JP2022123283A - Light-emitting device - Google Patents

Abstract

To suppress breakage of a connection conductive portion caused by static electricity charged in a sealing portion.SOLUTION: A first ground region 322 is located inside a region sealed by a sealing portion 200. A first conductive region 132a is located on a negative-direction side in an X direction with respect to a light emitting region 142. The first conductive region 132a covers at least a part of the first ground region 322. Further, the first conductive region 132a is in contact with the at least a part of the first ground region 322. Therefore, the first conductive region 132a is electrically connected to a ground conductive portion 320. As a result, the first conductive region 132a is grounded.SELECTED DRAWING: Figure 6

Description

The present invention relates to light emitting devices.

In a light-emitting device, a light-emitting portion such as an organic light-emitting diode (OLED) may be sealed with a sealing portion. For example, as described in Patent Document 1, the sealing portion may be made of a conductive material such as SUS304.

JP-A-2002-198173

Seals that are electrically conductive may be charged with static electricity. If the static electricity charged in the sealing portion flows to the connecting conductive portion that supplies voltage to each electrode of the light emitting portion, the connecting conductive portion may break. When a ground conductive portion such as a ground line is provided, static electricity accumulated in the sealing portion can flow to the ground conductive portion rather than to the connection conductive portion. However, if the ground conductive portion is only provided, for example, if the electrical insulation of the ground conductive portion is relatively high due to the oxide film formed on the surface of the ground conductive portion, the static electricity accumulated in the sealing portion cannot be connected to the ground conductive portion. It may not be possible to flow to the ground conductive part than the part.

One example of the problem to be solved by the present invention is to suppress the breakage of the connection conductive portion due to the static electricity accumulated in the sealing portion.

The invention according to claim 1,
a substrate;
a light emitting unit located on the substrate;
a conductive sealing portion that seals the light emitting portion;
a connecting conductive portion located on the substrate and electrically connected to the light emitting portion;
a ground conductive portion located on the substrate;
a first conductive portion electrically connected to the ground conductive portion;
A light-emitting device comprising

1 is a plan view of a light emitting device according to an embodiment; FIG. FIG. 2 is a diagram in which a plurality of second electrodes, first conductive parts, second conductive parts, and third conductive parts are removed from FIG. 1; 2 is an enlarged view of a portion of the light emitting region shown in FIG. 1; FIG. 4 is a diagram in which a plurality of organic layers, a plurality of second electrodes, and a plurality of first barrier ribs are removed from FIG. 3; FIG. 5 is a view of FIG. 4 with the first insulating layer removed; FIG. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1; FIG. 2 is a cross-sectional view taken along the line BB of FIG. 1;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

As used herein, the phrase "A is positioned on B" means, for example, that A is positioned directly on B with no other element (e.g., layer) positioned between A and B. or that another element (eg, layer) is partially or wholly located between A and B. Furthermore, expressions indicating orientation such as "up", "down", "left", "right", "front" and "back" are basically used in conjunction with the orientation of the drawings. The inventions described in the specification should not be construed as limited to the orientation of use.

In this specification, the expression "A and B overlap" means that at least part of A is in the same place as at least part of B in a projected image from a certain direction, unless otherwise specified. At this time, the plurality of elements may be in direct contact with each other, or may be separated from each other.

In this specification, the expression "outside of A" means the portion on the side where A is not located across the edge of A, unless otherwise specified.

The anode herein refers to an electrode that injects holes into a layer containing a light emitting material (e.g., an organic layer), and the cathode refers to an electrode that injects electrons into a layer containing a light emitting material. . The terms "anode" and "cathode" may also refer to other terms such as "hole-injection electrode" and "electron-injection electrode" or "positive electrode" and "negative electrode".

As used herein, the expression "edge of A" means the boundary between A and other elements when viewed from one direction, and the expression "edge of A" refers to the part of A that includes the boundary. and the expression "end point of A" means a point on the boundary.

The term "light-emitting device" as used herein includes devices having light-emitting elements such as displays and lighting. In some cases, the “light emitting device” also includes wiring, an IC (integrated circuit), a housing, or the like that is directly, indirectly, or electrically connected to the light emitting element.

As used herein, the term "connection" refers to a state in which a plurality of elements are directly or indirectly connected. For example, even when a plurality of elements are connected via an adhesive or a joining member, the expression "the plurality of elements are connected" may be used. In addition, when there is a member capable of supplying or transmitting current, voltage or potential between multiple elements, and "the multiple elements are electrically connected", simply "the multiple elements are connected It is sometimes expressed as

In this specification, unless otherwise specified, expressions such as "first, second, A, B, (a), (b)" are for distinguishing elements, and the expressions indicate the essence of the element. , order, order, number, or the like is not limited.

In this specification, each member and each element may be singular or plural. provided, however, that this is not the case where the context makes clear "singular" or "plural".

As used herein, the expression "A contains B" means that A is not limited to being composed of only B, and that A can be composed of elements other than B, unless otherwise specified. .

In this specification, unless otherwise specified, the term "cross section" means a plane that appears when the light-emitting device is cut in the direction in which pixels, light-emitting materials, etc. are stacked.

The terms “does not have,” “does not include,” “is not located in,” etc. herein may mean that an element is completely excluded or that an element has no technical effect. It may mean that it exists to the extent that it does not have

In this specification, expressions describing temporal context such as "after", "following", "next", and "before" represent relative temporal relationships. , and the elements for which the temporal context is used are not necessarily consecutive. Expressions such as “immediately” or “directly” may be used to express that each element is continuous.

As used herein, the expression "A covers B" means that A touches B with no other element (e.g., layer) between A and B, unless otherwise specified. or that another element (eg, layer) is partially or wholly located between A and B.

FIG. 1 is a plan view of a light emitting device 10 according to an embodiment. FIG. 2 is a diagram in which a plurality of second electrodes 130, first conductive portions 132, second conductive portions 134, and third conductive portions 136 are removed from FIG. FIG. 3 is an enlarged view of a portion of light emitting region 142 shown in FIG. FIG. 4 is a diagram in which the plurality of organic layers 120, the plurality of second electrodes 130 and the plurality of first barrier ribs 160 are removed from FIG. FIG. 5 is a diagram of FIG. 4 with the first insulating layer 150 removed. FIG. 6 is a cross-sectional view taken along line AA of FIG. FIG. 7 is a cross-sectional view along BB in FIG.

The light emitting device 10 includes a substrate 100, a plurality of first electrodes 110, a plurality of organic layers 120, a first organic portion 122, a plurality of second organic portions 124, a plurality of second electrodes 130, a first conductive portion 132, a plurality of a second conductive portion 134, a third conductive portion 136, a first insulating layer 150, a second insulating layer 152, a plurality of first partition walls 160, a second partition wall 162, a sealing portion 200, a circuit portion 300, a connecting conductive portion 310, and A ground conductive portion 320 is provided. As shown in FIGS. 6 and 7, substrate 100 has a first side 102 and a second side 104 . a plurality of first electrodes 110, a plurality of organic layers 120, a first organic portion 122, a plurality of second organic portions 124, a plurality of second electrodes 130, a first conductive portion 132, a plurality of second conductive portions 134, a third The conductive portion 136, the first insulating layer 150, the second insulating layer 152, the plurality of first partition walls 160, the second partition walls 162, the sealing portion 200, the circuit portion 300, the connection conductive portion 310, and the ground conductive portion 320 are It is located on the surface 102 side. The second surface 104 is located opposite the first surface 102 .

Note that the sealing portion 200 is not shown in FIG. In addition, in FIG. 1, boundaries between the plurality of second electrodes 130, first conductive portions 132, second conductive portions 134, and third conductive portions 136 are not illustrated. 2, the plurality of first electrodes 110, the plurality of organic layers 120, the first organic portion 122, the plurality of second organic portions 124, the first insulating layer 150, the second insulating layer 152, and the plurality of first barrier ribs are shown in FIG. 160, the second partition 162 and the connecting conductive part 310 are not shown.

1 to 7, the direction indicated by the arrow indicating the X direction, Y direction or Z direction is the positive direction of the direction indicated by the arrow, and the direction indicated by the arrow is the positive direction of the direction indicated by the arrow. It indicates that the opposite direction is the negative direction of the direction indicated by the arrow. A white dot with a black dot indicating the X direction, Y direction, or Z direction indicates that the direction from the back to the front of the paper surface is the positive direction of the direction indicated by the white circle with the black dot, and the direction from the front to the back of the paper surface is the direction with the black dot. Indicates the negative direction of the direction indicated by the open circle. A white circle with an X indicating the X direction, Y direction, or Z direction indicates that the direction from the front to the back of the paper surface is the positive direction of the direction indicated by the white circle with the X, and the direction from the back to the front of the paper surface is the direction with the X. Indicates the negative direction of the direction indicated by the open circle.

The X direction is one direction parallel to the first surface 102 or the second surface 104 . The positive direction of the X direction is the direction from the side of the substrate 100 opposite to the side where the circuit section 300 is located toward the side of the substrate 100 where the circuit section 300 is located. The negative direction of the X direction is the direction from the side of the substrate 100 where the circuit section 300 is located toward the side of the substrate 100 opposite to the side where the circuit section 300 is located. The Y direction is one direction parallel to the first surface 102 or the second surface 104 . The Y direction is orthogonal to the X direction. The positive direction of the Y direction is the right direction when viewed from the side of the substrate 100 on which the circuit section 300 is provided. The negative direction of the Y direction is the left direction when viewed from the side of the substrate 100 on which the circuit section 300 is provided. The Z direction is the direction perpendicular to the first surface 102 or the second surface 104 . The Z direction is orthogonal to both the X and Y directions. The positive direction of the Z direction is the direction from the side where the second surface 104 is located toward the side where the first surface 102 is located. The negative direction of the Z direction is the direction from the side where the first surface 102 is located toward the side where the second surface 104 is located.

The substrate 100 has translucency. The substrate 100 may be a single layer or multiple layers. The thickness of the substrate 100 is, for example, 10 μm or more and 1000 μm or less. The substrate 100 is, for example, a glass substrate. The substrate 100 may be a resin substrate containing an organic material such as PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), polyimide, or the like. If the substrate 100 is a resin substrate, an inorganic barrier layer (eg, SiN or SiON) may be positioned on at least one of the first surface 102 and the second surface 104 .

As shown in FIG. 5, the plurality of first electrodes 110 extend parallel to the X direction and are arranged parallel to the Y direction. Each first electrode 110 has translucency. The first electrode 110 functions as an anode. In one example, the first electrode 110 includes an oxide semiconductor such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide), and IGZO (Indium Gallium Zinc Oxide). contains.

As shown in FIGS. 3 to 5, the plurality of organic layers 120 extend parallel to the Y direction and are arranged parallel to the X direction. The multiple organic layers 120 are perpendicular to the multiple first electrodes 110 when viewed from the Z direction. As shown in FIGS. 6 and 7, the multiple organic layers 120 cover the multiple first electrodes 110 and the first insulating layer 150 from the positive side in the Z direction. The organic layer 120 includes, for example, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL), and an electron It in turn contains an injection layer (EIL). However, examples of layers included in each organic layer 120 are not limited to the examples described here.

As shown in FIG. 6, the first organic section 122 covers the end of the first electrode 110 on the negative side in the X direction. The first organic section 122 includes, for example, the materials exemplified for the organic layer 120 . Between the first organic section 122 and the organic layer 120 closest to the negative direction in the X direction among the plurality of organic layers 120 arranged in the X direction, a plurality of first partition walls 160 (details will be described later) are arranged in the X direction. ), the first partition wall 160 on the most negative side in the X direction is located. Therefore, the first organic section 122 and the endmost organic layer 120 on the negative direction side in the X direction among the plurality of organic layers 120 arranged in the X direction are the most separated among the plurality of first barrier ribs 160 arranged in the X direction. They are physically and electrically insulated by the first partition wall 160 on the negative side in the X direction.

As shown in FIGS. 3 to 5, the plurality of second electrodes 130 extend parallel to the Y direction and are arranged parallel to the X direction. The plurality of second electrodes 130 are orthogonal to the plurality of first electrodes 110 when viewed from the Z direction. The second electrode 130 has a light shielding property, specifically, a light reflecting property. As shown in FIGS. 6 and 7, the multiple second electrodes 130 cover the multiple organic layers 120 from the positive side in the Z direction. The second electrode 130 functions as a cathode. In one example, second electrode 130 includes a metal or alloy. The metal or alloy is, for example, at least one metal selected from the group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn and In, or an alloy of metals selected from this group.

As will be described later in detail, as shown in FIG. 6, the first conductive portion 132 has a first conductive region 132a. Further, as shown in FIG. 7, the first conductive portion 132 has a second conductive region 132b.

As shown in FIGS. 3 to 5, the first insulating layer 150 defines a plurality of openings 150a arranged in rows and columns in the X and Y directions when viewed from the Z direction. A plurality of openings 150a arranged in a row in the X direction are provided in each of the plurality of first electrodes 110 when viewed from the Z direction. As shown in FIGS. 6 and 7, a portion of the surface of each first electrode 110 on the positive side in the Z direction that overlaps with the opening 150a in the Z direction is exposed from the first insulating layer 150 through the opening 150a. there is The first insulating layer 150 contains an organic material such as polyimide. Note that the first insulating layer 150 may contain an inorganic material such as silicon oxide.

The light emitting device 10 includes a light emitting region 142 located on the positive side of the substrate 100 in the Z direction. As shown in FIGS. 3 to 5, the light emitting region 142 has a plurality of light emitting units 140 arranged in a matrix in the X direction and the Y direction. Each light emitting unit 140 is a pixel. As shown in FIGS. 6 and 7, each light emitting section 140 has a first electrode 110, an organic layer 120, and a second electrode 130 that overlap each other. Specifically, each of the plurality of light emitting portions 140 is defined by each of the plurality of openings 150a. Each light emitting part 140 includes a portion of each first electrode 110 overlapping the opening 150a in the Z direction, a portion of each organic layer 120 overlapping the opening 150a, a portion of each second electrode 130 overlapping the opening 150a, have. In this embodiment, the light emitted from the organic layer 120 toward the first electrode 110 passes through the first electrode 110 and the substrate 100 and is emitted toward the negative Z direction of the light emitting device 10 . Further, the light emitted from the organic layer 120 toward the second electrode 130 is reflected by the second electrode 130, passes through the first electrode 110 and the substrate 100, and travels in the negative direction of the Z direction of the light emitting device 10. emitted. Thus, the light emitting device 10 is bottom emission. In addition, the light emitting device 10 may be top emission or double sided light emission.

As shown in FIG. 7, the second insulating layer 152 is located on the negative direction side in the Y direction with respect to the light emitting region 142 . The second insulating layer 152 contains, for example, the materials exemplified for the first insulating layer 150 .

As shown in FIGS. 3 to 5, the plurality of first barrier ribs 160 extend parallel to the Y direction and are arranged parallel to the X direction. As shown in FIGS. 3 to 6, the organic layer 120 and the second electrode 130 are positioned between the first barrier ribs 160 adjacent in the X direction. The first partition wall 160 contains an organic material such as polyimide, epoxy, acrylic, or the like. Note that the first partition 160 may contain an inorganic material such as silicon oxide. As shown in FIG. 6, the second organic portion 124 and the second conductive portion 134 are arranged in order from the surface of the first partition wall 160 on the positive side in the Z direction toward the positive direction in the Z direction.

As shown in FIG. 7, the second partition wall 162 is positioned on the positive Z-direction side of the second insulating layer 152 . The second partition 162 includes, for example, the materials exemplified for the plurality of first partitions 160 . The third conductive portion 136 is positioned on the positive side of the second partition wall 162 in the Z direction.

The sealing section 200 seals the plurality of light emitting sections 140 . The sealing part 200 is a sealing can attached to the first surface 102 via an adhesive layer 210 . The sealing portion 200 has conductivity. The sealing portion is made of metal such as stainless steel, for example. As shown in FIGS. 6 and 7, the sealing portion 200 has a tapered portion 202 in which the width of the sealing portion 200 in the direction perpendicular to the Z direction becomes narrower as the distance from the first surface 102 increases.

The circuit section 300 is, for example, an FPC (Flexible Printed Circuit). The circuit unit 300 is electrically connected to the multiple light emitting units 140 and controls the light emission of each of the multiple light emitting units 140 . Specifically, the circuit section 300 supplies voltage to the plurality of first electrodes 110 via connection conductive sections (not shown) extending from the circuit section 300 to the first electrodes 110 . In addition, the circuit section 300 supplies voltage to the plurality of second electrodes 130 via connection conductive sections 310 extending from the circuit section 300 to the respective second electrodes 130 . The light emitting device 10 is a passive matrix. Therefore, the circuit unit 300 can selectively cause the light emitting unit 140 having the organic layer 120 positioned between the first electrode 110 supplied with voltage and the second electrode 130 supplied with voltage to emit light. can.

As shown in FIG. 7, at least a portion of the connecting conductive portion 310 is located between the light emitting region 142 and the second insulating layer 152 . The at least part of the connection conductive part 310 is covered with the end of the second electrode 130 on the negative direction side in the Y direction. In addition, the at least part of the connection conductive portion 310 is in contact with the end of the second electrode 130 on the negative direction side in the Y direction. Therefore, the connection conductive portion 310 is electrically connected to the second electrode 130 .

The ground conductive portion 320 is electrically connected to the circuit portion 300 . Therefore, the ground voltage can be supplied from the circuit section 300 to the ground conductive section 320 . A ground voltage may be supplied to the ground conductive portion 320 from a circuit different from the circuit portion 300 .

As shown in FIGS. 1 and 2, the ground conductive portion 320 has a first ground area 322 , a second ground area 324 and a third ground area 326 .

As shown in FIG. 2, when viewed in the Z direction, the first ground region 322 surrounds a portion of the light emitting region 142, specifically the negative side of the light emitting region 142 in the X direction. As shown in FIGS. 6 and 7 , the first ground area 322 is located inside the area sealed by the sealing part 200 . Note that the layout of the first grounding region 322 is not limited to the example according to this embodiment.

As shown in FIGS. 1 and 2, when viewed from the Z direction, the second ground region 324 extends from one end of the second ground region 324 that is connected to the negative direction side of the circuit unit 300 in the Y direction. 324 , the light emitting region 142 is surrounded by the other end connected to the positive direction side of the circuit section 300 in the Y direction. As shown in FIGS. 6 and 7, the second ground area 324 is located outside the area enclosed by the encapsulant 200 . Note that the layout of the second ground area 324 is not limited to the example according to this embodiment.

As shown in FIG. 2, the third ground area 326 connects the first ground area 322 and the second ground area 324 . Specifically, the third ground region 326 located on the negative Y-direction side of the light emitting region 142 is one end of the first ground region 322 located on the negative Y-direction side, and the second ground region 324 Among them, the portion located on the negative direction side in the Y direction of the light emitting region 142 is connected to. The third ground region 326 located on the positive Y-direction side of the light-emitting region 142 is the other end of the first ground region 322 located on the positive Y-direction side and the light-emitting region of the second ground region 324 . and a portion of the region 142 located on the positive side in the Y direction. The third ground region 326 passes between the substrate 100 and the encapsulant 200 . Note that the layout of the third grounding region 326 is not limited to the example according to this embodiment.

Next, details of the first conductive region 132a and the second conductive region 132b will be described.

As shown in FIG. 6, the first conductive region 132a is located on the negative side in the X direction with respect to the light emitting region 142. As shown in FIG. The first conductive region 132 a covers at least a portion of the first ground region 322 . Also, the first conductive region 132 a is in contact with at least a portion of the first ground region 322 . Therefore, the first conductive region 132 a is electrically connected to the ground conductive portion 320 . Thereby, the first conductive region 132a is grounded.

The first organic portion 122 is located between the first conductive region 132a and the end of the first electrode 110 on the negative side in the X direction. Therefore, the first conductive region 132 a and the first electrode 110 are physically and electrically insulated by the first organic section 122 .

A plurality of first barrier ribs 160 aligned in the X direction are provided between the first conductive region 132a and the second electrode 130 located at the extreme end on the negative direction side in the X direction among the plurality of second electrodes 130 aligned in the X direction. Among them, the first partition wall 160 at the extreme end on the negative direction side in the X direction is located. Therefore, the first conductive region 132a and the second electrode 130 located on the most negative side in the X direction among the plurality of second electrodes 130 arranged in the X direction are the same as those of the plurality of first barrier ribs 160 arranged in the X direction. They are physically and electrically insulated by the first partition wall 160 at the extreme end on the negative direction side in the X direction.

As shown in FIG. 7, the second conductive region 132b is located on the negative direction side in the Y direction with respect to the light emitting region 142. As shown in FIG. A second conductive region 132 b covers at least a portion of the first ground region 322 . Also, the second conductive region 132 b is in contact with at least a portion of the first ground region 322 . Therefore, the second conductive region 132 b is electrically connected to the ground conductive portion 320 . Thereby, the second conductive region 132b is grounded.

A second insulating layer 152 and a second partition wall 162 are positioned between the second conductive region 132b and the end of the second electrode 130 on the negative direction side in the Y direction. Therefore, the second conductive region 132b and the negative Y direction end of the second electrode 130 are physically and electrically insulated by the second insulating layer 152 and the second partition wall 162. .

When the first conductive portion 132 is provided, not only the ground conductive portion 320 but also the first conductive portion 132 is attached to the sealing portion 200 compared to the case where the first conductive portion 132 is not provided. It functions as a grounding part for discharging static electricity. Also, by adjusting the position where the first conductive part 132 is provided, the first conductive part 132 can be provided at a position relatively close to the sealing part 200 . Furthermore, by adjusting the range in which the first conductive part 132 is provided, the first conductive part 132 can be provided in a relatively wide range. Therefore, when the first conductive portion 132 is provided, the static electricity accumulated in the sealing portion 200 is transferred to the ground conductive portion 320 rather than the connection conductive portion 310 as compared to the case where the first conductive portion 132 is not provided. It can be made easier to flow. Therefore, when the first conductive part 132 is provided, breakage of the connection conductive part 310 due to static electricity in the sealing part 200 can be suppressed more than when the first conductive part 132 is not provided. can be done.

At least part of the connecting conductive part 310 may be exposed to the air inside the region sealed by the sealing part 200 without being covered with an insulating layer such as polyimide. In this case, moisture existing outside the region sealed by the sealing portion 200 can be prevented from entering the light emitting portion 140 via the insulating layer covering the connection conductive portion 310 . On the other hand, when the connection conductive part 310 is exposed to the air, the static electricity accumulated in the sealing part 200 tends to flow to the connection conductive part 310 compared to the case where the connection conductive part 310 is covered with an insulating layer. However, in this embodiment, even if at least a portion of the connection conductive portion 310 is exposed to the air, it is possible to suppress breakage of the connection conductive portion 310 due to static electricity in the sealing portion 200 .

At least part of the first conductive portion 132 is located inside the region sealed by the sealing portion 200 . Static electricity on the sealing portion 200 tends to flow to a low humidity area rather than a high humidity area. The humidity inside the area sealed by the sealing part 200 is lower than the humidity outside the area sealed by the sealing part 200 . Therefore, when at least part of the first conductive part 132 is located inside the area sealed by the sealing part 200, when the first conductive part 132 is located outside the area sealed by the sealing part 200 , static electricity accumulated in the sealing portion 200 can be easily discharged to the first conductive portion 132 . Note that the first conductive portion 132 may be positioned outside the region sealed by the sealing portion 200 .

At least a portion of the ground conductive portion 320 , specifically the first ground region 322 is located inside the region sealed by the sealing portion 200 . If the first grounding region 322 is not provided, in order to ground the first conductive part 132, the first conductive part 132 must be pulled out of the region sealed by the sealing part 200 and the first conductive part 132 can be grounded. Section 132 should be electrically connected to second ground area 324 . On the other hand, when the first grounding area 322 is provided, the first conductive part 132 can be grounded without drawing the first conductive part 132 outside the area sealed by the sealing part 200 . .

At least a portion of the first conductive portion 132 is positioned between the tapered portion 202 and the first surface 102 in the Z direction. In this case, compared to the case where the tapered portion 202 is a side wall portion parallel to the Z direction, the static electricity accumulated in the sealing portion 200 can easily flow to the first conductive portion 132 via the tapered portion 202. be able to. In place of the tapered portion 202, the sealing portion 200 may have a side wall portion whose width in the direction perpendicular to the Z direction is constant regardless of the distance from the first surface 102. good.

Next, an example of a method for manufacturing the light emitting device 10 will be described.

First, the connection conductive portion 310 and the ground conductive portion 320 are formed on the first surface 102 side by vapor deposition, for example.

Next, a conductive layer is formed on the first surface 102 side. The conductive layer is then patterned, for example by lithography, to form a plurality of first electrodes 110 .

Next, an insulating layer containing a photosensitive resin is formed on the first surface 102 side. The insulating layer is then patterned by exposure and development to form a first insulating layer 150 and a second insulating layer 152 . In this case, the second insulating layer 152 contains the same material as the material contained in the first insulating layer 150 . In addition, the manufacturing process of the light emitting device 10 can be simplified as compared with the case where the first insulating layer 150 and the second insulating layer 152 are formed by different patterning steps. Note that the first insulating layer 150 and the second insulating layer 152 may be formed by different patterning processes. In this case, the second insulating layer 152 may contain a material different from the material contained in the first insulating layer 150, or may contain the same material as the material contained in the first insulating layer 150. .

Next, an insulating layer containing a photosensitive resin is formed on the first surface 102 side. Then, the insulating layer is patterned by exposure and development to form a plurality of first barrier ribs 160 and second barrier ribs 162 . In this case, the second barrier ribs 162 contain the same material as that contained in the plurality of first barrier ribs 160 . Moreover, the manufacturing process of the light emitting device 10 can be simplified as compared with the case where the plurality of first partition walls 160 and the second partition walls 162 are formed by different patterning steps. In addition, the plurality of first barrier ribs 160 and the second barrier ribs 162 may be formed by different patterning processes. In this case, the second partition 162 may contain a material different from the material contained in the plurality of first partitions 160, or may contain the same material as the material contained in the plurality of first partitions 160. good.

Next, an organic layer is formed on the first surface 102 side by vapor deposition. The organic layers are divided by a plurality of first barrier ribs 160 and second barrier ribs 162 to form a plurality of organic layers 120 , first organic portions 122 and second organic portions 124 . In this case, the first organic portion 122 and the second organic portion 124 contain the same material as the material contained in the plurality of organic layers 120 .

In addition, the first partition 160 on the negative side in the X direction among the plurality of first partitions 160 arranged in the X direction separates the first organic portion 122 from the plurality of organic layers 120 arranged in the X direction, which is the most in the X direction. can be separated from the organic layer 120 on the negative direction side. Therefore, a mask having a shielding portion for separating the first organic portion 122 and the organic layer 120 closest to the negative direction in the X direction among the plurality of organic layers 120 arranged in the X direction is used in vapor deposition of the organic layers. No need. Therefore, the manufacturing process of the light emitting device 10 can be simplified as compared with the case where the mask is used. The mask may be used to separate the first organic portion 122 from the organic layer 120 closest to the negative direction in the X direction among the plurality of organic layers 120 arranged in the X direction.

In addition, the plurality of organic layers 120 and the first organic part 122 may be formed by different vapor deposition processes. In this case, the first organic section 122 may contain a material different from the material contained in the plurality of organic layers 120, or may contain the same material as the material contained in the plurality of organic layers 120. .

Next, a conductive layer is formed on the first surface 102 side by vapor deposition. The conductive layer is divided by a plurality of first barrier ribs 160 and second barrier ribs 162 to form a plurality of second electrodes 130 , first conductive portions 132 , second conductive portions 134 and third conductive portions 136 . In this case, the first conductive portion 132 , the second conductive portion 134 and the third conductive portion 136 contain the same material as the material contained in the plurality of second electrodes 130 .

In addition, the first conductive region 132a and the most X-direction electrode among the plurality of second electrodes 130 arranged in the X direction are arranged by the first partition 160 on the most negative side in the X direction among the plurality of first partitions 160 arranged in the X direction. can be separated from the second electrode 130 on the negative direction side. Therefore, a mask having a shielding portion for separating the first conductive region 132a and the second electrode 130 on the most negative side in the X direction among the plurality of second electrodes 130 arranged in the X direction is deposited on the conductive layer. need not be used in Therefore, the manufacturing process of the light emitting device 10 can be simplified as compared with the case where the mask is used. Note that the mask may be used to separate the first conductive region 132a from the second electrode 130 closest to the negative direction in the X direction among the plurality of second electrodes 130 arranged in the X direction.

In addition, the second conductive region 132b and the second electrode 130 can be separated by the second partition 162 . Therefore, it is not necessary to use a mask having a shielding portion for separating the second conductive region 132b and the second electrode 130 during deposition of the conductive layer. Therefore, the manufacturing process of the light emitting device 10 can be simplified as compared with the case where the mask is used. Note that the second conductive region 132b and the second electrode 130 may be separated using the mask.

In addition, the plurality of second electrodes 130 and the first conductive parts 132 may be formed by different vapor deposition processes. In this case, the first conductive part 132 may contain a material different from the material contained in the plurality of second electrodes 130, or may contain the same material as the material contained in the plurality of second electrodes 130. good too.

Next, the sealing part 200 is attached to the first surface 102 via the adhesive layer 210 .

Next, the circuit section 300 is provided on the first surface 102 side. Thereby, the circuit section 300 can be electrically connected to the connection conductive section 310 and the ground conductive section 320 .

Thus, the light emitting device 10 is manufactured.

Although the embodiments of the present invention have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than those described above can also be adopted.

For example, in the embodiments, suppression of disconnection of the connection conductive portion 310 electrically connected to the second electrode 130 has been described. However, according to the present embodiment, breakage of the connection conductive portion electrically connected to the first electrode 110 can also be suppressed.

Also, in the embodiment, the first conductive portion 132 covers at least a portion of the ground conductive portion 320 . However, the first conductive portion 132 does not have to cover the ground conductive portion 320 . For example, the first conductive portion 132 does not contact the end of the ground conductive portion 320 on the positive side in the Z direction, but contacts at least a portion of the end of the ground conductive portion 320 on the side perpendicular to the Z direction. You may have In this case, the first conductive portion 132 may be in direct contact with at least a portion of the end of the ground conductive portion 320 in the direction perpendicular to the Z direction, or may be in contact via laser welding, for example. good too. In this case, by providing unevenness on the surface of the end of the ground conductive portion 320 in the direction orthogonal to the Z direction, the first conductive portion 132 and the ground conductive portion are more likely to move than when the unevenness is not provided. The contact area with 320 may be increased. For example, when the ground conductive portion 320 is located relatively close to the sealing portion 200 and it is difficult to provide a portion of the first conductive portion 132 on the positive side of the ground conductive portion 320 in the Z direction, the first conductive portion The portion 132 can be brought into contact with at least a portion of the end of the ground conductive portion 320 on the side perpendicular to the Z direction.

Moreover, in the embodiment, the light-emitting device 10 is a display. However, the light-emitting device 10 may be a light-emitting device different from the display, such as a surface light source having a single light-emitting portion.

Further, in the embodiment, the plurality of first electrodes 110 are arranged in parallel in the Y direction, and the plurality of organic layers 120 and the plurality of second electrodes 130 are arranged in parallel in the X direction. However, the plurality of first electrodes 110 may be arranged in a direction different from the Y direction, for example parallel to the X direction, and the plurality of organic layers 120 and the plurality of second electrodes 130 may be arranged in a direction different from the X direction, For example, they may be arranged parallel to the Y direction.

Further, in the embodiment, the light emitting device 10 is a passive matrix. However, the light emitting device 10 may be an active matrix.

10 Light emitting device 100 Substrate 102 First surface 104 Second surface 110 First electrode 120 Organic layer 120 Second electrode 122 First organic part 124 Second organic part 130 Second electrode 132 First conductive part 132a First conductive region 132b Second conductive region 134 Second conductive portion 136 Third conductive portion 140 Light emitting portion 142 Light emitting region 150 First insulating layer 150a Opening 152 Second insulating layer 160 First partition 162 Second partition 200 Sealing portion 202 Tapered portion 210 Adhesive layer 300 Circuit portion 310 Connection conductive portion 320 Ground conductive portion 322 First ground area 324 Second ground area 326 Third ground area

Claims (7)

a substrate;
a light emitting unit located on the substrate;
a conductive sealing portion that seals the light emitting portion;
a connecting conductive portion located on the substrate and electrically connected to the light emitting portion;
a ground conductive portion located on the substrate;
a first conductive portion electrically connected to the ground conductive portion;
A light emitting device. The light emitting device according to claim 1,
The light-emitting device, wherein at least part of the first conductive portion is positioned inside a region sealed by the sealing portion. The light emitting device according to claim 1 or 2,
The light-emitting device, wherein at least part of the ground conductive portion is located inside a region sealed by the sealing portion. In the light emitting device according to any one of claims 1 to 3,
the sealing portion has a tapered portion in which the width of the sealing portion narrows as the width of the sealing portion moves away from the substrate;
The light-emitting device, wherein at least a portion of the first conductive portion is positioned between the tapered portion and the substrate in a direction perpendicular to the substrate. In the light emitting device according to any one of claims 1 to 4,
The light emitting unit has a first electrode, an organic layer, and a second electrode that overlap each other,
The light-emitting device, wherein the first conductive portion contains the same material as the material contained in the second electrode. In the light emitting device according to claim 5,
The light-emitting device further comprising a partition positioned between the second electrode and the first conductive portion. In the light emitting device according to any one of claims 1 to 6,
further comprising a circuit unit electrically connected to the light emitting unit;
A light-emitting device, wherein the ground conductive portion is electrically connected to the circuit portion.

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