 70 . The chuck 70 that grips the coaxial line 31 grips the tip of the exposed insulating portion 314, and the chuck 70 that grips the drain wire 32 also grips the same position in the X direction as the chuck 70 that grips the coaxial line 31. are doing. The chuck 70 that grips the coaxial line 31 may grip the exposed conductor portion 315 of the coaxial line 31 . Then, each chuck 70 is moved in a two-dimensional direction YZ perpendicular to the X direction so that the ends of the four electric wires 30 overlap the connected electrodes 532 in the X direction.

Here, in FIG. 14, the first heater 71 for heating the solder 6 from the front end side of the imaging device 5 and the second heater 72 for heating the solder 6 from the base end side of the chuck 70 are combined. represent. As an example, the first heater 71 and the second heater 72 may employ a case in which a coiled heating wire that generates heat when energized is arranged in an electrically insulating case. Four second heaters 72 are provided corresponding to each chuck 70 and fixed to each chuck 70 . At the stage of the alignment process, the first heater 71 and the second heater 72 are in a non-heating state.

FIG. 16 is a plan view showing the joining process of the cable connection structure 1. FIG. Unlike FIG. 14, the first heater 71 and the second heater 72 are hatched in FIG. 16. This is because the first heater 71 and the second heater 72 shown in FIG. It means something.

In the joining process, the wires 30 and the electrodes 532 are soldered after the bending process and the alignment process. In the bonding step, the first heater 71 and the second heater 72 are turned on to heat them. In addition, in the bonding process, inert gas G such as high-temperature nitrogen gas is blown around the solder 6 by the inert gas introduction part 73 . In this state, the imaging device 5 is brought closer to the cable 3 side in the X direction, the wire 30 is inserted into the melted solder 6, and the wire 30 and the electrode 532 are soldered. At this time, the position of the wire 30 with respect to the electrode 532 is adjusted so that the position of the eccentric boundary portion 8 between the wire 30 and the solder 6 is eccentric radially outward with respect to the electrode surface 532s. By blowing the high-temperature inert gas G around the solder 6, the melting of the solder 6 can be accelerated and the oxidation of the solder 6 can be prevented.

Next, although illustration is omitted, in the embedding step, for example, the melted embedding member 4 is filled from the electrode forming surface 531 to the distal end surface 371 of the outer skin 37 from an injector with a sharp tip. At this time, if the volume of the space surrounded by the four electric wires 30 is excessively small, the molten resin of the viscous embedding member 4 cannot sufficiently spread in the space surrounded by the four electric wires 30, and the embedded member 4 cannot be buried. Air bubbles may form in the member 4 . In addition, in the embedding process, if the filling amount of the melted embedding member 4 is small, the melted embedding member 4 may be added by replenishment. Cheap. Therefore, in the four electric wires 30 as in the present embodiment, the separation regions 33 are formed in the portion disposed inside the embedded member 4 so as to be separated from each other in the X direction as they become farther away from the electrode forming surface 531 . The space surrounded by the wires 30 can be widened, and the formation of air bubbles inside the embedded member 4 can be easily prevented.
As described above, the cable connection structure 1 in this embodiment can be manufactured.

(Action and effect of the first embodiment)
In the cable connection structure 1 of this embodiment, as the boundary portion 8 between the solder 6 and the electric wire 30, there is an eccentric boundary portion 8 that is eccentric with respect to the electrode surface 532s when viewed in the X direction. The eccentric boundary portion 8 is eccentric to the side farther from at least one other boundary portion 8 with respect to the electrode surface 532s. Therefore, the distance between the eccentric boundary portion 8 and at least one other boundary portion 8 can be widened, and the distance between the electric wires 30 forming these boundary portions 8 can be widened. Thereby, it is possible to suppress the formation of air bubbles in the embedded member 4 arranged between the electric wires 30 connected to the eccentric boundary portion 8 and at least one other boundary portion 8 respectively. When air bubbles are formed in the embedded member 4, for example, the air bubbles expand or contract due to changes in temperature or air pressure, and external pressure is likely to be applied to the connection between the electrode 532 and the wire 30. It is possible to suppress the occurrence of such a problem.

In addition, the direction in which the center C1 of the eccentric boundary portion 8 and the center C2 of the electrode surface 532s are aligned when viewed from the X direction is defined as the alignment direction (radial direction in this embodiment). The eccentric side of the eccentric boundary portion 8 with respect to 532s is defined as the eccentric side (in this embodiment, the radially outer side), and the opposite side of the eccentric side is defined as the anti-eccentric side (in this embodiment, the radially inner side). At this time, in the solder 6 forming the eccentric boundary portion 8, the width W1 in the alignment direction of the portion on the anti-eccentric side from the eccentric boundary portion 8 is larger than the width W2 in the alignment direction of the portion on the eccentric side from the eccentric boundary portion 8. . As a result, even when the boundary portion 8 is eccentric with respect to the electrode surface 532s, it is possible to prevent the strength of the solder 6 forming the boundary portion 8 from being excessively lowered.

In addition, in a cross section passing through the center C1 of the eccentric boundary portion 8 and the center C2 of the electrode surface 532s and parallel to the X direction, between the surface 61 of the solder 6 located on the anti-eccentric side of the eccentric boundary portion 8 and the alignment direction is smaller than the angle .theta.2 between the surface 62 of the solder 6 located on the eccentric side of the eccentric boundary portion 8 and the alignment direction. Due to such an inclination of the surface 61 , the molten resin forming the embedded member 4 is easily guided to the anti-eccentric side of the solder 6 (inward in the radial direction in this embodiment).

Also, the electric wire 30 forming the eccentric boundary portion 8 is the isolated electric wire 300 having the isolated area 33 inside the embedded member 4 inclined toward the eccentric side as the distance from the electrode forming surface 531 in the X direction increases. Therefore, the space between the remote wire 300 and at least one other wire 30 can be enlarged, and the formation of air bubbles in the embedded member 4 injected into the space can be suppressed. .

Also, the angle β formed between the separation region 33 and the X direction is 10° or more and 45° or less. When the angle β is 10° or more, the space between the remote wire 300 and at least one other wire 30 can be further increased. In addition, since the angle β is 45° or less, the gap between the separation region 33 and the electrode forming surface 531 is narrowed, so that the molten resin constituting the embedded member 4 is difficult to enter into the gap. can be prevented from becoming

The remote wire 300 has a remote area 33 and a close area 34, and the angle between the longitudinal direction of the remote area 33 and the longitudinal direction of the close area 34 is 3° or more and 15° or less. When the angle α is a small angle such as 3° or more and 15° or less, the gap between the separation region 33 and the access region 34 becomes too narrow, and the gap between the separation region 33 and the proximity region 34 becomes too narrow. It is possible to prevent the molten resin forming the embedded member 4 from entering easily.

A bent portion 35 is formed in the exposed core wire (that is, the inner conductor 311 ) of the isolated electric wire 300 , and a portion of the core wire on the electrode 532 side from the bent portion 35 constitutes the isolated region 33 . Thereby, the isolated region 33 can be easily formed in the isolated wire 300 .

Also, the plurality of electrodes 532 includes four electrodes 532 arranged side by side on the virtual circle C, and the four wires 30 include four wires 30 connected to the four electrodes 532 . In the case where a plurality of electric wires 30 are arranged three-dimensionally in this way, there is a concern that the molten resin constituting the embedded member 4 may not easily spread through the space surrounded by the plurality of electric wires 30 . be. Therefore, in this embodiment, each of the four boundary portions 8 constitutes an eccentric boundary portion 8, and the eccentric boundary portion 8 is eccentric radially outward with respect to the electrode surface 532s. As a result, the space surrounded by the four electric wires 30 can be enlarged, and the space can be easily filled with the molten resin forming the embedded member 4 .

The electronic component 2 is an imaging device 5 having an imaging device 53 of an endoscope, and the diameter of each core wire (that is, the inner conductor 311) of the four electric wires 30 is 0.1 mm or less. In other words, the core wire of each of the four electric wires 30 is a very thin wire, and the imaging device 5 of the endoscope as the electronic component 2 to which the cable 3 is connected is made very small so that it can be inserted into the human body. It has a premise configuration to be formed. In the case of having such a premise configuration, the gap between the electric wires 30 tends to become very narrow, and the molten resin constituting the embedded member 4 is difficult to enter into the gap, and air bubbles are generated in the embedded member 4. growing concern. Therefore, on the premise that such a prerequisite configuration is provided, by providing the eccentric boundary portion 8, the effect of suppressing the generation of air bubbles in the embedded member 4 is large.

In addition, the cable 3 has an outer sheath 37 that collectively covers the portions of the plurality of electric wires 30 excluding the end portions on the side of the electrode forming surface 531 . Therefore, since the binding force of the outer cover 37 acts on the plurality of wires 30 to bring them closer to each other, the plurality of wires 30 are configured so as to approach each other as they move away from the electrode forming surface 531 unless otherwise devised. The volume of the area surrounded by the plurality of electric wires 30 tends to be small. Therefore, in this embodiment, even in a situation where the area surrounded by the plurality of wires 30 tends to be small due to the provision of the outer cover 37 that collectively covers the plurality of wires 30, the four wires 30 are separated from the electrode formation surface 531. Formation of portions in the interior of the embedded member 4 that are separated from each other as they become more distant makes it possible to more effectively suppress the formation of air bubbles in the interior of the embedded member 4 .

Further, inside the embedded member 4 , the exposed conductor portion 315 of the coaxial line 31 is shorter than the exposed insulating portion 314 . Here, since the embedded member 4 is directly arranged around the exposed conductor portion 315, the impedance of the exposed conductor portion 315 tends to increase. Impedance increase can be suppressed. Further, by lengthening the exposed insulating portion 314, the exposed insulating portion 314 can be easily gripped during the above-described alignment process.

In addition, the embedded member 4 is arranged from the electrode forming surface 531 to the outer skin 37 in the X direction. The four separated electric wires 300 are arranged in the embedded member 4 so as to form separated regions 33 which are separated from each other toward the outer skin 37 side from the electrode forming surface 531 and approaching regions 34 which are closer to each other from the separated region 33 toward the outer skin 37 side. have it inside. Therefore, the area surrounded by the four isolated wires 300 becomes larger as they approach each other in the X direction, and is formed substantially symmetrically in the X direction. As a result, the space surrounded by the four isolated wires 300 can be easily filled with the embedded member 4 in a melted state, and the formation of air bubbles in the embedded member 4 can be easily suppressed.

In the three coaxial wires 31, the approaching region 34 is formed by the covered wire portion (ie, the exposed insulation portion 314) in which the core wire (ie, the inner conductor 311) of the electric wire 30 is covered with an insulator (ie, the inner insulator 312). The separation region 33 is formed by the bare wire portion of the core wire exposed from the insulator (that is, the exposed conductor portion 315). The isolated region 33 is close to the joint between the electric wire 30 and the electrode 532, and is a region where the stress generated in the joint tends to increase due to the formation of air bubbles in the embedded member 4. By forming the wire portions, it is easy to secure the distance between the separated regions 33 and to prevent the formation of air bubbles in the regions between the separated regions 33 in the embedding member 4 . By forming the access regions 34 of the three coaxial wires 31 with the coated wire portion, electrical insulation between the access regions 34 of the plurality of electric wires 30 can be easily ensured.

In addition, the three coaxial lines 31 are bent at the ends opposite to the electrodes 532 in the bare wire portions, and the regions of the coaxial wires 31 on the tip side from the bent portions 35 (that is, the separated regions 33) are straight. formed. The boundary between the bare wire portion and the coated wire portion and the bent portion 35 of the electric wire 30 tend to be areas where the flow of the embedded member 4 in the molten state is likely to be stagnant. By making the region 33 linear, it is easy to suppress the formation of air bubbles in the embedded member 4 .

In addition, when viewed from the X direction, the embedded member 4 is housed inside the contour of the electrode forming surface 531 . Therefore, an increase in size of the cable connection structure 1 can be effectively suppressed. That is, as in this embodiment, in the case where the four electric wires 30 are formed with portions that are spaced apart from each other in the X direction as they become more distant from the electrode forming surface 531, unless otherwise devised, the vicinity of the portion when viewed from the X direction protrudes outside the wire 30 formation surface and may cause interference with other members. Therefore, as in the present embodiment, the embedded member 4 is formed so as to be accommodated inside the contour of the electrode forming surface 531 when viewed in the X direction. Even in the case of forming portions that are spaced apart from each other as the distance from the surface 531 increases, it is possible to prevent the embedded member 4 from protruding outside the electrode forming surface 531 when viewed in the X direction. It is possible to suppress interference with members and the like.

Moreover, each core wire of the four electric wires 30 is a stranded wire. Therefore, it is possible to effectively improve the productivity of the cable connection structure 1 . That is, in the case where the four electric wires 30 have portions inside the embedded member 4 that are separated from each other as the distance from the electrode forming surface 531 increases in the X direction, as in this embodiment, the tips of the electric wires 30 and the electrodes are arranged. Alignment with the electrodes 532 tends to be difficult, but by configuring the core wires of the four electric wires 30 with highly flexible stranded wires, it is easy to align the tips of the electric wires 30 and the electrodes 532 .

As described above, according to this embodiment, it is possible to provide a cable connection structure that can easily suppress the formation of air bubbles in the embedded member.

[Second embodiment]
FIG. 17 is an enlarged plan view of the connection portion between the cable 3 and the imaging device 5 of the cable connection structure 1 according to the present embodiment. In this embodiment, the core wires of the four electric wires 30 are all composed of single wires. That is, in this embodiment, each of the inner conductors 311 of the three coaxial wires 31 and the one drain wire 32 as the core wire is composed of a single wire.

Other configurations of this embodiment are the same as those of the first embodiment.
Note that, of the reference numerals used in the second embodiment and subsequent embodiments, the same reference numerals as those used in the previous embodiments represent the same components as those in the previous embodiments, unless otherwise specified.

(Action and effect of the second embodiment)
In this embodiment, each core wire of the four electric wires 30 is a single wire. Therefore, the portion on the side of the electrode 532 from the bent portion 35 of the core wire can be easily maintained in a straight line shape, thereby facilitating the work of aligning the plurality of electric wires 30 and the electrode 532 . Further, the embedding member 4 is arranged around the core wire, and since the core wire is composed of a single wire, it is possible to suppress the formation of minute irregularities around the core wire. It is easy to prevent remaining
In addition, this embodiment also has the same actions and effects as those of the first embodiment.

(Summary of embodiment)
Next, technical ideas understood from the embodiments described above will be described with reference to the reference numerals and the like in the embodiments. However, each reference numeral and the like in the following description do not limit the constituent elements in the claims to the members and the like specifically shown in the embodiment.

[1] An electronic component (2) having a plurality of electrodes (532) on an electrode forming surface (531), and a plurality of solders (6) provided on the respective electrode surfaces (532s) of the plurality of electrodes (532) and a cable (3) having a plurality of wires (30) connected to each of the plurality of solders (6), and filled around the plurality of solders (6) and the plurality of wires (30) an embedding member (4) formed by curing molten resin and embedding the plurality of solders (6) and the plurality of wires (30), wherein the solder (6) and the wires (30) As the boundary portion (8) of, there is an eccentric boundary portion (8) eccentric with respect to the electrode surface (532s) when viewed from the normal direction (X) of the electrode forming surface (531). The eccentric boundary portion (8) is eccentric with respect to the electrode surface (532s) on the side farther from at least one other boundary portion (8), and when viewed from the normal direction (X), the The direction in which the center (C1) of the eccentric boundary portion (8) and the center (C2) of the electrode surface (532s) line up is defined as the alignment direction, and one side of the alignment direction with respect to the electrode surface (532s) When the eccentric side of the eccentric boundary portion (8) is defined as the eccentric side, and the side opposite to the eccentric side is defined as the anti-eccentric side, the solder (6) forming the eccentric boundary portion (8) is the eccentric boundary. A cable connection in which the width (W1) in the row direction of the part on the anti-eccentric side from the part (8) is greater than the width (W2) in the row direction of the part on the eccentric side from the eccentric boundary part (8) Structure (1).

[2] In a cross section passing through the center (C1) of the eccentric boundary (8) and the center (C2) of the electrode surface (532s) and parallel to the normal direction (X), the eccentric boundary (8) The angle (θ1) formed between the surface (61) of the solder (6) located on the anti-eccentric side of the solder (6) and the alignment direction is the angle (θ1) located on the eccentric side of the eccentric boundary (8). The cable connection structure (1) according to [1], which is smaller than the angle (θ2) formed between the surface (62) of the solder (6) and the alignment direction.

[3] The electric wire (30) constituting the eccentric boundary part (8) is a separated region ( 33) inside the embedded member (4).

[4] The cable connection structure (1 ).

[5] In the normal direction (X), the isolated electric wire (300) is an approaching area toward the anti-eccentric side as it goes from the isolated area (33) to the side opposite to the electrode forming surface (531) side. (34), and an angle (α) between the longitudinal direction of the separation region (33) and the longitudinal direction of the access region (34) is 3° or more and 15° or less, [3] Or the cable connection structure (1) according to [4].

[6] A bent portion (35) is formed in the exposed core wire of the remote wire (300), and a portion of the core wire on the side of the electrode (532) from the bent portion (35) is the isolated region. The cable connection structure (1) according to any one of [3] to [5], which constitutes (33).

[7] The plurality of electrodes (532) includes three or more electrodes (532) arranged side by side on a virtual circle (C), and the plurality of electric wires (30) are connected to the three or more electrodes (532) of three or more boundaries (8) between said three or more electrodes (532) and said three or more wires (30); Each constitutes the eccentric boundary portion (8), and the eccentric boundary portion (8) is eccentric to the electrode surface (532s) radially outward of the virtual circle (C). A cable connection structure (1) according to any one of [1] to [6].

[8] The electronic component (2) is an imaging device (5) having an imaging element (53) of an endoscope, and the diameter of each core wire of the plurality of electric wires (30) is 0.1 mm or less. The cable connection structure (1) according to any one of [1] to [7].

Although the embodiments of the present invention have been described above, the above-described embodiments do not limit the invention according to the scope of claims. Also, it should be noted that not all combinations of features described in the embodiments are essential to the means for solving the problems of the invention. Moreover, the present invention can be modified appropriately without departing from the gist thereof.

For example, in each embodiment, the number of electrodes formed on the electrode forming surface is four, but the number may be, for example, two, three, or five or more, depending on the specifications of the endoscope device. Correspondingly, the wires can also be 2, 3, or 5 or more.

Further, in each embodiment, all four boundary portions are eccentric boundary portions, but the present invention is not limited to this, and at least one eccentric boundary portion is sufficient. Further, in each embodiment, the eccentric boundary portion is eccentric to the electrode surface farther from all other boundary portions, but is not limited to this. It is sufficient if the surface is eccentric on the far side from at least one other boundary.

In each of the embodiments, all the four wires are isolated wires having portions inside the embedded member that are separated from each other as they go away from the electrode forming surface in the normal direction of the electrode forming surface. It suffices that at least two remote wires are present. If at least two spaced wires are present, it is possible to widen the area between the spaced wires in the embedded member and suppress the formation of air bubbles in the embedded member.

In addition, in each embodiment, the isolated area and the approaching area are formed in the area exposed from the outer covering of the remote wire, but it is sufficient if the isolated area is formed in a plurality of wires. It is also possible to form the access areas of the wires of the book parallel to each other. It is also possible to make all the parts of the four electric wires that protrude from the outer sheath the isolated area.

Moreover, in each embodiment, the embedded member is formed from the electrode forming surface to the tip surface of the outer skin, but the present invention is not limited to this. For example, in each of the above-described embodiments, the position of the end portion of the embedded member on the outer skin side may be formed at a position away from the tip surface of the outer skin toward the electrode forming surface.

REFERENCE SIGNS LIST 1 cable connection structure 2 electronic component 3 cable 30 electric wire 300 isolated electric wire 33 isolated area 34 approach area 35 bent portion 4 embedded member 5 imaging device 53 imaging element 531 electrode forming surface 532 ...Electrode 532s...Electrode surface 6...Solder 8...Boundary, eccentric boundary C...Virtual circle C1...Center of eccentric boundary C2...Center of electrode surface X...Normal direction of electrode forming surface

Claims (8)

an electronic component having a plurality of electrodes on an electrode forming surface;
a plurality of solders provided on respective electrode surfaces of the plurality of electrodes;
a cable having a plurality of wires connected to each of the plurality of solders;
an embedding member for embedding the plurality of solders and the plurality of wires, which is formed by curing molten resin filled around the plurality of solders and the plurality of wires;
As a boundary between the solder and the wire, there is an eccentric boundary that is eccentric with respect to the electrode surface when viewed from the normal direction of the electrode forming surface,
the eccentric boundary portion is eccentric with respect to the electrode surface on the far side from at least one other boundary portion;
A direction in which the center of the eccentric boundary portion and the center of the electrode surface are aligned when viewed from the normal direction is defined as an alignment direction, and the eccentric boundary portion is located on one side of the alignment direction with respect to the electrode surface. When the eccentric side is the eccentric side, and the opposite side to the eccentric side is the anti-eccentric side, the solder forming the eccentric boundary portion has a width in the alignment direction of the portion on the anti-eccentric side from the eccentric boundary portion. is greater than the width in the row direction of the part on the eccentric side from the eccentric boundary,
Cable connection structure. between the surface of the solder located on the anti-eccentric side of the eccentric boundary and the alignment direction in a cross section passing through the center of the eccentric boundary and the center of the electrode surface and parallel to the normal direction; The angle formed is smaller than the angle formed between the surface of the solder located on the eccentric side of the eccentric boundary and the alignment direction,
The cable connecting structure according to claim 1. The electric wire constituting the eccentric boundary portion is an isolated electric wire having, inside the embedded member, a separated area inclined toward the eccentric side as the distance from the electrode forming surface increases in the normal direction.
The cable connection structure according to claim 1 or 2. The angle formed between the isolated region and the normal direction is 10° or more and 45° or less.
The cable connection structure according to claim 3. The remote wire has an access region toward the anti-eccentric side as it goes from the remote region toward the side opposite to the electrode forming surface side in the normal direction,
The angle formed between the longitudinal direction of the separation area and the longitudinal direction of the approach area is 3° or more and 15° or less.
The cable connection structure according to claim 3 or 4. A bent portion is formed in the exposed core wire of the remote wire,
A portion of the core wire on the side of the electrode from the bent portion constitutes the separation region,
A cable connection structure according to any one of claims 3 to 5. The plurality of electrodes includes three or more electrodes arranged side by side on a virtual circle,
The plurality of wires includes three or more wires connected to the three or more electrodes,
each of the three or more boundary portions between the three or more electrodes and the three or more electric wires constitutes the eccentric boundary portion;
The eccentric boundary portion is eccentric to the electrode surface radially outward of the virtual circle,
A cable connection structure according to any one of claims 1 to 6. The electronic component is an imaging device having an imaging element of an endoscope,
The diameter of each core wire in the plurality of electric wires is 0.1 mm or less,
A cable connection structure according to any one of claims 1 to 7.

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