JP2022092217A - Vehicular lighting device and vehicular lamp fitting - Google Patents

Abstract

To provide a vehicular lighting device which enables improvement of connection accuracy and reduction of a connection space, and to provide a vehicular lamp fitting.SOLUTION: A vehicular lighting device according to an embodiment includes: a substrate; a light emitting element provided on a first surface of the substrate; a connection part provided on a second surface, which faces the first surface, of the substrate; and a coupling part having a first portion provided on the first surface of the substrate, a second portion intersecting with the first portion and provided on a third surface of the connection part, and a third portion facing the second portion and provided on a fourth surface which faces the third surface of the connection part.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lighting device.

Wedge-based bulbs without a base are used as vehicle lighting equipment. Wedge-based bulbs are incandescent bulbs. Therefore, from the viewpoint of power saving and long life, wedge-based light bulbs have come to be replaced with vehicle lighting devices equipped with light emitting diodes.

The wedge-based bulb is mounted by pushing it into a socket provided in a vehicle lamp. When a vehicle lighting device equipped with a light emitting diode is used instead of the wedge-based bulb, it is preferable that the socket in which the wedge-based bulb is mounted can be used as it is.

Therefore, a vehicle lighting device including a substrate on which a light emitting diode is mounted and a housing to which a pair of leads (terminals) are attached has been proposed. However, if the housing is provided, it becomes impossible to reduce the size and cost of the vehicle lighting device.

In this case, if the substrate on which the light emitting diode is mounted and the substrate provided with the pair of terminals are connected in a T shape, the size and cost of the vehicle lighting device can be reduced. However, if the two substrates are simply connected in a T shape, there is a possibility that the position shift will occur and the light distribution characteristics will fluctuate.

In this case, if the two substrates are connected in a T shape using a jig, the positional deviation can be suppressed. However, if this is done, the man-hours increase and the manufacturing cost may increase.
Further, the two substrates may be provided with a convex portion and a positioning portion such as a concave portion into which the convex portion is fitted. However, if the positioning portion is provided, the wiring pattern is not provided in the portion of the two boards where the positioning portion is provided. In addition, the mounting space for light emitting diodes and circuit components is reduced.
Therefore, it has been desired to develop a technique capable of improving the connection accuracy and reducing the connection space.

Japanese Unexamined Patent Publication No. 2013-105652

An object to be solved by the present invention is to provide a vehicle lighting device and a vehicle lighting device capable of improving the connection accuracy and reducing the connection space.

The vehicle lighting device according to the embodiment includes a substrate; a light emitting element provided on the first surface of the substrate; and a connection provided on the second surface of the substrate facing the first surface. A portion; a first portion provided on the first surface of the substrate, a second portion intersecting the first portion and provided on the third surface of the connection portion, and the first portion. It is provided with a connecting portion having a third portion facing the second portion and provided on the fourth surface facing the third surface of the connecting portion.

According to the embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lighting device that can improve the connection accuracy and reduce the connection space.

It is a schematic perspective view for exemplifying the vehicle lighting device which concerns on this embodiment. It is a schematic cross-sectional view for exemplifying a connecting part. (A) and (b) are schematic cross-sectional views for exemplifying the attachment of a connecting portion. It is a schematic diagram for exemplifying the lamp for a vehicle which concerns on this embodiment.

Hereinafter, embodiments will be illustrated with reference to the drawings. In each drawing, similar components are designated by the same reference numerals and detailed description thereof will be omitted as appropriate.
As the vehicle lighting device 1 according to the present embodiment, for example, those used for room lamps, meter lamps, reading lights, braking lights, direction indicator lights, tail lights, etc. provided in automobiles, railroad vehicles, and the like are exemplified. Can be done. However, the use of the vehicle lighting device 1 is not limited to these.

(Vehicle lighting equipment)
FIG. 1 is a schematic perspective view for exemplifying the vehicle lighting device 1 according to the present embodiment.
As shown in FIG. 1, the vehicle lighting device 1 may be provided with a light emitting unit 10, a connecting unit 20, a connecting unit 30, and a cover 40.

The light emitting unit 10 includes, for example, a substrate 11 and a light emitting element 12.
The substrate 11 can be a plate-shaped body. The planar shape of the substrate 11 can be, for example, a part of a circle including a center point. however. The planar shape of the substrate 11 is not limited to that illustrated. The planar shape of the substrate 11 may be, for example, a polygon. The planar shape of the substrate 11 can be appropriately changed depending on the number, arrangement, and the like of the light emitting elements 12.

The substrate 11 can be formed from an insulating material. The substrate 11 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride) or an organic material such as paper phenol or glass epoxy. Further, the substrate 11 may be, for example, a metal core substrate in which the surface of a metal plate is coated with an insulating material.

When the amount of heat generated by the light emitting element 12 is large, it is preferable to form the substrate 11 using a material having high thermal conductivity from the viewpoint of heat dissipation. Examples of the material having high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resin, and a metal core substrate. The high thermal conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler made of aluminum oxide, carbon (carbon) or the like.

The thickness of the substrate 11 is, for example, about 0.5 mm to 3.0 mm. However, the thickness of the substrate 11 is not limited to the one illustrated, and can be changed as appropriate.

A wiring pattern 11b (corresponding to an example of the first wiring pattern) is provided on the surface 11a (corresponding to an example of the first surface) of the substrate 11 opposite to the connection portion 20 side. The wiring pattern 11b has, for example, a mounting pad 11b1. The light emitting element 12 is electrically connected to the mounting pad 11b1. The wiring pattern 11b is formed of, for example, a low resistance metal such as copper, aluminum, or silver.

At least one light emitting element 12 can be provided on the surface 11a of the substrate 11.
The light emitting element 12 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.
The light emitting element 12 can be, for example, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type. Further, the light emitting element 12 may be, for example, a light emitting element having a lead wire such as a cannonball type. The light emitting element 12 illustrated in FIG. 1 is a surface mount type light emitting element.

Further, the light emitting element 12 may be a chip-shaped light emitting element. The chip-shaped light emitting element 12 can be mounted by, for example, a COB (Chip On Board). In this case, a chip-shaped light emitting element 12, a wiring for electrically connecting the light emitting element 12 and the wiring pattern 11b, a frame-shaped member surrounding the light emitting element 12 and the wiring, and a frame-shaped member provided inside the frame-shaped member to emit light. A sealing portion that covers the element 12 and the wiring can be provided on the surface 11a of the substrate 11. In addition, a fluorescent substance can be included in the sealing portion. The phosphor may be, for example, a YAG-based phosphor (yttrium-aluminum-garnet-based phosphor). The type of the fluorescent substance is not limited to the example. The type of the phosphor can be appropriately changed so as to obtain a desired emission color according to the use of the vehicle lighting device 1 and the like.

The light emitting surface of the light emitting element 12 can be substantially parallel to the surface 11a of the substrate 11. For example, the light emitting element 12 mainly irradiates light in a direction perpendicular to the surface 11a of the substrate 11.
The number, size, arrangement, etc. of the light emitting elements 12 are not limited to those illustrated, and can be appropriately changed according to the size, application, and the like of the vehicle lighting device 1. When a plurality of light emitting elements 12 are provided, the plurality of light emitting elements 12 can be connected in series.

The connecting portion 20 can be provided on the surface 11d (corresponding to an example of the second surface) of the substrate 11 facing the surface 11a. The connecting portion 20 has a plate shape and extends in a direction substantially perpendicular to the surface 11d, for example. When viewed from a direction parallel to the surface 11d, the shape of the connecting portion 20 is, for example, a rectangle. For example, the connecting portion 20 can be joined to the surface 11d of the substrate 11 by using an adhesive or the like.

In order to facilitate replacement with a wedge-based bulb, the width dimension W of the connecting portion 20 can be 5.0 mm to 15.0 mm, for example, about 10.0 mm. The width dimension W is, for example, the dimension of the connecting portion 20 in the direction orthogonal to the direction in which the vehicle lighting device 1 is inserted into the socket 101.

The thickness T of the connecting portion 20 can be 0.5 mm to 3.0 mm, for example, about 2.0 mm. However, the width dimension W and the thickness T of the connecting portion 20 are not limited to those illustrated, and can be appropriately changed according to the dimensions of the recess of the socket 101 into which the connecting portion 20 is inserted.

The material of the connecting portion 20 can be, for example, the same as the material of the substrate 11 described above. The heat generated in the light emitting element 12 is transferred to the connection portion 20 via the substrate 11, and is discharged from the connection portion 20 to the outside via the socket 101, for example. Therefore, in consideration of suppressing the temperature rise of the light emitting element 12, it is preferable to form the connecting portion 20 using a material having a high thermal conductivity. Examples of the material having high thermal conductivity include ceramics such as aluminum oxide and aluminum nitride, high thermal conductivity resin, and a metal core substrate. In this case, the material of the connecting portion 20 may be the same as or different from the material of the substrate 11.

A wiring pattern 20a1 (corresponding to an example of the second wiring pattern) can be provided on the surface 20a (corresponding to an example of the third surface) of the connecting portion 20. The wiring pattern 20a1 can be formed of a low resistance metal such as copper, aluminum, or silver. The wiring pattern 20a1 has, for example, a mounting pad 20a1a, a terminal 20a1b, and a connection pad 20a1c.

The mounting pad 20a1a can be provided in the area of the surface 20a between the area where the terminals 20a1b are provided and the area where the connection pad 20a1c is provided. Circuit components are mounted on the mounting pads 20a1a. For example, as illustrated in FIG. 1, the circuit component may be a diode 21, a resistor 22, a capacitor 23, or the like.

Since the wedge-based bulb is an incandescent bulb, one of the pair of leads may be electrically connected to the positive side of the power supply and the other lead may be electrically connected to the negative side of the power supply. That is, the wedge-based bulb is non-polar. On the other hand, the light emitting element 12 such as a light emitting diode has polarity. Therefore, a diode can be provided to prevent the reverse voltage from being applied to the light emitting element 12.

Further, in consideration of replacement with a wedge-based light bulb, it is preferable to provide a non-polar circuit in the vehicle lighting device 1. If the vehicle lighting device 1 is provided with a non-polar circuit, there is no directionality in mounting it on the socket 101, as in the wedge-based light bulb. Therefore, the installation work of the vehicle lighting device 1 becomes easy.

For example, if a bridge circuit (bridge diode) is configured by using four diodes, a non-polar circuit can be provided in the vehicle lighting device 1. The diode 21 illustrated in FIG. 1 is a so-called two-element diode. If the diode 21 is a two-element diode, the bridge circuit can be configured by using the two diodes 21, so that the mounting area can be reduced. Therefore, it becomes easy to match the width dimension W of the connection portion 20 with the width dimension of the portion where the lead of the wedge base bulb is provided.

The resistor 22 may be, for example, a surface mount type resistor, a resistor having a lead wire (metal oxide film resistor), a film-shaped resistor formed by using a screen printing method, or the like. The resistor 22 illustrated in FIG. 1 is a surface mount type resistor. If the surface mount type resistor is used, the mounting area can be reduced, so that the width dimension W of the connection portion 20 can be easily matched with the width dimension of the portion where the lead of the wedge base bulb is provided.

Here, since the forward voltage characteristics of the light emitting element 12 vary, if the applied voltage between the anode terminal and the ground terminal is made constant, the brightness of the light emitted from the light emitting element 12 (luminous flux, brightness). , Luminous intensity, illuminance). Therefore, the value of the current flowing through the light emitting element 12 is set to be within a predetermined range by the resistor 22 so that the brightness of the light emitted from the light emitting element 12 is within a predetermined range. In this case, by changing the resistance value of the resistor 22, the value of the current flowing through the light emitting element 12 can be kept within a predetermined range.

For example, when the resistor 22 is a surface-mounted resistor or a resistor having a lead wire, the resistor 22 having an appropriate resistance value is selected according to the forward voltage characteristic of the light emitting element 12. For example, when the resistance 22 is a film-like resistor, the resistance value can be increased by removing a part of the resistance 22.

Further, the resistor 22 can also have a role of preventing an excessive current from flowing through the light emitting element 12.
The number, size, arrangement, etc. of the resistors 22 are not limited to those illustrated, and can be appropriately changed according to the number, specifications, and the like of the light emitting elements 12.

The capacitor 23 can be provided, for example, for noise suppression and for smoothing the voltage. The capacitor 23 may be, for example, a surface mount type capacitor 23. If the surface mount type capacitor 23 is used, the mounting area can be reduced, so that it is easy to match the width dimension W of the connection portion 20 with the width dimension of the portion where the lead of the wedge base bulb is provided.

Although the case where the diode 21, the resistor 22, and the capacitor 23 are provided on the surface 20a is illustrated, for example, at least a part of these elements is provided on the surface 20b facing the surface 20a (corresponding to an example of the fourth surface). It can also be provided in). In this case, a wiring pattern can be provided on the surface 20b, and at least a part of these elements can be electrically connected to the wiring pattern. Further, a conduction via that penetrates the connection portion 20 in the thickness direction is provided, and the wiring pattern 20a1 provided on the surface 20a and the wiring pattern provided on the surface 20b can be electrically connected by the conduction via.

Further, for example, at least a part of these elements may be provided on the surface 11d of the substrate 11 facing the surface 11a. In this case, a wiring pattern can be provided on the surface 11d, and at least a part of these elements can be electrically connected to the wiring pattern. Further, a conductive via that penetrates the substrate 11 in the thickness direction is provided, and the wiring pattern 11b provided on the surface 11a and the wiring pattern provided on the surface 11d can be electrically connected by the conductive via.

Further, the circuit components are not limited to those illustrated. For example, the circuit component can be a passive element or an active element used to form a light emitting circuit having the light emitting element 12. For example, the circuit component may be a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as an FET or a bipolar transistor, a Zener diode, an integrated circuit, an arithmetic element, or the like, in addition to those described above. The integrated circuit may include, for example, at least one of a blinking circuit, a constant current circuit, and a lighting circuit (drive circuit).

At least a part of the circuit parts can be provided in the housing 102 of the vehicle lighting device 100 on which the vehicle lighting device 1 is mounted. By doing so, the configuration of the vehicle lighting device 1 can be simplified, so that the cost of the vehicle lighting device 1 can be reduced. However, if the circuit component is provided in the vehicle lighting device 1, even if the socket to which the wedge-based light bulb is mounted is used as it is, the vehicle lighting device 1 can be protected and multifunctional.

The pair of terminals 20a1b can be provided in the vicinity of the end portion of the connection portion 20 opposite to the substrate 11 side. When the connection portion 20 is attached to the socket 101, each of the pair of terminals 20a1b comes into contact with the socket terminals 101a and 101b provided in the socket 101. In this case, by bringing one socket terminal 101a provided on the socket 101 into contact with the one terminal 20a1b, the one socket terminal 101a is made to have one polarity of the light emitting element 12 via the wiring pattern 20a1 and the wiring pattern 11b. Can be electrically connected to the electrodes of. Further, the other socket terminal 101b can be electrically connected to the electrode of the other polarity of the light emitting element 12 via the wiring pattern 20a1 and the wiring pattern 11b.

Further, in the case of the vehicle lighting device 1 illustrated in FIG. 1, a pair of terminals 20a1b are provided on the surface 20a of the connection portion 20, but the terminals 20a1b are formed on the surface 20a and the surface 20b of the connection portion 20. It can be provided in at least one of them. In this case, the terminals 20a1b provided on the surface 20b can be provided at positions facing the terminals 20a1b provided on the surface 20a. The terminals 20a1b provided on the surface 20b can be electrically connected to the terminals 20a1b provided on the surface 20a via conductive vias. If the terminals 20a1b are provided on the surface 20a and the surface 20b, the reliability of contact between the pair of terminals 20a1b and the socket terminals 101a and 101b provided on the socket 101 can be improved.

The pair of connection pads 20a1c can be provided in the vicinity of the end portion of the connection portion 20 on the substrate 11 side. The pair of connection pads 20a1c are electrically connected to the wiring pattern 11b provided on the substrate 11.
For example, the pair of connection pads 20a1c and the wiring pattern 11b provided on the substrate 11 can be soldered.
Further, as shown in FIG. 1, the pair of connection pads 20a1c and the wiring pattern 11b provided on the substrate 11 can be electrically connected via the connecting portion 30.

In the case of the vehicle lighting device 1 illustrated in FIG. 1, a pair of connection pads 20a1c are provided on the surface 20a of the connection portion 20, but the connection pads 20a1c are provided on the surfaces 20a and 20b of the connection portion 20. It can be provided in at least one of them. In this case, the connection pad 20a1c provided on the surface 20b can be provided at a position facing the connection pad 20a1c provided on the surface 20a. The connection pad 20a1c provided on the surface 20b can be electrically connected to the connection pad 20a1c provided on the surface 20a via a conductive via. If the connection pads 20a1c are provided on the surface 20a and the surface 20b, the reliability of the electrical connection between the pair of connection pads 20a1c and the wiring pattern 11b provided on the substrate 11 can be improved.

Here, as described above, the connecting portion 20 is connected to the surface 11d of the substrate 11 by using an adhesive or the like. When the connection portion 20 is connected to the substrate 11, if the position shift occurs, the light distribution characteristics may fluctuate. In this case, if the connecting portion 20 is connected to the substrate 11 by using a jig, the occurrence of misalignment can be suppressed. However, if this is done, the man-hours increase and the manufacturing cost may increase.
Further, for example, if the substrate 11 is provided with a concave portion or a notch and the end portion of the connection portion 20 is provided with a convex portion fitted to the concave portion or the notch of the substrate 11, the occurrence of misalignment can be suppressed. However, in this way, the space for providing the wiring pattern 11b on the substrate 11 becomes small, and the mounting space for the light emitting element 12 and the circuit components becomes small.

Therefore, the vehicle lighting device 1 according to the present embodiment is provided with a connecting portion 30.
At least one connecting portion 30 can be provided. In this case, it is preferable to provide the two connecting portions 30 as shown in FIG. 1 in consideration of suppressing the positional deviation between the substrate 11 and the connecting portion 20 and securing a space for providing the wiring pattern 11b and the like. The shapes and sizes of the two connecting portions 30 may be the same or different.

FIG. 2 is a schematic cross-sectional view for illustrating the connecting portion 30.
FIG. 2 is a sectional view taken along line AA of the vehicle lighting device 1 in FIG.
As shown in FIG. 2, the surface 11d of the substrate 11 and the end surface of the connecting portion 20 are bonded via the bonding layer 24. The bonding layer 24 can be, for example, a layer formed by curing the adhesive.

As shown in FIGS. 1 and 2, the connecting portion 30 intersects the first portion 30a, the second portion 30b that intersects the first portion 30a, and the first portion 30a, and the second portion 30a. It has a third portion 30c, which faces the portion 30b. The first portion 30a, the second portion 30b, and the third portion 30c have a plate shape and can be integrally formed. The connecting portion 30 can be formed, for example, by bending a plate material.

The connecting portion 30 has, for example, elasticity and conductivity. The connecting portion 30 can include, for example, a metal. The connecting portion 30 can be formed of, for example, a plate material such as stainless steel, spring steel, or phosphor bronze.
The thickness of the connecting portion 30 can be, for example, about 0.1 mm to 2.0 mm.

The first portion 30a is provided, for example, on the surface 11a of the substrate 11. For example, the conductive first portion 30a can be electrically connected to the wiring pattern 11b.
The second portion 30b extends toward the connecting portion 20 side through, for example, a hole 11e provided in the substrate 11, and is in contact with the connecting portion 20. The hole 11e penetrates between the surface 11a and the surface 11d of the substrate 11. For example, the second portion 30b intersects the first portion 30a and is provided on the surface 20a of the connecting portion 20. For example, the conductive second portion 30b can be electrically connected to the wiring pattern 20a1.
The third portion 30c extends toward the connecting portion 20 side through, for example, a hole 11f provided in the substrate 11, and is in contact with the connecting portion 20. The hole 11f penetrates between the surface 11a and the surface 11d of the substrate 11. For example, the third portion 30c is provided on the surface 20b facing the second portion 30b and facing the surface 20a of the connecting portion 20. For example, the conductive third portion 30c can be electrically connected to the wiring pattern provided on the surface 20b.

3 (a) and 3 (b) are schematic cross-sectional views for exemplifying the attachment of the connecting portion 30.
As shown in FIG. 3A, the distance between the outer surface of the second portion 30b and the outer surface of the third portion 30c of the connecting portion 30 is L1 (mm). The distance between the inner wall (outer inner wall) of the hole 11e of the substrate 11 on the side far from the connection portion 20 and the inner wall (outer inner wall) of the hole 11f on the side farther from the connection portion 20 is L2 (mm). do. Further, the distance L1 is set to be slightly larger than the distance L2.

When the second portion 30b of the connecting portion 30 is inserted into the hole 11e of the substrate 11, the second portion 30b is pushed toward the surface 20a of the connecting portion 20 by the inner wall of the hole 11e. Therefore, the second portion 30b of the connecting portion 30 presses the surface 20a of the connecting portion 20 toward the surface 20b by the elastic force.
When the third portion 30c is inserted into the hole 11f of the substrate 11, the third portion 30c is pushed toward the surface 20b of the connection portion 20 by the inner wall of the hole 11f. Therefore, the third portion 30c of the connecting portion 30 presses the surface 20b of the connecting portion toward the surface 20a by the elastic force.
By doing so, the second portion 30b and the third portion 30c of the connecting portion 30 can be brought into close contact with the connecting portion 20.

As described above, the connecting portion 30 is held by the substrate 11 by the holes 11e and 11f. Further, the connecting portion 30 holds the connecting portion 20 by the second portion 30b and the third portion 30c. For example, by providing the second portion 30b in the hole 11e of the substrate 11 and the third portion 30c in the hole 11f of the substrate 11, the position of the connecting portion 30 with respect to the substrate 11 and thus the connecting portion 20 with respect to the substrate 11 You can decide the position. Further, for example, the connecting portion 30 can hold the connecting portion 20 by the elastic force of the second portion 30b and the third portion 30c.

Therefore, if the connecting portion 30 is provided, it is possible to prevent the positions of the connecting portion 20 and the substrate 11 from being displaced when the connecting portion 20 is joined to the substrate 11. Further, when the connecting portion 20 is joined to the substrate 11, it is only necessary to insert the connecting portion 30 into the holes 11e and 11f, so that the number of man-hours can be reduced and the manufacturing cost can be reduced as compared with the case of using a jig. be able to.

Further, if the connecting portion 30 has conductivity, the wiring pattern 11b provided on the substrate 11 and the wiring pattern 20a1 provided on the connecting portion 20 are electrically connected via the connecting portion 30. You can connect. For example, as shown in FIG. 2, the first portion 30a can be brought into contact with the wiring pattern 11b provided on the substrate 11. The second portion 30b can be brought into contact with the wiring pattern 20a1 (connection pad 20a1c) provided in the connection portion 20.

When the wiring pattern is provided on the surface 20b of the connection portion 20, the third portion 30c can be brought into contact with the wiring pattern provided on the surface 20b.
Therefore, if the connecting portion 30 is provided, the space for providing the wiring pattern 11b, the light emitting element 12, the circuit component, and the like can be increased as compared with the case where the substrate 11 is provided with a recess or a notch to form the positioning portion. can.

Further, the first portion 30a and the wiring pattern 11b provided on the substrate 11 can be joined by using solder, a conductive adhesive, or the like. It is also possible to join the second portion 30b and the wiring pattern 20a1 (connection pad 20a1c) provided on the surface 20a of the connection portion 20 by using solder, a conductive adhesive, or the like. It is also possible to join the wiring pattern provided on the surface 20b of the connecting portion 20 to the third portion 30c by using solder, a conductive adhesive, or the like. By doing so, the bonding between the substrate 11 and the connecting portion 20 via the connecting portion 30 can be made stronger.

Next, returning to FIG. 1, the cover 40 will be described.
As shown in FIG. 1, the cover 40 can be provided on the light emitting side of the light emitting unit 10. For example, the cover 40 can be provided so as to cover the surface 11a of the substrate 11. The shape of the cover 40 can be appropriately changed according to the light distribution characteristics required for the vehicle lighting device 1.

For example, as shown in FIG. 1, the cover 40 can be formed of a convex curved surface such as a hemispherical surface. By doing so, it is possible to obtain the vehicle lighting device 1 having a wide light distribution characteristic.
For example, the cover 40 may be formed of a concave curved surface or a flat surface. For example, the cover 40 may have a shape such as a columnar shape, a conical shape, a frustum shape, a prismatic shape, a pyramidal shape, or a pyramidal trapezoidal shape.

Further, the cover 40 may be transparent or may be colored. It is also possible to provide unevenness on the light emitting surface of the cover 40 to scatter the light. Light-scattering particles such as titanium oxide particles or a fluorescent substance can be applied to or included in the cover 40. A hole may be provided in the cover 40. If the cover 40 is provided with a hole, air can be convected through the hole. Therefore, the light emitting element 12 can be cooled. Further, since the intensity of the light emitted through the hole can be increased, the light distribution characteristic can be controlled. It is also possible to provide a film containing a material having high light reflectance (for example, aluminum) on the inner wall and the outer wall of the cover 40 so that the cover 40 has the function of a reflector.

The cover 40 can be omitted. However, if the cover 40 is provided, it is possible to suppress the application of an external force to the light emitting element 12 or the like. Further, if the cover 40 has the function of an optical element such as a lens, the degree of freedom in optical design on the vehicle lighting fixture 100 side can be increased.

Further, a cover 41 for covering circuit components such as a diode 21, a resistor 22, and a capacitor 23 can be further provided. The cover 41 can cover the area of the connection portion 20 where the circuit components are provided. In this case, the area of the connection portion 20 where the terminals 20a1b are provided can be exposed from the cover 41. The cover 41 is not always necessary, and may be provided as needed.

(Vehicle lamp 100)
FIG. 4 is a schematic diagram for illustrating the vehicle lamp 100 according to the present embodiment.
In the following, as an example, the case where one of the above-mentioned vehicle lighting devices 1 is provided will be illustrated, but at least one vehicle lighting device 1 may be provided.
As shown in FIG. 4, the vehicle lighting device 100 may be provided with a vehicle lighting device 1, a socket 101, a housing 102, and a cover 103.

The socket 101 can be provided in the housing 102. The vehicle lighting device 1 can be mounted on the socket 101. The socket 101 is formed of, for example, an insulating material such as resin.
Further, in FIG. 4, the case where the socket 101 and the housing 102 are provided separately is illustrated, but the socket 101 and the housing 102 may be integrally formed.

The socket 101 may be provided with a recess that opens at one end. A vehicle lighting device 1 (connection portion 20) can be inserted inside the recess. Further, inside the recess, a socket terminal 101a corresponding to one voltage polarity (for example, plus) and a socket terminal 101b corresponding to the other voltage polarity (for example, minus) can be provided. As described above, if the vehicle lighting device 1 is provided with a non-polar circuit, the mounting direction of the vehicle lighting device 1 (connection portion 20) is not limited.

The socket terminals 101a and 101b can be elastically deformed. When the connection portion 20 is inserted into the recess, the socket terminals 101a and 101b come into contact with the terminals 20a1b of the connection portion 20, respectively. A power source or the like provided outside the vehicle lamp 100 can be electrically connected to the socket terminals 101a and 101b. A circuit board may be provided on at least one of the inside and the outside of the housing 102 so that the socket terminals 101a and 101b and the power supply and the like are electrically connected via the circuit board.

The shape of the housing 102 can be, for example, a box shape in which one end side is open. The housing 102 can be formed of, for example, a resin that does not transmit light.
The cover 103 can be provided so as to close the opening of the housing 102. The cover 103 can be formed of a translucent resin or the like. The cover 103 may have a function such as a lens or may suppress glare. Further, the cover 103 can be provided in the housing 102 so as to be openable and closable, or can be provided in a detachable manner.

In addition, optical elements such as a reflector and a lens can be provided inside the housing 102.

Although some embodiments of the present invention have been exemplified above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, changes, and the like can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof. In addition, each of the above-described embodiments can be implemented in combination with each other.

1 Vehicle lighting device, 10 light emitting part, 11 board, 11a surface, 11b wiring pattern, 11e hole, 11f hole, 12 light emitting element, 20 connection part, 20a surface, 20a1 wiring pattern, 20a1c connection pad, 20b surface, 30 connections Part, 30a 1st part, 30b 2nd part, 30c 3rd part, 100 vehicle lighting, 101 socket

Claims (4)

With the board;
With a light emitting element provided on the first surface of the substrate;
With the connection portion provided on the second surface of the substrate facing the first surface;
A first portion provided on the first surface of the substrate, a second portion intersecting the first portion and provided on the third surface of the connection portion, and the second portion. A connecting portion comprising a third portion provided on a fourth surface of the connecting portion facing the third surface of the connecting portion;
A lighting device for vehicles equipped with. With the first wiring pattern provided on the first surface of the substrate and to which the light emitting element is electrically connected;
With the second wiring pattern provided on the third surface of the connection portion;
Further equipped,
The first portion of the connecting portion is conductive and is electrically connected to the first wiring pattern.
The vehicle lighting device according to claim 1, wherein the second portion of the connecting portion has conductivity and is electrically connected to the first portion and the second wiring pattern. The second portion of the connecting portion presses the third surface of the connecting portion toward the fourth surface side by an elastic force.
The vehicle lighting device according to claim 1 or 2, wherein the third portion of the connecting portion presses the fourth surface of the connecting portion toward the third surface side by an elastic force. With the vehicle lighting device according to any one of claims 1 to 3.
With a socket into which a connection provided in the vehicle lighting device is inserted;
A lamp for vehicles equipped with.

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