JP2022180205A - Substrate holder, substrate holding device, film forming system, and electronic device manufacturing method - Google Patents

Substrate holder, substrate holding device, film forming system, and electronic device manufacturing method Download PDF

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JP2022180205A
JP2022180205A JP2021087171A JP2021087171A JP2022180205A JP 2022180205 A JP2022180205 A JP 2022180205A JP 2021087171 A JP2021087171 A JP 2021087171A JP 2021087171 A JP2021087171 A JP 2021087171A JP 2022180205 A JP2022180205 A JP 2022180205A
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substrate
adhesive
substrate holder
peeling
adhesive portion
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健人 津田
Kento Tsuda
正明 高橋
Masaaki Takahashi
由高 荒井
Yoshitaka Arai
秀彦 藤村
Hidehiko Fujimura
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2021087171A priority Critical patent/JP2022180205A/en
Priority to KR1020220060119A priority patent/KR20220158624A/en
Priority to CN202210558251.6A priority patent/CN115394702A/en
Publication of JP2022180205A publication Critical patent/JP2022180205A/en
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H01L21/67343—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates characterized by a material, a roughness, a coating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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Abstract

To provide a substrate holder, a substrate holding device, a film forming system, and an electronic device manufacturing method that can easily separate a substrate from an adhesive section while suppressing a decrease in the holding force of the substrate.SOLUTION: A holder 120 includes an adhesive section 121 that includes an adhesive surface 121a that sticks to a substrate 10 and an opposite surface 121b on the opposite side of the adhesive surface and has flexibility and an adhesive holder 120 being a separation section for separating the substrate from the adhesive section. The separation section presses a plurality of positions of the adhesive section from the side of the opposite surface. Thereby, the substrate can be easily separated from the adhesive section while suppressing a decrease in the holding force of the substrate.SELECTED DRAWING: Figure 4

Description

本発明は、基板保持具、基板保持装置、成膜システム、及び電子デバイスの製造方法に関する。 The present invention relates to a substrate holder, a substrate holding apparatus, a film forming system, and an electronic device manufacturing method.

近年、ＦＰＤ(Flat Panel Display)産業においては、ＬＣＤ(Liquid Crystal Display)、ＰＤＰ(Plasma Display Panel)、有機ＥＬ(OEL, Organic Electro Luminescence)などにみられるように、大画面化の傾向が著しく、大型基板の搬送工程など、大型基板のハンドリングが技術課題となっている。基板に対する成膜等の各種処理は、基板キャリア等の基板保持部材により基板を保持した状態で行われる。基板保持部材による基板の保持の一例として、粘着パッド等の粘着部材の粘着力により基板を保持することが挙げられる。特許文献１には、基板保持部材に設けられた粘着パッドによって基板が保持され、保持された基板が基板保持部材ごと搬送され、成膜等の各種処理が行われ後に基板から粘着パッドが剥離されることが開示されている。また、特許文献1に開示されている粘着パッドは、基板の剥離を容易にするため、基板との接触面の中央部に非粘着領域が設けられている。すなわち、その非粘着領域が基板と接触する側と反対側から押圧されることで、基板を粘着パッドから容易に剥離させることができる。 In recent years, in the FPD (Flat Panel Display) industry, there has been a marked trend toward larger screens as seen in LCD (Liquid Crystal Display), PDP (Plasma Display Panel), organic EL (OEL, Organic Electro Luminescence), and the like. The handling of large substrates, such as the process of transporting large substrates, is a technical issue. Various processes such as film formation on a substrate are performed while the substrate is held by a substrate holding member such as a substrate carrier. As an example of holding the substrate by the substrate holding member, holding the substrate by the adhesive force of an adhesive member such as an adhesive pad can be cited. In Patent Document 1, a substrate is held by an adhesive pad provided on a substrate holding member, the held substrate is transported together with the substrate holding member, various processes such as film formation are performed, and then the adhesive pad is peeled off from the substrate. It is disclosed that Further, the adhesive pad disclosed in Patent Document 1 is provided with a non-adhesive area in the central portion of the contact surface with the substrate in order to facilitate the peeling of the substrate. That is, the substrate can be easily peeled off from the adhesive pad by pressing the non-adhesive region from the side opposite to the side in contact with the substrate.

特開２００５－２８６１１４JP 2005-286114

しかしながら、上記従来技術では、粘着パッドの中央部に非粘着部が設けられるため、基板との接触面の全面が基板に粘着する粘着領域である場合と比べ、基板の保持力が低下してしまう場合がある。 However, in the conventional technology described above, since the non-adhesive portion is provided in the central portion of the adhesive pad, the holding force of the substrate is reduced compared to the case where the entire surface of the contact surface with the substrate is the adhesive area that adheres to the substrate. Sometimes.

本発明は、基板の保持力の低下を抑制しつつ、基板を粘着部から剥離しやすくする技術を提供する。 The present invention provides a technique that makes it easier to separate a substrate from an adhesive portion while suppressing a decrease in the holding force of the substrate.

本発明によれば、
基板に貼り付く粘着面及び前記粘着面の反対側にある反対面を含み、可撓性を有する粘着部と、
基板を前記粘着部から剥離するための剥離部と、を備えた基板保持具であって、
前記剥離部は、前記粘着部の複数の位置を前記反対面の側から押圧する、
ことを特徴とする基板保持具が提供される。 According to the invention,
a flexible adhesive part including an adhesive surface that sticks to a substrate and an opposite surface on the opposite side of the adhesive surface;
A substrate holder comprising a peeling portion for peeling the substrate from the adhesive portion,
The peeling section presses a plurality of positions of the adhesive section from the opposite surface side,
There is provided a substrate holder characterized by:

本発明によれば、基板の保持力の低下を抑制しつつ、基板を粘着部から剥離しやすくすることができる。 ADVANTAGE OF THE INVENTION According to this invention, a board|substrate can be made easy to peel from an adhesion part, suppressing the fall of the holding force of a board|substrate.

一実施形態に係る基板キャリアの平面図。1 is a plan view of a substrate carrier according to one embodiment; FIG. 図１のＡ－Ａ‘線断面図。AA' line cross-sectional view of FIG. 図１のＢ－Ｂ‘線断面図である。2 is a cross-sectional view taken along line BB' of FIG. 1; FIG. （Ａ）～（Ｃ）は保持具の構成を示す図。(A) to (C) are diagrams showing the configuration of a holder. （Ａ）～（Ｃ）は保持具の構成を示す図。(A) to (C) are diagrams showing the configuration of a holder. （Ａ）～（Ｃ）は保持具の構成を示す図。(A) to (C) are diagrams showing the configuration of a holder. 球形部材が粘着部に対して加える力の方向を模式的に示す図。The figure which shows typically the direction of the force which a spherical member applies with respect to an adhesion part. 基板キャリアを用いて成膜処理を行う成膜システムの構成例を示す図。FIG. 2 is a diagram showing a configuration example of a film formation system that performs film formation processing using a substrate carrier; （Ａ）及び（Ｂ）は、成膜システムによる成膜処理の各工程を示すフローチャート。4A and 4B are flowcharts showing each step of film formation processing by the film formation system; 基板保持室の構成及び動作を模式的に示す図。4A and 4B are diagrams schematically showing the configuration and operation of a substrate holding chamber; FIG. 基板保持室の動作説明図である。FIG. 10 is an operation explanatory diagram of the substrate holding chamber; 基板保持室の動作説明図である。FIG. 10 is an operation explanatory diagram of the substrate holding chamber; 基板保持室の動作説明図である。FIG. 10 is an operation explanatory diagram of the substrate holding chamber; （Ａ）及び（Ｂ）は、反転室の構成及び動作を模式的に示す図。(A) and (B) are diagrams schematically showing the configuration and operation of an inversion chamber. 成膜室の構成を模式的に示す図。The figure which shows the structure of a film-forming chamber typically. 基板剥離室の構成及び動作を模式的に示す図。4A and 4B are diagrams schematically showing the configuration and operation of a substrate peeling chamber; FIG. （Ａ）は有機ＥＬ表示装置の全体図、（Ｂ）は１画素の断面構造を示す図。1A is an overall view of an organic EL display device, and FIG. 1B is a view showing a cross-sectional structure of one pixel; FIG.

以下、添付図面を参照して実施形態を詳しく説明する。なお、以下の実施形態は特許請求の範囲に係る発明を限定するものではなく、また実施形態で説明されている特徴の組み合わせの全てが発明に必須のものとは限らない。実施形態で説明されている複数の特徴のうち二つ以上の特徴が任意に組み合わされてもよい。また、同一若しくは同様の構成には同一の参照番号を付し、重複した説明は省略する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the invention according to the claims, and not all combinations of features described in the embodiments are essential to the invention. Two or more of the features described in the embodiments may be combined arbitrarily. Also, the same or similar configurations are denoted by the same reference numerals, and redundant explanations are omitted.

また、各図において、ＸＹ方向は平面方向を、Ｚ方向は鉛直方向をそれぞれ示すものとする。また、図面の見易さ等を考慮して、図中に複数示されている構成要素の一部について参照符号の付与を省略する場合がある。 In each figure, the XY direction indicates the planar direction, and the Z direction indicates the vertical direction. Also, in consideration of the visibility of the drawings, the reference numerals may be omitted for some of the constituent elements shown in the drawings.

＜基板キャリア１００＞
図１は、一実施形態に係る基板キャリア１００の平面図である。図２は、図１のＡ－Ａ‘線断面図である。説明の便宜上、特徴的な構成を強調して示すために、図１の縮尺は実際とは異なる場合がある。また図１及び図２では、配置関係を分かりやすくするために、一部の構成要素が破線で示されている。 <Substrate carrier 100>
FIG. 1 is a plan view of a substrate carrier 100 according to one embodiment. FIG. 2 is a cross-sectional view taken along line AA' of FIG. For convenience of explanation, the scale of FIG. 1 may be different from the actual scale in order to emphasize the characteristic configuration. In addition, in FIGS. 1 and 2, some components are indicated by dashed lines in order to make the arrangement relationship easier to understand.

基板キャリア１００は、基板１０を保持する基板保持装置の一例である。基板キャリア１００は、平板状部材１１０と、枠体１１５（図３参照）と、粘着式保持具１２０（以下、保持具１２０）と、支持具１３０と、を含む。 Substrate carrier 100 is an example of a substrate holding device that holds substrate 10 . The substrate carrier 100 includes a flat member 110 , a frame 115 (see FIG. 3), an adhesive holder 120 (hereinafter referred to as holder 120 ), and a support 130 .

平板状部材１１０は、基板キャリア１００が基板１０を保持する際に基板１０と接する面である保持面１１０Ｘを有する。平板状部材１１０には、複数の貫通孔１１１及び複数の貫通孔１１２がそれぞれ設けられている。貫通孔１１１は、保持面１１０Ｘに載置されている基板１０を持ち上げるためのピン２４０が通過するための孔である。図２に示すように、ピン２４０が貫通孔１１１を介して基板キャリア１００の下方から保持面１１０Ｘ側へと突出することで、基板１０が保持面１１０Ｘから持ち上げられる。貫通孔１１２は、保持具１２０を設置するための孔である。詳細には後述する。 The flat member 110 has a holding surface 110X, which is the surface that contacts the substrate 10 when the substrate carrier 100 holds the substrate 10 . A plurality of through-holes 111 and a plurality of through-holes 112 are provided in the flat plate member 110 . The through holes 111 are holes through which the pins 240 for lifting the substrate 10 placed on the holding surface 110X pass. As shown in FIG. 2, the pins 240 project through the through holes 111 from below the substrate carrier 100 toward the holding surface 110X, thereby lifting the substrate 10 from the holding surface 110X. Through hole 112 is a hole for installing holder 120 . Details will be described later.

枠体１１５は、平板状部材１１０を支持する部材である。枠体１１５は、平板状部材１１０の外周に沿って設けられる。保持具１２０は、複数の貫通孔１１２に対応して複数設けられており、粘着力により基板１０に貼り付いて基板１０を保持する。支持具１３０は、基板１０の周囲を支持するものであり、本実施形態では平板状部材１１０の短辺に各１つ、長辺に各２つ、それぞれ設けられている。支持具１３０としては、一般的なクランプなど公知の技術を採用することができる。すなわち、基板１０は、複数配置した保持具１２０及び支持具１３０で保持面１１０Ｘに支持固定され、基板キャリア１００と一体化して搬送される。 The frame 115 is a member that supports the flat member 110 . The frame 115 is provided along the outer circumference of the flat plate-like member 110 . A plurality of holders 120 are provided corresponding to the plurality of through holes 112 , and adhere to the substrate 10 by adhesive force to hold the substrate 10 . The supports 130 support the periphery of the substrate 10, and in this embodiment, one support is provided on each of the short sides of the flat plate-like member 110 and two on each of the long sides thereof. As the support 130, a known technique such as a general clamp can be adopted. That is, the substrate 10 is supported and fixed on the holding surface 110X by the plurality of holders 120 and supports 130 arranged, and transported integrally with the substrate carrier 100 .

なお、平板状部材１１０の形状及び寸法については基板１０の寸法、及び面取りする単品サイズの寸法（成膜領域）に応じて適宜設定される。また貫通孔１１１～１１２、保持具１２０及び支持具１３０の寸法、個数及び配置も、基板１０の寸法、及び面取り寸法（成膜領域）に応じて適宜設定される。最終製品で画像表示領域となる領域には保持具１２０を配置せず、額縁領域にのみ配置するため、一例を挙げれば、８０インチ（９９６×１７７１ミリ）サイズを面取りする場合は、最低でも短辺の長さ以上離間して保持具１２０を配置することになり、不支持領域が大きくすることができる。 The shape and dimensions of the plate-like member 110 are appropriately set according to the dimensions of the substrate 10 and the dimensions of the single product to be chamfered (film formation area). The dimensions, number and arrangement of the through holes 111 to 112, the holder 120 and the support 130 are also appropriately set according to the dimensions of the substrate 10 and the chamfer dimensions (film formation area). The holder 120 is not arranged in the area that will be the image display area in the final product, and is arranged only in the picture frame area. By arranging the holders 120 apart by the length of the side or more, the unsupported area can be enlarged.

＜保持具１２０＞
図３は、図１のＢ－Ｂ‘線断面図である。図３は、保持具１２０の構成を模式的に示している。保持具１２０は、平板状部材１１０に形成された貫通孔１１２に、シャフト１２６及び固定部材１５０支持されることによって配置されている。保持具１２０は、弾性粘着部１２１と、接着層１２３と、金属製基材１２４と、を含む。保持具１２０は、シャフト１２６に固定された接着層１２３上に、接着層１２３を介して粘着部１２１を貼着した構成を有する。 <Holder 120>
3 is a cross-sectional view taken along line BB' of FIG. 1. FIG. FIG. 3 schematically shows the configuration of the holder 120. As shown in FIG. The holder 120 is arranged by being supported by a shaft 126 and a fixing member 150 in a through hole 112 formed in the plate-like member 110 . The holder 120 includes an elastic adhesive portion 121 , an adhesive layer 123 , and a metallic base material 124 . The holder 120 has a configuration in which the adhesive portion 121 is adhered via the adhesive layer 123 on the adhesive layer 123 fixed to the shaft 126 .

粘着部１２１は、基板１０に粘着力により貼り付く部材である。基板キャリア１００は、この粘着部１２１の粘着力によってLＣＤ、ＰＤＰ、有機ＥＬなどの平板状基板を保持可能に構成されている。例えば、粘着部１２１は、ゴム・エラストマなどの可撓性を有する、換言すれば弾性変形可能な材料であってもよい。また、粘着部１２１は、真空下での製造プロセスでのアウトガスを考慮して、シロキサン結合を含まないフッ素ゴム等であってもよい。本実施形態では、粘着部１２１は、偏平な円盤状に成型される。また、粘着部１２１は、基板１０に貼り付く粘着面１２１ａと、粘着面１２１ａに対向する反対面１２１ｂとを含む。 The adhesive portion 121 is a member that adheres to the substrate 10 with adhesive force. The substrate carrier 100 is configured to be able to hold flat substrates such as LCDs, PDPs, and organic ELs by the adhesive strength of the adhesive portion 121 . For example, the adhesive portion 121 may be made of a flexible material such as rubber or elastomer, in other words, an elastically deformable material. Further, the adhesive portion 121 may be made of fluororubber or the like that does not contain a siloxane bond in consideration of outgassing in the manufacturing process under vacuum. In this embodiment, the adhesive portion 121 is shaped like a flat disc. Moreover, the adhesive portion 121 includes an adhesive surface 121a that sticks to the substrate 10 and an opposite surface 121b that faces the adhesive surface 121a.

接着層１２３は、粘着部１２１と金属製基材１２４とを接着するための層である。接着層１２３は、エラストマＥＡ層等であってもよい。また接着層１２３は、真空下での製造プロセスに悪影響を及ぼすアウトガス成分を放出しない着剤、両面テープ等であってもよい。金属製基材１２４は、接着層１２３を介して粘着部１２１を支持する金属製の部材である。 The adhesive layer 123 is a layer for bonding the adhesive portion 121 and the metal substrate 124 together. The adhesive layer 123 may be an elastomeric EA layer or the like. Alternatively, the adhesive layer 123 may be an adhesive, a double-sided tape, or the like that does not emit outgassing components that adversely affect the manufacturing process under vacuum. The metal base material 124 is a metal member that supports the adhesive portion 121 via the adhesive layer 123 .

以下、保持具１２０の内部構造及び保持具１２０の動作について説明する。
図４（Ａ）～図４（Ｃ）は、保持具１２０の構成を示す図である。図４（Ａ）は、保持具１２０の上面図である。また、図４（Ｂ）及び図４（Ｃ）は、図４（A）Ｃ-C’線断面図である。図４（Ｂ）は、基板１０に粘着部１２１が貼り付いている状態を示しており、図４（Ｃ）は、粘着部１２１から基板１０を剥離させようとしている状態を示している。 The internal structure of the holder 120 and the operation of the holder 120 will be described below.
4A to 4C are diagrams showing the configuration of the holder 120. FIG. FIG. 4A is a top view of the holder 120. FIG. Moreover, FIG.4(B) and FIG.4(C) are FIG.4(A) CC' line sectional drawing. 4B shows a state in which the adhesive portion 121 is attached to the substrate 10, and FIG. 4C shows a state in which the substrate 10 is about to be peeled off from the adhesive portion 121. FIG.

粘着保持具１２０は、基板１０を粘着部１２１から剥離するための剥離部の一例である、押圧部１２５を含む。押圧部１２５は、金属製基材１２４に形成された貫通孔１２２に設けられており、反対面１２１ｂの側から粘着部１２１を押圧可能に構成されている。押圧部１２５は、押圧部材１２５１と、支持部１２５２と、ナット部１２５３とを含む。 The adhesive holder 120 includes a pressing portion 125 that is an example of a peeling portion for peeling the substrate 10 from the adhesive portion 121 . The pressing portion 125 is provided in the through hole 122 formed in the metal substrate 124, and is configured to be able to press the adhesive portion 121 from the opposite surface 121b side. The pressing portion 125 includes a pressing member 1251 , a support portion 1252 and a nut portion 1253 .

押圧部材１２５１は、粘着部１２１を反対面１２１ｂの側から押圧する部材である。本実施形態では、金属製基材１２４には、図４（Ａ）の方向で見て円の外周に沿って４つの貫通孔１２２が形成されている。押圧部１２５は、４つの貫通孔１２２内をそれぞれ移動可能な４つの押圧部材１２５１を有している。本実施形態では、押圧部材１２５１は円筒形状であるが、押圧部材１２５１の形状等は適宜設定可能である。また、押圧部材１２５１の数は変更可能であり、２～３つ、或いは５つ以上であってもよい。 The pressing member 1251 is a member that presses the adhesive portion 121 from the side of the opposite surface 121b. In this embodiment, four through-holes 122 are formed in the metal base 124 along the outer circumference of a circle when viewed in the direction of FIG. 4(A). The pressing portion 125 has four pressing members 1251 that can move inside the four through holes 122 respectively. In this embodiment, the pressing member 1251 has a cylindrical shape, but the shape and the like of the pressing member 1251 can be set as appropriate. Also, the number of pressing members 1251 can be changed, and may be two to three, or five or more.

支持部１２５２は、押圧部材１２５１をＺ方向に移動可能に支持する。本実施形態では、支持部１２５２は、金属製基材１２４の内部に位置する円板形状の部分を含む。そして、押圧部材１２５１の粘着部１２１を押圧する側の端部と反対側の端部が支持部１２５２の円板形状の部分に接続している。本実施形態では、複数の押圧部材１２５１が１つの支持部１２５２に接続することで、支持部１２５２を移動させることにより複数の押圧部材１２５１を同時に移動させることができる。また、支持部１２５２は、その円板形状の部分から、押圧部材１２５１が接続する側と反対側に延びる円筒形状の部分を含む。この円筒形状の部分にナット部１２５３が接続している。 The support portion 1252 supports the pressing member 1251 so as to be movable in the Z direction. In this embodiment, support 1252 includes a disc-shaped portion located inside metal substrate 124 . The end of the pressing member 1251 on the side that presses the adhesive portion 121 and the end on the opposite side are connected to the disk-shaped portion of the supporting portion 1252 . In this embodiment, by connecting a plurality of pressing members 1251 to one supporting portion 1252 , the pressing members 1251 can be simultaneously moved by moving the supporting portion 1252 . Further, the support portion 1252 includes a cylindrical portion extending from the disk-shaped portion to the side opposite to the side to which the pressing member 1251 is connected. A nut portion 1253 is connected to this cylindrical portion.

また、図４（Ｂ）には、押圧部１２５を粘着部１２１に対して接離可能に変位させる変位部の一例であるアクチュエータ１２７が示されている。アクチュエータ１２７は例えば電動モータである。アクチュエータ１２７には押圧部１２５のナット部１２５３と螺合するネジ軸１２７１が設けられている。アクチュエータ１２７が駆動すると、ネジ軸１２７１及びナット部１２５３によりアクチュエータ１２７の回転が直線運動に変換されることで、押圧部材１２５１がＺ方向に昇降する。すなわち、アクチュエータ１２７は、複数の粘着部１２１５を同時に粘着部１２１に対して接離方向に変位させることができる。なお、アクチュエータ１２７の制御は、制御ライン１２９を介して行われる。 Further, FIG. 4B shows an actuator 127 which is an example of a displacement portion that displaces the pressing portion 125 so as to be able to contact and separate from the adhesive portion 121 . Actuator 127 is, for example, an electric motor. The actuator 127 is provided with a screw shaft 1271 that is screwed with the nut portion 1253 of the pressing portion 125 . When the actuator 127 is driven, the rotation of the actuator 127 is converted into linear motion by the screw shaft 1271 and the nut portion 1253, so that the pressing member 1251 moves up and down in the Z direction. That is, the actuator 127 can simultaneously displace the plurality of adhesive portions 1215 in the direction of contact and separation with respect to the adhesive portion 121 . The actuator 127 is controlled via a control line 129. FIG.

次に、押圧部１２５を用いた、粘着部１２１から基板１０を剥離するための動作を説明する。図４（Ｂ）で示すように、基板１０に粘着部１２１が貼り付いた状態においては、押圧部１２５は、金属製基材１２４内を降下して押圧部材１２５１が粘着部１２１から離間して位置する。これにより粘着部１２１は、本来の平面形状で基板１０と面接触することができるので、最大の接触面積で基板１０と接触することができる。すなわち、粘着部１２１は相対的に大きな粘着力で基板１０に貼り付くことができる。 Next, an operation for peeling the substrate 10 from the adhesive portion 121 using the pressing portion 125 will be described. As shown in FIG. 4B, in the state where the adhesive portion 121 is attached to the substrate 10, the pressing portion 125 descends inside the metal substrate 124 and the pressing member 1251 is separated from the adhesive portion 121. To position. As a result, the adhesive portion 121 can come into surface contact with the substrate 10 in its original planar shape, so that the adhesive portion 121 can come into contact with the substrate 10 with the maximum contact area. That is, the adhesive portion 121 can be attached to the substrate 10 with a relatively large adhesive strength.

一方で、図４（Ｃ）で示すように、基板１０を粘着部１２１から剥離させる際には、アクチュエータ１２７が押圧部１２５を上昇させることで、複数の押圧部材１２５１が粘着部１２１を反対面１２１ｂ側から押圧する。粘着部１２１が反対面１２１ｂから押圧されることで、粘着面１２１ａに凸形状の変形が形成される。これにより、粘着部１２１の基板１０に対する粘着力が相対的に低くなるので、基板１０の剥離が容易となる。例えば、図４（Ｃ）で示す状態で、ピン２４０により基板１０を図の下方から上方へと持ち上げることにより（図２参照）、基板１０が粘着部１２１から剥離する。 On the other hand, as shown in FIG. 4C, when the substrate 10 is peeled off from the adhesive portion 121, the actuator 127 lifts the pressing portion 125 so that the plurality of pressing members 1251 push the adhesive portion 121 on the opposite side. 121b side is pressed. When the adhesive portion 121 is pressed from the opposite surface 121b, the adhesive surface 121a is deformed into a convex shape. As a result, the adhesive strength of the adhesive portion 121 to the substrate 10 is relatively low, so that the substrate 10 can be easily peeled off. For example, in the state shown in FIG. 4C, the substrate 10 is peeled off from the adhesive portion 121 by lifting the substrate 10 from the bottom to the top of the drawing with the pins 240 (see FIG. 2).

本実施形態によれば、基板１０の粘着部１２１からの剥離が、粘着部１２１の基板１０に対する粘着力が相対的に低い状態で行われる。よって、基板１０を粘着部１２１から剥離しやすくすることができる。また、粘着力が相対的に低い状態で剥離動作が行われるので、剥離動作において基板１０に生じる応力を低減でき、基板１０に亀裂が発生することを抑制することができる。また、本実施形態では、保持具１２０と基板１０とが接触する面の全体が粘着部１２１で構成される。すなわち、保持具１２０と基板１０との接触面に非粘着領域が設けられないので、例えば基板１０を剥離しやすくするために接触面の一部を非粘着領域とする構成のように粘着部１２１の粘着力が低下することがない。したがって、保持具１２０による基板１０の保持力の低下を抑制しつつ、基板１０を粘着部１２１から剥離しやすくすることができる。 According to the present embodiment, the substrate 10 is separated from the adhesive portion 121 in a state in which the adhesive force of the adhesive portion 121 to the substrate 10 is relatively low. Therefore, the substrate 10 can be easily separated from the adhesive portion 121 . In addition, since the peeling operation is performed in a state in which the adhesive force is relatively low, the stress generated in the substrate 10 during the peeling operation can be reduced, and the occurrence of cracks in the substrate 10 can be suppressed. Further, in the present embodiment, the entire contact surface between the holder 120 and the substrate 10 is composed of the adhesive portion 121 . That is, since a non-adhesive area is not provided on the contact surface between the holder 120 and the substrate 10, the adhesive portion 121 may be configured such that a part of the contact surface is a non-adhesive area in order to facilitate the peeling of the substrate 10, for example. The adhesive strength of the adhesive does not decrease. Therefore, it is possible to easily separate the substrate 10 from the adhesive portion 121 while suppressing a decrease in the holding force of the substrate 10 by the holder 120 .

また、本実施形態では、押圧部１２５は、複数の押圧部材１２５１により、粘着部１２１の複数の位置を反対面１２１ｂの側から押圧する。これにより、粘着部１２１の変形が複数箇所で生じるので、より基板１０を粘着部１２１から剥離しやすくすることができる。 Further, in this embodiment, the pressing portion 125 presses a plurality of positions of the adhesive portion 121 from the side of the opposite surface 121b with a plurality of pressing members 1251 . As a result, the adhesive portion 121 is deformed at a plurality of locations, so that the substrate 10 can be more easily separated from the adhesive portion 121 .

また、保持具１２０は、保持面１１０Ｘからの突出量を管理できるよう一定の範囲内で上下に移動可能に構成されてもよい。 Moreover, the holder 120 may be configured to be vertically movable within a certain range so that the amount of protrusion from the holding surface 110X can be managed.

＜保持具１２０の変形例１＞
次に、保持具１２０の変形例について説明する。図５（Ａ）～図５（Ｃ）は、保持具１２０の変形例としての保持具１２０１を示す図である。図５（Ａ）は、一実施形態に係る保持具１２０１の上面図である。また、図５（Ｂ）及び図５（Ｃ）は、図５（Ａ）のＤ-Ｄ’線断面図である。図５（Ｂ）は、基板１０に粘着部１２１が貼り付いている状態を示しており、図５（Ｃ）は、粘着部１２１から基板１０を剥離させようとしている状態を示している。以下、図４の保持具１２０の各構成と同様の構成については同様の符号を付して説明を省略する。 <Modification 1 of holder 120>
Next, modified examples of the holder 120 will be described. 5A to 5C are diagrams showing a holder 1201 as a modified example of the holder 120. FIG. FIG. 5A is a top view of a retainer 1201 according to one embodiment. Moreover, FIG.5(B) and FIG.5(C) are DD' line sectional views of FIG.5(A). 5B shows a state in which the adhesive portion 121 is attached to the substrate 10, and FIG. 5C shows a state in which the substrate 10 is about to be peeled off from the adhesive portion 121. FIG. Hereinafter, configurations similar to those of the holder 120 shown in FIG. 4 are denoted by similar reference numerals, and description thereof is omitted.

図５の保持具１２０１は、図４の保持具１２０が粘着部１２１の周囲4箇所を押圧可能であるのに対し、粘着部１２１の周囲４箇所に加えて粘着部１２１の中央部も押圧可能な点で、図４の保持具１２０と異なる。具体的には、保持具１２０１は、粘着部１２１の周囲を押圧する４つの押圧部材１２５１に加えて、粘着部１２１の中央部を押圧する押圧部材１２５１ａを有する。なお、金属製基材１２４の中央部には、押圧部材１２５１ａに対応する貫通孔１２２ａが設けられている。 While the holder 120 in FIG. 4 can press the four locations around the adhesive portion 121, the holder 1201 in FIG. 5 can press the central portion of the adhesive portion 121 in addition to the four locations around the adhesive portion 121. It differs from the holder 120 of FIG. 4 in this respect. Specifically, the holder 1201 has a pressing member 1251 a that presses the central portion of the adhesive portion 121 in addition to the four pressing members 1251 that press the periphery of the adhesive portion 121 . A through hole 122a corresponding to the pressing member 1251a is provided in the central portion of the metal base 124. As shown in FIG.

本変形例では、粘着部１２１の周辺部だけでなく中央部も押圧されることとなるので、押圧時に粘着部１２１の中央部が凹形状に変形することが抑制される。これにより、粘着部１２１の粘着力が急激に失われるのではなく、粘着力が徐々に減少し、より安定に剥離動作を行うことができる。 In this modified example, not only the peripheral portion of the adhesive portion 121 but also the central portion is pressed, so that deformation of the central portion of the adhesive portion 121 into a concave shape during pressing is suppressed. As a result, the adhesive force of the adhesive portion 121 is not suddenly lost, but the adhesive force gradually decreases, so that the peeling operation can be performed more stably.

押圧部１２５による粘着部１２１の押圧位置、換言すれば粘着部１２１の変形箇所については、基板１０のサイズ、厚み及び剛性、並びに粘着部１２１の面積及び変形許容範囲等、基板１０又は粘着部１２１の性質に応じて適宜設定可能である。また、基板キャリア１００上の位置に応じて、用いられる保持具１２０、１２０１が適宜選択されてもよい。例えば、平板状部材１１０の周囲に配置される保持具として保持具１２０を用いるとともに、平板状部材１１０の内側に配置される保持具として保持具１２０１を用いてもよい。 The pressure position of the adhesive portion 121 by the pressing portion 125, in other words, the deformation location of the adhesive portion 121, depends on the size, thickness and rigidity of the substrate 10, the area of the adhesive portion 121 and the allowable deformation range, etc., and the substrate 10 or the adhesive portion 121. can be appropriately set according to the nature of Also, depending on the position on the substrate carrier 100, the holders 120, 1201 to be used may be appropriately selected. For example, the holder 120 may be used as a holder arranged around the flat plate-like member 110 and the holder 1201 may be used as a holder arranged inside the flat plate-like member 110 .

＜保持具１２０の変形例２＞
図６（Ａ）～図６（Ｃ）は、保持具１２０の変形例としての保持具１２０２を示す図である。図５（Ａ）は、一実施形態に係る保持具１２０２の上面図である。また、図６（Ｂ）及び図６（Ｃ）は、図６（A）のＥ-Ｅ’線断面図である。図６（Ｂ）は、基板１０に粘着部１２１が貼り付いている状態を示しており、図６（Ｃ）は、粘着部１２１から基板１０を剥離させようとしている状態を示している。以下、図４の保持具１２０の各構成と同様の構成については同様の符号を付して説明を省略する。 <Modification 2 of holder 120>
6A to 6C are diagrams showing a holder 1202 as a modified example of the holder 120. FIG. FIG. 5A is a top view of a retainer 1202 according to one embodiment. 6(B) and 6(C) are sectional views taken along line EE' of FIG. 6(A). 6B shows a state in which the adhesive portion 121 is attached to the substrate 10, and FIG. 6C shows a state in which the substrate 10 is about to be peeled off from the adhesive portion 121. FIG. Hereinafter, configurations similar to those of the holder 120 shown in FIG. 4 are denoted by similar reference numerals, and description thereof is omitted.

図６の保持具１２０２は、押圧部材としての球形部材１２５１ｂが粘着部１２１の中央部を押圧可能に１つ設けられている点で図４の保持具１２０と異なる。球形部材１２５ｂは、支持部１２５２ｂとは独立に設けられ、粘着部１２１を反対面１２１ｂから押圧可能に設けられている。本変形例では、球形部材１２５１ｂは、反対面１２１ｂと、貫通孔１２２と、支持部１２５２ｂとにより区画された空間に配置されている。また、球形部材１２５１ｂは、貫通孔１２２に対して所定のクリアランスを有して貫通孔１２２内に設けられている。このクリアランスは適宜設定可能である。あくまで例示であるが、貫通孔１２２の直径と、球形部材１２５１ｂの直径との差が０．０５ｍｍ～１．０ｍｍに設定されてもよい。或いは、貫通孔１２２の直径に対する球形部材１２５１ｂの直径の割合で、クリアランスが設定されてもよい。 A holder 1202 in FIG. 6 is different from the holder 120 in FIG. 4 in that a single spherical member 1251b as a pressing member is provided so as to be able to press the central portion of the adhesive portion 121 . The spherical member 125b is provided independently of the support portion 1252b, and is provided so as to be able to press the adhesive portion 121 from the opposite surface 121b. In this modification, the spherical member 1251b is arranged in a space defined by the opposite surface 121b, the through hole 122, and the support portion 1252b. Further, the spherical member 1251b is provided inside the through hole 122 with a predetermined clearance with respect to the through hole 122 . This clearance can be set as appropriate. As an example, the difference between the diameter of the through-hole 122 and the diameter of the spherical member 1251b may be set to 0.05 mm to 1.0 mm. Alternatively, the clearance may be set at a ratio of the diameter of the spherical member 1251b to the diameter of the through-hole 122. FIG.

基板１０に粘着部１２１が貼り付いている状態（図６（Ｂ））から、アクチュエータ１２７が支持部１２５２ｂを粘着部１２１に接近する方向に移動させると、球形部材１２５１ｂが反対面１２１ｂから粘着部１２１を押圧する（図６（Ｃ））。このとき、球形部材１２５１ｂは、支持部１２５２ｂから独立して設けられており、かつ貫通孔１２２に対してクリアランスを有することから、アクチュエータ１２７により変位する方向と交差する方向（ＸＹ方向）にも移動可能である。よって、球形部材１２５１ｂによる粘着部１２１への押圧力は、基板１０に対してせん断方向にも加わることになり、より小さな力で基板１０と粘着部１２１とを剥離することができる。別の観点からみると、球形部材１２５１ｂは、押圧動作の中で粘着部１２１の押圧位置が変化することにより、粘着部１２１の複数の位置を押圧しているといえる。図７は、球形部材１２５１ｂが粘着部１２１に対して加える力の方向を模式的に示している。また、使用状況に応じて、球形部材１２５１ｂと支持部１２５２ｂとが独立している構成により、球形部材１２５１ｂを交換することも容易になる。 When the actuator 127 moves the support portion 1252b in a direction approaching the adhesive portion 121 from the state where the adhesive portion 121 is attached to the substrate 10 (FIG. 6B), the spherical member 1251b moves from the opposite surface 121b to the adhesive portion. 121 is pressed (FIG. 6(C)). At this time, since the spherical member 1251b is provided independently of the support portion 1252b and has a clearance with respect to the through hole 122, the spherical member 1251b is also moved in the direction (XY direction) intersecting the direction of displacement by the actuator 127. It is possible. Therefore, the pressing force to the adhesive portion 121 by the spherical member 1251b is also applied to the substrate 10 in the shear direction, so that the substrate 10 and the adhesive portion 121 can be separated with a smaller force. From another point of view, it can be said that the spherical member 1251b presses a plurality of positions of the adhesive portion 121 by changing the pressing position of the adhesive portion 121 during the pressing operation. FIG. 7 schematically shows directions of forces applied to the adhesive portion 121 by the spherical member 1251b. In addition, the configuration in which the spherical member 1251b and the support portion 1252b are independent of each other makes it easy to replace the spherical member 1251b according to the usage conditions.

なお、本変形例では、支持部１２５２ｂと独立した押圧部材として球形部材１２５１ｂが用いられているが、押圧部材の形状は変更可能である。例えば、押圧部材は、粘着部１２１を押圧する面の形状が曲面形状を含むように形成されてもよい。また、本変形例では、支持部１２５２ｂと独立した押圧部材として球形部材１２５１ｂが１つ設けられているが、このような押圧部材が複数設けられてもよい。 In addition, in this modified example, the spherical member 1251b is used as a pressing member independent of the supporting portion 1252b, but the shape of the pressing member can be changed. For example, the pressing member may be formed so that the shape of the surface that presses the adhesive portion 121 includes a curved shape. Also, in this modification, one spherical member 1251b is provided as a pressing member independent of the support portion 1252b, but a plurality of such pressing members may be provided.

このように、保持具１２０の構成は適宜変形可能である。また、保持具１２０、１２０１、１２０２の構成が適宜組み合わされてもよい。また、基板キャリア１００の中に、複数種類の保持具１２０、１２０１、１２０２が設けられていてもよい。 Thus, the configuration of the holder 120 can be modified as appropriate. Also, the configurations of the holders 120, 1201, and 1202 may be appropriately combined. Also, multiple types of holders 120 , 1201 , 1202 may be provided in the substrate carrier 100 .

なお、本実施形態では、保持具１２０の基板１０に対する保持力は、粘着部１２１に基板１０を粘着させ、基板１０を垂直方向に引っ張り、剥離するまでの最大荷重と定義した。具体的には、固定した保持具１２０に基板を粘着させ、基板１０を電動ステージ用いて、上方に1mm/sの速度で引き揚げ、剥離するまでにかかる最大荷重をデジタルフォースゲージで測定することで評価を行うことができる。 In this embodiment, the holding force of the holder 120 with respect to the substrate 10 is defined as the maximum load until the substrate 10 is adhered to the adhesive portion 121, the substrate 10 is pulled in the vertical direction, and the substrate 10 is peeled off. Specifically, the substrate is adhered to the fixed holder 120, the substrate 10 is lifted upward at a speed of 1 mm/s using an electric stage, and the maximum load applied until the substrate is peeled off is measured with a digital force gauge. can be evaluated.

また、本実施形態では、保持具１２０の基板剥離性の指標となる剥離力は、粘着部１２１に基板１０を粘着させ、押圧部１２５により粘着部１２１を押圧した状態で、基板１０を垂直方向に引っ張り、剥離するまでの最大荷重と定義した。つまり、保持力に対して剥離力が低くなっていれば、押圧部１２５の作用により、粘着部１２１から基板１０を剥離しやすくなっているということができる。 Further, in the present embodiment, the peeling force, which is an index of the substrate peelability of the holder 120, is obtained by making the substrate 10 adhere to the adhesive portion 121, pressing the adhesive portion 121 with the pressing portion 125, and pressing the substrate 10 in the vertical direction. It was defined as the maximum load until it was pulled and peeled off. In other words, if the peeling force is lower than the holding force, it can be said that the substrate 10 can be easily peeled off from the adhesive portion 121 by the action of the pressing portion 125 .

＜基板キャリア１００を用いた成膜処理＞
次に、基板キャリア１００を用いた成膜処理の一例を説明する。図８は、基板キャリア１００を用いて成膜処理を行う成膜システムＳＹの構成例を示す図である。成膜システムＳＹは、いわゆるインライン式の成膜システムであり、基板１０を搬送させながら後述する各室Ｒ１～Ｒ６において基板１０に対して所定の処理を行う。図９（Ａ）は、成膜システムＳＹによる成膜処理の各工程を示すフローチャートである。本実施形態では、これらの一連の工程が真空雰囲気下で行われる。そのため、各室Ｒ１～Ｒ６は、内部の真空状態を維持可能に隣接する室と連通している。なお、本実施形態では「真空」は、大気圧より低い圧力の気体で満たされた状態、換言すれば減圧状態を指すものとする。 <Film Forming Processing Using Substrate Carrier 100>
Next, an example of film formation processing using the substrate carrier 100 will be described. FIG. 8 is a diagram showing a configuration example of a film forming system SY that performs a film forming process using the substrate carrier 100. As shown in FIG. The film forming system SY is a so-called in-line film forming system, and performs a predetermined process on the substrate 10 in chambers R1 to R6, which will be described later, while the substrate 10 is being transported. FIG. 9A is a flow chart showing each step of film formation processing by the film formation system SY. In this embodiment, these series of steps are performed in a vacuum atmosphere. Therefore, each of the chambers R1 to R6 communicates with adjacent chambers so as to maintain the internal vacuum state. In the present embodiment, "vacuum" refers to a state filled with gas having a pressure lower than atmospheric pressure, in other words, a reduced pressure state.

（Ｓ１：基板保持工程）
ステップＳ１（以下、各ステップについて単にＳ１等と表記する）は、基板保持工程である。基板保持工程は、搬送されてきた基板１０を基板キャリア１００により保持する工程である。基板保持工程は、基板保持室Ｒ１で行われる。 (S1: substrate holding step)
Step S1 (each step is hereinafter simply referred to as S1, etc.) is a substrate holding step. The substrate holding step is a step of holding the transported substrate 10 by the substrate carrier 100 . The substrate holding process is performed in the substrate holding chamber R1.

基板保持室Ｒ１について説明する。図１０は、基板保持室Ｒ１の構成及び動作を模式的に示す図である。基板保持室Ｒ１は、複数のピン２４０により基板１０をＺ軸方向に上下動させるピンユニット２００と、基板１０を保持具１２０の粘着部１２１に貼り付けるために基板１０を押圧する押圧ユニット４００と、基板キャリア１００を支持する支持台５００とを含む。基板キャリア１００は、平板状部材１１０の保持面１１０Ｘが水平面と平行となるように支持台５００に支持される。 The substrate holding chamber R1 will be explained. FIG. 10 is a diagram schematically showing the configuration and operation of the substrate holding chamber R1. The substrate holding chamber R1 includes a pin unit 200 that moves the substrate 10 up and down in the Z-axis direction using a plurality of pins 240, and a pressing unit 400 that presses the substrate 10 to adhere the substrate 10 to the adhesive portion 121 of the holder 120. , and a support 500 that supports the substrate carrier 100 . The substrate carrier 100 is supported by the support table 500 so that the holding surface 110X of the flat member 110 is parallel to the horizontal plane.

ピンユニット２００は、モータ２１０と、モータ２１０により回転するネジ軸２２０と、ネジ軸２２０の回転動作に伴ってネジ軸２２０に沿って上下動するナット部２３０と、ナット部２３０に固定されナット部２３０とともに上下動するピン２４０とを含む。ナット部２３０の内周面と、ネジ軸２２０の外周面との間で、複数のボールが無限循環するように構成されている。すなわち、ピンユニット２００は、ボールねじ機構により、ピン２４０を昇降可能に構成されている。本実施形態では、平板状部材１１０に設けられる複数の貫通孔１１１の位置に対応して、複数のピンユニット２００が設けられている。 The pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 vertically moving along the screw shaft 220 as the screw shaft 220 rotates, and a nut portion fixed to the nut portion 230. and a pin 240 that moves up and down with 230 . A plurality of balls are configured to endlessly circulate between the inner peripheral surface of nut portion 230 and the outer peripheral surface of screw shaft 220 . That is, the pin unit 200 is configured such that the pin 240 can be raised and lowered by the ball screw mechanism. In this embodiment, a plurality of pin units 200 are provided corresponding to the positions of the plurality of through holes 111 provided in the flat plate member 110 .

押圧ユニット４００は、モータ４１０と、モータ４１０により回転するネジ軸４２０と、ネジ軸４２０の回転動作に伴って、ネジ軸４２０に沿って上下動するナット部４３０とを含む。また、押圧ユニット４００は、ナット部４３０に固定され、ナット部４３０とともに上下動する軸部４４０と、軸部４４０の先端に設けられる押圧部４５０とを含む。ナット部４３０の内周面とネジ軸４２０の外周面との間で、複数のボールが無限循環するように構成されている。すなわち、押圧ユニット４００は、ボールねじ機構により、押圧部４５０を昇降可能に構成されている。また、本実施形態では、基板キャリア１００に設けられる複数の保持具１２０の位置に対応して、複数の押圧ユニット４００が設けられている。 The pressing unit 400 includes a motor 410 , a screw shaft 420 rotated by the motor 410 , and a nut portion 430 vertically moving along the screw shaft 420 as the screw shaft 420 rotates. The pressing unit 400 also includes a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430 , and a pressing portion 450 that is provided at the tip of the shaft portion 440 . A plurality of balls are configured to endlessly circulate between the inner peripheral surface of nut portion 430 and the outer peripheral surface of screw shaft 420 . That is, the pressing unit 400 is configured such that the pressing portion 450 can be moved up and down by the ball screw mechanism. Also, in this embodiment, a plurality of pressing units 400 are provided corresponding to the positions of the plurality of holders 120 provided on the substrate carrier 100 .

なお、本実施形態ではピン２４０及び押圧部４５０を昇降させる機構としてボールねじ機構が採用されているが、ラックアンドピニオン方式などその他の公知の技術も採用し得る。 In this embodiment, a ball screw mechanism is employed as a mechanism for raising and lowering the pin 240 and the pressing portion 450, but other known techniques such as a rack and pinion system may also be employed.

また、基板保持室Ｒ１は、基板処理領域Ａ１と、駆動源配置領域Ａ２と、駆動源配置領域Ａ３とに区画される。基板処理領域Ａ１を介して、鉛直方向下方に駆動源配置領域Ａ２が設けられ、鉛直方向上方に駆動源配置培地領域Ａ３が設けられる。基板処理領域Ａ１には、支持台５００に支持された基板キャリア１００などが配置される。そして、駆動源配置領域Ａ２には、ピンユニット２００のモータ２１０などが配され、駆動源配置領域Ａ３には、押圧ユニット４００のモータ４１０などが配置される。この構成により、モータ２１０、４１０の回転によって発生する異物や、ボールネジの摺動部で発生する異物（パーティクル）が、基板処理領域Ａ１に進入することを抑制できる。なお、各領域Ａ１～Ａ３すべてを真空雰囲気にせず、例えば、基板処理領域Ａ１を真空雰囲気とし、駆動源配置領域Ａ２及び駆動源配置領域Ａ３を大気雰囲気とするように、基板保持室Ｒ１を区画する壁部等が設けられてもよい。 Further, the substrate holding chamber R1 is divided into a substrate processing area A1, a drive source arrangement area A2, and a drive source arrangement area A3. A driving source arrangement area A2 is provided vertically downward through the substrate processing area A1, and a driving source arrangement culture medium area A3 is provided vertically upward. A substrate carrier 100 and the like supported by a support table 500 are arranged in the substrate processing area A1. The motor 210 and the like of the pin unit 200 are arranged in the driving source arrangement area A2, and the motor 410 and the like of the pressing unit 400 are arranged in the driving source arrangement area A3. With this configuration, it is possible to prevent foreign matter generated by the rotation of the motors 210 and 410 and foreign matter (particles) generated at the sliding portion of the ball screw from entering the substrate processing area A1. The substrate holding chamber R1 is divided so that, for example, the substrate processing area A1 is in a vacuum atmosphere, and the drive source arrangement area A2 and the drive source arrangement area A3 are in an air atmosphere, instead of all the areas A1 to A3 being in a vacuum atmosphere. A wall or the like may be provided.

なお、基板キャリア１００の平板状部材１１０内に配された保持具１２０の押圧部１２５及びアクチュエータ１２７は、剥離部から生じる異物がチャンバ内に拡散することのないようケース１５５によって密閉されている。 The pressing portion 125 and the actuator 127 of the holder 120 arranged in the plate-shaped member 110 of the substrate carrier 100 are sealed by a case 155 so that foreign substances generated from the peeling portion do not diffuse into the chamber.

また基板１０をＺ軸方向に上下動させるピン２４０を駆動するモータ２１０、押圧部４５０を駆動するモータ４１０、保持具１２０の押圧部１２５を駆動するアクチュエータ１２７等の駆動系は、それぞれの制御ライン２０１、４０１、１２９によってコントローラ７２０へと接続され、コントローラ７２０が制御プログラムを実行することによって制御される。本実施形態では、コントローラ７２０は、成膜システムＳＹの全体を制御するコントローラである。例えば、コントローラ７２０は、ＣＰＵ、ＲＡＭ、ＲＯＭ等を含み、ＣＰＵがＲＯＭに記憶されたプログラムをＲＡＭに読み出して実行することにより、各駆動系の制御が実現される。また、７１０はシステムの各部に電源を供給する電源ユニットである。なお、各室Ｒ１～Ｒ６に対して室内の構成要素を制御するコントローラがそれぞれ設けられ、各コントローラが通信可能に構成されてもよい。すなわち、成膜システムＳＹが有するコントローラの数や、各コントローラの役割等は限定されない。 Further, drive systems such as the motor 210 that drives the pin 240 that moves the substrate 10 up and down in the Z-axis direction, the motor 410 that drives the pressing portion 450, and the actuator 127 that drives the pressing portion 125 of the holder 120 are controlled by respective control lines. 201, 401, 129 to a controller 720, which is controlled by executing a control program. In this embodiment, the controller 720 is a controller that controls the entire film formation system SY. For example, the controller 720 includes a CPU, a RAM, a ROM, etc., and the CPU reads a program stored in the ROM into the RAM and executes it, thereby realizing control of each driving system. A power supply unit 710 supplies power to each part of the system. It should be noted that a controller may be provided for each of the rooms R1 to R6 to control the components in the room, and the controllers may be configured to communicate with each other. That is, the number of controllers included in the film forming system SY, the role of each controller, and the like are not limited.

次に、基板保持工程（Ｓ１）の具体例について説明する。図９（Ｂ）は、Ｓ１の工程の詳細を示すフローチャートである。基板保持工程は、準備工程（Ｓ１１）、載置工程（Ｓ１２）及び粘着工程（Ｓ１３）を含む。 Next, a specific example of the substrate holding step (S1) will be described. FIG. 9B is a flow chart showing the details of the step of S1. The substrate holding process includes a preparation process (S11), a mounting process (S12) and an adhesion process (S13).

Ｓ１１は、準備工程である。準備工程は、基板キャリア１００による基板１０の保持の準備を行う工程である。この工程では、まず、ピン２４０及び押圧部４５０は、鉛直方向最上方の位置で待機している。さらに言えば、ピン２４０は、平板状部材１１０のピン用の貫通孔１１１から保持面１１０Ｘよりも鉛直方向上方に飛び出した状態となっている。また、保持具１２０は、図３に示すように、弾性粘着部１２１を保持面１１０Ｘよりも僅かに突出した状態で平板状部材１１０に固定されている。よって、ピン２４０の上端が鉛直方向で保持具１２０の粘着部１２１よりも上方に位置している。この状態で、不図示の搬送機構により基板１０が基板保持室Ｒ１に搬入されると、基板１０は、保持具１２０の粘着部１２１と接触することなくピン２４０に支持される（図１０）。 S11 is a preparatory step. The preparation process is a process of preparing for holding the substrate 10 by the substrate carrier 100 . In this step, first, the pin 240 and the pressing portion 450 are on standby at the vertically uppermost position. In other words, the pin 240 protrudes vertically upward from the holding surface 110X from the pin through hole 111 of the flat plate member 110 . Further, as shown in FIG. 3, the holder 120 is fixed to the flat plate member 110 with the elastic adhesive portion 121 protruding slightly from the holding surface 110X. Therefore, the upper end of the pin 240 is located above the adhesive portion 121 of the holder 120 in the vertical direction. In this state, when the substrate 10 is carried into the substrate holding chamber R1 by a transport mechanism (not shown), the substrate 10 is supported by the pins 240 without coming into contact with the adhesive portion 121 of the holder 120 (FIG. 10).

Ｓ１２は、載置工程である。載置工程は、基板キャリア１００に基板１０を載置する工程である。コントローラ７２０は、モータ２１０を制御してピン２４０を鉛直方向下方に移動させる。ピン２４０の先端は、平板状部材１１０の貫通孔１１１を通過して平板状部材１１０の保持面１１０Ｘとは反対側の面よりも下方に移動する。その結果、基板１０は保持具１２０の粘着部１２１に接触する状態となる。図１１は、基板保持室Ｒ１の動作説明図であって、基板１０が基板キャリア１００の粘着部１２１に接触した状態を示す図である。 S12 is a mounting step. The mounting process is a process of mounting the substrate 10 on the substrate carrier 100 . Controller 720 controls motor 210 to move pin 240 vertically downward. The tip of the pin 240 passes through the through hole 111 of the flat plate-like member 110 and moves below the surface of the flat plate-like member 110 opposite to the holding surface 110X. As a result, the substrate 10 comes into contact with the adhesive portion 121 of the holder 120 . FIG. 11 is an operation explanatory view of the substrate holding chamber R1, showing a state in which the substrate 10 is in contact with the adhesive portion 121 of the substrate carrier 100. FIG.

なお基板１０から７０インチ（８７２×１５４９ミリ）サイズや８０インチサイズなどの大画面を面取りする場合等では、図１で示す場合と異なり基板１０の内側に保持具１２０が存在しない場合がある。このような場合には、ピン２４０の下方への移動に伴い、基板１０にうねりが残ることがあるが、ピン２４０の下方への移動を調整することで基板１０のうねりを低減することが可能である。 When chamfering a large screen such as 70 inches (872×1549 mm) or 80 inches from the substrate 10, the holder 120 may not exist inside the substrate 10 unlike the case shown in FIG. In such a case, undulations may remain in the substrate 10 as the pins 240 move downward, but the undulations of the substrate 10 can be reduced by adjusting the downward movement of the pins 240. is.

Ｓ１３は、基板粘着工程である。基板粘着工程は、基板１０に粘着部１２１を粘着させる工程である。コントローラ７２０は、モータ４１０を制御して押圧部４５０を鉛直方向下方に移動させることで、基板１０を粘着部１２１に押しつける。これにより、基板１０が粘着部１２１に粘着する。このように、押圧部４５０により基板１０を粘着部１２１に対して押圧することで、基板１０と粘着部１２１との接触面を十分に確保することができる。 S13 is a substrate adhesion step. The substrate adhesion step is a step of adhering the adhesive portion 121 to the substrate 10 . The controller 720 presses the substrate 10 against the adhesive portion 121 by controlling the motor 410 to move the pressing portion 450 downward in the vertical direction. As a result, the substrate 10 adheres to the adhesive portion 121 . By pressing the substrate 10 against the adhesive portion 121 by the pressing portion 450 in this manner, a sufficient contact surface between the substrate 10 and the adhesive portion 121 can be secured.

この際、複数の押圧部４５０を同時に基板１０に押圧するのではなく、押圧領域が、特定の開始地点から特定の終了地点に向かって徐々に変化するように、コントローラ７２０により押圧部４５０動作を制御してもよい。例えば、コントローラ７２０は、基板１０の長手方向中央部から押圧を開始して、両端部に向かって順次基板１０が押圧されるように複数の押圧部４５０を制御する。図１２は、基板保持室Ｒ１の動作説明図であって、押圧部４５０が下方に移動し、平板状部材１１０からわずかに突出した保持具１２０の粘着部１２１の接触面に基板１０が接触して粘着された状態を示している。このとき保持具120内では、押圧部１２５が金属製基材１２４内を降下した位置にあり、粘着部１２１の接触面積を基板保持にフルに用いることができる（図４（Ｂ）参照）。 At this time, the controller 720 controls the operation of the pressing portions 450 so that the pressing area gradually changes from a specific start point toward a specific end point, instead of pressing the plurality of pressing portions 450 against the substrate 10 at the same time. may be controlled. For example, the controller 720 controls the plurality of pressing portions 450 so that pressing is started from the central portion in the longitudinal direction of the substrate 10 and the substrate 10 is sequentially pressed toward both ends. FIG. 12 is an explanatory view of the operation of the substrate holding chamber R1, in which the pressing portion 450 moves downward, and the substrate 10 comes into contact with the contact surface of the adhesive portion 121 of the holder 120 slightly protruding from the flat plate member 110. It shows a sticky state. At this time, in the holder 120, the pressing portion 125 is at a position lowered in the metal substrate 124, and the contact area of the adhesive portion 121 can be fully used for holding the substrate (see FIG. 4B).

押圧部４５０による押圧後、コントローラ７２０は、モータ４１０を制御して押圧部４５０を鉛直方向上方に移動させる。その後、コントローラ７２０は、支持具１３０によって基板１０の周囲をクランプして基板キャリア１００に固定する。これにより、支持具１３０及び保持具１２０によって、基板１０が基板キャリア１００にしっかりと保持された状態となる。図１３は、基板保持室Ｒ１の動作説明図であって、基板キャリア１００による基板１０の保持動作が完了した状態を示している。こうして、基板１０は基板キャリア１００と一体化して、基板保持室Ｒ１から搬出前の工程を完了する。 After pressing by the pressing portion 450, the controller 720 controls the motor 410 to move the pressing portion 450 vertically upward. The controller 720 then clamps the substrate 10 around its perimeter and secures it to the substrate carrier 100 with the supports 130 . As a result, the substrate 10 is firmly held on the substrate carrier 100 by the supports 130 and the holders 120 . FIG. 13 is an operation explanatory view of the substrate holding chamber R1, showing a state in which the operation of holding the substrate 10 by the substrate carrier 100 is completed. In this way, the substrate 10 is integrated with the substrate carrier 100, and the process before carrying out from the substrate holding chamber R1 is completed.

（Ｓ２：反転工程）
Ｓ２は、反転工程である。反転工程は、反転室Ｒ２において基板キャリア１００を反転させる工程である。図１４（Ａ）及び図１４（Ｂ）は、反転室Ｒ２の構成及び動作を模式的に示す図である。図１４（Ａ）は反転前の状態を示し、図１４（Ｂ）は反転後の状態を示している。反転室Ｒ２は、基板キャリア１００を保持する保持部材６１０と、保持部材６１０に固定される回転軸６２０と、回転軸６２０を回転させるモータ６３０と、回転軸６２０を軸支持する支持部材６４０とを含む。 (S2: reversing step)
S2 is an inversion step. The reversing step is a step of reversing the substrate carrier 100 in the reversing chamber R2. FIGS. 14A and 14B are diagrams schematically showing the configuration and operation of the reversing chamber R2. FIG. 14A shows the state before inversion, and FIG. 14B shows the state after inversion. The reversing chamber R2 includes a holding member 610 that holds the substrate carrier 100, a rotating shaft 620 that is fixed to the holding member 610, a motor 630 that rotates the rotating shaft 620, and a supporting member 640 that supports the rotating shaft 620. include.

図１４（Ａ）で示されるように、基板１０を保持した基板キャリア１００は、不図示の機構により基板保持室Ｒ１から反転室Ｒ２に搬送され、保持部材６１０により保持される。その状態から、コントローラ７２０は、モータ６３０を制御して回転軸６２０を回転させることにより、基板キャリア１００を１８０度回転させる。これにより基板キャリア１００は、図１２（Ｂ）で示されるように基板１０が基板キャリア１００に対して鉛直方向下方に向いた（吊り下げた）状態となる。大画面を面取りする場合には、基板１０の保持具１２０で保持されない部位に鉛直方向下方へのたわみが生じることがあるが、本実施形態では、粘着部１２１によって基板１０を継続して安定的に保持可能することができる。 As shown in FIG. 14A, the substrate carrier 100 holding the substrate 10 is transported from the substrate holding chamber R1 to the reversing chamber R2 by a mechanism (not shown) and held by the holding member 610. As shown in FIG. From this state, the controller 720 rotates the substrate carrier 100 by 180 degrees by controlling the motor 630 to rotate the rotating shaft 620 . As a result, the substrate carrier 100 is in a state in which the substrate 10 faces downward in the vertical direction (hangs) with respect to the substrate carrier 100, as shown in FIG. 12(B). When chamfering a large screen, a portion of the substrate 10 that is not held by the holder 120 may be bent downward in the vertical direction. can be held.

（Ｓ３：マスク保持工程）
Ｓ３は、マスク保持工程である。基板１０を保持した基板キャリア１００は、反転室Ｒ２で反転された後にアライメント室Ｒ５に搬送される。アライメント室Ｒ５では、アライメント室Ｒ５で待機するマスク２０と基板１０とを位置合わせ（アライメント）が行われ、基板キャリア１００はマスク２０の上方にアライメントされた状態で戴置される。基板キャリア１００をマスク２０と固定する方法としては、公知の技術を採用可能であり、例えば、電磁石等の磁気を利用する構成や、クランプなどのメカ的な機構を採用することができる。また、基板キャリア１００をマスク２０と固定せず、ローラ等の搬送用部材上にあるマスク２０の上に基板キャリアを載せ、搬送用部材の上を一体的に移動させることも可能である。 (S3: mask holding step)
S3 is a mask holding step. The substrate carrier 100 holding the substrate 10 is transferred to the alignment chamber R5 after being reversed in the reversing chamber R2. In the alignment chamber R5, alignment is performed between the mask 20 waiting in the alignment chamber R5 and the substrate 10, and the substrate carrier 100 is placed above the mask 20 in an aligned state. As a method for fixing the substrate carrier 100 to the mask 20, a known technique can be adopted. For example, a configuration using magnetism such as an electromagnet or a mechanical mechanism such as a clamp can be adopted. Alternatively, the substrate carrier 100 may not be fixed to the mask 20, and the substrate carrier may be placed on the mask 20 on a conveying member such as a roller and moved integrally on the conveying member.

（Ｓ４：成膜工程）
Ｓ４は、成膜工程である。図１５は、成膜室Ｒ３の構成を模式的に示す図である。成膜室Ｒ３は、成膜処理の一例としての蒸着処理が実行可能である。なお、成膜方法は蒸着やスパッタリングなど方法を問わず、成膜材料や蒸着材料の種類も問わない。成膜室Ｒ３の内部には、蒸着源３０が設置されている。基板１０及びマスク２０を一体的に保持した基板キャリア１００は、アライメント室Ｒ５から成膜室Ｒ３に搬送される。蒸着源３０から成膜材料が蒸発又は昇華している空間を、基板キャリア１００が通過することで、基板１０に薄膜が形成される。なお、複数の成膜室Ｒ３が設けられ、それぞれに異なる蒸着源が配置されてもよい。そして、基板キャリア１００が複数の成膜室Ｒ３に順次搬送されることで、複数種類の薄膜を基板１０に順次成膜されてもよい。この場合、各成膜室Ｒ３の間に、マスク２０の交換、及び基板１０とマスク２０のアライメントが可能なアライメント室Ｒ５等が設けられてもよい。なお、設けられる成膜室Ｒ３の数は適宜設定可能である。 (S4: film formation step)
S4 is a film forming step. FIG. 15 is a diagram schematically showing the configuration of the film forming chamber R3. The film-forming chamber R3 can perform vapor deposition processing as an example of film-forming processing. It should be noted that the film formation method does not matter, such as vapor deposition or sputtering, and the types of film formation materials and vapor deposition materials do not matter. A vapor deposition source 30 is installed inside the film forming chamber R3. The substrate carrier 100 integrally holding the substrate 10 and the mask 20 is transported from the alignment chamber R5 to the film formation chamber R3. A thin film is formed on the substrate 10 by passing the substrate carrier 100 through the space where the film forming material is evaporated or sublimated from the vapor deposition source 30 . In addition, a plurality of film forming chambers R3 may be provided, and different vapor deposition sources may be arranged in each of the film forming chambers R3. Then, the substrate carrier 100 may be sequentially transported to a plurality of film formation chambers R3 to sequentially form a plurality of types of thin films on the substrate 10 . In this case, an alignment chamber R5 or the like in which the mask 20 can be exchanged and the substrate 10 and the mask 20 can be aligned may be provided between the film formation chambers R3. In addition, the number of film-forming chambers R3 provided can be set suitably.

成膜が終了すると、基板キャリア１００はマスク取外室Ｒ６に搬送され、基板１０に組み合わされたマスク２０が取り外される。なお、別のマスクを再度組み合わせて成膜工程を繰り返す構成も採用可能である。 After the film formation is completed, the substrate carrier 100 is transported to the mask removing chamber R6, and the mask 20 combined with the substrate 10 is removed. Note that it is also possible to adopt a configuration in which another mask is recombined and the film formation process is repeated.

（Ｓ５：基板剥離工程）
Ｓ５は、基板剥離工程である。基板剥離工程は、基板剥離室Ｒ４において成膜が行われた後の基板１０を粘着部１２１から剥離する工程である。図１６（Ａ）及び図１６（Ｂ）は、基板剥離室Ｒ４の構成及び動作を模式的に示す図である。図１６（Ａ）は基板１０剥離前の状態を示し、図１６（Ｂ）は基板１０剥離後の状態を示している。 (S5: substrate peeling step)
S5 is a substrate peeling step. The substrate peeling step is a step of peeling off the substrate 10 after film formation is performed in the substrate peeling chamber R<b>4 from the adhesive portion 121 . 16A and 16B are diagrams schematically showing the configuration and operation of the substrate peeling chamber R4. 16A shows the state before the substrate 10 is peeled off, and FIG. 16B shows the state after the substrate 10 is peeled off.

基板剥離室Ｒ４には、基板保持室Ｒ１と同様に、基板１０を上下動させるためのピンユニット２００と、支持台５００とが設けられている。成膜室Ｒ３での成膜後、基板キャリア１００は反転室Ｒ２に搬送されて反転されてから、基板剥離室Ｒ４に反応される。基板剥離室Ｒ４に基板キャリア１００が搬送されると、図１６（Ａ）で示されるように支持具１３０による基板１０の固定が解除される。その後、コントローラ７２０がモータ２１０を制御してピン２４０を鉛直方向上方に移動させることにより、基板１０は複数のピン２４０によって持ち上げられて、基板キャリア１００から離間する（図１６（Ｂ））。その後、基板１０は基板剥離室Ｒ４から搬出される。 A pin unit 200 for moving the substrate 10 up and down and a support base 500 are provided in the substrate peeling chamber R4, as in the substrate holding chamber R1. After the film is formed in the film forming chamber R3, the substrate carrier 100 is transported to the reversing chamber R2, reversed, and then transferred to the substrate peeling chamber R4. When the substrate carrier 100 is transported to the substrate peeling chamber R4, the substrate 10 is released from the support 130 as shown in FIG. 16(A). After that, the controller 720 controls the motor 210 to move the pins 240 vertically upward, so that the substrate 10 is lifted by the pins 240 and separated from the substrate carrier 100 (FIG. 16(B)). After that, the substrate 10 is unloaded from the substrate peeling chamber R4.

なお、ピン２４０によって基板１０を基板キャリア１００から上方へと離間させる際、図４（Ａ）～図４（Ｃ）等で説明したように、保持具１２０内において、アクチュエータ１２７によって押圧部１２５を上昇させ、粘着部１２１を反対面１２１ｂから押圧して変形させる。これにより、基板１０に対する接触面積を減少させることで粘着力を減少させ、基板１０を容易に剥離させることができる。 When the substrate 10 is moved upward from the substrate carrier 100 by the pin 240, the pressing portion 125 is moved by the actuator 127 inside the holder 120 as described with reference to FIGS. Then, the adhesive portion 121 is pressed from the opposite surface 121b and deformed. Accordingly, by reducing the contact area with the substrate 10, the adhesive force can be reduced, and the substrate 10 can be easily peeled off.

以上説明したように、本実施形態によれば、基板キャリア１００により基板１０を保持する際には、保持具１２０の粘着部１２１の接触面積をフルに使って強い保持力を得ることができる。一方、粘着部１２１から基板１０を剥離する際には、粘着部１２１を部分的に変形させることによって、粘着部１２１から基板１０を容易に剥離することができる。よって、基板１０に不要な負荷を与えることなく、基板保持、搬送、成膜等の処理、及び剥離までのフローを円滑に行うことができる。 As described above, according to this embodiment, when holding the substrate 10 by the substrate carrier 100, the contact area of the adhesive portion 121 of the holder 120 can be fully used to obtain a strong holding force. On the other hand, when peeling the substrate 10 from the adhesive portion 121 , the substrate 10 can be easily peeled from the adhesive portion 121 by partially deforming the adhesive portion 121 . Therefore, without applying an unnecessary load to the substrate 10, the substrate holding, transportation, processing such as film formation, and peeling can be performed smoothly.

なお、本実施形態では、保持具１２０を有する基板キャリア１００がインライン式の成膜システムＳＹに用いられる場合について説明したが、保持具１２０を有する基板支持装置が、他のタイプの成膜装置に用いられてもよい。例えば、搬送ロボットを用いて順次成膜室に基板１０を搬入して、各成膜室において基板１０に対して成膜処理を行うクラスタ式の成膜装置に対しても本実施形態の構成を適用可能である。 In this embodiment, the case where the substrate carrier 100 having the holder 120 is used in the in-line film formation system SY has been described. may be used. For example, the configuration of the present embodiment can also be applied to a cluster-type film forming apparatus in which substrates 10 are sequentially carried into film forming chambers using a transport robot and film forming processing is performed on the substrates 10 in each film forming chamber. Applicable.

＜電子デバイスの製造方法＞
次に、電子デバイスの製造方法の一例を説明する。以下、電子デバイスの例として有機ＥＬ表示装置の構成及び製造方法を例示する。この例の場合、図１５に例示した成膜室Ｒ３が、製造ライン上に、例えば、６か所、設けられる。 <Method for manufacturing electronic device>
Next, an example of a method for manufacturing an electronic device will be described. The configuration and manufacturing method of an organic EL display device will be exemplified below as an example of an electronic device. In the case of this example, the film forming chambers R3 illustrated in FIG. 15 are provided at, for example, six locations on the manufacturing line.

まず、製造する有機ＥＬ表示装置について説明する。図１７（Ａ）は有機ＥＬ表示装置５０の全体図、図１７（Ｂ）は１画素の断面構造を示す図である。 First, the organic EL display device to be manufactured will be described. FIG. 17A is an overall view of the organic EL display device 50, and FIG. 17B is a view showing the cross-sectional structure of one pixel.

図１７（Ａ）に示すように、有機ＥＬ表示装置５０の表示領域５１には、発光素子を複数備える画素５２がマトリクス状に複数配置されている。詳細は後で説明するが、発光素子のそれぞれは、一対の電極に挟まれた有機層を備えた構造を有している。 As shown in FIG. 17A, in a display region 51 of an organic EL display device 50, a plurality of pixels 52 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

なお、ここでいう画素とは、表示領域５１において所望の色の表示を可能とする最小単位を指している。カラー有機ＥＬ表示装置の場合、互いに異なる発光を示す第１発光素子５２Ｒ、第２発光素子５２Ｇ、第３発光素子５２Ｂの複数の副画素の組み合わせにより画素５２が構成されている。画素５２は、赤色（Ｒ）発光素子と緑色（Ｇ）発光素子と青色（Ｂ）発光素子の３種類の副画素の組み合わせで構成されることが多いが、これに限定はされない。画素５２は少なくとも１種類の副画素を含めばよく、２種類以上の副画素を含むことが好ましく、３種類以上の副画素を含むことがより好ましい。画素５２を構成する副画素としては、例えば、赤色（Ｒ）発光素子と緑色（Ｇ）発光素子と青色（Ｂ）発光素子と黄色（Ｙ）発光素子の４種類の副画素の組み合わせでもよい。 The term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51. FIG. In the case of a color organic EL display device, a pixel 52 is configured by combining a plurality of sub-pixels of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often composed of a combination of three types of sub-pixels, a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. Sub-pixels constituting the pixel 52 may be a combination of four types of sub-pixels, for example, a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

図１７（Ｂ）は、図１７（Ａ）のＡ－Ｂ線における部分断面模式図である。画素５２は、基板１００上に、第１の電極（陽極）５４と、正孔輸送層５５と、赤色層５６Ｒ・緑色層５６Ｇ・青色層５６Ｂのいずれかと、電子輸送層５７と、第２の電極（陰極）５８と、を備える有機ＥＬ素子で構成される複数の副画素を有している。これらのうち、正孔輸送層５５、赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂ、電子輸送層５７が有機層に当たる。赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂは、それぞれ赤色、緑色、青色を発する発光素子（有機ＥＬ素子と記述する場合もある）に対応するパターンに形成されている。 FIG. 17B is a schematic partial cross-sectional view taken along the line AB of FIG. 17A. The pixel 52 includes, on the substrate 100, a first electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second layer. It has a plurality of sub-pixels composed of organic EL elements each having an electrode (cathode) 58 . Among these layers, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively.

また、第１の電極５４は、発光素子ごとに分離して形成されている。正孔輸送層５５と電子輸送層５７と第２の電極５８は、複数の発光素子５２Ｒ、５２Ｇ、５２Ｂにわたって共通で形成されていてもよいし、発光素子ごとに形成されていてもよい。すなわち、図１７（Ｂ）に示すように正孔輸送層５５が複数の副画素領域にわたって共通の層として形成された上に赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂが副画素領域ごとに分離して形成され、さらにその上に電子輸送層５７と第２の電極５８が複数の副画素領域にわたって共通の層として形成されていてもよい。 Also, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 17B, the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, and the red layer 56R, the green layer 56G, and the blue layer 56B are separated for each sub-pixel region. The electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

なお、近接した第１の電極５４の間でのショートを防ぐために、第１の電極５４間に絶縁層５９が設けられている。さらに、有機ＥＬ層は水分や酸素によって劣化するため、水分や酸素から有機ＥＬ素子を保護するための保護層６０が設けられている。 In addition, an insulating layer 59 is provided between the first electrodes 54 in order to prevent short-circuiting between the adjacent first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

図１７（Ｂ）では正孔輸送層５５や電子輸送層５７が一つの層で示されているが、有機ＥＬ表示素子の構造によって、正孔ブロック層や電子ブロック層を有する複数の層で形成されてもよい。また、第１の電極５４と正孔輸送層５５との間には第１の電極５４から正孔輸送層５５への正孔の注入が円滑に行われるようにすることのできるエネルギーバンド構造を有する正孔注入層を形成してもよい。同様に、第２の電極５８と電子輸送層５７の間にも電子注入層を形成してもよい。 Although the hole transport layer 55 and electron transport layer 57 are shown as one layer in FIG. may be In addition, an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is formed between the first electrode 54 and the hole transport layer 55 . A hole injection layer having a Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57 as well.

赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂのそれぞれは、単一の発光層で形成されていてもよいし、複数の層を積層することで形成されていてもよい。例えば、赤色層５６Ｒを２層で構成し、上側の層を赤色の発光層で形成し、下側の層を正孔輸送層又は電子ブロック層で形成してもよい。あるいは、下側の層を赤色の発光層で形成し、上側の層を電子輸送層又は正孔ブロック層で形成してもよい。このように発光層の下側又は上側に層を設けることで、発光層における発光位置を調整し、光路長を調整することによって、発光素子の色純度を向上させる効果がある。 Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed of a single light-emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer being a red light emitting layer, and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer and the upper layer may be formed of an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby improving the color purity of the light-emitting element.

なお、ここでは赤色層５６Ｒの例を示したが、緑色層５６Ｇや青色層５６Ｂでも同様の構造を採用してもよい。また、積層数は２層以上としてもよい。さらに、発光層と電子ブロック層のように異なる材料の層が積層されてもよいし、例えば発光層を２層以上積層するなど、同じ材料の層が積層されてもよい。 Although an example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G and the blue layer 56B. Also, the number of layers may be two or more. Furthermore, layers of different materials may be laminated such as the light emitting layer and the electron blocking layer, or layers of the same material may be laminated such as laminating two or more light emitting layers.

次に、有機ＥＬ表示装置の製造方法の例について具体的に説明する。ここでは、赤色層５６Ｒが下側層５６Ｒ１と上側層５６Ｒ２の２層からなり、緑色層５６Ｇと青色層５６Ｂは単一の発光層からなる場合を想定する。 Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R consists of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and blue layer 56B consist of a single light-emitting layer.

まず、有機ＥＬ表示装置を駆動するための回路（不図示）及び第１の電極５４が形成された基板１００を準備する。なお、基板１００の材質は特に限定はされず、ガラス、プラスチック、金属などで構成することができる。本実施形態においては、基板１００として、ガラス基板上にポリイミドのフィルムが積層された基板を用いる。 First, a substrate 100 on which a circuit (not shown) for driving an organic EL display device and a first electrode 54 are formed is prepared. The material of the substrate 100 is not particularly limited, and can be made of glass, plastic, metal, or the like. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 100 .

第１の電極５４が形成された基板１００の上にアクリル又はポリイミド等の樹脂層をバーコートやスピンコートでコートし、樹脂層をリソグラフィ法により、第１の電極５４が形成された部分に開口が形成されるようにパターニングし絶縁層５９を形成する。この開口部が、発光素子が実際に発光する発光領域に相当する。なお、本実施形態では、絶縁層５９の形成までは大型基板に対して処理が行われ、絶縁層５９の形成後に、基板１００を分割する分割工程が実行される。 The substrate 100 on which the first electrode 54 is formed is coated with a resin layer such as acrylic or polyimide by bar coating or spin coating, and the resin layer is subjected to lithography to form openings in the portions where the first electrodes 54 are formed. is formed, and an insulating layer 59 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light. Note that in the present embodiment, the large substrate is processed until the insulating layer 59 is formed, and after the insulating layer 59 is formed, the dividing step of dividing the substrate 100 is performed.

絶縁層５９がパターニングされた基板１００を第１の成膜室Ｒ３に搬入し、正孔輸送層５５を、表示領域の第１の電極５４の上に共通する層として成膜する。正孔輸送層５５は、最終的に１つ１つの有機ＥＬ表示装置のパネル部分となる表示領域５１ごとに開口が形成されたマスクを用いて成膜される。 The substrate 100 patterned with the insulating layer 59 is carried into the first film forming chamber R3, and the hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display area. The hole transport layer 55 is formed using a mask having openings for each of the display regions 51 that will eventually become the panel portion of each organic EL display device.

次に、正孔輸送層５５までが形成された基板１００を第２の成膜室Ｒ３に搬入する。基板１００とマスクとのアライメントを行い、基板をマスクの上に載置し、正孔輸送層５５の上の、基板１００の赤色を発する素子を配置する部分（赤色の副画素を形成する領域）に、赤色層５６Ｒを成膜する。ここで、第２の成膜室で用いるマスクは、有機ＥＬ表示装置の副画素となる基板１００上における複数の領域のうち、赤色の副画素となる複数の領域にのみ開口が形成された高精細マスクである。これにより、赤色発光層を含む赤色層５６Ｒは、基板１００上の複数の副画素となる領域のうちの赤色の副画素となる領域のみに成膜される。換言すれば、赤色層５６Ｒは、基板１００上の複数の副画素となる領域のうちの青色の副画素となる領域や緑色の副画素となる領域には成膜されずに、赤色の副画素となる領域に選択的に成膜される。 Next, the substrate 100 with the holes up to the hole transport layer 55 formed thereon is carried into the second film forming chamber R3. The substrate 100 is aligned with the mask, the substrate is placed on the mask, and the portion of the substrate 100 on the hole transport layer 55 where the element emitting red is to be arranged (the region for forming the red sub-pixel). , a red layer 56R is deposited. Here, the mask used in the second deposition chamber is a mask having openings formed only in a plurality of regions serving as red sub-pixels among a plurality of regions on the substrate 100 serving as sub-pixels of the organic EL display device. A fine mask. As a result, the red layer 56R including the red light-emitting layer is formed only on the red sub-pixel area among the plurality of sub-pixel areas on the substrate 100 . In other words, the red layer 56R is not formed in the blue sub-pixel region or the green sub-pixel region among the plurality of sub-pixel regions on the substrate 100, and is not formed in the red sub-pixel region. A film is selectively formed in the region where

赤色層５６Ｒの成膜と同様に、第３の成膜室Ｒ３において緑色層５６Ｇを成膜し、さらに第４の成膜室Ｒ３において青色層５６Ｂを成膜する。赤色層５６Ｒ、緑色層５６Ｇ、青色層５６Ｂの成膜が完了した後、第５の成膜室Ｒ３において表示領域５１の全体に電子輸送層５７を成膜する。電子輸送層５７は、３色の層５６Ｒ、５６Ｇ、５６Ｂに共通の層として形成される。 Similarly to the deposition of the red layer 56R, the green layer 56G is deposited in the third deposition chamber R3, and the blue layer 56B is deposited in the fourth deposition chamber R3. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation chamber R3. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G and 56B.

電子輸送層５７までが形成された基板を第６の成膜室Ｒ３に移動し、第２の電極５８を成膜する。本実施形態では、第１の成膜室Ｒ３～第６の成膜室Ｒ３では真空蒸着によって各層の成膜を行う。しかし、本発明はこれに限定はされず、例えば第６の成膜室Ｒ３における第２の電極５８の成膜はスパッタによって成膜するようにしてもよい。その後、第２の電極５８までが形成された基板を封止装置に移動してプラズマＣＶＤによって保護層６０を成膜して（封止工程）、有機ＥＬ表示装置５０が完成する。なお、ここでは保護層６０をＣＶＤ法によって形成するものとしたが、これに限定はされず、ＡＬＤ法やインクジェット法によって形成してもよい。 The substrate on which the electron transport layer 57 is formed is moved to the sixth film forming chamber R3, and the second electrode 58 is formed. In this embodiment, each layer is formed by vacuum deposition in the first to sixth film formation chambers R3 to R3. However, the present invention is not limited to this, and for example, the deposition of the second electrode 58 in the sixth deposition chamber R3 may be performed by sputtering. After that, the substrate on which the second electrode 58 is formed is moved to a sealing device, and the protective layer 60 is formed by plasma CVD (sealing step), whereby the organic EL display device 50 is completed. Although the protective layer 60 is formed by the CVD method here, it is not limited to this, and may be formed by the ALD method or the inkjet method.

ここで、第１の成膜室Ｒ３～第６の成膜室Ｒ３での成膜は、形成されるそれぞれの層のパターンに対応した開口が形成されたマスクを用いて成膜される。成膜の際には、基板１００とマスクとの相対的な位置調整（アライメント）を行った後に、マスクの上に基板１００を載置して成膜が行われる。ここで、各成膜室において行われるアライメント工程は、上述のアライメント工程の通り行われる。 Here, films are formed in the first film-forming chamber R3 to the sixth film-forming chamber R3 using masks having openings corresponding to the patterns of the respective layers to be formed. During film formation, the substrate 100 is placed on the mask after relative positional adjustment (alignment) between the substrate 100 and the mask. Here, the alignment process performed in each film formation chamber is performed in the same manner as the alignment process described above.

＜他の実施形態＞
本発明は、上述の実施形態の１以上の機能を実現するプログラムを、ネットワーク又は記憶媒体を介してシステム又は装置に供給し、そのシステム又は装置のコンピュータにおける１つ以上のプロセッサがプログラムを読出し実行する処理でも実現可能である。また、１以上の機能を実現する回路（例えば、ＡＳＩＣ）によっても実現可能である。 <Other embodiments>
The present invention supplies a program that implements one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in the computer of the system or apparatus reads and executes the program. It can also be realized by processing to It can also be implemented by a circuit (for example, ASIC) that implements one or more functions.

発明は上記の実施形態に制限されるものではなく、発明の要旨の範囲内で、種々の変形・変更が可能である。 The invention is not limited to the above embodiments, and various modifications and changes are possible within the scope of the invention.

１０：基板、１００：基板キャリア、１２０：保持具、１２１：粘着部、１２１ａ：粘着面、１２１ｂ：反対面、１２５：押圧部 10: Substrate, 100: Substrate carrier, 120: Holder, 121: Adhesive part, 121a: Adhesive surface, 121b: Opposite surface, 125: Pressing part

Claims (14)

基板に貼り付く粘着面及び前記粘着面の反対側にある反対面を含み、可撓性を有する粘着部と、
基板を前記粘着部から剥離するための剥離部と、を備えた基板保持具であって、
前記剥離部は、前記粘着部の複数の位置を前記反対面の側から押圧する、
ことを特徴とする基板保持具。 a flexible adhesive part including an adhesive surface that sticks to a substrate and an opposite surface on the opposite side of the adhesive surface;
A substrate holder comprising a peeling portion for peeling the substrate from the adhesive portion,
The peeling section presses a plurality of positions of the adhesive section from the opposite surface side,
A substrate holder characterized by: 請求項１に記載の基板保持具であって、
前記剥離部は、前記複数の位置を同時に前記反対面の側から押圧する、
ことを特徴とする基板保持具。 The substrate holder according to claim 1,
The peeling section simultaneously presses the plurality of positions from the opposite surface side,
A substrate holder characterized by: 請求項１に記載の基板保持具であって、
前記剥離部は、
前記粘着部を前記反対面の側から押圧する複数の押圧部と、
前記複数の押圧部を前記粘着部に対して接離可能に変位させる変位部と、を含む、
ことを特徴とする基板保持具。 The substrate holder according to claim 1,
The peeling part is
a plurality of pressing portions that press the adhesive portion from the opposite side;
a displacement part that displaces the plurality of pressing parts so as to be able to contact and separate from the adhesive part,
A substrate holder characterized by: 請求項１に記載の基板保持具であって、
前記剥離部は、押圧動作の中で押圧位置が変化することにより、前記複数の位置を押圧する、
ことを特徴とする基板保持具。 The substrate holder according to claim 1,
The peeling unit presses the plurality of positions by changing the pressing position during the pressing operation,
A substrate holder characterized by: 請求項１に記載の基板保持具であって、
前記剥離部は、
前記粘着部を前記反対面の側から押圧する押圧部と、
前記押圧部を前記粘着部に対して接離可能に変位させる変位部と、を含み、
前記押圧部は、前記変位部による変位方向と交差する方向にも変位する部分を含む、
ことを特徴とする基板保持具。 The substrate holder according to claim 1,
The peeling part is
a pressing portion that presses the adhesive portion from the opposite side;
a displacement portion that displaces the pressing portion so as to be able to contact and separate from the adhesive portion;
The pressing portion includes a portion that is also displaced in a direction intersecting the displacement direction of the displacement portion,
A substrate holder characterized by: 請求項１に記載の基板保持具であって、
前記粘着部を前記反対面の側から支持し、前記粘着部に通じる貫通孔が形成される基材をさらに備え、
前記剥離部は、
前記貫通孔内に設けられ、前記粘着部を前記反対面の側から押圧する第１の部材と、
前記第１の部材と独立に設けられ、前記粘着部に対する接離方向に変位することにより前記第１の部材を変位させる第２の部材と、
前記第２の部材を前記接離方向に変位させる変位部と、を含み、
前記第１の部材は、前記接離方向と交差する方向にも変位可能である、
ことを特徴とする基板保持具。 The substrate holder according to claim 1,
further comprising a substrate supporting the adhesive portion from the opposite side and having a through hole formed therein leading to the adhesive portion;
The peeling part is
a first member that is provided in the through hole and presses the adhesive portion from the opposite side;
a second member that is provided independently of the first member and displaces the first member by being displaced in a contacting/separating direction with respect to the adhesive portion;
a displacement section that displaces the second member in the contact/separation direction,
The first member is also displaceable in a direction intersecting with the contact/separation direction.
A substrate holder characterized by: 請求項６に記載の基板保持具であって、
前記第１の部材は、前記粘着部を押圧する面の形状が曲面形状を含む、
ことを特徴とする基板保持具。 The substrate holder according to claim 6,
In the first member, the shape of the surface that presses the adhesive portion includes a curved surface shape,
A substrate holder characterized by: 請求項６に記載の基板保持具であって、
前記第１の部材は、球形状である、
ことを特徴とする基板保持具。 The substrate holder according to claim 6,
The first member has a spherical shape,
A substrate holder characterized by: 請求項６に記載の基板保持具であって、
前記第１の部材は、前記貫通孔に対して所定のクリアランスを有して前記貫通孔内に設けられる、
ことを特徴とする基板保持具。 The substrate holder according to claim 6,
The first member is provided in the through hole with a predetermined clearance with respect to the through hole,
A substrate holder characterized by: 請求項９に記載の基板保持具であって、
前記貫通孔は円筒形状であり、
前記第１の部材は球形状であり、
前記所定のクリアランスとして、前記貫通孔の直径と、前記第１の部材の直径との差が０．０５ｍｍ～１．０ｍｍに設定される、
ことを特徴とする基板保持具。 The substrate holder according to claim 9,
the through hole is cylindrical,
The first member has a spherical shape,
As the predetermined clearance, the difference between the diameter of the through hole and the diameter of the first member is set to 0.05 mm to 1.0 mm,
A substrate holder characterized by: 基板に貼り付く粘着面及び前記粘着面の反対側にある反対面を含み、可撓性を有する粘着部と、
前記粘着部を前記反対面の側から支持し、前記粘着部に通じる貫通孔が形成される基材と、
基板を前記粘着部から剥離するための剥離部と、を備えた基板保持具であって、
前記剥離部は、
前記貫通孔内に設けられ、前記粘着部を前記反対面の側から押圧する第１の部材と、
前記第１の部材と独立に設けられ、前記粘着部に対する接離方向に変位することにより前記第１の部材を変位させる第２の部材と、
前記第２の部材を前記接離方向に変位させる変位部と、を含み、
前記第１の部材は、前記基材に形成された貫通孔内に、前記貫通孔に対して所定のクリアランスを有して設けられる、
ことを特徴とする基板保持具。 a flexible adhesive part including an adhesive surface that sticks to a substrate and an opposite surface on the opposite side of the adhesive surface;
a base material that supports the adhesive part from the opposite side and has a through hole formed therein leading to the adhesive part;
A substrate holder comprising a peeling portion for peeling the substrate from the adhesive portion,
The peeling part is
a first member that is provided in the through hole and presses the adhesive portion from the opposite side;
a second member that is provided independently of the first member and displaces the first member by being displaced in a contacting/separating direction with respect to the adhesive portion;
a displacement section that displaces the second member in the contact/separation direction,
The first member is provided in a through hole formed in the base material with a predetermined clearance with respect to the through hole,
A substrate holder characterized by: 請求項１から１０までのいずれか１項に記載の基板保持具を複数有する基板保持装置。 A substrate holding device comprising a plurality of substrate holders according to any one of claims 1 to 10. 請求項１２に記載の基板保持装置と、
前記基板保持装置に保持された基板に対して成膜処理を行う成膜装置と、を備える、
ことを特徴とする成膜システム。 a substrate holding device according to claim 12;
a film forming device that performs a film forming process on the substrate held by the substrate holding device;
A deposition system characterized by: 請求項１２に記載の基板保持装置により基板を保持する工程と、
前記基板保持装置により保持された基板に対して成膜処理を行う工程と、
成膜処理が行われた後の基板を前記粘着部から剥離する工程と、
を含む、ことを特徴とする電子デバイスの製造方法。 holding a substrate by the substrate holding device according to claim 12;
a step of performing a film forming process on the substrate held by the substrate holding device;
A step of peeling the substrate after the film formation process from the adhesive part;
A method of manufacturing an electronic device, comprising:
JP2021087171A 2021-05-24 2021-05-24 Substrate holder, substrate holding device, film forming system, and electronic device manufacturing method Pending JP2022180205A (en)

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