JP2023016817A - 加工物のレーザ加工のための機械加工装置および加工物のレーザ加工のための方法 - Google Patents
加工物のレーザ加工のための機械加工装置および加工物のレーザ加工のための方法 Download PDFInfo
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- 238000003754 machining Methods 0.000 title claims abstract description 329
- 238000000034 method Methods 0.000 title abstract description 57
- 230000005855 radiation Effects 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 20
- 238000003698 laser cutting Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 abstract description 39
- 238000007493 shaping process Methods 0.000 abstract description 17
- 230000033001 locomotion Effects 0.000 description 41
- 230000003287 optical effect Effects 0.000 description 21
- 239000000835 fiber Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 238000009826 distribution Methods 0.000 description 10
- 230000003044 adaptive effect Effects 0.000 description 9
- 230000010355 oscillation Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical class [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 7
- 230000005672 electromagnetic field Effects 0.000 description 6
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
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- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
【解決手段】機械加工装置10は、機械加工レーザ源のための第1のインタフェース14と、放射17を検出する検出デバイスのための第2のインタフェース16と、出口開口18と、第1および第2のレーザビーム誘導デバイス20,22とを有し、第1のレーザビーム誘導デバイス20,20a,20bは、機械加工レーザビーム14を第2のレーザビーム誘導デバイス22へ誘導するように設計されており、第2のレーザビーム誘導デバイス22は、動的に運動させた機械加工レーザビーム14を出口開口18を通り抜けるように誘導するように、および機械加工ゾーン13によって発射され出口開口を通り抜けた放射を少なくとも部分的に第2のインタフェース16へ誘導するように配置および設計されている。
【選択図】図1
Description
米国特許第8781269(B2)号明細書は、レーザビームのビーム断面特性を変化させるための方法を記載している。
以下では、とりわけ、機械加工ヘッドを用いた例によって、本発明の実施形態に基づく機械加工装置を説明する。本発明はそれらの例に限定されない。本発明の実施形態に基づく機械加工装置および方法は、機械加工ヘッドなしで実現することもできる。
Claims (1)
- 加工物(12)の機械加工ゾーン(13)内のレーザ加工のための機械加工装置、特にレーザ切削のための機械加工装置、特にレーザ加工ヘッドであって、
機械加工レーザビーム(15)を発生させるための機械加工レーザ源のための第1のインタフェース(14)と、
前記機械加工ゾーンによって発射された放射(17)を検出する検出デバイスのための第2のインタフェース(16)と、
前記機械加工レーザビームのための出口開口(18)と、
第1および第2のレーザビーム誘導デバイス(20,22)と
を有し、
前記第1のレーザビーム誘導デバイス(20,20a,20b)が、前記機械加工レーザビームを前記第2のレーザビーム誘導デバイスへ誘導するように、および前記機械加工レーザビームを動的に運動させるように、特に、前記機械加工レーザビームを動的に整形するように配置および設計されており、
前記第2のレーザビーム誘導デバイス(22)が、動的に運動させた前記機械加工レーザビームを前記出口開口を通り抜けるように誘導するように、および前記機械加工ゾーンによって発射され前記出口開口を通り抜けた前記放射を少なくとも部分的に前記第2のインタフェースへ誘導するように配置および設計されている
ことを特徴とする機械加工装置。
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Application Number | Priority Date | Filing Date | Title |
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DE102019115554.1A DE102019115554A1 (de) | 2019-06-07 | 2019-06-07 | Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks |
DE102019115554.1 | 2019-06-07 | ||
JP2021572074A JP7175407B2 (ja) | 2019-06-07 | 2020-06-05 | 加工物のレーザ加工のための機械加工装置および加工物のレーザ加工のための方法 |
PCT/EP2020/065615 WO2020245349A1 (en) | 2019-06-07 | 2020-06-05 | Machining apparatus for the laser machining of a workpiece and method of the laser machining of a workpiece |
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JP2021572074A Division JP7175407B2 (ja) | 2019-06-07 | 2020-06-05 | 加工物のレーザ加工のための機械加工装置および加工物のレーザ加工のための方法 |
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JP2022179145A Active JP7464678B2 (ja) | 2019-06-07 | 2022-11-08 | 加工物のレーザ加工のための機械加工装置および加工物のレーザ加工のための方法 |
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US (1) | US11478879B2 (ja) |
EP (1) | EP3980216B1 (ja) |
JP (2) | JP7175407B2 (ja) |
CN (1) | CN113924184B (ja) |
DE (1) | DE102019115554A1 (ja) |
WO (1) | WO2020245349A1 (ja) |
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EP3747588A1 (de) * | 2019-06-07 | 2020-12-09 | Bystronic Laser AG | Bearbeitungsvorrichtung zur laserbearbeitung eines werkstücks und verfahren zur laserbearbeitung eines werkstücks |
KR20220139188A (ko) * | 2021-04-07 | 2022-10-14 | 주식회사 엘지에너지솔루션 | 분리막 커팅 장치 및 이를 포함하는 전극셀 제조 시스템 |
DE102022002959A1 (de) | 2022-08-15 | 2024-02-15 | Fritz Stepper GmbH & Co. KG. | Schweißvorrichtung und Verfahren zum Verschweißen zweier Werkstücke |
EP4292749A1 (de) | 2022-06-15 | 2023-12-20 | Fritz Stepper GmbH & Co. KG | Laser-schweissvorrichtung und verfahren zur überwachung, mit einem laser-schweisskopf und einer überwachungseinrichtung |
DE102022002164A1 (de) | 2022-06-15 | 2023-12-21 | Fritz Stepper GmbH & Co. KG. | Laser-Schweißkopf |
EP4321291A1 (de) | 2022-07-27 | 2024-02-14 | Fritz Stepper GmbH & Co. KG | Laser-schweissvorrichtung und verfahren zur überwachung, mit einem laser-schweisskopf und einer überwachungseinrichtung |
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US11478879B2 (en) | 2022-10-25 |
EP3980216B1 (en) | 2023-11-22 |
US20220143756A1 (en) | 2022-05-12 |
JP7464678B2 (ja) | 2024-04-09 |
JP7175407B2 (ja) | 2022-11-18 |
CN113924184A (zh) | 2022-01-11 |
CN113924184B (zh) | 2023-12-29 |
WO2020245349A1 (en) | 2020-12-10 |
EP3980216A1 (en) | 2022-04-13 |
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