JP2022146217A - Substrate processing apparatus - Google Patents

Abstract

To provide a substrate processing apparatus capable of determining the presence or absence of an abnormality in a substrate processing portion in a short data collection time.SOLUTION: A substrate processing apparatus 1 includes a substrate processing unit 3 including a motor 3b, a regenerative power conversion unit 60 that converts regenerative energy generated from the motor 3b into electric energy, and a control unit 50 that determines abnormality of the substrate processing unit 3 on the basis of power value data of the regenerative power obtained by the regenerative power conversion unit 60.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing apparatus.

2. Description of the Related Art Conventionally, there has been known a substrate processing apparatus that performs chemical mechanical polishing (CMP) to flatten the surface of a substrate such as a silicon wafer. This substrate processing apparatus includes, as substrate processing sections, a polishing section that polishes a substrate and a cleaning section that cleans and dries the polished substrate. Further, the substrate processing apparatus is equipped with various sensors in order to detect an abnormality in each substrate processing section. The substrate processing apparatus reports the occurrence of the abnormality by, for example, displaying an error on the display device when the sensor detects the occurrence of the problem.

In the substrate processing apparatus described in Patent Literature 1 below, in order to efficiently identify a location where a defect has occurred, a collection unit for collecting error information output from a defect detection unit installed in each part of the substrate processing apparatus; a selection unit that selects image data corresponding to the error information collected by the collection unit from among a plurality of image data that are provided in advance according to the type of error information; a display processing unit for displaying on a display device, wherein the plurality of image data include an image simulating at least a part of the substrate processing apparatus and an image for specifying a defect occurrence location of the substrate processing apparatus. include.

Further, the substrate processing apparatus described in Patent Literature 2 below performs enhanced equipment quality assurance (EEQA) efficiently. and an apparatus quality assurance control section that acquires apparatus operation data of the substrate processing section and performs abnormality determination based on the apparatus operation data.

JP 2015-88591 A JP 2017-112212 A

By the way, in the conventional technology described above, the data during the operation of the substrate processing unit is acquired, and the abnormality determination is performed based on the data during the operation. For this reason, data is continuously collected while the substrate processing unit is in operation, and it is impossible to determine the presence or absence of an abnormality in a short data collection time. In addition, depending on the type of abnormality in the substrate processing unit, it may be difficult to determine the abnormality based only on the data during operation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate processing apparatus capable of determining the presence or absence of an abnormality in a substrate processing section in a short data collection time.

A substrate processing apparatus according to an aspect of the present invention includes a substrate processing unit including a motor, a regenerative power conversion unit that converts regenerative energy generated from the motor into electrical energy, and regenerative power obtained by the regenerative power conversion unit. and a control unit that determines whether the substrate processing unit is abnormal based on the power value data.

In the substrate processing apparatus, the control unit stores past history data of power value data of the regenerative power, and performs abnormality determination of the substrate processing unit by comparing with the past history data. good too.

The substrate processing apparatus includes a sensor unit that acquires process data including the power consumption of the motor associated with the operation of the substrate processing unit, and the control unit further controls the process data based on the process data obtained by the sensor unit. Abnormality determination of the substrate processing section may be performed.

In the above substrate processing apparatus, the control unit stores past history data of the process data obtained by the sensor unit, and determines an abnormality of the substrate processing unit by comparing with the past history data. you can go

In the substrate processing apparatus, the control section may stop the operation of the substrate processing section when determining that the substrate processing section is abnormal.

The substrate processing apparatus may further include a notification section that issues an error when the control section determines that the substrate processing section is abnormal.

In the above substrate processing apparatus, the control unit includes a learning unit that learns whether or not an abnormality has occurred in the substrate processing unit based on power value data of regenerative power obtained by the regenerative power conversion unit; A determination unit may be provided that determines whether the substrate processing unit is abnormal based on the learning result of the learning unit and the input power value data of the regenerated power.

According to the aspect of the present invention, it is possible to determine whether there is an abnormality in the substrate processing section in a short data collection time until the motor decelerates and stops.

1 is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment; FIG. It is a block diagram which shows the structure regarding the abnormality determination of the substrate processing apparatus which concerns on one Embodiment. 1 is a conceptual diagram showing an abnormality determination system for a substrate processing apparatus according to one embodiment; FIG. 1 is a conceptual diagram showing the entirety of an abnormality determination system including a plurality of substrate processing apparatuses according to one embodiment; FIG. 6 is a flow chart showing processing of abnormality determination of the substrate processing apparatus according to one embodiment.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1 according to one embodiment.
A substrate processing apparatus 1 shown in FIG. 1 is a chemical mechanical polishing (CMP) apparatus that polishes the surface of a substrate W such as a silicon wafer to a flat surface. This substrate processing apparatus 1 includes a rectangular box-shaped housing 2 . The housing 2 is formed in a substantially rectangular shape in plan view.

The housing 2 has a longitudinally extending board transfer path 2a in its center. A loading/unloading section 10 is arranged at one end in the longitudinal direction of the substrate transport path 2a. A polishing section 20 is provided on one side of the substrate transport path 2a in the width direction (a direction orthogonal to the longitudinal direction in plan view), and a cleaning section 30 is provided on the other side. A substrate transport section 40 for transporting the substrate W is provided on the substrate transport path 2a. The substrate processing apparatus 1 also includes a control section 50 that controls operations of the loading/unloading section 10 , the polishing section 20 , the cleaning section 30 , and the substrate transfer section 40 .

The loading/unloading section 10 includes a front loading section 11 in which substrates W are accommodated. A plurality of front load portions 11 are provided on one side surface of the housing 2 in the longitudinal direction. A plurality of front loading portions 11 are arranged in the width direction of the housing 2 . The front loading unit 11 is loaded with, for example, an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF and FOUP are sealed containers that contain cassettes of substrates W inside and are covered with partition walls, and can maintain an environment independent of the external space.

In addition, the loading/unloading section 10 includes two transport robots 12 for loading and unloading substrates W from the front loading section 11, and a traveling mechanism 13 for running each of the transport robots 12 along the front loading section 11. . Each transport robot 12 has two upper and lower hands, which are used before and after the substrate W is processed. For example, when returning the substrate W to the front loading section 11, the upper hand is used, and when taking out the substrate W before processing from the front loading section 11, the lower hand is used.

The polishing section 20 includes a plurality of substrate polishing apparatuses 21 (21A, 21B, 21C, 21D) that polish (flatten) the substrate W. As shown in FIG. A plurality of substrate polishing apparatuses 21 are arranged in the longitudinal direction of the substrate transport path 2a. A substrate polishing apparatus 21 includes a polishing table 23 that rotates a polishing pad 22 having a polishing surface, and a top ring 24 that holds a substrate W and polishes the substrate W while pressing the substrate W against the polishing pad 22 on the polishing table 23 . , a polishing liquid supply nozzle 25 for supplying a polishing liquid or a dressing liquid (for example, pure water) to the polishing pad 22, a dresser 26 for dressing the polishing surface of the polishing pad 22, and a liquid (for example, pure water). and an atomizer 27 for spraying a mixed fluid of gas (eg, nitrogen gas) or liquid (eg, pure water) in the form of a mist onto the polishing surface.

The substrate polishing apparatus 21 presses the substrate W against the polishing pad 22 by the top ring 24 while supplying the polishing liquid onto the polishing pad 22 from the polishing liquid supply nozzle 25, and further moves the top ring 24 and the polishing table 23 relative to each other. Thereby, the substrate W is polished to flatten its surface. The dresser 26 has hard particles such as diamond particles and ceramic particles fixed to a rotating portion at the tip thereof that contacts the polishing pad 22. By rotating and swinging the rotating portion, the entire polishing surface of the polishing pad 22 is covered. Dress evenly to form a flat polished surface.
The atomizer 27 cleans the polishing surface by washing away polishing debris, abrasive grains, etc. remaining on the polishing surface of the polishing pad 22 with a high-pressure fluid, and performs dressing of the polishing surface by the dresser 26, which is in mechanical contact, that is, polishing. achieve surface regeneration.

The cleaning unit 30 includes a plurality of substrate cleaning devices 31 (31A, 31B) that clean the substrates W, and a substrate drying device 32 that dries the cleaned substrates W. As shown in FIG. A plurality of substrate cleaning devices 31 and substrate drying devices 32 are arranged in the longitudinal direction of the substrate transport path 2a. A first transfer chamber 33 is provided between the substrate cleaning device 31A and the substrate cleaning device 31B. The first transfer chamber 33 is provided with a transfer robot 35 that transfers the substrate W between the substrate transfer section 40, the substrate cleaning device 31A, and the substrate cleaning device 31B. A second transfer chamber 34 is provided between the substrate cleaning device 31B and the substrate drying device 32 . In the second transfer chamber 34, a transfer robot 36 that transfers the substrate W between the substrate cleaning device 31B and the substrate drying device 32 is provided.

The substrate cleaning device 31A and the substrate cleaning device 31B include, for example, a roll sponge type cleaning module, and scrub clean the substrate W. FIG. The substrate cleaning device 31A and the substrate cleaning device 31B may be of the same type or different types of cleaning modules, for example, a pencil sponge type cleaning module or a two-fluid jet type cleaning module. may The substrate drying device 32 includes, for example, a drying module that performs Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). After drying, the shutter 1a provided on the partition wall between the substrate drying device 32 and the loading/unloading section 10 is opened, and the substrate W is taken out from the substrate drying device 32 by the transfer robot 12. FIG.

The substrate transfer section 40 includes a lifter 41 , a first linear transporter 42 , a second linear transporter 43 and a swing transporter 44 . The substrate transport path 2a has a first transport position TP1, a second transport position TP2, a third transport position TP3, a fourth transport position TP4, a fifth transport position TP5, and a sixth transport position in order from the load/unload section 10 side. A position TP6 and a seventh transport position TP7 are set.

The lifter 41 is a mechanism for vertically transporting the substrate W at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the loading/unloading section 10 at the first transport position TP1. Also, the lifter 41 transfers the substrate W received from the transport robot 12 to the first linear transporter 42 . A partition wall between the first transfer position TP1 and the load/unload section 10 is provided with a shutter 1b. Passed.

The first linear transporter 42 is a mechanism that transports the substrate W between the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4. The first linear transporter 42 includes a plurality of transport hands 45 (45A, 45B, 45C, 45D) and a linear guide mechanism 46 that horizontally moves each transport hand 45 at a plurality of heights.
The transport hand 45A is moved by the linear guide mechanism 46 between the first transport position TP1 and the fourth transport position TP4. The transport hand 45A is a pass hand for receiving the substrate W from the lifter 41 and transferring it to the second linear transporter 43. As shown in FIG.

The transport hand 45B is moved by the linear guide mechanism 46 between the first transport position TP1 and the second transport position TP2. The transport hand 45B receives the substrate W from the lifter 41 at the first transport position TP1, and transfers the substrate W to the substrate polishing apparatus 21A at the second transport position TP2. The transport hand 45B is provided with an elevation driving unit, and is raised when the substrate W is transferred to the top ring 24 of the substrate polishing apparatus 21A, and is lowered after the substrate W is transferred to the top ring 24. The transport hand 45C and the transport hand 45D are also provided with similar up-and-down driving units.

The transport hand 45</b>C is moved between the first transport position TP<b>1 and the third transport position TP<b>3 by the linear guide mechanism 46 . The transport hand 45C receives the substrate W from the lifter 41 at the first transport position TP1, and transfers the substrate W to the substrate polishing apparatus 21B at the third transport position TP3. The transfer hand 45C also functions as an access hand that receives the substrate W from the top ring 24 of the substrate polishing apparatus 21A at the second transfer position TP2 and transfers the substrate W to the substrate polishing apparatus 21B at the third transfer position TP3.

The transport hand 45</b>D is moved between the second transport position TP<b>2 and the fourth transport position TP<b>4 by the linear guide mechanism 46 . The transport hand 45D receives the substrate W from the top ring 24 of the substrate polishing apparatus 21A or 21B at the second transport position TP2 or the third transport position TP3, and transfers the substrate W to the swing transporter 44 at the fourth transport position TP4. Acts as an access hand for passing

The swing transporter 44 has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5, and transfers the substrate W from the first linear transporter 42 to the second linear transporter 43. . Also, the swing transporter 44 transfers the substrate W polished by the polishing section 20 to the cleaning section 30 . A temporary placement table 47 for the substrate W is provided on the side of the swing transporter 44 . The swing transporter 44 inverts the substrate W received at the fourth transport position TP4 or the fifth transport position TP5 and places it on the temporary placement table 47 . The substrate W placed on the temporary placement table 47 is transferred to the first transfer chamber 33 by the transfer robot 35 of the cleaning section 30 .

The second linear transporter 43 is a mechanism that transports the substrate W between the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7. The second linear transporter 43 includes a plurality of transport hands 48 (48A, 48B, 48C) and a linear guide mechanism 49 that horizontally moves each transport hand 48 at a plurality of heights. The transport hand 48A is moved by the linear guide mechanism 49 between the fifth transport position TP5 and the sixth transport position TP6. The transport hand 45A functions as an access hand that receives the substrate W from the swing transporter 44 and transfers it to the substrate polishing apparatus 21C.

The transport hand 48B moves between the sixth transport position TP6 and the seventh transport position TP7. The transport hand 48B functions as an access hand for receiving the substrate W from the substrate polishing apparatus 21C and transferring it to the substrate polishing apparatus 21D. The transport hand 48C moves between the seventh transport position TP7 and the fifth transport position TP5. The transport hand 48C receives the substrate W from the top ring 24 of the substrate polishing apparatus 21C or 21D at the sixth transport position TP6 or the seventh transport position TP7, and transfers the substrate W to the swing transporter 44 at the fifth transport position TP5. Acts as an access hand for passing Although the description is omitted, the operation of the transport hand 48 when transferring the substrate W is the same as the operation of the first linear transporter 42 described above.

Next, a configuration related to abnormality determination of the substrate processing apparatus 1 described above will be described.

FIG. 2 is a block diagram showing a configuration related to abnormality determination of the substrate processing apparatus 1 according to one embodiment. FIG. 3 is a conceptual diagram showing an abnormality determination system for the substrate processing apparatus 1 according to one embodiment. FIG. 4 is a conceptual diagram showing the overall abnormality determination system when a plurality of substrate processing apparatuses 1 according to one embodiment are provided.
As shown in FIG. 2, the substrate processing apparatus 1 includes a substrate processing section 3 (the aforementioned loading/unloading section 10, polishing section 20, cleaning section 30, and substrate transfer section 40), a control section 50, regenerative power A conversion unit 60 , a sensor unit 70 , and a notification unit 80 are provided.

As shown in FIG. 3, the regenerative power conversion section 60 converts regenerative energy generated from the motor 3b of the substrate processing section 3 into electrical energy. The electrical energy is used, for example, as an AC power source 90 to drive the motor 3b via the motor driver 3a. The electrical energy may be used as a standby power source by charging a secondary battery or the like, or may be used as electric power for operating the sensor section 70, the notification section 80, and the like. Approximately 80 motors 3b exist in one substrate processing apparatus 1 of the present embodiment, and the regenerative power conversion unit 60 converts regenerative energy generated from each motor 3b into electrical energy.

A regenerative power conversion unit 60 provided in the loading/unloading unit 10 converts, for example, regenerative energy generated from various motors 3b that drive the transport robot 12, the travel mechanism 13, etc., into electrical energy. A regenerative power conversion unit 60 provided in the polishing unit 20 converts regenerative energy generated from various motors 3b that drive the polishing table 23, the top ring 24, the polishing liquid supply nozzle 25, the dresser 26, the atomizer 27, etc., for example. Convert to electrical energy.

Further, the regenerative power conversion unit 60 provided in the cleaning unit 30 converts, for example, regenerative energy generated from various motors 3b that drive the cleaning module of the substrate cleaning device 31 and the drying module of the substrate drying device 32 into electrical energy. do. Further, the regenerative power conversion unit 60 provided in the substrate transfer unit 40 is generated from various motors 3b that drive the lifter 41, the first linear transporter 42, the second linear transporter 43, the swing transporter 44, etc., for example. Convert regenerative energy into electrical energy.

Returning to FIG. 2 , the sensor unit 70 is composed of various sensors for obtaining process data including the power consumption of the motor 3 b associated with the operation of the substrate processing unit 3 . The process data includes at least the power consumption of the motor 3b, and the other data includes, for example, cleaning section processing process data and polishing section processing process data. The cleaning unit processing process data includes, for example, the cleaning speed, the ON/OFF timing of the wafer presence/absence sensor, and the like. Polishing part processing process data includes, for example, polishing speed, limit sensor (ON/OFF timing), pressing pressure of cleaning member, slurry flow rate, chemical flow rate, pure water flow rate, polishing time, EPD (End Point Detector). ) sensor, EPD detection time, ON/OFF timing of the wafer presence/absence sensor, and the like.

The control unit 50 includes a CPU, a memory, an interface, and the like. The CPU executes arithmetic processing for executing various functions of the control unit 50 . The memory includes ROM, RAM and non-volatile memory. A program for controlling the functions of the control unit 50 is stored in the ROM. The RAM is used to temporarily store output values of various sensors, calculation results of the CPU, and the like. The memory stores a control program for creating commands for the substrate processing section 3 and the notification section 80, various parameters, and the like.

As shown in FIG. 3, the control section 50 includes an edge PC 50a provided in each substrate processing section 3. As shown in FIG. Data such as regenerative power and power consumption of the motor 3b are input to the edge PC 50a from the regenerative power conversion/communication device 61 of the regenerative power conversion section 60 provided in the substrate processing section 3. FIG. The control unit 50 determines whether or not the substrate processing unit 3 is abnormal based on these data.

The controller 50 outputs a stop command from the device PLC 50b that controls the operation of the substrate processing unit 3 when the abnormality determination of the substrate processing unit 3 is “yes”. Further, the edge PC 50a issues an operation command to the device PC 81 of the notification unit 80, displays a screen regarding the abnormality, and reports the abnormality to the host PC 100 (see FIG. 4). As shown in FIG. 4, when substrate processing apparatuses 1A to 1X are present, the host PC 100 is connected to each of the substrate processing apparatuses 1A to 1X and receives an abnormality report from each of the substrate processing apparatuses 1A to 1X.

Returning to FIG. 2 , the control section 50 includes a command section 51 , a learning section 52 and a determination section 53 .
The command unit 51 outputs operation commands to the substrate processing unit 3 and the notification unit 80 . Command unit 51 creates an operation command according to an operation program and parameters stored in a memory (not shown). The command unit 51 corresponds to, for example, the device PLC 50b shown in FIG.

The learning unit 52 learns whether or not an abnormality has occurred in the substrate processing unit 3 based on the power value data of the regenerative power obtained by the regenerative power conversion unit 60 . Further, the learning unit 52 of this embodiment learns whether or not an abnormality has occurred in the substrate processing unit 3 based on the process data obtained by the sensor unit 70 .

The determination unit 53 determines whether the substrate processing unit 3 is abnormal based on the learning result of the learning unit 52 and the power value data of the regenerative power input from the regenerative power conversion unit 60 . Further, the determination unit 53 of the present embodiment performs abnormality determination of the substrate processing unit 3 based on the process data input from the sensor unit 70 .

The abnormality determination of the substrate processing apparatus 1 will be specifically described below with reference to FIG.

FIG. 5 is a flow chart showing the abnormality determination process of the substrate processing apparatus 1 according to one embodiment.
As shown in FIG. 5, when the processing process of the substrate processing apparatus 1 is started, each substrate processing section 3 (the aforementioned load/unload section 10, polishing section 20, cleaning section 30, and The motor 3b of the substrate transfer section 40) starts rotating (step S1). The sensor unit 70 acquires process data including the power consumption of the motor 3b accompanying the operation of the substrate processing unit 3 (step S2).

The regenerative power conversion unit 60 converts regenerative energy generated from the motor 3b into electric energy when the motor 3b of the substrate processing unit 3 decelerates or stops (step S3). The electrical energy is reused as power for the AC power supply 90 or the like. In addition, the regenerative power conversion unit 60 provides power value data of regenerative power to the control unit 50 via the regenerative power conversion/communication device 61 .

The control unit 50 acquires power value data of the regenerative power obtained by the regenerative power conversion unit 60 (step S4). Then, the control unit 50 performs abnormality determination (primary determination) of the substrate processing unit 3 based on the power value data of the regenerated power. Specifically, the control unit 50 determines whether or not the power value data of the regenerated power has changed based on a predetermined threshold value (step S5). The predetermined threshold may be set based on the past history data of the power value data of the regenerated power stored in the control unit 50 . It should be noted that the determination in step S5 is to be one of three patterns: greater than or equal to a predetermined threshold value, less than or equal to a predetermined threshold value, and out of range.

If the determination in step S5 is "NO", the flow is terminated assuming that there is no abnormality in the operation of the motor 3b. On the other hand, if the determination in step S5 is "YES", it is considered that some change has occurred in the operation of the motor 3b from the change in the power value data of the regenerated power, so the process proceeds to step S6.

In step S<b>6 , the control unit 50 performs abnormality determination (secondary determination) of the substrate processing unit 3 based on the process data obtained by the sensor unit 70 . Specifically, the control unit 50 determines whether or not the process data has changed based on a predetermined threshold value. The predetermined threshold may be set based on past history data of process data stored in the control unit 50 . It should be noted that the determination in step S6 is made to be one of three patterns: greater than or equal to a predetermined threshold value, less than or equal to a predetermined threshold value, and out of range.

If the determination in step S6 is "NO", there is no change in the process data, but there is a change in the power value data of the regenerative power. Efficiency information, health check information, necessity of maintenance of the motor 2b, replacement of expendable parts, etc. are reported.

On the other hand, if the determination in step S6 is "YES", it is assumed that both the power value data of the regenerative power and the process data have changed, so that an abnormality that should be dealt with immediately has occurred, and the process proceeds to step S7. , the control unit 50 stops the operation of the substrate processing unit 3 (processing process stop). Further, the control unit 50 issues an operation command to the notification unit 80 to issue an error, thereby informing the administrator or the like that an abnormality has occurred in the substrate processing unit 3 .

After step S7, the controller 50 notifies the host PC 100 of the content of the change in the process data. On the premise that the power value data of the regenerative power has changed, the control unit 50 notifies the host PC 100 of the maintenance and consumption of the motor 3b when the power consumption and the process data of the speed of the motor 3b change. Report the parts replacement confirmation.

Further, on the premise that the power value data of the regenerative power has changed, the control unit 50 further assumes that when the process data of the ON/OFF timing of the limit sensor and the ON/OFF timing of the wafer presence/absence sensor change, Report failure confirmation of limit sensor and wafer presence/absence sensor.

Further, on the premise that there is a change in the power value data of the regenerative power, the control unit 50 further processes the pressing pressure, the slurry flow rate, the chemical flow rate, the pure water flow rate, the polishing time, the EPD sensor, and the EPD detection time. When the data changes, the abnormality confirmation of the processed wafer (film thickness) and the abnormality confirmation of the processing process (pressure gauge, flow meter, EPD sensor) are reported.

After completing the report to the host PC 100 in step S8, the control unit 50 performs pattern learning based on the input power value data and process data of the regenerated power (step S9). By machine learning in step S9, the control unit 50 changes the power value data of the regenerative power and the weight related to the abnormality determination set in the various process data, corrects the threshold value, and feeds it back.

In step S9, the control unit 50 may use a known learning model such as "supervised learning", "unsupervised learning", or "reinforcement learning". A neural network may also be used as a value function approximation algorithm in "supervised learning," "unsupervised learning," and "reinforcement learning." Learning may also be performed according to other known methods, such as genetic programming, functional logic programming, support vector machines, and the like. When "reinforcement learning" is used as the learning model for the abnormality determination of the substrate processing unit 3, algorithms such as Q-learning, Sarsa, and Monte Carlo method may be used.

As described above, the flow of abnormality determination of the substrate processing apparatus 1 ends.

As described above, the substrate processing apparatus 1 of the present embodiment described above includes the substrate processing section 3 having the motor 3b, the regenerative power conversion section 60 converting the regenerative energy generated from the motor 3b into electrical energy, and the regenerative power conversion section and a control unit 50 for performing an abnormality determination of the substrate processing unit 3 based on the power value data of the regenerated power obtained by 60 . According to this configuration, it is possible to determine whether there is an abnormality in the substrate processing section 3 in a short data collection time until the motor 3b decelerates and stops. In addition, since the time required for the motor 3b to decelerate and stop increases or decreases due to wear of the bearings of the motor 3b, it is possible to detect abnormalities such as wear of the bearings that are difficult to determine while the motor 3b is in operation. .

Further, in the present embodiment, the control unit 50 stores past history data of the power value data of the regenerative power, and in step S5, from comparison with the past history data (predetermined threshold value), the substrate Abnormality determination of the processing unit 3 is performed. According to this configuration, it is possible to improve the accuracy of abnormality determination of the substrate processing section 3 .

Further, in this embodiment, the sensor unit 70 is provided to acquire process data including the power consumption of the motor 3b associated with the operation of the substrate processing unit 3. In step S6, the control unit 50 further acquires Abnormality determination of the substrate processing unit 3 is performed based on the obtained process data. According to this configuration, it is possible to determine the content of the abnormality that has occurred in the substrate processing section 3 .

Further, in the present embodiment, the control unit 50 stores past history data of the process data obtained by the sensor unit 70, and in step S6, comparison with the past history data (predetermined threshold value) is performed. Then, the abnormality judgment of the substrate processing section 3 is performed. According to this configuration, it is possible to improve the accuracy of abnormality determination of the substrate processing section 3 .

Further, in the present embodiment, when the control unit 50 determines that the substrate processing unit 3 is abnormal, the operation of the substrate processing unit 3 is stopped in step S7. According to this configuration, when the health check determines that there is an abnormality, the target processing process can be terminated.

Further, in the present embodiment, a notification unit 80 that issues an error when the control unit 50 determines that the substrate processing unit 3 is abnormal is provided. According to this configuration, the administrator of the substrate processing apparatus 1 or the like can be notified of the occurrence of an abnormality.

In the present embodiment, the control unit 50 also includes a learning unit 52 that learns whether or not an abnormality has occurred in the substrate processing unit 3 based on power value data of regenerative power obtained by the regenerative power conversion unit 60. , and a determination unit 53 that determines an abnormality of the substrate processing unit 3 based on the learning result of the learning unit 52 and the input power value data of the regenerated power. According to this configuration, machine learning can be used to correct and update the weights and thresholds of various data related to abnormality determination, and the accuracy of abnormality determination of the substrate processing unit 3 can be improved.

While the preferred embodiments of the invention have been described and described, it is to be understood that they are illustrative of the invention and should not be considered limiting. Additions, omissions, substitutions, and other modifications may be made without departing from the scope of the invention. Accordingly, the invention should not be viewed as limited by the foregoing description, but rather by the claims appended hereto.

For example, in the above embodiment, abnormality determination of the substrate processing unit 3 is performed based on power value data of regenerative power obtained by the regenerative power conversion unit 60 and process data obtained by the sensor unit 70. , the abnormality determination of the substrate processing unit 3 may be performed only based on the power value data of the regenerated power.

Further, for example, in the above embodiment, machine learning is performed in step S9, but machine learning may not be performed.

DESCRIPTION OF SYMBOLS 1... Substrate processing apparatus 1a... Shutter 1b... Shutter 2... Housing 2a... Substrate conveyance path 2b... Motor 3... Substrate processing part 3a... Motor driver 3b... Motor 6... Step 10... Anne Loading part 11 Front loading part 12 Transport robot 13 Traveling mechanism 20 Polishing part 21 Substrate polishing device 22 Polishing pad 23 Polishing table 24 Top ring 25 Polishing liquid supply Nozzle 26 Dresser 27 Atomizer 30 Cleaning unit 31 Substrate cleaning device 32 Substrate drying device 33 First transfer chamber 34 Second transfer chamber 35 Transfer robot 36 Transfer robot , 40... Substrate transport unit, 41... Lifter, 42... First linear transporter, 43... Second linear transporter, 44... Swing transporter, 45... Transport hand, 46... Linear guide mechanism, 47... Temporary placing table, 48... Conveying hand 49... Linear guide mechanism 50... Control unit 50a... Edge PC 50b... Apparatus PLC 51... Command unit 52... Learning unit 53... Decision unit 60... Regenerative power conversion unit 61... Regenerative power conversion/communication device 70 Sensor unit 80 Notification unit 81 Device PC 90 AC power supply 100 Host PC TP1 First transport position TP2 Second transport position TP3 Third Transfer position TP4... Fourth transfer position TP5... Fifth transfer position TP6... Sixth transfer position TP7... Seventh transfer position W... Substrate

Claims (7)

a substrate processing unit having a motor;
a regenerative power conversion unit that converts regenerative energy generated from the motor into electric energy;
A substrate processing apparatus comprising: a control section that determines an abnormality of the substrate processing section based on power value data of the regenerated power obtained by the regenerative power conversion section. 3. The control unit stores past history data of the power value data of the regenerative power, and performs an abnormality determination of the substrate processing unit based on comparison with the past history data. 2. The substrate processing apparatus according to 1. a sensor unit that acquires process data including the power consumption of the motor associated with the operation of the substrate processing unit;
3. The substrate processing apparatus according to claim 1, wherein said control section further determines abnormality of said substrate processing section based on process data obtained by said sensor section. The control unit stores past history data of the process data obtained by the sensor unit, and performs abnormality determination of the substrate processing unit based on comparison with the past history data. The substrate processing apparatus according to claim 3. 5. The substrate processing apparatus according to claim 1, wherein the control unit stops the operation of the substrate processing unit when determining that the substrate processing unit is abnormal. 6. The substrate processing apparatus according to any one of claims 1 to 5, further comprising a reporting unit that issues an error when said control unit determines that said substrate processing unit is abnormal. The control unit
a learning unit that learns whether or not an abnormality has occurred in the substrate processing unit based on the power value data of the regenerative power obtained by the regenerative power conversion unit;
7. The apparatus according to any one of claims 1 to 6, further comprising a determination unit that determines whether the substrate processing unit is abnormal based on the learning result of the learning unit and the input power value data of the regenerated power. The substrate processing apparatus according to item 1.

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