JP2022096996A - Discharge device, imprint device and method for producing article - Google Patents

Abstract

To provide a discharge device that has a simple structure and can suppress contact between a discharged material and oxygen in a storage container, and an imprint device and a method for producing an article.SOLUTION: A discharge device has a storage container that stores a gas and a discharged material, and discharge means that discharges the discharged material within the storage container. The discharge device also has a deoxygenation part that reduces an oxygen content in the gas within the storage container.SELECTED DRAWING: Figure 2

Description

The present invention relates to a discharge device, an imprint device, and a method for manufacturing an article.

In Patent Document 1, a separation film is provided in the space inside the storage container, and the separation film separates the discharge storage unit for accommodating the discharge and the filling liquid storage unit for accommodating the filling liquid. Is disclosed.

When the discharged product comes into contact with oxygen, it is inactivated and causes oxygen inhibition (polymerization inhibition) in which the polymerization reaction is stopped. As in Patent Document 1, the pressure of the discharge accommodating portion is controlled through the separation membrane by controlling the pressure of the filling liquid accommodating portion in a state where the filling liquid accommodating portion and the ejected material accommodating portion are separated and the ejected material is isolated. By controlling the pressure, it is possible to suppress the contact between the discharged material and oxygen.

Japanese Unexamined Patent Publication No. 2020-26129

However, the configuration of the storage container as in Patent Document 1 is complicated, and the number of parts is also large.

Therefore, an object of the present invention is to provide a discharge device, an imprint device, and a method for manufacturing an article, which have a simple structure and can suppress contact between a discharge device and oxygen in a storage container.

Therefore, the discharge device of the present invention is a discharge device including a storage container for storing the discharged material and a discharge means for discharging the discharge material stored in the storage container, and is a gaseous oxygen stored in the storage container. It is characterized by having a deoxidizing portion for reducing the content.

According to the present invention, it is possible to provide a discharge device, an imprint device, and a method for manufacturing an article, which have a simple structure and can suppress contact between a discharge device and oxygen in a storage container.

It is a figure which showed the imprint apparatus. It is a schematic diagram which showed the discharge device. It is a figure which showed the manufacturing method of the article in the imprint apparatus in the order of process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing an imprint device 1 to which the present embodiment can be applied. The imprint device 1 is used for manufacturing an article represented by a semiconductor device. The imprint device 1 includes a light irradiation unit 10, a mold holding unit 11, a substrate chuck 12, a substrate stage 13, a discharge device 14, a discharge nozzle 15, a pressure adjusting unit 16, and a discharge device control unit 17. , Equipped with.

The imprint device 1 discharges a liquid photosensitive resin (photosensitive resin composition, resist) 21 which is a discharge from the discharge nozzle 15 of the discharge device 14 onto the substrate 19 fixed to the substrate chuck 12. After that, the mold 18 having a pattern held by the mold holding portion 11 is pressed (stamped) against the uncured photosensitive resin 21 discharged onto the substrate 19. Then, the imprint device 1 cures the photosensitive resin 21 by irradiating the photosensitive resin 21 with light 20 (for example, ultraviolet rays) from the light irradiation unit 10 in a state where the mold 18 is pressed against the mold 18. After that, the imprint device 1 transfers the pattern on the mold 18 to the photosensitive resin 21 on the substrate 19 by separating the mold 18 from the photosensitive resin 21.

The light irradiation unit 10 irradiates the photosensitive resin 21 with light 20 via the mold 18. The wavelength of the light to be irradiated may be a wavelength corresponding to the resin to be cured. A pattern to be transferred, such as a circuit pattern, is formed on the surface of the mold 18 facing the substrate 19. The material of the mold 18 is preferably a material that allows light 20 to pass through, for example, quartz. The mold holding portion 11 includes a mold chuck (not shown) for holding the mold 18, a mold drive mechanism (not shown) for holding the mold chuck movably, and a magnification correction mechanism (not shown) for correcting the shape of the mold 18. Be prepared. The substrate 19 is a silicon wafer, an SOI (Silicon on Insulator) substrate, or a glass substrate.

On the substrate 19, there are a plurality of shots that are pattern forming regions arranged in a specific shot layout, and in each shot, droplets of the photosensitive resin 21 are ejected from the ejection nozzle 15 immediately before imprinting. To. By imprinting the pattern formed on the mold 18 on the discharged photosensitive resin 21, the pattern of the photosensitive resin 21 is formed on the substrate 19. The substrate chuck 12 holds the substrate 19. The substrate stage 13 holds the substrate 19 movably, ejects the photosensitive resin 21 by the ejection nozzle 15, and then performs imprinting while aligning the mold 18 and the substrate 19. The discharge device 14 stores the photosensitive resin 21 and discharges the photosensitive resin 21 from a plurality of discharge nozzles 15 that are discharged onto the substrate.

A series of imprint operations are performed in the order of substrate movement to the imprint shot position, resin ejection / coating, imprinting, alignment, resin curing, mold release, and movement to the next shot position, if necessary. This operation is repeated.

FIG. 2 is a schematic view showing the discharge device 14. The discharge device 14 includes a discharge nozzle 15, a storage container 24, a pressure adjusting unit 16, a discharge device control unit 17, a deoxidizing unit 23, and a pressure detecting unit 25 for measuring the pressure in the storage container 24.

The photosensitive resin 21 is housed in the storage container 24, and the gas 22 is housed in the space formed above the photosensitive resin 21 in the storage container 24. In the discharge device 14, the entire device is controlled by the discharge device control unit 17, the gas 22 is supplied into the storage container by the pressure adjustment unit 16 to control the pressure in the storage container, and the photosensitive resin 21 is released from the discharge nozzle 15. It is discharged. The ejection nozzle 15 preferably uses an inkjet technique.

The pressure adjusting unit 16 controls the discharge device so as to maintain the pressure of the liquid photosensitive resin (photosensitive resin composition, liquid) in the storage container 24 at a predetermined pressure based on the detection result of the pressure detecting unit 25. It is controlled by the unit 17. In order to stably eject the droplets in the inkjet type ejection nozzle 15, it is required to keep the pressure of the photosensitive resin at a constant minute negative pressure. Therefore, the photosensitive resin in the storage container 24 is controlled to a predetermined pressure, and the pressure is, for example, −0.3 kPa. In the present embodiment, the discharge nozzle 15 and the pressure detection unit 25 are provided at substantially the same height in order to accurately measure the pressure of the photosensitive resin of the discharge nozzle 15. In the present embodiment, the discharge nozzle 15 and the pressure detection unit 25 are provided at substantially the same height, but the pressure detection unit 25 may be provided in the discharge nozzle 15 or in the vicinity of the discharge nozzle 15.

The gas 22 in the storage container 24 is preferably an inert gas, and for example, nitrogen, argon or the like is suitable. The photosensitive resin 21 contains additives such as a photopolymerization initiator, a polymerization inhibitor, and a surfactant, in addition to the monomer as the main component. In order to prevent the reaction with these additives and the like, an inert gas is used for the gas 22. Although the inert gas is used in the present embodiment, the gas is not limited to the inert gas and a gas containing no oxygen may be used.

If the gas 22 is a gas containing oxygen, the photopolymerization initiator of the photosensitive resin 21 reacts with oxygen, which may cause polymerization inhibition in which the polymerization reaction is stopped. When the polymerization inhibition occurs, the polymerization reaction is stopped at the photosensitive resin 21 after ejection, and the curing of the photosensitive resin 21 is inhibited. Since the storage container 24 and the pipes use a resin such as PTFE or PFA as the material thereof, gas can permeate. Further, the discharge device 14 has a joint portion, and it may be difficult to completely seal the inside of the storage container 24. In this way, oxygen can enter the storage container 24 together with air from the outside. As a result, the photosensitive resin 21 and oxygen may come into contact with each other, resulting in polymerization inhibition.

Therefore, in the present embodiment, the discharge device 14 is provided with a deoxidizing unit 23 for reducing the oxygen content of the gas 22 in the storage container 24. Any deoxidizing device can be used for the deoxidizing unit 23. For example, a method using nitrogen gas, a method using an oxygen scavenger such as hydrazine, or the like can be used. The deoxidizing unit 23 can reduce the oxygen content of the gas 22 while circulating the gas 22 in the storage container 24. Further, the deoxidizing unit 23 includes an oxygen concentration measuring function, and the deoxidizing unit 23 controls the discharge device so as to maintain the oxygen concentration of the gas 22 at an oxygen concentration of 1% or less, which is an oxygen concentration that does not cause polymerization inhibition. It is controlled by unit 17. By repeating the ejection of the photosensitive resin 21 from the ejection nozzle 15 based on the series of imprinting operations, the photosensitive resin 21 in the storage container 24 is reduced. As the amount of the resin 21 decreases, the gas 22 is supplied from the pressure adjusting unit 16 based on a predetermined control.

In this way, the discharge device 14 controls the pressure inside the storage container 24, the oxygen concentration of the gas 22, and the gas circulation, so that the photosensitive resin 21 maintained in the optimum state for imprinting is discharged from the discharge nozzle 15. be able to.

The pressure inside the storage container 24 is controlled to a negative pressure of about −0.3 kPa. By controlling the inside of the storage container 24 to a negative pressure in this way, the stored photosensitive resin 21 is degassed. By degassing the photosensitive resin 21, bubbles that may cause pattern defects after ejection can be removed from the photosensitive resin 21.

3 (a) to 3 (f) are views showing the manufacturing method of articles in the imprint device 1 in the order of processes. Imprint technology can form three-dimensional structures at once, and because it is possible to manufacture diffractive optical elements and bio-based chip-type inspection elements, and to form nanometer-order patterns, next-generation semiconductor lithography technology, etc. It can be applied to a wide range of fields.

The three-dimensional pattern formed by using the imprint device 1 is used permanently for at least a part of various articles or temporarily when manufacturing various articles. Here, the "article" is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

Hereinafter, a method of manufacturing an article in the imprint device 1 will be described in order of process. First, as shown in FIG. 3A, a substrate 1z such as a silicon wafer (a substrate 2z such as a silicon wafer and a substrate 1z such as a silicon wafer) having a workpiece 2z such as an insulator formed on the surface thereof are combined to form a substrate 19. (See Fig. 1)) is prepared. Subsequently, by an inkjet method or the like, the photosensitive resin 21 which is an imprint material having reduced oxygen (in the deoxidizing step) is applied to the surface of the material 2z to be processed (discharging step). Here, a state in which a plurality of droplet-shaped photosensitive resins 21 are applied onto the substrate is shown. Next, as shown in FIG. 3B, the side on which the uneven pattern of the imprint mold 18 is formed faces the photosensitive resin 21 on the substrate.

Then, as shown in FIG. 3C, the mold 18 is stamped on the substrate 1z to which the photosensitive resin 21 is applied (stamping step). The photosensitive resin 21 is filled in the gap between the mold 18 and the work material 2z. In this state, light is irradiated through the mold 18 as energy for curing. As a result, the polymerization reaction is started and the photosensitive resin 21 is cured. Since the photosensitive resin 21 is suppressed from coming into contact with oxygen, it cures without causing polymerization inhibition. Then, as shown in FIG. 3D, when the photosensitive resin 21 is cured and then the mold 18 and the substrate 1z are released, a pattern of the photosensitive resin 21 is formed on the substrate 1z. In this pattern, the concave portion of the mold 18 corresponds to the convex portion of the pattern, and the convex portion corresponds to the concave portion of the pattern. That is, the uneven pattern of the mold 18 is transferred to the photosensitive resin 21.

After the uneven pattern is transferred, as shown in FIG. 3E, when etching is performed using the pattern as an etching resistant mask, the portion of the surface of the work material 2z that has no pattern or remains thin is removed, and the groove is formed. 5z is formed. After that, as shown in FIG. 3 (f), when the pattern of the photosensitive resin 21 is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Here, the pattern is removed, but the pattern may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

As described above, the discharge device 14 includes a deoxidizing unit 23 for adjusting the oxygen concentration of the gas 22 in the storage container 24 to a desired concentration. Thereby, it is possible to provide a discharge device, an imprint device, and a method for manufacturing an article, which have a simple structure and can suppress the contact between the photosensitive resin and oxygen in the storage container.

1 Imprint device 14 Discharge device 15 Discharge nozzle 16 Pressure adjustment unit 21 Photosensitive resin 23 Deoxidizer 24 Storage container 25 Pressure measurement unit

Claims (10)

A storage container for storing gas and discharge, a discharge means for discharging the discharge stored in the storage container, and a discharge means.
It is a discharge device equipped with
A discharge device including a deoxidizing unit that reduces the oxygen content of the gas stored in the storage container. The discharge device according to claim 1, wherein the deoxidizing unit circulates a gas stored in the storage container. A pressure adjusting means for supplying gas into the storage container and adjusting the pressure in the storage container is provided.
The discharge device according to claim 1 or 2, wherein the pressure adjusting means adjusts the pressure in the storage container based on the detection result of the pressure detecting means for detecting the pressure in the storage container. The discharge device according to claim 3, further comprising a control means for controlling the deoxidizing unit, the discharge means, and the pressure adjusting means. The deoxidizing section has an oxygen concentration measuring function and has an oxygen concentration measuring function.
The discharge device according to claim 4, wherein the control means controls the deoxidizing unit so as to maintain the oxygen concentration of the gas stored in the storage container at 1% or less. The discharge device according to any one of claims 1 to 5, wherein the discharge is a photosensitive resin. The discharge device according to any one of claims 1 to 6, wherein the gas is an inert gas. The discharge device according to any one of claims 1 to 7, wherein the discharge product contains a photopolymerization initiator. An imprint device comprising the discharge device according to any one of claims 1 to 8 and a mold for imprinting the discharged material discharged from the discharge device. A method for manufacturing an article using a discharge device including a storage container for storing gas and discharge, and a discharge means for discharging the discharge stored in the storage container.
A deoxidizing process that reduces the oxygen content of the gas stored in the storage container,
A discharge process for discharging the discharge material stored in the storage container in which the deoxidizing step has been performed, and a discharge process.
A stamping process of imprinting a mold on the discharged material discharged in the discharging process to manufacture an article, and a stamping process of manufacturing an article.
A method of manufacturing an article having.

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