JP2022168774A5 - - Google Patents

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Publication number
JP2022168774A5
JP2022168774A5 JP2021074481A JP2021074481A JP2022168774A5 JP 2022168774 A5 JP2022168774 A5 JP 2022168774A5 JP 2021074481 A JP2021074481 A JP 2021074481A JP 2021074481 A JP2021074481 A JP 2021074481A JP 2022168774 A5 JP2022168774 A5 JP 2022168774A5
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JP
Japan
Prior art keywords
terminal piece
copper foil
pad
gaming machine
board
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JP2021074481A
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English (en)
Japanese (ja)
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JP7526446B2 (ja
JP2022168774A (ja
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Priority claimed from JP2021074481A external-priority patent/JP7526446B2/ja
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Publication of JP2022168774A5 publication Critical patent/JP2022168774A5/ja
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JP2021074481A 2021-04-26 2021-04-26 遊技機 Active JP7526446B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021074481A JP7526446B2 (ja) 2021-04-26 2021-04-26 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021074481A JP7526446B2 (ja) 2021-04-26 2021-04-26 遊技機

Publications (3)

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JP2022168774A JP2022168774A (ja) 2022-11-08
JP2022168774A5 true JP2022168774A5 (enrdf_load_stackoverflow) 2023-10-03
JP7526446B2 JP7526446B2 (ja) 2024-08-01

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JP2021074481A Active JP7526446B2 (ja) 2021-04-26 2021-04-26 遊技機

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JP (1) JP7526446B2 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222268A (ja) 2005-02-10 2006-08-24 Pioneer Electronic Corp 電子回路用基板
JP2018157166A (ja) 2017-03-21 2018-10-04 サミー株式会社 回路基板アセンブリ及び製造方法
JP6721560B2 (ja) 2017-11-21 2020-07-15 株式会社三共 遊技機
JP7167894B2 (ja) 2019-10-04 2022-11-09 株式会社三洋物産 遊技機
JP7341432B2 (ja) 2020-11-05 2023-09-11 株式会社大一商会 遊技機

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