JP2022545538A - 方向付けられたウエハローディングによる非対称性補正 - Google Patents
方向付けられたウエハローディングによる非対称性補正 Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
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- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
Description
などの2乗差の総和として計算され得る。
Claims (15)
- 研磨パッドを支持するためのプラテン、基板を保持するためのキャリアヘッド、および前記キャリアヘッドを回転させるためのモータを有する研磨ステーションと、
前記基板を前記研磨ステーションに移送するように構成されたロボットアームと、
前記キャリアヘッドの角度の除去プロファイルを保存し、前記基板の角度の厚さプロファイルを受信することと、前記角度の除去プロファイルおよび前記角度の厚さプロファイルに基づいて前記基板に対する前記キャリアヘッドの装填の向きを決定することと、前記キャリアヘッドが前記装填の向きにあるように、前記モータに前記キャリアヘッドを回転させることと、前記基板を、前記キャリアヘッドが前記装填の向きにある状態で前記キャリアヘッド内に装填することと、を行うように構成されたコントローラと、を備える、化学機械研磨システム。 - 前記コントローラが、前記角度の除去プロファイルおよび前記角度の厚さプロファイルに基づいて決定された最終厚さプロファイルの角度の非対称性を低減するために、装填の向きを決定するように構成されている、請求項1に記載のシステム。
- 前記コントローラが、複数の角度差のうちの角度差ごとに、前記角度の除去プロファイルと前記角度の厚さプロファイルとの間の全体の厚さの差を計算するように構成され、最終厚さプロファイルが、前記角度差を、前記角度の除去プロファイルと前記角度の厚さプロファイルとの間の角度オフセットとして使用する、請求項1に記載のシステム。
- 前記コントローラが、前記複数の角度差から最小の全体の厚さの差を有する角度差を選択するように構成されている、請求項3に記載のシステム。
- 前記コントローラが、前記角度差に基づいて、前記角度の向きを決定するように構成されている、請求項3に記載のシステム。
- 前記コントローラが、前記最終厚さプロファイルを、前記角度の除去プロファイルと前記角度の厚さプロファイルとの間の最小の2乗差の総和として計算するように構成されている、請求項3に記載のシステム。
- 前記基板の前記角度の厚さプロファイルを測定するように構成されたセンサを有する計測ステーションを備える、請求項1に記載のシステム。
- 前記センサが、ライン走査カメラを備える、請求項7に記載のシステム。
- 前記基板を前記キャリアヘッド内に装填する前に、前記基板の角度の向きを決定するためのセンサを備える、請求項1に記載のシステム。
- 前記センサが、前記基板上の目印を検出するように構成されている、請求項9に記載のシステム。
- 前記センサが、前記基板上のフラットまたはノッチを検出するように構成されている、請求項10に記載のシステム。
- 前記コントローラが、前記基板の向きを示す目印を割り当てるように構成されている、請求項10に記載のシステム。
- 前記基板の前記角度の厚さプロファイルを測定するための計測ステーションを備え、前記センサが、前記計測ステーション内の前記基板の角度の向きを決定するために、前記計測ステーション内に配置される、請求項9に記載のシステム。
- 化学機械研磨のための方法であって、
基板の角度の厚さプロファイルの測定値を受信することと、
研磨での角度の不均一性を低減するために、前記基板に対するキャリアヘッドの所望の角度を選択することと、
前記所望の角度に前記キャリアヘッドを回転させることと、
前記基板を前記キャリアヘッドに移送し、前記基板を、前記キャリアヘッドが前記所望の角度にある状態で前記キャリアヘッド内に装填することと、
前記基板を研磨することと、を含む、方法。 - テスト基板の研磨前の角度の厚さプロファイルを測定することと、
前記テスト基板を、前記キャリアヘッドが前記基板に対して零位置にある状態で前記キャリアヘッド内に装填することと、
前記テスト基板を研磨することと、
前記テスト基板の研磨後の角度の厚さプロファイルを測定することと、
前記研磨前の角度の厚さプロファイルと前記研磨後の角度の厚さプロファイルとを比較することによって、前記キャリアヘッドによる角度の除去プロファイルを計算することと、を含む、請求項14に記載の方法。
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PCT/US2020/047806 WO2021041417A1 (en) | 2019-08-27 | 2020-08-25 | Asymmetry correction via oriented wafer loading |
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US11282755B2 (en) | 2019-08-27 | 2022-03-22 | Applied Materials, Inc. | Asymmetry correction via oriented wafer loading |
US11931853B2 (en) | 2021-03-05 | 2024-03-19 | Applied Materials, Inc. | Control of processing parameters for substrate polishing with angularly distributed zones using cost function |
TWI783714B (zh) * | 2021-05-10 | 2022-11-11 | 環球晶圓股份有限公司 | 晶圓接合設備 |
US20230390885A1 (en) * | 2022-06-03 | 2023-12-07 | Applied Materials, Inc. | Determining substrate precession with acoustic signals |
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