JP2022118584A - Electronic component and manufacturing method thereof - Google Patents

Electronic component and manufacturing method thereof Download PDF

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JP2022118584A
JP2022118584A JP2021015195A JP2021015195A JP2022118584A JP 2022118584 A JP2022118584 A JP 2022118584A JP 2021015195 A JP2021015195 A JP 2021015195A JP 2021015195 A JP2021015195 A JP 2021015195A JP 2022118584 A JP2022118584 A JP 2022118584A
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electronic component
conductor
component according
manufacturing
dimensional pattern
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Japanese (ja)
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真志 梶
Shinji Kaji
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Tokyo Cosmos Electric Co Ltd
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Tokyo Cosmos Electric Co Ltd
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Priority to JP2021015195A priority Critical patent/JP2022118584A/en
Priority to CN202210076686.7A priority patent/CN114845423A/en
Priority to DE102022102140.8A priority patent/DE102022102140A1/en
Publication of JP2022118584A publication Critical patent/JP2022118584A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Abstract

To provide a highly versatile electronic component that can prevent the disconnection of a conductor, and a manufacturing method thereof.SOLUTION: An electronic component includes a linear conductor and a first member in which the conductor is provided. In the electronic component, sinuous parts are provided in portions of the conductor that are subjected to bending or pressing work, the sinuous parts being not adjacent to each other in a drawing direction of the conductor.SELECTED DRAWING: Figure 3

Description

本開示は、電子部品およびその製造方法に関する。 TECHNICAL FIELD The present disclosure relates to electronic components and manufacturing methods thereof.

例えば、特許文献１には、線状のヒータ素子（導体の一例）と、そのヒータ素子が設けられた基材と、を備えるヒータユニット（電子部品の一例）が開示されている。このヒータユニットでは、基材のうちヒータ素子が設けられた部分に、基材とヒータ素子とが一体化しないように、穴あき部分が設けられている。この構造により、ヒータユニットを車両用シートに設置する際に、基材に引っ張り力や屈曲力が生じた場合、ヒータ素子の応力を緩和し、ヒータ素子の断線を防止している。 For example, Patent Literature 1 discloses a heater unit (an example of an electronic component) including a linear heater element (an example of a conductor) and a substrate provided with the heater element. In this heater unit, a perforated portion is provided in a portion of the base material where the heater element is provided so that the base material and the heater element are not integrated. With this structure, when a tensile force or bending force is applied to the base material when the heater unit is installed on the vehicle seat, the stress of the heater element is relieved and disconnection of the heater element is prevented.

特開２０１８－７３７６４号公報JP 2018-73764 A

しかしながら、電子部品には、構造上、基材に穴を開けることが好ましくないものもある。よって、特許文献１の構造は、適用範囲が限定されてしまい、汎用性に欠けるという課題があった。 However, some electronic components are structurally unfavorable for making holes in the base material. Therefore, the structure of Patent Literature 1 has a limited application range and lacks versatility.

本開示の一態様の目的は、導体の断線防止を実現するとともに、高い汎用性を実現した電子部品およびその製造方法を提供することである。 An object of one aspect of the present disclosure is to provide an electronic component that prevents disconnection of a conductor and achieves high versatility, and a method of manufacturing the same.

本開示の一態様に係る電子部品は、線状の導体と、前記導体が設けられる第１部材とを有する電子部品であって、前記導体のうち曲げ加工またはプレス加工が施される部分に、前記導体の延伸方向において互いに隣接しない湾曲部が設けられている。 An electronic component according to an aspect of the present disclosure is an electronic component that includes a linear conductor and a first member provided with the conductor, wherein a portion of the conductor that is subjected to bending or pressing is Curved portions are provided that are not adjacent to each other in the extending direction of the conductor.

本開示の一態様に係る電子部品の製造方法は、線状の導体と、前記導体が設けられる第１部材とを有する電子部品の製造方法であって、前記導体のうち曲げ加工またはプレス加工が施される部分に、前記導体の延伸方向において互いに隣接しない湾曲部を形成し、前記導体が設けられた前記第１部材に対して曲げ加工またはプレス加工を施す。 A method for manufacturing an electronic component according to an aspect of the present disclosure is a method for manufacturing an electronic component having a linear conductor and a first member provided with the conductor, wherein the conductor is subjected to bending or pressing. Curved portions that are not adjacent to each other in the extension direction of the conductor are formed in the portion to be subjected to bending or pressing to the first member provided with the conductor.

本開示によれば、導体の断線防止を実現するとともに、高い汎用性を実現することができる。 Advantageous Effects of Invention According to the present disclosure, it is possible to prevent disconnection of conductors and achieve high versatility.

本開示の実施の形態に係る電子部品の構成の一例を示す分解斜視図1 is an exploded perspective view showing an example of a configuration of an electronic component according to an embodiment of the present disclosure; FIG. 本開示の実施の形態に係る立体模様の一例を示す斜視図1 is a perspective view showing an example of a three-dimensional pattern according to an embodiment of the present disclosure; FIG. 本開示の実施の形態に係る立体模様と湾曲部の位置関係の一例を模式的に示す正面図FIG. 2 is a front view schematically showing an example of the positional relationship between a three-dimensional pattern and curved portions according to an embodiment of the present disclosure; 本開示の変形例３に係る電子部品の構成の一例を示す分解斜視図FIG. 11 is an exploded perspective view showing an example of a configuration of an electronic component according to Modification 3 of the present disclosure;

以下、本開示の実施の形態について、図面を参照しながら説明する。なお、各図において共通する構成要素については同一の符号を付し、それらの説明は適宜省略する。 Embodiments of the present disclosure will be described below with reference to the drawings. In addition, the same code|symbol is attached|subjected about the component which is common in each figure, and those description is abbreviate|omitted suitably.

まず、図１を用いて、本実施の形態の電子部品１０の構成について説明する。図１は、本実施の形態の電子部品１０の構成の一例を示す分解斜視図である。 First, the configuration of electronic component 10 of the present embodiment will be described with reference to FIG. FIG. 1 is an exploded perspective view showing an example of the configuration of an electronic component 10 according to this embodiment.

図１に示すように、電子部品１０は、表層部材１、第１接着部材２、絶縁シート３、電熱線４、第２接着部材５を有する。 As shown in FIG. 1 , the electronic component 10 has a surface layer member 1 , a first adhesive member 2 , an insulating sheet 3 , a heating wire 4 and a second adhesive member 5 .

表層部材１は、第２部材の一例に相当する。絶縁シート３は、第１部材の一例に相当する。電熱線４は、線状の導体（電気伝導体ともいう）の一例に相当する。 The surface layer member 1 corresponds to an example of the second member. The insulating sheet 3 corresponds to an example of the first member. The heating wire 4 corresponds to an example of a linear conductor (also referred to as an electrical conductor).

表層部材１は、第１接着部材２を介して、絶縁シート３と接合される。絶縁シート３の一面（第１接着部材２との接合面の裏面）には、電熱線４が設けられる。なお、図１では、電熱線４の形状を把握し易くするために、絶縁シート３と電熱線４とを別々に図示したが、実際には、電熱線４は、絶縁シート３上に形成される。絶縁シート３の一面（電熱線４が形成された面）には、第２接着部材５が接合される。 The surface layer member 1 is joined to the insulating sheet 3 via the first adhesive member 2 . A heating wire 4 is provided on one surface of the insulating sheet 3 (the back surface of the bonding surface with the first adhesive member 2). In FIG. 1, the insulating sheet 3 and the heating wire 4 are shown separately in order to make it easier to grasp the shape of the heating wire 4, but in reality the heating wire 4 is formed on the insulating sheet 3. be. A second adhesive member 5 is bonded to one surface of the insulating sheet 3 (the surface on which the heating wire 4 is formed).

表層部材１は、例えば、ポリエチレンテレフタレート（ＰＥＴ）により構成された部材である。 The surface layer member 1 is a member made of polyethylene terephthalate (PET), for example.

第１接着部材２は、例えば、ポリエチレン（ＰＥ)、ポリプロピレン（ＰＰ)、または不織布により構成された基材の両面に、アクリル系の接着剤が塗布された部材である。すなわち、第１接着部材２は、両面テープとして機能する。 The first adhesive member 2 is, for example, a member in which an acrylic adhesive is applied to both sides of a base material made of polyethylene (PE), polypropylene (PP), or non-woven fabric. That is, the first adhesive member 2 functions as a double-sided tape.

絶縁シート３は、例えば、ポリイミド（ＰＩ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、またはポリカーボネート（ＰＣ）により構成された部材である。 The insulating sheet 3 is a member made of, for example, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polycarbonate (PC).

また、絶縁シート３の一面（第１接着部材２との接合面の裏面）には、例えば、銅、ステンレス鋼材（ＳＵＳ）、またはアルミ等により構成される金属層（図示略）が設けられる。この金属層がエッチングされることにより、所定のパターンの電熱線４が形成される。電熱線４は、通電により発熱し、ヒータとして機能する。 A metal layer (not shown) made of, for example, copper, stainless steel (SUS), aluminum, or the like is provided on one surface of the insulating sheet 3 (the back surface of the bonding surface with the first adhesive member 2). By etching this metal layer, the heating wire 4 having a predetermined pattern is formed. The heating wire 4 generates heat when energized and functions as a heater.

また、電熱線４は、湾曲状に形成された湾曲部６を複数有する。湾曲部６は、電熱線４のうち、電子部品１０に立体模様（詳細は後述）を形成するためのプレス加工（例えば、エンボス加工）が施される部分に形成されている。換言すれば、湾曲部６は、電子部品１０に形成される立体模様の位置に対応して形成されている（詳細は後述）。なお、湾曲状は、円弧状と言い換えてもよい。 Moreover, the heating wire 4 has a plurality of curved portions 6 formed in a curved shape. The curved portion 6 is formed in a portion of the heating wire 4 that is subjected to press working (for example, embossing) for forming a three-dimensional pattern (details will be described later) on the electronic component 10 . In other words, the curved portion 6 is formed corresponding to the position of the three-dimensional pattern formed on the electronic component 10 (details will be described later). It should be noted that the curved shape may be rephrased as an arc shape.

なお、本実施の形態では、電熱線４が用いられる場合を例に挙げて説明したが、これに限定されない。例えば、電熱線４の代わりに、ＰＴＣ（positive temperature coefficient heater）ヒータが用いられてもよい。 In addition, although the case where the heating wire 4 is used was mentioned as an example and demonstrated in this Embodiment, it is not limited to this. For example, instead of the heating wire 4, a PTC (positive temperature coefficient heater) heater may be used.

第２接着部材５は、例えば、ポリエチレン（ＰＥ)または不織布により構成された基材の一面（絶縁シート３との接合面）にアクリル系の接着剤が塗布され、その基材の他面（絶縁シート３との接合面の裏面）にＰＥＴシートが設けられた部材である。すなわち、第２接着部材５は、片面テープとして機能する。 For the second adhesive member 5, for example, an acrylic adhesive is applied to one surface of a base material (joint surface with the insulating sheet 3) made of polyethylene (PE) or nonwoven fabric, and the other surface of the base material (insulating It is a member provided with a PET sheet on the back surface of the joint surface with the sheet 3). That is, the second adhesive member 5 functions as a single-sided tape.

なお、本実施の形態では、電子部品１０を構成する各部材の形状が円形である場合を例に挙げて説明したが、これに限定されない。また、電子部品１０を構成する各部材の材料は、上記例示に限定されない。 In addition, although the case where each member which comprises the electronic component 10 has a circular shape was demonstrated as an example in this Embodiment, it is not limited to this. Further, the material of each member constituting the electronic component 10 is not limited to the above examples.

上述した表層部材１、第１接着部材２、絶縁シート３、電熱線４、第２接着部材５が積層されることにより、積層体としての電子部品１０が形成される。そして、その電子部品１０に対してエンボス加工（浮き出し加工または凸加工ともいう）を施すことにより、電子部品１０には、例えば、図２に示す立体模様７が形成される。 By laminating the surface member 1, the first adhesive member 2, the insulating sheet 3, the heating wire 4, and the second adhesive member 5, the electronic component 10 is formed as a laminate. Then, the electronic component 10 is embossed (also referred to as embossing or convex processing) to form the three-dimensional pattern 7 shown in FIG. 2, for example.

図２は、電子部品１０に形成される立体模様７の一例を示す斜視図である。なお、図２では、電子部品１０の構成要素のうち表層部材１以外の図示を省略している。 FIG. 2 is a perspective view showing an example of the three-dimensional pattern 7 formed on the electronic component 10. As shown in FIG. In FIG. 2, illustration of components other than the surface layer member 1 among the constituent elements of the electronic component 10 is omitted.

図２に示すように、表層部材１の表面には、エンボス加工により、アルファベットの「Ｃ」を表す立体模様７が形成される。なお、図２に示す立体模様７は一例であり、これに限定されない。 As shown in FIG. 2, the surface of the surface layer member 1 is embossed to form a three-dimensional pattern 7 representing the letter "C". In addition, the three-dimensional pattern 7 shown in FIG. 2 is an example, and is not limited to this.

なお、本実施の形態では、立体模様７を形成するためのプレス加工の一例として、エンボス加工を例に挙げて説明したが、これに限定されない。例えば、立体模様７は、デボス加工（凹加工）により形成されてもよい。 In the present embodiment, embossing has been described as an example of press working for forming the three-dimensional pattern 7, but the present invention is not limited to this. For example, the three-dimensional pattern 7 may be formed by debossing (recessing).

上述した立体模様７は、電熱線４に含まれる湾曲部６の位置に対応して形成される。換言すれば、各湾曲部６は、立体模様７の位置に対応して形成される。 The three-dimensional pattern 7 described above is formed corresponding to the position of the curved portion 6 included in the heating wire 4 . In other words, each curved portion 6 is formed corresponding to the position of the three-dimensional pattern 7 .

図３は、立体模様７と湾曲部６の位置関係の一例を模式的に示す正面図である。図３に示すように、湾曲部６は、立体模様７の外縁部分に重なるように形成される。換言すれば、電熱線４のうち立体模様７の外縁部分と重なる部分は、湾曲状に形成されている。なお、図３に示すように、湾曲部６は、その頂上部分に立体模様７の外縁部分が重なるように形成されることが好ましい。 FIG. 3 is a front view schematically showing an example of the positional relationship between the three-dimensional pattern 7 and the curved portion 6. As shown in FIG. As shown in FIG. 3 , the curved portion 6 is formed so as to overlap the outer edge portion of the three-dimensional pattern 7 . In other words, the portion of the heating wire 4 that overlaps the outer edge portion of the three-dimensional pattern 7 is formed in a curved shape. In addition, as shown in FIG. 3, the curved portion 6 is preferably formed so that the outer edge portion of the three-dimensional pattern 7 overlaps the top portion of the curved portion 6 .

また、複数の湾曲部６は、電熱線４の延伸方向において、連続して（互いに隣接して）設けられない。すなわち、図３に示すように、２つの湾曲部６の間には、水平方向（図の左右方向）に延びる直線部が含まれる。よって、電熱線４の延伸方向に沿って設けられる複数の湾曲部６は、つづら折り状（蛇腹状）を形成しない。 Moreover, the plurality of curved portions 6 are not provided continuously (adjacent to each other) in the extending direction of the heating wire 4 . That is, as shown in FIG. 3, between the two curved portions 6 is included a straight portion extending in the horizontal direction (horizontal direction in the drawing). Therefore, the plurality of curved portions 6 provided along the extending direction of the heating wire 4 do not form a zigzag shape (accordion shape).

立体模様７が形成された電子部品１０は、例えば、車両に搭載されるエンブレム（オーナメントともいう）として用いられる。その場合、電子部品１０は、例えば、車両に搭載された検知デバイス２０の前方に配置される（図１参照）。このとき、電子部品１０は、立体模様７が車両の前進方向を向くように（表層部材１が最前に位置するように）配置される。 The electronic component 10 having the three-dimensional pattern 7 formed thereon is used, for example, as an emblem (also referred to as an ornament) mounted on a vehicle. In that case, the electronic component 10 is arranged, for example, in front of a detection device 20 mounted on the vehicle (see FIG. 1). At this time, the electronic component 10 is arranged so that the three-dimensional pattern 7 faces the forward direction of the vehicle (so that the surface layer member 1 is positioned in the forefront).

図１に示した検知デバイス２０は、車両の周辺の状況を検出するデバイスである。検知デバイス２０としては、例えば、ミリ波レーダまたはレーザレーダ等を用いることができるが、これらに限定されない。 The sensing device 20 shown in FIG. 1 is a device that senses the situation around the vehicle. For example, a millimeter wave radar, a laser radar, or the like can be used as the detection device 20, but the detection device 20 is not limited to these.

なお、上述したように、電子部品１０が検知デバイス２０の前方に配置される場合、電子部品１０を構成する各部材は、検知デバイス２０から送出される光または電磁波等を透過する材料で構成されればよい。 As described above, when the electronic component 10 is arranged in front of the detection device 20, each member constituting the electronic component 10 is made of a material that transmits light or electromagnetic waves emitted from the detection device 20. All you have to do is

また、本実施の形態では、表層部材１と絶縁シート３とを接合するために、第１接着部材２を用いる場合を例に挙げて説明したが、これに限定されない。例えば、第１接着部材２の代わりに、接合具（例えば、ネジ、ボルト、ナット等）を用いてもよい。または、例えば、表層部材１は、絶縁シート３が嵌合される構造を有してもよい。同様に、第２接着部材５の代わりに、上記接合具を用いて、絶縁シート３に対してＰＥＴシートが接合されてもよい。または、例えば、絶縁シート３は、ＰＥＴシートが嵌合される構造を有してもよい。 Further, in this embodiment, the case where the first adhesive member 2 is used to join the surface layer member 1 and the insulating sheet 3 is described as an example, but the present invention is not limited to this. For example, instead of the first adhesive member 2, a connector (for example, screw, bolt, nut, etc.) may be used. Alternatively, for example, the surface layer member 1 may have a structure in which the insulating sheet 3 is fitted. Similarly, instead of the second adhesive member 5, the PET sheet may be joined to the insulating sheet 3 using the joining tool. Alternatively, for example, the insulating sheet 3 may have a structure in which a PET sheet is fitted.

以上、本実施の形態の電子部品１０の構成について説明した。 The configuration of the electronic component 10 according to the present embodiment has been described above.

次に、電子部品１０の製造方法について、以下に説明する。 Next, a method for manufacturing the electronic component 10 will be described below.

まず、絶縁シート３の金属層に対してエッチング加工を行い、電熱線４を形成する。このとき、電熱線４のうちプレス加工（例えば、エンボス加工）が施される部分を、湾曲状に形成する。これにより、電熱線４において、図１、図３に示した複数の湾曲部６が形成される。 First, the metal layer of the insulating sheet 3 is etched to form the heating wire 4 . At this time, the portion of the heating wire 4 to be pressed (eg, embossed) is formed into a curved shape. As a result, a plurality of curved portions 6 shown in FIGS. 1 and 3 are formed in the heating wire 4 .

次に、図１に示したように、表層部材１、第１接着部材２、絶縁シート３、第２接着部材５を配置し、それらを積層する。 Next, as shown in FIG. 1, the surface layer member 1, the first adhesive member 2, the insulating sheet 3, and the second adhesive member 5 are arranged and laminated.

次に、形成された積層体（電子部品１０）に対し、立体模様７が形成されるようにプレス加工を行う。これにより、電子部品１０には、図２に示した立体模様７が形成される。 Next, the formed laminate (electronic component 10) is pressed so that the three-dimensional pattern 7 is formed. Thereby, the three-dimensional pattern 7 shown in FIG. 2 is formed on the electronic component 10 .

以上、電子部品１０の製造方法について説明した。 The method for manufacturing the electronic component 10 has been described above.

以上説明したように、本実施の形態の電子部品１０では、電熱線４のうちプレス加工が施される部分に、電熱線４の延伸方向において互いに隣接しない湾曲部６を形成する。これにより、プレス加工の際の電熱線４の応力を緩和し、電熱線４の断線を防止することができる。また、絶縁シート３に穴を開ける必要がないため、幅広い種類の電子部品に適用することができる。よって、本実施の形態は、導体の断線防止を実現するとともに、高い汎用性を実現することができる。 As described above, in the electronic component 10 of the present embodiment, the curved portions 6 that are not adjacent to each other in the extending direction of the heating wire 4 are formed in the portion of the heating wire 4 to be pressed. As a result, the stress of the heating wire 4 during press working can be relaxed, and breakage of the heating wire 4 can be prevented. Moreover, since it is not necessary to make a hole in the insulating sheet 3, it can be applied to a wide variety of electronic parts. Therefore, the present embodiment can prevent disconnection of conductors and achieve high versatility.

また、本実施の形態の電子部品１０は、電熱線４の発熱により、電子部品１０を加熱することができる。よって、電子部品１０に付着した水分を取り除いたり、電子部品１０に水分が付着することを予防したりすることができる。したがって、検知デバイス２０から送出される光または電磁波等の透過性をより向上させることができる。 Moreover, the electronic component 10 of the present embodiment can be heated by the heat generated by the heating wire 4 . Therefore, it is possible to remove the moisture adhering to the electronic component 10 or to prevent the moisture from adhering to the electronic component 10 . Therefore, it is possible to further improve the transmittance of light or electromagnetic waves emitted from the sensing device 20 .

なお、本開示は、上記実施の形態の説明に限定されず、その趣旨を逸脱しない範囲において種々の変形が可能である。以下、変形例について説明する。 It should be noted that the present disclosure is not limited to the description of the above embodiments, and various modifications are possible without departing from the scope of the present disclosure. Modifications will be described below.

［変形例１］
電熱線４のパターンは、図３に示す態様に限定されない。また、湾曲部６の位置、数、大きさ、および曲率は、図３に示す態様に限定されない。 [Modification 1]
The pattern of the heating wire 4 is not limited to the mode shown in FIG. Moreover, the position, number, size, and curvature of the curved portions 6 are not limited to those shown in FIG.

［変形例２］
実施の形態では、電子部品１０が車両用エンブレムとして用いられる場合を例に挙げて説明したが、これに限定されない。 [Modification 2]
In the embodiment, the case where the electronic component 10 is used as a vehicle emblem has been described as an example, but the present invention is not limited to this.

例えば、電子部品１０は、車両の窓ガラスに取り付けられ、その窓ガラスを加熱するステッカタイプの面状発熱体として用いられてもよい。これにより、窓ガラスにおける霜取りまたは曇り止めを実現することができる。 For example, the electronic component 10 may be attached to a windowpane of a vehicle and used as a sticker-type planar heating element that heats the windowpane. Defrosting or defogging of the window glass can thereby be achieved.

［変形例３］
実施の形態では、電子部品１０が積層体である場合を例に挙げて説明したが、これに限定されない。また、実施の形態では、電子部品１０がプレス加工を施されるものである場合を例に挙げて説明したが、これに限定されない。 [Modification 3]
In the embodiment, the case where electronic component 10 is a laminate has been described as an example, but the present invention is not limited to this. Further, in the embodiment, the case where the electronic component 10 is subjected to press working has been described as an example, but the present invention is not limited to this.

以下、図４を用いて、本変形例の電子部品３０について説明する。図４は、本変形例の電子部品３０の構成の一例を示す斜視図である。 The electronic component 30 of this modified example will be described below with reference to FIG. FIG. 4 is a perspective view showing an example of the configuration of the electronic component 30 of this modified example.

図４に示すように、電子部品３０は、フレキシブル基板８（第１部材の一例に相当）、ＩＣチップ９、および銅箔線１１（導体の一例に相当）を有する。ＩＣチップ９および銅箔線１１は、フレキシブル基板８上に設けられている。銅箔線１１は、ＩＣチップ９と電気的に接続されている。 As shown in FIG. 4, the electronic component 30 has a flexible substrate 8 (corresponding to an example of a first member), an IC chip 9, and a copper foil wire 11 (corresponding to an example of a conductor). IC chip 9 and copper foil wires 11 are provided on flexible substrate 8 . Copper foil wire 11 is electrically connected to IC chip 9 .

銅箔線１１は、湾曲状に形成された湾曲部１３を有する。湾曲部１３は、フレキシブル基板８の折り曲げ部１２の位置に設けられている。折り曲げ部１２は、銅箔線１１が設けられたフレキシブル基板８に対して曲げ加工が施される部分である。 The copper foil wire 11 has a curved portion 13 formed in a curved shape. The curved portion 13 is provided at the position of the bent portion 12 of the flexible substrate 8 . The bent portion 12 is a portion where the flexible substrate 8 provided with the copper foil wire 11 is bent.

このように、曲げ加工が施される前に、折り曲げ部１２に位置する銅箔線１１を湾曲状に形成しておくことにより、曲げ加工の際の銅箔線１１の応力を緩和し、銅箔線１１の断線を防止することができる。また、フレキシブル基板８に穴を開ける必要がないため、幅広い種類の電子部品に適用することができる。よって、本変形例は、実施の形態と同様に、導体の断線防止を実現するとともに、高い汎用性を実現することができる。 In this way, by forming the copper foil wire 11 positioned at the bent portion 12 into a curved shape before bending, the stress of the copper foil wire 11 during bending is relieved, and the copper foil wire 11 is bent. Breakage of the foil wire 11 can be prevented. Moreover, since it is not necessary to make a hole in the flexible substrate 8, it can be applied to a wide variety of electronic components. Therefore, like the embodiment, this modification can prevent disconnection of the conductor and achieve high versatility.

なお、本変形例では、導体の一例として銅箔線１１を挙げて説明したが、これに限定されない。例えば、導体は、リード線であってもよい。 In addition, although the copper foil wire 11 was mentioned as an example of the conductor and demonstrated in this modification, it is not limited to this. For example, the conductor may be a lead wire.

以上、変形例について説明した。上記変形例は、任意に組み合わせて実施されてもよい。 The modification has been described above. The above modifications may be implemented in any combination.

本開示の電子部品およびその製造方法は、線状の導体が部材に設けられ、曲げ加工またはプレス加工が施される電子部品およびその製造方法に有用である。 INDUSTRIAL APPLICABILITY The electronic component and the manufacturing method thereof according to the present disclosure are useful as an electronic component in which a member is provided with a linear conductor and subjected to bending or pressing, and the manufacturing method thereof.

１ 表層部材
２ 第１接着部材
３ 絶縁シート
４ 電熱線
５ 第２接着部材
６、１３ 湾曲部
７ 立体模様
８ フレキシブル基板
９ ＩＣチップ
１０、３０ 電子部品
１１ 銅箔線
１２ 折り曲げ部
２０ 検知デバイス 1 surface layer member 2 first adhesive member 3 insulating sheet 4 heating wire 5 second adhesive member 6, 13 curved portion 7 three-dimensional pattern 8 flexible substrate 9 IC chip 10, 30 electronic component 11 copper foil wire 12 bent portion 20 detection device

Claims (16)

線状の導体と、前記導体が設けられる第１部材とを有する電子部品であって、
前記導体のうち曲げ加工またはプレス加工が施される部分に、前記導体の延伸方向において互いに隣接しない湾曲部が設けられている、
電子部品。 An electronic component having a linear conductor and a first member provided with the conductor,
A portion of the conductor that is subjected to bending or pressing is provided with curved portions that are not adjacent to each other in the extending direction of the conductor,
electronic components. 前記第１部材に積層される第２部材をさらに有し、
前記電子部品は、
前記第１部材と前記第２部材とが積層された状態で施されるプレス加工により立体模様が形成された積層体である、
請求項１に記載の電子部品。 further comprising a second member laminated on the first member;
The electronic component is
A laminate in which a three-dimensional pattern is formed by press working in a state in which the first member and the second member are laminated,
The electronic component according to claim 1. 前記湾曲部は、前記立体模様の外縁部分に重なるように形成される、
請求項２に記載の電子部品。 The curved portion is formed so as to overlap an outer edge portion of the three-dimensional pattern,
The electronic component according to claim 2. 前記湾曲部は、その頂上部分に前記立体模様の外縁部分が重なるように形成される、
請求項３に記載の電子部品。 The curved portion is formed so that the outer edge portion of the three-dimensional pattern overlaps the top portion thereof.
The electronic component according to claim 3. 前記導体は、通電により発熱する電熱線である、
請求項１から４のいずれか１項に記載の電子部品。 The conductor is a heating wire that generates heat when energized,
The electronic component according to any one of claims 1 to 4. 前記プレス加工は、エンボス加工である、
請求項１から５のいずれか１項に記載の電子部品。 The pressing is embossing,
The electronic component according to any one of claims 1 to 5. 前記電子部品は、
車両に設けられるエンブレムである、
請求項２から６のいずれか１項に記載の電子部品。 The electronic component is
It is an emblem provided on the vehicle,
The electronic component according to any one of claims 2 to 6. 前記電子部品は、
車両の周辺の状況を検知する検知デバイスの前方に配置される、
請求項２から７のいずれか１項に記載の電子部品。 The electronic component is
It is placed in front of the sensing device that detects the situation around the vehicle,
The electronic component according to any one of claims 2 to 7. 線状の導体と、前記導体が設けられる第１部材とを有する電子部品の製造方法であって、
前記導体のうち曲げ加工またはプレス加工が施される部分に、前記導体の延伸方向において互いに隣接しない湾曲部を形成し、
前記導体が設けられた前記第１部材に対して曲げ加工またはプレス加工を施す、
電子部品の製造方法。 A method for manufacturing an electronic component having a linear conductor and a first member provided with the conductor,
Forming curved portions that are not adjacent to each other in the extension direction of the conductor in a portion of the conductor that is subjected to bending or pressing,
Bending or pressing the first member provided with the conductor,
A method for manufacturing electronic components. 前記プレス加工の前に、前記導体が設けられた前記第１部材に第２部材を積層し、
前記第２部材が積層された前記第１部材に対して、立体模様が形成されるように前記プレス加工を行う、
請求項９に記載の電子部品の製造方法。 Laminating a second member on the first member provided with the conductor before the pressing,
Performing the press working so that a three-dimensional pattern is formed on the first member on which the second member is laminated,
A method for manufacturing an electronic component according to claim 9 . 前記湾曲部を、前記立体模様の外縁部分に重なるように形成する、
請求項１０に記載の電子部品の製造方法。 forming the curved portion so as to overlap an outer edge portion of the three-dimensional pattern;
The method for manufacturing an electronic component according to claim 10. 前記湾曲部を、その頂上部分に前記立体模様の外縁部分が重なるように形成する、
請求項１１に記載の電子部品の製造方法。 The curved portion is formed so that the outer edge portion of the three-dimensional pattern overlaps with the top portion of the curved portion.
The method for manufacturing an electronic component according to claim 11. 前記導体は、通電により発熱する電熱線である、
請求項９から１２のいずれか１項に記載の電子部品の製造方法。 The conductor is a heating wire that generates heat when energized,
The method for manufacturing an electronic component according to any one of claims 9 to 12. 前記プレス加工は、エンボス加工である、
請求項９から１３のいずれか１項に記載の電子部品の製造方法。 The pressing is embossing,
The method for manufacturing an electronic component according to any one of claims 9 to 13. 前記電子部品は、
車両に設けられるエンブレムである、
請求項１０から１４のいずれか１項に記載の電子部品の製造方法。 The electronic component is
It is an emblem provided on the vehicle,
The method for manufacturing an electronic component according to any one of claims 10 to 14. 前記電子部品は、
車両の周辺の状況を検知する検知デバイスの前方に配置される、
請求項１０から１５のいずれか１項に記載の電子部品の製造方法。 The electronic component is
It is placed in front of the sensing device that detects the situation around the vehicle,
The method for manufacturing an electronic component according to any one of claims 10 to 15.
JP2021015195A 2021-02-02 2021-02-02 Electronic component and manufacturing method thereof Pending JP2022118584A (en)

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