JP2022093969A - Vehicular lighting device and vehicular lamp fitting - Google Patents

Abstract

To provide a vehicular lighting device which enables easy change of a thickness of a portion with which a socket terminal contacts, and to provide a vehicular lamp fitting.SOLUTION: A vehicular lighting device according to an embodiment has a light emitting element. The vehicular lighting device includes: a substrate having a pair of terminals and provided with a wiring pattern which is electrically connected with the light emitting element; and adapters which are respectively provided at the pair of terminals and have conductivity and into which portions, provided with the terminals, of the substrate are respectively inserted.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lighting device.

Wedge-based bulbs without a base are used as vehicle lighting equipment. Wedge-based bulbs are incandescent bulbs. Therefore, from the viewpoint of power saving and long life, wedge-based light bulbs have come to be replaced with vehicle lighting devices equipped with light emitting diodes.

The wedge-based bulb is mounted by pushing it into a socket provided in a vehicle lamp. When a vehicle lighting device equipped with a light emitting diode is used instead of the wedge-based bulb, it is preferable that the socket in which the wedge-based bulb is mounted can be used as it is.

Therefore, a vehicle lighting device including a substrate on which a light emitting diode is mounted and a housing to which a pair of leads (terminals) are attached has been proposed. However, if the housing is provided, it becomes impossible to reduce the size and cost of the vehicle lighting device.
In this case, if a substrate provided with a pair of terminals is used instead of the housing to which the pair of leads are attached, it is possible to reduce the size and cost of the vehicle lighting device. A board provided with a pair of terminals is inserted inside a recess provided in a socket, and a portion of the board provided with terminals is sandwiched between socket terminals provided inside the recess. Therefore, the vehicle lighting device is held at the socket terminal. Further, the vehicle lighting device is electrically connected to an external power source or the like via the socket terminal.

However, depending on the model number and manufacturer of the socket, the dimensions (thickness of the portion where the terminal is provided) suitable for sandwiching the socket terminal may differ. Further, depending on the manufacturing lot and the like, there may be a large variation in dimensions suitable for sandwiching the socket terminal.
In this case, if the thickness of the portion provided with the terminal is too thick for the dimension suitable for sandwiching the socket terminal, it becomes difficult to mount the vehicle lighting device. If the thickness of the part where the terminal is provided is too thin for the size suitable for sandwiching the socket terminal, the reliability of the electrical connection between the terminal on the board and the socket terminal will decrease, or the lighting for vehicles will be reduced. The device may fall out of the socket.

In this case, if the thickness of the substrate is changed according to the dimensions suitable for the socket terminal to be sandwiched, the manufacturing cost will increase and the productivity will decrease.
Therefore, it has been desired to develop a technique capable of easily changing the thickness of the portion where the socket terminal contacts.

Japanese Unexamined Patent Publication No. 2013-105652

An object to be solved by the present invention is to provide a vehicle lighting device and a vehicle lighting device capable of easily changing the thickness of a portion in contact with a socket terminal.

The vehicle lighting device according to the embodiment is a vehicle lighting device having a light emitting element. The vehicle lighting device includes a substrate having the pair of terminals and provided with a wiring pattern electrically connected to a light emitting element; the substrate provided on each of the pair of terminals and having conductivity. The adapter is provided with an adapter into which the portion provided with the terminal is inserted.

According to the embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lighting device that can easily change the thickness of the portion in contact with the socket terminal.

It is a schematic perspective view for exemplifying the vehicle lighting device which concerns on 1st Embodiment. It is a schematic perspective view for exemplifying a connection pad. (A) is a schematic perspective view for exemplifying an adapter. (B) is a schematic cross-sectional view for exemplifying the attachment of the adapter. It is a schematic perspective view for exemplifying the vehicle lighting device which concerns on 2nd Embodiment. It is a schematic diagram for exemplifying the lamp for a vehicle which concerns on this embodiment.

Hereinafter, embodiments will be illustrated with reference to the drawings. In each drawing, similar components are designated by the same reference numerals and detailed description thereof will be omitted as appropriate.
Examples of the vehicle lighting device according to the present embodiment include those used for room lamps, meter lamps, reading lights, braking lights, direction indicator lights, tail lights, etc. provided in automobiles, railroad vehicles, and the like. can. However, the use of the vehicle lighting device is not limited to these.

(Vehicle lighting device according to the first embodiment)
FIG. 1 is a schematic perspective view for illustrating the vehicle lighting device 1 according to the first embodiment. As shown in FIG. 1, the vehicle lighting device 1 is provided with, for example, a light emitting unit 10, a connecting unit 20, a positioning unit 30, and a cover 40.

The light emitting unit 10 includes, for example, a substrate 11 and a light emitting element 12.
The substrate 11 can be a plate-like body having a surface 11a and a surface 11d facing the surface 11a. The planar shape of the substrate 11 can be, for example, a part of a circle including a center point. however. The planar shape of the substrate 11 is not limited to that illustrated. The planar shape of the substrate 11 may be, for example, a polygon. The planar shape of the substrate 11 can be appropriately changed depending on the number, arrangement, and the like of the light emitting elements 12.

The substrate 11 can be formed from an insulating material. The substrate 11 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride) or an organic material such as paper phenol or glass epoxy. Further, the substrate 11 may be, for example, a metal core substrate in which the surface of a metal plate is coated with an insulating material.

When the amount of heat generated by the light emitting element 12 is large, it is preferable to form the substrate 11 using a material having high thermal conductivity from the viewpoint of heat dissipation. Examples of the material having high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resin, and a metal core substrate. The high thermal conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler made of aluminum oxide, carbon (carbon) or the like.

The thickness of the substrate 11 is, for example, about 0.5 mm to 3.0 mm. However, the thickness of the substrate 11 is not limited to the one illustrated, and can be changed as appropriate.

A wiring pattern 11b is provided on the surface 11a of the substrate 11 opposite to the connection portion 20 side. The wiring pattern 11b has, for example, a mounting pad 11b1. The light emitting element 12 is electrically connected to the mounting pad 11b1. The wiring pattern 11b is formed of, for example, a low resistance metal such as copper, aluminum, or silver.

At least one light emitting element 12 can be provided on the surface 11a of the substrate 11.
The light emitting element 12 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.
The light emitting element 12 can be, for example, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type. Further, the light emitting element 12 may be, for example, a light emitting element having a lead wire such as a cannonball type. The light emitting element 12 illustrated in FIG. 1 is a surface mount type light emitting element.

Further, the light emitting element 12 may be a chip-shaped light emitting element. The chip-shaped light emitting element can be mounted by, for example, a COB (Chip On Board). In this case, inside the chip-shaped light emitting element, the wiring for electrically connecting the chip-shaped light emitting element and the wiring pattern 11b, the frame-shaped member surrounding the chip-shaped light emitting element and the wiring, and the inside of the frame-shaped member. A chip-shaped light emitting element, a sealing portion that covers the wiring, and the like can be provided on the surface 11a of the substrate 11. In addition, a fluorescent substance can be included in the sealing portion. The phosphor may be, for example, a YAG-based phosphor (yttrium-aluminum-garnet-based phosphor). The type of the fluorescent substance is not limited to the example. The type of the phosphor can be appropriately changed so as to obtain a desired emission color according to the use of the vehicle lighting device 1 and the like.

The light emitting surface of the light emitting element 12 can be substantially parallel to the surface 11a of the substrate 11. For example, the light emitting element 12 mainly irradiates light in a direction perpendicular to the surface 11a of the substrate 11.
The number, size, arrangement, etc. of the light emitting elements 12 are not limited to those illustrated, and can be appropriately changed according to the size, application, and the like of the vehicle lighting device 1. When a plurality of light emitting elements 12 are provided, the plurality of light emitting elements 12 can be connected in series.

The connection portion 20 includes, for example, a substrate 21, a circuit component 22, and an adapter 23.
The substrate 21 can be provided on the surface 11d of the substrate 11 provided in the light emitting unit 10. For example, the end surface 21c of the substrate 21 on the substrate 11 side can be adhered to the surface 11d of the substrate 11. The substrate 21 has a plate shape and extends in a direction substantially perpendicular to the surface 11d of the substrate 11, for example. When viewed from a direction parallel to the surface 11d of the substrate 11, the shape of the substrate 21 can be, for example, a substantially rectangular shape.

In order to facilitate replacement with a wedge-based bulb, the width dimension W of the substrate 21 can be 5.0 mm to 15.0 mm, for example, about 10.0 mm. However, the width dimension W of the substrate 21 is not limited to the one illustrated, and can be appropriately changed according to the dimension of the recess of the socket 101 into which the substrate 21 is inserted. The width dimension W is, for example, the dimension of the substrate 21 in the direction orthogonal to the direction in which the vehicle lighting device 1 is inserted into the socket 101.

The thickness T of the substrate 21 can be, for example, about 0.1 mm to 3.0 mm. In this case, if the thickness T of the substrate 21 is thin, the adjustment range by the adapter 23, which will be described later, can be increased. Further, if the thickness T of the substrate 21 is thin, the manufacturing cost of the substrate 21 can be reduced, and the manufacturing cost of the vehicle lighting device 1 can be reduced. However, if the thickness T of the substrate 21 is made too thin, the substrate 21 may be damaged, for example, when the vehicle lighting device 1 is inserted into the socket 101. According to the knowledge obtained by the present inventor, the thickness T of the substrate 21 is preferably about 0.1 mm to 2.0 mm. If the thickness T of the substrate 21 is within this range, the adjustment range by the adapter 23 can be expanded, the manufacturing cost can be reduced, and the substrate 21 can be suppressed from being damaged.

The material of the substrate 21 can be, for example, the same as the material of the substrate 11 described above. The heat generated in the light emitting element 12 is transferred to the substrate 21 via the substrate 11, and is discharged from the substrate 21 to the outside via the socket 101, for example. Therefore, in consideration of suppressing the temperature rise of the light emitting element 12, it is preferable to form the substrate 21 using a material having high thermal conductivity. Examples of the material having high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resin, and a metal core substrate. In this case, the material of the substrate 21 may be the same as or different from the material of the substrate 11.

A wiring pattern 21a1 can be provided on the surface 21a of the substrate 21 (corresponding to an example of the first surface). The wiring pattern 21a1 can be formed of a low resistance metal such as copper, aluminum, or silver.

The wiring pattern 21a1 has, for example, a mounting pad 21a1a, a terminal 21a1b, and a connection pad 21a1c.
The mounting pad 21a1a can be provided in the region between the surface 21a where the terminals 21a1b are provided and the end portion of the surface 21a on the substrate 11 side. The circuit component 22 is mounted on the mounting pad 21a1a.

A pair of terminals 21a1b can be provided in the vicinity of the end portion of the substrate 21 opposite to the light emitting portion 10 side. When the board 21 is mounted on the socket 101, each of the pair of terminals 21a1b is electrically connected to the socket terminals 101a and 101b provided on the socket 101 via the adapter 23. In this case, by electrically connecting one socket terminal 101a provided on the socket 101 to the one terminal 21a1b, the one socket terminal 101a is connected to the light emitting element 12 via the wiring pattern 21a1 and the wiring pattern 11b. It can be electrically connected to an electrode of one polarity. Further, the other socket terminal 101b can be electrically connected to the electrode of the other polarity of the light emitting element 12 via the wiring pattern 21a1 and the wiring pattern 11b.
That is, the substrate 21 is provided with a wiring pattern 21a1 having a pair of terminals 21a1b and electrically connected to the light emitting element 12.

Further, in the case of the vehicle lighting device 1 illustrated in FIG. 1, the terminals 21a1b are provided on the surface 21a of the substrate 21, but the terminals 21a1b are the surfaces 21a and 21b (second surface) of the substrate 21. It can be provided in at least one of (corresponding to one example). In this case, the terminals 21a1b provided on the surface 21b can be provided at positions facing the terminals 21a1b provided on the surface 21a. The terminals 21a1b provided on the surface 21b can be electrically connected to the terminals 21a1b provided on the surface 21a via conductive vias. If the terminals 21a1b are provided on the surface 21a and the surface 21b, the reliability of the electrical connection between the pair of terminals 21a1b and the socket terminals 101a and 101b provided on the socket 101 can be improved. ..

FIG. 2 is a schematic perspective view for illustrating the connection pad 21a1c.
As shown in FIGS. 1 and 2, a pair of connection pads 21a1c can be provided in the vicinity of the end portion of the substrate 21 on the light emitting portion 10 side. Further, a pair of connection pads 11c are provided on the surface 11d of the substrate 11. The pair of connection pads 11c are electrically connected to the wiring pattern 11b provided on the surface 11a of the substrate 11 via a conductive via or the like.

As shown in FIG. 2, the connection pad 21a1c and the connection pad 11c are electrically connected by a joint portion 24. The joint portion 24 is formed by, for example, soldering. That is, the wiring pattern 21a1 provided on the substrate 21 is electrically connected to the wiring pattern 11b provided on the substrate 11 via the joint portion 24.

The circuit component 22 may be, for example, a diode 22a, a resistor 22b, a capacitor 22c, or the like.
Since the wedge-based bulb is an incandescent bulb, one of the pair of leads may be electrically connected to the positive side of the power supply and the other lead may be electrically connected to the negative side of the power supply. That is, the wedge-based bulb is non-polar. On the other hand, the light emitting element 12 such as a light emitting diode has polarity. Therefore, a diode can be provided to prevent the reverse voltage from being applied to the light emitting element 12.

Further, in consideration of replacement with a wedge-based light bulb, it is preferable to provide a non-polar circuit in the vehicle lighting device 1. If the vehicle lighting device 1 is provided with a non-polar circuit, there is no directionality in mounting it on the socket 101, as in the wedge-based light bulb. Therefore, the installation work of the vehicle lighting device 1 becomes easy.

For example, if a bridge circuit (bridge diode) is configured by using four diodes, a non-polar circuit can be provided in the vehicle lighting device 1. The diode 22a illustrated in FIG. 1 is a so-called two-element diode. If the diode 22a is a two-element diode, the bridge circuit can be configured by using the two diodes 22a, so that the mounting area can be reduced. Therefore, it becomes easy to match the width dimension W of the substrate 21 with the width dimension of the portion where the lead of the wedge base bulb is provided.

The resistor 22b can be, for example, a surface mount type resistor, a resistor having a lead wire (metal oxide film resistor), a film-shaped resistor formed by using a screen printing method, or the like. The resistor 22b illustrated in FIG. 1 is a surface mount type resistor. If the surface mount type resistor is used, the mounting area can be reduced, so that it becomes easy to match the width dimension W of the substrate 21 with the width dimension of the portion where the lead of the wedge base bulb is provided.

Here, since the forward voltage characteristics of the light emitting element 12 vary, if the applied voltage between the anode terminal and the ground terminal is made constant, the brightness of the light emitted from the light emitting element 12 (luminous flux, brightness). , Luminous intensity, illuminance). Therefore, the value of the current flowing through the light emitting element 12 is set to be within the predetermined range by the resistor 22b so that the brightness of the light emitted from the light emitting element 12 is within a predetermined range. In this case, by changing the resistance value of the resistor 22b, the value of the current flowing through the light emitting element 12 can be kept within a predetermined range.

For example, when the resistor 22b is a surface mount type resistor or a resistor having a lead wire, the resistor 22b having an appropriate resistance value is selected according to the forward voltage characteristic of the light emitting element 12. For example, when the resistance 22b is a film-like resistor, the resistance value can be increased by removing a part of the resistance 22b.

Further, the resistor 22b can also have a role of preventing an excessive current from flowing through the light emitting element 12.
The number, size, arrangement, etc. of the resistors 22b are not limited to those illustrated, and can be appropriately changed according to the number, specifications, and the like of the light emitting elements 12.

The capacitor 22c can be provided, for example, for noise suppression and for smoothing the voltage. The capacitor 22c can be, for example, a surface mount type capacitor 22c. If the surface mount type capacitor 22c is used, the mounting area can be reduced, so that it becomes easy to match the width dimension W of the substrate 21 with the width dimension of the portion where the lead of the wedge base bulb is provided.

Although the case where the diode 22a, the resistor 22b, and the capacitor 22c are provided on the surface 21a is illustrated, for example, at least a part of these elements may be provided on the surface 21b facing the surface 21a. In this case, a wiring pattern can be provided on the surface 21b, and at least a part of these elements can be electrically connected to the wiring pattern. Further, a conductive via that penetrates the substrate 21 in the thickness direction is provided, and the wiring pattern 21a1 provided on the surface 21a and the wiring pattern provided on the surface 21b can be electrically connected by the conductive via.

Further, for example, at least a part of these elements may be provided on the surface 11d of the substrate 11 facing the surface 11a. In this case, a wiring pattern can be provided on the surface 11d, and at least a part of these elements can be electrically connected to the wiring pattern. Further, a conductive via that penetrates the substrate 11 in the thickness direction is provided, and the wiring pattern 11b provided on the surface 11a and the wiring pattern provided on the surface 11d can be electrically connected by the conductive via.

Further, the circuit component 22 is not limited to the example. For example, the circuit component 22 can be a passive element or an active element used to form a light emitting circuit having a light emitting element 12. For example, the circuit component 22 may be a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as an FET or a bipolar transistor, a Zener diode, an integrated circuit, an arithmetic element, or the like, in addition to those described above. .. The integrated circuit may include, for example, at least one of a blinking circuit, a constant current circuit, and a lighting circuit (drive circuit).

At least a part of the circuit component 22 can be provided in the housing 102 of the vehicle lighting device 100 on which the vehicle lighting device 1 is mounted. By doing so, the configuration of the vehicle lighting device 1 can be simplified, so that the cost of the vehicle lighting device 1 can be reduced. However, if the circuit component 22 is provided in the vehicle lighting device 1, even if the socket to which the wedge-based light bulb is mounted is used as it is, the vehicle lighting device 1 can be protected and multifunctional. ..

Here, when the vehicle lighting device 1 (board 21) is attached to the socket 101 of the vehicle lighting equipment 100, the portion provided with the terminal 21a1b of the board 21 is the socket terminal 101a, 101b provided in the socket 101. It is sandwiched between.
In this case, the dimensions (thickness of the portion provided with the terminals 21a1b) suitable for sandwiching the socket terminals 101a and 101b may differ depending on the model number and manufacturer of the socket 101. Further, depending on the production lot and the like, there may be a large variation in dimensions suitable for sandwiching the socket terminals 101a and 101b.

If the thickness of the portion provided with the terminals 21a1b is too thick for the dimensions suitable for sandwiching the socket terminals 101a and 101b, it becomes difficult to mount the vehicle lighting device 1. If the thickness of the portion where the terminals 21a1b are provided is too thin for the dimensions suitable for sandwiching the socket terminals 101a and 101b, the reliability of the electrical connection between the terminals 21a1b and the socket terminals 101a and 101b is lowered. Or, the vehicle lighting device 1 may fall off from the socket 101.

In this case, if the thickness of the substrate 21 is changed, the thickness of the terminals 21a1b is changed, or a metal film such as solder is formed on the surface of the terminals 21a1b, the thickness of the substrate 21 is changed according to the dimensions suitable for sandwiching the socket terminals 101a and 101b. This will lead to an increase in manufacturing costs and a decrease in productivity.

Therefore, the vehicle lighting device 1 according to the present embodiment is provided with the adapter 23. As shown in FIG. 1, the adapter 23 is provided in each of the pair of terminals 21a1b.
FIG. 3A is a schematic perspective view for illustrating the adapter 23.
FIG. 3B is a schematic cross-sectional view for illustrating the attachment of the adapter 23. Note that FIG. 3B shows a case where the terminals 21a1b are provided on the surface 21a of the substrate 21 and the surface 21b of the substrate 21.

As shown in FIGS. 3A and 3B, the adapter 23 has a first portion 23a extending along a surface 21a of the substrate 21 and a second portion 23b extending along a surface 21b facing the surface 21a. And can have a third portion 23c.

The second portion 23b faces the first portion 23a. The planar shape of the first portion 23a and the second portion 23b can be, for example, a substantially rectangular shape. The planar dimensions of the first portion 23a and the second portion 23b can be, for example, substantially the same as the terminals 21a1b or smaller than the terminals 21a1b.

One end of the first portion 23a and one end of the second portion 23b are connected via a third portion 23c. In this case, the first portion 23a, the second portion 23b, and the third portion 23c have a plate shape and can be integrally formed.

The adapter 23 has conductivity. The adapter 23 can be formed of, for example, a metal such as copper, a copper alloy, aluminum, an aluminum alloy, or stainless steel. For example, the adapter 23 can be formed by bending a strip-shaped metal plate.

The adapter 23 can be bonded to the terminals 21a1b by using, for example, a metal having a low melting point such as solder or a conductive adhesive.

As shown in FIGS. 1 and 3B, a portion of the substrate 21 provided with terminals 21a1b is inserted inside the adapter 23. In this case, it is preferable that the portion of the substrate 21 provided with the terminal 21a1b is sandwiched between the first portion 23a and the second portion 23b. For example, as shown in FIG. 3B, the distance between the first portion 23a and the second portion 23b is the same as or slightly smaller than the sum of the thickness T of the substrate 21 and the thickness T1 of the terminals 21a1b. can do.

By doing so, the adapter 23 can be brought into close contact with the portion of the substrate 21 where the terminals 21a1b are provided by the elastic force. Therefore, since the positional relationship between the adapter 23 and the portion of the substrate 21 where the terminals 21a1b are provided can be maintained, it becomes easy to join the adapter 23 and the terminals 21a1b by using solder or the like. Further, it is possible to suppress the formation of a gap between the adapter 23 and the terminals 21a1b.

As described above, the dimensions suitable for sandwiching the socket terminals 101a and 101b provided in the socket 101 may change, or the dimensions suitable for sandwiching the socket terminals 101a and 101b may vary greatly depending on the manufacturing rod or the like. In some cases.
Since the vehicle lighting device 1 according to the present embodiment is provided with the adapter 23, the socket terminal can be changed by changing at least one of the thickness of the first portion 23a and the thickness of the second portion 23b. It can be adapted to the dimensions suitable for sandwiching 101a and 101b. For example, by changing the thickness of the metal plate used as the material of the adapter 23, the thickness of the first portion 23a and the thickness of the second portion 23b can be easily changed.

As shown in FIG. 3A, since the adapter 23 has a simple structure, it is possible to suppress an increase in manufacturing cost even if a plurality of types of adapters 23 having different thicknesses are required. Further, since the adapter 23 can be easily manufactured by bending a metal plate or the like, it is possible to suppress a decrease in productivity.
Further, in general, the terminals 21a1b are metal films formed by using a screen printing method, a plating method, or the like. Therefore, since the thickness of the terminals 21a1b becomes thin, for example, if the vehicle lighting device 1 is repeatedly attached and detached, the terminals 21a1b may be peeled off or scratched, and the reliability of the electrical connection may be lowered. On the other hand, since the thickness of the adapter 23 is thicker than that of the metal film formed by using a screen printing method or the like, for example, even if the vehicle lighting device 1 is repeatedly attached and detached, the reliability of the electrical connection is reliable. Can be suppressed from decreasing.

According to the knowledge obtained by the present inventor, it is preferable to change the thickness of the first portion 23a and the second portion 23b in the range of, for example, 0.1 mm to 2.0 mm. By doing so, it becomes easy to adapt the socket terminals 101a and 101b to the dimensions suitable for sandwiching. Further, since the adapter 23 can be easily formed by bending or the like, the manufacturing cost can be reduced and the productivity can be improved.

Next, returning to FIG. 1, the positioning unit 30 and the cover 40 will be described.
As described above, the connecting portion 20 is joined to the surface 11d of the substrate 11 by using an adhesive or the like. When the connection portion 20 is joined to the substrate 11, if the position shift occurs, the light distribution characteristics may fluctuate. Further, if the positional deviation becomes too large, a defect may occur in the joint portion 24 described above. In this case, if the connection portion 20 is joined to the substrate 11 using a jig, it may be difficult to keep the positional deviation within a predetermined range depending on the accuracy of the jig. Further, if the worker corrects the positional deviation, the man-hours increase and the manufacturing cost may increase.

Therefore, the vehicle lighting device 1 is provided with a positioning unit 30. At least one positioning unit 30 can be provided. In this case, as shown in FIG. 1, it is preferable to provide a pair of positioning portions 30. If the pair of positioning portions 30 are provided, the positioning accuracy can be improved. Further, if the positioning unit 30 is provided, the area of the substrate 11 where the wiring pattern 11b and the light emitting element 12 are provided becomes narrow, but if the number of the positioning units 30 is two, the area where the wiring pattern 11b and the like are provided is extremely small. It does not become narrow.

The positioning portion 30 may have, for example, a convex portion 31 provided on the substrate 21 and a concave portion 32 provided on the substrate 11. By fitting the convex portion 31 provided on the substrate 21 into the concave portion 32 provided on the substrate 11, the connection portion 20 and the substrate 11 can be aligned with each other.

The arrangement of the convex portions 31 can be appropriately changed according to the sizes of the substrate 11 and the substrate 21 and the like. For example, as shown in FIG. 1, the convex portion 31 is an end portion of the substrate 21 on the substrate 11 side and can be provided in the vicinity of the side surface of the substrate 21.

When a plurality of convex portions 31 are provided, the cross-sectional shape and the cross-sectional dimension of the convex portions 31 may be the same or different. As described above, the light emitting element 12 has polarity. Further, the vehicle lighting device 1 may not be provided with a non-polar circuit. In such a case, it is preferable that at least one of the cross-sectional shape and the cross-sectional dimension of the convex portion 31 is different. If at least one of the cross-sectional shape and the cross-sectional dimension of the convex portion 31 is different, the bonding between the substrate 11 and the substrate 21 is directional, so that it is possible to suppress the reverse voltage from being applied to the light emitting element 12. can.

For example, the convex portion 31 can be integrally formed with the substrate 21. When the convex portion 31 is integrally formed with the substrate 21, the thickness and material of the convex portion 31 can be the same as the thickness T and material of the substrate 21. For example, the convex portion 31 can be formed by cutting out the vicinity of the end portion of the substrate 21 on the substrate 11 side.

Further, for example, the convex portion 31 can be an element (separate component) attached to the substrate 21. When the convex portion 31 is used as an element to be attached to the substrate 21, the convex portion 31 can be adhered to the end surface 21c of the substrate 21 on the substrate 11 side, or the convex portion 31 can be embedded. When the convex portion 31 is an element attached to the substrate 21, the material of the convex portion 31 is not particularly limited as long as it has a certain degree of rigidity. For example, the material of the convex portion 31 can be a metal such as stainless steel.
However, if the convex portion 31 is integrally formed with the substrate 21, the manufacturing cost can be reduced and the positioning accuracy can be improved.

The cross-sectional shape, number, and arrangement of the concave portions 32 can be adapted to the convex portions 31 fitted in the concave portions 32. For example, as shown in FIG. 1, a pair of recesses 32 can be provided at positions symmetrical with respect to the center point of the substrate 11. The recess 32 penetrates the substrate 11 in the thickness direction. For example, the recess 32 is open to the surface 11a of the substrate 11 and the surface 11d of the substrate 11. Further, the recess 32 can be further opened to the side surface 11e of the substrate 11. For example, as shown in FIG. 1, the recess 32 can also be opened in the surface 11a, the surface 11d, and the side surface 11e of the substrate 11.

If the positioning portion 30 is provided, the position accuracy of the substrate 11 with respect to the substrate 21 and, by extension, the joining accuracy can be improved. Therefore, it is possible to suppress fluctuations in the light distribution characteristics and the occurrence of defects in the joint portion 24.

The cover 40 can be provided on the light emitting side of the light emitting unit 10. For example, the cover 40 can be provided so as to cover the surface 11a of the substrate 11. The shape of the cover 40 can be appropriately changed according to the light distribution characteristics required for the vehicle lighting device 1.

For example, as shown in FIG. 1, the cover 40 can be formed of a convex curved surface such as a hemispherical surface. By doing so, it is possible to obtain the vehicle lighting device 1 having a wide light distribution characteristic.
For example, the cover 40 may be formed of a concave curved surface or a flat surface. For example, the cover 40 may have a shape such as a columnar shape, a conical shape, a conical trapezoidal shape, a prismatic shape, a pyramidal shape, or a pyramidal trapezoidal shape.

Further, the cover 40 may be transparent or may be colored. It is also possible to provide unevenness on the light emitting surface of the cover 40 to scatter the light. Light-scattering particles such as titanium oxide particles or a fluorescent substance can be applied to or included in the cover 40. A hole may be provided in the cover 40. If the cover 40 is provided with a hole, air can be convected through the hole. Therefore, the light emitting element 12 can be cooled. Further, since the intensity of the light emitted through the hole can be increased, the light distribution characteristic can be controlled. A film containing a material having a high light reflectance (for example, aluminum) may be provided on the inner wall or the outer wall of the cover 40, and the cover 40 may have the function of a reflector.

The cover 40 can be omitted. However, if the cover 40 is provided, it is possible to suppress the application of an external force to the light emitting element 12 or the like. Further, if the cover 40 has the function of an optical element such as a lens, the degree of freedom in optical design on the vehicle lighting fixture 100 side can be increased.

Further, a cover 41 that covers the circuit component 22 can be further provided. The cover 41 can cover the area of the substrate 21 where the circuit component 22 is provided. In this case, the region of the substrate 21 where the terminals 20a1b are provided can be exposed from the cover 41. The cover 41 is not always necessary, and may be provided as needed.

(Vehicle lighting device according to the second embodiment)
FIG. 4 is a schematic perspective view for exemplifying the vehicle lighting device 1a according to the second embodiment.
As shown in FIG. 4, the vehicle lighting device 1a is provided with, for example, a substrate 51, a light emitting element 12, a circuit component 22, an adapter 23, and a cover 40a.

The substrate 51 has a plate shape, and has, for example, a shape extending in a direction in which the vehicle lighting device 1a is inserted into the socket 101. The planar shape of the substrate 51 can be, for example, a substantially rectangular shape. The thickness T2 and the width dimension W1 of the substrate 51 can be, for example, the same as the thickness T and the width dimension W of the substrate 21 described above. The material of the substrate 51 can be, for example, the same as the material of the substrate 21 described above.

A wiring pattern 51a1 can be provided on the surface 51a of the substrate 51 (corresponding to an example of the first surface). The wiring pattern 51a1 can be formed of a low resistance metal such as copper, aluminum, or silver.

The wiring pattern 51a1 has, for example, a mounting pad 21a1a, terminals 21a1b, and a mounting pad 11b1.
The mounting pad 21a1a can be provided in a region of the surface 51a between the region where the terminal 21a1b is provided and the region where the mounting pad 11b1 is provided. The circuit component 22 is mounted on the mounting pad 21a1a.

A pair of terminals 21a1b can be provided near the end of the substrate 51 on the side opposite to the light emitting element 12 (mounting pad 11b1) side. When the board 51 is mounted on the socket 101, each of the pair of terminals 21a1b is electrically connected to the socket terminals 101a and 101b provided on the socket 101 via the adapter 23. In this case, by electrically connecting one socket terminal 101a provided on the socket 101 to the one terminal 21a1b, the one socket terminal 101a is connected to one of the polarities of the light emitting element 12 via the wiring pattern 51a1. It can be electrically connected to the electrode. Further, the other socket terminal 101b can be electrically connected to the electrode of the other polarity of the light emitting element 12 via the wiring pattern 51a1.

Further, in the case of the vehicle lighting device 1a illustrated in FIG. 4, a pair of terminals 21a1b are provided on the surface 51a of the substrate 51, but the terminals 21a1b face the surface 51a and the surface 51a of the substrate 51. It can be provided on at least one of the surfaces 51b (corresponding to an example of the second surface). In this case, the terminals 21a1b provided on the surface 51b can be provided at positions facing the terminals 21a1b provided on the surface 51a. The terminals 21a1b provided on the surface 51b can be electrically connected to the terminals 21a1b provided on the surface 51a via conductive vias. If the terminals 21a1b are provided on the surface 51a and the surface 51b, the reliability of the electrical connection between the pair of terminals 21a1b and the socket terminals 101a and 101b provided on the socket 101 can be improved. ..

The cover 40a can be provided on the light emitting side of the light emitting element 12. For example, the cover 40a can be attached to the surface 51a of the substrate 51. The shape of the cover 40a can be appropriately changed according to the light distribution characteristics required for the vehicle lighting device 1a and the like. The shape, material, and the like of the cover 40a can be the same as those of the cover 40 described above.
Further, similarly to the vehicle lighting device 1 described above, a cover 41a for covering the circuit component 22 may be further provided, if necessary. The cover 41a can be the same as the cover 41 described above.

Also in the vehicle lighting device 1a according to the present embodiment, since the adapter 23 is provided for each of the pair of terminals 21a1b, the effect of the adapter 23 described above can be enjoyed.

(Vehicle lamp 100)
FIG. 5 is a schematic diagram for illustrating the vehicle lamp 100 according to the present embodiment.
In the following, as an example, the case where one of the above-mentioned vehicle lighting devices 1 is provided will be illustrated, but at least one vehicle lighting device 1 may be provided. Further, at least one of the above-mentioned vehicle lighting devices 1a may be provided, or a vehicle lighting device 1 and a vehicle lighting device 1a may be provided.

As shown in FIG. 5, the vehicle lighting device 100 may be provided with a vehicle lighting device 1, a socket 101, a housing 102, and a cover 103.

The socket 101 can be provided in the housing 102. The vehicle lighting device 1 can be mounted on the socket 101. The socket 101 is formed of, for example, an insulating material such as resin.
Further, in FIG. 5, the case where the socket 101 and the housing 102 are provided separately is illustrated, but the socket 101 and the housing 102 may be integrally formed.

The socket 101 may be provided with a recess that opens at one end. A vehicle lighting device 1 (board 21) can be inserted inside the recess. Further, inside the recess, a socket terminal 101a corresponding to one voltage polarity (for example, plus) and a socket terminal 101b corresponding to the other voltage polarity (for example, minus) can be provided. As described above, if the vehicle lighting device 1 is provided with a non-polar circuit, the mounting direction of the vehicle lighting device 1 (board 21) is not limited.

The socket terminals 101a and 101b can be elastically deformed. When the substrate 21 is inserted into the recess, the socket terminals 101a and 101b are electrically connected to the terminals 21a1b via the adapter 23, respectively.
That is, the socket 101 has socket terminals 101a and 101b that can contact the adapter 23 provided in the vehicle lighting device 1.

A power source or the like provided outside the vehicle lamp 100 can be electrically connected to the socket terminals 101a and 101b. A circuit board may be provided on at least one of the inside and the outside of the housing 102 so that the socket terminals 101a and 101b and the power supply and the like are electrically connected via the circuit board.

The shape of the housing 102 can be, for example, a box shape in which one end side is open. The housing 102 can be formed of, for example, a resin that does not transmit light.
The cover 103 can be provided so as to close the opening of the housing 102. The cover 103 can be formed of a translucent resin or the like. The cover 103 may have a function such as a lens or may suppress glare. Further, the cover 103 can be provided in the housing 102 so as to be openable and closable, or can be provided in a detachable manner.

In addition, optical elements such as a reflector and a lens can be provided inside the housing 102.

Although some embodiments of the present invention have been exemplified above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, changes, and the like can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof. In addition, each of the above-described embodiments can be implemented in combination with each other.

1 vehicle lighting device, 1a vehicle lighting device, 10 light emitting part, 11 board, 11a surface, 11b wiring pattern, 11d surface, 12 light emitting element, 20 connection part, 20a surface, 20a1 wiring pattern, 21a1b terminal, 23 adapter, 23a 1st part, 23b 2nd part, 100 vehicle lighting equipment, 101 socket, 101a socket terminal, 101b socket terminal

Claims (4)

A vehicle lighting device having a light emitting element.
With the substrate having the pair of terminals and provided with a wiring pattern electrically connected to the light emitting element;
With an adapter provided in each of the pair of terminals, which has conductivity and in which a portion of the substrate provided with the terminals is inserted;
A lighting device for vehicles equipped with. The adapter
With a first portion of the substrate extending along a first surface;
With a second portion of the substrate extending along a second surface facing the first surface;
The vehicle lighting device according to claim 1. The vehicle lighting device according to claim 1 or 2, wherein the first portion and the second portion have a plate shape. With the vehicle lighting device according to any one of claims 1 to 3.
With a socket having a socket terminal that can contact the adapter provided in the vehicle lighting device;
A lamp for vehicles equipped with.

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