JP2022505321A5 - - Google Patents

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Publication number
JP2022505321A5
JP2022505321A5 JP2021521294A JP2021521294A JP2022505321A5 JP 2022505321 A5 JP2022505321 A5 JP 2022505321A5 JP 2021521294 A JP2021521294 A JP 2021521294A JP 2021521294 A JP2021521294 A JP 2021521294A JP 2022505321 A5 JP2022505321 A5 JP 2022505321A5
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JP
Japan
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JP2021521294A
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Japanese (ja)
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JP2022505321A (ja
JP7488815B2 (ja
JPWO2020081397A5 (https=
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Priority claimed from PCT/US2019/055920 external-priority patent/WO2020081397A1/en
Publication of JP2022505321A publication Critical patent/JP2022505321A/ja
Publication of JP2022505321A5 publication Critical patent/JP2022505321A5/ja
Publication of JPWO2020081397A5 publication Critical patent/JPWO2020081397A5/ja
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JP2021521294A 2018-10-19 2019-10-11 窒化ケイ素膜を堆積させる方法 Active JP7488815B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862748085P 2018-10-19 2018-10-19
US62/748,085 2018-10-19
PCT/US2019/055920 WO2020081397A1 (en) 2018-10-19 2019-10-11 Method of depositing silicon nitride films

Publications (4)

Publication Number Publication Date
JP2022505321A JP2022505321A (ja) 2022-01-14
JP2022505321A5 true JP2022505321A5 (https=) 2024-01-25
JPWO2020081397A5 JPWO2020081397A5 (https=) 2024-01-25
JP7488815B2 JP7488815B2 (ja) 2024-05-22

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ID=70284713

Family Applications (1)

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JP2021521294A Active JP7488815B2 (ja) 2018-10-19 2019-10-11 窒化ケイ素膜を堆積させる方法

Country Status (6)

Country Link
US (1) US12230495B2 (https=)
JP (1) JP7488815B2 (https=)
KR (1) KR102751446B1 (https=)
CN (1) CN112930581B (https=)
TW (1) TWI857979B (https=)
WO (1) WO2020081397A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250009119A (ko) * 2023-07-10 2025-01-17 한화정밀기계 주식회사 기판 처리 장치 및 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4669679B2 (ja) * 2004-07-29 2011-04-13 東京エレクトロン株式会社 窒化珪素膜の製造方法及び半導体装置の製造方法
JP4607637B2 (ja) * 2005-03-28 2011-01-05 東京エレクトロン株式会社 シリコン窒化膜の形成方法、シリコン窒化膜の形成装置及びプログラム
US8728955B2 (en) * 2012-02-14 2014-05-20 Novellus Systems, Inc. Method of plasma activated deposition of a conformal film on a substrate surface
US9343317B2 (en) * 2013-07-01 2016-05-17 Micron Technology, Inc. Methods of forming silicon-containing dielectric materials and semiconductor device structures
US9576792B2 (en) * 2014-09-17 2017-02-21 Asm Ip Holding B.V. Deposition of SiN
US9589790B2 (en) 2014-11-24 2017-03-07 Lam Research Corporation Method of depositing ammonia free and chlorine free conformal silicon nitride film
US10410857B2 (en) * 2015-08-24 2019-09-10 Asm Ip Holding B.V. Formation of SiN thin films
KR102146542B1 (ko) 2015-09-30 2020-08-20 주식회사 원익아이피에스 질화막의 제조방법
CN110178201B (zh) * 2017-01-13 2023-06-16 应用材料公司 用于低温氮化硅膜的方法及设备
US10043656B1 (en) * 2017-03-10 2018-08-07 Lam Research Corporation Selective growth of silicon oxide or silicon nitride on silicon surfaces in the presence of silicon oxide
US9984869B1 (en) * 2017-04-17 2018-05-29 Asm Ip Holding B.V. Method of plasma-assisted cyclic deposition using ramp-down flow of reactant gas

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