JP2022082057A - Contact release method in inspection device and inspection device - Google Patents

Abstract

To perform proper alignment on a substrate and a probe in another inspection space when the set temperature of a substrate support provided in one inspection space is changed in an inspection device provided with multiple inspection spaces for substrate inspection.SOLUTION: A control portion of an inspection device includes a correction portion in which a fixed portion (Pogo frame 80) is provided with a plurality of position correction marks (position correction pins 85), and which corrects the contact position that is the position of a substrate support in the moving plane by an aligner 50 when a substrate W supported by the substrate support (chuck top 70) is brought into contact with a probe. When the set temperature of the substrate support is changed in one inspection space, the correction portion corrects the contact position in another inspection space on the basis of a result obtained by capturing the position correction marks by an imaging unit (lower camera 54) after changing the set temperature in the other inspection space K, and a reference value for position correction.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to a contact release method and an inspection device in an inspection device.

Patent Document 1 discloses a wafer inspection apparatus having a three-layer structure of a row of testers composed of a plurality of horizontally arranged testers, and further including a transfer stage for transporting wafers. In Patent Document 1, in the above-mentioned inspection device, a stretchable bellows is arranged so as to surround the probe card of the tester, and a wafer is placed on a chuck top which is a thick plate member. Further, the chuck top is supported by the transfer stage, the transfer stage is opposed to the probe card together with the wafer and the chuck top, and then the transfer stage is moved toward the probe card to bring the chuck top into contact with the bellows. Then, even after the chuck top comes into contact with the bellows, the transfer stage is moved toward the probe card together with the wafer and the chuck top to bring the wafer into contact with the probe card.

Japanese Unexamined Patent Publication No. 2014-75420

The technique according to the present disclosure is that in an inspection device provided with a plurality of inspection spaces for inspecting a substrate, when the set temperature of a substrate support portion provided in one inspection space is changed, another inspection space is provided. Properly align the substrate and probe in.

In one aspect of the present disclosure, a plurality of inspection spaces for inspecting a substrate are provided, and a substrate support portion for supporting the substrate and a probe card having an inspection probe are fixed in each of the inspection spaces. The substrate is movable along a moving plane facing the probe card, which is arranged on the fixed portion and the base wall and is fixed to the fixed portion, and the substrate is movable in a height direction orthogonal to the moving plane. A moving mechanism configured to move the support portion and an imaging unit that moves together with the substrate support portion by the moving mechanism are provided, and a plurality of position correction marks are provided on the fixed portion, and the substrate is provided. It has a correction unit that corrects the contact position, which is the position of the substrate support portion in the moving plane when the substrate supported by the support portion and the probe are brought into contact with each other, and the correction unit is one of the above. When the set temperature of the substrate support portion is changed in the inspection space, the result of imaging each of the position correction marks by the image pickup unit after the change of the set temperature in the other inspection space, and the reference for position correction. Based on the value, the contact position in the other inspection space is corrected.

According to the present disclosure, in an inspection device provided with a plurality of inspection spaces for inspecting a substrate, when the set temperature of a substrate support portion provided in one inspection space is changed, in another inspection space. The position of the substrate and the probe can be properly aligned.

It is a top cross-sectional view which shows the outline of the structure of the inspection apparatus which concerns on this embodiment. It is a front vertical sectional view which shows the outline of the structure of the inspection apparatus which concerns on this embodiment. It is a side sectional view of the inspection area. It is a partially enlarged view of the front cross section of the inspection area. It is a side sectional view which shows the state when the set temperature of the chuck top of the inspection space is changed. It is a functional block unit of the control unit related to the correction processing of the contact position in the inspection device. It is a figure for demonstrating the specific example 1 of the contact position correction method. It is a figure for demonstrating the specific example 1 of the contact position correction method. It is a figure for demonstrating the specific example 2 of the contact position correction method. It is a figure for demonstrating the specific example 2 of the said contact position correction method. It is a figure for demonstrating the specific example 3 of the said contact position correction method.

In the semiconductor manufacturing process, a large number of semiconductor devices having a predetermined circuit pattern are formed on a semiconductor wafer (hereinafter referred to as “wafer”). The formed semiconductor device is inspected for electrical characteristics and the like, and is classified into a non-defective product and a defective product. The inspection of a semiconductor device is performed by using an inspection device, for example, in the state of a wafer before being divided into each semiconductor device.

The inspection device is provided with a probe card having a large number of probes which are a large number of needle-shaped contact terminals. When inspecting the electrical characteristics, the wafer and the probe card are first brought close to each other, and the probe of the probe card comes into contact with each electrode of the semiconductor device formed on the wafer. In this state, an electric signal is supplied to the semiconductor device from the tester provided above the probe card via each probe. Then, based on the electrical signal received by the tester from the semiconductor device via each probe, it is determined whether or not the semiconductor device is a defective product.

In order to efficiently perform such an electrical characteristic inspection on a large number of wafers, an inspection device in which inspection spaces for inspecting the wafers are stacked in a plurality of stages is used (see Patent Document 1).

In such an inspection device, the probe card, the wafer support portion that supports the wafer, and the wafer support portion can be moved along the moving plane and moved in the height direction orthogonal to the moving plane for each inspection space. A mechanism is provided. Then, in this inspection device, the lower camera images the predetermined position of the probe card, the upper camera images the predetermined position of the wafer, and from these imaging results, the electrodes formed on the wafer and the probe of the probe card are imaged. The wafer (specifically, the wafer support portion that supports the wafer) is aligned in the moving plane so that the wafer and the wafer are in accurate contact with each other.

Further, in recent years, in order to enable inspection of electrical characteristics of electronic devices under various temperature conditions, a temperature adjusting means may be provided on a wafer support portion.

By the way, as a result of diligent investigation by the present inventors, in the inspection apparatus in which the inspection spaces are stacked in a plurality of stages as described above, when the temperature adjusting means is provided on the wafer support portion, the electrodes and probes on the wafer are as follows. It turned out that it may not be possible to properly contact with. That is, in an inspection device in which multiple inspection spaces are stacked, if the set temperature of the wafer support portion of one inspection space is changed, the wafer can be used in another inspection space using the upper camera and the lower camera as described above. It has been found that even with alignment, the electrodes on the wafer and the probe may not be in proper contact.

Therefore, the technique according to the present disclosure is another technique in an inspection apparatus provided with a plurality of inspection spaces for inspecting wafers, when the set temperature of the wafer holding portion provided in one inspection space is changed. Properly align the substrate and probe in the inspection space.

Hereinafter, the inspection device according to the present embodiment and the position correction method of the substrate support portion in the inspection device will be described with reference to the drawings. In the present specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals, so that duplicate description will be omitted.

1 and 2 are a top sectional view and a front vertical sectional view showing an outline of the configuration of the inspection device according to the present embodiment, respectively. Note that FIG. 2 shows only a part of the aligners described later.

The inspection device 1 of FIGS. 1 and 2 inspects the wafer W as a substrate, and specifically, inspects the electrical characteristics of a semiconductor device as an inspection target device formed on the wafer W. be. The inspection device 1 has a housing 10, and the housing 10 is provided with an loading / unloading area 11, a transport area 12, and an inspection area 13. The carry-in / out area 11 is an area where the wafer W is carried in / out to the inspection device 1. The transport area 12 is an area connecting the carry-in / out area 11 and the inspection area 13. Further, the inspection area 13 is an area where the electrical characteristics of the semiconductor device formed on the wafer W are inspected.

The carry-in / out area 11 is provided with a port 20 for receiving a cassette C containing a plurality of wafers W, a loader 21 for accommodating a probe card described later, and a control unit 22 for controlling each component of the inspection device 1. There is. The control unit 22 has a storage unit (not shown) for storing various types of information. In the storage unit, for example, a program that realizes an inspection process or the like is stored. The program may be recorded on a non-temporary storage medium that can be read by a computer, and may be installed on the control unit 22 from the storage medium. Part or all of the program may be realized by dedicated hardware (circuit board). Further, the storage unit is, for example, a storage device such as an HDD, a memory such as a RAM for storing temporarily necessary information related to a program calculation, or a combination thereof.

In the transport region 12, a transport device 30 that can freely move while holding the wafer W or the like is arranged. The transfer device 30 transfers the wafer W between the cassette C in the port 20 of the carry-in / out area 11 and the inspection area 13. Further, the transport device 30 transports the probe cards fixed to the pogo frame described later in the inspection area 13 that require maintenance to the loader 21 of the carry-in / out area 11. Further, the transport device 30 transports a new or maintained probe card from the loader 21 into the inspection area 13.

As shown in FIG. 2, the inspection area 13 is provided with a plurality of inspection spaces K (three stages in the example of the figure) in which the wafer W is inspected, and is laminated in the vertical direction. In the following description, each of the three inspection spaces K may be referred to as an inspection space K1, an inspection space K2, and an inspection space K3 in order from the bottom. Each inspection space K is provided with a tester row composed of a plurality of (four in the example of the figure) testers 40 arranged in the horizontal direction (direction A in FIG. 2). Further, each inspection space is provided with an aligner 50 as one moving mechanism and one upper camera 60. The number and arrangement of the tester 40, the aligner 50, and the upper camera 60 can be arbitrarily selected.

The tester 40 sends and receives an electric signal for electrical characteristic inspection to and from the wafer W.
The aligner 50 can hold the chuck top 70 and move it along a moving plane facing the probe card fixed to the pogo frame described later, and can move it in a height direction orthogonal to the moving plane. It is configured to be possible. For example, when the moving plane is horizontal, the aligner 50 moves the chuck top 70 in the left-right direction (A direction in FIG. 2), the front-back direction (B direction in FIG. 2), and the vertical direction (C direction in FIG. 2). Can be made to. Further, the aligner 50 can align the wafer W placed on the chuck top 70 with the probe of the probe card described later.

The upper camera 60 is configured to be movable horizontally, and is provided so as to take an image of the lower part. The upper camera 60 is, for example, positioned in front of each tester 40 in the inspection provided with the upper camera 60, and images the wafer W placed on the chuck top 70 on the aligner 50.

The chuck top 70 is a substrate support portion that supports the wafer W, and for example, the mounted wafer W can be held by adsorption or the like.
The chuck top 70 is provided with a temperature control mechanism. The temperature control mechanism is, for example, at least one of a heating mechanism such as a resistance heater and a cooling mechanism such as a flow path of a refrigerant. Further, the chuck top 70 is provided with a temperature sensor (not shown). Then, the temperature control mechanism provided on the chuck top 70 is controlled by the control unit 22 so that the measurement result by the temperature sensor becomes the set temperature, that is, the temperature of the chuck top 70 becomes the set temperature. In addition, the temperature of the chuck top 70 is adjusted.

In this inspection device 1, while the transfer device 30 conveys the wafer W toward one tester 40, the other tester 40 inspects the electrical characteristics of the electronic device formed on the other wafer W. be able to.

Subsequently, a more detailed configuration of the inspection region 13 will be described with reference to FIGS. 3 to 5. FIG. 3 is a side sectional view of the inspection area 13. FIG. 4 is a partially enlarged view of the front cross section of the inspection area 13. FIG. 5 is a side sectional view showing a state when the set temperature of the chuck top 70 of the inspection space K1 is changed.

As described above, the aligner 50 is provided in each inspection space K of the inspection area 13. Further, as shown in FIG. 3, each inspection space K is provided with a chuck top 70 and a pogo frame 80.

The aligner 50 is a base wall of the housing 10 which is a lower wall defining the inspection space K (specifically, a bottom wall 10a of the housing 10, a horizontal partition wall 10b separating the inspection space K1 and the inspection space K2). , It is arranged on the horizontal partition wall 10c) that separates the inspection space K2 and the inspection space K3. The base wall on which the aligner 50 is arranged is supported by a back wall 10d as a support member of the housing 10 and a vertical partition wall 10e that separates the transport region 12 and the inspection region 13.
The aligner 50 has, for example, an X stage 51, a Y stage 52, and a Z stage 53.

The X stage 51 moves along the guide rail 51a in the X-axis direction constituting the coordinate system of the moving plane (XY plane) by the aligner 50. The X stage 51 is provided with a position detection mechanism (not shown) for detecting a position of the X stage 51 in the X direction, that is, a position of the chuck top 70 in the X axis direction. The position detection mechanism is, for example, a linear encoder.

The Y stage 52 moves on the X stage 51. Specifically, it moves along the guide rail 52a in the Y-axis direction constituting the coordinate system of the movement plane (XY plane) by the aligner 50. The Y stage 52 is provided with a position detection mechanism (not shown) for detecting a position of the Y stage 52 in the Y-axis direction, that is, a position of the chuck top 70 in the Y-axis direction. The position detection mechanism is, for example, a linear encoder.

The Z stage 53 moves in the height direction (Z direction) by the telescopic shaft 53a that can be expanded and contracted in the height direction (Z direction) orthogonal to the movement plane (XY plane) by the aligner 50. The Z stage 53 is provided with a position detection mechanism (not shown) for detecting a position of the Z stage 53 in the Z direction, that is, a position of the chuck top 70 in the Z direction. The position detection mechanism is, for example, a linear encoder.
Further, the chuck top 70 is detachably attracted and held on the Z stage 53. The suction holding of the chuck top 70 by the Z stage 53 is performed by vacuum suction or the like by a suction holding mechanism (not shown).
Further, the Z stage 53 is provided with a lower camera 54.

Since the lower camera 54 is provided on the Z stage 53 as described above, the lower camera 54 moves together with the chuck top 70 by the aligner 50.
The lower camera 54 is provided so as to take an image of the upper part. The lower camera 54, for example, captures a probe card fixed to a pogo frame described later, and also captures a position correction pin provided on the pogo frame described later.

The aligner 50 and the lower camera 54 are controlled by the control unit 22, and the position detection results by the position detection mechanisms provided in the X stage 51, the Y stage 52, and the Z stage 53 are output to the control unit 22.

As shown in FIG. 4, the tester 40 has a tester motherboard 41 at the bottom. A plurality of inspection circuit boards (not shown) are mounted on the tester motherboard 41 in an upright state. Further, a plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41.
Further, below the tester 40, a pogo frame 80 as a fixed portion is provided.

The probe card 90 is fixed to the pogo frame 80, and the probe card 90 and the tester 40 are electrically connected to each other. Further, the pogo frame 80 is supported by the back wall 10d of the housing 10 like the base wall on which the aligner 50 is arranged. However, unlike the base wall, the pogo frame 80 is not supported by the vertical partition wall 10e. The pogo frame 80 has a pogo pin 81 that electrically connects the tester 40 and the probe card 90, and specifically, has a pogo block 82 that holds a large number of pogo pins 81. Further, the pogo frame 80 has a frame main body 83 in which a mounting hole 83a to which a pogo pin 81 is attached is formed by inserting a pogo block 82.

A probe card 90 is fixed to the lower surface of the pogo frame 80 in a state of being aligned at a predetermined position.

By the exhaust mechanism (not shown), the tester motherboard 41 is vacuum-sucked to the pogo frame 80, and the probe card 90 is vacuum-sucked to the pogo frame 80. Due to the vacuum suction force for performing the vacuum suction, the lower end of each pogo pin 81 of the pogo frame 80 comes into contact with the corresponding electrode pad on the upper surface of the card body 91 described later of the probe card 90, and the upper end of each pogo pin 81 is brought into contact with the corresponding electrode pad. , Pressed against the corresponding electrode on the underside of the tester motherboard 41.

The probe card 90 has a disk-shaped card body 91 having a plurality of electrode pads provided on the upper surface. A plurality of probes 92, which are needle-shaped contact terminals extending downward, are provided on the lower surface of the card body 91.
The plurality of electrode pads provided on the upper surface of the card body 91 are electrically connected to the corresponding probes 92, respectively. Further, at the time of inspection, each of the probes 92 comes into contact with the electrodes of the semiconductor device formed on the wafer W. Therefore, at the time of electrical characteristic inspection, an electrical signal to be inspected is transmitted between the tester motherboard 41 and the semiconductor device on the wafer W via the pogo pin 81, the electrode pad provided on the upper surface of the card body 91, and the probe 92. It is sent and received.
The inspection device 1 is provided with a large number of probes 92 so as to cover substantially the entire lower surface of the card body 91 in order to collectively inspect the electrical characteristics of the plurality of semiconductor devices formed on the wafer W.

A bellows 84 is attached to the lower surface of the pogo frame 80. The bellows 84 is a cylindrical stretchable member that hangs down so as to surround the probe card 90. Further, the bellows 84 attracts and holds the chuck top 70 at a position below the probe card 90.

Further, the bellows 84 sucks and holds the chuck top 70 to form a closed space S surrounded by the pogo frame 80 including the probe card 90, the bellows 84, and the chuck top 70. By depressurizing the closed space S by a decompression mechanism (not shown), the contact state between the wafer W and the probe 92 can be maintained.

As described above, the base wall (bottom wall 10a, lateral partition wall 10b, 10c) on which the aligner 50 is arranged and the pogo frame 80 are supported by the back wall 10d of the housing 10. Further, this back wall 10d is common among the inspection spaces K.

In the inspection device 1 configured as described above, when the set temperature of the chuck top 70 of one inspection space K is changed, the conventional position using the upper camera 60 and the lower camera 54 in the other inspection space K. Even if the alignment is performed, the electrodes on the wafer W and the probe 92 may not be properly brought into contact with each other. As a result of diligent studies by the present inventors on this cause, the following findings were obtained.

In the inspection device 1 in which the inspection spaces K are provided in a plurality of stages, as described above, the base wall on which the aligner 50 is arranged and the pogo frame are common support members, that is, back walls among the inspection spaces K in the plurality of stages. It is supported by 10d. For example, when the set temperature of the chuck top 70 of the inspection space K1 in the lowermost stage is changed, the temperature of the probe card 90 in contact with the wafer W supported by the chuck top 70 changes. Therefore, of the back wall 10d and the vertical partition wall 10e, the temperature of the back wall 10d close to the probe card 90 changes, so that the back wall 10d thermally expands or contracts in the vertical direction as shown in FIG. As a result, for example, the relative angle between the base wall (specifically, the lateral partition wall 10b) in the middle inspection space K2 and the pogo frame 80 changes, that is, the base wall (specifically) in the middle inspection space K2. The relative angle between the moving plane (XY plane) of the chuck top 70 and the pogo frame and 80 by the aligner 50 arranged on the horizontal partition wall 10b) changes. Therefore, even if the inspection space K2 in the middle stage is aligned in the same manner as before the set temperature of the chuck top 70 in the inspection space K1 in the lower stage is changed, the electrodes on the wafer W and the probe 92 are in proper contact with each other. It is considered that the phenomenon that it cannot be made to occur occurs.

In this embodiment, based on the above findings, as shown in FIGS. 3 and 4, a position correction pin 85 as a position correction mark is provided on the pogo frame 80 (specifically, the bottom surface of the frame body 83). There are multiple. The result when these position correction pins 85 are imaged or recognized by the lower camera 54 is the relative angle between the base wall on which the aligner 50 is placed and the pogo frame 80, in other words, the chuck top 70 by the aligner 50. It changes according to the relative angle between the moving plane (XY plane) and the pogo frame 80. Therefore, in the present embodiment, as described in detail below, the contact position is corrected based on the image pickup result by the lower camera 54 of each of the position correction pins 85. The contact position is the position of the chuck top 70 in the moving plane when the wafer W supported by the chuck top 70 and the probe 92 are brought into contact with each other.

The plurality of position correction pins 85 are, for example, the position correction pins 85a and 85b provided so as to be separated from each other when viewed from the X-axis direction constituting the coordinate system of the moving plane of the chuck top 70 by the aligner 50. , 85c and 85d for position correction provided so as to be separated from each other when viewed from the Y-axis direction constituting the coordinate system.
Further, for each position correction pin 85, a material having a smaller coefficient of thermal expansion than the material of the back wall 10d of the housing 10 is used, and for example, the same material as the frame main body 83 of the pogo frame 80 is used.
In the following description, for the sake of simplification of the description, it is assumed that only one tester 40 and one pogo frame 80 are provided in each inspection space K.

FIG. 6 is a functional block unit of the control unit 22 related to the contact position correction process in the inspection device 1.
The control unit 22 functions as an image pickup control unit 22a, a correction unit 22b, and an acquisition unit 22c by reading and executing a program stored in the storage unit by a processor such as a CPU.

The image pickup control unit 22a controls the lower camera 54 and the aligner 50 (specifically, the drive system of the aligner 50), and causes the lower camera 54 to image each of the position correction pins 85. As a result of imaging the position correction pin 85 by the lower camera 54, the image pickup control unit 22a determines the position of the chuck top 70 when the position correction pin 85 is recognized by the lower camera 54 in the coordinate system of the moving plane by the aligner 50. That is, it is output in the XY coordinate system.

The correction unit 22b corrects the contact position.
In the present embodiment, when the set temperature of the chuck top 70 is changed in one inspection space K, the correction unit 22b has a position correction pin 85 by the lower camera 54 in another inspection space K after the change of the set temperature. The contact position in the other inspection space K is corrected based on the result of imaging each image and the reference value for position correction. For example, when the set temperature of the chuck top 70 is changed in the inspection space K1 in the lowermost stage, the correction unit 22b uses the lower camera 54 to move each of the position correction pins 85 in the inspection space K2 in the middle stage after the change in the set temperature. The contact position in the inspection space K2 in the middle stage is corrected based on the imaged result and the reference value for position correction. Hereinafter, an example of correcting the contact position for the inspection space K2 in the middle stage will be described.

The acquisition unit 22c acquires the reference value for the position correction. For example, the acquisition unit 22c acquires the reference value for position correction from the result of imaging each of the position correction pins with the lower camera 54 in advance for the inspection space K2 in the middle stage. In addition, "preliminary" means, for example, before or immediately after the change of the set temperature of the chuck top 70 in the inspection space K1. In addition, "immediately after the change" means a period in which thermal expansion or thermal contraction of the back wall 10d due to the change of the set temperature has not yet occurred.

(Specific example 1 of correction method)
7 and 8 are diagrams for explaining a specific example 1 of the method for correcting the contact position.
For example, the acquisition unit 22c constitutes an XY coordinate system from the results of imaging each of the two position correction pins 85a and 85b in advance with the lower camera 54 under the control of the image pickup control unit 22a for the inspection space K2 in the middle stage. The reference value L1 of the distance between the two position correction pins 85 with respect to the Y-axis direction is calculated and acquired. As shown in FIG. 7, the Y coordinate of the position of the chuck top 70 when one position correction pin 85a is recognized by the lower camera 54 in advance is y1, and the chuck top when the other position correction pin 85b is recognized. When the Y coordinate of the position of 70 is y2, the reference value L1 can be expressed by the following equation (1).
L1 = y2-y1 ... (1)

On the other hand, the correction unit 22b acquires the following information when the set temperature of the chuck top 70 is changed in the inspection space K1 at the lowermost stage. That is, after the change in the set temperature, the correction unit 22b imaged the two position correction pins 85a and 85b with the lower camera 54 under the control of the image pickup control unit 22a for the inspection space K2 in the middle stage. The distance L2 between the two position correction pins 85 in the Y-axis direction is acquired. As shown in FIG. 8, the Y coordinate of the position of the chuck top 70 when one position correction pin 85a is recognized by the lower camera 54 after the change of the set temperature is y3, and the other position correction pin 85b is recognized. When the Y coordinate of the position of the chuck top 70 is y4, the distance L2 can be expressed by the following equation (2).
L2 = y4-y3 ... (2)

Then, the correction unit 22b corrects the contact position in the Y-axis direction based on the difference ΔL (= L2-L1) between the distance L2 and the reference value L1.
Specifically, the correction unit 22b corrects the amount of movement of the chuck top 70 from the origin to the contact position in the Y-axis direction based on the following equation (3).
ΔY1'= ΔY1 + a * ΔL ... (3)

ΔY1 is the amount of movement of the chuck top 70 from the origin to the contact position in the Y-axis direction, which is determined based on the image pickup result of the predetermined portion of the probe card 90 by the lower camera 54, and ΔY1 is the correction amount. Later, it is the amount of movement of the chuck top 70 from the origin to the contact position in the Y-axis direction.
Further, a is a variable, and is set based on, for example, the distance of the position correction pins 85a and 85b on the pogo frame 80.

The amount of movement of the chuck top 70 from the origin to the contact position in the X-axis direction can also be corrected in the same manner based on the result of imaging the position correction pins 85c and 85d by the lower camera 54.

(Specific example 2 of the correction method)
9 and 10 are views for explaining a specific example 2 of the contact position correction method.
In the case of this example, the image pickup control unit 22a captures the position correction pin 85 by the lower camera 54, and as a result, the height of the lower camera 54 (specifically, when the position correction pin 85 is in focus). The height of the chuck top 70) is output. The height of the chuck top 70 is determined, for example, based on a position detection mechanism (not shown) that detects the position of the Z stage 53.

The acquisition unit 22c is, for example, the lower camera 54 when the two position correction pins 85a and 85b are in focus when the inspection space K2 in the middle stage is imaged in advance under the control of the image pickup control unit 22a. From the heights Z1 and Z2 of the above, the reference value θ1 of the relative inclination between the pogo frame 80 and the lateral partition wall 10b viewed from the X-axis direction is calculated and obtained. As shown in FIG. 9, the height Z1 of the lower camera 54 when one of the position correction pins 85a was in focus when the image was taken in advance and the other position correction pin 85b were in focus. Using the height Z2 of the lower camera 54 and the above-mentioned reference value L1, the above-mentioned reference value θ1 can be expressed by the following equation (4).
θ1 = arctan ((Z1-Z2) / L1) ... (4)

On the other hand, when the set temperature of the chuck top 70 is changed in the inspection space K1 in the lowermost stage, the correction unit 22b takes an image of the inspection space K2 in the middle stage after changing the set temperature under the control of the image pickup control unit 22a. When the two position correction pins 85a and 85b are in focus, the relatives of the pogo frame 80 and the lateral partition wall 10b as viewed from the X-axis direction from the heights Z3 and Z4 of the lower camera 54. The inclination θ2 is calculated and acquired. As shown in FIG. 10, the height Z3 of the lower camera 54 when one of the position correction pins 85a is in focus when an image is taken after the set temperature is changed, and the other position correction pin 85b. Using the height Z4 of the lower camera 54 when in focus and the above-mentioned distance L2, the inclination θ2 can be expressed by the following equation (5).
θ2 = arctan ((Z4-Z3) / L2) ... (5)

Then, the correction unit 22b corrects the contact position in the Y-axis direction based on the difference Δθ (= θ2-θ1) between the inclination θ2 and the reference value θ1.
Specifically, the correction unit 22b corrects the amount of movement of the chuck top 70 from the origin to the contact position in the Y-axis direction based on the following equation (6).
ΔY1 ′ = ΔY1 * cos (θ2-θ1)… (6)

The amount of movement of the chuck top 70 from the origin to the contact position in the X-axis direction can also be corrected in the same manner based on the result of imaging the position correction pins 85c and 85d by the lower camera 54.

(Specific example 3 of the correction method)
FIG. 11 is a diagram for explaining a specific example 3 of the contact position correction method.
In the case of this example, the information output by the image pickup control unit 22a as a result of imaging the position correction pin 85 by the lower camera 54 is the same as that of the above-mentioned specific example 1.
Further, the information acquired by the acquisition unit 22c as the reference value for position correction is the same as that of the above-mentioned specific example 1. For example, the acquisition unit 22c captures two position correction pins 85a and 85b with the lower camera 54 in advance for the inspection space K2 in the middle stage, and obtains two positions with respect to the Y-axis direction constituting the XY coordinate system. The reference value L11 of the distance between the correction pins 85 is calculated and acquired.

Here, when the pogo frame 80 and the lateral partition wall 10b are relatively tilted when viewed from the X-axis direction, the desired position of the chuck top 70 is directly below the predetermined position P of the pogo frame 80 in the Y-axis direction. It is assumed that the chuck top 70 is moved to a position where (for example, the center) is considered to be located. In this case, the position related to the Y-axis direction is actually detected not at the chuck top 70 but at the Y stage 52, and since the chuck top 70 has a height from the Y stage 52, the Y-axis is detected. With respect to the direction, the desired position (for example, the center) of the chuck top 70 is not located directly below the predetermined position P of the pogo frame 80. In order to position the chuck top 70 at a desired position (for example, the center) directly below the predetermined position P of the pogo frame 80 in the Y-axis direction, the chuck top 70 needs to be further moved by ΔY2 in the Y-axis direction.

Therefore, when the set temperature of the chuck top 70 is changed in the inspection space K1 at the lowermost stage, the correction unit 22b first acquires the following information as in the above-mentioned specific example 1. That is, after changing the set temperature, the correction unit 22b takes images of the two position correction pins 85a and 85b for the inspection space K2 in the middle stage by the lower camera 54, respectively, for two position corrections in the Y-axis direction. The distance L12 between the pins 85 is acquired.

Further, the correction unit 22b calculates and acquires the relative inclination θ11 between the pogo frame 80 and the lateral partition wall 10b viewed from the X-axis direction from the reference value L11 and the distance L12. As shown in FIG. 11, the slope θ2 can be expressed by the following equation (7) using the reference value L11 and the distance L12.
θ11 = arccos (L11 / L12)… (7)

The correction unit 22b has the inclination θ11 and the height of the chuck top 70 (specifically, the height of the chuck top 70 from the Y stage 52 when the chuck top 70 is assembled to the aligner 50 at room temperature) Z3. Based on the above, the contact position in the Y-axis direction is corrected.
Specifically, the correction unit 22b calculates the correction amount ΔY2 of the movement amount of the chuck top 70 from the origin to the contact position in the Y-axis direction based on the following equation (8).
ΔY2 = tanθ11 * Z3 ... (8)

Then, the correction unit 22b corrects the amount of movement of the chuck top 70 from the origin to the contact position in the Y-axis direction based on the following equation (9).
ΔY1'= ΔY1 + ΔY2 ... (9)

The amount of movement of the chuck top 70 from the origin to the contact position in the X-axis direction can also be corrected in the same manner based on the result of imaging the position correction pins 85c and 85d by the lower camera 54. However, the height of the chuck top 70 used for the correction is specifically the height of the chuck top 70 from the X stage 51.

Next, the inspection process using the inspection device 1 will be described. First, an inspection process that does not involve correction of the contact position will be described.

(S1. Carry-in)
First, the wafer W to be inspected is carried into the desired inspection space K.
Specifically, the transfer device 30 and the like are controlled by the control unit 22, and the wafer W is taken out from the cassette C in the port 20 of the carry-in / out area 11, and is carried into, for example, the inspection area 13 in the middle stage, and is carried into the aligner 50. It is placed on the chuck top 70 which is attracted and held. At this time, the temperature of the chuck top 70 is adjusted to the set temperature by a temperature adjusting mechanism (not shown).

(S2. Alignment)
Next, the wafer W and the probe card 90 are aligned with each other.
Specifically, the aligner 50 is controlled by the control unit 22 based on the image pickup result of the wafer W on the chuck top 70 by the upper camera 60 and the image pickup result of the probe 92 by the lower camera 54, and becomes the probe card 90. The wafer W on the chuck top 70 and the probe 92 are aligned in the facing moving planes. Normally, the inspection device 1 is started up or maintained so that the wafer W and the probe 92 can be appropriately contacted only by this alignment, that is, without correcting the contact position as described above. Occasionally, the contact position is adjusted.

(S3. Adsorption holding of chuck top 70)
Subsequently, the chuck top 70 is attracted to the pogo frame 80.
Specifically, the chuck top 70 is raised until the probe 92 of the probe card 90 and the electrode of the electronic device formed on the wafer W come into contact with each other. In a state where the electrode on the wafer W and the probe 92 are in contact with each other, the decompression mechanism (not shown) and the like are controlled, and the Z stage 53 of the aligner 50 is lowered, whereby the chuck top 70 is moved to the aligner 50. Is separated from the pogo frame 80 and adsorbed on the pogo frame 80.

(S4. Inspection)
After the chuck top 70 and the aligner 50 are separated from each other, the electrical characteristics of the electronic device formed on the wafer W are inspected.
Specifically, the electrical characteristics of the electronic device formed on the wafer W are inspected while the chuck top 70 is adjusted to the set temperature. The electrical signal for the electrical characteristic inspection is input from the tester 40 to the electronic device via the pogo pin 81, the probe 92, and the like.

(S5. Carry out)
After that, the inspected wafer W is carried out.
Specifically, the chuck top 70 adsorbed on the pogo frame 80 is delivered to and held by the aligner 50. Further, the wafer W after inspection on the chuck top 70 held by the aligner 50 is carried out from the inspection area 13 by the transfer device 30 and returned to the cassette C in the port 20 of the carry-in / out area 11.
During the inspection by one tester 40, the aligner 50 transfers the wafer W to be inspected to another tester 40 and recovers the wafer W after inspection from the other tester 40.

Next, an inspection process involving correction of the contact position using the inspection device 1 will be described. In the following description, it is assumed that the inspection space K for which the contact position is corrected is the inspection space K2 in the middle stage. Further, in the following description, it is assumed that the acquisition unit 22c acquires the reference value for position correction from the result of imaging each of the position correction pins with the lower camera 54 for the inspection space K2 in the middle stage.

(S11. Carry-in)
First, the wafer W to be inspected is carried into the inspection space K2 in the middle stage in the same manner as in the above-mentioned carrying-in step of S1.

(S12. Imaging by the upper camera 60)
Next, imaging by the upper camera 60 is performed.
Specifically, under the control of the image pickup control unit 22a, a predetermined portion of the wafer W on the chuck top 70 is imaged by the upper camera 60.

(S13. Adjusting the position of the chuck top 70)
Then, the position of the chuck top 70 is adjusted.
Specifically, the position of the chuck top 70 is adjusted based on the image pickup result of the predetermined portion of the wafer W supported by the chuck top 70 by the upper camera 60.

(S14. Imaging for alignment by the lower camera 54)
Next, imaging for alignment is performed by the lower camera 54.
Specifically, a predetermined portion of the probe card 90 is imaged by the lower camera 54 under the control of the image pickup control unit 22a.

(S15. Imaging for position correction by the lower camera 54)
Next, imaging for correction of the contact position is performed by the lower camera 54.
Specifically, under the control of the image pickup control unit 22a, each of the plurality of position correction pins 85 formed on the pogo frame 80 is imaged, that is, recognized by the lower camera 54.

(Step S16. Calculation of contact position)
Subsequently, the contact position is calculated.
Specifically, the control unit 22 calculates the contact position from the result of imaging a predetermined portion of the probe card 90 by the lower camera 54. The control unit 22 calculates the amount of movement of the chuck top 70 from the origin to the contact position from the result of imaging a predetermined portion of the probe card 90 by the lower camera 54.

(Step S17. Correction of contact position)
Then, the contact position is corrected.
Specifically, the contact position calculated in step S16 (more specifically) based on the result of the correction unit 22b imaging each of the position correction pins 85 in step S14 and the reference value for position correction. Corrects the amount of movement of the chuck top 70 from the origin to the contact position).
As the correction method, any of the above-mentioned specific examples 1 to 3 may be used. Further, any two or more of the above-mentioned specific examples 1 to 3 may be used in combination. For example, the average value of the contact position corrected by the method according to the above-mentioned specific example 1 and the contact position corrected by the method according to the above-mentioned specific example 2 may be used as the corrected contact position.

(Step S18. Alignment)
Then, the wafer W and the probe card 90 are aligned with each other.
Specifically, the aligner 50 moves the chuck top 70 to the corrected contact position based on the calculation result in step S17.

(S19. Adsorption holding of chuck top 70)
Subsequently, the chuck top 70 is attracted to the pogo frame 80 in the same manner as in step S3 described above.

(S20. Inspection)
Next, as in step S4 described above, after the chuck top 70 and the aligner 50 are separated from each other, the electrical characteristics of the electronic device formed on the wafer W on the chuck top 70 are inspected.

(S21. Carry out)
After that, the wafer W after inspection is carried out as in step S5 described above.

Subsequently, the processes of steps S11 to S21 described above are repeated for another wafer W to be inspected. However, if there is no change in the imaging result of the positioning probe card 90 by the lower camera 54, the step S15 described above (that is, the step of imaging each of the plurality of position correction pins 85 by the lower camera 54) is omitted. You may. In other words, the step S15 described above may be performed only when there is a change in the image pickup result of the positioning probe card 90 by the lower camera 54. This can improve the inspection throughput.
When the step of the above-mentioned step S15 is omitted, the step of correcting the contact position in the above-mentioned step S17 is also omitted, and in the above-mentioned alignment step of the step S18, after the correction when the most recently corrected step S18 is omitted. A contact position is used and the chuck top 70 is moved to this contact position.

The inspection device 1 according to the present embodiment is provided with a plurality of inspection spaces K in which the wafer W is inspected. When the set temperature of the chuck top 70 is changed in one inspection space K, the relative between the base wall on which the aligner 50 is placed and the pogo frame 80 after the change in the set temperature in the other inspection space K. The angle changes, and even if the alignment is performed in the same manner as before the change of the set temperature, there is a possibility that the electrode on the wafer W and the probe 92 cannot be brought into proper contact with each other. In order to avoid this, in the present embodiment, a plurality of position correction pins 85 are provided, in which the result when the image is taken by the lower camera 54 changes according to the relative angle. Then, in the present embodiment, when the correction unit 22b changes the set temperature of the chuck top 70 in one inspection space K, the correction unit 22b is used for position correction by the lower camera 54 in the other inspection space K after the change in the set temperature. The contact position in the other inspection space K is corrected based on the result of imaging each of the pins 85 and the reference value for position correction.
Therefore, according to the present embodiment, in the inspection device 1 provided with a plurality of inspection spaces K for inspecting the wafer W, the set temperature of the chuck top 70 provided in one inspection space K is changed. However, the position of the wafer W and the probe 92 in the other inspection space K can be appropriately aligned.

In the above example, the reference value for position correction is obtained from the result of imaging the position correction pin 85 by the lower camera 54, but is predetermined without using the image taken by the lower camera 54. You may.

In the above example, when the set temperature of the chuck top 70 of the lowermost inspection space K1 is changed, the inspection space K to be corrected for the contact position is the inspection space K2 directly above, but the inspection further above it. The space K3 may also be the correction target of the contact position. Further, when the set temperature of the chuck top 70 of one inspection space K is changed, not only the inspection space K above the one inspection space K but also the inspection space K2 below the one inspection space K is in contact position. It may be the correction target of.

The embodiments disclosed this time should be considered to be exemplary and not restrictive in all respects. The above embodiments may be omitted, replaced or modified in various embodiments without departing from the scope of the appended claims and their gist.

1 Inspection device 10a Bottom wall 10b Horizontal partition 10c Horizontal partition 22b Correction unit 50 Aligner 54 Lower camera 70 Chuck top 80 Pogo frame 85 Position correction pin 85a Position correction pin 85b Position correction pin 85c Position correction pin 85d Position correction Pin 90 Probe card K Inspection space K1 Inspection space K2 Inspection space K3 Inspection space L1 Reference value L11 Reference value W Wafer θ1 Reference value

Claims (9)

There are multiple inspection spaces where the board is inspected.
In each of the inspection spaces
The board support part that supports the board and
A fixed part to which a probe card with an inspection probe is fixed,
The substrate support can be moved along a moving plane facing the probe card placed on the base wall and fixed to the fixed portion, and the substrate support can be moved in a height direction orthogonal to the moving plane. With a freely configured movement mechanism,
An image pickup unit that moves together with the substrate support portion by the movement mechanism is provided.
A plurality of position correction marks are provided on the fixed portion.
It has a correction unit for correcting the contact position, which is the position of the substrate support portion in the moving plane when the substrate supported by the substrate support portion and the probe are brought into contact with each other.
When the set temperature of the substrate support portion is changed in one of the inspection spaces, the correction unit captures each of the position correction marks by the image pickup unit after the set temperature is changed in the other inspection space. An inspection device that corrects the contact position in the other inspection space based on the result and the reference value for position correction. The inspection device according to claim 1, further comprising an acquisition unit for acquiring a reference value for position correction from the result of imaging each of the position correction marks by the image pickup unit in advance for the other inspection space. .. The reference value for position correction is a reference value L1 of the distance between the two marks for position correction with respect to one axial direction constituting the coordinate system of the moving plane.
The correction unit acquires a distance L2 between the two position correction marks with respect to the one axial direction when an image is taken after changing the set temperature, and the difference between the distance L2 and the reference value L1. The inspection device according to claim 1 or 2, wherein the contact position with respect to the one axial direction is corrected based on the above. The coordinate system of the moving plane is composed of one axis and another axial direction, and the reference value for position correction is the relative inclination of the fixed portion and the base wall as viewed from the other axial direction. Is the reference value θ1 of
The two position correction marks are separated from each other when viewed from the other axial direction.
The correction unit
From the height of the imaging unit when each of the two position correction marks is focused after the change of the set temperature, the fixed portion and the base wall as viewed from the other axial direction Calculate the relative slope θ2 and
The inspection device according to any one of claims 1 to 3, wherein the contact position with respect to the one axial direction is corrected based on the difference between the reference value θ1 and the inclination θ2. The reference value for position correction is a reference value L11 of the distance between the two marks for position correction with respect to one axial direction constituting the coordinate system of the moving plane.
The correction unit
The distance L12 between the two position correction marks with respect to the one axial direction when an image is taken after changing the set temperature is acquired.
From the reference value L11 and the distance L12, the relative inclination θ11 between the fixed portion and the base wall as viewed from the other axial direction is calculated.
The inspection device according to any one of claims 1 to 4, wherein the contact position with respect to the one axial direction is corrected based on the inclination θ11 and the height Z of the substrate support portion. The image pickup unit further performs imaging of the probe card for positioning the substrate supported by the substrate support portion and the probe.
The imaging of the position correction mark by the imaging unit after the change of the set temperature is performed only when there is a change in the imaging result of the probe card for the alignment by the imaging unit, claim 1. The inspection device according to any one of 5 to 5. The inspection device according to any one of claims 1 to 6, wherein the base wall and the fixed portion of each of the inspection spaces are supported by a common support member. The inspection device according to claim 7, wherein the material of the fixed portion has a smaller coefficient of thermal expansion than the material of the support member. It is a method of correcting the position of the substrate support portion that supports the substrate in an inspection apparatus provided with a plurality of inspection spaces for inspecting the substrate.
In each of the inspection spaces
The substrate support and
A fixed part to which a probe card with an inspection probe is fixed,
The substrate support can be moved along a moving plane facing the probe card placed on the base wall and fixed to the fixed portion, and the substrate support can be moved in a height direction orthogonal to the moving plane. With a freely configured movement mechanism,
An image pickup unit that moves together with the substrate support portion by the movement mechanism is provided.
A plurality of position correction marks are provided on the fixed portion.
A step of correcting the contact position, which is the position of the substrate support portion in the moving plane when the substrate supported by the substrate support portion and the probe are brought into contact with each other, is included.
In the correction step, when the set temperature of the substrate support portion is changed in one of the inspection spaces, each of the position correction marks is imaged by the image pickup unit after the set temperature is changed in the other inspection space. A method of correcting the contact position in the other inspection space based on the result and the reference value for position correction.

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