JP2022176115A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022176115A5 JP2022176115A5 JP2022073029A JP2022073029A JP2022176115A5 JP 2022176115 A5 JP2022176115 A5 JP 2022176115A5 JP 2022073029 A JP2022073029 A JP 2022073029A JP 2022073029 A JP2022073029 A JP 2022073029A JP 2022176115 A5 JP2022176115 A5 JP 2022176115A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical formula
- group
- resin
- resin film
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims 27
- 239000011347 resin Substances 0.000 claims 25
- 229920005989 resin Polymers 0.000 claims 25
- 125000004432 carbon atom Chemical group C* 0.000 claims 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 12
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 5
- 125000005843 halogen group Chemical group 0.000 claims 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 5
- 239000011342 resin composition Substances 0.000 claims 5
- 125000003277 amino group Chemical group 0.000 claims 4
- 125000004427 diamine group Chemical group 0.000 claims 3
- 150000004985 diamines Chemical class 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 150000000000 tetracarboxylic acids Chemical group 0.000 claims 3
- 125000003368 amide group Chemical group 0.000 claims 2
- 125000004185 ester group Chemical group 0.000 claims 2
- 125000001033 ether group Chemical group 0.000 claims 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims 2
- 230000004580 weight loss Effects 0.000 claims 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims 1
- 229910001413 alkali metal ion Inorganic materials 0.000 claims 1
- 125000005103 alkyl silyl group Chemical group 0.000 claims 1
- 150000002391 heterocyclic compounds Chemical group 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021080840 | 2021-05-12 | ||
| JP2021080840 | 2021-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022176115A JP2022176115A (ja) | 2022-11-25 |
| JP2022176115A5 true JP2022176115A5 (https=) | 2025-04-11 |
Family
ID=84145399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022073029A Pending JP2022176115A (ja) | 2021-05-12 | 2022-04-27 | 樹脂膜、その製造方法、樹脂組成物、ディスプレイおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2022176115A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116217930A (zh) * | 2022-12-29 | 2023-06-06 | 上海邃铸科技有限公司 | 含稠环聚合物及其生产方法与应用 |
| WO2026071035A1 (ja) * | 2024-09-30 | 2026-04-02 | Ube株式会社 | ポリイミド前駆体組成物、ポリイミドフィルム、ポリイミドフィルム/基材積層体、フレキシブル電子デバイス、及び、フレキシブル電子デバイス基板 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110124806A1 (en) * | 2009-11-20 | 2011-05-26 | E.I. Du Pont De Nemours And Company | Dimensionally stable polyimides, and methods relating thereto |
| CN105073851B (zh) * | 2013-04-03 | 2018-08-28 | 三井化学株式会社 | 聚酰胺酸、包含该聚酰胺酸的清漆、以及聚酰亚胺膜 |
| CN111936553A (zh) * | 2018-03-28 | 2020-11-13 | 三菱瓦斯化学株式会社 | 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜 |
| JP2020158744A (ja) * | 2019-03-19 | 2020-10-01 | 三菱ケミカル株式会社 | ポリイミド及びポリイミドフィルム |
| US20230137230A1 (en) * | 2020-03-24 | 2023-05-04 | Toray Industries, Inc. | Resin composition, method for producing display device or light reception device using same, substrate and device |
| JP2020183540A (ja) * | 2020-07-09 | 2020-11-12 | Hdマイクロシステムズ株式会社 | 樹脂組成物及びポリイミド樹脂膜 |
-
2022
- 2022-04-27 JP JP2022073029A patent/JP2022176115A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022176115A5 (https=) | ||
| JP7376630B2 (ja) | 樹脂組成物、硬化物の製造方法、及び硬化物 | |
| JPH09278724A5 (https=) | ||
| JPWO2022220286A5 (https=) | ||
| JPH03275722A (ja) | 硬化性樹脂及びその製造方法 | |
| JP2019172970A5 (https=) | ||
| US9221849B2 (en) | Silane coupling agent, making method, primer composition, and coating composition | |
| JPS61243092A (ja) | シリルカルバメ−トおよびその製法 | |
| JP2022176116A5 (https=) | ||
| CN1090196C (zh) | 芳族聚碳化二亚胺和使用它的片材 | |
| JPWO2023223924A5 (https=) | ||
| JPH05194747A (ja) | 硬化性樹脂及びその製造方法並びに電子部品用保護膜 | |
| JP2023014999A5 (https=) | ||
| JPH08301971A (ja) | 低粘性、尿素基含有(環状)脂肪族ポリアミン、その製法、並びに該化合物からなるpur−反応ラック及び塗料組成物及び接着剤組成物用成分 | |
| JP2513096B2 (ja) | 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤 | |
| US12227531B2 (en) | Silylated organomodified compounds | |
| JP2023020948A5 (https=) | ||
| JPWO2021193530A5 (https=) | ||
| JP2874014B2 (ja) | 硬化性樹脂組成物及び電子部品用保護膜 | |
| JPWO2023074569A5 (https=) | ||
| JPH0931198A (ja) | シロキサン変性ポリアミドイミド樹脂の製造法 | |
| JP2005232211A (ja) | 架橋ポリフェニレン、その薄膜および薄膜の形成方法 | |
| JP2020522604A (ja) | 自己修復機能性ポリビニル系化合物及びその製造方法 | |
| US5109058A (en) | Curable resin solution compositions, their preparation, and electronic part protective coatings | |
| JP4538216B2 (ja) | ポリイミド前駆体、ポリイミド前駆体の製造方法、ポリイミド前駆体有機溶媒溶液の製造方法、キャスト膜の製造方法、及びポリイミド膜の製造方法。 |