JP2023027403A - Electrically conductive component, wire harness and method for producing electrically conductive component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrically conductive component in which the interior of a conducting wire bundle is well waterproofed.

SOLUTION: This electrically conductive component comprises a conducting wire bundle having a plurality of conducting wires, a first resin adhered to the conducting wires, and an injection molding that seals the conducting wire bundle and seals a second resin. In a cross section orthogonal to an axial direction of the conducting wire bundle, the conducting wires and the first resin are present in an inner-side region of an outermost circumscribing line of the conducting wire bundle. A total surface area ratio of cavities within the inner-side region is 20% or lower.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2023,JPO&INPIT

Description

The present invention relates to electrical conducting components and wire harnesses.

2. Description of the Related Art Vehicles such as motorcycles and automobiles are conventionally equipped with wire harnesses having insulated wires. In order to bundle a plurality of bundles of insulated wires, the insulating layer of the insulated wires may be partially stripped to expose the conductors, and the exposed conductors may be joined by welding, crimping, or the like. In some cases, the conductor wire in the exposed portion is joined to a metal terminal. In such a case, there is a problem that water penetrates into the insulated wire from the conductor wire of the exposed portion or electric leakage occurs. In order to solve these problems, there is known a technique of sealing exposed conductors with resin.

Patent Document 1 discloses a wire in which a connection portion between a coated wire and a metal terminal is embedded in a mold resin, and a waterproof layer made of a silicone adhesive is formed on the connection portion to prevent water from entering the wire. A harness is disclosed.

JP 2016-126981 A

In Patent Document 1, a waterproof layer made of a silicone-based adhesive is formed at the connection between the coated wire and the metal terminal, but no consideration has been given to stopping water running through the cavity inside the conductor bundle. It cannot be said that water can be stopped sufficiently when water penetrates to the conductor bundle due to deterioration of the part or the waterproof layer.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrically conductive component which is excellent in water cut-off properties within a conductor bundle.

The configuration of the present invention is as follows.
[1] A conductor bundle having a plurality of conductors, a first resin adhering to the conductors, and a second resin sealing the conductor bundle, wherein the axis of the conductor bundle In a cross section perpendicular to the direction, the conductor wire and the first resin are present in the inner region of the outermost tangent line of the conductor bundle, and the total area ratio of the voids in the inner region is 20% or less. An electrically conductive component characterized by:
[2] The electrically conductive component according to [1] above, wherein the total area ratio of the conductors in the inner region is 80% or less.
[3] The electrically conductive component according to [1] or [2] above, wherein the first resin has a maximum thickness of 0.1 mm or less outside the outermost tangent line.
[4] The electrically conductive component according to any one of [1] to [3] above, which has a third insulating resin covering at least a portion of the conductor bundle.
[5] The electrically conductive component according to [4], wherein the maximum thickness of the first resin from the outermost tangent line is smaller than the thickness of the third resin.
[6] The electrically conductive component according to any one of [1] to [5], wherein at least part of the conductors are joined to each other.
[7] The first resin is one or more selected from the group consisting of polyester-based resins, urethane-based resins, epoxy-based resins, and acrylic-based resins. Electrically conductive parts.
[8] The electrically conductive component according to any one of [1] to [7], wherein the second resin is one or more selected from the group consisting of polyester-based resins, polyamide-based resins, and polyolefin-based resins.
[9] A wire harness having the electrically conductive component according to any one of [1] to [8] above.

According to the present invention, with the above configuration, it is possible to provide an electrically conductive component that is excellent in water cut-off properties within the conductor bundle.

FIG. 1(a) shows a plan view of the electrically conductive component of the first embodiment. FIG. 1(b) shows a plan view of FIG. 1(a) in which illustration of the second resin is omitted and only the outline of the first resin is shown. FIG. 1(c) shows a BB sectional view of FIG. 1(a). FIG. 2(a) shows a plan view of the electrically conductive component of the second embodiment. FIG. 2(b) shows a plan view of FIG. 2(a) in which illustration of the second resin is omitted and only the outline of the first resin is shown. FIG. 2(c) shows a side view of FIG. 2(b). FIG. 2(d) shows a BB sectional view of FIG. 2(a).

The inventors of the present invention have made extensive studies to provide an electrically conductive component that is excellent in water cut-off properties within the conductor bundle. As a result, it has a conductor bundle having a plurality of conductors, a first resin adhering to the conductors, and a second resin sealing the conductor bundle, and the axis of the conductor bundle In a cross section perpendicular to the direction, the conductor wire and the first resin are present in the inner region of the outermost tangent line of the conductor bundle, and the total area ratio of the voids in the inner region is 20% or less. The inventors have found that the intended purpose can be achieved with the parts, and have completed the present invention.

Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited by the following examples, and can be implemented with appropriate modifications within the scope that can conform to the gist of the above and later descriptions. Of course, it is also possible, and all of them are included in the technical scope of the present invention.

(First embodiment)
FIG. 1(a) shows a plan view of the electrically conductive component of the first embodiment. FIG. 1(b) shows a plan view of FIG. 1(a) in which illustration of the second resin is omitted and only the outline of the first resin is shown. FIG. 1(c) shows a BB sectional view of FIG. 1(a). The dashed line in FIG. 1(c) indicates the outermost tangent line of the conductor bundle.

As shown in FIGS. 1(a) and 1(b), the electrically conductive component 10 includes a conductor bundle 5 having a plurality of conductors 4, a first resin 1 adhering to the conductors 4, and the conductor bundle 5. It has the 2nd resin 2 which has stopped. Furthermore, as shown in FIGS. 1A and 1C, in a cross section perpendicular to the axial direction A of the conductor bundle 5 (hereinafter sometimes referred to as a BB cross section), the inside of the outermost tangent line of the conductor bundle 5 Conductive wire 4 and first resin 1 are present in region 7 (hereinafter sometimes referred to as inner region 7), and the total area ratio of cavities 6 in inner region 7 is controlled to 20% or less.

In the present invention, the outermost tangent line is the shortest tangent line that surrounds and circumscribes the plurality of conductor wires 4 in a cross section perpendicular to the axial direction A of the conductor bundle 5 .

The greatest feature of the present invention is that the total area ratio of the cavities 6 in the inner region 7 to the inner region 7 is controlled to 20% or less in the BB cross section. Normally, cavities are present between the plurality of conductors 4, but in the present invention, the first resin 1 is adhered between the conductors 4 to reduce the total area ratio of the cavities 6 to 20% or less. This makes it easier to stop water that has entered the conductor bundle 5 . The total area ratio of the cavities 6 is preferably 9% or less, more preferably 5% or less, even more preferably 2% or less, even more preferably 1% or less, particularly preferably 0.1% or less, and most preferably 0%. is.

Note that the total area ratio (%) of the cavities 6 in the inner region 7 is obtained by the following formula.
Total area ratio (%) of cavities 6 in inner region 7 = total area of cavities 6 in inner region 7 / area of inner region 7 At a position 1 cm away from the end of, the sealing portion 9 is cut perpendicular to the axial direction A, the cross section is polished, the cross section is observed with an optical microscope (magnification of 50 times), and a photograph is taken. can be obtained by image analysis.

Further, in the BB cross section, the total area ratio of the conductive wires 4 in the inner region 7 to the inner region 7 is preferably 80% or less. By setting the total area ratio of the conductor wire 4 to 80% or less, the amount of the first resin 1 adhered to each conductor wire 4 can be increased, and the water stoppage can be easily improved. More preferably 70% or less, still more preferably 60% or less. On the other hand, by setting the total area ratio of the conductive wires 4 to 20% or more, it is possible to easily suppress the propagation of cracks when the first resin 1 cracks. It is preferably 20% or more, more preferably 40% or more, and still more preferably 50% or more.

The first resin 1 is not particularly limited as long as it can adhere to the conductive wire, and examples thereof include one or more selected from the group consisting of polyester-based resins, urethane-based resins, epoxy-based resins, and acrylic-based resins. These are preferable because they tend to improve the adhesiveness with the second resin 2 used for sealing. Of these, polyester-based resins are more preferred.

A polyester-based resin is formed by reacting a carboxylic acid component and a hydroxyl group component. Carboxylic acid components include, for example, terephthalic acid, isophthalic acid, adipic acid, sebacic acid, naphthalenedicarboxylic acid and the like. The hydroxyl group component includes ethylene glycol, 1,4-butanediol, diethylene glycol, neopentyl glycol, cyclohexanedimethanol and the like.

A urethane-based resin is formed by reacting a hydroxyl group component (prepolymer) with an isocyanate compound (curing agent). Examples of hydroxyl group components include polyester polyols, polycaprolactone polyols, polyether polyols, polyalkylene polyols, and polycarbonate polyols. Isocyanate compounds include diisocyanates such as trimethylene diisocyanate (TDI), hexamethylene diisocyanate (HDI), diphenylmethane diisocyanate (MDI), isophorone diisocyanate (IPDI), and xylylene diisocyanate (XDI).

Epoxy resins are formed by reacting a prepolymer having two or more epoxy groups in one molecule with various curing agents. Examples of prepolymers include glycidyl ether type epoxy resins, hydrogenated bisphenol A type epoxy resins, glycidyl ester type epoxy resins, glycidyl ether type epoxy resins, alicyclic epoxy resins, and modified epoxy resins obtained by modifying these with alkylphenols or fatty acids. , novolac type epoxy resins, and the like. Curing agents include, for example, phenolic compounds, aliphatic amines, alicyclic amines, aromatic polyamines, polyamides, aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, dicyandiamide, organic acid dihydrazides, Boron trifluoride amine complexes, imidazoles and tertiary amines.

Acrylic resins are formed by polymerizing acrylic monomers. Acrylic monomers include acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, isopropyl acrylate, n-hexyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, hydroxypropyl acrylate, methacryl methyl acid, ethyl methacrylate, isopropyl methacrylate, butyl methacrylate, n-hexyl methacrylate, lauryl methacrylate, 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate, hydroxypropyl methacrylate and the like.

The first resin 1 may contain a curing catalyst. Curing catalysts include, for example, tin, amines, bismuth, and the like.

The maximum thickness of the first resin 1 outside the outermost tangent line of the conductor bundle 5 (hereinafter referred to as the maximum thickness of the first resin 1) is preferably 0.1 mm or less. Since the maximum thickness of the first resin 1 is 0.1 mm or less, the contact area between the first resin 1 and the second resin 2 can be reduced, making it easier to prevent the occurrence of voids in the contact surfaces. be able to. The maximum thickness of the first resin 1 is more preferably 0.08 mm or less, still more preferably 0.05 mm or less. On the other hand, by setting the maximum thickness of the first resin 1 to 0.001 mm or more, it is possible to easily prevent water from entering from the outside of the wire bundle 5 . The maximum thickness of the first resin 1 is more preferably 0.01 mm or more, still more preferably 0.02 mm or more.

The second resin 2 seals the wire bundle 5 . This makes it easier to prevent water from entering the wire bundle 5 . The second resin 2 is not particularly limited as long as it can seal the wire bundle 5 by injection molding or the like, and either a thermoplastic resin or a thermosetting resin can be used. Considering the adhesiveness with the first resin 1, the second resin 2 is preferably one or more selected from the group consisting of polyester resins, polyamide resins, and polyolefin resins. Of these, polyester-based resins are more preferred.

A polyester-based resin is formed by reacting a carboxylic acid component and a hydroxyl group component as described above. Polyester-based resins include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, poly(1,4-cyclohexanedimethylene terephthalate) and the like. Commercially available products include Viroshot (registered trademark, manufactured by Toyobo Co., Ltd.). Since Viroshot can be injected even at low pressure, damage to the wire bundle 5 during injection molding can be easily suppressed. Biroshot is particularly preferred for this purpose. Examples of Viroshot include Viroshot (registered trademark) GM-955 series and GM-960 series.

A polyamide-based resin is a polymer having an amide bond in its molecule. Examples of polyamide resins include nylon 6,6, nylon 6,9, nylon 6,10, nylon 6,12, nylon 6, nylon 12, nylon 11, and nylon 4,6.

Polyolefin resins are homopolymers or copolymers of olefins such as ethylene, propylene and butene, or copolymers of these olefins and copolymerizable monomer components. Polyolefin resins such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-α-olefin copolymer coalescence, ethylene-propylene copolymer, ethylene-butene copolymer and the like.

Various conventional additives can be added as long as the properties of the second resin 2 are not impaired. Examples of additives include fillers such as silica and talc; flame retardants such as antimony oxide, aluminum hydroxide and magnesium hydroxide; plasticizers such as phthalates and adipates; release agents such as polyethylene wax and silicone oil; Examples include hydrolysis inhibitors such as carbodiimide. These additives may be used alone or in combination of two or more. The content of the additive is preferably about 0.1 parts by mass or more and 50 parts by mass or less in 100 parts by mass of the second resin 2. It is more preferably 1 part by mass or more and 30 parts by mass or less, still more preferably 5 parts by mass or more and 20 parts by mass or less.

As shown in FIGS. 1A and 1C, in the first embodiment, the sealing portion 9 sealed with the second resin 2 has a cylindrical shape, but the shape is not particularly limited. The shape of the sealing portion 9 in a cross section perpendicular to the axial direction A of the wire bundle 5 may be circular, elliptical, polygonal such as triangular or quadrangular. Moreover, the cross-sectional shape of the sealing portion 9 may be different in the axial direction A. Since the sealing portion 9 has various shapes in this way, it can be accommodated in various places.

As shown in FIG. 1(b), part of the conductors 4 are preferably joined together to form joints 11. As shown in FIG. This allows electrical continuity. As a joining method, known methods such as welding and crimping may be used.

The electrically conductive component 10 preferably has an insulating third resin 3 covering at least a partial section of the wire bundle 5 . The wire bundle 5 can form an insulated wire by being covered with the insulating third resin 3 .

Although the third resin 3 is not particularly limited as long as it is an insulating resin, it is preferably one or more resins selected from the group consisting of polyvinyl chloride, polyethylene, and polypropylene used for the insulating layer of the insulated wire. Among these, polyvinyl chloride is more preferable.

When the third resin 3 is provided, the maximum thickness of the first resin 1 is preferably smaller than the thickness of the third resin 3 . This makes it easier to reduce the size of the sealing portion 9 sealed with the second resin 2 .

The thickness of the third resin 3 is preferably 0.2 mm or more and 5.0 mm or less. By setting the thickness to 0.2 mm or more, electric leakage can be easily prevented. It is more preferably 0.5 mm or more, still more preferably 0.8 mm or more. On the other hand, by setting the thickness to 5.0 mm or less, the contact area with the first resin 1 and the second resin 2 can be reduced, and the occurrence of voids in the contact surfaces can be easily prevented. More preferably, it is 2.0 mm or less.

The material of the conducting wire 4 is not particularly limited, but examples thereof include copper, copper alloy, aluminum, silver, or those plated with gold or tin.

(Second embodiment)
FIG. 2(a) shows a plan view of the electrically conductive component of the second embodiment. FIG. 2(b) shows a plan view of FIG. 2(a) in which illustration of the second resin is omitted and only the outline of the first resin is shown. FIG. 2(c) shows a side view of FIG. 2(b). FIG. 2(d) shows a BB sectional view of FIG. 2(a). In addition, the same number is given to the same component as the electrically conductive component of the first embodiment, and the description thereof is omitted.

As shown in FIGS. 2(b) and 2(c), the wire bundle 5 may be connected to a metal terminal 8. FIG. Although the shape of the metal terminal 8 is not particularly limited, it may have a ring-shaped portion 8a, a protrusion 8b, and a body portion 8c as shown in FIGS. 2(b) and 2(c). The ring-shaped portion 8a is formed in a ring shape, the projecting portion 8b is formed in a U shape, and the body portion 8c is formed in a rectangular parallelepiped shape. By connecting the metal terminal 8 and the wire bundle 5 in this manner, the electrically conductive component 10 can be easily fixed at a desired location. Alternatively, the connector may be formed by changing the shapes of the metal terminals 8 and the second resin 2 .

A method for joining the wire bundle 5 and the metal terminal 8 is not particularly limited, but known methods such as welding and crimping may be used. Moreover, although not shown, the conductor bundle 5 may be fixed by crimping the main body portion 8c of the metal terminal 8 .

As shown in FIGS. 2(a) to 2(d), the electrically conductive component 10 does not necessarily have a plurality of wire bundles 5, and may have only one wire bundle 5. FIG.

The shape of the sealing portion sealed with the second resin 2 shown in FIGS. 2A and 2D is a shape combining hexagonal prisms of different sizes. It may be formed into a complicated shape.

The electrically conductive component 10 can be used, for example, as a wire harness binding portion or a connector. That is, the present invention also includes a wire harness having the electrically conductive component.

Next, a method for manufacturing an electrically conductive component according to an embodiment of the present invention will be described.

In the case of the first embodiment, a part of the insulating film (third resin 3) of the insulated wire is removed, the first resin 1 is adhered to the exposed conductor 4, and then the second resin 2 is applied to the conductor bundle. By encapsulating 5, an electrically conductive component 10 is obtained.

In the case of the second embodiment, after removing a part of the insulating film (third resin 3) of the insulated wire and joining the conducting wire 4 and the metal terminal 8, the first resin 1 is adhered to the conducting wire 4, Then, by sealing the wire bundle 5 with the second resin 2, the electrically conductive component 10 is obtained.

The method of attaching the first resin 1 to the conducting wire 4 is not particularly limited, but the liquid containing the first resin 1, or the monomers and prepolymers forming the first resin 1, and optionally the curing agent, the curing catalyst, etc. A method of applying a treatment liquid (hereinafter referred to as a treatment liquid) to the conducting wire 4 and a method of immersing the conducting wire 4 in the treatment liquid are exemplified.

The treatment liquid preferably has a viscosity of 0.1 poise or more and 300 poise or less at 23°C. By setting the viscosity of the treatment liquid to 300 poise or less, the first resin 1 can be easily filled into the conductor bundle 5, and the total area ratio of the cavities 6 can be easily controlled to 20% or less. More preferably 50 poise or less, still more preferably 30 poise or less. On the other hand, by setting the viscosity to 0.1 poise or more, it can be easily adhered to the conducting wire 4 . More preferably 1 poise or more, still more preferably 10 poise or more. Viscosity can be measured, for example, according to the method described in JIS K7117-1.

A widely used low boiling point solvent can be used as the treatment liquid. Low boiling point solvents include, for example, methyl ethyl ketone and toluene. After treatment, the solvent may be volatilized by natural drying, air drying, a dryer, an oven, or the like.

A method for sealing the wire bundle 5 with the second resin 2 is, for example, injection molding. Specifically, injection molding may be performed by placing the conductor 4 to which the first resin 1 is attached in a mold and injecting the molten resin into the mold. Examples of the injection molding machine include an injection molding machine THX5S1VN manufactured by Nissei Plastic Industry Co., Ltd.

The injection molding temperature (nozzle temperature) is preferably 180° C. or higher and 230° C. or lower. By setting the temperature to 180° C. or higher, it becomes easier to inject the molten resin. Furthermore, this makes it easier to cure the first resin 1 when the first resin 1 is a thermosetting resin. On the other hand, by setting the molding temperature to 230° C. or lower, it becomes easier to suppress decomposition and discoloration of the molten resin.

The injection pressure is preferably 0.05 MPa or more and 50 MPa or less. By setting the pressure to 50 MPa or less, movement of the wire bundle 5 during injection can be suppressed, and damage can be easily suppressed. On the other hand, by setting the injection pressure to 0.05 MPa or more, it is possible to facilitate the filling of the molten resin. When Viroshot is used as the molten resin, molding can be performed at a low injection pressure of 0.1 MPa or more and 30 MPa or less.

The pressure holding time and mold temperature after injection of the second resin 2 are not particularly limited, and vary depending on the mold and the type of resin. °C or higher and 230 °C or lower.

In the examples of Patent Document 1, "TSE322" and "TSE3212" manufactured by Momentive, which are one-component heat-curable silicone adhesives used as adhesives for the waterproof layer, have viscosities of 1100 poise and 2800 poise at 23°C, respectively. It has been confirmed that when these are used, the total area ratio of the cavities 6 in the inner region 7 of the outermost tangent line of the conductor bundle 5 exceeds 20%.

This application claims the benefit of priority based on Japanese Patent Application No. 2017-072383 filed on March 31, 2017. The entire contents of the specification of Japanese Patent Application No. 2017-072383 filed on March 31, 2017 are incorporated herein by reference.

REFERENCE SIGNS LIST 1 first resin 2 second resin 3 third resin 4 conducting wire 5 conducting wire bundle 6 cavity 7 inner region of the outermost tangent line 8 metal terminal 8a ring-shaped portion 8b projection 8c body portion 9 sealing portion 10 electrically conductive component 11 joining portion A axial direction

Claims (12)

a conductor bundle having a plurality of conductors;
a first resin adhering to the conducting wire;
an injection-molded article that seals the conductor bundle and contains a second resin;
In the cross section perpendicular to the axial direction of the conductor bundle, the conductor and the first resin are present in the inner region of the outermost tangent line of the conductor bundle, and the total area ratio of the voids in the inner region is 20%. An electrically conductive component characterized by: 2. The electrically conductive component according to claim 1, wherein the total area ratio of said conductors in said inner region is 80% or less. 3. The electrically conductive part according to claim 1, wherein said first resin has a maximum thickness of 0.1 mm or less outside said outermost tangent line. The electrically conductive component according to any one of claims 1 to 3, further comprising an insulating third resin covering at least a portion of the conductor bundle. 5. The electrically conductive component according to claim 4, wherein the maximum thickness of said first resin from said outermost tangent line is smaller than the thickness of said third resin. The third resin is at least one resin selected from the group consisting of polyvinyl chloride, polyethylene, and polypropylene,
6. The electrically conductive component according to claim 4, wherein said conductor bundle has an exposed portion not covered with said third resin, and said cross section is a cross section at said exposed portion. An electrically conducting component according to any one of the preceding claims, wherein at least some of said conductors are joined together. The electrically conductive component according to any one of claims 1 to 7, wherein the first resin is one or more selected from the group consisting of polyester-based resins, urethane-based resins, epoxy-based resins, and acrylic-based resins. The electrically conductive component according to any one of claims 1 to 8, wherein the second resin is one or more selected from the group consisting of polyester resins, polyamide resins, and polyolefin resins. A wire harness comprising the electrically conductive component according to any one of claims 1 to 9. A step of attaching a first resin to a wire bundle having a plurality of wires; and a step of sealing the wire bundle to which the first resin is attached by injection molding using a second resin,
In the cross section perpendicular to the axial direction of the conductor bundle after the sealing, the conductor and the first resin are present in the inner region of the outermost tangent line of the conductor bundle, and the total number of cavities in the inner region A method for manufacturing an electrically conductive component having an area ratio of 20% or less. In the step of attaching the first resin,
12. The method of manufacturing an electrically conductive component according to claim 11, wherein the liquid containing the component forming the first resin has a viscosity at 23[deg.]C of 0.1 poise or more and 300 poise or less.

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