JP2022122352A - Inner surface processing device - Google Patents

Abstract

To provide an inner surface processing device capable of simultaneously performing processing, defect inspection, and inner diameter measurement of a cylindrical inner surface of a processed body in a short time.SOLUTION: An inner surface processing device 100 includes: processing means 10 for processing a cylindrical inner surface 51 of a processed body 50 by irradiating it with a processing laser beam; defect inspection means 30 for performing defect inspection on the cylindrical inner surface 51 of the processed body 50 by irradiating the cylindrical inner surface 51 with an inspection laser beam; inner diameter measurement means 40 for performing inner diameter measurement on the cylindrical inner surface 51 of the processed body 50 by irradiating the cylindrical inner surface 51 with a measurement laser beam; and a probe 20 for irradiating the cylindrical inner surface 51 with the processing laser beam, the inspection laser beam, and the measurement laser beam while moving along a cylinder axis direction of the processed body 50, and acquiring reflection light of the inspection laser beam and the measurement laser beam.SELECTED DRAWING: Figure 3

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner surface processing apparatus for processing the cylindrical inner surface of a workpiece, inspecting for defects, and measuring the inner diameter.

Conventionally, most inspections for defects such as blowholes, scratches, and burrs existing on the cylindrical inner surface of a workpiece such as an engine part rely on visual inspection by an inspector. Since visual inspection requires a lot of manpower, it causes an increase in cost, and there is also a problem of variation in quality.

On the other hand, as an apparatus that automates the inspection of defective parts, the entire inner surface is scanned while measuring the reflected light amount of the laser beam applied to the inner surface of the workpiece, and an image is formed from the measured reflected light amount. An inner surface inspection apparatus has been proposed that determines the presence or absence of a defective portion from the image obtained. For example, in Japanese Unexamined Patent Application Publication No. 2002-100000, defective portion candidates are first detected from a determination target portion, and then from the detected defective portion candidates, based on narrowing conditions such as shape, size, and positional relationship, defective portions are narrowed down. , describes an invention relating to an inner surface inspection apparatus designed to improve the accuracy of determining a defective portion.

On the other hand, there are cases where inner diameter measurement and roundness measurement are performed on the cylindrical inner surface of a workpiece such as an engine part. The inner diameter can be measured manually by an inspector using a measuring jig, or automatically by an air micro device or the like. Roundness measurement includes a manual inspection method using a plug gauge by an inspector and an automatic inspection method using a roundness measuring instrument.

As a device for measuring the inner diameter and roundness, for example, Patent Documents 2 and 3 disclose distance information by irradiating the inner surface of a cylindrical shape with a laser beam, and measure the inner diameter, roundness, squareness, etc. An invention relating to a measuring device for calculating is described.

In addition, for the cylindrical inner surface of non-inspected objects such as engine parts, surface processing such as cross hatching and dimples, and fine uneven processing for fixing the hard layer (thermal spray film) to the cylindrical inner surface of the thermal spray engine. is being done. After machining the cylindrical inner surface, it is necessary to inspect for defects such as scratches and burrs remaining on the surface, and to measure the inner diameter to confirm the machining depth.

JP 2017-101938 A JP 2020-148632 A JP 2020-187052 A

Conventionally, in order to machine the inner surface of a cylindrical shape, inspect defects, and measure the degree of inner diameter measurement, each device must be used separately, and there is a limit to shortening the inspection time and measurement time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an inner surface processing apparatus capable of simultaneously processing the cylindrical inner surface of a workpiece, inspecting for defects, and measuring the inner diameter in a short time.

In order to solve the above-mentioned problems, the inner surface processing apparatus of the present invention comprises: processing means for irradiating the cylindrical inner surface of a workpiece with a processing laser beam to process the cylindrical inner surface; Defect inspection means for irradiating an inspection laser beam to inspect the cylindrical inner surface for defects, and inner diameter measuring means for irradiating the cylindrical inner surface of the workpiece with a measurement laser beam to measure the inner diameter of the cylindrical inner surface. and irradiating the inner surface of the cylindrical body with a processing laser beam, an inspection laser beam, and a measurement laser beam, and reflecting light of the inspection laser beam and the measurement laser beam. and a probe that acquires the reflected light of the

Further, the inner surface processing apparatus of the present invention comprises: processing means for irradiating the cylindrical inner surface of the workpiece with a laser beam for processing to process the cylindrical inner surface; Defect inspection means for inspecting the inner surface of the cylindrical shape by irradiating a defect, and moving along the axial direction of the cylinder of the object to be processed to irradiate the inner surface of the cylindrical shape with the processing laser beam and the inspection laser beam, and the inspection laser beam. and a probe that acquires reflected light.

Further, the inner surface processing apparatus of the present invention comprises: processing means for irradiating the cylindrical inner surface of a workpiece with a laser beam for processing to process the cylindrical inner surface; inner diameter measuring means for measuring the inner diameter of the cylindrical inner surface by irradiating, and moving along the cylindrical axis direction of the workpiece, irradiating the cylindrical inner surface with the processing laser beam and the measuring laser beam, and the measuring laser beam. and a probe that acquires reflected light.

The inner surface processing apparatus of the present invention has processing means, defect inspection means, inner diameter measurement means, and probes. Then, the processing means irradiates the cylindrical inner surface of the object to be processed with a processing laser beam to process the cylindrical inner surface, and the defect inspection means irradiates the cylindrical inner surface of the object to be processed with an inspection laser beam to form a cylindrical shape. The inner surface is inspected for defects, and the inner diameter measuring means irradiates the cylindrical inner surface of the workpiece with a measuring laser beam to measure the inner diameter of the cylindrical inner surface. In addition, the probe moves along the axial direction of the cylinder of the object to be processed, irradiates the inner surface of the cylinder with the processing laser beam, the inspection laser beam, and the measurement laser beam, and reflects the inspection laser beam and the measurement laser beam. It is designed to acquire the reflected light of light. Therefore, machining, defect inspection, and inner diameter measurement can be performed simultaneously while moving the probe, and machining time, inspection time, and measurement time can be shortened.

Further, the inner surface processing apparatus of the present invention has processing means, defect inspection means and probes. Then, the processing means irradiates the cylindrical inner surface of the object to be processed with a processing laser beam to process the cylindrical inner surface, and the defect inspection means irradiates the cylindrical inner surface of the object to be processed with an inspection laser beam to form a cylindrical shape. The inner surface is inspected for defects. Further, the probe moves along the axial direction of the cylinder of the object to be processed, irradiates the inner surface of the cylinder with the processing laser beam and the inspection laser beam, and acquires the reflected light of the inspection laser beam. Therefore, processing and defect inspection can be performed simultaneously while moving the probe, and processing time and inspection time can be shortened.

Further, the inner surface processing apparatus of the present invention has processing means, inner diameter measuring means, and a probe. Then, the processing means irradiates the cylindrical inner surface of the object to be processed with a processing laser beam to process the cylindrical inner surface, and the inner diameter measuring means irradiates the cylindrical inner surface of the object to be processed with the measuring laser beam to form a cylindrical shape. It is designed to measure the inner diameter of the inner surface. Further, the probe moves along the axial direction of the cylinder of the object to be processed, irradiates the inner surface of the cylinder with the processing laser beam and the measurement laser beam, and acquires the reflected light of the measurement laser beam. Therefore, machining and inner diameter measurement can be performed simultaneously while moving the probe, and machining time and measurement time can be shortened.

As described above, according to the inner surface processing apparatus of the present invention, the processing of the cylindrical inner surface of the workpiece, defect inspection, and inner diameter measurement can be performed simultaneously in a short time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows the inner surface processing apparatus which concerns on embodiment of this invention. It is a block diagram which shows a probe. It is the schematic of the processing of an inner surface processing apparatus, defect inspection, and inner diameter measurement. It is a functional block diagram of an inner surface processing apparatus.

Next, an inner surface processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. An inner surface processing apparatus 100 according to the present embodiment is for processing, inspecting for defects, and measuring the inner diameter of a cylindrical inner surface of a workpiece such as an automobile engine part.

FIG. 1 is a configuration diagram showing an inner surface processing apparatus 100. As shown in FIG. The inner surface processing apparatus 100 comprises a probe 1 , a probe feed mechanism 2 , a motor driver 3 , a control unit 4 , a personal computer 5 and a terminal block 6 . The probe 1 is a sensor that is inserted into the cylindrical inner surface of the object to be processed, irradiates it with a laser beam, processes the cylindrical inner surface, and acquires reflected light data. At the same time, the rotation is controlled by the motor driver 3 . The control unit 4 controls the entire apparatus, matches the data transmitted from the probe 1 with the axis position, and transmits the data to the personal computer 5 . The personal computer 5 performs processing instructions, determination of defective portions, calculation of the inner diameter and roundness, and storage of data. The terminal block 6 is for communication with an external device.

FIG. 2 is a configuration diagram showing the probe 1. As shown in FIG. A laser entrance/exit part 11 is provided at the tip of the probe 1. A laser whose output is controlled by a laser cable 15 is emitted through a mirror, and reflected light from the cylindrical inner surface of the object to be processed enters. It's becoming The spindle shaft 12 rotates at high speed to rotate the laser entrance/exit part 11 along the circumference of the cylindrical inner surface of the workpiece. The rotary encoder sensor 13 then transmits the single revolution data to the control unit 4 via the data cable 14 . As a result, reflected light data for one rotation along the circumferential direction is obtained, and by repeating the measurement from the entrance to the bottom of the cylindrical inner surface of the workpiece, the reflected light data for the entire inner surface is obtained. be able to. Note that the laser light that is irradiated onto the cylindrical inner surface of the object to be inspected may be any of visible light, infrared light, and ultraviolet light.

FIG. 3 is a schematic diagram of processing, defect inspection, and inner diameter measurement of the inner surface processing apparatus 100. FIG. 4 is a functional configuration diagram of the inner surface processing apparatus 100. As shown in FIG. In FIGS. 3 and 4, the white arrows indicate the irradiated laser light, and the black arrows indicate the received reflected light.

The inner surface processing apparatus 100 applies a laser beam to the cylindrical inner surface 51 of the workpiece 50 to process it, measures the reflected light of the laser beam along the circumferential direction, inspects the cylindrical inner surface 51 for defects, and measures the inner diameter. It is mainly composed of a processing means 10, a probe 20, a defect inspection means 30 and an inner diameter measuring means 40. In other words, machining, defect inspection, and inner diameter measurement can be performed simultaneously while moving the probe 20 .

The probe 20 (corresponding to the probe 1 in FIG. 1) moves along the cylindrical axis direction of the workpiece 50, and the spindle shaft 21 (corresponding to the spindle shaft 12 in FIG. 2) provided at the tip rotates at high speed. The cylindrical inner surface 51 is irradiated with processing laser light, inspection laser light, and measurement laser light, and reflected light of the inspection laser light and reflected light of the measurement laser light are acquired. A dichroic prism 22 and a prism 23 (or a mirror) are arranged inside the probe 20 for changing the directions of the irradiated laser light and the received reflected light. Hereinafter, the "spindle shaft" is simply referred to as "shaft".

The processing means 10 has a processing light source 16 and irradiates a processing laser beam to the cylindrical inner surface 51 of the workpiece 50 to process the cylindrical inner surface 51 . The processing laser light emitted from the processing light source 16 passes through the dichroic prisms 22 and 23 of the probe 20 and is irradiated onto the cylindrical inner surface 51 for processing. Types of processing include surface processing such as cross hatching and dimples, and fine uneven processing for fixing a hard layer (thermal spray film) to the cylindrical inner surface of a thermal spray engine. Processing by laser light has a high degree of freedom, and fine processing is also possible.

The defect inspection means 30 performs defect inspection based on the acquired intensity information of the reflected light, and the inspection laser light emitted from the light source 31 passes through the dichroic prism 22 and the prism 23 to form a cylindrical shape. The inner surface 51 is irradiated with the light, and the reflected light passes through the prism 23 and the dichroic prism 22 and is received by the PD sensor 32 and acquired. As a method of performing defect inspection based on the acquired intensity information of the reflected light, there is a method of forming an image based on the intensity information and determining the presence or absence of a defective portion from the obtained image. For example, as in the invention described in the above-mentioned Patent Document 1, defect site candidates are first detected from the determination target site, and from among the detected defect site candidates, based on narrowing conditions such as shape, size, and positional relationship, , a method of narrowing down the defective portion to improve the determination accuracy of the defective portion is preferable. In FIG. 4, the light is received by the PD sensor 32 via the prism 23 and the dichroic prism 22, but the light is received by another path such as by providing another mirror without passing through the dichroic prism 22. You may make it

The inner diameter measuring means 40 measures the inner diameter based on the acquired distance information of the reflected light. The inner diameter measuring means 40 in this embodiment is designed to measure the inner diameter by interferometry. The interferometry is a known method of analyzing interference light obtained by synthesizing reflected light from a measurement surface and reflected light from a reference surface to calculate the difference in distance between the measurement surface and the reference surface. For example, in the medical field, it is used as a technique for capturing cross-sectional images in fundus examination and endoscopy.

The interferometry in this embodiment will be described below. The inner diameter measuring means 40 mainly comprises a light source 41, an isolator 42, a coupler 43, a polarization controller 44, a delay line (reference plane) 45, a polarization controller 46, a spectrometer 47 and a PC48.

A measurement laser beam emitted from a light source 41 is guided to a coupler 43 via an isolator 42 and branched by the coupler 43 . One of the branched measurement laser beams is applied to a delay line (reference plane) 45 via a polarization controller 44 . The distance (reference distance) to the delay line (reference plane) 45 is known. The other of the split measurement laser beams is guided into the probe 20 via the polarization controller 46 and is irradiated to the cylindrical inner surface 51 via the dichroic prisms 22 and 23 .

Reflected light of the measurement laser light applied to the delay line (reference plane) 45 is guided to the coupler 43 via the polarization controller 44 . Reflected light of the measurement laser light irradiated to the cylindrical inner surface 51 is guided to the coupler 43 via the prism 23 , the dichroic prism 22 and the polarization controller 46 . The two guided reflected lights are combined and synthesized by the coupler 43 , and the combined reflected light is measured by the spectrometer 47 and analyzed by the PC 48 .

When the reflected light from the delay line 45 and the reflected light from the cylindrical inner surface 51 are combined, interference fringes are generated due to interaction. Since the width of the interference fringes changes depending on the size of the difference L between the reference distance and the measurement distance (distance to be measured), by analyzing the interference light, the difference L between the reference distance and the measurement distance (distance to be measured) is sought. Thereby, the measured distance can be calculated. In order to analyze the interference light and calculate the difference L, it is necessary to perform information processing including Fourier transform on the intensity information of the reflected light.

In this way, the inner diameter measuring means 40 analyzes the interference light obtained by synthesizing the reflected light from the measurement surface and the reflected light from the reference surface, and calculates the difference L in the distance between the measurement surface and the reference surface. Distance information can be calculated by interferometry.

Further, as a method of correcting the center position from the distance information at a plurality of parts of the cylindrical inner surface 51 and further measuring the roundness, for example, the least squares center method can be mentioned. A tangent circle center method, a minimum circumscribed circle center method, or the like may be used.

An inner surface processing apparatus 100 according to this embodiment has processing means 10 , defect inspection means 30 , inner diameter measurement means 40 and probes 20 . Then, the processing means 10 irradiates the cylindrical inner surface 51 of the workpiece 50 with the processing laser beam to process the cylindrical inner surface 51, and the defect inspection means 30 irradiates the cylindrical inner surface 51 of the workpiece 50 with the inspection laser beam. The inner diameter measuring means 40 irradiates the cylindrical inner surface 51 of the workpiece 50 with the measuring laser beam to measure the inner diameter of the cylindrical inner surface 51. ing. Further, the probe 20 moves along the cylindrical axis direction of the workpiece 50 and irradiates the cylindrical inner surface 51 with the processing laser beam, the inspection laser beam, and the measurement laser beam, and the reflected light of the inspection laser beam and the measurement laser beam. The reflected light of the measurement laser light is acquired. Therefore, machining, defect inspection, and inner diameter measurement can be performed simultaneously while moving the probe 20, and machining time, inspection time, and measurement time can be shortened.

Although the inner surface processing apparatus according to the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various other modifications are possible.

For example, the inner diameter measuring means 40 is not limited to one that performs measurement by interferometry. Moreover, the same light source may be used for the inspection laser light and the measurement laser light.

In the above embodiment, machining, defect inspection, and inner diameter measurement are all performed at the same time. You can also Further, it is also possible to configure the apparatus only by the processing means 10, the inner diameter measuring means 40 and the probe 20, and to perform the processing and the inner diameter measurement at the same time.

1 probe 2 probe feeding mechanism 3 motor driver 4 control unit 5 personal computer 6 terminal block 7 housing means (housing box)
10 processing means 11 laser entrance/exit portion 12 spindle shaft (shaft)
13 rotary encoder/sensor 14 data cable 15 laser cable 16 processing light source 20 probe 21 spindle shaft (shaft)
22 dichroic prism 23 prism 30 defect inspection means 31 light source 32 PD sensor 40 inner diameter measuring means 41 light source 42 isolator 43 coupler 44 polarization controller 45 delay line (reference plane)
46 polarization controller 47 spectrometer 48 PC
50 Object to be processed 51 Cylindrical inner surface 100 Inner surface processing device

Claims (3)

Processing means for irradiating the cylindrical inner surface of a workpiece with a laser beam for processing to process the cylindrical inner surface, and defect inspection of the cylindrical inner surface by irradiating the cylindrical inner surface of the workpiece with an inspection laser beam. defect inspection means for measuring the inner diameter of the cylindrical inner surface of the workpiece by irradiating the cylindrical inner surface of the workpiece with a measurement laser beam; inner diameter measuring means for measuring the inner diameter of the cylindrical inner surface; and a probe for irradiating a processing laser beam, an inspection laser beam, and a measurement laser beam onto an inner surface of the shape and acquiring reflected light of the inspection laser beam and reflected light of the measurement laser beam. Inner surface processing equipment. Processing means for irradiating the cylindrical inner surface of a workpiece with a laser beam for processing to process the cylindrical inner surface, and defect inspection of the cylindrical inner surface by irradiating the cylindrical inner surface of the workpiece with an inspection laser beam. and a probe that moves along the axial direction of the cylinder of the workpiece and irradiates the inner surface of the cylinder with the processing laser beam and the inspection laser beam and obtains the reflected light of the inspection laser beam. An inner surface processing apparatus, comprising: Processing means for irradiating a cylindrical inner surface of a workpiece with a laser beam for processing to machine the cylindrical inner surface, and measuring the inner diameter of the cylindrical inner surface by irradiating the cylindrical inner surface of the workpiece with a measuring laser beam. and a probe that moves along the axial direction of the cylinder of the workpiece to irradiate the inner surface of the cylinder with the machining laser beam and the measuring laser beam and acquires the reflected light of the measuring laser beam. An inner surface processing apparatus, comprising:

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