JP2022181817A5 - - Google Patents

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Publication number
JP2022181817A5
JP2022181817A5 JP2021088988A JP2021088988A JP2022181817A5 JP 2022181817 A5 JP2022181817 A5 JP 2022181817A5 JP 2021088988 A JP2021088988 A JP 2021088988A JP 2021088988 A JP2021088988 A JP 2021088988A JP 2022181817 A5 JP2022181817 A5 JP 2022181817A5
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JP
Japan
Prior art keywords
wiring
substrate
semiconductor element
metal
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021088988A
Other languages
English (en)
Japanese (ja)
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JP7512954B2 (ja
JP2022181817A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2021088988A priority Critical patent/JP7512954B2/ja
Priority claimed from JP2021088988A external-priority patent/JP7512954B2/ja
Priority to PCT/JP2022/018368 priority patent/WO2022249808A1/ja
Priority to CN202280037247.3A priority patent/CN117337491A/zh
Publication of JP2022181817A publication Critical patent/JP2022181817A/ja
Publication of JP2022181817A5 publication Critical patent/JP2022181817A5/ja
Priority to US18/504,296 priority patent/US20240079292A1/en
Application granted granted Critical
Publication of JP7512954B2 publication Critical patent/JP7512954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021088988A 2021-05-27 2021-05-27 半導体装置 Active JP7512954B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021088988A JP7512954B2 (ja) 2021-05-27 2021-05-27 半導体装置
PCT/JP2022/018368 WO2022249808A1 (ja) 2021-05-27 2022-04-21 半導体装置
CN202280037247.3A CN117337491A (zh) 2021-05-27 2022-04-21 半导体装置
US18/504,296 US20240079292A1 (en) 2021-05-27 2023-11-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021088988A JP7512954B2 (ja) 2021-05-27 2021-05-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2022181817A JP2022181817A (ja) 2022-12-08
JP2022181817A5 true JP2022181817A5 (enExample) 2023-03-29
JP7512954B2 JP7512954B2 (ja) 2024-07-09

Family

ID=84228796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021088988A Active JP7512954B2 (ja) 2021-05-27 2021-05-27 半導体装置

Country Status (4)

Country Link
US (1) US20240079292A1 (enExample)
JP (1) JP7512954B2 (enExample)
CN (1) CN117337491A (enExample)
WO (1) WO2022249808A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
WO2023190662A1 (ja) * 2022-04-01 2023-10-05 日東電工株式会社 積層体、放熱基板および積層体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094824A (ja) * 2011-11-01 2013-05-20 Aisin Aw Co Ltd 半導体装置
EP3226292B1 (en) 2014-11-27 2019-05-29 Shindengen Electric Manufacturing Co., Ltd. Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device
JP2017159335A (ja) 2016-03-10 2017-09-14 株式会社デンソー 半導体装置及びその製造方法
WO2021049039A1 (ja) 2019-09-13 2021-03-18 株式会社デンソー 半導体装置

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