JP2023015410A - Glass plate having through-hole pattern formed therein, manufacturing method therefor, and micro-channel chip - Google Patents

Abstract

To provide a glass plate having a through-hole pattern formed therein and a manufacturing method therefor, which can be used for a micro-channel chip that enables high-precision analyses, experiments, and the like.SOLUTION: A method for manufacturing a glass plate having a through-hole pattern formed therein includes: a drawing step of drawing a pattern on a glass plate 2 by irradiating the glass plate 2 with a pulse laser while relatively scanning along a pattern to be formed; and a step of forming a through-hole pattern 3 having the shape of the pattern drawn and adjusting the width of the through-hole and the thickness of the glass plate by etching the glass plate 2.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a glass plate having a through-hole pattern formed thereon, a method for manufacturing the same, and a microchannel chip.

In the fields of biotechnology, medicine, agriculture, and the like, experiments such as reactions and analyzes using very small amounts of samples (μTAS, Micro-Total Analysis System) are often performed. In these research fields, a microchannel chip in which a channel with a width on the order of μm is formed in a transparent base material is used in order to flow a sample liquid through a channel with a width of several μm to several tens of μm.

A microchannel chip is manufactured by laminating transparent materials in order to ensure the visibility of the inside of the channel and the transparency of light. In particular, when considering the use for optical analysis such as FTIR (Fourier transform infrared spectroscopy), it is necessary to make the light transmittance uniform. Therefore, it is preferable that the width of the channel is constant and the wall surface is perpendicular to the substrate surface, that is, the cross-sectional shape of the channel is rectangular.

From this point of view, easy-to-process resins such as polystyrene resins and acrylic resins are frequently used as materials for microchannel chips.

Glass is also suitable as a material for the microchannel chip in terms of transparency, heat resistance, durability, chemical resistance, and the like. However, glass has the problem that it is easily chipped or broken in general machining, and fine processing is difficult.

An example of a method of forming a micropattern on a glass plate that can be applied to a microchannel chip is disclosed in Patent Document 1. This manufacturing method comprises: i) forming a film of an etching resistance variable material on a support substrate to be processed; iii) developing the etching resistance variable material film to form micropatterned openings; and iv) using the remaining etching resistance variable material film as a mask, etching the support substrate to form grooves. By doing so, a micropattern is formed.

Japanese Patent Application Laid-Open No. 2007-196106

In the method disclosed in Patent Document 1, the etching is isotropic etching, which progresses in the direction normal to the surface of the support substrate in the mask opening and also isotropically progresses below the mask. As a result, so-called undercut, side etching, and the like occur. Therefore, the cross section of the formed channel has a tapered side surface (side wall), and the width of the channel becomes narrower as it becomes deeper.

If the width of the channel is not uniform in this way, position adjustment becomes complicated when installing the microchannel chip in an optical analysis device or an optical measurement device. Furthermore, variations occur in the optical properties of the sample liquid in the depth direction of the channel.

In addition, the bottom surface of the channel becomes curved due to the influence of isotropic etching. Therefore, light emitted from an analytical instrument or the like is refracted or dispersed when passing through the bottom surface.

For this reason, it becomes difficult to ensure sufficiently high accuracy for analysis, experiments, and the like.

The present invention has been made in view of the above circumstances, and provides a glass plate having a through-hole pattern formed thereon and a method for manufacturing the same, which can be used for a microchannel chip that enables high-precision analysis and experiments. intended to

The present invention is a method of manufacturing a glass plate having a through-hole pattern, comprising the following steps.
A drawing step of irradiating a glass plate with a pulse laser along a pattern to be formed to draw the pattern on the glass plate;
an etching step of etching the glass plate to form through-holes having the drawn pattern shape and adjusting the width of the through-holes and the thickness of the glass plate;

The drawing step preferably includes a step of irradiating a pulse laser while relatively scanning along a pattern to be formed perpendicular to the main surface of the glass plate.

The pulse laser is preferably a picosecond laser or a femtosecond laser.

Preferably, in the etching step, the entire glass plate is immersed in an etchant without applying a mask to the glass plate.

In the etching step, the portion of the glass plate through which the pulse laser passes and the modified portion therearound are further etched at a higher etching rate than the surrounding unmodified portion, thereby removing the glass. A through hole can be formed having a plane substantially perpendicular to the surface of the plate.

After the etching step,
A sealing step of bonding a sealing material to at least one of the front surface and the back surface of the glass plate so as to block at least a part of the through hole can be provided.

The sealing step preferably includes the following steps.
providing a metal coating layer on each surface of the sealing material and the glass plate;
By laminating the metal coating layer of the glass plate and the metal coating layer of the sealing material so that they are in contact with each other and diffusing the metal atoms of both metal coating layers, the sealing material and the glass plate are joined. process to do.

The metal used for the atomic diffusion bonding is preferably gold or copper.

Preferably, in the sealing step, the metal coating layer is formed to a thickness of 0.2 to 20 nm by sputtering.

The sealing step preferably includes a step of using a glass plate and a resin sheet as a sealing material, laminating the glass plate, the resin sheet, and the glass substrate in this order, and heating and pressurizing the upper surface of the glass plate. .

The glass plate having the through-hole pattern of the present invention is
a glass plate having substantially parallel opposing principal surfaces and having through holes extending in a direction parallel to the principal surfaces;
a sealing material that is joined so as to block at least a portion of the through hole;
A cross section defined by the side wall portion of the through hole and the sealing material is substantially rectangular.

The microchannel chip of the present invention is formed of a glass plate having the through-hole pattern formed thereon.

FIG. 2A is a plan view and FIG. 1B is a side view showing a microchannel chip formed by a glass plate having a through-hole pattern formed thereon and manufactured by a manufacturing method according to an embodiment of the present invention; , (C) is a sectional view taken along line CC of (A), and (D) is a partially enlarged view of (C). It is process drawing of the manufacturing method of the glass plate with which the through-hole pattern was formed which concerns on embodiment of this invention. 1. It is a figure showing the laser drawing method for forming the through-hole pattern of the glass plate in which the through-hole pattern shown in FIG. 1 was formed. It is a figure showing the state of a glass plate when a short-pulse laser beam passes through a glass plate, (A) is sectional drawing, (B) is a top view. It is a figure showing the etching process of the manufacturing method concerning an embodiment of the invention. It is a figure which shows the joining process of a glass plate and a sealing material in the manufacturing method which concerns on embodiment of this invention. It is a figure which shows the joining process of the glass plate and sealing material by atomic diffusion bonding in the manufacturing method which concerns on embodiment of this invention. FIG. 3 is a diagram showing a joined body in which a glass base material and a sealing material are joined; It is a figure showing an example of the modification of embodiment of this invention. It is a figure showing an example of the modification of embodiment of this invention.

Hereinafter, a glass plate having a through-hole pattern formed thereon and a method for manufacturing the same according to an embodiment of the present invention will be described with reference to a drawing of a glass plate having a through-hole pattern formed thereon, which is one embodiment.

As shown in FIGS. 1(B) and 1(C), the glass plate 1 formed with the through-hole pattern 3 according to the present embodiment is a glass plate formed with the micro-channel 3 formed by the through-hole pattern 3. It comprises a plate 2 and sealing plates 4 and 5 with glass substrates 2 arranged on both main surfaces.

Although the material of the glass plate 2 is not particularly limited, it is desirable to use, for example, a material containing few impurities such as quartz glass. Both main surfaces of the glass plate 2 are formed parallel to each other.
As shown in FIGS. 1(C) and 1(D), the glass plate 2 is formed with through-holes forming side walls of the microchannel, and as shown in FIG. 1(A), the surface of the glass plate 2 Extends as far as required in the direction.
As shown enlarged in FIG. 1(D), the wall surface of the glass plate 2 facing the through hole is substantially perpendicular to the surface of the glass plate 2 . The width W of the microchannel 3 is arbitrary, for example, from about 2 μm to about 3 mm.
A wide portion 14 such as a sample introduction portion and a reservoir is appropriately arranged in the microchannel 3 .

The sealing plates 4 and 5 are each made of a resin film or a glass plate. The sealing plate 4 is arranged on one main surface of the glass plate 2 , and the sealing plate 5 is arranged on the opposite main surface of the glass plate 2 . It is arranged on the main surface, closely adheres to the glass plate 2 , and seals the microchannel 3 .

The microchannel 3 is composed of the opposing side walls of the through hole formed in the glass plate 2 and the sealing plates 4 and 5, and has a substantially rectangular (rectangular) cross section in a plane perpendicular to its extending direction. be. Further, the depth of the microchannel 3 is equal to the thickness of the glass plate 2, eg, 100 μm to 1.5 mm.

In addition, openings are appropriately formed at positions facing the wide portion 14 of the sealing plates 4 and 5 .

Next, a method for manufacturing the glass plate 1 having the through-hole pattern 3 having the above configuration will be described with reference to FIGS.

The manufacturing method of the glass plate 1 having the through-hole pattern 3 according to the present embodiment can be summarized as follows: i) a step of preparing the glass plate 2 and the sealing materials 4 and 5; iii) a step of etching the glass plate 2 after drawing; and iv) a step of attaching the sealing plates 4 and 5 to the glass plate 2 after etching.
Hereinafter, each process will be described in order with reference to FIG.

1. First, a glass substrate is prepared (step S11). As described above, the material of the glass base material is arbitrary, but it is desirable to have high translucency and few impurities. In addition, since the thickness of the glass base material is reduced by etching in the subsequent etching process (step S13), a glass base material having a thickness that takes into consideration the thickness reduction in the etching process is prepared.
The vertical and horizontal dimensions of the glass substrate are not particularly limited, and may be selected according to the equipment to be used. It is also possible to cut out a plurality of glass plates 2 from one glass substrate. In the following description, for ease of understanding, it is assumed that one glass plate 2 is obtained from one glass substrate.

2. Sealing materials 4 and 5 are prepared (steps S21 and S31).
As the sealing materials 4 and 5, a sheet of transparent resin such as a glass plate, an acrylic resin, or a polystyrene resin can be used.
The thickness of the sealing materials 4 and 5 is not particularly limited as long as the transparency of the glass plate 1 having the through-hole pattern 3 formed thereon, the dimensions suitable for the application, and the strength to withstand use can be ensured. The vertical and horizontal sizes of the sealing materials 4 and 5 are appropriately selected according to the vertical and horizontal sizes of the glass substrate.

3. Next, a laser processing step (step S12) is performed.
In this process, the glass plate 2 is placed on an XY stage, a pulse laser device is placed above it, and the relative positions of the glass plate 2 and the pulse laser device are moved, as shown in FIG. A plate 2 is irradiated with a pulsed laser beam L to draw a pattern of microchannels to be formed on the glass plate 2 . The positions and inclinations of the pulse laser device and the glass plate 2 are adjusted so that the laser beam L is applied perpendicularly to the surface of the glass plate 2 .

The intensity of the laser light L is set to be sufficient for the laser light L incident on the glass plate 2 from the upper surface to be emitted from the lower surface.
Further, it is desirable that the beam diameter of the laser light L is, for example, about 1/4 to 3/4 of the width W of the microchannel 3 to be formed.

Here, pulsed lasers are lasers with extremely short pulse widths, such as picosecond lasers and femtosecond lasers. A picosecond laser is a laser having a pulse width on the order of picoseconds. A femtosecond laser is a laser having a pulse width on the order of femtoseconds.

Since the pulse laser device irradiates high energy in a short time, it can absorb light even in transparent materials. Further, as shown in FIG. 4A, when the pulsed laser beam L is applied to the glass plate 2, a high-voltage shock wave S is generated. The shock wave S reaches a deep part that is not affected by the heat of the pulsed laser beam L. As shown in FIG. Therefore, inside the glass plate 2, there is a portion affected by the shock wave S that is not caused by heat.

Further, the glass is modified in the range of 10 to 20 μm in diameter centering on the micropores formed by the pulsed laser. This modification is due to effects such as severing the molecular chains of the glass by these pulse lasers.

The glass-modified portion 8 thus modified has a higher etching rate than the unmodified portion in the etching step (step S13) described later, and can be etched several times to several tens of times faster.

4. Etching Step Subsequently, in the etching step (step S13), the glass plate 2 is etched to form holes in the shape of the drawn pattern 3 . By adjusting the etching time, the width W of the pattern 3 and the thickness of the glass plate 2 are adjusted.

The etching method is not particularly limited, and any known method may be used. For example, as shown in FIG. 5, a method of immersing the glass plate 2 in an etching bath 10 filled with an etchant 9 may be used.

The etchant 9 is not particularly limited, but hydrofluoric acid can be used. As the etching bath 10, a bath lined to prevent corrosion by hydrofluoric acid is used. Tetrafluoroethylene is preferred for the lining.

As described above, the modified portion 8 of the glass produced by irradiation with the pulse laser has a high etching rate (high etching rate). Therefore, the etchant 9 quickly penetrates into the reformed portion 8 to proceed with the etching, and furthermore, the etching proceeds in the direction parallel to the surface of the glass plate 2 .

Therefore, the wall surface of the through-hole pattern 3 is perpendicular to the surface of the glass plate 2 and has a uniform and flat surface shape.

As a result, the through-hole pattern 3 having a high aspect ratio, in which the depth L is large relative to the width W of the through-hole pattern 3, can be formed.

During this time, the etching of the surface of the glass plate 2 progresses, and the surface of the glass plate 2 becomes in a state equivalent to chemical polishing.

When the width W of the through-hole pattern 3 reaches a desired value and the thickness of the glass plate 2 reaches a desired thickness, the etching is finished.

5. Washing/Drying Step Subsequently, the glass plate 2 is washed and dried (step S14).

Optionally, a sealing material may be bonded to at least one of the front surface and the back surface of the glass plate having the through-hole pattern 3 of the present invention so as to block at least part of the through-holes.

6. Sealing Step Next, as shown in FIG. 6 , sealing materials 4 and 5 are joined to both surfaces of the glass plate 2 to block the through-hole pattern 3 .

The method itself for bonding the sealing members 4 and 5 made of glass to the glass plate 2 is arbitrary. However, it is desirable to use atomic diffusion bonding that does not require heat treatment and pressure treatment.

A bonding method using atomic diffusion bonding will be described below.
First, the bonding surfaces 4 and 5 of the sealing member made of glass are polished by a chemical polishing method and flattened.
Next, in a vacuum environment, a thin metal coating layer is formed by sputtering on the surfaces to be joined, that is, both surfaces of the glass plate 2 and the chemically polished surfaces of the sealing materials 4 and 5 (steps S15 and S17). , S22, S32). A thickness of several nanometers is sufficient for the coating layer, and a thickness of about three atomic layers may be sufficient.

Any metal such as gold, copper, titanium, silver, aluminum, molybdenum, tantalum, and tungsten can be used as the metal deposited by sputtering. A material that does not affect the sample chemically is preferable, and gold or copper is preferable. Gold exhibits little chemical reactivity. When copper forms an oxide film, it becomes passive and becomes difficult to react chemically. Furthermore, it is most preferable to use gold from the viewpoint of having the highest chemical stability. When using a metal such as gold or copper, it is preferable to coat titanium in advance and then sputter gold thereon.

The thickness of the metal coating layer formed by sputtering should be as large as one metal atom, and therefore should be about 0.2 nm or more. Moreover, from the viewpoint that it is necessary to ensure the transparency of the channel, the metal coating layer is preferably not too thick, preferably 20 nm or less.

The lamination of the glass plate 2 and the sealing materials 4 and 5 may be performed on one side at a time, or may be performed on both sides at the same time.

It should be noted that special treatment such as masking the pattern 3 of the glass plate 2 is not required. This is because the deposit amount is very small.
Subsequently, as shown in FIG. 7, the metal coating layer 11a of the glass plate 2 and the metal coating layers 11b of the sealing materials 4 and 5 are brought into contact with each other and laminated (steps S16 and S18).

For example, it can be carried out under any conditions such as high temperature and pressurized conditions. However, in the present invention, since the substrate obtained by etching is used, it can be performed at normal temperature and normal pressure, and the bonding process can be easily performed without the need for equipment for adjusting temperature and pressure. can be done.

The process of bonding the glass plate 2 and the sealing material 4 by atomic diffusion bonding will be described with reference to FIGS. 7(1) to 7(4).
(1) The metal coating layer 11a of the glass plate 2 and the metal coating layer 11b of the encapsulant 4 face each other and are aligned.
(2) The metal coating layer 11a of the glass plate 2 and the metal coating layer 11b of the sealing material 4 are brought into contact with each other. Diffusion of metal atoms begins between the metal coating layers 11a and 11b from the boundary (dotted line).
(3) The metal atoms of the metal coating layers 11a and 11b are rearranged.
(4) Due to the rearrangement of metal atoms, the boundary between the metal coating layers 11a and 11b disappears and a single metal layer 11 is formed between the transparent substrate 2 and the sealing member 4;
As a result, the glass plate 2 and the sealing material 4 are strongly bonded.
The sealing material 5 is also bonded to the glass plate 2 by the same operation.

After lamination, metal atoms diffuse at the contact portions between the metal coating layer 11 of the glass plate 2 and the metal coating layers 11 of the sealing materials 4 and 5 . As a result, the boundary of the contact disappears and a single layer of metal is formed. Thereby, the glass plate 2 and the sealing materials 4 and 5 are firmly joined.

The use of atomic diffusion bonding for bonding the glass plate 2 and the sealing materials 4 and 5 has the following advantages.
1. Bonding is done by diffusion of metal atoms, so there is no limit to the materials to be bonded.
2. By coating the inside of the channel with gold or copper, a chemically stable channel can be formed.
3. Bonding is achieved simply by bringing the bonding surfaces of the glass plate 2 and the sealing materials 4 and 5 into contact with each other at room temperature and atmospheric pressure.

Thus, when gold or copper is used for the metal coating layer 11, there is no chemical effect on the sample solution. If the thickness of the metal coating layer is 0.2 to 20 nm, the transparency and dimensions of the patterns of the encapsulants 4 and 5 are hardly affected. Therefore, sputtering can be performed without masking the sealing materials 4 and 5 and the glass plate 2 .

Furthermore, no stress is generated in the glass plate 2 and the sealing materials 4 and 5 during bonding. Therefore, it is possible to prevent the glass plate on which the through-hole pattern 3 is formed from being damaged due to the deformation of the member.

Moreover, when using atomic diffusion bonding, the sealing materials 4 and 5 are not limited to glass. Resins such as acrylic resins and polystyrene can be used.

7. Cutting Step Next, unnecessary portions of the laminate are cut using a laser cutter or the like to form a glass plate 1 having a through-hole pattern 3 as a product such as a microchannel chip.

As described above, according to the glass plate 1 formed with the through-hole pattern 3 according to the present embodiment, the micro flow is made of glass excellent in transparency, heat resistance, durability, chemical resistance, and the like. You can get road chips. In addition, the microchannel 3 provided in the glass plate 1 having the through-hole pattern 3 formed thereon has a substantially rectangular cross-section taken along a plane perpendicular to the direction in which it extends, so that high-precision experiments, analyses, etc. can be performed. It becomes possible. That is, by forming a sharp edge between the front and back surfaces of the glass plate and the inner surface of the through hole, it is possible to obtain a glass plate having excellent optical properties when the glass plate having the through hole pattern 3 is formed. is.

In addition, according to the method of manufacturing a glass plate having the through-hole pattern 3 formed thereon according to the present embodiment, it is possible to process a thin opening having a rectangular cross section in the glass plate, which enables high-precision experiments, analyses, and the like. can provide a microfluidic chip capable of

In the above description, an example of bonding the sealing materials 4 and 5 to the glass plate 2 by atomic diffusion bonding was shown, but other methods may be used.
However, it is not preferable to use an adhesive for joining the sealing materials 4 and 5 from the viewpoint of influence on the sample. Therefore, for example, when glass sealing materials 4 and 5 are used, the glass sealing material, the resin sheet, and the glass plate 2 can be laminated in this order and bonded by thermocompression bonding. The thickness of the glass sealing material is not particularly limited as long as the size suitable for the application and the strength for use can be ensured. As the resin sheet for thermocompression bonding the sealing members 4 and 5 made of glass and the glass plate 2, a resin having high chemical resistance is preferable. Also, in order to prevent breakage due to impact or the like, a resin having elasticity is preferable.

From such a point of view, the resin sheet for thermocompression is preferably a polyolefin resin, more preferably a polyethylene resin. Moreover, the resin sheet used for thermocompression bonding of the glass sealing material preferably does not contain additives such as plasticizers and tackifiers from the viewpoint of influence on the sample.

The heating temperature is appropriately set to a temperature higher than the softening point of the resin sheet to be used and lower than the melting point. Moreover, the pressurizing conditions are appropriately set so that the softened resin sheet does not block the microchannel 3 .

The thickness of the resin sheet used for thermocompression bonding of the glass sealing material ensures the transparency of the glass plate on which the through-hole pattern 3 is formed, the size according to the application, and the strength to withstand use. If possible, there are no particular restrictions.

Moreover, resins such as acrylic resins and polystyrene resins can be used as the sealing materials 4 and 5 . In this case, the sealing material made of resin can be laminated on the glass substrate and bonded by thermocompression bonding.

The heating temperature required for the thermocompression bonding is appropriately set to a temperature higher than the softening point of the resin used and lower than the melting point. Moreover, the pressurization conditions are appropriately set so that the softened resin does not clog the flow path.

The thickness of the sealing materials 4 and 5 is not particularly limited as long as the transparency of the glass plate 1 having the through-hole pattern 3 formed thereon, the dimensions suitable for the application, and the strength to withstand use can be ensured.

Moreover, from the viewpoint of influence on the sample, it is preferable that the resins used as the sealing materials 4 and 5 do not contain additives such as plasticizers and tackifiers.

As illustrated in FIG. 8, a protective material layer 13 may be further laminated on the sealing materials 4 and 5 in order to protect the glass plate 1 having the through-hole pattern 3 formed thereon.
However, when the sealing members 4 and 5 made of glass and the glass plate 2 are thermocompressed via a resin sheet by the above method, or when the sealing members 4 and 5 made of resin are heat-bonded to the glass plate 2, In the case of crimping, it is difficult to laminate another member on top of the sealing materials 4 and 5 .

Specifically, when a plurality of resin layers are laminated, the heat conduction efficiency is lowered. Therefore, it is difficult to thermally bond a plurality of resin layers together, and it is necessary to laminate a resin material having a softening temperature lower than that of the resin of the lower layer and thermally bond each time.

For this reason, when a multi-layered structure is formed by thermocompression bonding, the combination of members is significantly restricted, and the manufacturing process becomes complicated.
In such a case, it is desirable to use the atomic diffusion bonding method described above.

(Modification)
In the above-described embodiment, an example of forming the glass plate 1 in which the through-hole pattern 3 having the microchannel 3 having a width close to the diameter of the laser beam L is formed has been described.
The present invention is not limited to this. For example, it can be applied to forming a microchannel having a width sufficiently larger than the laser diameter.

In this case, for example, as shown in FIG. 9, a pulsed laser may be irradiated along the outer edge pattern of the microchannel 3 and the wide portion 14 to be formed for drawing. By irradiating the laser beam in this manner, the central portion of the through-hole 3 or the wide portion 15 can be removed by etching from the periphery in the subsequent etching process, and the diameter of the laser beam is smaller than that of the beam diameter of the laser beam. Wide through holes can be formed.

Further, for example, as shown in FIG. 10, in the manufacturing process, a sealed through hole 3 is formed, and finally, a laser cutter or the like is used to cut along cutting lines C1 and C2, thereby sealing the hole. Both ends of the through hole 3 may be opened.

The present invention is not limited to the above embodiments, and various modifications and applications are possible.
For example, in the manufacturing method described above, a resin plate can be used instead of the glass plate 2, and a microchannel array using a resin plate can be manufactured by the same process.

INDUSTRIAL APPLICABILITY According to the present invention, a glass substrate having a through-hole pattern 3 having a rectangular cross section can be manufactured at low cost using a glass substrate. It is useful for manufacturing microfluidic chips used in research fields such as.

REFERENCE SIGNS LIST 1 glass plate formed with a through-hole pattern 2 glass plate 3 through-hole pattern 4 sealing material 5 sealing material 6 laser irradiation point 7 fine hole 8 glass reforming section 9 etching liquid 10 etching tank 11 metal coating layer 12 laminate 13 Protective material layer 14 Wide portion 15 Wide portion

Claims (12)

A drawing step of irradiating a glass plate with a pulse laser along a pattern to be formed to draw the pattern on the glass plate;
an etching step of etching the glass plate to form through holes having the drawn pattern shape and adjusting the width of the through holes and the thickness of the glass plate;
A method for manufacturing a glass plate having a through-hole pattern formed thereon. 2. The formation of the through-hole pattern according to claim 1, wherein the drawing step includes a step of irradiating a pulsed laser while relatively scanning along a pattern to be formed perpendicularly to the main surface of the glass plate. A method for manufacturing a glass plate that has been processed. 3. The method of manufacturing a glass plate having a through-hole pattern according to claim 1, wherein the pulse laser is a picosecond laser or a femtosecond laser. 4. The method for manufacturing a glass plate having a through-hole pattern according to claim 1, wherein in the etching step, the entire glass plate is immersed in an etchant without applying a mask to the glass plate. . In the etching step, the portion of the glass plate through which the pulse laser passes and the modified portion therearound are further etched at a higher etching rate than the surrounding unmodified portion, thereby removing the glass. 5. The method for producing a glass plate having a through-hole pattern according to claim 1, wherein the through-holes are formed so as to have a plane substantially perpendicular to the surface of the plate. After the etching step,
The penetration according to any one of claims 1 to 5, comprising a sealing step of joining a sealing material to at least one of the front surface and the back surface of the glass plate so as to block at least a part of the through hole. A method for manufacturing a glass plate having a hole pattern formed thereon. The sealing step includes
providing a metal coating layer on each surface of the sealing material and the glass plate;
By laminating the metal coating layer of the glass plate and the metal coating layer of the sealing material so that they are in contact with each other and diffusing the metal atoms of both metal coating layers, the sealing material and the glass plate are joined. 7. The method for manufacturing a glass plate having a through-hole pattern according to claim 6, comprising the step of: 8. The method of manufacturing a glass plate having a through-hole pattern according to claim 7, wherein the metal used for the metal coating layer is gold or copper. 9. The method for producing a glass plate having a through-hole pattern according to claim 7 or 8, wherein the metal coating layer is formed by sputtering to a thickness of 0.2 to 20 nm. The sealing step includes a step of using a glass plate and a resin sheet as a sealing material, laminating the glass plate, the resin sheet, and the glass substrate in this order, and heating and pressurizing the upper surface of the glass plate. 8. The method for producing a glass plate having a through-hole pattern according to 7 above. a glass plate having substantially parallel opposing principal surfaces and having through holes extending in a direction parallel to the principal surfaces;
a sealing material that is joined so as to block at least a portion of the through hole;
A glass plate having a pattern of through-holes formed thereon, wherein a cross section defined by the side wall portions of the through-holes and the sealing material is substantially rectangular. A microchannel chip formed of the glass plate having the through-hole pattern according to claim 11 formed thereon.

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