JP2022525135A5 - - Google Patents
Info
- Publication number
- JP2022525135A5 JP2022525135A5 JP2021555069A JP2021555069A JP2022525135A5 JP 2022525135 A5 JP2022525135 A5 JP 2022525135A5 JP 2021555069 A JP2021555069 A JP 2021555069A JP 2021555069 A JP2021555069 A JP 2021555069A JP 2022525135 A5 JP2022525135 A5 JP 2022525135A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- electronic
- card
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/299,037 | 2019-03-11 | ||
| US16/299,037 US10592795B2 (en) | 2017-07-10 | 2019-03-11 | Packaged electronic module and manufacturing method thereof |
| PCT/US2020/022198 WO2021091587A2 (en) | 2019-03-11 | 2020-03-11 | Packaged electronic module and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022525135A JP2022525135A (ja) | 2022-05-11 |
| JP2022525135A5 true JP2022525135A5 (https=) | 2023-03-23 |
| JP7644976B2 JP7644976B2 (ja) | 2025-03-13 |
Family
ID=75848572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021555069A Active JP7644976B2 (ja) | 2019-03-11 | 2020-03-11 | パッケージ化電子モジュール及びその製造方法 |
Country Status (13)
| Country | Link |
|---|---|
| EP (1) | EP3939084A4 (https=) |
| JP (1) | JP7644976B2 (https=) |
| KR (1) | KR20210134665A (https=) |
| CN (1) | CN114175258A (https=) |
| AU (1) | AU2020380119B2 (https=) |
| BR (1) | BR112021017785A2 (https=) |
| CA (1) | CA3132334A1 (https=) |
| IL (1) | IL286170B2 (https=) |
| MA (1) | MA55326A (https=) |
| MX (1) | MX2021010237A (https=) |
| SG (1) | SG11202109820RA (https=) |
| WO (1) | WO2021091587A2 (https=) |
| ZA (1) | ZA202106107B (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3161493A1 (fr) | 2024-04-19 | 2025-10-24 | Smart Packaging Solutions | Module électronique pour carte à puce pourvue d’un écran d’affichage, et son procédé de fabrication |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL137498A0 (en) * | 1998-01-27 | 2001-07-24 | Viztec Inc | Transmitting advertisements to smart cards |
| FR2790849B1 (fr) * | 1999-03-12 | 2001-04-27 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
| DE10146804A1 (de) * | 2001-09-22 | 2003-04-10 | Philips Corp Intellectual Pty | Verfahren und Schaltungsanordnung zum Ansteuern eines Displays sowie Chipkarte mit Display |
| DE10221214A1 (de) * | 2002-05-13 | 2003-11-27 | Orga Kartensysteme Gmbh | Chipmodul |
| DE10248391A1 (de) * | 2002-10-17 | 2004-05-13 | Giesecke & Devrient Gmbh | Tragbarer Datenträger mit Display |
| US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
| JP2010108387A (ja) * | 2008-10-31 | 2010-05-13 | Dainippon Printing Co Ltd | 表示付きカード |
| EP2390824A1 (fr) * | 2010-05-27 | 2011-11-30 | Gemalto SA | Procédé de réalisation d'un module multifonctionnel et dispositif le comprenant |
| EP2426627B1 (fr) * | 2010-09-02 | 2016-10-12 | Oberthur Technologies | Module lumineux pour dispositif à microcircuit |
| FR2997535B1 (fr) * | 2012-10-30 | 2016-07-08 | Oberthur Technologies | Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue |
| DE102013102003A1 (de) * | 2013-02-28 | 2014-08-28 | Bundesdruckerei Gmbh | Chipkarte mit integrierten aktiven Komponenten |
| DE102013105575A1 (de) * | 2013-05-30 | 2014-12-04 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
| US9793599B2 (en) * | 2015-03-06 | 2017-10-17 | Apple Inc. | Portable electronic device with antenna |
| EP3166143A1 (fr) * | 2015-11-05 | 2017-05-10 | Gemalto Sa | Procede de fabrication d'un dispositif a puce de circuit integre par depot direct de matiere conductrice |
| EP3168787A1 (en) * | 2015-11-11 | 2017-05-17 | Mastercard International Incorporated | Integrated circuit card |
| EP3182336A1 (fr) * | 2015-12-14 | 2017-06-21 | Gemalto Sa | Dispositif radiofrequence a circuit lc ajustable comprenant un module electrique et/ou electronique |
| GB2548639A (en) * | 2016-03-24 | 2017-09-27 | Zwipe As | Method of manufacturing a smartcard |
| FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
| US10268942B2 (en) * | 2017-07-10 | 2019-04-23 | Cyril Lalo | Packaged electronic module and manufacturing method thereof |
-
2020
- 2020-03-11 BR BR112021017785A patent/BR112021017785A2/pt not_active Application Discontinuation
- 2020-03-11 CN CN202080020267.0A patent/CN114175258A/zh active Pending
- 2020-03-11 MX MX2021010237A patent/MX2021010237A/es unknown
- 2020-03-11 JP JP2021555069A patent/JP7644976B2/ja active Active
- 2020-03-11 AU AU2020380119A patent/AU2020380119B2/en active Active
- 2020-03-11 KR KR1020217029208A patent/KR20210134665A/ko not_active Withdrawn
- 2020-03-11 WO PCT/US2020/022198 patent/WO2021091587A2/en not_active Ceased
- 2020-03-11 SG SG11202109820R patent/SG11202109820RA/en unknown
- 2020-03-11 IL IL286170A patent/IL286170B2/en unknown
- 2020-03-11 MA MA055326A patent/MA55326A/fr unknown
- 2020-03-11 EP EP20885861.3A patent/EP3939084A4/en active Pending
- 2020-03-11 CA CA3132334A patent/CA3132334A1/en active Pending
-
2021
- 2021-08-24 ZA ZA2021/06107A patent/ZA202106107B/en unknown
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