JP2022107988A - Processing device - Google Patents

Abstract

To provide a processing device that allows a user to easily and reliably recognize the relation between a processed area of a work piece seen in an image and processing conditions which have been applied for the processing on the area.SOLUTION: A control unit of a processing device comprises a coordinate storage section that stores coordinates indicating an area within a work piece to be processed by a processing unit, a processing condition storage section that stores processing conditions which may be applied when the processing unit processes the work piece, a linking information generation section that generates linking information which links the area within the work piece indicated by the coordinates stored in the coordinate storage section with the processing conditions stored in the processing condition storage section and to be applied when the processing unit processes the area, a linking information storage section that stores the linking information, and a processing condition display section that, based on an area specified by using an input unit and the linking information stored in the linking information storage section, displays the processing conditions linked with the specified area on a display unit.SELECTED DRAWING: Figure 3

Description

The present invention relates to a processing apparatus used when processing plate-like workpieces such as wafers.

In electronic equipment represented by mobile phones and personal computers, device chips having devices with various functions are essential components. A device chip is formed by, for example, dividing the surface of a wafer made of a material such as silicon or sapphire into a plurality of regions by dividing lines (streets), forming devices in each region, and then forming the wafer along the dividing lines. is obtained by dividing

When dividing a plate-shaped workpiece such as a wafer into a plurality of chips, for example, a cutting device equipped with a spindle to which an annular cutting blade is attached, or a laser with a wavelength that is absorbed by the workpiece A laser processing device or the like having a laser oscillator capable of generating a beam is used. The workpiece is processed by rotating the cutting blade at high speed to cut into the workpiece, or by irradiating the workpiece with a laser beam generated by a laser oscillator.

2. Description of the Related Art A processing apparatus such as a cutting apparatus or a laser processing apparatus is usually provided with a camera capable of capturing an image of a workpiece and generating an image (see, for example, Patent Document 1). For example, when selecting processing conditions suitable for a workpiece, the workpiece for evaluation is photographed with a camera after being processed under arbitrary processing conditions, and based on the state of processing marks etc. in the obtained image , to evaluate the applied processing conditions.

JP 2016-197702 A

By the way, when selecting processing conditions as described above, one workpiece for evaluation is often processed under a plurality of different processing conditions. In this case, since a plurality of machining marks with different machining conditions are formed on one workpiece, the operator must check the relationship between the machining marks formed on the workpiece and the applied machining conditions. Must be properly recorded. In other words, in this method, the work required of the operator is complicated, and human error is likely to occur.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a processing apparatus that can easily and reliably confirm the relationship between a processed area in an image of a workpiece and the processing conditions applied to the processing of this area. That is.

According to one aspect of the present invention, there is provided a processing apparatus comprising a chuck table that holds a workpiece, a processing unit that processes the workpiece held by the chuck table, and a machining unit that is held by the chuck table. a camera for photographing the workpiece and generating an image of the workpiece; a display unit for displaying the image generated by the camera; and the workpiece captured in the image displayed on the display unit. an input unit used when specifying a region within a workpiece; and a control unit, wherein the control unit stores coordinates indicating a region within the workpiece to be processed by the processing unit. a coordinate storage unit, a machining condition storage unit for storing machining conditions that can be applied when the machining unit processes the workpiece; a linking information generating unit for generating linking information linking a region and a processing condition stored in the processing condition storage unit and applied when the processing unit processes the region; Linking to the specified area based on the linking information storage unit to be stored, the area specified using the input unit, and the linking information stored in the linking information storage unit and a machining condition display unit that causes the display unit to display the machining conditions that have been obtained.

In one aspect of the present invention, the control unit may further include a mark display section that causes the display unit to display a mark indicating the area superimposed on the image. Further, the coordinate storage unit stores a plurality of the areas, and the mark display unit superimposes a plurality of the marks indicating the plurality of areas in a distinguishable manner on the image and displays the mark on the display unit. You can display it.

Further, the processing condition display unit may cause the display unit to display a list showing the relationship between the plurality of marks pointing to the plurality of regions and the processing conditions associated with each of the plurality of regions. good. Further, when the mark in the list is specified using the input unit, the control unit controls the image held on the chuck table so as to generate an enlarged image of the area indicated by the mark. The object to be processed may be photographed by the camera.

Further, the control unit may generate report information in which the image obtained by enlarging the area and the processing conditions associated with the area are associated with each other. The control unit may further include a port to which an external storage device is connected, and the control unit may store the report information in the external storage device connected to the port.

In one aspect of the present invention, the processing unit has a laser oscillator that generates a laser beam that irradiates the workpiece, and a region within the workpiece processed by the processing unit includes: Machining traces may be formed by the laser beam.

In one aspect of the present invention, the machining unit has a spindle to which an annular cutting blade is attached, and a region in the workpiece that has been machined by the machining unit is covered by the cutting blade. Machining traces may be formed.

A processing apparatus according to one aspect of the present invention includes: a coordinate storage unit that stores coordinates indicating an area within a workpiece to be processed by a processing unit; A machining condition storage unit that stores the machining conditions to be obtained, an area within the workpiece indicated by the coordinates stored in the coordinate storage unit, and a machining unit that is stored in the machining condition storage unit and applied when machining this area Since it includes a control unit having a tying information generation unit that generates tying information for tying the machining conditions and a tying information storage unit that stores the tying information, the operator can perform processing in the workpiece There is no need to record the relationship between the area subjected to processing and the processing conditions applied for this processing.

Further, the control unit sends the processing conditions linked to the specified area to the display unit based on the specified area using the input unit and the linking information stored in the linking information storage unit. Since it has a machining condition display section to be displayed, only by specifying the machined area in the workpiece using the input unit, the machined area in the workpiece and the conditions applied to this machining can be displayed. It is possible to confirm the relationship between As described above, according to the processing apparatus according to one aspect of the present invention, it is possible to easily and reliably determine the relationship between the processed area in the image of the workpiece and the processing conditions applied to this processing. I can confirm.

FIG. 1 is a perspective view showing a laser processing apparatus. FIG. 2 is a schematic diagram showing how a laser beam travels inside the laser processing apparatus. FIG. 3 is a functional block diagram showing part of the functional structure of the control unit. FIG. 4 is a table showing an example of machining conditions stored in the machining condition storage unit. FIG. 5 is a table showing an example of coordinates stored in the coordinate storage unit. FIG. 6 is a table showing an example of linking information stored in the linking information storage unit. FIG. 7 is a plan view showing an example of part of the workpiece after machining. FIG. 8 is a diagram schematically showing an example of a generated image. FIG. 9 is a diagram schematically showing examples of images and marks displayed on the touch screen. FIG. 10 is a diagram schematically showing examples of images, marks, and processing conditions displayed on the touch screen. FIG. 11 is a diagram schematically showing an example of an image and two marks displayed on the touch screen. FIG. 12 is a diagram schematically showing an example of an image displayed on the touch screen, two marks, and processing conditions. FIG. 13 is a diagram schematically showing an example of an image and a plurality of marks displayed on the touch screen. FIG. 14 is a diagram schematically showing an example of an image, a plurality of marks, and a list displayed on the touch screen. FIG. 15 is a diagram schematically showing an example of an image generated when a mark in the list is specified. FIG. 16 is a diagram schematically showing an example of report information. FIG. 17 is a perspective view showing a laser processing apparatus configured to be connectable with an external storage device.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a laser processing device (processing device) 2 according to this embodiment. In FIG. 1, some elements of the laser processing apparatus 2 are shown as functional blocks. The X-axis direction (processing feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (vertical direction) used in the description of this laser processing apparatus 2 are perpendicular to each other.

As shown in FIG. 1, the laser processing apparatus 2 includes a base 4 that supports various elements that constitute the laser processing apparatus 2. As shown in FIG. A horizontal movement mechanism (processing feed mechanism, indexing feed mechanism) 6 is arranged on the upper surface of the base 4 . The horizontal movement mechanism 6 includes a pair of Y-axis guide rails 8 fixed to the upper surface of the base 4 and elongated in a direction substantially parallel to the Y-axis direction. A Y-axis moving plate 10 is attached to the Y-axis guide rail 8 so as to be slidable along the Y-axis direction.

A nut (not shown) forming a ball screw is provided on the lower surface side of the Y-axis moving plate 10 . A long screw shaft 12 is rotatably connected to the nut in a direction substantially parallel to the longitudinal direction of the Y-axis guide rail 8 . A Y-axis pulse motor 14 is connected to one end of the screw shaft 12 . When the screw shaft 12 is rotated by the Y-axis pulse motor 14, the Y-axis moving plate 10 moves along the longitudinal direction of the Y-axis guide rail 8 in the Y-axis direction.

A pair of X-axis guide rails 16 extending in a direction substantially parallel to the X-axis direction is provided on the upper surface of the Y-axis movement plate 10 . An X-axis moving plate 18 is attached to the X-axis guide rail 16 so as to be slidable along the X-axis direction. A nut (not shown) forming a ball screw is provided on the lower surface side of the X-axis movement plate 18 .

A long screw shaft 20 is rotatably connected to the nut in a direction substantially parallel to the longitudinal direction of the X-axis guide rail 16 . An X-axis pulse motor 22 is connected to one end of the screw shaft 20 . When the screw shaft 20 is rotated by the X-axis pulse motor 22, the X-axis moving plate 18 moves along the longitudinal direction of the X-axis guide rail 16 in the X-axis direction.

A columnar table base 24 is arranged on the upper surface side of the X-axis movement plate 18 . A chuck table 26 used to hold the workpiece 11 is arranged above the table base 24 . A rotary drive source (not shown) such as a motor is connected to the lower portion of the table base 24 .

The chuck table 26 rotates around a rotation axis substantially parallel to the Z-axis direction by the force generated from this rotational drive source. The table base 24 and the chuck table 26 are moved in the X-axis direction and the Y-axis direction (processing feed, indexing feed) by the horizontal movement mechanism 6 described above.

The workpiece 11 is, for example, a disk-shaped wafer made of a material such as silicon or sapphire. The surface (upper surface in FIG. 1) side of the workpiece 11 is partitioned into a plurality of small regions by a plurality of streets (planned division lines) that intersect with each other. Devices such as LEDs (Light Emitting Diodes) are formed.

For example, a tape (dicing tape) 13 having a diameter larger than that of the workpiece 11 is attached to the back surface (lower surface in FIG. 1) of the workpiece 11 . Also, the outer peripheral portion of the tape 13 is fixed to an annular frame 15 . Thus, in this embodiment, the workpiece 11 is processed while being supported by the frame 15 via the tape 13 .

In this embodiment, a disk-shaped wafer made of silicon, sapphire, or the like is used as the workpiece 11, but the material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, a substrate or the like made of other semiconductors, other ceramics, resins, metals, or other materials can be used as the workpiece 11 .

Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices formed on the workpiece 11 . For example, devices may not be formed on the workpiece 11 or the like for evaluation used for selecting processing conditions. In addition, the workpiece 11 can be processed in a state where the tape 13 is attached to the surface side, a state in which the tape 13 is not attached to the surface side and the back side, and a state in which the frame 15 is not supported.

A part of the upper surface of the chuck table 26 is formed of, for example, a porous material, and serves as a holding surface that holds the workpiece 11 in contact with the tape 13 (the workpiece 11 when the tape 13 is not attached). 26a. The holding surface 26a is substantially parallel to the X-axis direction and the Y-axis direction.

Further, the holding surface 26a is connected to a suction source (not shown) such as a vacuum pump through a channel (not shown) provided inside the chuck table 26 or the like. Therefore, when the workpiece 11 is placed on the holding surface 26a and the negative pressure of the suction source is applied, the workpiece 11 is held by the holding surface 26a. Around the chuck table 26 are provided four clamps 28 capable of fixing the annular frame 15 supporting the workpiece 11 .

A support structure 30 having a side surface substantially perpendicular to the X-axis direction is provided in a region on one side of the horizontal movement mechanism 6 in the Y-axis direction. A vertical movement mechanism (height adjustment mechanism) 32 is arranged on the side surface of the support structure 30 . The vertical movement mechanism 32 includes a pair of Z-axis guide rails 34 fixed to the side surfaces of the support structure 30 and elongated in a direction generally parallel to the Z-axis direction. A Z-axis moving plate 36 is attached to the Z-axis guide rail 34 so as to be slidable along the Z-axis direction.

A nut (not shown) forming a ball screw is provided on the back side of the Z-axis moving plate 36 (on the Z-axis guide rail 34 side). A long screw shaft (not shown) is rotatably connected to the nut in a direction substantially parallel to the longitudinal direction of the Z-axis guide rail 34 . A Z-axis pulse motor 38 is connected to one end of the screw shaft. When the Z-axis pulse motor 38 rotates the screw shaft, the Z-axis moving plate 36 moves in the Z-axis direction along the longitudinal direction of the Z-axis guide rail 34 .

A support 40 is fixed to the surface side of the Z-axis moving plate 36, and a laser irradiation unit capable of processing the workpiece 11 held on the chuck table 26 is attached to the support 40. A part of (processing unit) 42 is supported. FIG. 2 is a schematic diagram showing how the laser beam 21 travels inside the laser processing apparatus 2. As shown in FIG.

As shown in FIGS. 1 and 2, the laser irradiation unit 42 includes, for example, a laser oscillator 44 fixed to the base 4, a tubular housing 46 supported by the support 40 and elongated in the Y-axis direction, and a housing 46 and an irradiation head 48 provided at the end of (the other end in the Y-axis direction).

The laser oscillator 44 has a laser medium such as Nd:YAG suitable for laser oscillation, for example, generates the laser beam 21 used for processing the workpiece 11, and emits it to the mirror 46a on the housing 46 side. do. In this embodiment, the laser oscillator 44 generates a pulsed laser beam having a wavelength that is absorbed by the workpiece 11 .

However, the laser oscillator 44 may be configured to generate a pulsed laser beam having a wavelength that passes through the workpiece 11 . A laser beam having a wavelength that is absorbed by the workpiece 11 is suitable for ablation processing of the workpiece 11, and a laser beam having a wavelength that passes through the workpiece 11 causes the workpiece 11 to undergo multiphoton absorption. It is suitable for processing to modify by such as.

The housing 46 accommodates a part of the optical system constituting the laser irradiation unit 42 and guides the laser beam 21 emitted from the laser oscillator 44 and reflected by the mirror 46 a to the irradiation head 48 . In this embodiment, as shown in FIG. 2, the housing 46 accommodates a mirror 46b that reflects the laser beam 21 toward the irradiation head 48 side. Both the mirror 46a and the mirror 46b may be accommodated in the housing 46. FIG.

Another part of the optical system that constitutes the laser irradiation unit 42 is accommodated in the irradiation head 48 . For example, the irradiation head 48 directs the laser beam 21 directed from the housing 46 downward using a mirror 48a or the like, and converges the laser beam 21 at a predetermined height on the side of the chuck table 26 with a lens 48b disposed below. . Lens 48b is typically a convex lens.

As shown in FIG. 1, a camera (photographing unit) 50 fixed to the housing 46 is arranged in a region on one side of the irradiation head 48 in the X-axis direction. The camera 50 includes, for example, a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor sensitive to visible light, and the workpiece 11 held on the chuck table 26 (the upper surface of the workpiece 11 or the like) is photographed to generate an image showing the workpiece 11 .

The housing 46 and the irradiation head 48 of the laser irradiation unit 42 are moved in the Z-axis direction by the vertical movement mechanism 32 together with the camera 50 described above. That is, the vertical movement mechanism 32 moves elements such as the mirror 48 a and the lens 48 b provided on the irradiation head 48 in a direction substantially perpendicular to the holding surface 26 a of the chuck table 26 .

In this embodiment, the laser oscillator 44 is fixed to the base 4, but the laser oscillator 44 is configured to be movable in the Z-axis direction together with the housing 46 and the like by the vertical movement mechanism 32. May be. Further, an actuator or the like may be provided in the irradiation head 48 so that only the lens 48b can be independently moved in the Z-axis direction.

The top of the base 4 is covered with a cover (not shown) that can accommodate each element. A touch screen (display unit, input unit) 52 serving as a user interface is arranged on the side surface of this cover. An image generated by the camera 50 is displayed on the touch screen 52, for example.

Further, for example, processing conditions and the like applied when processing the workpiece 11 are input or selected using the touch screen 52 . Furthermore, the touch screen 52 is also used when specifying a region within the workpiece 11 to be imaged, as will be described later. Note that instead of the touch screen 52 in which the display unit and the input unit are integrated, a display unit such as a liquid crystal display and an input unit such as a keyboard and a mouse may be provided.

Elements such as the horizontal movement mechanism 6 , the vertical movement mechanism 32 , the laser irradiation unit 42 , the camera 50 , the touch screen 52 and the like are each connected to the control unit 54 . The control unit 54 is configured by, for example, a computer including a processing device and a storage device, and controls each element described above in accordance with a series of steps required for machining the workpiece 11 .

The processing device is typically a CPU (Central Processing Unit), and performs various processes necessary to control the elements described above. The storage device includes, for example, a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a hard disk drive and a flash memory. The functions of the control unit 54 are realized, for example, by the processing device operating according to software stored in the storage device. However, the functions of the control unit 54 may be realized only by hardware.

Next, part of the functional structure of the control unit 54 according to this embodiment will be described together with the operation of the laser processing apparatus 2. FIG. FIG. 3 is a functional block diagram showing part of the functional structure of the control unit 54. As shown in FIG. 3 also shows some external elements of the control unit 54. As shown in FIG.

As shown in FIG. 3, the control unit 54 includes a processing condition storage section 54a capable of storing one or more processing conditions that can be applied when processing the workpiece 11 by the laser irradiation unit 42. As shown in FIG. For example, when an operator inputs processing conditions to the control unit 54 using the touch screen 52 or the like, the processing conditions are stored in the processing condition storage section 54a.

In a state in which one or more machining conditions are stored in the machining condition storage unit 54a, the operator selects an arbitrary machining condition using the touch screen 52 or the like to reapply the target machining condition to the workpiece to be machined. Object 11 can be processed. FIG. 4 is a table showing an example of processing conditions stored in the processing condition storage unit 54a.

The parameters included in the processing conditions include the output of the laser beam 21, the repetition frequency of the laser beam 21, the defocus of the laser beam 21, as well as the number of shots of the laser beam 21 and the chuck table. There are 26 feed speeds, the number of lines to be machined, the interval (pitch) between the lines to be machined, and so on. However, there are no restrictions on the types and number of parameters included in the processing conditions.

The control unit 54 also includes a coordinate storage section 54b that stores the coordinates of the area (area within the workpiece 11) to be processed by the laser irradiation unit 42. FIG. For example, when the operator inputs (or selects) the machining conditions and then uses the touch screen 52 or the like to input the coordinates of the area where machining is to be started to the control unit 54, the control unit 54 outputs the machining conditions and the input Based on the coordinates obtained, the coordinates indicating the region to be processed are calculated and stored in the coordinate storage section 54b.

More specifically, for example, the control unit 54 regards the area to be processed as a rectangular area, calculates the coordinates of its four corners, and stores them in the coordinate storage section 54b. Further, for example, when processing a plurality of regions separated from each other (typically, a plurality of lines), the control unit 54 calculates coordinates corresponding to all regions and stores them in the coordinate storage section 54b. do.

FIG. 5 is a table showing an example of coordinates stored in the coordinate storage unit 54b. 5 includes a plurality of coordinates indicating a region 1 to be processed under the processing condition 1 included in the table of FIG. 4 and a region 2 to be processed under the processing condition 2 included in the table of FIG. A table is shown. Region 1 is composed of two regions (region 1A and region 1B) separated from each other.

Furthermore, the control unit 54 links the area indicated by the coordinates stored in the coordinate storage section 54b and the processing conditions stored in the processing condition storage section 54a and applied when the laser irradiation unit 42 processes this area. It includes a tying information generation unit 54c that generates tying information to be attached. For example, when the processing conditions to be applied are input (or selected) and the coordinates indicating the region to be processed are stored in the coordinate storage unit 54b, the linking information generation unit 54c connects the processing conditions and the region. Generate the linking information to be linked.

For example, by designating a region indicated by coordinates stored in the coordinate storage unit 54b, the control unit 54 reads the processing conditions applied to the processing of the designated region from the processing condition storage unit 54a. configured to be output. The control unit 54 includes a linking information storage section 54d, and the linking information generated by the linking information generating section 54c is stored in the linking information storage section 54d.

FIG. 6 is a table showing an example of linking information stored in the linking information storage unit 54d. Processing condition 1 is associated with region 1, and processing condition 2 is associated with region 2, using the table (association information) in FIG.

The workpiece 11 is processed in parallel with the above-described processing, or before or after the above-described processing. For example, when processing conditions and coordinates of a region where processing is to be started are input, the control unit 54 controls the operations of the horizontal movement mechanism 6, the vertical movement mechanism 32, the laser irradiation unit 42, etc. based on these. to machine the workpiece 11 held on the chuck table 26 .

In the present embodiment, a machining mark 11 a is formed by the laser beam 21 in a region of the workpiece 11 that has been machined (ablated) by the laser irradiation unit 42 . FIG. 7 is a plan view showing an example of part of the workpiece 11 after machining. Note that FIG. 7 shows the workpiece 11 when the region 1 (that is, two regions 1A and 1B separated from each other) is processed under the processing condition 1 described above.

When the processing of the workpiece 11 is completed, the control unit 54 controls the operations of the horizontal movement mechanism 6, the vertical movement mechanism 32, the camera 50, etc., and photographs the workpiece 11 held on the chuck table 26. FIG. Specifically, the control unit 54 takes an image of the area processed by the laser irradiation unit 42 in the workpiece 11 with the camera 50, and generates an image showing the processing marks 11a. FIG. 8 is a diagram schematically showing an example of the generated image 23a.

The image 23a generated by the camera 50 is stored, for example, in the image storage section 54e in the control unit 54. FIG. The image 23a stored in the image storage section 54e is read out by the control unit 54 and displayed on the touch screen 52 as necessary. The control unit 54 includes a mark display section 54f capable of displaying on the touch screen 52 a mark such as a pin pointing to an area within the image 23a.

For the control unit 54, the positional relationship among the chuck table 26, the laser irradiation unit 42, the camera 50, etc. is known. That is, the control unit 54 grasps the relationship between the coordinates stored in the coordinate storage section 54b and the positions within the image 23a generated by the camera 50. FIG. Based on this relationship, the mark display unit 54f superimposes the mark on the image 23a so as to indicate within the image 23a the area indicated by the coordinates stored in the coordinate storage unit 54b (that is, the processed area). indicate.

FIG. 9 is a diagram schematically showing an example of the image 23a and the mark 25a displayed on the touch screen 52. As shown in FIG. Note that the mark 25a in FIG. 9 points to the region 1 in which the working mark 11a is formed. Also, the mark 25 a is displayed so that the operator can select it using the touch screen 52 . For example, the operator touches a portion of the touch screen 52 where the mark 25a is displayed and selects the mark 25a, thereby specifying the area 1 indicated by the mark 25a (that is, the area 1 where the machining mark 11a is formed). be.

Based on the area specified using the touch screen 52 and the linking information stored in the linking information storage unit 54d, the control unit 54 displays the processing conditions linked to the specified area on the touch screen. 52 further includes a processing condition display portion 54g to be displayed. Specifically, the processing condition display unit 54g refers to the tying information stored in the tying information storage unit 54d, and reads the processing conditions that are tied to the designated area from the processing condition storage unit 54a. After that, it is displayed on the touch screen 52 so as to be superimposed on the image 23a and the like.

Therefore, for example, when the operator selects the mark 25a using the touch screen 52 and designates the area 1 indicated by this mark 25a, the touch screen 52 displays the time when the designated area 1 is processed (that is, the processing trace 11a ) is displayed.

FIG. 10 is a diagram schematically showing an example of the image 23a, the mark 25a, and the processing condition 1 displayed on the touch screen 52. As shown in FIG. In addition, there is no restriction on the mode of the display column 27a for displaying the processing condition 1. FIG. For example, the display column 27a may be displayed in a mode in which the image 23a and the mark 25a superimposed thereon can be visually recognized, typically in a translucent manner. Also, the size, shape, etc. of the display field 27a can be arbitrarily set.

FIG. 11 is a diagram schematically showing examples of the image 23b, the mark 25a, and the mark 25b displayed on the touch screen 52. As shown in FIG. The mark 25a indicates the area 1 where the machining mark 11a is formed under the machining condition 1, and the mark 25b indicates the area 2 where the machining mark 11b is formed under another machining condition 2. FIG. In other words, the image 23b in FIG. 11 is generated after the regions 1 and 2 have been processed.

For example, when the operator selects the mark 25b using the touch screen 52 and designates the area 2 indicated by this mark 25b, the touch screen 52 displays the area when the designated area 2 is processed (that is, the processing mark 11b is formed). ) is displayed.

FIG. 12 is a diagram schematically showing an example of the image 23b, the marks 25a, the marks 25b, and the processing condition 2 displayed on the touch screen 52. As shown in FIG. The processing condition 2 is displayed in a display field 27b similar to the display field 27a described above. Further, when the mark 25a is selected in the state of FIG. 11, the processing condition 1 applied when processing the designated area 1 is displayed on the touch screen 52 as shown in FIG.

As described above, the laser processing device (processing device) 2 according to the present embodiment has a coordinate storage unit that stores the coordinates indicating the region to be processed by the laser irradiation unit (processing unit) 42 in the workpiece 11. 54b, a processing condition storage unit 54a that stores processing conditions that can be applied when the laser irradiation unit 42 processes the workpiece 11, and the coordinates stored in the coordinate storage unit 54b. A linking information generating unit 54c for generating linking information linking a region and a processing condition stored in the processing condition storage unit 54a and applied when the laser irradiation unit 42 processes this region; and the control unit 54 having the linking information storage unit 54d that stores the relationship between the processed area in the workpiece 11 and the processing conditions applied to this processing. No need to record.

In addition, the control unit 54 is linked to the specified area based on the area specified using the touch screen (input unit) 52 and the linking information stored in the linking information storage unit 54d. Since it has a processing condition display section 54g for displaying the processed processing conditions on the touch screen (display unit) 52, only by using the touch screen 52 to specify a region in the work piece 11 that has undergone processing, the work piece can be displayed. The relationship between the processed area in 11 and the processing conditions applied to this processing can be confirmed. As described above, according to the laser processing apparatus 2 according to the present embodiment, the relationship between the processed region in the image to be processed 11 and the processing conditions applied to this processing can be easily and reliably determined. can be confirmed.

It should be noted that the present invention is not limited to the description of the above-described embodiment and can be implemented with various modifications. The laser processing device (processing device) 2 may further have a plurality of functions. For example, when a region (region 1 in FIG. 5) processed under a certain processing condition (processing condition 1 in FIG. 5) is composed of a plurality of regions (regions 1A and 1B in FIG. 5) separated from each other, Alternatively, the mark display unit 54f may cause the touch screen (display unit) 52 to display a plurality of marks that indicate a plurality of areas separated from each other in a distinguishable manner so as to be superimposed on the image.

FIG. 13 is a diagram schematically showing examples of the image 23b displayed on the touch screen 52, the mark 25a-1, the mark 25a-2, and the mark 25b. As shown in FIG. 13, the mark 25a-1 indicates the region 1A in which the working mark 11a-1 is formed, and the mark 25a-2 indicates the region 1B in which the working mark 11a-2 is formed. , a mark 25b indicates the region 2 in which the machining mark 11b is formed.

Further, the processing condition display unit 54g causes the touch screen (display unit) 52 to display a list showing the relationship between the plurality of marks indicating the plurality of regions and the processing conditions associated with the plurality of regions. Also good. FIG. 14 is a diagram schematically showing examples of the image 23b, the mark 25a-1, the mark 25a-2, the mark 25b, and the list displayed on the touch screen 52. FIG.

In the display column 27c, marks 25a-1, 25a-2, and 25b indicating the areas 1A, 1B, and 2, respectively, and areas 1A (area 1), area 1B (area 1), and areas A list showing the relationship between the processing conditions 1 and 2 linked to each of the processing conditions 2 is displayed. Displaying such a list on the touch screen 52 facilitates comparison and confirmation of areas or conditions.

It is desirable that the processing condition display unit 54g causes the touch screen 52 to display a list showing the relationship between the plurality of marks indicating all of the plurality of regions and the processing conditions associated with each of the plurality of regions. . If all of the plurality of areas are included in the list, all the areas and conditions can be grasped just by looking at the list, so there is no need to confirm the entire workpiece 11 based on the image, and work efficiency is improved. Get better.

However, the processing condition display unit 54g displays a plurality of marks indicating a plurality of areas designated using the touch screen (input unit) 52, and processing conditions associated with each of the plurality of designated areas. A list showing relationships may be displayed on the touch screen 52 . In this case, for example, marks of low importance can be excluded from the list, so the list does not become complicated.

Also, when any mark in the list is specified using the touch screen (input unit) 52, the control unit 54 causes the chuck table 26 to generate an enlarged image of the area indicated by the mark. The held workpiece 11 may be photographed by the camera 50 . FIG. 15 is a diagram schematically showing an example of an image 23c generated when a mark in the list is designated.

For example, when the mark 25a-1 corresponding to the area 1A is specified in the list, the control unit 54 causes the image held on the chuck table 26 to generate an enlarged image of the area 1A indicated by the mark 25a-1. The camera 50 is caused to take an image of the workpiece 11 which has been removed. That is, the control unit 54 relatively moves the chuck table 26 and the camera 50, adjusts the range of the field of view (magnification of enlargement) of the camera 50, and photographs the workpiece 11 with the camera 50. Let

As a result, as shown in FIG. 15, an image 23c showing the enlarged area 1A (that is, the enlarged working trace 11a) is generated. Note that designation of a mark in the list is performed, for example, by the operator touching a portion of the touch screen 52 where the target mark or processing conditions are displayed. The image 23c generated by the camera 50 is stored in the image storage section 54e in the control unit 54, for example. The image 23c stored in the image storage section 54e is read by the control unit 54 and displayed on the touch screen 52 as necessary.

Furthermore, when one or more marks in the list are specified, the control unit 54 creates a report in which an image obtained by enlarging the area indicated by each mark and the processing conditions associated with this area are associated. information may be generated. FIG. 16 is a diagram schematically showing an example of generated report information 29. As shown in FIG.

For example, with the mark 25a-1 corresponding to the area 1A designated in the list, the operator uses the touch screen (input unit) 52 to input an instruction to the control unit 54 to generate report information. In this case, the control unit 54 generates report information in which the image 23c obtained by enlarging the area 1A and the processing conditions 1 linked to the area 1A (area 1) are arranged side by side.

Further, for example, in a state in which the mark 25a-1 corresponding to the area 1A, the mark 25a-2 corresponding to the area 1B, and the mark 25b corresponding to the area 2 are specified in the list, the operator can A generation instruction is input to the control unit 54 . In this case, control unit 54 generates report information 29 shown in FIG.

That is, the control unit 54 arranges the image 23c obtained by enlarging the area 1A and the processing condition 1 linked to the area 1A (area 1). Further, the control unit 54 arranges the image 23d obtained by enlarging the area 1B and the processing condition 1 linked to the area 1B (area 1). Then, the control unit 54 arranges the image 23e obtained by enlarging the area 2 and the processing condition 2 linked to the area 2 .

The report information 29 generated in this manner can be stored in an external storage device and distributed as needed. FIG. 17 is a perspective view showing a laser processing device (processing device) 102 configured to be connectable with an external storage device. In addition, in FIG. 17 , the same reference numerals as the elements of the laser processing apparatus 2 are assigned to the same elements as the elements of the laser processing apparatus 2 according to the above-described embodiment.

As shown in FIG. 17, the laser processing device 102 includes a port 56 to which an external storage device (not shown) is connected. The external storage device is, for example, a portable auxiliary storage device such as a USB memory (USB flash drive), and the port 56 is, for example, a USB port. However, the types of external storage device and port 56 are not particularly limited.

For example, when an instruction to store the report information 29 in the external storage device is input to the control unit 54 through the touch screen (input unit) 52, the control unit 54 stores the report information in the external storage device connected to the port 56. 29 is memorized. The operator can then remove the external storage device from port 56 and distribute it with report information 29 .

Furthermore, in the above-described embodiment and modifications, the case where the workpiece 11 is processed linearly has been described as an example, but the manner of machining the workpiece 11 can be arbitrarily set or changed. For example, the workpiece 11 may be processed into dots by one shot of a pulsed laser beam.

Further, in the above-described embodiments and modifications, the laser processing device 2 that processes the workpiece 11 by irradiating the laser beam 21 has been described, but the processing device according to the present invention cuts the workpiece with a cutting blade. A cutting device or the like for processing the workpiece 11 may be used. A basic structure of the cutting device is the same as that of the laser processing device 2 . However, this cutting apparatus is provided with a cutting unit (processing unit) instead of the laser irradiation unit (processing unit) 42 described above.

The cutting unit has a spindle on which annular cutting blades are mounted. The workpiece 11 is machined by rotating the spindle and causing the cutting blade to cut into the workpiece 11 . In other words, in this case, a machining mark is formed by the cutting blade in the region of the workpiece 11 that has been machined by the cutting unit.

Note that this cutting device includes an X-axis movement mechanism (processing feed mechanism) for moving the chuck table in the X-axis direction instead of the horizontal movement mechanism (processing feed mechanism, indexing feed mechanism) 6 of the laser processing device 2, and a Y-axis movement mechanism (index feed mechanism) for moving the cutting unit in the Y-axis direction. The parameters included in the machining conditions include the number of rotations of the spindle, the feed speed of the chuck table, the number of lines to be machined, the interval (pitch) between the lines to be machined, and the like.

In addition, the structures, methods, and the like according to the above-described embodiments and modifications can be modified as appropriate without departing from the scope of the present invention.

2: Laser processing equipment (processing equipment)
4: base 6: horizontal movement mechanism (processing feed mechanism, indexing feed mechanism)
8: Y-axis guide rail 10: Y-axis movement plate 12: Screw shaft 14: Y-axis pulse motor 16: X-axis guide rail 18: X-axis movement plate 20: Screw shaft 22: X-axis pulse motor 24: Table base 26 : Chuck table 26a : Holding surface 28 : Clamp 30 : Support structure 32 : Vertical movement mechanism (height adjustment mechanism)
34: Z-axis guide rail 36: Z-axis moving plate 38: Z-axis pulse motor 40: Supporting tool 42: Laser irradiation unit (processing unit)
44: Laser oscillator 46: Housing 46a: Mirror 46b: Mirror 48: Irradiation head 48a: Mirror 48b: Lens 50: Camera (shooting unit)
52: Touch screen (display unit, input unit)
54: Control unit 54a: Processing condition storage unit 54b: Coordinate storage unit 54c: Linking information generation unit 54d: Linking information storage unit 54e: Image storage unit 54f: Mark display unit 54g: Processing condition display unit 56: Port 11: Work piece 11a: processing marks 11a-1: processing marks 11a-2: processing marks 11b: processing marks 13: tape (dicing tape)
15: Frame 21: Laser beam 23a: Image 23b: Image 23c: Image 23d: Image 23e: Image 25a: Mark 25a-1: Mark 25a-2: Mark 25b: Mark 27a: Display field 27b: Display field 27c: Display field 29: Report information

Claims (9)

A processing device,
a chuck table for holding a workpiece;
a machining unit for machining the workpiece held on the chuck table;
a camera that captures the workpiece held on the chuck table to generate an image of the workpiece;
a display unit for displaying the image generated by the camera;
an input unit used to designate a region within the workpiece that appears in the image displayed on the display unit;
a control unit;
The control unit is
a coordinate storage unit that stores coordinates indicating an area in the workpiece to be processed by the processing unit;
a machining condition storage unit that stores machining conditions that can be applied when the machining unit processes the workpiece;
A string that links an area within the workpiece indicated by the coordinates stored in the coordinate storage unit and a processing condition stored in the processing condition storage unit and applied when the processing unit processes the area. a linking information generation unit that generates linking information;
a linking information storage unit that stores the linking information;
Based on the region specified using the input unit and the linking information stored in the linking information storage unit, the processing conditions linked to the specified region are sent to the display unit. A processing apparatus having a processing condition display unit for displaying. 2. The processing apparatus according to claim 1, wherein said control unit further includes a mark display section for causing said display unit to display a mark indicating said area superimposed on said image. The coordinate storage unit stores a plurality of the areas,
3. The processing apparatus according to claim 2, wherein the mark display unit causes the display unit to display the plurality of marks indicating the plurality of areas in a distinguishable manner so as to be superimposed on the image. 4. The processing condition display unit causes the display unit to display a list showing a relationship between the plurality of marks indicating the plurality of regions and the processing conditions associated with the plurality of regions. Processing equipment as described. When the mark in the list is specified using the input unit, the control unit controls the workpiece held on the chuck table so as to generate an enlarged image of the area pointed to by the mark. 5. The processing apparatus according to claim 4, wherein the object is photographed by the camera. 6. The processing apparatus according to claim 5, wherein the control unit generates report information in which the image obtained by enlarging the area and the processing conditions linked to the area are associated with each other. further comprising a port to which an external storage device is connected;
7. The processing apparatus according to claim 6, wherein said control unit stores said report information in said external storage device connected to said port. The processing unit has a laser oscillator that generates a laser beam that irradiates the workpiece,
8. The processing apparatus according to any one of claims 1 to 7, wherein traces of processing by said laser beam are formed in a region of said workpiece processed by said processing unit. The processing unit has a spindle on which an annular cutting blade is mounted,
8. The processing apparatus according to any one of claims 1 to 7, wherein traces of processing by said cutting blade are formed in a region of said workpiece processed by said processing unit.

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