JP2022099212A5 - - Google Patents

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JP2022099212A5
JP2022099212A5 JP2020220051A JP2020220051A JP2022099212A5 JP 2022099212 A5 JP2022099212 A5 JP 2022099212A5 JP 2020220051 A JP2020220051 A JP 2020220051A JP 2020220051 A JP2020220051 A JP 2020220051A JP 2022099212 A5 JP2022099212 A5 JP 2022099212A5
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metal
semiconductor
metal needle
voltage
thin film
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JP2020220051A
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JP2022099212A (en
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Description

2方向切替スイッチ9を図内下方側に倒し、
4X4マトリックス・スイッチ10については下記の接続順で発生するホール起電力を測定する。
1)W11とW42を短絡して金属針34と35間に電流源31によって電流を流し、W23とW34を短絡することで電圧計32によって金属針33と36間に発生するホール起電力V36を計測する。
更に、金属針の位置的な誤差によって生じるオフセット電圧を除去するために、電流を逆
方向に流して平均化する必要があるため、下記の接続で再度測定する。
2)W41とW12を短絡して金属針34と35間に電流源31によって逆方向に電流を流し、W23とW34を短絡することで電圧計32によって金属針33と36間に発生するホール起電力V63を計測する。
V63とV36の差を取り、1/2を掛けてオフセット電圧を除去して正確なホール起電力を導出することができる。
Push the two-way selector switch 9 downward in the figure,
Regarding the 4×4 matrix switch 10, the Hall electromotive force generated in the following connection order is measured.
1) By short-circuiting W11 and W42 and flowing a current between the metal needles 34 and 35 by the current source 31, and shorting W23 and W34, the Hall electromotive force V36 generated between the metal needles 33 and 36 is detected by the voltmeter 32. measure.
Furthermore, in order to remove the offset voltage caused by the positional error of the metal needle, it is necessary to flow the current in the opposite direction and average it, so the measurement is performed again with the following connection.
2) By shorting W41 and W12 and passing a current in the opposite direction between the metal needles 34 and 35 by the current source 31, and shorting W23 and W34, the voltmeter 32 detects the hole generated between the metal needles 33 and 36. Measure electric power V63.
An accurate Hall electromotive force can be derived by taking the difference between V63 and V36 and multiplying by 1/2 to remove the offset voltage.

上記の測定法は、無論、電流源の方向を逆にして平均化することで測定精度を高めることが出来る。以上、金属針列1を軸に説明したが、また、金属針列2と1を交代して、直交する方向で測定を行うことや、印加磁場の方向を逆にして同様の手順で測定を行うことで、より一層、測定精度を高めることが出来る。このように、本実施例は4端子法によって予めシート抵抗を知ることが出来ることから、GaN/AlGaNヘテロ接合における二次元電子ガスのキャリア移動度やキャリア濃度の測定が簡略化されるものである。
なお、原理的に電圧V の測定では最内側2本の金属針のみを用いれば良いが、金属針列2と金属針列1を交代させ、被測定物の直交する方向の移動度も測定できる。
なお、金属針列1と金属針列2に対して、実施例5で使用する測定プラットフォームを2回適用し、電圧計を2個用いて、実施できることは言うまでもない。
Of course, the measurement accuracy of the above measurement method can be improved by reversing the direction of the current source and averaging. The above explanation has been based on metal needle row 1, but it is also possible to alternate metal needle rows 2 and 1 and perform measurements in orthogonal directions, or to perform measurements in the same manner with the direction of the applied magnetic field reversed. By doing so, the measurement accuracy can be further improved. In this way, in this example, the sheet resistance can be known in advance using the four-terminal method, which simplifies the measurement of the carrier mobility and carrier concentration of the two-dimensional electron gas in the GaN/AlGaN heterojunction. .
In principle, it is sufficient to use only the two innermost metal needles to measure the voltage VH, but it is also possible to alternate the metal needle row 2 and metal needle row 1 and measure the mobility of the object to be measured in the orthogonal direction . can.
It goes without saying that the measurement platform used in Example 5 can be applied twice to the metal needle row 1 and the metal needle row 2, and the measurement can be carried out using two voltmeters.

Claims (7)

セラミック圧電素子の2つの電極に接続された金属針を半導体または導電性薄膜に接触させ、前記圧電素子に応力または打撃を加えることで前記金属針に高電圧かつ微小電流を印加することにより、前記金属針と半導体または導電性薄膜と電気的コンタクトを形成する方法。 A metal needle connected to two electrodes of a ceramic piezoelectric element is brought into contact with a semiconductor or a conductive thin film, and a high voltage and a minute current are applied to the metal needle by applying stress or impact to the piezoelectric element. A method of forming electrical contact between a metal needle and a semiconductor or conductive thin film. セラミック圧電素子の2つの電極に接続された金属針を半導体または導電性薄膜に接触させ、前記圧電素子に応力または打撃を加えることで前記金属針に高電圧かつ微小電流を印加した後、圧電素子の電極を反転させ、前記素子に複数回の応力または打撃を加えることで金属針に高電圧かつ微小電流を印加することにより、金属針と半導体または導電性薄膜と電気的コンタクトを形成する方法。 A metal needle connected to two electrodes of a ceramic piezoelectric element is brought into contact with a semiconductor or a conductive thin film, and a high voltage and a small current are applied to the metal needle by applying stress or impact to the piezoelectric element, and then the piezoelectric element is A method of forming electrical contact between a metal needle and a semiconductor or conductive thin film by applying a high voltage and a minute current to the metal needle by inverting the electrode and applying stress or blows to the element multiple times. 直線状かつ等間隔に4本配列された金属針を半導体または導電性薄膜に接触し、請求項1および2に記載されたセラミック圧電素子を最外側の2 本の金属針に接続し、請求項1および2に記載される方法で半導体または導電性薄膜と電気的コンタクトを形成した後、最外側の2本の金属針に電流源を接続し、最内側2本の金属針間の電圧を計測することにより前記半導体または導電性薄膜のシート抵抗を測定することを特徴とする測定装置。 Four metal needles arranged in a straight line and at equal intervals are brought into contact with a semiconductor or a conductive thin film, and the ceramic piezoelectric elements described in claims 1 and 2 are connected to the two outermost metal needles, as claimed in claim 1. After forming electrical contact with the semiconductor or conductive thin film using the methods described in 1 and 2, connect a current source to the two outermost metal needles and measure the voltage between the two innermost metal needles. A measuring device characterized in that the sheet resistance of the semiconductor or conductive thin film is measured by: 4辺形の頂点に配置された4本の金属針を接触させた半導体または導電性薄膜に対して、請求項1および2に記載される方法で、4本の金属針全てに電気的コンタクトを形成し、半導体または導電性薄膜に法線方向から磁場を印加し、対角する2本の金属針に電流源を接続し、直交方向の2本の金属針間の電圧を測定することを特徴とするホール効果測定装置。 For a semiconductor or conductive thin film in contact with four metal needles placed at the vertices of a quadrilateral, electrical contact is made to all four metal needles by the method described in claims 1 and 2. A magnetic field is applied to the semiconductor or conductive thin film from the normal direction, a current source is connected to two diagonal metal needles, and the voltage between the two metal needles in the orthogonal direction is measured. Hall effect measuring device. 半導体基板上に形成されたショットキー接合またはMIS(金属・絶縁体・半導体)接合領域と、前記領域外に複数の金属針を半導体基板と接触させて、請求項1および2に記載された方法で電気的コンタクトを形成した電極と、ショットキー接合またはMIS(金属・絶縁体・半導体)接合領域に接触させた電極間において、容量・電圧特性(CV特性)を測定することを特徴とする半導体特性測定装置。 The method according to claims 1 and 2, comprising a Schottky junction or MIS (metal-insulator-semiconductor) junction region formed on a semiconductor substrate, and a plurality of metal needles outside the region in contact with the semiconductor substrate. A semiconductor characterized in that capacitance/voltage characteristics (CV characteristics) are measured between an electrode with which an electrical contact is formed and an electrode that is in contact with a Schottky junction or an MIS (metal-insulator-semiconductor) junction region. Characteristic measuring device. 請求項1,2、3,4、5における、セラミック圧電素子による電気的コンタクトを形成する構成部および接続の切替部を共用して使用することを特徴とする電気特性測定装置。 An electrical property measuring device according to any one of claims 1, 2, 3, 4, and 5, characterized in that a component for forming an electrical contact using a ceramic piezoelectric element and a connection switching unit are used in common. 直線状かつ等間隔に配列された4本の金属針列1と
前記4本の金属針列1と直交して配置された同様の4本の金属針列2と、
前記4本の金属針列1の最外側の2本に接続される電流源と、
前記4本の金属針列1の最内側の2本の金属針の電圧Vsを測定する電圧Vs測定部と、
半導体または導電性薄膜に垂直から磁場を印加し、前記4本の金属針列2の最内側の2本の金属針の電圧V を測定する電圧V 測定部と、
を備え、
前記4本の金属針列1の最内側の2本の金属針と前記4本の金属針列2の最内側の2本の金属針とを用いて正四辺形を構成し、
前記4本の金属針列1及び前記4本の金属針列2に電気的コンタクトが形成されており、
電圧Vsおよび電圧V および磁場Bからキャリア移動度を求めることを特徴とするホール効果測定装置。
A row of four metal needles 1 arranged linearly and at equal intervals ,
Similar four metal needle rows 2 arranged orthogonally to the four metal needle rows 1 ;
a current source connected to the outermost two of the four metal needle rows 1 ;
a voltage Vs measurement unit that measures the voltage Vs of the two innermost metal needles of the four metal needle rows 1 ;
a voltage V H measurement unit that applies a magnetic field B perpendicularly to the semiconductor or conductive thin film and measures the voltage V H of the innermost two metal needles of the four metal needle rows 2;
Equipped with
Constructing a regular quadrilateral using the innermost two metal needles of the four metal needle rows 1 and the innermost two metal needles of the four metal needle rows 2,
Electrical contacts are formed on the four metal needle rows 1 and the four metal needle rows 2,
A Hall effect measuring device characterized in that carrier mobility is determined from voltage Vs, voltage VH , and magnetic field B.
JP2020220051A 2020-12-22 2020-12-22 Forming method of electrical contact on semiconductor and conductive thin film, sheet resistance measuring device using the same, hall effect measuring device, and capacity/voltage characteristic measuring device Pending JP2022099212A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020220051A JP2022099212A (en) 2020-12-22 2020-12-22 Forming method of electrical contact on semiconductor and conductive thin film, sheet resistance measuring device using the same, hall effect measuring device, and capacity/voltage characteristic measuring device

Applications Claiming Priority (1)

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JP2020220051A JP2022099212A (en) 2020-12-22 2020-12-22 Forming method of electrical contact on semiconductor and conductive thin film, sheet resistance measuring device using the same, hall effect measuring device, and capacity/voltage characteristic measuring device

Publications (2)

Publication Number Publication Date
JP2022099212A JP2022099212A (en) 2022-07-04
JP2022099212A5 true JP2022099212A5 (en) 2023-11-20

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JP2020220051A Pending JP2022099212A (en) 2020-12-22 2020-12-22 Forming method of electrical contact on semiconductor and conductive thin film, sheet resistance measuring device using the same, hall effect measuring device, and capacity/voltage characteristic measuring device

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