JP2022123483A - Floor panel and method for manufacturing the same - Google Patents

Abstract

To provide a thin floor panel which enables the temperature of its upper surface to rise uniformly in a short time and has high heating efficiency.SOLUTION: A floor panel is formed by laminating a base material, an insulating layer and a heat insulation layer in this order, has wiring made of a plating layer formed on a surface opposite to the heat insulation layer of the insulating layer, and generates heat by energizing the wiring.SELECTED DRAWING: Figure 1

Description

Applied for application of Article 30, Paragraph 2 of the Patent Act Nov. 25-Dec. 25, 2020 “EcoPro Online 2020” sponsored by Nikkei Inc. and Sustainable Management Promotion Organization

The present invention relates to a floor panel and its manufacturing method.

2. Description of the Related Art In recent years, in buildings such as buildings, a double floor called an OA floor, a free access floor, or the like, in which a space for wiring of OA equipment is provided between a base floor and an upper floor, has been widely adopted. When floor heating is performed in such a double-bottomed building, a floor heater or the like is conventionally used in which a heater is installed under the floor panel (upper floor). However, the floor heater reduces the heating efficiency by dissipating heat to the base floor. There are problems such as the narrow space between the base floor and the upper floor, and improvements have been desired.

Patent Document 1 discloses a floor panel with a heater function that constitutes a free access floor, and includes a frame that houses a sheet-like heater and a heat equalizing plate by forming a convex shape on four sides of the upper surface of the panel base, It describes a floor panel with a heater function in which a heat equalizing plate is not fixed in the frame, and that a carbon heater is preferable as the sheet heater. In Patent Document 1, such a floor panel has a sheet-shaped heater attached to the floor panel surface (upper surface), so that the floor surface is efficiently warmed, and a heat equalizing plate that spreads the heat of the heater evenly is a sheet. It also protects the heater and prevents the heater from being damaged. The heat equalizing plate is placed in the frame of the floor panel and is stored without fixing, so the heat equalizing plate will not be distorted due to the heat of the heater. It is described that it is possible to prevent unevenness and to provide a floor panel free from irregularities and rattling. However, in this floor panel, the rate of temperature rise of the upper surface of the floor panel was still low, and the temperature difference between the central portion and the peripheral portion was large. Furthermore, since the floor panel described in Patent Document 1 has a sheet-like heater, it is thicker than a general floor panel that does not have a heater. Therefore, when both are used in combination, it is necessary to adjust the thickness at the time of manufacturing or construction so as not to cause a step, resulting in an increase in cost.

JP 2014-101718 A

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a thin floor panel whose upper surface is uniformly heated in a short time and whose heating efficiency is high, and a simple manufacturing method thereof.

The above problem is that a substrate, an insulating layer, and a heat insulating layer are laminated in this order, a wiring made of a plating layer is formed on the surface of the insulating layer facing the heat insulating layer, and heat is generated by energizing the wiring. , is solved by providing a floor panel.

It is preferable that the heat insulating layer is made of a wooden material. It is also preferable that the substrate is made of a steel plate. Preferably, the insulating layer is a resin layer, more preferably, the insulating layer includes an electrodeposition coating layer, the insulating layer further includes a powder coating layer, and the substrate, the electrodeposition coating layer and the powder are More preferably, the body coating layers are laminated in this order.

It is preferable that an interface between the insulating layer and the plating layer is roughened. It is also preferable that a groove is formed in the surface of the insulating layer and that the groove is filled with the plating layer.

The above problem is to form the insulating layer by coating the surface of the base material with a resin, and perform electroless plating to form the plated layer on the surface of the insulating layer, thereby forming the base material and the heat insulating material. It is also solved by providing a method for manufacturing the floor panel by laminating the above.

In the manufacturing method, a pulse laser is applied to a partial region of the surface of the insulating layer to roughen the surface of the region, and the electroless plating is performed to form the plating layer on the surface of the region. preferably.

Further, the above-mentioned problem is to provide a method for manufacturing the floor panel, in which a wiring made of the plating layer is formed on the surface of the resin film by performing electroless plating, and the base material, the resin film and the heat insulating material are laminated. It can also be resolved by providing

In the floor panel of the present invention, the temperature of the entire upper surface is uniformly raised in a short time, and the heat radiation from the lower surface to the base floor or the like is suppressed, so that the heating efficiency is high. Further, the floor panel is easy to be thin because it generates heat by the wiring made of the extremely thin plated layer. According to the manufacturing method of the present invention, such a floor panel can be manufactured easily.

FIG. 2 is an exploded perspective view of the floor panel of Example 1 as viewed obliquely from below; FIG. 2 is an exploded perspective view of the floor panel of Example 1 as viewed obliquely from above; FIG. 4 is a diagram showing a floor heater of Comparative Example 1; 4 is a thermographic image of the upper surface of the floor panel 60 minutes after the start of energization in Example 1 and Comparative Example 1. FIG.

In the floor panel of the present invention, a base material, an insulating layer, and a heat insulating layer are laminated in this order, a wiring made of a plating layer is formed on the surface of the insulating layer facing the heat insulating layer, and the wiring is energized. heat is generated by A major feature of the present invention is that the wiring composed of the extremely thin plating layer is directly formed on the surface of the insulating layer. Since the wiring composed of the insulating layer and the plating layer is extremely thin, the floor panel of the present invention has the same thickness as existing floor panels that do not have a heater function. Therefore, when the floor panel of the present invention is used as the upper floor of a double floor such as an OA floor or a free access floor, a wide space is secured between the base floor and the upper floor. Further, heat generated by energizing the wiring is transmitted to the entire upper surface of the substrate in a short period of time, and heat radiation to the base floor is suppressed by the heat insulating layer, so that the heating efficiency is high.

FIG. 1 is an exploded perspective view of a floor panel of Example 1, which will be described later, viewed diagonally from below, and FIG. 2 is an exploded perspective view of the floor panel of Example 1, viewed from diagonally above. Description will be made below with reference to FIGS. 1 and 2. FIG. From the viewpoint of high durability and thermal conductivity, the substrate 2 is preferably a metal plate such as a steel plate, a copper plate, an aluminum plate, or a stainless steel plate, and more preferably a steel plate. The thickness of the base material 2 is usually 0.1 to 10 mm.

From the viewpoint of improving corrosion resistance, it is preferable that a galvanized layer is formed on the surface of the steel sheet. The galvanized layer may be formed on either one of the upper surface and the lower surface of the steel sheet, or may be formed on both surfaces. It is preferable that the galvanized layer is formed on the upper surface of the steel sheet. When forming an electrodeposition coating layer, which will be described later, on the lower surface of the steel sheet, it is preferable that a galvanized layer is not formed on the lower surface. The galvanized layer can be formed by a general hot dip galvanizing method.

The insulating layer 3 is arranged under the base material 2 . The type of the insulating layer 3 is not particularly limited as long as it can prevent electric leakage from the wiring 4 . Examples of the insulating layer 3 include a resin layer, a ceramic layer, a glass layer (glass sheet, glass coat, etc.), etc. Among them, a resin layer is preferable. The resin contained as a main component in the resin layer includes polyimide, epoxy polyester, polyvinyl chloride, polyolefin (PE, PP, etc.), polyamide, polyester (PET, etc.), polyurethane, epoxy resin, acrylic, liquid crystal polymer, fluororesin. (PTFE, PFA, etc.), polycarbonate, etc., among which polyimide and epoxy polyester are preferred, and polyimide is more preferred. Here, the main component means a component contained in the resin layer in an amount of 50% by mass or more. The resin layer can be formed by coating the substrate 2 with a resin, as will be described later. Moreover, as described later, a resin film formed in advance can also be used as the resin layer.

Although the thickness of the insulating layer 3 is not particularly limited, it is preferably 5 to 2000 μm. If the thickness of the insulating layer 3 is less than 5 μm, the insulating properties may be insufficient. The thickness is more preferably 10 µm or more, and even more preferably 20 µm or more. On the other hand, if the thickness exceeds 2000 μm, the temperature rise rate of the upper surface of the floor panel 1 may decrease. The thickness is more preferably 1000 μm or less, more preferably 500 μm or less, particularly preferably 500 μm or less, most preferably 300 μm or less.

A wiring 4 made of a plating layer is formed on the surface of the insulating layer 3 facing the heat insulating layer 5 . By forming a thin plating layer directly on the surface of the insulating layer 3 in this manner, the temperature rise rate of the upper surface of the floor panel 1 is improved and the thickness of the floor panel 1 can be easily reduced. The floor panel 1 of the present invention generates heat by energizing the wiring 4 made of the plating layer. Since the amount of heat generated at this time is proportional to the square of the current and the electrical resistance of the wiring, it is preferable that the plated layer has a certain degree of electrical resistance and is excellent in heat resistance. From such a viewpoint, the plating layer is nickel, zinc, cobalt, iron, platinum, tin, lead, iridium, rhodium, chromium, bismuth, cadmium, palladium, indium, gold, tungsten, molybdenum, and from the group consisting of alloys thereof At least one selected is preferred. The alloy as used herein means a material containing 50% by mass or more of at least one of the above metal elements. Preferred alloys include nichrome and the like.

From the viewpoint of the balance between electrical resistance and heat resistance, it is more preferable that the plating layer is at least one selected from the group consisting of nickel, zinc, cobalt, iron, platinum, tin and alloys thereof. From the viewpoint that a plating layer can be easily formed by an electroless plating method, it is more preferable that the plating layer is at least one selected from the group consisting of nickel, cobalt, iron, and alloys thereof. .

The plating layer preferably has a thickness of 0.1 to 500 μm. If the thickness of the plating layer is less than 0.1 μm, disconnection may occur. The thickness of the plated layer is more preferably 0.5 μm or more, still more preferably 1 μm or more, and particularly preferably 2 μm or more. On the other hand, if the thickness of the plating layer exceeds 500 μm, the manufacturing cost of the floor panel 1 may increase. The thickness of the plating layer is more preferably 250 μm or less, still more preferably 100 μm or less, particularly preferably 50 μm or less, and most preferably 30 μm or less.

The width of the wiring 4 made of the plating layer is preferably 0.2 to 50 mm. If the width is less than 0.2 mm, disconnection may occur. The width is more preferably 0.5 mm or more, and even more preferably 1 mm or more. On the other hand, if the width exceeds 50 mm, there is a possibility that the required plating thickness cannot be ensured. The width is more preferably 20 mm or less, even more preferably 10 mm or less.

The pattern of the wiring 4 made of the plating layer formed on the surface of the insulating layer 3 is not particularly limited, but from the viewpoint of uniformly increasing the temperature of the entire upper surface of the floor panel 1, the wiring is formed on the entire surface of the floor panel 1. 4 is preferably formed. The wiring 4 made of the plated layer is easily formed at any position on the surface of the insulating layer 3 .

A heat insulating layer 5 is arranged under the insulating layer 3 . The type of the heat insulating layer 5 is not particularly limited as long as it has high heat insulating properties and strength enough to support the load from above. As the heat insulating layer 5, a heat insulating material such as wood, mortar, resin, ceramics, glass, gypsum, etc. is used, and wood is preferable because it has high heat insulating properties and strength and is excellent in terms of the environment. Examples of the wooden material include particle board, plywood, MDF (medium density fiberboard), HDF (high density fiberboard), etc. Among them, particle board is preferable.

The thickness of the heat insulating layer 5 is usually 1 to 50 mm. If the thickness is less than 1 mm, the resulting floor panel 1 may have insufficient heat insulation and strength. The thickness is preferably 2 mm or more, more preferably 3 mm or more. On the other hand, if the thickness exceeds 50 mm, the manufacturing cost of the floor panel 1 may increase, or the space between the floor panel 1 and the base floor may become narrow. The thickness is preferably 30 mm or less, more preferably 20 mm or less.

The heat insulating layer 5 has a hole 9 for connecting a connecting portion 8 of the wiring 4 on the surface of the insulating layer 3 to an external power source, thermostat, fuse, or the like, or for installing a thermostat, fuse, or thermistor. may be formed.

From the viewpoint of further improving the strength and durability of the floor panel 1 , it is preferable that the protective layer 6 is arranged below the heat insulating layer 5 . A metal plate is preferable as the protective layer 6 . As the metal plate, the one described above as the one used as the base material 2 is used. When a steel plate having a galvanized layer formed on its surface is used as the metal plate, the galvanized layer is preferably formed on the lower side of the steel plate. A hole 10 may be formed in the protective layer 6 for connecting a connecting portion 8 of the wiring 4 on the surface of the insulating layer 3 to an external power source, thermostat or fuse, thermistor, or the like.

The floor panel 1 may have layers other than the base material 2, the insulating layer 3, the heat insulating layer 5, and the protective layer 6 as long as the effects of the present invention are not impaired. In order to make the thickness of the floor panel 1 thinner, it is preferable that the other layer is not provided.

Although the method for manufacturing the floor panel 1 of the present invention is not particularly limited, the surface of the base material 2 is coated with a resin to form the insulating layer 3, and the surface of the insulating layer 3 is plated. A method of forming the layer 4 and laminating the base material 2 and the heat insulating material is preferable. As the plating method, electroless plating, which will be described later, is preferable.

From the viewpoint of improving the adhesion between the base material 2 and the insulating layer 3, the base material 2 may be pretreated before coating. Examples of pretreatment include chemical conversion treatment, zinc plating layer removal treatment, etching treatment, blasting treatment, and primer treatment. It is preferable to form unevenness on the surface of the substrate 2 by pretreatment.

The method of coating the resin on the surface of the base material 2 is not particularly limited, and includes electrodeposition coating, powder coating, spray coating, dip coating, etc. Electrodeposition coating and powder coating are preferred, and electrodeposition coating is preferred. more preferred. Electrodeposition coating involves applying a voltage to the base material 2 and electrodes in an electrolytic solution containing the resin to be coated or its precursor to adhere the resin or its precursor to the surface of the base material 2. It is a method of forming a coating film by heat-treating if necessary after drying. Further, powder coating is a method of forming a coating film by applying a powdery resin to the substrate 2 by static electricity and then heat-treating it as necessary. General conditions are adopted as the conditions for electrodeposition coating and powder coating. These methods may be used in combination. Examples of the resin to be coated include those described above as the resin contained in the resin layer.

It is preferable that the insulating layer 3 includes a coating layer formed by the coating method. By arranging the wiring 4 made of the plated layer through the thin coating layer directly formed on the surface of the base material 2, the temperature rise rate of the upper surface of the floor panel 1 is further improved. More preferably, the insulating layer 3 consists of only the coating layer. The coating layer preferably includes at least one of an electrodeposition coating layer and a powder coating layer, and more preferably consists of at least one of the electrodeposition coating layer and the powder coating layer. From the viewpoint of forming the insulating layer 3 with a uniform thickness, it is preferable that the coating layer includes an electrodeposition coating layer. At this time, it is more preferable that an electrodeposition coating layer is formed on the surface of the substrate 2 . As the resin contained in the electrodeposition coating layer, polyimide, epoxy resin, acryl, polyurethane, polyamide, and fluororesin are preferable. From the viewpoint of further improving insulation, the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, and the substrate 2, the electrodeposition coating layer and the powder coating layer are laminated in this order. is preferred. As the resin contained in the powder coating layer, epoxy-polyester, epoxy resin, polyester, polyurethane, polyamide, and fluororesin are preferable.

When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, the thickness of the electrodeposition coating layer is preferably 5 to 500 μm. If the thickness is less than 5 μm, the insulating properties may deteriorate. The thickness is more preferably 10 µm or more, and even more preferably 20 µm or more. On the other hand, if the thickness exceeds 500 μm, the temperature rise rate of the upper surface of the floor panel 1 may decrease. The thickness is more preferably 300 μm or less, further preferably 200 μm or less, particularly preferably 150 μm or less, and most preferably 100 μm or less.

When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, the powder coating layer preferably has a thickness of 10 to 1500 μm. If the thickness is less than 10 μm, the insulating properties may deteriorate. The thickness is more preferably 50 μm or more, and even more preferably 100 μm or more. On the other hand, if the thickness exceeds 1500 μm, the temperature rise rate of the upper surface of the floor panel 1 may decrease. The thickness is more preferably 1000 μm or less, more preferably 500 μm or less, particularly preferably 300 μm or less, and most preferably 200 μm or less.

Wiring 4 made of the plating layer is formed on the surface of the insulating layer 3 by plating. The method of forming the wiring 4 is not particularly limited, but since it is easy to deal with various wiring patterns and the occurrence of defective products is low, by irradiating a part of the surface of the insulating layer 3 with a laser, A method of forming the wiring 4 made of the plating layer on the surface of the region by performing electroless plating after roughening the surface of the region is preferable.

A region on the surface of the insulating layer 3 where the wiring 4 is to be formed is irradiated with a laser to roughen the surface of the region. In the floor panel 1, it is preferable that the interface between the insulating layer 3 and the plating layer is roughened. By roughening the interface, the adhesion between the insulating layer 3 and the plating layer is improved.

Although the laser irradiation method is not particularly limited, it is preferable to irradiate the region with a pulse laser in order to efficiently roughen the surface of the insulating layer 3 . Usually, the pulse width (second) of the pulse laser is 1×10 ⁻¹⁸ seconds or more and 1×10 ⁻⁴ seconds or less, the frequency is 1 to 10000 kHz, and the average output at the processing point is 0.01 to 1000 W. be. The type of laser is also not particularly limited, and solid lasers such as YAG lasers, fiber lasers and semiconductor lasers; and gas lasers such as carbon dioxide lasers and excimer lasers can be used. The wavelength of the pulse laser is not particularly limited, and can be appropriately set depending on the type of the insulating layer 3, and is usually 100 to 12000 nm.

It is preferable that grooves be formed in the surface of the insulating layer 3 and that the grooves be filled with the plating layer. As a result, the wiring 4 made of the plating layer is less likely to be damaged, and the temperature rise rate of the upper surface of the floor panel 1 is further increased. A method for forming the grooves is not particularly limited, but a method of forming grooves on the surface of the insulating layer 3 by irradiating the surface of the insulating layer 3 with a laser can be used. It is preferable to roughen the interface of the insulating layer 3 and form the grooves at the same time by irradiating the surface of the coating layer 3 with a laser.

It is preferable that the groove has a depth of 0.1 to 1000 μm. If the groove depth is less than 0.1 μm, the plated layer may easily come off the groove. The depth of the groove is more preferably 1 μm or more, and even more preferably 5 μm or more. On the other hand, if the groove depth exceeds 1000 μm, the cost for forming the groove may increase. The depth of the groove is more preferably 300 μm or less, and even more preferably 100 μm or less.

The thickness of the insulating layer 3 at the bottom of the groove is preferably 5 to 1000 μm. If the thickness is less than 5 μm, the insulating layer 3 may be perforated and lose its insulating properties. The thickness is more preferably 20 μm or more, and even more preferably 30 μm or more. On the other hand, if the thickness exceeds 1000 μm, the temperature rise rate of the upper surface of the floor panel 1 may decrease. The thickness is more preferably 500 μm or less, still more preferably 400 μm or less, particularly preferably 300 μm or less, and most preferably 200 μm or less. When the insulating layer 3 includes an electrodeposition coating layer and a powder coating layer, and the substrate 2, the electrodeposition coating layer and the powder coating layer are laminated in this order, the bottom of the groove is the electrodeposition coating layer. It is preferable not to reach the coating layer. That is, it is preferable that the insulating layer 3 at the bottom of the groove includes an electrodeposition coating layer and a powder coating layer, and the plating layer is formed on the surface of the powder coating layer.

By performing electroless plating on the laser-irradiated region of the insulating layer 3, the wiring 4 made of the plated layer is formed on the surface of the region. An electroless plating catalyst is adhered to the surface of the insulating layer 3 . The electroless plating catalyst is not particularly limited as long as it contains a metal element having a catalytic action on the electroless plating solution. The metal elements include palladium (Pd), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), iron (Fe), cobalt (Co), zinc (Zn), and gold (Au). , platinum (Pt), tin (Sn), and the like. These metal elements can be appropriately selected according to the type of electroless plating solution. The insulating layer 3 can be treated with an aqueous solution containing the metal element and then treated with an aqueous solution containing a reducing agent to activate the electroless plating catalyst.

It is preferable to selectively remove the catalyst adhering to the portion not irradiated with the laser or selectively deactivate the catalyst before plating. As these specific methods, the methods described in [0044] to [0050] of JP-A-2020-113469 are employed.

By performing electroless plating, the plating layer is formed in the region irradiated with the laser. Electroless plating may be performed multiple times. Electrolytic plating may be further performed after electroless plating. When plating is performed multiple times, the types of plating layers to be formed may be the same or different. For example, in consideration of the solderability between the wiring 4 and the terminal, a copper plating layer, a gold plating layer, a silver plating layer, a tin plating layer, or the like may be further formed on the connection portion 8 to which the terminal is connected in the wiring 4. can.

As a method of forming the wiring 4 made of the plating layer on the surface of the insulation layer 3 by performing electroless plating, the insulation layer 3 is formed so that only the portion where the plating layer is to be formed is exposed. A method of forming the wiring 4 made of the plating layer by performing electroless plating after masking the surface is also preferable. In this case, from the viewpoint of cost reduction, it is preferable that the insulating layer 3 consists only of the electrodeposition coating layer.

After forming the wiring 4 made of the plating layer on the surface of the insulating layer 3 , a protective layer may be formed on the surfaces of the insulating layer 3 and the wiring 4 . In this case, from the viewpoint of protecting the wiring 4, it is preferable that the thickness of the plating layer and the depth of the groove be the same, or that the thickness of the plating layer be smaller than the depth of the groove. The types of protective layers formed on the surfaces of the insulating layer 3 and the wiring 4 are not particularly limited, and examples of the insulating layer 3 include those described above, and among them, a resin layer and a glass layer (glass sheet, glass coat, etc.). is preferred.

After the wiring 4 made of the plating layer is formed on the surface of the insulating layer 3, the base material 2 and the heat insulating material are laminated. At this time, the insulating layer 3 formed on the base material 2 and the heat insulating material are laminated so as to face each other. It is preferable to bond the insulating layer 3 and the heat insulating material using an adhesive, an adhesive sheet, or the like.

When the protective layer 6 is placed under the heat insulating layer 5, it is preferable to bond the two together using an adhesive, an adhesive sheet, or the like. Moreover, from the viewpoint of the strength and durability of the floor panel 1, it is preferable that the base material 2 and the protective layer 6 are integrated. As a method for integrating the base material 2 and the protective layer 6, the peripheral edge part 7 of at least one of the base material 2 and the protective layer 6 is bent, and the peripheral edge parts are crimped to each other to integrate them. A method of making

As the method for manufacturing the floor panel of the present invention, it is also preferable to perform electroless plating to form a wiring made of the plating layer on the surface of the resin film, and laminate the base material, the resin film and the heat insulating material. .

Examples of the resin used for the resin film include those mentioned above as the resin used for the insulating layer 3, and among them, polyimide, polyester (PET), polyolefin, epoxy, polyester, and fluorine resin (PTFE) are preferable. As a method of forming the wiring composed of the plating layer on the surface of the resin film, the method of forming the plating layer on the surface of the insulating layer (coating layer) described above is adopted. The base material, the resin film on which the wiring made of the plating layer is formed, and the heat insulating material are laminated. At this time, the surface of the resin film on which the wiring is not formed faces the substrate, and the surface of the resin film on which the wiring is formed faces the heat insulating material. It is preferable that the substrate and the resin film are adhered with an adhesive or an adhesive sheet.

The floor panel 1 obtained in this manner generates heat when a power source, a thermostat, a fuse, etc. are connected to the connection portion 8 of the wiring 4 and then energized. The wiring 4 can be arranged over the entire surface of the floor panel 1, and the wiring 4 composed of the insulating layer 3 and the plating layer is extremely thin, and the distance from the wiring 4 to the top surface of the floor panel 1 is short. The entire top surface of the In addition, heat radiation to the base floor is suppressed by the heat insulating layer 5 . Therefore, the floor panel 1 has very high heating efficiency. Furthermore, the floor panel 1 has the same thickness as existing floor panels that do not have a heater function. Therefore, when the floor panel 1 is used in combination, there is no need to adjust the thickness at the time of manufacturing or construction so as not to cause a step, and it is compatible with existing floor panels, resulting in an increase in cost. The floor panel 1 can be freely laid out while suppressing the In addition, it is possible to easily change the layout after construction. The floor panel 1 of the present invention is suitably used as floors of buildings such as buildings and houses, for example, upper floors of double floors such as OA floors and free access floors, floors of washrooms and bathrooms, and the like.

EXAMPLES Hereinafter, the present invention will be described more specifically using examples.

Example 1
Substrate 2 (length of one side: 510 mm, thickness: 0.5 mm) made of a substantially square galvanized steel sheet with galvanized layers formed on both surfaces is etched on one side to form unevenness, and then polyimide is applied. By electrodeposition coating, an electrodeposition coating layer having a thickness of 50 μm was formed on the surface of the substrate. Further, an epoxy-polyester powder coating was applied to the surface of the electrodeposition coating layer to form a powder coating layer having a thickness of 70 to 150 μm. Thus, an insulating layer 3 composed of an electrodeposition coating layer and a powder coating layer was formed on the surface of the substrate 2 .

Using a fiber laser marker "ML-7350DL-3D" manufactured by Amada Weld Tech Co., Ltd., the surface of the powder coating layer is irradiated with laser (wavelength: 1064 nm, frequency: 50 kHz, output: 20 W). A groove pattern of 13 μm and 1.5 mm in width was formed, and the bottom surface of the groove was roughened.

By performing electroless plating (pretreatment, electroless plating catalyst adhesion treatment, catalyst removal treatment, activation treatment and electroless Ni plating treatment) by the method described in the example of JP 2020-113469, the groove A wiring 4 made of an electroless Ni-plated layer having a thickness of 11.5 μm and a width of 1.5 μm was formed on the bottom surface of the substrate.

The surface of the base material 2 on which the wiring 4 is formed and the particle board (thermal insulation layer 5) of a substantially square shape (length of one side: 470 mm, thickness: 18 mm) were bonded together using an adhesive. . Further, the surface of the particle board to which the base material 2 was not laminated was laminated with an adhesive to a substantially square galvanized steel sheet (protective layer 6) in which the peripheral portion 7 was bent upward. Furthermore, the base material 2 and the galvanized steel sheet were integrated by caulking the peripheral edge portions thereof. Thus, the floor panel 1 shown in FIGS. 1 and 2 was obtained. A tile carpet was laminated on the entire upper surface of the floor panel 1, and a power source, a thermostat and a fuse were connected to the connection portions 8 of the wirings 4 of the floor panel 1. A power of 50 W (200 V (AC) with the resistance between both ends of the wiring set to 800 Ω) was applied to the wiring 4, and the temperature change at this time was measured by thermography. It took 12 minutes for the temperature at the center of the tile carpet to rise by 10°C. A thermographic image 60 minutes after the start of energization is shown in FIG. 4 (right view in FIG. 4). As can be seen from FIG. 4, it was confirmed that the temperature of the entire tile carpet was uniformly raised. When the temperature at the center of the floor carpet was controlled at 38° C. and the electricity was applied for 12 hours, the power consumption was reduced by 30% or more compared to the case of using the floor heater of Comparative Example 1, which will be described later.

Example 2
Electrodeposition coating of polyimide is applied to the non-galvanized surface of a substrate (side length: 500 mm, thickness: 0.5 mm) made of a substantially square galvanized steel sheet with a galvanized layer formed only on one side. Thus, an electrodeposition coating layer having a thickness of 50 μm was formed. The surface of the electrodeposition coating layer was masked with silicone rubber so that the portion where the wiring pattern was to be formed was exposed. Electroless plating was carried out in the same manner as in Example 1, except that the masked base material was not subjected to the catalyst removal treatment. Wiring was formed from an electroless Ni plating layer of 0.5 mm. The wiring pattern formed at this time is the same as that of the first embodiment. In the same manner as in Example 1, the base material, the particle board (heat insulating layer) and the galvanized steel sheet (protective layer) were pasted together and then crimped to obtain a floor panel. When the obtained floor panel was energized in the same manner as in Example 1, it took 12 minutes for the temperature at the center of the tile carpet laminated on the upper surface of the floor panel to rise by 10°C. When the temperature change of the tile carpet at this time was measured by thermography, it was confirmed that the temperature of the entire surface was uniformly raised.

Example 3
In order to expose the part where the wiring pattern is to be formed, the surface of a substantially square polyimide film "7413D" (470 mm long, 450 mm wide, 65 μm total thickness, 25 μm film thickness) made by 3M (with adhesive) was covered. Masked with silicone rubber. By performing electroless plating on the masked polyimide film in the same manner as in Example 2, a wiring consisting of an electroless Ni plating layer having a thickness of 11.5 μm and a width of 1.5 mm was formed on the surface of the polyimide film. did. A substrate (length of one side: 510 mm, thickness: 0.5 mm) made of a substantially square galvanized steel sheet having a galvanized layer formed only on one side, a surface on which no galvanized layer is formed, and the wiring of the polyimide film. The surface on which the film was not formed was adhered using an adhesive. In the same manner as in Example 1, the base material, the particle board (heat insulating layer) and the galvanized steel sheet (protective layer) were pasted together and then crimped to obtain a floor panel. When the obtained floor panel was energized in the same manner as in Example 1, it took 15 minutes for the temperature at the center of the tile carpet laminated on the upper surface of the floor panel to rise by 10°C. When the temperature change of the tile carpet at this time was measured by thermography, it was confirmed that the temperature of the entire upper surface was uniformly raised.

Comparative example 1
A tile carpet was laminated on top of a conventional floor heater, shown in FIG. Electric power of 50 W was applied to the floor heater, and the temperature change at this time was measured by thermography. It took 60 minutes for the temperature at the center of the tile carpet to rise by 10°C. A thermographic image 60 minutes after the start of energization is shown in FIG. 4 (left view in FIG. 4). As shown in FIG. 4, the temperature of the peripheral portion was significantly lower than that of the central portion of the tile carpet. In addition, when the temperature in the center of the floor carpet was controlled to 38° C. and the electricity was applied for 12 hours, the power consumption was measured and compared with Example 1 as described above. Floor panel 1 consumes less power by 30% or more. It is thought that the heat from the heater 12 was difficult to reach the upper surface of the floor panel 11 and was easily dissipated to the base floor 13, resulting in high power consumption, a long time required to raise the temperature, and large temperature unevenness on the surface of the floor carpet. be done.

REFERENCE SIGNS LIST 1 floor panel 2 base material 3 insulating layer 4 wiring 5 heat insulating layer 6 protective layer 7 peripheral portion 8 connection portion 9, 10 hole 11 floor panel 12 heater 13 base floor

Claims (11)

A floor panel comprising a substrate, an insulating layer, and a heat insulating layer laminated in this order, a wiring made of a plating layer formed on a surface of the insulating layer facing the heat insulating layer, and generating heat when the wiring is energized. 2. The floor panel of claim 1, wherein said insulating layer is made of wood material. 3. A floor panel according to claim 1 or 2, wherein the base material is made of steel plate. 4. The floor panel according to claim 1, wherein said insulating layer is a resin layer. 5. The floor panel of claim 4, wherein said insulating layer comprises an electrocoat layer. 6. The floor panel according to claim 5, wherein said insulating layer further includes a powder coating layer, and said substrate, said electrodeposition coating layer and said powder coating layer are laminated in this order. 7. The floor panel according to claim 1, wherein an interface between said insulating layer and said plating layer is roughened. 8. The floor panel according to claim 1, wherein grooves are formed in the surface of said insulating layer, and said grooves are filled with said plating layer. forming the insulating layer by coating a resin on the surface of the base material;
forming the plated layer on the surface of the insulating layer by performing electroless plating;
The method for manufacturing a floor panel according to any one of claims 1 to 8, wherein the base material and a heat insulating material are laminated. Roughening the surface of the region by irradiating a partial region of the insulating layer surface with a pulsed laser;
10. The method of manufacturing a floor panel according to claim 9, wherein the plated layer is formed on the surface of the region by performing the electroless plating. By performing electroless plating to form a wiring made of the plating layer on the surface of the resin film,
The method for manufacturing a floor panel according to any one of claims 1 to 4, wherein the base material, the resin film and the heat insulating material are laminated.

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