JP2022515673A - 電子機器ケース及びその製造方法、並びに電子機器 - Google Patents
電子機器ケース及びその製造方法、並びに電子機器 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 77
- 239000010980 sapphire Substances 0.000 claims abstract description 67
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims description 77
- 238000004140 cleaning Methods 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 29
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 239000012459 cleaning agent Substances 0.000 claims description 16
- 239000003995 emulsifying agent Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 9
- 239000011261 inert gas Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 238000002834 transmittance Methods 0.000 claims description 9
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 6
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 6
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 claims description 6
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 239000000920 calcium hydroxide Substances 0.000 claims description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 3
- 239000003599 detergent Substances 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 11
- 230000000007 visual effect Effects 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000005385 borate glass Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 description 1
- 229940043264 dodecyl sulfate Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
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- C—CHEMISTRY; METALLURGY
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3888—Arrangements for carrying or protecting transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
- H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/31—Pre-treatment
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9646—Optical properties
- C04B2235/9653—Translucent or transparent ceramics other than alumina
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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Abstract
Description
本開示は、2018年12月29日に提出された中国特許出願第201811642127.8号に基づくものであり、かつその優先権を主張するものであり、その全ての内容は参照により本開示に組み込まれるものとする。
本実施例では、中枠ブランクは、高アルミナガラス板材を採用し、底板は、サファイアを採用する。
本実施例では、底板はガラスを採用し、中枠はサファイアを採用する。
本実施例では、底板はサファイアを採用し、中枠ブランクは高アルミナガラス板材を採用し、カメラの環状ボス及び頂部レンズはガラス材質を採用する。
本実施例では、底板ブランクは高アルミナガラス板材を採用し、中枠はサファイアを採用し、カメラの環状ボスはサファイアを採用し、頂部レンズはガラス材質を採用する。
本比較例では、中枠ブランクは高アルミナガラス板材を採用し、底板はサファイアを採用する。
比較例では、中枠ブランクはサファイアを採用し、底板はガラスを採用する。
本比較例では、底板はサファイアを採用し、中枠はガラスを採用し、カメラの環状ボス及び頂部レンズはガラス材質を採用する。
本比較例では、底板ブランクは高アルミナガラス板材を採用し、中枠はサファイアを採用し、カメラの環状ボスはサファイアを採用し、頂部レンズはガラス材質を採用する。
実施例1の方法に従ってケースを製造し、相違点は、PVBフィルムにより中枠と底板を接着することである。具体的なステップは以下のとおりである。
実施例1~4及び比較例1~5で製造されたケースの性能を試験する。光透過率計の方法に従って光透過率を試験し、光沢計の拡散反射計算法に従って散乱光の百分率を試験し、4点曲げ法に従って曲げ強度を試験し、結果を表1に示す。
Claims (12)
- 底板及び中枠を含み、前記中枠が前記底板に接続され、前記中枠の材質がガラスで、前記底板の材質がサファイアであり、又は、前記底板の材質がガラスで、前記中枠の材質がサファイアであり、前記底板と前記中枠との間が界面なく連続して接続される、
電子機器ケース。 - 前記底板は、溶接の方式により前記中枠に接続される、
請求項1に記載の電子機器ケース。 - 前記底板と前記中枠との間の結合強度は、前記底板の引張強度と前記中枠の引張強度のうちの低い方以上であり、
前記ケースの光透過率は80%以上である、
請求項1又は2に記載の電子機器ケース。 - 前記底板には、カメラ穴が形成され、かつカメラレンズが取り付けられ、前記カメラレンズと前記カメラ穴との間が環状ボスにより接続され、前記環状ボスの材質はサファイア又はガラスである、
請求項1~3のいずれか一項に記載の電子機器ケース。 - 前記カメラレンズの縁部と前記環状ボスとの間が界面なく連続して接続され、
前記環状ボスと前記カメラレンズとの間の結合強度は、前記環状ボスの引張強度と前記カメラレンズの引張強度のうちの低い方以上であることを特徴とする、請求項4に記載の電子機器ケース。 - 溶接対象の部品に表面洗浄処理を行って、表面洗浄処理後の部品を得るステップと、
前記表面洗浄処理後の部品に、予備加圧処理を行い、さらに溶接することにより、溶接対象の部品間を界面なく連続して接続するステップと
を含み、
前記溶接対象の部品は、少なくとも中枠及び底板を含み、前記中枠の材質がガラスで、前記底板の材質がサファイアであり、又は、前記底板の材質がガラスで、前記中枠の材質がサファイアである、
電子機器ケースの製造方法。 - 前記溶接対象の部品は、少なくともカメラレンズ及び環状ボスをさらに含む、
請求項6に記載の方法。 - 前記カメラレンズを前記環状ボスに溶接して、カメラ構造を得るステップと、
次に、前記カメラ構造と前記底板を溶接することにより、前記カメラ構造を前記底板に形成されたカメラ穴に結合するステップと、をさらに含み、
前記環状ボスの材質はサファイア又はガラスである、
請求項7に記載の方法。 - 前記表面洗浄処理は、前記溶接対象の部品をそれぞれ洗浄剤で洗浄した後に純水で洗浄するステップを含み、
好ましくは、前記洗浄剤は、界面活性剤、乳化剤及び強塩基を含有し、前記界面活性剤は、ドデシルベンゼンスルホン酸ナトリウム、ドデシルスルホン酸ナトリウム及びドデシル硫酸ナトリウムのうちの少なくとも一種を含み、前記乳化剤はトリエタノールアミンを含み、前記強塩基は、水酸化ナトリウム、水酸化カリウム及び水酸化カルシウムのうちの少なくとも一種を含み、前記界面活性剤、乳化剤と強塩基の重量比は1:(0.2~2):(0.5~5)である、
請求項6-8のいずれか一項に記載の方法。 - 前記予備加圧処理は第1の加熱板及び第2の加熱板を有する加圧機器において行われ、前記第1の加熱板は、ガラス材質の前記溶接対象の部品と接触することができ、前記第2の加熱板は、サファイア材質の前記溶接対象の部品と接触することができ、前記第1の加熱板の温度は前記第2の加熱板の温度より高く、好ましくは、前記第1の加熱板の温度は前記第2の加熱板の温度より50~100℃高く、前記加圧機器内に不活性ガスが充填され、前記予備加圧処理は、順に、
圧力が0.4~0.6MPa、時間が0.5~2h、前記第1の加熱板の温度が200℃以下、前記第2の加熱板の温度が100℃以下である第1の段階と、
圧力が0.8~1.2MPa、時間が0.5~2h、前記第1の加熱板の温度が300℃以下、前記第2の加熱板の温度が200℃以下である第2の段階と、
圧力が1.4~1.6MPa、時間が0.5~2h、前記第1の加熱板の温度が400℃以下、前記第2の加熱板の温度が300℃以下である第3の段階と、
を含む、
請求項6~9のいずれか一項に記載の方法。 - 前記溶接の条件は、400~800℃の温度、0~5MPaの圧力、6~12hの時間を含む、
請求項6~10のいずれか一項に記載の方法。 - 請求項6~11のいずれか一項に記載の方法により製造された電子機器ケース。
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