JP2022103511A - Antistatic resin composition and molding thereof - Google Patents

Abstract

To provide an antistatic resin composition that can give a molding having high antistatic performance, which lasts for a long time, and also has high weather resistance, and to provide a molding thereof.SOLUTION: An antistatic resin composition contains, relative to 100 pts.mass of a synthetic resin, at least one polymer compound (E) of 3-40 pts.mass and at least one photostabilizer (F) of 0.001-30 pts.mass. The polymer compound (E) is at least one polymer compound that results from the reaction of: a polyester (a) derived from the reaction of a diol (a1) and a dicarboxylic acid (a2); a compound (b) having a hydroxy group at both terminals including at least one ethyleneoxy group; and an epoxy compound (D) having at least two epoxy groups. The diol (a1) is at least one of 1,4-butanediol and ethylene glycol. The dicarboxylic acid (a2) is succinic acid, or a mixture of a dicarboxylic acid containing succinic acid. There is also provided a molding thereof.SELECTED DRAWING: None

Description

The present invention relates to an antistatic resin composition (hereinafter, also simply referred to as “resin composition”) and a molded product thereof, and in particular, can provide a molded product having excellent antistatic durability and weather resistance. The present invention relates to a possible antistatic resin composition and a molded product thereof.

Synthetic resins, especially thermoplastic resins, are used for building materials, automobile materials, home appliances / electronic materials, textile materials, packaging materials, agricultural materials, home appliances, etc., depending on various physical properties such as molding processability and low specific gravity. It is widely used in various molded bodies such as housing materials, household goods, films, sheets and structural parts.
These thermoplastic resins have excellent insulating properties and are easily charged, and may attract dust or dust to spoil the appearance of the product. Further, when the molded product is an electronic product, the circuit may not operate normally due to charging. Furthermore, an electric shock may be generated from the charged resin member, which not only makes the person feel uncomfortable when the electric shock is received, but also may induce an explosion accident in the presence of flammable gas or dust.
Today, in order to prevent the resin member from being charged, measures such as adding an antistatic agent to the thermoplastic resin are taken. Examples of such an antistatic agent include a coating type used by spraying, dipping, and coating on a resin molded surface, and a kneading type that is processed by adding it as an additive to a polymer material. In addition to being inferior in the durability of the antistatic property, there is a problem that the antistatic agent is wiped off by touching the surface.
To solve such a problem, Patent Document 1 proposes a polymer-type antistatic agent that is kneaded into a synthetic resin and used.
On the other hand, synthetic resin is required to have weather resistance because the product life is shortened due to discoloration and cracks on the surface of the molded product when exposed to sunlight or ultraviolet rays such as outdoors. There is.

International Publication No. 2014/115745

However, the conventional antistatic agent is not always sufficient in antistatic performance and its sustainability, and further improvement is desired at present. Further, it is desired to suppress discoloration and crack generation of the synthetic resin containing an antistatic agent due to ultraviolet rays.
Therefore, an object of the present invention is to provide an antistatic resin composition and a molded product thereof, which can provide a molded product having excellent antistatic performance, durability thereof, and weather resistance.

As a result of diligent studies to solve the above problems, the present inventors have found that the above problems can be solved by using an antistatic polymer compound having a specific structure and a light stabilizer in combination. The present invention has been completed.
That is, the present invention contains 3 to 40 parts by mass of one or more polymer compounds (E) and 0.001 to 30 parts by mass of one or more light stabilizers (F) with respect to 100 parts by mass of the synthetic resin. In the antistatic resin composition,
The polymer compound (E) is a polyester (a) obtained by reacting a diol (a1) with a dicarboxylic acid (a2), and a compound (b) having one or more ethyleneoxy groups and having hydroxyl groups at both ends. , One or more of the polymer compounds obtained by reacting with the epoxy compound (D) having two or more epoxy groups, wherein the diol (a1) is 1,4-butanediol or ethylene glycol. At least one of them provides an antistatic resin composition in which the dicarboxylic acid (a2) is a succinic acid or a mixture of dicarboxylic acids containing a succinic acid.

The present invention also provides the antistatic resin composition in which the light stabilizer (F) is an ultraviolet absorber (F-1).
The present invention also provides the antistatic resin composition, wherein the light stabilizer (F) is a hindered amine-based light stabilizer (F-2).
The present invention also provides the antistatic resin composition, wherein the light stabilizer (F) is an ultraviolet absorber (F-1) and a hindered amine-based light stabilizer (F-2). be.

Further, in the present invention, the polymer compound (E) has a polyester block (A) composed of the polyester (a) and a polyether block (B) composed of the compound (b). A hydroxyl group formed by reacting a hydroxyl group or a carboxyl group at the end of the polyester (a) with a hydroxyl group at the end of the compound (b) and an epoxy group or an epoxy group of the epoxy compound (D). The present invention provides the antistatic resin composition having a structure formed by a reaction with and formed through an ester bond or an ether bond.
Further, in the present invention, the polymer compound (E) is carboxyled to both ends formed by repeatedly and alternately bonding the polyester block (A) and the polyether block (B) via an ester bond. The present invention provides the antistatic resin composition having a structure in which a block polymer (C) having a group and the epoxy compound (D) are bonded via an ester bond.

The present invention also provides the antistatic resin composition having a structure in which the polyester (a) of the polymer compound (E) has a carboxyl group at both ends.
The present invention also provides the antistatic resin composition in which the compound (b) of the polymer compound (E) is polyethylene glycol.
The present invention also provides the antistatic resin composition in which the crystallization temperature of the polymer compound (E) is in the range of 20 to 70 ° C.

The present invention also provides the antistatic resin composition in which the number average molecular weight of the polyester (a) of the polymer compound (E) is 1,000 to 10,000 in terms of polystyrene. ..
The present invention also provides the antistatic resin composition in which the number average molecular weight of the block polymer (C) of the polymer compound (E) is 5,000 to 50,000 in terms of polystyrene. ..
Further, the present invention further provides the antistatic resin composition containing 0.01 to 8 parts by mass of one or more selected from the group consisting of an alkali metal salt (H) and an ionic liquid (J). It is something to do.

Further, in the present invention, the synthetic resin is selected from the group consisting of polyolefin-based resins, polystyrene-based resins, polycarbonate-based resins, polyester-based resins, polyether-based resins, polyamide-based resins, halogen-containing resins, and copolymers thereof. The present invention provides the antistatic resin composition which is one or more kinds.
The present invention also provides a molded product obtained from the antistatic resin composition.

According to the present invention, it is possible to provide an antistatic resin composition and a molded product thereof, which can provide a molded product having excellent antistatic performance, durability thereof, and weather resistance.

Hereinafter, embodiments of the present invention will be described in detail.
The resin composition of the present invention contains 3 to 40 parts by mass of one or more polymer compounds (E) and 0.001 to 30 parts by mass of one or more light stabilizers (F) with respect to 100 parts by mass of synthetic resin. contains. In the resin composition of the present invention, the polymer compound (E) has a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2) and both ends having one or more ethyleneoxy groups. One or more of the polymer compounds obtained by reacting the compound (b) having a hydroxyl group and the epoxy compound (D) having two or more epoxy groups, and the diol (a1) is 1,4. -At least one of butanediol or ethylene glycol, said dicarboxylic acid (a2) is a succinic acid or a mixture of dicarboxylic acids containing succinic acid.

First, the synthetic resin used in the resin composition of the present invention will be described.
The resin that can be used in the resin composition of the present invention is not particularly limited as long as it is a synthetic resin, but a thermoplastic resin is preferable from the viewpoint of moldability, and among them, antistatic property, its durability, and weather resistance are preferable. From this point of view, polyolefin-based resins, polystyrene-based resins, polycarbonate-based resins, polyester-based resins, polyether-based resins, polyamide-based resins, and halogen-containing resins are more preferable, and polyolefin-based resins, polystyrene-based resins, and polycarbonate-based resins are particularly preferable.

Examples of the polyolefin resin include polyethylene, low density polyethylene, linear low density polyethylene, high density polyethylene, crosslinked polyethylene, ultrahigh molecular weight polyethylene, polypropylene, homopolypoly, impact copolymer polypropylene, random copolymer polypropylene, block copolymer polypropylene, and the like. Isotactic polypropylene, syndiotactic polypropylene, hemiisotactic polypropylene, polybutene, cycloolefin polymer, stereoblock polypropylene, poly-3-methyl-1-butene, poly-3-methyl-1-pentene, poly-4- Α-olefin polymer such as methyl-1-pentene, block or random copolymer of ethylene-propylene, ethylene-methylmethacrylate copolymer, ethylene-methylacrylate copolymer, ethylene-ethylacrylate copolymer, ethylene- Examples thereof include butyl acrylate copolymers, α-olefin copolymers such as ethylene-vinyl acetate copolymers, polyfluoroolefins, and polyolefin-based thermoplastic elastomers, and two or more of these copolymers may be used.

Examples of the styrenic resin include vinyl group-containing aromatic hydrocarbons alone, vinyl group-containing aromatic hydrocarbons, and other monomers (for example, maleic anhydride, phenylmaleimide, and (meth) acrylic acid ester. Copolymers with (butadiene, (meth) acrylonitrile, etc.) include, for example, polystyrene (PS) resin, impact resistant polystyrene (HIPS), acrylonitrile-styrene (AS) resin, acrylonitrile-butadiene-styrene (ABS) resin. , Methyl methacrylate-butadiene-styrene (MBS) resin, heat resistant ABS resin, acrylate-styrene-acrylonitrile (ASA) resin, styrene-maleic anhydride (SMA) resin, methacrylate-styrene (MS) resin, styrene-isoprene-styrene Thermoplastic resins such as (SIS) resin, acrylonitrile-ethylene propylene rubber-styrene (AES) resin, styrene-butadiene-butylene-styrene (SBBS) resin, methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin, and these. Styrene-ethylene-butylene-styrene (SEBS) resin, styrene-ethylene-propylene-styrene (SEPS) resin, styrene-ethylene-propylene (SEP) resin, styrene-ethylene- Examples thereof include hydrogenated styrene-based elastomer resins such as ethylene-propylene-styrene (SEEPS) resin.

Examples of the polycarbonate-based resin include polycarbonate, polycarbonate / ABS resin, polycarbonate / ASA resin, and branched polycarbonate.
Examples of the polyester-based resin include polyalkylene terephthalates such as polyethylene terephthalate, polybutylene terephthalate, and polycyclohexanedimethylene terephthalate; aromatic polyesters such as polyalkylene naphthalate such as polyethylene naphthalate and polybutylene naphthalate; and polytetramethylene terephthalate. Linear polyesters such as: polyhydroxybutyrate, polycaprolactone, polybutylene succinate, polyethylene succinate, polylactic acid, polyapple acid, polyglycolic acid, polydioxane, poly (2-oxetanone) and other degradable aliphatic polyesters, etc. Can be mentioned.
Examples of the polyether resin include polyacetal, polyphenylene ether, polyether ketone, polyether ether ketone, polyether ketone ketone, polyether ether ketone ketone, polyether sulfone, polyetherimide and the like.

Examples of the polyamide resin include ε-caprolactam (nylon 6), undecanelactam (nylon 11), lauryllactam (nylon 12), aminocaproic acid, enantractum, 7-aminoheptanoic acid, 11-aminoundecanoic acid, 9-. Polymers such as aminononanoic acid, α-pyrrolidone, α-piperidone; diamines such as hexamethylenediamine, nonanediamine, nonanemethylenediamine, methylpentadiamine, undecamethylenediamine, dodecanemethylenediamine, metaxylenediamine, and adibic acid, sebacic acid. , A copolymer obtained by copolymerizing with a carboxylic acid compound such as a dicarboxylic acid such as terephthalic acid, isophthalic acid, dodecandicarboxylic acid and glutaric acid, or a mixture of these polymers or copolymers. .. Further, examples thereof include aramid resins such as DuPont's product name "Kevlar", DuPont's product name "Nomex", Teijin Limited's product name "Twaron" (registered trademark), and "Conex".

Examples of the halogen-containing resin include polyvinyl chloride, polyvinylidene chloride, chlorinated polyethylene, chlorinated polypropylene, polyvinylidene fluoride, rubber chloride, vinyl chloride-vinyl acetate copolymer, vinyl chloride-ethylene copolymer, and vinyl chloride-chloride. Examples include vinylidene copolymer, vinyl chloride-vinylidene chloride-vinyl acetate ternary copolymer, vinyl chloride-acrylic acid ester copolymer, vinyl chloride-maleic acid ester copolymer, vinyl chloride-cyclohexylmaleimide copolymer and the like. Be done.

Further examples of thermoplastic resins include petroleum resins, kumaron resins, polyvinyl acetates, acrylic resins, polymethylmethacrylates, polyvinyl alcohols, polyvinylformal, polyvinylbutyral, polyphenylene sulfides, polyurethanes, fibrous resins, and polyimide resins. , Polysulfone, thermoplastic resins such as liquid crystal polymers and blends thereof can be used.
The thermoplastic resin includes isoprene rubber, butadiene rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene copolymer rubber, fluororubber, silicone rubber, polyester elastomer, nitrile elastomer, nylon elastomer, vinyl chloride elastomer, and the like. It may be an elastomer such as a polyamide-based elastomer or a polyurethane-based elastomer, or may be used in combination.

In the resin composition of the present invention, these thermoplastic resins may be used alone or in combination of two or more. It may also be alloyed. In addition, these thermoplastic resins have molecular weight, degree of polymerization, density, softening point, ratio of insoluble matter in solvent, degree of stereoregularity, presence / absence of catalyst residue, type and compounding ratio of monomer as raw material, polymerization catalyst. It can be used regardless of the type of (for example, Cheegler catalyst, metallosen catalyst, etc.) and the like.

Next, the polymer compound (E) will be described. The polymer compound (E) is blended to impart antistatic properties to the resin composition. The polymer compound (E) used in the present invention is a polyester (a) obtained by reacting a diol (a1) with a dicarboxylic acid (a2), and a compound having one or more ethyleneoxy groups and having hydroxyl groups at both ends (a compound having hydroxyl groups at both ends. It is a polymer compound obtained by reacting b) with an epoxy compound (D) having two or more epoxy groups. Here, the ethyleneoxy group is a group represented by the following general formula (1).

In the polymer compound (E), the diol (a1) is at least one of 1,4-butanediol or ethylene glycol. Compared with other diols, these are excellent in antistatic property, their durability, and weather resistance.

In the polymer compound (E), the dicarboxylic acid (a2) is succinic acid or a mixture of dicarboxylic acids containing succinic acid. Succinic acid is superior to other dicarboxylic acids in terms of antistatic property, its durability, and weather resistance.
Examples of dicarboxylic acids that can be used as a mixture with succinic acid include aliphatic dicarboxylic acids and aromatic dicarboxylic acids, which may be used alone or in combination of two or more.

The aliphatic dicarboxylic acid preferably includes an aliphatic dicarboxylic acid having 2 to 20 carbon atoms, and examples thereof include oxalic acid, malonic acid, glutamic acid, methylsuccinic acid, dimethylmalonic acid, 3-methylglutaric acid and ethylsuccinic acid. , Isopropylalonic acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid (1,10-decandicarboxylic acid), tridecanedioic acid, tetradecanedioic acid, hexadecanedioic acid,
Octadecandioic acid, Eikosandioic acid, 1,3-cyclopentanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, Examples thereof include 1,4-cyclohexanedioacetic acid, 1,3-cyclohexanedioacetic acid, 1,2-cyclohexanediacetic acid, 1,1-cyclohexanedioacetic acid, dimer acid, maleic acid, and fumaric acid.

The aromatic dicarboxylic acid preferably includes an aromatic dicarboxylic acid having 8 to 20 carbon atoms, and examples thereof include terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid and β-phenylglutal. Acid, α-phenyladipic acid, β-phenyladipic acid, biphenyl-2,2'-dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate and 3-sulfoisophthalic acid Examples include potassium.

The dicarboxylic acid used in the mixture with succinic acid is preferably an aliphatic dicarboxylic acid, more preferably adipic acid and sebacic acid, and most preferably adipic acid, from the viewpoints of antistatic property, its durability and weather resistance.
The dicarboxylic acid (a2) has a molar ratio of succinic acid to another dicarboxylic acid (for example, adipic acid) of 100: 0 to 50:50 from the viewpoint of antistatic property, its durability, and weather resistance. Is preferable, 100: 0 to 70:30 is more preferable, 100: 0 to 80:20 is even more preferable, and 100: 0 to 90:10 is even more preferable.

In the polymer compound (E), from the viewpoint of antistatic property, its durability, and weather resistance, the polyester block (A) composed of the polyester (a) and the polyether composed of the compound (b) An epoxy group of an epoxy compound (D) having a block (B), a hydroxyl group or a carboxyl group at the end of the polyester (a), a hydroxyl group at the end of the compound (b), and two or more epoxy groups. , Or a structure formed by a reaction with a hydroxyl group formed by the reaction of an epoxy group, preferably via an ester bond or an ether bond. Here, the hydroxyl group formed by the reaction of the epoxy group is a hydroxyl group formed by the ring-opening reaction of the epoxy group of the epoxy compound (D) with the hydroxyl group or the carboxyl group.

In the polymer compound (E), in particular, from the viewpoint of antistatic property, its durability, and weather resistance, the polyester block (A) and the polyether block (B) are repeatedly alternated via an ester bond. It is preferable that the block polymer (C) having a carboxyl group at both ends and the epoxy compound (D) having two or more epoxy groups are bonded to each other via an ester bond. The ester bond here is an ester bond formed by the reaction of the carboxyl group of the block polymer (C) and the epoxy group of the epoxy compound (D), and further, the reaction of forming this ester bond is an epoxy group. Examples thereof include an ester bond formed by reacting a hydroxyl group formed by opening a ring with a carboxyl group. In the present invention, any of these ester bonds may be used for bonding, and bonding via both ester bonds is more preferable from the viewpoint of antistatic property, its durability, and weather resistance.

In the polymer compound (E), the polyester (a) contains at least 1,4-butanediol or ethylene glycol as the diol component (a1), and succinic acid or succinic acid as the dicarboxylic acid component (a2). A mixture of dicarboxylic acids may be subjected to an esterification reaction (including a transesterification reaction). The esterification reaction referred to in the present invention is not particularly limited as long as it is a reaction for forming an ester bond. The diol component (a1) may be 1,4-butanediol alone, ethylene glycol alone, or both 1,4-butanediol and ethylene glycol. The diol component (a1) is preferably 1,4-butanediol from the viewpoint of antistatic property, its durability and weather resistance, and when 1,4-butanediol and ethylene glycol are used in combination, 1,4-butanediol is used. The larger the ratio is, the more preferable it is from the viewpoint of antistatic property, its durability, and weather resistance.

The diol component (a1) has a molar ratio of 1,4-butanediol to ethylene glycol, preferably 100: 0 to 50:50, preferably 100, from the viewpoint of antistatic property, its durability, and weather resistance. : 0 to 70:30 is more preferable, and 100: 0 to 80:20 is even more preferable.

The succinic acid which is the dicarboxylic acid component (a2) used in the polymer compound (E) may be a derivative of succinic acid, and examples of the derivative include succinic acid anhydride and succinic acid ester (for example, succinic acid). Examples thereof include succinic acid alkyl esters such as methyl esters), succinic acid alkali metal salts (eg, succinic acid sodium salts), and succinic acid halides (eg, succinic acid chloride). Further, the dicarboxylic acid used as a mixture with succinic acid may also be a derivative of the dicarboxylic acid. Examples of the derivative include carboxylic acid anhydride, carboxylic acid ester (for example, carboxylic acid alkyl ester such as carboxylic acid methyl ester), carboxylic acid alkali metal salt (for example, carboxylic acid sodium salt), and carboxylic acid halide (for example, carboxylic acid). Acid chloride) and the like. The number of dicarboxylic acids used as a mixture with succinic acid may be two or more.

Next, the compound (b) and the block (B) of the preferred polymer compound (E) as a polyether will be described. The block (B) of the polyether is composed of the compound (b) having one or more ethyleneoxy groups represented by the following general formula (1) and having hydroxyl groups at both ends.

As the compound (b) having one or more ethyleneoxy groups represented by the general formula (1) and having hydroxyl groups at both ends, a hydrophilic compound is preferable, and the ethyleneoxy group represented by the general formula (1) is used. The possessed polyether is more preferable, polyethylene glycol is even more preferable from the viewpoint of antistatic property, its durability, and weather resistance, and polyethylene glycol represented by the following general formula (2) is particularly preferable.

Here, m represents a number from 5 to 250. m is preferably 20 to 200, more preferably 40 to 180, from the viewpoint of antistatic property, its durability, and weather resistance.

Examples of the compound (b) include ethylene oxide and other alkylene oxides such as propylene oxide, 1,2-, 1,4-, 2,3-, in addition to polyethylene glycol obtained by addition reaction of ethylene oxide. Alternatively, a polyether obtained by addition reaction with one or more of 1,3-butylene oxide and the like can be mentioned, and this polyether may be either random or blocked.

Further giving an example of the compound (b), a compound having a structure in which ethylene oxide is added to an active hydrogen atom-containing compound, ethylene oxide and other alkylene oxides, for example, propylene oxide, 1,2-, 1,4-, Examples thereof include compounds having a structure in which one or more of 2,3- or 1,3-butylene oxide is added. These may be either random addition or block addition.

Examples of the active hydrogen atom-containing compound include glycols, divalent phenols, primary monoamines, secondary diamines and dicarboxylic acids.

As the glycol, an aliphatic glycol having 2 to 20 carbon atoms, an alicyclic glycol having 5 to 12 carbon atoms, an aromatic glycol having 8 to 26 carbon atoms and the like can be used.
Examples of the aliphatic glycol include ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, and 1,3-. Hexylenediol, 1,4-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,2-octanediol, 1,8-octanediol, 1,10-decanediol, 1,18-octadecane Examples thereof include diols, 1,20-eicosane diols, diethylene glycols, triethylene glycols and thiodiethylene glycols.
Examples of the alicyclic glycol include 1-hydroxymethyl-1-cyclobutanol, 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, and 1-methyl-3,4-cyclohexanediol. , 2-Hydroxymethylcyclohexanol, 4-hydroxymethylcyclohexanol, 1,4-cyclohexanedimethanol, 1,1'-dihydroxy-1,1'-dicyclohexyl and the like.
Examples of the aromatic glycol include dihydroxymethylbenzene, 1,4-bis (β-hydroxyethoxy) benzene, 2-phenyl-1,3-propanediol, 2-phenyl-1,4-butanediol, and 2-benzyl. -1,3-Propanediol, triphenylethylene glycol, tetraphenylethylene glycol, benzopinacol and the like can be mentioned.

As the divalent phenol, phenol having 6 to 30 carbon atoms can be used, and for example, catechol, resorcinol, hydroquinone, bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ether, dihydroxydiphenylthioether, binaphthol and alkyls thereof (carbon atoms) can be used. Numbers 1 to 10) or halogen-substituted products can be mentioned.

Examples of the primary monoamine include aliphatic primary monoamines having 1 to 20 carbon atoms, for example, methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, s-butylamine, isobutylamine, n-. Examples thereof include amylamine, isoamylamine, n-hexylamine, n-heptylamine, n-octylamine, n-decylamine, n-octadecylamine and n-icosylamine.

The secondary diamines include aliphatic secondary diamines having 4 to 18 carbon atoms, heterocyclic secondary diamines having 4 to 13 carbon atoms, alicyclic secondary diamines having 6 to 14 carbon atoms, and carbon atoms. 8 to 14 aromatic secondary diamines and secondary alkanol diamines having 3 to 22 carbon atoms can be used.
Examples of the aliphatic secondary diamine include N, N'-dimethylethylenediamine, N, N'-diethylethylenediamine, N, N'-dibutylethylenediamine, N, N'-dimethylpropylenediamine, N, N'-diethylpropylene. Diamine, N, N'-dibutylpropylene diamine, N, N'-dimethyltetramethylenediamine, N, N'-diethyltetramethylenediamine, N, N'-dibutyltetramethylenediamine, N, N'-dimethylhexamethylenediamine , N, N'-diethylhexamethylenediamine, N, N'-dibutylhexamethylenediamine, N, N'-dimethyldecamethylenediamine, N, N'-diethyldecamethylenediamine and N, N'-dibutyldecamethylenediamine. And so on.
Examples of the heterocyclic secondary diamine include piperazine and 1-aminopiperidine.
Examples of the alicyclic secondary diamine include N, N'-dimethyl-1,2-cyclobutanediamine, N, N'-diethyl-1,2-cyclobutanediamine, and N, N'-dibutyl-1,2-. Cyclobutanediamine, N, N'-dimethyl-1,4-cyclohexanediamine, N, N'-diethyl-1,4-cyclohexanediamine, N, N'-dibutyl-1,4-cyclohexanediamine, N, N'- Examples thereof include dimethyl-1,3-cyclohexanediamine, N, N'-diethyl-1,3-cyclohexanediamine, N, N'-dibutyl-1,3-cyclohexanediamine and the like.
Examples of the aromatic secondary diamine include N, N'-dimethyl-phenylenediamine, N, N'-dimethyl-xylylenediamine, N, N'-dimethyl-diphenylmethanediamine, and N, N'-dimethyl-diphenyletherdiamine. , N, N'-dimethyl-benzidine and N, N'-dimethyl-1,4-naphthalenediamine and the like.
Examples of the secondary alkanolamine include N-methyldiethanolamine, N-octyldiethanolamine, N-stearyldiethanolamine, N-methyldipropanolamine and the like.

As the dicarboxylic acid, a dicarboxylic acid having 2 to 20 carbon atoms can be used, and for example, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and the like are used.
Examples of the aliphatic dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, methylsuccinic acid, dimethylmalonic acid, β-methylglutaric acid, ethylsuccinic acid, isopropylmalonic acid, adipic acid, pimelic acid, and sveric acid. Examples thereof include azelaic acid, sebacic acid, undecandic acid, dodecandic acid, tridecandic acid, tetradecandic acid, hexadecandic acid, octadecandic acid and icosandic acid.
Examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid, β-phenylglutaric acid, α-phenyladipic acid, β-phenyladipic acid and biphenyl-2. , 2'-Dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate, potassium 3-sulfoisophthalate and the like.
Examples of the alicyclic dicarboxylic acid include 1,3-cyclopentanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, and 1,3-cyclohexanedicarboxylic acid. Examples thereof include acids, 1,4-cyclohexanediacetic acid, 1,3-cyclohexanediacetic acid, 1,2-cyclohexanediacetic acid and dicyclohexyl-4,4'-dicarboxylic acid.

These active hydrogen atom-containing compounds can be used alone or in a mixture of two or more.

Next, the epoxy compound (D) having two or more epoxy groups constituting the polymer compound (E) will be described. The epoxy compound (D) used in the present invention is not particularly limited as long as it has two or more epoxy groups. Polyglycidyl ether compounds; dihydroxynaphthalene, biphenol, methylenebisphenol (bisphenol F), methylenebis (orthocresol), etylidenebisphenol, isopropyridenebisphenol (bisphenol A), isopropyridenebis (orthocresol), tetrabromobisphenol A, 1,3 -Bis (4-hydroxycumylbenzene), 1,4-bis (4-hydroxycumylbenzene), 1,1,3-tris (4-hydroxyphenyl) butane, 1,1,2,2-tetra (1,1,2,2-tetra ( 4-Hydroxyphenyl) Polyglycyl ether of polynuclear polyvalent phenol compounds such as ethane, thiobisphenol, sulfobisphenol, oxybisphenol, phenol novolak, orthocresol novolak, ethylphenol novolak, butylphenol novolak, octylphenol novolak, resorcinnovolac, terpenphenol. Compounds; ethylene glycol, propylene glycol, butylene glycol, hexanediol, diethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, polyglycol, thiodiglycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, bisphenol A-ethylene oxide adduct , Polyglycidyl ethers of polyhydric alcohols such as dicyclopentadiene dimethanol; maleic acid, fumaric acid, itaconic acid, succinic acid, glutaric acid, suberic acid, adipic acid, azelaic acid, sebacic acid, dimer acid, trimeric acid, Glycidyl of aliphatic, aromatic or alicyclic polybasic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid, endomethylene tetrahydrophthalic acid. Homopolymers or copolymers of esters and glycidyl methacrylate; glycidyl amino groups such as N, N-diglycidylaniline, bis (4- (N-methyl-N-glycidylamino) phenyl) methane, diglycidyl orthotoluidine Epoxy compounds with; vinyl cyclohexene diepo Xido, dicyclopentadiene diepoxiside, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6-methylcyclohexanecarboxylate, bis (3,4-) Epoxys of cyclic olefin compounds such as epoxy-6-methylcyclohexylmethyl) adipates; epoxidized conjugated diene polymers such as epoxidized polybutadienes and epoxidized styrene-butadiene copolymers, heterocyclic compounds such as triglycidyl isocyanurate, epoxys. Epoxy oil and the like can be mentioned. In addition, these epoxy compounds are internally cross-linked by a prepolymer of terminal isocyanate, or polyvalent active hydrogen compounds (polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphoric acid ester, etc.) are used to increase the molecular weight. It may be the one that has been used. Two or more kinds of the epoxy compound (D) may be used.

The epoxy compound (D) is preferably bisphenol F diglycidyl ether, dicyclopentadiene dimethanol diglycidyl ether, or hydrogenated bisphenol A diglycidyl ether from the viewpoint of antistatic property, its durability, and weather resistance.
The epoxy equivalent of the epoxy compound (D) is preferably 70 to 2,000, more preferably 100 to 1,000, and particularly preferably 150 to 600, from the viewpoints of antistatic property, durability thereof, and weather resistance.

The polymer compound (E) is a polyester (a) obtained by reacting a diol (a1) with a dicarboxylic acid (a2), and a compound (b) having one or more ethyleneoxy groups and having hydroxyl groups at both ends. It is obtained by reacting with an epoxy compound (D) having two or more epoxy groups, and is a polyester block (A) composed of polyester (a) and a poly composed of compound (b). An epoxy group of an epoxy compound having an ether block (B), a hydroxyl group or a carboxyl group at the end of the polyester (a), a hydroxyl group at the end of the compound (b), and two or more epoxy groups. Alternatively, those having a structure formed by the reaction of the hydroxyl group formed by the reaction of the epoxy group and bonded via an ester bond or an ether bond have antistatic property, its durability, and weather resistance. It is preferable from the viewpoint of.

Further, the polymer compound (E) is a polyester block (A) composed of the polyester (a) and a polyether composed of the compound (b) from the viewpoint of antistatic property, its durability and weather resistance. The block polymer (C) having a carboxyl group at both ends formed by repeatedly and alternately bonding the block (B) via an ester bond, and the epoxy compound (D) are the carboxyl group of the block polymer (C) and the epoxy. Those having a structure formed by bonding with the epoxy group of the compound (D) via an ester bond formed by the compound (D) are preferable, and further, a hydroxyl group formed by opening the ring of the epoxy group by a reaction with the carboxyl group and a carboxyl. It is also preferable to have a structure for binding via an ester bond formed by a reaction with a group. The polyester (a) constituting the polyester block (A) according to the polymer compound (E) of the present invention may be composed of a diol (a1) and a dicarboxylic acid (a2), and has antistatic properties and its sustainability. From the viewpoint of property and weather resistance, it is preferable that the residue of the diol (a1) excluding the hydroxyl group and the residue of the dicarboxylic acid (a2) excluding the carboxyl group are bonded via an ester bond. ..

Further, the polyester (a) preferably has a structure having carboxyl groups at both ends from the viewpoint of antistatic property, its durability and weather resistance. Further, the degree of polymerization of the polyester (a) is preferably in the range of 2 to 50 from the viewpoint of antistatic property, its durability and stability.
The polyester (a) having a carboxyl group at both ends is an esterification reaction between a diol (a1) (at least one of 1,4-butanediol or ethylene glycol) and a dicarboxylic acid (a2) (for example, succinic acid). Can be obtained by

The dicarboxylic acid (a2) (for example, succinic acid) may be a derivative thereof (for example, an acid anhydride, an ester such as an alkyl ester, an alkali metal salt, an acid halide, etc.), and the derivative is used to make a polyester (a). ) Can be finally treated to form a carboxyl group at both ends, and in the same state, the next block polymer (C) having a structure having a carboxyl group at both ends can be obtained. You may proceed to the reaction.

As for the reaction ratio of the dicarboxylic acid (a2) and the diol (a1), it is preferable to use an excessive amount of the dicarboxylic acid (a2) so that both ends have a carboxyl group, and the diol (a1) has a molar ratio. On the other hand, it is preferable to use an excess of 1 mol. For the esterification reaction, a catalyst that promotes the esterification reaction may be used, and as the catalyst, conventionally known catalysts such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used.
When derivatives such as esters, alkali metal salts, and acid halides are used instead of dicarboxylic acids, both ends may be treated as dicarboxylic acids after the reaction between them and diols, and the acid may be used as it is. The next reaction may proceed to obtain a block polymer (C) having a structure having a carboxyl group at both ends.

A suitable polyester (a) composed of a diol (a1) and a dicarboxylic acid (a2) and having a carboxyl group at both ends forms an ester bond by reacting with the compound (b) to form a structure of the block polymer (C). The carboxyl groups at both ends may be protected, modified, or in the form of a precursor. Further, in order to suppress the oxidation of the product during the reaction, a light stabilizer (F) such as a phenol-based antioxidant may be added in advance to the reaction system.

The compound (b) having one or more ethyleneoxy groups and having hydroxyl groups at both ends preferably reacts with the polyester (a) to form an ester bond or an ether bond, preferably an ester bond, and the block polymer (C). The hydroxyl groups at both ends may be protected, modified, or in the form of a precursor.

In the present invention, the block polymer (C) having a structure having carboxyl groups at both ends of the polymer compound (E) is composed of the block (A) composed of the polyester (a) and the compound (b). It has a block (B) formed therein, and has a structure in which these blocks are repeatedly and alternately bonded via an ester bond formed by a carboxyl group and a hydroxyl group. Examples of the block polymer (C) include those having a structure represented by the following general formula (3).

In the general formula (3), (A) represents a block composed of the polyester (a) having a carboxyl group at both ends, and (B) is composed of a compound (b) having a hydroxyl group at both ends. The block is represented, and t is the number of repetitions in the repeating unit, and preferably represents 1 to 10 in terms of antistatic property, its durability, and weather resistance. t is more preferably a number from 1 to 7, and most preferably a number from 1 to 5.

The block polymer (C) having a structure having a carboxyl group at both ends is obtained by subjecting a polyester (a) having a carboxyl group at both ends and a compound (b) having a hydroxyl group at both ends to undergo a polycondensation reaction. However, the polyester (a) and the compound (b) have a structure equivalent to that having a structure in which the polyester (a) and the compound (b) are repeatedly and alternately bonded via an ester bond formed by a carboxyl group and a hydroxyl group. If it is, it is not always necessary to synthesize it from the polyester (a) and the compound (b).

The reaction ratio of the polyester (a) to the compound (b) is adjusted so that the compound (b) has an X mol and the polyester (a) has an X + 1 mol, and carboxyl groups are grouped at both ends. The block polymer (C) having the above can be preferably obtained.

In the reaction, after the synthesis reaction of the polyester (a) is completed, the compound (b) may be added to the reaction system and reacted as it is without isolating the polyester (a).
For the polycondensation reaction, a catalyst that promotes the esterification reaction may be used, and as the catalyst, conventionally known catalysts such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used. Further, in order to suppress the oxidation of the product during the reaction, an antioxidant such as a phenolic antioxidant may be added to the reaction system.

In the present invention, the polymer compound (E) is preferably a block polymer (C) having a structure having a carboxyl group at both ends and two or more thereof from the viewpoint of antistatic property, its durability and weather resistance. It has a structure in which an epoxy compound (D) having an epoxy group is bonded via an ester bond. The ester bond was formed by an ester bond formed by the reaction of the carboxyl group at the end of the block polymer (C) with the epoxy group of the epoxy compound (D), and further by this reaction (reaction between the carboxyl group and the epoxy group). Any of the ester bonds formed by the reaction of the hydroxyl group and the carboxyl group may be used, and the presence of both ester bonds is preferable from the viewpoint of antistatic property, its durability and weather resistance.

Further, the polymer compound (E) may further contain an ester bond formed by the carboxyl group of the polyester (a) and the epoxy group of the epoxy compound (D).
Further, the polymer compound (E) may contain an ester bond formed by the carboxyl group of the polyester (a) and the hydroxyl group formed by the reaction of the epoxy group of the epoxy compound.
Furthermore, the polymer compound (E) further contains an ether bond formed by the hydroxyl group of the polyester (a) or the hydroxyl group of the compound (b) and the epoxy group of the epoxy compound (D). You may.

In order to obtain a preferable polymer compound (E), the block polymer (C) may be reacted with the epoxy compound (D). That is, the carboxyl group of the block polymer (C) may be reacted with the epoxy group of the epoxy compound (D). More preferably, the hydroxyl group formed from the reacted epoxy group may be reacted with the carboxyl group. The number of epoxy groups in the epoxy compound (D) is preferably 0.5 to 5 equivalents, more preferably 0.5 to 1.5 equivalents of the number of carboxyl groups in the block polymer (C) to be reacted. Further, the above reaction may be carried out in various solvents or in a molten state.
The epoxy compound (D) having two or more epoxy groups to be reacted is preferably 0.1 to 2.0 equivalents, preferably 0.2 to 1.5 equivalents of the number of carboxyl groups of the block polymer (C) to be reacted. More preferred.

In the reaction, after the synthesis reaction of the block polymer (C) is completed, the epoxy compound (D) may be added to the reaction system and reacted as it is without isolating the block polymer (C). In that case, the carboxyl group of the unreacted polyester (a) used excessively when synthesizing the block polymer (C) reacts with a part of the epoxy group of the epoxy compound (D) to form an ester bond. You may.

In the present invention, the polymer compound (E) is a block polymer (C) having a structure having a carboxyl group at both ends and an epoxy compound (D) having two or more epoxy groups, respectively, having a carboxyl group and an epoxy group. It is not always necessary to synthesize from the block polymer (C) and the epoxy compound (D) as long as the polymer has a structure equivalent to that having a structure bonded via an ester bond formed by. The ester bond formed by the carboxyl group and the epoxy group referred to here also includes an ester bond formed by the carboxyl group and the hydroxyl group formed from the epoxy group by reacting with the carboxyl group.

In the present invention, in the polymer compound (E), the number average molecular weight of the compound (b) constituting the block (B) composed of the compound (b) having hydroxyl groups at both ends is calculated from the measured value of the hydroxyl value. However, from the viewpoint of antistatic property, its durability, and weather resistance, it is preferably 400 to 10,000, more preferably 1,000 to 8,000, and further preferably 2,000 to 8,000. be. The method for measuring the hydroxyl value and the method for calculating the number average molecular weight from the hydroxyl value are described below.

<Calculation method of number average molecular weight from hydroxyl value>
The hydroxyl value was measured by the following method for measuring the hydroxyl value, and the number average molecular weight (hereinafter, also referred to as “Mn”) was determined by the following formula.
Number average molecular weight = (56110 × 2) / hydroxyl value

<Measurement method of hydroxyl value>
・ Reagent A (acetylating agent)
(1) Triethyl phosphate 1560 mL
(2) Acetic anhydride 193 mL
(3) Perchloric acid (60%) 16g
The above reagents are mixed in the order of (1) → (2) → (3).
・ Reagent B
Pyridine and pure water are mixed in a volume ratio of 3: 1.
・ Reagent C
Add 2-3 drops of phenolphthalein solution to 500 mL of isopropyl alcohol and neutralize with 1N-KOH aqueous solution.

First, weigh 2 g of a sample into a 200 mL Erlenmeyer flask, add 10 mL of triethyl phosphate, and heat to dissolve. Add 15 mL of Reagent A, plug and shake vigorously. Add 20 mL of Reagent B, plug and shake vigorously. Add 50 mL of Reagent C. Titrate with 1N-KOH aqueous solution and calculate by the following formula.
Hydroxy group value [mgKOH / g] = 56.11 × f × (TB) / S
factor of 1N-KOH aqueous solution
B: Empty test titration [mL]
T: Quantitative test titration [mL]
S: Sample amount [g]

Further, in the present invention, the number average molecular weight of the polyester (a) constituting the block (A) composed of the polyester (a) in the polymer compound (E) is antistatic property and its durability in terms of polystyrene. From the viewpoint of weather resistance, it is preferably 1,000 to 10,000, more preferably 1,500 to 8,000, and even more preferably 2,500 to 7,500. If the number average molecular weight is less than 1,000, the storage stability may be inferior, and if it exceeds 10,000, the reaction for obtaining the polymer compound (E) may take a long time and the economic efficiency may be inferior. The molecular compound may be colored by a long-term reaction.
As a method for measuring the number average molecular weight in terms of polystyrene, a gel permeation chromatograph (GPC) method is preferable, and the measuring method is shown below.

<Measurement method of number average molecular weight by polystyrene conversion>
The number average molecular weight (hereinafter, also referred to as “Mn”) was measured by a gel permeation chromatography (GPC) method. The measurement conditions for Mn are as follows.
Equipment: GPC equipment manufactured by JASCO Corporation Solvent: Chloroform reference material: Polystyrene detector: Differential refractometer (RI detector)
Column stationary phase: Showa Denko Corporation Shodex LF-804
Column temperature: 40 ° C
Sample concentration: 1 mg / 1 mL
Flow rate: 0.8 mL / min.
Injection volume: 100 μL

Further, the number average molecular weight of the block polymer (C) having a structure having a carboxyl group at both ends in the polymer compound (E) is preferable from the viewpoint of antistatic property, its durability and weather resistance in terms of polystyrene. Is 5,000 to 50,000, more preferably 10,000 to 45,000, and even more preferably 15,000 to 40,000. If the number average molecular weight is less than 5,000, the storage stability may be inferior, and if it exceeds 50,000, the reaction for obtaining the polymer compound (E) may take a long time and the economic efficiency may be inferior. The molecular compound may be colored by a long-term reaction. As a method for measuring the number average molecular weight in terms of polystyrene, a gel permeation chromatograph (GPC) method is preferable, and the measuring method is as described above.

Further, the polymer compound (E) according to the antistatic agent of the present invention is a compound (a) obtained from a diol (a1) and a dicarboxylic acid (a2) without isolating the polyester (a). b) and / or may be reacted with the epoxy compound (D).
In the present invention, the polymer compound (E) preferably has a crystallization temperature in the range of 20 ° C. or higher and 70 ° C. or lower, preferably 30 ° C. or higher and 70 ° C., from the viewpoint of antistatic property, its durability and weather resistance. The following is more preferable, 40 ° C. to 70 ° C. or lower is even more preferable, 50 ° C. or higher and 70 ° C. or lower is even more preferable, 55 ° C. or higher and 70 ° C. or lower is even more preferable, and 60 ° C. or higher and 70 ° C. or lower is even more preferable. In the antistatic agent of the present invention, the crystallization temperature is measured by the following crystallization temperature measuring method.

<Crystalization temperature measurement method>
The crystallization temperature is measured using a differential scanning calorimetry device (DSC). Weigh 3 ± 1 mg of the sample into an aluminum pan, raise the temperature from room temperature (25 ° C) to 130 ° C at a rate of 10 ° C / min, hold for 5 minutes, and cool to 0 ° C at a rate of 10 ° C / min. In the obtained chart, the temperature at which the peak of heat absorption is reached is defined as the crystallization temperature.

In the present invention, the polymer compound (E) is preferably used in the form of pellets from the viewpoint of handleability. To make pellets, after the polymerization reaction, the polymer may be extruded from an extruder and cut into pellets. A machine such as a pelletizer may be used for cutting.
In the resin composition of the present invention, the content of the polymer compound (E) is 3 to 40 parts by mass with respect to 100 parts by mass of the synthetic resin, and from the viewpoint of antistatic property, its durability and weather resistance. 5 to 35 parts by mass is preferable, and 7 to 30 parts by mass is more preferable. If it is less than 3 parts by mass, sufficient antistatic property may not be obtained, and if it exceeds 40 parts by mass, the physical properties of the molded product may be adversely affected.

Next, the light stabilizer (F) used in the resin composition of the present invention will be described.
As the light stabilizer (F) used in the present invention, known ones can be used, but one or more selected from the group of the ultraviolet absorber (F-1) and the hindered amine-based light stabilizer (F-2) can be used. , It is preferable from the viewpoint of antistatic property, its durability, and weather resistance.
It is also preferable to use one or more ultraviolet absorbers (F-1) and one or more hindered amine-based light stabilizers (F-2) in combination from the viewpoints of antistatic property, durability thereof, and weather resistance.

First, the ultraviolet absorber (F-1) will be described. The ultraviolet absorber (F-1) can be used without particular limitation as long as it is a known compound. Specific examples of the ultraviolet absorber (F-1) include 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2-hydroxy-5-tert-octylphenyl) benzotriazole, 2 -(2-Hydroxy-3,5-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3-tert-butyl-5-methylphenyl) -5-chlorobenzotriazole, 2 -(2-Hydroxy-3,5-dicumylphenyl) benzotriazole, 2,2'-methylenebis (4-tert-octyl-6-benzotriazolylphenol), 2,2'-methylenebis (4-ethylhydroxy) -6-benzotriazolylphenol), 2,2'-methylenebis (4-methyl-6-benzotriazolylphenol), 2- (2-hydroxy-3-tert-butyl-5-carboxyphenyl) benzotriazole Polyethylene glycol ester, 2- [2-hydroxy-3- (2-acryloyloxyethyl) -5-methylphenyl] benzotriazole, 2- [2-hydroxy-3- (2-methacryloyloxyethyl) -5-tert -Butylphenyl] benzotriazole, 2- [2-hydroxy-3- (2-methacryloyloxyethyl) -5-tert-octylphenyl] benzotriazole, 2- [2-hydroxy-3- (2-methacryloyloxyethyl)) -5-tert-butylphenyl] -5-chlorobenzotriazole, 2- [2-hydroxy-5- (2-methacryloyloxyethyl) phenyl] benzotriazole, 2- [2-hydroxy-3-tert-butyl-5 -(2-Methylloyloxyethyl) phenyl] benzotriazole, 2- [2-hydroxy-3-tert-amyl-5- (2-methacryloyloxyethyl) phenyl] benzotriazole, 2- [2-hydroxy-3-tert -Butyl-5- (3-methacryloyloxypropyl) phenyl] -5-chlorobenzotriazole, 2- [2-hydroxy-4- (2-methacryloyloxymethyl) phenyl] benzotriazole, 2- [2-hydroxy-4 -(3-Methyloxyloyloxy-2-hydroxypropyl) phenyl] benzotriazole, 2- [2-hydroxy-4- (3-methacryloyloxypropyl) phenyl] benzotriazole and the like 2- (2-hydroxyf) Enyl) benzotriazoles; 2- (4,6-diphenyl-1,3,5-triazine-2-yl) -5- (hexyloxy) phenol, 2- (4,6-diphenyl-1,3,5) -Triazine-2-yl) -5- (octyloxy) phenol, 2- (4,6-bis (4-butoxy-2-methylphenyl) -1,3,5-triazine-2-yl) -3, 5-Dibutoxyphenol, 2- (4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine-2-yl) -5- (3- (2-ethylhexyloxy) -2- Hydroxypropoxy) Phenol, 2- (4,6-di ([1,1'-biphenyl] -4-yl) -1,3,5-triazine-2-yl) -5-hexyloxyphenol, 2-methyl Phenols such as hexyl-2- (4, (4,6-di ([1,1'-biphenyl] -4-yl) -1,3,5-triazine-2-yl) -3-hydroxyphenoxy) propanoate, etc. Triazines contained; 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,4-dihydroxybenzophenone, 5,5'-methylenebis (2-hydroxy-4-methoxybenzophenone), 1,4-bis (4) -Benzoyl-3-hydroxyphenoxy) -2-hydroxybenzophenones such as butane; resorcinol monobenzoate, 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, octyl ( 3,5-Di-tert-butyl-4-hydroxy) benzoate, dodecyl (3,5-di-tert-butyl-4-hydroxy) benzoate, tetradecyl (3,5-di-tert-butyl-4-hydroxy) Phenol, hexadecyl (3,5-di-tert-butyl-4-hydroxy) benzoate, octadecyl (3,5-di-tert-butyl-4-hydroxy) benzoate, behenyl (3,5-di-tert-butyl- 4-Hydroxy) Phenolates such as benzoate; substituted oxanilides such as 2-ethyl-2'-ethoxyoxyzanilide, 2-ethoxy-4'-dodecyloxanilide; ethyl-2-cyano-3,3-diphenyl Acrylate, 2'-ethylhexyl-2-cyano-3,3-diphenyl acrylate, ethyl-α-cyano-β, β-diphenyl acrylate, methyl-2-cyano-3-methyl-3- (p-methoxyphenyl) ac. Relate, 4- (2-cyano-3- (4-ethylphenoxy) -3-oxopropenyl) Phenyl-4-propylcyclohexane-1-carboxylate, 4- (2-cyano-3- (4-ethylphenoxy) -3-oxopropenyl) Phenyl-4-propylbenzoate, 4-butylphenyl-4- (2-cyano-3-oxo-3- (4-propylphenoxy) propenyl) benzoate, 4- (2-cyano-3-) (4-Cyanophenoxy) -3-oxopropenyl) Phenyl-4-pentylbenzoate, 4- (2-cyano-3- (4-fluorophenoxy) -3-oxopropenyl) Phenyl-4-methylcyclohexane-1-carboxy Rate, 4- (2-cyano-3- (4-methoxyphenoxy) -3-oxopropenyl) Phenyl-4-hexylcyclohexane-1-carboxylate, 4- (2-cyano-3- (4-ethoxyphenoxy) -3-oxopropenyl) Phenyl-4-octylcyclohexane-1-carboxylate, 4- (2-cyano-3-oxo-3- (4-propoxyphenoxy) propenyl) Phenyl-4-propylcyclohexane-1-carboxylate , 4- (2-cyano-3-oxo-3- (4-pentylphenoxy) propenyl) Phenyl-4-propylcyclohexane-1-carboxylate, 4- (2-cyano-3- (4-octylphenoxy)- 3-oxopropenyl) -4-propylcyclohexane-1-carboxylate, 1,3-bis-[(2'-cyano-3', 3'-diphenylacryloyl) oxy] -2,2-bis-[[( 2'-Cyano-3', 3'-diphenylacryloyl) oxy] methyl] cyanoacrylates such as propane; 4-tert-butylphenylsalicylate, amylsalicylate, menthylsalicylate, homomentylsalicylate, octylsalicylate, phenylsalicylate, benzyl Salicylates, p-isopropanol Phenylsalicylate and other salicylates) Various metal salts or metal chelate, particularly nickel, chromium salts, chelates and the like.

The ultraviolet absorber (F-1) may be a mixture of two or more kinds, or may be a masterbatch containing them. Further, the ultraviolet absorber (F-1) having a liquid property at room temperature and being in a fluid state by non-heating or heating may be impregnated with a carrier described later.

A preferable ultraviolet absorber (F-1) from the viewpoint of antistatic property, its durability and weather resistance is 2- (2H-benzotriazole-2-yl) -4,6-bis (1-methyl-1-). Phenylethyl) phenol, 2- (2H-benzotriazole-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol, 2,2'-methylenebis [6- (2H-benzotriazole-) 2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol], 2- (2H-benzotriazole-2-yl) -p-cresol, 2- (5-chloro-2H-benzo) Triazole-2-yl) -6-tert-butyl-4-methylphenol, 2- (4,6-diphenyl-1,3,5-triazine-2-yl) -5- [2- (2-ethylhexa) Noyloxy) ethoxy] phenol, 2,4,6-tris (2-hydroxy-4-hexyloxy-3-methylphenyl) -1,3,5-triazine, [2-hydroxy-4- (octyloxy) phenyl ] (Phenol) methanone.
As the ultraviolet absorber (F-1), a commercially available product may be used. For example, the product names "Adecastab LA-24", "Adecastab LA-29", and "Adecastab LA-31RG" manufactured by ADEKA Co., Ltd. may be used. , "Adekastab LA-31G", "Adekastab LA-32", "Adekastab LA-36", "Adekastab LA-36RG", "Adekastab LA-46", "Adekastab LA-F70", "Adekastab 1413", " Adecastab LA-51 "; Product names" UVA-100 "," UVA93 "manufactured by Otsuka Chemical Co., Ltd .; Product names" Mixxim BB / 150 "," Mixxim BB / 200 "manufactured by Fairmout Co., Ltd. Product names "Seesorb 704", "Seesorb 705", "Seesorb 706", "Seesorb 707", "Seesorb 708", "Seesorb 709", "Seesorb 100", "Seesorb 101", "Seesorb 104", "Seesorb 104", "Seesorb 104", "Seesorb 104", "Seesorb 104" Product name "Sumisorb250" manufactured by Sumitomo Chemical Co., Ltd .; Product names "TinuvinP", "TinuvinPS", "Tinuvin109", "Tinuvin213", "Tinuvin234", "Tinuvin234FF", "Tinuvin234", "Tinuvin326""Tinuvin327","Tinuvin328","Tinuvin329","Tinuvin329FL","Tinuvin350","Tinuvin360","Tinuvin384","Tinuvin571","Tinuvin1130""Tinuvin477","Tinuvin479","Tinuvin1577","Tinuvin1577ED","Tinuvin1600","Chimassorb81","Chimassorb81FL","Tinuvin120","Uvinul30""CyasorbUV-21","CyasorbUV-24","CyasorbUV-207","CyasorbUV-284","CyasorbUV" -21236 "and the like.

Next, the hindered amine-based light stabilizer (F-2) will be described. The hindered amine-based light stabilizer (F-2) can be used without particular limitation as long as it is a known compound. Examples of the hindered amine-based light stabilizer (F-2) include compounds having a structure of 2,2,6,6-tetramethylpiperidyl, and specifically, for example, 2,2,6,6-tetramethyl-. 4-piperidyl esterate, 1,2,2,6,6-pentamethyl-4-piperidyl stearate, 2,2,6,6-tetramethyl-4-piperidylbenzoate, bis (2,2,6,6- Tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (2,2,6,6-tetramethyl-1- (octyloxy) piperidyl- 4-yl) sebacate, methyl (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, butane-1,2,3,4-tetracarboxylic acid tetrakis (2,2,6,6-tetra) Methyl-4-piperidinyl), butane-1,2,3,4-tetracarboxylic acid tetrakis (1,2,2,6,6-pentamethyl-4-piperidinyl), bis (2,2,6,6-tetra) Methyl-4-piperidyl) di (tridecyl) -1,2,3,4-butanetetracarboxylate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) di (tridecyl) -1 , 2,3,4-butanetetracarboxylate, bis (1,2,2,4,4-pentamethyl-4-piperidyl) -2-butyl-2- (3,5-ditertiary butyl-4-hydroxy) Benzyl) malonate, 1- (2-hydroxyethyl) -2,2,6,6-tetramethyl-4-piperidinol / diethyl succinate polycondensate, 1,6-bis (2,2,6,6) -Tetramethyl-4-piperidylamino) hexane / 2,4-dichloro-6-morpholino-s-triazine polycondensate, 1,6-bis (2,2,6,6-tetramethyl-4-piperidylamino) Hexane / 2,4-dichloro-6-3 octylamino-s-triazine polycondensate, 1-methyl-10-sebasic acid (1,2,2,6,6-pentamethyl-4-piperidyl) and bis ( 2,2,6,6-Tetramethyl-4-piperidyl) polycondensate of sebacate, butane tetracarboxylic acid tetramethyl ester, ester with spiroglycol and N-methylpiperidinol, butane tetracarboxylic acid, 3-hydroxy Polycondensate of ester with -2,2-dimatespentanal and N-methylpiperidinol, 1,2,3,4-butanetetracarboxylate tetramethy Ruester, 2,2,6,6-tetramethyl-4-piperidinol and β, β, β', β'-tetramethyl-2,4,8,10-tetraoxaspiro [5.5] undecane-3, Polycondensate of 9-diethanol, 2,4-dichloro-6- (1,1,3,3-tetramethylbutylamino) -1,3,5-triazine-N, N'-bis (2,2) 6,6-Tetramethyl-4-piperidyl) Hexamethylenediamine polycondensate, 2,4-dichloro-6- (1,1,3,3-tetramethylbutylamino) -1,3,5-triazine, 1 , 5,8,12-Tetrakiss [2,4-bis (N-butyl-N- (2,2,6,6-tetramethyl-4-piperidyl) amino) -s-triazine-6-yl] -1 , 5,8,12-tetraazadodecane, 1,5,8,12-tetrakis [2,4-bis (N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl)) Amino) -s-triazine-6-yl] -1,5,8-12-tetraazadodecane, 1,6,11-tris [2,4-bis (N-butyl-N- (2,2,6) , 6-Tetramethyl-4-piperidyl) amino) -s-triazine-6-yl] aminoundecane, 1,6,11-tris [2,4-bis (N-butyl-N- (1,2,2) , 6,6-Pentamethyl-4-piperidyl) amino) -s-triazine-6-yl] aminoundecane, bis {4- (1-octyloxy-2,2,6,6-tetramethyl) piperidyl} decandio Nart, bis {4- (2,2,6,6-tetramethyl-1-undesyloxy) piperidil) carbonate and the like can be mentioned.

The hindered amine-based light stabilizer (F-2) may be a mixture of two or more kinds, or may be a masterbatch containing them. Further, the hindered amine-based light stabilizer having a liquid property at room temperature and being in a fluid state by non-heating or heating may be impregnated with a carrier described later.

Tetrakiss (1,2,2,6,6-pentamethyl-4-piperidyl) butane-1,2, as a preferable hindered amine light stabilizer (F-2) from the viewpoint of antistatic property, its durability and weather resistance, 3,4-Tetracarboxylate, Tetrakiss (2,2,6,6-Tetramethyl-4-piperidyl) Butane-1,2,3,4-Tetracarboxylate, 1,2,3,4-Butane Tetracarboxyl Acid and 1,2,2,6,6-pentamethyl-4-piperidinol and 3,9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8-10-tetraoxospiro [5] .5] Mixed esterified product with undecane, 1,2,3,4-butanetetracarboxylic acid and 2,2,6,6-tetramethyl-4-piperidinol, and 3,9-bis (2-hydroxy-1). , 1-dimethylethyl) -2,4,8-10-tetraoxospiro [5.5] mixed esterified product with undecane, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (2,2,6,6-pentamethyl-4-piperidyl) cevacate, bis (1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 1,2,2,6,6 -Pentamethyl-4-piperidyl methacrylate, 2,2,6,6, -tetramethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-pipepe of C12-21 saturated fatty acid and C18 unsaturated fatty acid Examples include lysinyl ester.

As the hindered amine-based light stabilizer (F-2), a commercially available product may be used. For example, the product names "ADEKA STAB LA-52", "ADEKA STAB LA-57" and "ADEKA STAB LA" manufactured by ADEKA Corporation may be used. -63P "," Adeka Stub LA-68 "," Adeka Stab LA-72 "," Adeka Stab LA-77 "," Adeka Stab LA-77Y "," Adeka Stab LA-77G "," Adeka Stab LA-81 "," Adeka Stab LA- 82 ”,“ Adeka Stab LA-87 ”,“ Adeka Stab LA-402AF ”,“ Adeka Stab LA-40MP ”,“ Adeka Stab LA-40Si ”,“ Adeka Stab LA-94 ”,“ Adeka Stab LA-402XP ”,“ Adeka Stab LA-502XP "; BASF product names" Chimassorb 119 "," Chimassorb 944 "," Chimassorb 944FDL "," Chimassorb 944LD "," Chimassorb 2020 "," Chimassorb 2020 "," Chimassorb 2020FDL "," Chimassorb 2020FDL "," , "Tinuvin XT850}," Tinuvin NOR 371, "Tinuvin 783", "Tinuvin 791", "Irgastab FS-210", "Irgastab FS-410", "Tinuvin 622", "Tinuvin 622" 783 ”,“ Tinuvin 783FDL ”,“ Tinuvin 791FB ”; product names“ Cyasorb UV-3808PP5 ”,“ Cyasorb Cynergy V-703 ”manufactured by Cytec, and the like can be mentioned.

The blending amount of the light stabilizer (F) is 0.001 to 30 parts by mass with respect to 100 parts by mass of the synthetic resin, but from the viewpoint of antistatic property, its durability and weather resistance, 0.01 to 20 parts by mass. Parts are preferable, 0.03 to 10 parts by mass is more preferable, and 0.05 to 5 parts by mass is even more preferable. If the blending amount of the light stabilizer (F) is less than 0.001 part by mass, the effect of improving the weather resistance may not be obtained, and if it exceeds 30 parts by mass, the resin physical properties may be adversely affected.

The resin composition of the present invention further contains one or more selected from the group of alkali metal salt (H) and ionic liquid (J) in terms of antistatic property, its durability and weather resistance. Is preferable.

Hereinafter, the alkali metal salt (H) will be described first. Examples of the alkali metal salt (H) include salts of organic acids or inorganic acids, and examples of alkali metals include lithium, sodium, potassium, cesium, rubidium and the like. Examples of organic acids include aliphatic monocarboxylic acids having 1 to 18 carbon atoms such as formic acid, acetic acid, propionic acid, butyric acid and lactic acid; oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, adipic acid and the like. Aromatic carboxylic acids such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid; methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, trifluoromethane. Examples thereof include sulfonic acid having 1 to 20 carbon atoms such as sulfonic acid. Examples of the inorganic acid include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfite, phosphoric acid, phosphoric acid, polyphosphoric acid, nitric acid, perchloric acid and the like. Among them, salts of lithium, sodium and potassium are preferable, and sodium is more preferable, from the viewpoints of antistatic property and its sustainability, and safety to living organisms and the environment. Further, from the viewpoint of antistatic property and its sustainability, a salt of acetic acid, a salt of perchloric acid, a salt of p-toluenesulfonic acid and a salt of dodecylbenzenesulfonic acid are preferable, and a salt of dodecylbenzenesulfonic acid is more preferable. Two or more kinds of alkali metal salts may be used.
Specific examples of the alkali metal salt (H) include lithium acetate, sodium acetate, potassium acetate, lithium chloride, sodium chloride, potassium chloride, lithium phosphate, sodium phosphate, potassium phosphate, lithium sulfate, and sodium sulfate. , Lithium perchlorate, sodium perchlorate, potassium perchlorate, lithium p-toluenesulfonate, sodium p-toluenesulfonate, potassium p-toluenesulfonate, lithium dodecylbenzenesulfonate, sodium dodecylbenzenesulfonate, dodecyl Examples thereof include potassium benzenesulfonate. Among these, lithium p-toluenesulfonate, sodium p-toluenesulfonate, lithium dodecylbenzenesulfonate, and dodecylbenzenesulfone are preferable from the viewpoints of antistatic property and sustainability, and safety to living organisms and the environment. Sodium acid and the like, most preferably sodium dodecylbenzenesulfonate.
In the resin composition of the present invention, the content of the alkali metal salt (H) is 0.01 to 8.0 with respect to 100 parts by mass of the synthetic resin from the viewpoint of antistatic property, its durability and weather resistance. By mass is preferable, 0.1 to 5.0 parts by mass is more preferable, and 0.3 to 4.0 parts by mass is more preferable. If the amount of the alkali metal salt (H) is less than 0.01 parts by mass, the effect of adding the alkali metal salt (H) may not be sufficient, and if it exceeds 8.0 parts by mass, the physical properties of the resin are adversely affected. There may be.

Next, the ionic liquid (J) will be described.
As an example of the ionic liquid (J), it has a melting point of 100 ° C. or lower, at least one of the cations or anions constituting the ionic liquid is an organic ion, and the initial conductivity is 1 to 200 ms / cm, preferably. Is a room temperature molten salt having a temperature of 10 to 200 ms / cm, and examples thereof include the room temperature molten salt described in International Publication No. 95/15572.
Examples of the cation constituting the ionic liquid (J) include cations selected from the group consisting of amidinium, pyridinium, pyrazolium and guanidinium cations. Among these, examples of the amidinium cation include the following.

(1) Imidazolinium cations Examples thereof include those having 5 to 15 carbon atoms, for example, 1,2,3,4-tetramethylimidazolinium, 1,3-dimethylimidazolinium;
(2) Imidazole cations Examples thereof include those having 5 to 15 carbon atoms, for example, 1,3-dimethylimidazolium, 1-ethyl-3-methylimidazolium;
(3) Tetrahydropyrimidinium cations Examples thereof include those having 6 to 15 carbon atoms, for example, 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium, 1,2,3,4-tetra. Methyl-1,4,5,6-tetrahydropyrimidinium;
(4) Dihydropyrimidinium cations Examples thereof include those having 6 to 20 carbon atoms, for example, 1,3-dimethyl-1,4-dihydropyrimidinium and 1,3-dimethyl-1,6-dihydropyrimidi. Nium, 8-methyl-1,8-diazabicyclo [5,4,0] -7,9-undecagenium, 8-methyl-1,8-diazabicyclo [5,4,0] -7,10-un Decagenium.

Examples of the pyridinium cation include those having 6 to 20 carbon atoms, and examples thereof include 3-methyl-1-propylpyridinium and 1-butyl-3,4-dimethylpyridinium.
Examples of the pyrazolium cation include those having 5 to 15 carbon atoms, and examples thereof include 1,2-dimethylpyrazolium and 1-n-butyl-2-methylpyrazolium.

Examples of the guanidinium cation include the following.
(1) Guanidinium cation having an imidazolinium skeleton Examples thereof include those having 8 to 15 carbon atoms, for example, 2-dimethylamino-1,3,4-trimethylimidazolinium and 2-diethylamino-1,3. , 4-trimethylimidazolinium;
(2) Guanidinium cation having an imidazolium skeleton Examples thereof include those having 8 to 15 carbon atoms, for example, 2-dimethylamino-1,3,4-trimethylimidazolium and 2-diethylamino-1,3,4. -Trimethylimidazolium;
(3) Guanidinium cation having a tetrahydropyrimidinium skeleton Examples thereof include those having 10 to 20 carbon atoms, for example, 2-dimethylamino-1,3,4-trimethyl-1,4,5,6-tetrahydro. Pyrimidinium, 2-diethylamino-1,3-dimethyl-4-ethyl-1,4,5,6-tetrahydropyrimidinium;
(4) Guanidinium cation having a dihydropyrimidinium skeleton Examples thereof include those having 10 to 20 carbon atoms, for example, 2-dimethylamino-1,3,4-trimethyl-1,4-dihydropyrimidinium. 2-Dimethylamino-1,3,4-trimethyl-1,6-dihydropyrimidinium, 2-diethylamino-1,3-dimethyl-4-ethyl-1,4-dihydropyrimidinium, 2-diethylamino-1 , 3-Dimethyl-4-ethyl-1,6-dihydropyrimidinium.

One type of cation may be used alone, or two or more types may be used in combination. Of these, from the viewpoint of antistatic property and its durability, preferably an amidinium cation, more preferably an imidazolium cation, particularly preferably 1-ethyl-3-methylimidazolium cation, 1-ethyl-3 methylimidazole. Riumdodecylbenzene sulfonate.

Examples of the organic acid or the inorganic acid constituting the anion in the ionic liquid (J) include the following. Organic acids include, for example, carboxylic acids, sulfate esters, sulfonic acids and phosphoric acids; inorganic acids include, for example, super-strong acids (eg, borofluoric acid, boron tetrafluoroacid, perchloric acid, phosphorus hexafluoride). Acids, antimonic acid hexafluoride and arsenic hexafluoride), phosphoric acid and boric acid. The organic acid and the inorganic acid may be used alone or in combination of two or more.

Among the organic acid and the inorganic acid, the ionic liquid (J) is preferably the Hamett acidity function (-H0) of the anion constituting the ionic liquid (J) from the viewpoint of antistatic property and its durability. It is an acid forming an anion other than the conjugated base of the superacid, the conjugated base of the superacid, and a mixture thereof, which are up to 100.

Examples of anions other than the conjugated base of the super strong acid include halogen (eg, fluorine, chlorine and bromine) ions, alkyl (1 to 12 carbon atoms) benzenesulfonic acid (eg, p-toluenesulfonic acid and dodecylbenzenesulfonic acid). ) Ions and poly (n = 1-25) fluoroalcan sulfonic acid (eg, undecafluoropentane sulfonic acid) ions.

Examples of superacids include protonic acids and those derived from a combination of protonic acid and Lewis acid, and mixtures thereof. Examples of the protonic acid as a super strong acid include bis (trifluoromethylsulfonyl) imide acid, bis (pentafluoroethylsulfonyl) imide acid, tris (trifluoromethylsulfonyl) methane, perchloric acid, fluorosulfonic acid, and alkane ( 1 to 30 carbon atoms) sulfonic acid (eg, methane sulfonic acid, dodecane sulfonic acid, etc.), poly (n = 1 to 30) fluoroalkane (1 to 30 carbon atoms) sulfonic acid (eg, trifluoromethane sulfonic acid, etc.) Pentafluoroethane sulfonic acid, heptafluoropropane sulfonic acid, nonafluorobutane sulfonic acid, undecafluoropentane sulfonic acid and tridecafluorohexane sulfonic acid), borofluoric acid and boron tetrafluorofluoric acid. Of these, borofluoric acid, trifluoromethanesulfonic acid, bis (trifluoromethanesulfonyl) imide acid and bis (pentafluoroethylsulfonyl) imide acid are preferable from the viewpoint of ease of synthesis.

Proton acids used in combination with Lewis acid include, for example, hydrogen halide (eg, hydrogen fluoride, hydrogen chloride, hydrogen bromide and hydrogen iodide), perchloric acid, fluorosulfonic acid, methanesulfonic acid, trifluoromethane. Examples thereof include sulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid, tridecafluorohexanesulfonic acid and mixtures thereof. Of these, hydrogen fluoride is preferable from the viewpoint of the initial conductivity of the ionic liquid (J).

Lewis acids include, for example, boron trifluoride, phosphorus pentafluoride, antimony pentafluoride, arsenic pentafluoride, tantalum pentafluoride and mixtures thereof. Of these, boron trifluoride and phosphorus pentafluoride are preferable from the viewpoint of the initial conductivity of the ionic liquid.

The combination of the protonic acid and the Lewis acid is arbitrary, but examples of the super strong acid consisting of these combinations include tetrafluoroboric acid, hexafluorophosphate, tantalum hexafluorofluoride, antimonic acid hexafluoride, and hexafluoric acid. Examples thereof include tantalum sulphonic acid, boron tetrafluoroacid, phosphoric acid hexafluoride, boron trifluoride chloride, arsenic hexafluoride and mixtures thereof.
Of these anions, the conjugated base of superstrong acid (superacid consisting of protonic acid and superstrong acid consisting of a combination of protonic acid and Lewis acid) is preferable from the viewpoint of antistatic property of ionic liquid and its durability. More preferred are superacids and protonic acids consisting of protonic acids and conjugated bases of superacids consisting of boron trifluoride and / or phosphorus pentafluoride.

Among the ionic liquids (J), an ionic liquid having an amidinium cation is preferable, and an ion having a 1-ethyl-3-methylimidazolium cation is more preferable, from the viewpoint of antistatic property and its durability. The sex liquid, particularly preferred is 1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide.

In the resin composition of the present invention, the content of the ionic liquid (J) is 0.01 to 8.0 mass by mass with respect to 100 parts by mass of the synthetic resin from the viewpoint of antistatic property, its durability and weather resistance. Parts are preferable, 0.1 to 5.0 parts by mass are more preferable, and 0.3 to 4.0 parts by mass are more preferable. If the amount of the ionic liquid (J) is less than 0.01 parts by mass, the effect of adding the ionic liquid (J) may not be sufficient, and if it exceeds 8.0 parts by mass, the physical properties of the resin are adversely affected. There may be.

In the resin composition of the present invention, the alkali metal salt (H) and the ionic liquid (J) may be used in combination.
When the synthetic resin is blended, the alkali metal salt (H) and the ionic liquid (J) may be blended directly, or during the synthesis reaction of the polymer compound (E), the alkali metal is added to the reaction system. It may be blended with the addition of one or more selected from the group of salt (H) and ionic liquid (J).

The resin composition of the present invention may further contain a salt of a Group 2 element as long as the effects of the present invention are not impaired.
Examples of the salt of the group 2 element include salts of organic acid or inorganic acid, and examples of the group 2 element include beryllium, magnesium, calcium, strontium, barium and the like. Examples of organic acids include aliphatic monocarboxylic acids having 1 to 18 carbon atoms such as formic acid, acetic acid, propionic acid, butyric acid and lactic acid; oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, adipic acid and the like. Aromatic carboxylic acids such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid; methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, trifluoromethane. Examples thereof include sulfonic acid having 1 to 20 carbon atoms such as sulfonic acid. Examples of the inorganic acid include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfite, phosphoric acid, phosphoric acid, polyphosphoric acid, nitric acid, perchloric acid and the like.

Further, the resin composition of the present invention may contain a surfactant as long as the effects of the present invention are not impaired. As the surfactant, a nonionic, anionic, cationic or amphoteric surfactant can be used.
Examples of the nonionic surfactant include polyethylene glycol-type nonionic surfactants such as higher alcohol ethylene oxide adduct, fatty acid ethylene oxide adduct, higher alkylamine ethylene oxide adduct, and polypropylene glycol ethylene oxide adduct; fatty acid esters of polyethylene oxide and glycerin. , Pentaerislit fatty acid ester, sorbit or sorbitan fatty acid ester, polyhydric alcohol alkyl ether, polyhydric alcohol type nonionic surfactant such as alkanolamine aliphatic amide and the like.
Examples of the anionic surfactant include carboxylates such as alkali metal salts of higher fatty acids; sulfate esters such as higher alcohol sulfates and higher alkyl ether sulfates, alkylbenzene sulfonates and alkyl sulfonates. Sulfates such as paraffin sulfonates; phosphate ester salts such as higher alcohol phosphates and the like can be mentioned.
Examples of the cationic surfactant include quaternary ammonium salts such as alkyltrimethylammonium salts.
Examples of the amphoteric tenside include amino acid-type amphoteric surfactants such as higher alkylaminopropionate, higher alkyldimethylbetaine, and betaine-type amphoteric surfactants such as higher alkyldihydroxyethylbetaine, which may be used alone or. Two or more types can be used in combination.
When the surfactant is blended, the blending amount is preferably 0.1 to 5 parts by mass, more preferably 0.3 to 4 parts by mass with respect to 100 parts by mass of the synthetic resin.

Further, the resin composition of the present invention may contain a polymer-type antistatic agent as long as the effects of the present invention are not impaired. As the polymer antistatic agent, for example, a known polymer type antistatic agent such as a polyether ester amide can be used, and as a known polyether ester amide, for example, JP-A-7-10989 can be used. Examples thereof include the polyether ester amides comprising the polyoxyalkylene adducts of the described bisphenol A. Further, a block polymer having a repeating structure in which the bonding unit between the polyolefin block and the hydrophilic polymer block is 2 to 50 can be used, and examples thereof include the block polymer described in US Pat. No. 6,552,131.
When the polymer type antistatic agent is blended, the blending amount is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.

Furthermore, the resin composition of the present invention may contain a compatibilizer, if necessary, as long as the effects of the present invention are not impaired. By blending a compatibilizer, the compatibility between the antistatic component and other components or resin components can be improved. As the compatibilizer, a modified vinyl polymer having at least one functional group (polar group) selected from the group consisting of a carboxyl group, an epoxy group, an amino group, a hydroxyl group and a polyoxyalkylene group, for example, JP-A-3. Examples thereof include the polymer described in JP-A-258850, the modified vinyl polymer having a sulfonyl group described in JP-A-6-345927, and the block polymer having a polyolefin moiety and an aromatic vinyl polymer moiety. ..
When the compatibilizer is blended, the blending amount is preferably 0.01 to 5 parts by mass, more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the synthetic resin.

Further, in the resin composition of the present invention, various additives such as a phenol-based antioxidant, a phosphorus-based antioxidant, a thioether-based antioxidant, and an amine-based antioxidant are added as long as the effects of the present invention are not impaired. Further can be added, which can stabilize the resin composition of the present invention.

Examples of the phenolic antioxidant include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol and 2-tert-butyl-4,6-. Dimethylphenol, styrated phenol, 2,2'-methylenebis (4-ethyl-6-tert-butylphenol), 2,2'-thiobis- (6-tert-butyl-4-methylphenol), 2,2'- Thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2-methyl-4,6-bis (octylsulfanylmethyl) phenol, 2,2'-isobutylidenebis (4,6-dimethylphenol), isooctyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, N, N'-hexane-1,6-diylbis [3- (3,5) -Di-tert-butyl-4-hydroxyphenyl) propionamide, 2,2'-oxamid-bis [ethyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2-ethylhexyl -3- (3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate, 2,2'-ethylenebis (4,6-di-tert-butylphenol), 3,5-di-tert Polymers of -butyl-4-hydroxy-benzenepropaneic acid and C13-15alkyl esters, 2,5-di-tert-amylhydroquinone, and hinderedphenol (trade name AO.OH.98, manufactured by Adecapalmarol), 2,2'-Methylenebis [6- (1-methylcyclohexyl) -p-cresol], 2-tert-butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl Acrylate, 2- [1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 6- [3- (3-tert-butyl-) 4-Hydroxy-5-methyl) propoxy] -2,4,8,10-tetra-tert-butylbenz [d, f] [1,3,2] -dioxaphosphobin, hexamethylenebis [3-( 3,5-Di-tert-butyl-4-hydroxyphenyl) propionate, bis [monoethyl (3,5-di-tert-butyl-4-hydroxybenzyl) phosphonate] calcium salt, 5,7 -Bis (1,1-dimethylethyl) -3-hydroxy-2 (3H) -Reaction product of benzofuranone and o-xylene, 2,6-di-tert-butyl-4- (4,6-bis (4,6-bis) Octylthio) -1,3,5-triazine-2-ylamino) phenol, DL-a-tocophenol (vitamin E), 2,6-bis (α-methylbenzyl) -4-methylphenol, bis [3,3 -Bis- (4'-hydroxy-3'-tert-butyl-phenyl) butanoic acid] glycol ester, 2,6-di-tert-butyl-p-cresol, 2,6-diphenyl-4-octadesiloxyphenol , Stearyl (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, distearyl (3,5-di-tert-butyl-4-hydroxybenzyl) phosphonate, tridecyl-3,5-tert-butyl- 4-Hydroxybenzylthioacetate, thiodiethylenebis [(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 4,4'-thiobis (6-tert-butyl-m-cresol), 2- Octylthio-4,6-di (3,5-di-tert-butyl-4-hydroxyphenoxy) -s-triazine, 2,2'-methylenebis (4-methyl-6-tert-butylphenol), bis [3, 3-Bis (4-hydroxy-3-tert-butylphenyl) butyric acid] glycol ester, 4,4'-butylidenebis (2,6-di-tert-butylphenol), 4,4'-butylidenebis (6-tert) -Butyl-3-methylphenol), 2,2'-ethylidenebis (4,6-di-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) ) Butane, bis [2-tert-butyl-4-methyl-6- (2-hydroxy-3-tert-butyl-5-methylbenzyl) phenyl] terephthalate, 1,3,5-tris (2,6-dimethyl) -3-Hydroxy-4-tert-butylbenzyl) isocyanurate, 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5-tris (3) , 5-Di-tert-butyl-4-hydroxybenzyl) -2,4,6-trimethylbenzene, 1,3,5-tris [(3,5-di-tert-butyl-4-hydroxyphenyl) Propionyloxyethyl] isocyanurate, tetrakis [methylene-3- (3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] methane, 2-tert-butyl-4-methyl-6- (2) -Acryloyloxy-3-tert-butyl-5-methylbenzyl) phenol, 3,9-bis [2- (3-tert-butyl-4-hydroxy-5-methylhydrocinnamoyloxy) -1,1-dimethyl Ethyl] -2,4,8,10-tetraoxaspiro [5.5] undecane, triethylene glycolbis [β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate], stearyl-3 -(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid amide, palmityl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid amide, myristyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid amide 3- (3,5) propionic acid amide such as 3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid amide, lauryl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid amide, etc. -Dialkyl-4-hydroxyphenyl) propionic acid derivative, N, N'-bis [2- "2- (3,5-di-tert-butyl-4-hydroxyphenyl) ethylcarbonyloxy" ethyl] oxamid, N, N'-(1,3-Phenyldiyl) bis [3,5-di-tert-butyl-4-hydroxybenzenepropaneamide], 1,6-hexanediol bis [3- (3,5-di-tert-) Butyl-4-hydroxyphenyl) propionate, 4-[[4,6-bis (octylthio) -1,3,5-triazine-2-yl] amino] -2,6-di-tert-butylphenol, N, N '-Bis [3- (4-hydroxyphenyl) propanamide], bis [3- [3,5-di (tert-butyl) -4-hydroxyphenyl] propionic acid] thiobisethylene, N, N'-( 1,6-Hexanediyl) bis [3,5-di-tert-butyl-4-hydroxybenzenepropaneamide], 3- (4-hydroxy-3,5-diisopropylphenyl) octyl propionate, calcium bis [3, 5-Di-tert-butyl-4-hydroxybenzyl (ethoxy) phosphonate], 2,4-bis (octylthiomethyl) -6-methylphenol, 2,5,7,8-tetramethi Examples thereof include le-2- (4,8,12-trimethyltridecyl) -2H-1-benzopyran-6-ol.

From the viewpoint of antistatic property, its durability and weather resistance, the preferred phenolic antioxidant is 1,3,5-tris (3,5-di-tert-butyl-hydroxybenzyl) -1,3,5-. Triazine-2,4,6 (1H, 3H, 5H) -trione, 4,4', 4 "-(1-methylpropanol-3-iriden) tris (6-tert-butyl-m-cresol), 6 , 6'-di-tert-butyl-4,4'-butylidene-m-cresol, octadecyl 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythritol tetrakis [3- (3) , 5-Di-tert-butyl-4-hydroxyphenyl) propionate], 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1, 1-dimethylethyl} -2,4,8,10-tetraoxaspiro [5,5] undecane, 1,3,5-tris (3,5-di-tert-butyl-4-hydroxyphenylmethyl) -2 , 4,6-trimethylbenzene, thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxy-phenyl) propionate], N, N'-hexane-1,6-diylbis (3-( 3,5-Di-tert-butyl-4-hydroxyphenylpropionamide)), benzenepropanoic acid, 3,5-bis (1,1-dimethyl-ethyl) -4-hydroxy-C7-C9 branched alkyl ester , 4,6-bis (octylthiomethyl) -o-cresol, ethylene bis (oxyethylene) bis- (3- (5-tert-butyl-4-hydroxy-m-toluyl) propionate), hexamethylene bis ( 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate) and the like can be mentioned.
The amount of these phenolic antioxidants added is preferably 0.001 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.

Examples of the phosphorus antioxidant include bis (decyl) pentaerythritol diphosphite, bis (diisodecyl) pentaerythritol diphosphite, bis (nonylphenyl) pentaerythritol diphosphite, and bis (tridecyl) pentaerythritol diphosphite. , Bis (stearyl) pentaerythritol diphosphite, trilaurylthiophosphite heptaxis (dipropylene glycol) triphosphite bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6- Di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (2,4,6-tri-tert-butylphenyl) pentaerythritol diphosphite, bis (2,4-dicumylphenyl) pentaerythritol Diphosphite Poly (Dipropylene Glycol) Phenylphosphite, Tetra (Tridecyl) Isopropylidene Diphosphite, Tetra (Tridecyl) -4,4'-n-Buchilidenbis (2-tert-butyl-5-methylphenol) Diphosphite, Hexa (Tridecyl) -1,1,3-Tris (2-methyl-4-hydroxy-5-tert-butylphenyl) Butanetriphosphite, Tetrax (2,4-di-tert-butylphenyl) [1, 1-Biphenyl] -4,4'-diylbisphosphonite, tetrakis (2,4-di-tert-butyl-5-methylphenyl) -4,4'-biphenylidenephosphonite, tetra (alkyl of C12-C15) ) -4,4'-Isopropyridene diphenyldiphosphite, alkyl (C10) bisphenol A phosphite, 4,4'-butylidene-bis (3-methyl-6-tert-butylphenylditridecyl) phosphite, 2, 2'-Methylenebis-4,6-di-tert-butylphenyl-2-butylphosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-ethylhexylphosphite, 2,2' -Methylenebis-4,6-di-tert-butylphenyl-2-decylphosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-dodecylphosphite, 2,2'-methylenebis -4,6-di-tert-butylphenyl-2-octadecylphosphite, 2,2'-ethylenebis (4,6-di-tert-buchi) Ruphenyl) fluorophosphite, 6-ethylhexyl-2,4,8,10-tetra-tert-butyldibenzo [d. f] [1,3,2] dioxaphosphepine, 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetra-tert -Butyl dibenzo [d. f] [1,3,2] dioxaphosphepine (Sumilizer-GP), triethylphosphite, tris (2-ethylhexyl) phosphite, tri (decyl) phosphite, triisodecylphosphite, triisooctylphos Fight, Trilauryl phosphite, Tris (tridecyl) phosphite, Tristearyl phosphite, Tris (dipropylene glycol) phosphite, Trioleyl phosphite, Trisnonylphenyl phosphite, Dioleylhydrogen phosphite, Diisooctylphenyl Phenyl phosphite, di (decyl) monophenyl phosphite, diphenyl mono (2-ethylhexyl) phosphite, diphenyl monodecyl phosphite, diphenyl mono (tridecyl) phosphite, diphenyl octyl phosphite, diphenyl isooctyl phosphite, diphenyl isodecyl Phenylphosphite, diphenyltridecylphosphite, diisooctylphosphite, bis (tridecyl) phosphite, bis (2,4-di-tert-butyl-6-methylphenyl) ethylphosphite, tris [2-[(2) , 4,8,10-Tetra-tert-butyldibenzo [d, f] [1,3,2] dioxaphosphepine-6-yl) oxy] ethyl] amine, tris (2,4-di-tert) -Butylphenyl) phosphite, tetraphenyldipropylglycoldiphosphite, 2,4,6-tri-tert-butylphenyl-2-butyl-2-ethyl-1,3-propanediol phosphite, tetrakis (2, 4-Di-tert-butylphenyl) biphenylenediphosphonite, hydrogenated bisphenol-A-pentaerythritol phosphite polymer (trade name JPH-3800, Johoku Chemical Industry Co., Ltd.), 2-hydroxyethyl methacrylate acid phosphate (Johoku Chemical Industry Co., Ltd.) Company trade name "JPA-514"), Stenbisphenol-A phosphite polymer (trade name HBP of Johoku Chemical Industry Co., Ltd.), stearyl acid phosphate zinc salt (trade name JP-518Zn of Johoku Chemical Industry Co., Ltd.) and the like.

From the viewpoint of antistatic property, its durability and weather resistance, preferable phosphorus-based antioxidants are 3,9-bis (octadecyloxy) -2,4,8,10-tetraoxa-3,9-diphosphaspiro [5, 5] Undecane, 3,9-bis (2,6-di-tert-butyl-4-methylphenoxy) -2,4,8,10-tetraoxa-3,9-diphosphaspiro [5,5] Undecane, 2, 2'-Methylbis (4,6-di-tert-butylphenyl) 2-ethylhexylphosphite, tris (2,4-di-tert-butylphenyl) phosphite, tris (nonylphenyl) phosphite, tetra-C12- 15-alkyl (Propane-2,2-diylbis (4,1-phenylene)) bis (phosphite), 2-ethylhexyldiphenylphosphite, isodecyldiphenylphosphite, triisodecylphosphite, triphenylphosphite, 3 , 9-bis [2,4-bis (1-methyl-1-phenylethyl) phenoxy] -2,4,8,10-tetraoxa-3,9-diphosphaspiro [5,5] undecane, 3,9-bis [2,4-di-tert-butylphenoxy] -2,4,8,10-tetraoxa-3,9-diphosphaspiro [5,5] undecane, tetrakis (2,4-di-tert-butylphenyl) -4 , 4'-bisphenyldiphosphonite, tetra (alkyl of C12-C15) -4,4'-isopropyridene diphenyldiphosphite, diphenylmono (2-ethylhexyl) phosphite, diphenylisodecylphosphite and the like. ..
The amount of these phosphorus-based antioxidants added is preferably 0.001 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.

Next, examples of the thioether-based antioxidant include 3,3'-thiodipropionic acid, alkyl (C12-14) thiopropionic acid, di (lauryl) -3,3'-thiodipropionate, and di (di (C12-14) thiopropionic acid. Tridecyl) -3,3'-thiodipropionate, di (methyl) -3,3'-thiodipropionate, di (stearyl) -3,3'-thiodipropionate, di (octadecyl) -3, 3'-thiodipropionate, laurylstearylthiodipropionate, tetrakis [methylene-3- (dodecylthio) propionate] methane, thiobis (2-tert-butyl-5-methyl-4,1-phenylene) bis (3- (Dodecylthio) propionate), 2,2'-thiodiethylenebis (3-aminobutenoate), 4,6-bis (octylthiomethyl) -o-cresol, 2,2'-thiodiethylenebis [3-( 3,5-Di-tert-butyl-4-hydroxyphenyl) propionate], 2,2'-thiobis (4-methyl-6-tert-butylphenol), 2-ethylhexyl- (3,5-di-tert-butyl) -4-Hydroxybenzyl) thioacetate, 4,4'-thiobis (6-tert-butyl-3-methylphenol), 4,4'-thiobis (4-methyl-6-tert-butylphenol), 4,4'. -[Thiobis (methylene)] bis (2-tert-butyl-6-methyl-1-hydroxybenzyl), bis (4,6-di-tert-butylphenol-2-yl) sulfide, tridecyl-3,5-di -Tart-butyl-4-hydroxybenzylthioacetate, 1,4-bis (octylthiomethyl) -6-methylphenol, 2,4-bis (dodecylthiomethyl) -6-methylphenol and the like can be mentioned.

From the viewpoint of antistatic property, its durability and weather resistance, the preferred thioether-based antioxidant is 2,2-bis {[3- (dodecylthio) -1-oxopropoxy] methyl} propane-1,3-diylbis [ 3- (Dodecylthio) propionate], di (tridecyl) 3,3'-thiodipropionate, bis [2-methyl-4- {3-n-dodecylthiopropionyloxy} -5-tert-butylphenyl] sulfide, 4- [4-Hydroxy-3-tert-butyl-6-methylphenylthio] -2-tert-butyl-5-methylphenyl-3-dodecylthiopropanoate, bis [2-methyl-4- {3- n-alkyl (C12 or C14) thiopropionyloxy} -5-tert-butylphenyl] sulfide, didodecyl-3,3'-thiodipropionate, 3,3'-thiodipropionic acid dioctadecyl ester, etc. Be done.
The amount of these thioether-based antioxidants added is preferably 0.001 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin.

Next, examples of the amine-based antioxidant include dioctylmethylamine oxide, trioctylamine oxide, didecylmethylamine oxide, tridecylamine oxide, di (hydrogenated C12-14 alkyl) methylamine oxide, and tri (water). Addition C12-14 Alkyl Amine Oxide, Di (Hydrogen C16-18 Alkyl) Methyl Amine Oxide, Tri (Hydrogen C16-18 Alkyl) Amine Oxide, Di (C20-22) Alkyl Methyl Amine Oxide and Tri (C20-22) ) Amine oxide compounds such as alkyl) amine oxides, N, N-dibenzylhydroxylamine, phenylnaphthylamine, 4,4'-dimethoxydiphenylamine, 4,4'-bis (α, α-dimethylbenzyl) diphenylamine, 4-iso N, N-diaryl hydroxylamine such as propoxydiphenylamine, N, N-alkylaryl hydroxylamine, N, N-dicycloalkyl hydroxylamine, diethyl hydroxylamine, dioctyl hydroxylamine, dododecyl hydroxylamine, dioctadecyl hydroxylamine and the like. Examples thereof include N, N-dialkylhydroxylamines.

Further, it is preferable to add a known neutralizing agent to the resin composition of the present invention in order to neutralize the residual catalyst in the synthetic resin, if necessary. Examples of the neutralizing agent include fatty acid metal salts such as calcium stearate, lithium stearate, and sodium stearate, or fatty acid amides such as ethylene bis (stearoamide), ethylene bis (12-hydroxystearoamide), and stearic acid amide. Examples thereof include compounds, and these neutralizing agents may be mixed and used.

Furthermore, the resin composition of the present invention further comprises, if necessary, sodium-2,2'-methylenebis (4,6-di-tert-butylphenyl) phosphate, lithium-2,2'-methylenebis (4). , 6-di-tert-butylphenyl) phosphate, aluminum hydroxybis [2,2'methylenebis (4,6-di-tert-butylphenyl) phosphate], sodium benzoate, 4-tert-butyl benzoate aluminum salt, Sodium adipate and carboxylic acid metal salts such as 2-sodium bicyclo [2.2.1] heptane-2,3-dicarboxylate, dibenzylene sorbitol, bis (methylbenzylene) sorbitol, bis (3,4-dimethylbenzylene) Polyol derivatives such as sorbitol, bis (p-ethylbenzylene) sorbitol, and bis (dimethylbenzylene) sorbitol, N, N', N "-tris [2-methylcyclohexyl] -1,2,3-propanetricarboxamide, N , N', N "-tricyclohexyl-1,3,5-benzenetricarboxamide, N, N'-dicyclohexylnaphthalenedicarboxamide, amide compounds such as 1,3,5-tri (dimethylisopropoilamino) benzene, etc. May contain a nucleating agent such as aromatic carboxylic acid metal salt, alicyclic alkyl carboxylic acid metal salt, p-tertiary butyl benzoate metal salt, aromatic phosphoric acid ester metal salt, and dibenzylene sorbitol. ..

Furthermore, the resin composition of the present invention further contains, if necessary, a triazine ring-containing compound, a metal hydroxide, a phosphate ester-based flame retardant, a condensed phosphate ester-based flame retardant, a phosphate-based flame retardant, and inorganic phosphorus. A flame retardant, a (poly) phosphate flame retardant, a silicon flame retardant, a flame retardant aid, a drip inhibitor, a metal soap, a filler, a pigment, a lubricant, a foaming agent and the like may be added.

Examples of triazine ring-containing compounds include melamine, ammeline, benzguanamine, acetoguanamine, phthalodiguanamine, melamine cyanurate, melamine pyrophosphate, butyreneguanamine, norbornenediguanamine, methylenediguanamine, ethylenedimelamine, trimethylenedi. Examples thereof include melamine, tetramethylene dimelamine, hexamethylene dimelamine, 1,3-hexylene melamine and the like.
Examples of the metal hydroxide include magnesium hydroxide, aluminum hydroxide, calcium hydroxide, barium hydroxide, zinc hydroxide, Kismer 5A (magnesium hydroxide: manufactured by Kyowa Chemical Industry Co., Ltd.) and the like.

Examples of phosphoric acid ester flame retardants include trimethyl phosphate, triethyl phosphate, tributyl phosphate, tributoxyethyl phosphate, trischloroethyl phosphate, trisdichloropropyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyldiphenyl phosphate, and triki. Sirenyl phosphate, octyldiphenyl phosphate, xylenyldiphenyl phosphate, trisisopropylphenyl phosphate, 2-ethylhexyldiphenyl phosphate, t-butylphenyldiphenyl phosphate, bis- (t-butylphenyl) phenyl phosphate, tris- (t-butylphenyl) ) Phosphate, isopropylphenyldiphenyl phosphate, bis- (isopropylphenyl) diphenyl phosphate, tris- (isopropylphenyl) phosphate and the like.

Examples of the condensed phosphoric acid ester flame retardant include 1,3-phenylene bis (diphenyl phosphate), 1,3-phenylene bis (dixylenyl phosphate), bisphenol A bis (diphenyl phosphate) and the like.

Examples of the (poly) phosphate-based flame retardant include ammonium salts and amine salts of (poly) phosphate such as ammonium polyphosphate, melamine polyphosphate, piperazine polyphosphate, melamine pyrophosphate, and piperazine pyrophosphate.

If necessary, the resin composition of the present invention includes additives usually used for synthetic resins, such as cross-linking agents, anti-fog agents, anti-plate-out agents, surface treatment agents, plasticizers, lubricants, and fluorescent agents. Antifungal agents, bactericidal agents, foaming agents, metal deactivators, mold release agents, pigments, dyes, processing aids, fillers, foaming agents and the like can be blended within a range that does not impair the effects of the present invention.

The method for producing the resin composition of the present invention is not particularly limited, and a synthetic resin, particularly a thermoplastic resin, a polymer compound (E), a light stabilizer (F), an alkali metal salt (H) and, if necessary, an alkali metal salt (H) and One or more of the ionic liquid (J) and other arbitrary components may be blended, and any commonly used method can be used as the method. For example, it may be mixed and kneaded by a roll kneading, a bumper kneading, an extruder, a kneader or the like.
Further, the polymer compound (E) may be added as it is, or may be added after impregnating the carrier, if necessary. In order to impregnate the carrier, the mixture may be heated and mixed as it is, or if necessary, the carrier may be impregnated after diluting with an organic solvent, and then the solvent may be removed. As such a carrier, those known as fillers and fillers of synthetic resins, flame retardants and light stabilizers (F) that are solid at room temperature can be used, and for example, calcium silicate powder, silica powder, and talc powder can be used. , Alumina powder, titanium oxide powder, chemically modified surface of these carriers, solid ones among the flame retardant agents and light stabilizers (F) mentioned above, and the like. Among these carriers, the one in which the surface of the carrier is chemically modified is preferable, and the one in which the surface of the silica powder is chemically modified is more preferable. These carriers preferably have an average particle size of 0.1 to 100 μm, more preferably 0.5 to 50 μm.

Further, as a method of blending the polymer compound (E) into the synthetic resin, particularly the thermoplastic resin, the block polymer (C) and the epoxy compound (D) having two or more epoxy groups are kneaded at the same time as the thermoplastic resin. However, the polymer compound (E) may be synthesized and blended, and at that time, further from the group of the light stabilizer (F), and if necessary, the alkali metal salt (H) and the ionic liquid (J). One or more selected types may be kneaded at the same time, or the polymer compound (E) and the thermoplastic resin may be mixed at the time of molding such as injection molding to obtain a molded product. In addition, one or more selected from the group of a light stabilizer (F), an alkali metal salt (H) and an ionic liquid (J) may be further added, if necessary, and a polymer compound may be further added in advance. A master batch of (E) and a thermoplastic resin may be produced and blended with this master batch, at which time a light stabilizer (F), and if necessary, an alkali metal salt (H) and One or more selected from the group of ionic liquids (J) may be blended.

Next, the molded product of the present invention will be described.
By molding the antistatic resin composition of the present invention, it is possible to obtain a molded product having antistatic properties, its durability, and weather resistance. The molding method is not particularly limited, and examples thereof include extrusion processing, calendar processing, injection molding, roll, compression molding, blow molding, rotary molding, and the like, and include resin plates, sheets, films, bottles, fibers, and deformed products. It is possible to manufacture molded products having various shapes such as.
The molded product obtained from the resin composition of the present invention is excellent in antistatic performance, its durability and weather resistance.

The resin composition of the present invention and a molded product thereof include electric / electronic / communication, agriculture, forestry and fisheries, mining, construction, food, textile, clothing, medical care, coal, petroleum, rubber, leather, automobiles, precision equipment, wood, building materials, etc. It can be used in a wide range of industrial fields such as civil engineering, furniture, printing, and musical instruments.
More specifically, the resin composition of the present invention and a molded product thereof include a printer, a personal computer, a word processor, a keyboard, a PDA (small information terminal), a telephone, a copying machine, a facsimile, an ECR (electronic money registration machine), and the like. Office work such as calculators, electronic notebooks, cards, holders, stationery, OA equipment, washing machines, refrigerators, vacuum cleaners, microwave ovens, lighting equipment, game machines, irons, household appliances such as kotatsu, TVs, VTRs, video cameras, radio cassette recorders. , Tape recorders, mini discs, CD players, speakers, AV equipment such as liquid crystal displays, connectors, relays, condensers, switches, printed boards, coil bobbins, semiconductor encapsulation materials, LED encapsulation materials, electric wires, cables, transformers, deflection yokes. , Distribution boards, electric / electronic parts such as watches and communication equipment, interior / exterior materials for automobiles, intermediate bulk containers, artificial turf, plate-making films, adhesive films, bottles, food containers, food packaging films , Pharmaceutical / pharmaceutical wrapping film, product packaging film, agricultural film, agricultural sheet, greenhouse film, etc.

Further, the resin composition of the present invention and a molded body thereof are used for seats (filling, outer material, etc.), belts, ceiling coverings, compatible tops, armrests, door trims, rear package trays, carpets, mats, sun visors, foil covers, mattress covers. , Airbag, Insulation material, Hanging hand, Hanging hand band, Wire covering material, Electrical insulation material, Paint, Coating material, Overlaying material, Floor material, Corner wall, Carpet, Wallpaper, Wall covering material, Exterior material, Interior material , Roofing materials, deck materials, wall materials, pillar materials, floorboards, fence materials, skeletons and slabs, window and door profiles, shavings, siding, terraces, balconies, soundproofing boards, insulation boards, window materials, etc. Cars, vehicles, ships, aircraft, buildings, housing and building materials and civil engineering materials, clothing, curtains, sheets, non-woven fabrics, plywood, synthetic fiber boards, rugs, entrance mats, sheets, buckets, hoses, containers, glasses, bags, cases. , Goggles, ski boards, rugs, tents, daily necessities such as musical instruments, sporting goods, etc. can be used for various purposes.

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
The polymer compound (E) used in the present invention was produced according to the following production example. Further, in the following production example, the number average molecular weight of the compound (b) is calculated by the following <method for calculating the number average molecular weight from the hydroxyl group>, and the number average molecular weight other than the compound (b) is calculated by the following <polystyrene conversion]. It was calculated by the method for measuring the number average molecular weight>.

<Calculation method of number average molecular weight from hydroxyl value>
The hydroxyl value was measured by the following method for measuring the hydroxyl value, and the number average molecular weight was determined by the following formula.
Number average molecular weight = (56110 × 2) / hydroxyl value

<Measurement method of hydroxyl value>
・ Reagent A (acetylating agent)
(1) Triethyl phosphate 1560 mL
(2) Acetic anhydride 193 mL
(3) Perchloric acid (60%) 16g
The above reagents are mixed in the order of (1) → (2) → (3).
・ Reagent B
Pyridine and pure water are mixed in a volume ratio of 3: 1.
・ Reagent C
Add 2-3 drops of phenolphthalein solution to 500 mL of isopropyl alcohol and neutralize with 1N-KOH aqueous solution.

First, weigh 2 g of a sample into a 200 mL Erlenmeyer flask, add 10 mL of triethyl phosphate, and heat to dissolve. Add 15 mL of Reagent A, plug and shake vigorously. Add 20 mL of Reagent B, plug and shake vigorously. Add 50 mL of Reagent C. Titrate with 1N-KOH aqueous solution and calculate by the following formula.
Hydroxy group value [mgKOH / g] = 56.11 × f × (TB) / S
factor of 1N-KOH aqueous solution
B: Empty test titration [mL]
T: Quantitative test titration [mL]
S: Sample amount [g]

<Measurement method of number average molecular weight by polystyrene conversion>
The number average molecular weight was measured by gel permeation chromatography (GPC) method. The measurement conditions for Mn are as follows.
Equipment: GPC equipment manufactured by JASCO Corporation Solvent: Chloroform reference material: Polystyrene detector: Differential refractometer (RI detector)
Column stationary phase: Showa Denko Corporation Shodex LF-804
Column temperature: 40 ° C
Sample concentration: 1 mg / 1 mL
Flow rate: 0.8 mL / min.
Injection volume: 100 μL

[Manufacturing Example 1]
In a separable flask, 122 g (1.35 mol) of 1,4-butanediol and 168 g (1.42 mol) of succinic acid were polymerized at normal pressure for 3 hours while gradually increasing the temperature from 140 ° C to 190 ° C. Then, polyester (a) -1 was obtained. The obtained polyester (a) -1 had a number average molecular weight of 3,000.
Next, 250 g of the obtained polyester (a) -1 and 160 g of polyethylene glycol having a number average molecular weight of 3,300 and the number of repeating units of ethyleneoxy groups = 75 as the compound (b) -1 having hydroxyl groups at both ends. , 0.4 g of zirconium octylate was charged and polymerized at 200 ° C. for 3 hours under reduced pressure to obtain 400 g of block polymer (C) -1 having a structure having a carboxyl group at both ends. The number average molecular weight Mn of the block polymer (C) -1 having a structure having a carboxyl group at both ends was 16,500.
As the epoxy compound (D) -1 having two or more epoxy groups in 400 g of the obtained block polymer (C) -1 having a structure having a carboxyl group at both ends, bisphenol F diglycidyl ether (epoxy equivalent 170 g /). eq) 3 g was charged, polymerized at 220 ° C. for 5 hours under reduced pressure, then extruded at 220 ° C. using Labplast Mill μ (manufactured by Toyo Seiki Seisakusho Co., Ltd.), and cut into 5 mm square pellets. 400 g of pellets of the polymer compound (E) -1, which is the antistatic agent of the present invention, was obtained. The crystallization temperature of the obtained pellets was measured by the following <crystallization temperature measuring method>. The crystallization temperature of the polymer compound (E) -1 was 63 ° C.

<Crystalization temperature measurement method>
The crystallization temperature is measured using a differential scanning calorimetry device (Diamond DSC manufactured by Perkin). The sample is cut into small pellets, weighed 3 ± 1 mg in an aluminum pan, heated from room temperature (25 ° C) to 130 ° C at a rate of 10 ° C / min, held for 5 minutes, and then held at a rate of 10 ° C / min. In the chart obtained by cooling to 0 ° C., the temperature at which the peak heat absorption was reached was defined as the crystallization temperature.

[Examples 1 to 26, Comparative Examples 1 to 16]
Using the resin compositions of Examples and Comparative Examples blended based on the blending amounts (parts by mass) shown in Tables 1 to 9 below, test pieces were obtained according to the test piece preparation conditions shown below. Using the obtained test piece, the surface resistivity (SR value) was measured according to the following, and the antistatic property and its durability were evaluated. Moreover, using the obtained test piece, the weather resistance was evaluated according to the following. These results are also shown in Tables 1-9.
The ultraviolet absorber (F-1), hindered amine-based light stabilizer (F-2), and alkali metal salt (H) used in the evaluation are as follows.

<Conditions for preparing a test piece of ASA resin composition>
Based on the blending amounts shown in Tables 1 to 9 below, the ASA resin composition was granulated using a twin-screw extruder manufactured by Ikekai Co., Ltd. (containing PCM30, 60 mesh) at 230 ° C. and 6 kg / hour. And obtained pellets. The obtained pellets were molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Resin Industry Co., Ltd.) under processing conditions of a resin temperature of 230 ° C and a mold temperature of 50 ° C, and a test piece for surface resistivity measurement (100 mm). × 100 mm × 3 mm) and a test piece for weather resistance test (60 mm × 30 mm × 2 mm) were obtained. As the ASA resin, a melt flow rate = 20 cm ^3/10 min (ISO1133, 220 ° C. × 10.00 kg) was used.

<Conditions for preparing test piece of polycarbonate / ASA (PC / ASA) resin composition>
Based on the blending amounts shown in Tables 1 to 9 below, the polycarbonate / ASA resin composition was prepared using a twin-screw extruder manufactured by Ikekai Co., Ltd. (containing PCM30, 60 mesh) at 250 ° C. and 6 kg / hour. Granulation was performed to obtain pellets. The obtained pellets are molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Resin Industry Co., Ltd.) under processing conditions of a resin temperature of 250 ° C. and a mold temperature of 50 ° C., and a test piece for surface resistivity measurement (100 mm). × 100 mm × 3 mm) and a test piece for weather resistance test (60 mm × 30 mm × 2 mm) were obtained. The polycarbonate / ASA was polycarbonate / ASA = 7/3 (mass ratio), and a melt flow rate = 40 g / 10 min (ISO1133, 260 ° C. × 5.00 kg) was used.

<Conditions for preparing test piece of polycarbonate / ABS (PC / ABS) resin composition>
Based on the blending amounts shown in Tables 1 to 9 below, the polycarbonate / ABS resin composition was prepared using a twin-screw extruder manufactured by Ikekai Co., Ltd. (containing PCM30, 60 mesh) at 250 ° C. and 6 kg / hour. Granulation was performed to obtain pellets. The obtained pellets are molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Resin Industry Co., Ltd.) under processing conditions of a resin temperature of 250 ° C. and a mold temperature of 50 ° C., and a test piece for surface resistivity measurement (100 mm). × 100 mm × 3 mm) and a test piece for weather resistance test (60 mm × 30 mm × 2 mm) were obtained. The polycarbonate / ABS was polycarbonate / ABS = 7/3 (mass ratio), and a melt flow rate = 40 g / 10 min (ISO1133, 260 ° C. × 5.00 kg) was used.

<Conditions for preparing high-density polyethylene (HDPE) resin composition test piece>
The resin composition blended based on the blending amounts shown in Tables 1 to 9 below was prepared using a twin-screw extruder manufactured by Ikekai Co., Ltd. (containing PCM30, 60 mesh) at 200 ° C. and 6 kg / hour. Granulated to obtain pellets. The obtained pellets were molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Resin Industry Co., Ltd.) under processing conditions of a resin temperature of 200 ° C and a mold temperature of 40 ° C, and a test piece for surface resistivity measurement (100 mm). × 100 mm × 3 mm) and a test piece for weather resistance test (60 mm × 30 mm × 2 mm) were obtained. As the HDPE resin, a melt flow rate = 8 g / 10 min (ISO1133, 190 ° C. × 2.16 kg) was used.

<Surface resistivity (SR value) measurement method>
Immediately after the molding process, the obtained test piece was stored under the conditions of a temperature of 25 ° C. and a humidity of 50% RH, and after 1 day and 30 days of the molding process, the R8340 resistivity tester manufactured by Advantest Co., Ltd. was stored under the same atmosphere. The surface resistivity (Ω / □) was measured under the conditions of an applied voltage of 100 V and an applied time of 1 minute. The measurement was performed on 5 test pieces at 5 points per piece, and the average value was calculated. The results are shown in Tables 1-9.

<Weather resistance test method>
The obtained test piece for weather resistance test (60 mm × 30 mm × 2 mm) is weather-resistant using a xenon weatherometer (Ci4000 manufactured by Atlas) under the conditions of a black panel temperature of 65 ° C., a relative humidity of 50%, and a rain spray. A sex test was performed. The surface gloss retention rate (%) and the presence or absence of cracks were confirmed for the test piece 1,200 hours after the start of the test. Regarding the test results, those in which no cracks are found are marked with 〇, and those in which cracks are found are marked with x. It can be said that the one in which no crack is observed has excellent weather resistance.
The surface gloss retention rate is determined by measuring the gloss of each test piece at a measurement angle of 60 degrees using a gloss meter manufactured by Tokyo Denki Co., Ltd., model TC-108D, and then performing the above-mentioned weather resistance test. The glossiness of the test piece after the sex test was measured. The 100% of the glossiness after the weather resistance test with respect to the glossiness before the weather resistance test was defined as the glossiness retention rate (%). It can be said that the closer the gloss retention rate is to 100%, the better the weather resistance. The results of these tests are shown in Tables 1 to 9 below, respectively.

UV absorber (F-1)
(F-1) -1: 2- (5-chloro-2H-benzotriazole-2-yl) -6-tert-butyl-4-methylphenol (manufactured by ADEKA Corporation, product name ADEKA STAB LA-36)
(F-1) -2: 2- (2H-benzotriazole-2-yl) -p-cresol (manufactured by ADEKA Corporation, product name ADEKA STAB LA-32)
(F-1) -3: 2- (2H-benzotriazole-2-yl) -4,6-bis (1-methyl-1-phenylethyl) phenol (manufactured by ADEKA Corporation, product name ADEKA STAB LA-24)
(F-1) -4: 2- (2H-benzotriazole-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol (manufactured by ADEKA Corporation, product name ADEKA STAB LA-29)
(F-1) -5: 2,2'-Methylenebis [6- (2H-benzotriazole-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol] (manufactured by ADEKA Corporation) , Product name ADEKA STAB LA-31RG)
(F-1) -6: 2- (4,6-diphenyl-1,3,5-triazine-2-yl) -5- [2- (2-ethylhexanoyloxy) ethoxy] phenol (ADEKA Corporation) Made, product name ADEKA STAB LA-46)
(F-1) -7: 2,4,6-Tris (2-hydroxy-4-hexyloxy-3-methylphenyl) -1,3,5-triazine (manufactured by ADEKA Corporation, product name ADEKA STUB LA-F70) )
(F-1) -8: [2-Hydroxy-4- (octyloxy) phenyl] (phenyl) methanone (manufactured by ADEKA Corporation, product name ADEKA STAB 1413)

Hindered amine light stabilizer (F-2)
(F-2) -1: Bis (2,2,6,6-pentamethyl-4-piperidyl) Sebacate (manufactured by ADEKA Corporation, product name ADEKA STAB LA-77Y)
(F-2) -2: Tetrakis (2,2,6,6-tetramethyl-4-piperidyl) butane-1,2,3,4-tetracarboxylate (manufactured by ADEKA Corporation, product name ADEKA STAB LA-57) )
(F-2) -3: 1,2,3,4-butanetetracarboxylic acid, 2,2,6,6-tetramethyl-4-piperidinol and 3,9-bis (2-hydroxy-1,1) -Dimethylethyl) -2,4,8-10-Tetraoxospiro [5.5] Mixed esterified product with undecane (manufactured by ADEKA Corporation, product name ADEKA STAB LA-68)
(F-2) -4: 2,2,6,6-Tetramethyl-4-piperidinyl ester of C12-21 saturated fatty acid and C18 unsaturated fatty acid (manufactured by ADEKA Corporation, product name ADEKA STAB LA-40)
(F-2) -5: Tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) butane-1,2,3,4-tetracarboxylate (manufactured by ADEKA Corporation, product name ADEKA STAB LA-) 52)
(F-2) -6: 1,2,3,4-butanetetracarboxylic acid, 1,2,2,6,6-pentamethyl-4-piperidinol and 3,9-bis (2-hydroxy-1,2, 1-Dimethylethyl) -2,4,8-10-Tetraoxospiro [5.5] Mixed esterified product with undecane (manufactured by ADEKA Corporation, product name ADEKA STAB LA-63P)
(F-2) -7: Bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate (manufactured by ADEKA Corporation, product name ADEKA STAB LA-72)
(F-2) -8: Bis (1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate (manufactured by ADEKA Corporation, product name ADEKA STAB LA-81)

Alkali metal salt (H): sodium dodecylbenzene sulfonate (NaDBS)

From the above, it can be seen that the resin composition of the present invention can provide a molded product having excellent antistatic performance, durability thereof, and weather resistance.

Claims (14)

Antistatic resin composition containing 3 to 40 parts by mass of one or more polymer compounds (E) and 0.001 to 30 parts by mass of one or more light stabilizers (F) with respect to 100 parts by mass of synthetic resin. In things
The polymer compound (E) is a polyester (a) obtained by reacting a diol (a1) with a dicarboxylic acid (a2), and a compound (b) having one or more ethyleneoxy groups and having hydroxyl groups at both ends. , One or more of the polymer compounds obtained by reacting with the epoxy compound (D) having two or more epoxy groups, wherein the diol (a1) is 1,4-butanediol or ethylene glycol. An antistatic resin composition which is at least one and the dicarboxylic acid (a2) is a succinic acid or a mixture of dicarboxylic acids containing a succinic acid. The antistatic resin composition according to claim 1, wherein the light stabilizer (F) is an ultraviolet absorber (F-1). The antistatic resin composition according to claim 1, wherein the light stabilizer (F) is a hindered amine-based light stabilizer (F-2). The antistatic resin composition according to claim 1, wherein the light stabilizer (F) is an ultraviolet absorber (F-1) and a hindered amine light stabilizer (F-2). The polymer compound (E) has a block (A) of a polyester composed of the polyester (a) and a block (B) of a polyether composed of the compound (b), and the polyester ( Formed by the reaction of a hydroxyl group or carboxyl group at the end of a), a hydroxyl group at the end of compound (b), and a hydroxyl group formed by the reaction of the epoxy group or epoxy group of the epoxy compound (D). The antistatic resin composition according to any one of claims 1 to 4, which has a structure formed by bonding via an ester bond or an ether bond. The polymer compound (E) is a block polymer having a carboxyl group at both ends, wherein the polyester block (A) and the polyether block (B) are repeatedly and alternately bonded via an ester bond. The antistatic resin composition according to any one of claims 1 to 5, which has a structure in which (C) and the epoxy compound (D) are bonded via an ester bond. The antistatic resin composition according to any one of claims 1 to 6, wherein the polyester (a) of the polymer compound (E) has a structure having carboxyl groups at both ends. The antistatic resin composition according to any one of claims 1 to 7, wherein the compound (b) of the polymer compound (E) is polyethylene glycol. The antistatic resin composition according to any one of claims 1 to 8, wherein the crystallization temperature of the polymer compound (E) is in the range of 20 to 70 ° C. The antistatic resin composition according to any one of claims 1 to 9, wherein the polyester (a) of the polymer compound (E) has a number average molecular weight of 1,000 to 10,000 in terms of polystyrene. thing. The antistatic resin composition according to any one of claims 6 to 10, wherein the block polymer (C) of the polymer compound (E) has a number average molecular weight of 5,000 to 50,000 in terms of polystyrene. thing. The charge according to any one of claims 1 to 11, further comprising 0.01 to 8 parts by mass of one or more selected from the group consisting of an alkali metal salt (H) and an ionic liquid (J). Preventive resin composition. The synthetic resin is at least one selected from the group consisting of polyolefin-based resins, polystyrene-based resins, polycarbonate-based resins, polyester-based resins, polyether-based resins, polyamide-based resins, halogen-containing resins, and copolymers thereof. , The antistatic resin composition according to any one of claims 1 to 12. A molded product obtained from the antistatic resin composition according to any one of claims 1 to 13.