JP2022080963A

JP2022080963A - Pump device

Info

Publication number: JP2022080963A
Application number: JP2020192198A
Authority: JP
Inventors: 岳山本; Takeshi Yamamoto
Original assignee: Nidec Sankyo Corp
Current assignee: Nidec Sankyo Corp
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2022-05-31
Anticipated expiration: 2040-11-19
Also published as: JP7473459B2

Abstract

To provide a pump device capable of shielding electromagnetic waves generated from a circuit board and electromagnetic waves from the outside.SOLUTION: A pump device 1 includes a resin seal member 7 including a cylindrical part 74 covering a stator 6 and opened at the other side L2 in the axial direction, a circuit board 8 stored in the cylindrical part 74 and including a ground connection part 83, a cover member 9 covering the cylindrical part 74 from the other side L2 and including a conductive member 92, and an elastic member 16 electrically connecting the conductive member 92 and the ground connection part 83, the resin seal member 7 including a placement part 79 provided in the cylindrical part 74 where the circuit board 8 is placed from one side L1, the elastic member 16 having elastic contact with the conductive member 92 and the ground connection part 83, the elastic member 16 being fixed to the placement part 79 together with the circuit board 8 with a fixing member 791.SELECTED DRAWING: Figure 3

Description

本発明は、ポンプ装置に関する。 The present invention relates to a pump device.

ポンプ装置では、ポンプ室に配置されたインペラをモータで回転させる。この種のモータは、ポンプ室を区画する隔壁部材によって覆われたステータを備えており、ステータに対してインペラとは反対側には、モータに対する給電用の回路基板が配置される。 In the pump device, the impeller arranged in the pump chamber is rotated by a motor. This type of motor comprises a stator covered by a partition member that separates the pump chamber, and a circuit board for feeding the motor is arranged on the opposite side of the stator from the impeller.

このようなポンプ装置は、例えば特許文献１に記載されている。同文献では、モータは、軸線方向の一方側の端部にインペラが配置されたロータと、ロータを囲むステータを備える。ステータの軸線方向の他方側には、モータを制御するための回路基板が配置される。回路基板は、ステータとともに樹脂封止部材によって覆われている。 Such a pump device is described in, for example, Patent Document 1. In the same document, the motor comprises a rotor with an impeller located at one end in the axial direction and a stator surrounding the rotor. A circuit board for controlling the motor is arranged on the other side of the stator in the axial direction. The circuit board is covered with a resin sealing member together with the stator.

特開２０２０－１７４４７５号公報Japanese Unexamined Patent Publication No. 2020-174475

特許文献１において、回路基板を覆う樹脂封止部材は、樹脂製であるので、電磁波をシールドする機能が十分ではない。このため、モータを制御する際に回路基板から発生したノイズ（電磁波）は、ポンプ装置の周辺に配置された機器に影響を与える可能性がある。また、ポンプ装置の周辺に配置された機器から発生したノイズにより、ポンプ装置は影響を受ける可能性がある。 In Patent Document 1, since the resin sealing member covering the circuit board is made of resin, the function of shielding electromagnetic waves is not sufficient. Therefore, noise (electromagnetic waves) generated from the circuit board when controlling the motor may affect the equipment arranged around the pump device. Also, the pumping device may be affected by noise generated by equipment located around the pumping device.

以上の問題点に鑑みて、本発明の課題は、回路基板から発生した電磁波、および、外部からの電磁波をシールドすることが可能なポンプ装置を提供することにある。 In view of the above problems, an object of the present invention is to provide a pump device capable of shielding electromagnetic waves generated from a circuit board and electromagnetic waves from the outside.

上記課題を解決するために、本発明に係るポンプ装置は、回転中心軸線を中心に回転するロータと、前記ロータの周囲に配置されたステータと、前記ロータに対して前記回転中心軸線が延在する軸線方向の一方側に配置されたインペラと、前記ステータを覆うとともに、前記軸線方向の他方側において開口する筒部を備える樹脂封止部材と、前記筒部に収容され、グランド接続部を備えた回路基板と、前記筒部を前記他方側から覆うとともに、導電部材を備えたカバー部材と、前記回路基板と前記導電部材との間に配置され、前記導電部材および前記グランド接続部に弾性接触する導電性の弾性部材とを有し、前記樹脂封止部材は、前記筒部の内部において前記回路基板が前記他方側から載置される載置部を備え、前記弾性部材は、前記回路基板を前記載置部に固定する固定部材によって前記回路基板とともに前記載置部に固定されることを特徴とする。 In order to solve the above problems, in the pump device according to the present invention, the rotor rotating around the rotation center axis, the stator arranged around the rotor, and the rotation center axis extend to the rotor. An impeller arranged on one side in the axial direction, a resin sealing member having a tubular portion that covers the stator and opens on the other side in the axial direction, and a ground connection portion accommodated in the tubular portion. The circuit board and the cylinder portion are covered from the other side, and the cover member provided with the conductive member is arranged between the circuit board and the conductive member, and elastically contacts the conductive member and the ground connection portion. The resin sealing member includes a mounting portion on which the circuit board is mounted from the other side inside the cylinder portion, and the elastic member is the circuit board. Is fixed to the previously described resting portion together with the circuit board by a fixing member for fixing the to the previously described resting portion.

本発明では、回路基板を覆うカバー部材に導電部材が設けられており、導電部材および回路基板のグランド接続部に弾性接触する導電性の弾性部材を有する。すなわち、導電部材は、弾性部材を介して、回路基板のグランド接続部と電気的に接続する。このため、モータを制御する際に回路基板から発生したノイズ（電磁波）は、導電部材によって吸収されるので、外部へのノイズの放出が抑制される。また、ポンプ装置の周辺に配置された機器から発生したノイズは、導電部材によって吸収されるので、回路基板への影響が低減される。したがって、ポンプ装置は、回路基板から発生した電磁波、および、外部からの電
磁波をシールドすることが可能である。 In the present invention, the cover member that covers the circuit board is provided with the conductive member, and has the conductive member and the conductive elastic member that makes elastic contact with the ground connection portion of the circuit board. That is, the conductive member is electrically connected to the ground connection portion of the circuit board via the elastic member. Therefore, the noise (electromagnetic wave) generated from the circuit board when controlling the motor is absorbed by the conductive member, so that the emission of the noise to the outside is suppressed. Further, since the noise generated from the equipment arranged around the pump device is absorbed by the conductive member, the influence on the circuit board is reduced. Therefore, the pump device can shield the electromagnetic wave generated from the circuit board and the electromagnetic wave from the outside.

また、本発明では、回路基板は載置部に他方側から載置されている。したがって、弾性部材の付勢力が回路基板に加わっても、回路基板が撓むことを抑制することができる。これにより、回路基板の破損や変形を抑制でき、回路基板上の電子素子の不具合を抑制できる。また、弾性部材と回路基板は、共通の固定部材により固定されるので、弾性部材と回路基板とを、別々に載置部に固定する構成と比べて、構成を簡素にすることができる。 Further, in the present invention, the circuit board is mounted on the mounting portion from the other side. Therefore, even if the urging force of the elastic member is applied to the circuit board, it is possible to prevent the circuit board from bending. As a result, damage or deformation of the circuit board can be suppressed, and defects in the electronic elements on the circuit board can be suppressed. Further, since the elastic member and the circuit board are fixed by a common fixing member, the configuration can be simplified as compared with the configuration in which the elastic member and the circuit board are separately fixed to the mounting portion.

本発明において、前記カバー部材は、前記軸線方向に開口する開口部を備える樹脂製の枠部材と、前記開口部を覆う前記導電部材とを備え、前記枠部材と前記筒部との間には、前記枠部材と前記筒部とを接合する溶着部が設けられることが好ましい。このように構成すれば、枠部材と筒部は、樹脂製であるので、カバー部材は、樹脂封止部材の筒部に溶着によって固定することが可能である。したがって、カバー部材の固定にネジ等を用いる必要がないので、カバー部材および筒部にネジ孔を設ける部位を形成する必要がない。したがって、カバー部材および筒部の大型化を回避できるので、ポンプ装置を全体的にコンパクトにすることができる。 In the present invention, the cover member includes a resin frame member having an opening that opens in the axial direction, and the conductive member that covers the opening, and is between the frame member and the cylinder portion. It is preferable to provide a welded portion for joining the frame member and the tubular portion. With this configuration, since the frame member and the cylinder portion are made of resin, the cover member can be fixed to the cylinder portion of the resin sealing member by welding. Therefore, since it is not necessary to use a screw or the like for fixing the cover member, it is not necessary to form a portion for providing a screw hole in the cover member and the tubular portion. Therefore, since it is possible to avoid increasing the size of the cover member and the cylinder portion, the pump device can be made compact as a whole.

本発明において、前記載置部は、前記筒部の径方向の中央に配置されることが好ましい。このように構成すれば、固定部材によって弾性部材と回路基板とを載置部に固定する際の作業性が向上する。また、回路基板の中央の１箇所を載置部によって支持できるので、回路基板をバランス良く支持でき、回路基板の撓みを少なくすることができる。 In the present invention, it is preferable that the above-mentioned placing portion is arranged at the center of the tubular portion in the radial direction. With such a configuration, workability when fixing the elastic member and the circuit board to the mounting portion by the fixing member is improved. Further, since one central portion of the circuit board can be supported by the mounting portion, the circuit board can be supported in a well-balanced manner, and the bending of the circuit board can be reduced.

本発明において、前記回路基板は、前記軸線方向から見て前記載置部と重なる貫通穴を備え、前記弾性部材は、前記軸線方向から見て前記貫通穴と重なる固定穴を備え、前記載置部は、前記他方側に突出し前記貫通穴および前記固定穴に挿入された突出部を備え、前記固定部材は、前記載置部から前記他方側に突出し前記貫通穴および前記固定穴に挿入された突出部の先端を熱カシメすることによって形成されたカシメ部であることが好ましい。このように構成すれば、弾性部材と回路基板とを載置部に固定することが容易である。また、弾性部材の付勢力は回路基板と載置部とが軸線方向に重なる箇所に加わるので、回路基板にほとんど負荷をかけずに電気的接続を行うことができる。 In the present invention, the circuit board is provided with a through hole that overlaps with the previously described insertion portion when viewed from the axial direction, and the elastic member is provided with a fixing hole that overlaps with the through hole when viewed from the axis direction. The portion comprises a protrusion protruding to the other side and inserted into the through hole and the fixing hole, and the fixing member protrudes to the other side from the previously described placement portion and is inserted into the through hole and the fixing hole. It is preferably a caulked portion formed by heat caulking the tip of the protruding portion. With this configuration, it is easy to fix the elastic member and the circuit board to the mounting portion. Further, since the urging force of the elastic member is applied to the portion where the circuit board and the mounting portion overlap in the axial direction, the electrical connection can be made with almost no load on the circuit board.

本発明において、前記回路基板は、前記筒部に係合する係合部を備え、前記筒部に前記係合部が係合することにより、前記回路基板が周方向に位置決めされることが好ましい。このように構成すれば、固定部材による固定箇所で周方向の位置決めを行っていなくても、回路基板が筒部の内部で回転することを防止することができる。 In the present invention, it is preferable that the circuit board includes an engaging portion that engages with the tubular portion, and the circuit board is positioned in the circumferential direction by engaging the engaging portion with the tubular portion. .. With such a configuration, it is possible to prevent the circuit board from rotating inside the cylinder portion even if the positioning in the circumferential direction is not performed at the fixing portion by the fixing member.

本発明において、前記導電部材は、金属製の放熱部材であり、前記放熱部材と前記回路基板との間には、前記放熱部材および前記回路基板に配置される電子素子に接触する熱伝達部材が配置されることが好ましい。このように構成すれば、回路基板の電子素子で発生した熱を、熱伝達部材を介して放熱部材に伝達することができる。したがって、放熱を早めることができ、回路基板の電子素子の温度上昇を抑制できる。 In the present invention, the conductive member is a metal heat-dissipating member, and between the heat-dissipating member and the circuit board, a heat-dissipating member and a heat transfer member in contact with an electronic element arranged on the circuit board are provided. It is preferable to be arranged. With this configuration, the heat generated by the electronic elements of the circuit board can be transferred to the heat dissipation member via the heat transfer member. Therefore, heat dissipation can be accelerated, and the temperature rise of the electronic element of the circuit board can be suppressed.

本発明において、前記弾性部材は、金属製の板バネであることが好ましい。このように構成すれば、弾性部材を介して回路基板の熱を放熱部材に伝達できる。また、電子素子の熱はグランド接続部を介して弾性部材に伝わるので、弾性部材を介して電子素子の熱を放熱部材に伝達できる。したがって、放熱を早めることができ、回路基板の電子素子の温度上昇を抑制できる。 In the present invention, the elastic member is preferably a leaf spring made of metal. With this configuration, the heat of the circuit board can be transferred to the heat dissipation member via the elastic member. Further, since the heat of the electronic element is transferred to the elastic member via the ground connection portion, the heat of the electronic element can be transferred to the heat dissipation member via the elastic member. Therefore, heat dissipation can be accelerated, and the temperature rise of the electronic element of the circuit board can be suppressed.

本発明において、前記回路基板は、前記グランド接続部が電気的に接続するグランド層を備え、前記電子素子は、前記放熱部材と前記グランド層とに挟まれることが好ましい。
このように構成すれば、電子素子は放熱部材とグランド層とに挟まれるので、モータを制御する際に回路基板の電子素子から発生したノイズは、導電部材によって、より効率的に吸収される。この結果、ポンプ装置は、回路基板に対して電磁波をシールドする効果を、さらに向上させることができる。 In the present invention, it is preferable that the circuit board includes a ground layer to which the ground connection portion is electrically connected, and the electronic element is sandwiched between the heat dissipation member and the ground layer.
With this configuration, the electronic element is sandwiched between the heat dissipation member and the ground layer, so that noise generated from the electronic element on the circuit board when controlling the motor is more efficiently absorbed by the conductive member. As a result, the pump device can further improve the effect of shielding the electromagnetic wave from the circuit board.

本発明において、ポンプ装置は、回路基板を覆うカバー部材に導電部材が設けられており、導電部材および回路基板のグランド接続部に弾性接触する導電性の弾性部材を有する。したがって、モータを制御する際に回路基板から発生した電磁波、および、ポンプ装置の周辺に配置された機器から発生した電磁波は、いずれも導電部材によって吸収される。よって、回路基板から発生した電磁波、および、外部からの電磁波をシールドすることが可能である。 In the present invention, the pump device is provided with a conductive member on a cover member that covers the circuit board, and has a conductive member and a conductive elastic member that makes elastic contact with a ground connection portion of the circuit board. Therefore, both the electromagnetic wave generated from the circuit board when controlling the motor and the electromagnetic wave generated from the equipment arranged around the pump device are absorbed by the conductive member. Therefore, it is possible to shield the electromagnetic wave generated from the circuit board and the electromagnetic wave from the outside.

本発明を適用したポンプ装置の斜視図である。It is a perspective view of the pump device to which this invention is applied. 図１に示すポンプ装置を他方側から見た斜視図である。FIG. 3 is a perspective view of the pump device shown in FIG. 1 as viewed from the other side. 図１に示すポンプ装置の断面図である。It is sectional drawing of the pump device shown in FIG. 図１に示すポンプ装置からカバー部材を外した状態を示す斜視図である。It is a perspective view which shows the state which the cover member was removed from the pump device shown in FIG. 図１に示すポンプ装置の他方側の端部を拡大した断面斜視図である。FIG. 3 is an enlarged cross-sectional perspective view of the other end of the pump device shown in FIG. 1. カバー部材の斜視図である。It is a perspective view of a cover member. カバー部材の分解斜視図である。It is an exploded perspective view of a cover member. 弾性部材の斜視図である。It is a perspective view of an elastic member.

以下、図面を用いて、本発明に係るインペラを備えるポンプ装置について説明する。以下の説明において、回転中心軸線Ｌの延在方向を軸線方向として説明する。また、軸線方向において、一方側にはＬ１を付し、他方側にＬ２を付して説明する。また、以下の説明において、回転中心軸線を中心とする径方向および周方向を各々、単に「径方向」および「周方向」とする。 Hereinafter, a pump device including an impeller according to the present invention will be described with reference to the drawings. In the following description, the extending direction of the rotation center axis L will be described as the axis direction. Further, in the axial direction, L1 is attached to one side and L2 is attached to the other side. Further, in the following description, the radial direction and the circumferential direction about the rotation center axis are simply referred to as "diameter direction" and "circumferential direction", respectively.

（全体構成）
図１は、本発明を適用したポンプ装置１の斜視図である。図２は、図１に示すポンプ装置１を他方側Ｌ２から見た斜視図である。図３は、図１に示すポンプ装置１の断面図である。図４は、図１に示すポンプ装置からカバー部材を外した状態を示す斜視図である。図５は、図１に示すポンプ装置１の他方側Ｌ２の端部を拡大した断面斜視図である。図６は、カバー部材の斜視図である。図７は、カバー部材の分解斜視図である。 (overall structure)
FIG. 1 is a perspective view of a pump device 1 to which the present invention is applied. FIG. 2 is a perspective view of the pump device 1 shown in FIG. 1 as viewed from the other side L2. FIG. 3 is a cross-sectional view of the pump device 1 shown in FIG. FIG. 4 is a perspective view showing a state in which the cover member is removed from the pump device shown in FIG. FIG. 5 is an enlarged cross-sectional perspective view of the end portion of the other side L2 of the pump device 1 shown in FIG. FIG. 6 is a perspective view of the cover member. FIG. 7 is an exploded perspective view of the cover member.

図１～図４に示すように、ポンプ装置１は、ケース２と、ロータ５およびステータ６を備えたモータ３と、ロータ５に対して軸線方向の一方側Ｌ１に配置された樹脂製のインペラ４とを備える。ケース２は、インペラ４を収容し、ポンプ室２０を区画する。モータ３は、ステータ６を覆う樹脂製の樹脂封止部材７と、ステータ６のコイル６３に接続された回路基板８と、回路基板８を他方側Ｌ２から覆うとともに導電部材９２を備えたカバー部材９とを備える。また、モータ３は、回路基板８と導電部材９２との間に配置された弾性部材１６を備える。ポンプ装置１は、インペラ４がロータ５と一体に回転中心軸線Ｌを中心として回転することによりポンプ室２０内の流体を移動させる。 As shown in FIGS. 1 to 4, the pump device 1 includes a case 2, a motor 3 provided with a rotor 5 and a stator 6, and a resin impeller arranged on one side L1 in the axial direction with respect to the rotor 5. 4 and. The case 2 houses the impeller 4 and partitions the pump chamber 20. The motor 3 includes a resin sealing member 7 made of resin that covers the stator 6, a circuit board 8 connected to the coil 63 of the stator 6, and a cover member that covers the circuit board 8 from the other side L2 and has a conductive member 92. 9 and. Further, the motor 3 includes an elastic member 16 arranged between the circuit board 8 and the conductive member 92. The pump device 1 moves the fluid in the pump chamber 20 by rotating the impeller 4 integrally with the rotor 5 about the rotation center axis L.

（ケース）
図３に示すように、ケース２は、樹脂封止部材７との間にポンプ室２０を区画する。ケース２は、インペラ４に一方側Ｌ１で対向する対向壁２３と、インペラ４の径方向外側において周方向に延在する側壁２４とを備える。図１、図２に示すように、ケース２は、軸
線方向に沿って延在する吸入管２１と、軸線方向に対して直交する方向に延在する吐出管２２とを備える。吸入管２１および吐出管２２は各々、端部に吸入口２１ａおよび吐出口２２ａを備える。吸入管２１および吸入口２１ａは、回転中心軸線Ｌに対して同心状に設けられている。吐出管２２は、インペラ４の径方向外側に位置する。 (Case)
As shown in FIG. 3, the case 2 partitions the pump chamber 20 from the resin sealing member 7. The case 2 includes a facing wall 23 facing the impeller 4 on one side L1 and a side wall 24 extending in the circumferential direction on the radial outer side of the impeller 4. As shown in FIGS. 1 and 2, the case 2 includes a suction pipe 21 extending along the axial direction and a discharge pipe 22 extending in a direction orthogonal to the axial direction. The suction pipe 21 and the discharge pipe 22 are provided with a suction port 21a and a discharge port 22a at their ends, respectively. The suction pipe 21 and the suction port 21a are provided concentrically with respect to the rotation center axis L. The discharge pipe 22 is located on the outer side in the radial direction of the impeller 4.

（インペラ）
インペラ４は、樹脂製である。図３に示すように、インペラ４は、円形の第１プレート４１と、第１プレート４１から一方側Ｌ１に突出するとともに周方向に一定の間隔で配置された複数の羽根部４２と、羽根部４２の他方側Ｌ２の先端部と当接する円形の第２プレート４３とを備える。モータ３の駆動によってロータ５と一体にインペラ４が回転中心軸線Ｌを中心に回転すると、羽根部４２によってポンプ室２０内の流体が回転方向に流動する。これにより、流体は、遠心力を生じて、径方向内側は低圧、径方向外側は高圧となって、吸入口２１ａから吸入され、吐出口２２ａから吐出される。 (Impeller)
The impeller 4 is made of resin. As shown in FIG. 3, the impeller 4 includes a circular first plate 41, a plurality of blade portions 42 protruding from the first plate 41 to one side L1 and arranged at regular intervals in the circumferential direction, and blade portions. A circular second plate 43 that abuts on the tip of L2 on the other side of 42 is provided. When the impeller 4 is rotated about the rotation center axis L integrally with the rotor 5 by the drive of the motor 3, the fluid in the pump chamber 20 flows in the rotation direction by the blade portion 42. As a result, the fluid generates centrifugal force, becomes low pressure on the inner side in the radial direction and high pressure on the outer side in the radial direction, is sucked from the suction port 21a, and is discharged from the discharge port 22a.

（モータ）
図３に示すように、ロータ５は、軸線方向に延びる円筒状のホルダ５１と、ホルダ５１の外周面に保持された円筒状の磁石１０とを備える。ホルダ５１は樹脂製である。ホルダ５１は、外周面に磁石１０を保持する小径部５２と、磁石１０の他方側Ｌ２の端部と当接する円形の当接部５３と、当接部５３の外周縁から一方側Ｌ１に突出する大径部５４とを備えており、小径部５２の外径寸法は、大径部５４の外径寸法より小さい。小径部５２と大径部５４とは、同軸に設けられている。小径部５２は、内部に軸受５６を保持しており、ロータ５は、軸受５６を介して支持軸１１に回転可能に支持されている。 (motor)
As shown in FIG. 3, the rotor 5 includes a cylindrical holder 51 extending in the axial direction and a cylindrical magnet 10 held on the outer peripheral surface of the holder 51. The holder 51 is made of resin. The holder 51 has a small diameter portion 52 that holds the magnet 10 on the outer peripheral surface, a circular contact portion 53 that contacts the end of the other side L2 of the magnet 10, and a protrusion from the outer peripheral edge of the contact portion 53 to one side L1. The large diameter portion 54 is provided, and the outer diameter dimension of the small diameter portion 52 is smaller than the outer diameter dimension of the large diameter portion 54. The small diameter portion 52 and the large diameter portion 54 are provided coaxially. The small diameter portion 52 holds a bearing 56 inside, and the rotor 5 is rotatably supported by the support shaft 11 via the bearing 56.

図３に示すように、磁石１０は、全体が樹脂のスキン層で覆われる。磁石１０の外径寸法は、大径部５４の外径寸法と略同一である。磁石１０と小径部５２との間に接着剤を塗布することにより、磁石１０と小径部５２とは接着されている。この際、磁石１０は当接部５３と当接することにより軸線方向に位置決めされる。磁石１０は、フェライト磁石、ネオジムボンド磁石、サマリウム鉄窒素磁石などで構成される。本形態では、磁石１０は、フェライト磁石である。なお、フェライト磁石である場合には、全体が樹脂のスキン層で覆われていなくてもよい。 As shown in FIG. 3, the magnet 10 is entirely covered with a resin skin layer. The outer diameter dimension of the magnet 10 is substantially the same as the outer diameter dimension of the large diameter portion 54. By applying an adhesive between the magnet 10 and the small diameter portion 52, the magnet 10 and the small diameter portion 52 are adhered to each other. At this time, the magnet 10 is positioned in the axial direction by abutting on the contact portion 53. The magnet 10 is composed of a ferrite magnet, a neodymium bond magnet, a samarium iron-nitrogen magnet, and the like. In this embodiment, the magnet 10 is a ferrite magnet. In the case of a ferrite magnet, the entire magnet may not be covered with a resin skin layer.

図３に示すように、ステータ６は、ステータコア６１と、ステータコア６１にインシュレータ６２を介して巻回されたコイル６３とを有している。詳細な説明を省略するが、ステータコア６１は、ロータ５の周囲を囲む円環部と、円環部から径方向の内側へ突出する複数の突極とを備えている。コイル６３は、突極を覆うインシュレータ６２の径方向内側の第１鍔部６２１と径方向外側の第２鍔部６２２との間に巻回される。本形態において、モータ３は３相モータであり、コイル６３には、Ｕ相コイル、Ｖ相コイル、およびＷ相コイルが含まれている。 As shown in FIG. 3, the stator 6 has a stator core 61 and a coil 63 wound around the stator core 61 via an insulator 62. Although detailed description will be omitted, the stator core 61 includes an annular portion surrounding the rotor 5 and a plurality of salient poles protruding inward in the radial direction from the annular portion. The coil 63 is wound between the radial inner first flange portion 621 and the radial outer second flange portion 622 of the insulator 62 that covers the salient pole. In the present embodiment, the motor 3 is a three-phase motor, and the coil 63 includes a U-phase coil, a V-phase coil, and a W-phase coil.

図３および図５に示すように、樹脂封止部材７は、ステータ６とインペラ４との間に介在する第１隔壁部７１と、ステータ６と磁石１０との間に介在する第２隔壁部７２と、ロータ５の他方側Ｌ２の端面と対向する第３隔壁部７３とを備える。第１隔壁部７１はインペラ４に他方側Ｌ２で対向し、ケース２との間にポンプ室２０を区画する。本形態において、樹脂封止部材７は、ステータ６を径方向外側および径方向内側から覆うととともに、および軸線方向の両側から覆う樹脂封止部材である。樹脂封止部材７の材質は、例えば、ポリフェニレンサルファイド（ＰＰＳ：ＰｏｌｙＰｈｅｎｙｌｅｎｅＳｕｌｆｉｄｅ）によってステータ６をインサート成形することによって形成されている。また、例えば、樹脂封止部材７は、ＢＭＣ（ＢｕｌｋＭｏｌｄｉｎｇＣｏｍｐｏｕｎｄ）等によってステータ６をインサート成形することにより形成してもよい。 As shown in FIGS. 3 and 5, the resin sealing member 7 has a first partition wall portion 71 interposed between the stator 6 and the impeller 4, and a second partition wall portion interposed between the stator 6 and the magnet 10. 72 and a third partition wall portion 73 facing the end surface of the other side L2 of the rotor 5 are provided. The first partition wall portion 71 faces the impeller 4 on the other side L2, and partitions the pump chamber 20 from the case 2. In the present embodiment, the resin sealing member 7 is a resin sealing member that covers the stator 6 from the radial outside and the radial inside, and also covers both sides in the axial direction. The material of the resin sealing member 7 is formed by, for example, insert molding the stator 6 with polyphenylene sulfide (PPS: Poly Phenylene Sulfide). Further, for example, the resin sealing member 7 may be formed by insert molding the stator 6 with a BMC (Bulk Molding Compound) or the like.

図３に示すように、支持軸１１は、金属製の棒状部材である。支持軸１１の中心軸線がロータ５の回転中心軸線Ｌと一致する。支持軸１１の他方側Ｌ２の端部は、第３隔壁部７３に形成された孔部７３ａに圧入されている。支持軸１１の一方側Ｌ１の端部には、円環状の板部材１２が取り付けられている。板部材１２は、軸受５６の他方側Ｌ２の端部と当接する。 As shown in FIG. 3, the support shaft 11 is a metal rod-shaped member. The center axis of the support shaft 11 coincides with the rotation center axis L of the rotor 5. The end portion of the other side L2 of the support shaft 11 is press-fitted into the hole portion 73a formed in the third partition wall portion 73. An annular plate member 12 is attached to the end of L1 on one side of the support shaft 11. The plate member 12 comes into contact with the end of L2 on the other side of the bearing 56.

図３～図５に示すように、樹脂封止部材７は、ポンプ装置１の他方側Ｌ２の端部において他方側Ｌ２に開口する筒部７４を備える。本形態では、第３隔壁部７３はロータ５の他方側Ｌ２から外周側へ拡がっており、ステータ６の他方側Ｌ２を覆う。筒部７４は、第３隔壁部７３と接続する小径部７５と、小径部７５の他方側Ｌ２の端部と接続する大径部７６と、大径部７６の他方側Ｌ２の端部より径方向外側に突出したフランジ部７７とを備える。また、筒部７４は、回路基板８と電気的に接続するコネクタピン８２を覆うコネクタハウジング７８を備える。小径部７５は、円筒形状である。大径部７６は、円筒形状であり、小径部７５より外径寸法が大きい。大径部７６の内部には、回路基板８が収容される。図４に示すように、大径部７６の内周面には、回路基板８と係合する位置規制部７６１が３箇所に設けられている。フランジ部７７は、大径部７６の全周に渡って設けられる。 As shown in FIGS. 3 to 5, the resin sealing member 7 includes a tubular portion 74 that opens to the other side L2 at the end of the other side L2 of the pump device 1. In this embodiment, the third partition wall portion 73 extends from the other side L2 of the rotor 5 to the outer peripheral side and covers the other side L2 of the stator 6. The tubular portion 74 has a diameter larger than that of the small diameter portion 75 connected to the third partition wall portion 73, the large diameter portion 76 connected to the end portion of the other side L2 of the small diameter portion 75, and the end portion of the other side L2 of the large diameter portion 76. A flange portion 77 projecting outward in the direction is provided. Further, the tubular portion 74 includes a connector housing 78 that covers a connector pin 82 that is electrically connected to the circuit board 8. The small diameter portion 75 has a cylindrical shape. The large diameter portion 76 has a cylindrical shape and has a larger outer diameter than the small diameter portion 75. The circuit board 8 is housed inside the large diameter portion 76. As shown in FIG. 4, on the inner peripheral surface of the large diameter portion 76, position limiting portions 761 that engage with the circuit board 8 are provided at three locations. The flange portion 77 is provided over the entire circumference of the large diameter portion 76.

図３および図５に示すように、樹脂封止部材７は、回路基板８を載置するための載置部７９を備える。載置部７９は、第３隔壁部７３から他方側Ｌ２に突出する。載置部７９は、軸線方向から見た場合、円形形状であり、載置部７９の中心軸線は、回転中心軸線Ｌと一致する。載置部７９の他方側Ｌ２の端面には、回路基板８を固定するための固定部材７９１が設けられる。固定部材７９１は、載置部７９の他方側Ｌ２の端面から突出した突出部７９１ａの先端を熱変形させることによって形成されたカシメ部である。すなわち、固定部材７９１は、熱カシメにより形成される。 As shown in FIGS. 3 and 5, the resin sealing member 7 includes a mounting portion 79 for mounting the circuit board 8. The mounting portion 79 projects from the third partition wall portion 73 to the other side L2. The mounting portion 79 has a circular shape when viewed from the axial direction, and the central axis of the mounting portion 79 coincides with the rotation center axis L. A fixing member 791 for fixing the circuit board 8 is provided on the end surface of the other side L2 of the mounting portion 79. The fixing member 791 is a caulked portion formed by thermally deforming the tip of the protruding portion 791a protruding from the end surface of the other side L2 of the mounting portion 79. That is, the fixing member 791 is formed by heat caulking.

図３～図５に示すように、回路基板８は、コイル６３に対して給電を制御する回路等が設けられている。回路基板８は、載置部７９の他方側Ｌ２の端面に他方側Ｌ２から載置され、固定部材７９１により載置部７９に固定される。より具体的には、回路基板８の中央には軸線方向から見て載置部７９と重なる位置に貫通穴８ａが設けられている。貫通穴８ａに突出部７９１ａを挿入した状態で、突出部７９１ａの先端を熱カシメすることにより、回路基板８は、突出部７９１ａの先端に形成されたカシメ部である固定部材７９１により載置部７９に固定される。図４に示すように、回路基板８は、外周縁に係合部８５を備える。係合部８５は、回路基板８の外周部から径方向に突出しており、３箇所に設けられている。係合部８５が筒部７４の位置規制部７６１に係合することにより、回路基板８が周方向に位置決めされる。 As shown in FIGS. 3 to 5, the circuit board 8 is provided with a circuit or the like for controlling power supply to the coil 63. The circuit board 8 is mounted on the end surface of the other side L2 of the mounting portion 79 from the other side L2, and is fixed to the mounting portion 79 by the fixing member 791. More specifically, a through hole 8a is provided in the center of the circuit board 8 at a position overlapping the mounting portion 79 when viewed from the axial direction. By thermally caulking the tip of the projecting portion 791a with the projecting portion 791a inserted into the through hole 8a, the circuit board 8 is mounted by the fixing member 791 which is a caulking portion formed at the tip of the projecting portion 791a. It is fixed to 79. As shown in FIG. 4, the circuit board 8 includes an engaging portion 85 on the outer peripheral edge. The engaging portions 85 project radially from the outer peripheral portion of the circuit board 8 and are provided at three locations. The circuit board 8 is positioned in the circumferential direction by engaging the engaging portion 85 with the position restricting portion 761 of the tubular portion 74.

図３～図５に示すように、回路基板８の他方側Ｌ２の面には、電子素子８１が実装されている。電子素子８１は、給電を制御するＩＣチップ等である。電子素子８１は、コイル６３に対して給電を制御する際、発熱する熱源となる。図３および図５に示すように、回路基板８の他方側Ｌ２の面には、グランド接続部８３が設けられている。グランド接続部８３は、銅箔などの導電材からなる。グランド接続部８３は、貫通穴８ａを囲うように配置される。グランド接続部８３は、回路基板８の内部に設けられたグランド層８４に接続する。すなわち、回路基板８はグランド層８４を備えた多層基板である。グランド層８４は、回路基板８の全範囲に設けられた金属の層である。グランド層８４は、コネクタピン８２を介して、ポンプ装置１のグランド端子と電気的に接続する。本形態では、電子素子８１は、グランド接続部８３の近傍に配置されており、グランド接続部８３と隣り合う位置に配置される。電子素子８１は、軸線方向において、導電部材９２とグランド層８４とに挟まれる。 As shown in FIGS. 3 to 5, the electronic element 81 is mounted on the surface of the other side L2 of the circuit board 8. The electronic element 81 is an IC chip or the like that controls power supply. The electronic element 81 becomes a heat source that generates heat when controlling power supply to the coil 63. As shown in FIGS. 3 and 5, a ground connection portion 83 is provided on the surface of the other side L2 of the circuit board 8. The ground connection portion 83 is made of a conductive material such as copper foil. The ground connection portion 83 is arranged so as to surround the through hole 8a. The ground connection portion 83 is connected to the ground layer 84 provided inside the circuit board 8. That is, the circuit board 8 is a multilayer board provided with the ground layer 84. The ground layer 84 is a metal layer provided in the entire range of the circuit board 8. The ground layer 84 is electrically connected to the ground terminal of the pump device 1 via the connector pin 82. In this embodiment, the electronic element 81 is arranged in the vicinity of the ground connecting portion 83, and is arranged at a position adjacent to the ground connecting portion 83. The electronic element 81 is sandwiched between the conductive member 92 and the ground layer 84 in the axial direction.

図３、図６および図７に示すように、カバー部材９は、樹脂封止部材７のフランジ部７
７に溶着により固定されて、筒部７４を他方側Ｌ２から覆う。カバー部材９は、軸線方向に開口する開口部９１ａを備える樹脂製の枠部材９１と、開口部９１ａを一方側Ｌ１から覆う導電部材９２と、枠部材９１と導電部材９２との間に配置されたシール部材９３とを備える。導電部材９２は、金属製であり、ノイズ（電磁波）に対するシールド部材であるとともに、回路基板８の熱を放熱するための放熱部材である。導電部材９２と回路基板８との間には、導電部材９２と回路基板８とに接触することによって回路基板８の熱を導電部材９２に伝達する熱伝達部材１５が配置される。 As shown in FIGS. 3, 6 and 7, the cover member 9 is the flange portion 7 of the resin sealing member 7.
It is fixed to 7 by welding and covers the tubular portion 74 from the other side L2. The cover member 9 is arranged between the resin frame member 91 having an opening 91a that opens in the axial direction, the conductive member 92 that covers the opening 91a from one side L1, and the frame member 91 and the conductive member 92. The seal member 93 is provided. The conductive member 92 is made of metal, is a shield member against noise (electromagnetic waves), and is a heat dissipation member for radiating heat from the circuit board 8. Between the conductive member 92 and the circuit board 8, a heat transfer member 15 that transfers the heat of the circuit board 8 to the conductive member 92 by contacting the conductive member 92 and the circuit board 8 is arranged.

枠部材９１は、円形の開口部９１ａを備える板状の円環部９１１と、円環部９１１の径方向中央において円環部９１１から一方側Ｌ１に突出する環状の環状壁部９１２とを備える。円環部９１１の外形形状は、筒部７４のフランジ部７７の外形形状と同一形状である。円環部９１１は、他方側Ｌ２を向く外面９１３と、環状壁部９１２より径方向内側において一方側Ｌ１を向く内面内周部９１４と、環状壁部９１２より径方向外側において一方側Ｌ１を向く内面外周部９１５とを備える。外面９１３は、軸線方向において環状壁部９１２と重なる位置に、枠部材９１を射出成形する際に形成される複数のゲート痕Ｇを備える。内面外周部９１５は、フランジ部７７に他方側Ｌ２から対向する。 The frame member 91 includes a plate-shaped annular portion 911 having a circular opening 91a, and an annular wall portion 912 protruding from the annular portion 911 to one side L1 at the radial center of the annular portion 911. .. The outer shape of the annular portion 911 is the same as the outer shape of the flange portion 77 of the tubular portion 74. The annular portion 911 faces the outer surface 913 facing the other side L2, the inner peripheral portion 914 facing the one side L1 radially inside the annular wall portion 912, and the one side L1 radially outward from the annular wall portion 912. It is provided with an inner surface outer peripheral portion 915. The outer surface 913 is provided with a plurality of gate marks G formed when the frame member 91 is injection-molded at a position overlapping the annular wall portion 912 in the axial direction. The inner peripheral peripheral portion 915 faces the flange portion 77 from the other side L2.

図５に示すように、環状壁部９１２は、筒部７４の大径部７６の内側に位置する。環状壁部９１２の外周面は、筒部７４の大径部７６の内周面に当接する。図７に示すように、環状壁部９１２は、径方向内側に突出する位置決め凸部９１７を備える。位置決め凸部９１７は、軸線方向から見た場合、半円形状であり、軸線方向に延びている。位置決め凸部９１７は、周方向に等間隔で８箇所に設けられている。後述するように、各位置決め凸部９１７の一方側Ｌ１の先端には、爪部９１９が形成される。また、環状壁部９１２の内周面は、他方側Ｌ２に凹む段部９１８を備える。段部９１８は、環状壁部９１２の内周面に沿って全周に延びている。段部９１８は、シール部材９３の他方側Ｌ２への移動を規制し、シール部材９３を軸線方向に位置決めする。 As shown in FIG. 5, the annular wall portion 912 is located inside the large diameter portion 76 of the tubular portion 74. The outer peripheral surface of the annular wall portion 912 abuts on the inner peripheral surface of the large diameter portion 76 of the tubular portion 74. As shown in FIG. 7, the annular wall portion 912 includes a positioning convex portion 917 that projects inward in the radial direction. The positioning convex portion 917 has a semicircular shape when viewed from the axial direction, and extends in the axial direction. The positioning protrusions 917 are provided at eight positions at equal intervals in the circumferential direction. As will be described later, a claw portion 919 is formed at the tip of one side L1 of each positioning convex portion 917. Further, the inner peripheral surface of the annular wall portion 912 is provided with a stepped portion 918 recessed in the other side L2. The step portion 918 extends all around along the inner peripheral surface of the annular wall portion 912. The step portion 918 restricts the movement of the seal member 93 to the other side L2, and positions the seal member 93 in the axial direction.

導電部材９２は、環状壁部９１２の径方向内側に位置する。導電部材９２は、一枚の金属板により構成される。導電部材９２は、銅、真鍮、アルミニウムなどの金属で構成される。導電部材９２は、軸線方向から見た場合、円形状である。導電部材９２は、開口部９１ａを一方側Ｌ１から覆う遮蔽部９２１と、遮蔽部９２１の外周縁から一方側Ｌ１に屈曲して軸線方向に延びる周壁部９２２と、周壁部９２２の端縁から径方向外側に突出するフランジ部９２３とを備える。周壁部９２２は、軸線方向と直交する方向において、回路基板８と重ならない。 The conductive member 92 is located inside the annular wall portion 912 in the radial direction. The conductive member 92 is composed of a single metal plate. The conductive member 92 is made of a metal such as copper, brass, or aluminum. The conductive member 92 has a circular shape when viewed from the axial direction. The conductive member 92 has a shielding portion 921 that covers the opening 91a from one side L1, a peripheral wall portion 922 that bends from the outer peripheral edge of the shielding portion 921 to one side L1 and extends in the axial direction, and a diameter from the edge of the peripheral wall portion 922. A flange portion 923 protruding outward in the direction is provided. The peripheral wall portion 922 does not overlap with the circuit board 8 in the direction orthogonal to the axial direction.

遮蔽部９２１は、軸線方向から見た場合、円形形状をしており、開口部９１ａより外径寸法が大きい。遮蔽部９２１は、軸線方向において、内面内周部９１４に一方側Ｌ１から当接する。すなわち、内面内周部９１４は、遮蔽部９２１に他方側Ｌ２から当接する当接部であり、遮蔽部９２１を軸線方向に位置決めする位置決め部９１６として機能する。 The shielding portion 921 has a circular shape when viewed from the axial direction, and has a larger outer diameter than the opening 91a. The shielding portion 921 abuts on the inner peripheral peripheral portion 914 of the inner surface from one side L1 in the axial direction. That is, the inner peripheral peripheral portion 914 of the inner surface is an abutting portion that abuts on the shielding portion 921 from the other side L2, and functions as a positioning portion 916 that positions the shielding portion 921 in the axial direction.

遮蔽部９２１は、回路基板８と対向する平面部９２４と、平面部９２４から一方側Ｌ１に突出する対向部９２５を備える。対向部９２５は、軸線方向から見た場合、四角形状をしており、軸線方向において、電子素子８１と重なる。平面部９２４は、対向部９２５に対して他方側Ｌ２に後退した位置に配置されているので、平面部９２４と回路基板８との間には、回路基板８上の半田などの導電材と平面部９２４との接触を回避するため接触回避空間Ｓが形成される。 The shielding portion 921 includes a flat surface portion 924 facing the circuit board 8 and a facing portion 925 projecting from the flat surface portion 924 to L1 on one side. The facing portion 925 has a rectangular shape when viewed from the axial direction, and overlaps with the electronic element 81 in the axial direction. Since the flat surface portion 924 is arranged at a position retracted to the other side L2 with respect to the facing portion 925, a conductive material such as solder on the circuit board 8 and a flat surface are formed between the flat surface portion 924 and the circuit board 8. A contact avoidance space S is formed to avoid contact with the portion 924.

導電部材９２は、フランジ部９２３の外周縁を内周側に切り欠いた切欠き部９２６を備える。切欠き部９２６は、軸線方向から見た場合、半円形状である。切欠き部９２６は、周方向に等間隔で８箇所に設けられている。導電部材９２を枠部材９１に固定する際、導
電部材９２の周壁部９２２を枠部材９１の環状壁部９１２の内周側に挿入するが、この際、切欠き部９２６は、環状壁部９１２の内周面に設けられた位置決め凸部９１７に係合する。これにより、導電部材９２は、周方向に位置決めされる。 The conductive member 92 includes a cutout portion 926 in which the outer peripheral edge of the flange portion 923 is cut out on the inner peripheral side. The notch portion 926 has a semicircular shape when viewed from the axial direction. Notches 926 are provided at eight locations at equal intervals in the circumferential direction. When fixing the conductive member 92 to the frame member 91, the peripheral wall portion 922 of the conductive member 92 is inserted into the inner peripheral side of the annular wall portion 912 of the frame member 91. At this time, the notch portion 926 is the annular wall portion 912. Engage with the positioning protrusion 917 provided on the inner peripheral surface of the. As a result, the conductive member 92 is positioned in the circumferential direction.

図６、図７に示すように、枠部材９１は、環状壁部９１２の一方側Ｌ１の先端に設けられた爪部９１９を備える。爪部９１９は、軸線方向において、位置決め凸部９１７と重なる。爪部９１９は、環状壁部９１２の一方側Ｌ１の先端部から突出した変形部９１９ａを熱変形させることによって形成される。すなわち、爪部９１９は、熱カシメにより形成されたカシメ部である。爪部９１９は、フランジ部９２３の外周縁を一方側Ｌ１から係止する。これにより、導電部材９２は、枠部材９１に固定される。 As shown in FIGS. 6 and 7, the frame member 91 includes a claw portion 919 provided at the tip of one side L1 of the annular wall portion 912. The claw portion 919 overlaps the positioning convex portion 917 in the axial direction. The claw portion 919 is formed by thermally deforming the deformed portion 919a protruding from the tip end portion of one side L1 of the annular wall portion 912. That is, the claw portion 919 is a caulking portion formed by heat caulking. The claw portion 919 locks the outer peripheral edge of the flange portion 923 from one side L1. As a result, the conductive member 92 is fixed to the frame member 91.

シール部材９３は、枠部材９１と導電部材９２との間に配置され、枠部材９１および導電部材９２に密着する。本形態のシール部材９３は、Ｏリングである。シール部材９３は、環状壁部９１２と周壁部９２２との径方向の隙間に配置され、径方向に弾性変形した状態で、環状壁部９１２の内周面および周壁部９２２の外周面に密着している。また、シール部材９３は、段部９１８によって、他方側Ｌ２への移動が規制されている。 The seal member 93 is arranged between the frame member 91 and the conductive member 92, and is in close contact with the frame member 91 and the conductive member 92. The seal member 93 of this embodiment is an O-ring. The seal member 93 is arranged in the radial gap between the annular wall portion 912 and the peripheral wall portion 922, and is in close contact with the inner peripheral surface of the annular wall portion 912 and the outer peripheral surface of the peripheral wall portion 922 in a state of being elastically deformed in the radial direction. ing. Further, the movement of the seal member 93 to the other side L2 is restricted by the step portion 918.

熱伝達部材１５は、薄いシート状の伝熱部材であり、弾性を有している。なお、熱伝達部材１５は、グリスなどであってもよい。本形態では、熱伝達部材１５は、対向部９２５および電子素子８１と接触するように配置されている。 The heat transfer member 15 is a thin sheet-like heat transfer member and has elasticity. The heat transfer member 15 may be grease or the like. In this embodiment, the heat transfer member 15 is arranged so as to be in contact with the facing portion 925 and the electronic element 81.

カバー部材９は、溶着により樹脂封止部材７の筒部７４に固定される。本形態では、枠部材９１と筒部７４との間には、枠部材９１と筒部７４とを接合する溶着部９４が設けられる。溶着部９４は、筒部７４の他方側Ｌ２の端部に設けられたフランジ部７７と、枠部材９１の円環部９１１とが軸線方向に対向する箇所に設けられている。図５に示すように、枠部材９１は、円環部９１１の内面外周部９１５から一方側Ｌ１へ突出する溶着用凸部９５１を備える。溶着用凸部９５１は環状であり、環状壁部９１２の周囲を囲んでいる。フランジ部７７は、溶着用凸部９５１に一方側Ｌ１から対向する環状の溶着用凹部９５２を備える。なお、枠部材９１に他方側Ｌ２に凹んだ溶着用凹部を設け、フランジ部７７に他方側Ｌ２に突出する溶着用凸部を設けた構成を採用してもよい。 The cover member 9 is fixed to the tubular portion 74 of the resin sealing member 7 by welding. In this embodiment, a welding portion 94 for joining the frame member 91 and the tubular portion 74 is provided between the frame member 91 and the tubular portion 74. The welded portion 94 is provided at a position where the flange portion 77 provided at the end of the other side L2 of the tubular portion 74 and the annular portion 911 of the frame member 91 face each other in the axial direction. As shown in FIG. 5, the frame member 91 includes a welding convex portion 951 projecting from the inner peripheral outer peripheral portion 915 of the annular portion 911 to one side L1. The welding convex portion 951 is annular and surrounds the annular wall portion 912. The flange portion 77 includes an annular welding recess 952 facing the welding convex portion 951 from one side L1. It should be noted that the frame member 91 may be provided with a welding recess recessed on the other side L2, and the flange portion 77 may be provided with a welding protrusion protruding on the other side L2.

図８は、弾性部材１６の斜視図である。図８に示すように、弾性部材１６は、導電性を有し、一枚の金属板により構成される板バネである。弾性部材１６は、導電部材９２とグランド接続部８３とを電気的に接続する。弾性部材１６は、導電部材９２とグランド接続部８３との間で弾性変形した状態で、固定部材７９１によって回路基板８とともに載置部７９に固定される。 FIG. 8 is a perspective view of the elastic member 16. As shown in FIG. 8, the elastic member 16 is a leaf spring having conductivity and composed of one metal plate. The elastic member 16 electrically connects the conductive member 92 and the ground connecting portion 83. The elastic member 16 is elastically deformed between the conductive member 92 and the ground connecting portion 83, and is fixed to the mounting portion 79 together with the circuit board 8 by the fixing member 791.

図５および図８に示すように、弾性部材１６は、グランド接続部８３と接する基部１６１と、導電部材９２と接する先端部１６２と、基部１６１および先端部１６２を接続する接続部１６３とを備える。図８に示すように、接続部１６３は、基部１６１から斜めに突出する。接続部１６３は、基部１６１および先端部１６２と湾曲した状態で連続する。基部１６１には、固定穴１６４が設けられる。本形態では、固定穴１６４は円形の貫通穴である。固定穴１６４は、軸線方向から見て回路基板８の貫通穴８ａと重なる位置に設けられている。回路基板８の貫通穴８ａから他方側Ｌ２に突出した突出部７９１ａを固定穴１６４に挿入した状態で、突出部７９１ａの先端を熱カシメして固定部材７９１を形成することにより、弾性部材１６は、回路基板８とともに、固定部材７９１により載置部７９に固定される。 As shown in FIGS. 5 and 8, the elastic member 16 includes a base portion 161 in contact with the ground connecting portion 83, a tip portion 162 in contact with the conductive member 92, and a connecting portion 163 connecting the base portion 161 and the tip portion 162. .. As shown in FIG. 8, the connecting portion 163 projects obliquely from the base portion 161. The connecting portion 163 is continuous with the base portion 161 and the tip portion 162 in a curved state. The base 161 is provided with a fixing hole 164. In this embodiment, the fixing hole 164 is a circular through hole. The fixing hole 164 is provided at a position overlapping the through hole 8a of the circuit board 8 when viewed from the axial direction. The elastic member 16 is formed by heat caulking the tip of the protrusion 791a in a state where the protrusion 791a protruding from the through hole 8a of the circuit board 8 to the other side L2 is inserted into the fixing hole 164 to form the fixing member 791. , Together with the circuit board 8, are fixed to the mounting portion 79 by the fixing member 791.

次に、カバー部材９を樹脂封止部材７に固定するための溶着方法について説明する。溶着方法としては、超音波溶着や振動溶着などが用いられる。本形態では、溶着用凸部９５
１が溶着用凹部９５２に嵌った状態で、円環部９１１の外面９１３に溶着ヘッドを押し付けて、溶着用凸部９５１と溶着用凹部９５２とを溶着する。溶着の際、フランジ部７７は、治具によって一方側Ｌ２から支持される。本形態では、樹脂封止部材７は、筒部７４から径方向外側に突出するコネクタハウジング７８を備えており、フランジ部７７とコネクタハウジング７８との間には、治具を挿入可能な軸線方向の隙間が形成されている。 Next, a welding method for fixing the cover member 9 to the resin sealing member 7 will be described. As the welding method, ultrasonic welding, vibration welding, or the like is used. In this embodiment, the welding convex portion 95
With 1 fitted in the welding recess 952, the welding head is pressed against the outer surface 913 of the annular portion 911 to weld the welding protrusion 951 and the welding recess 952. At the time of welding, the flange portion 77 is supported from one side L2 by a jig. In the present embodiment, the resin sealing member 7 includes a connector housing 78 that protrudes radially outward from the tubular portion 74, and an axial direction in which a jig can be inserted between the flange portion 77 and the connector housing 78. A gap is formed.

本形態では、枠部材９１と筒部７４との溶着量を調整することによって、熱伝達部材１５を対向部９２５および電子素子８１とに確実に接触させる。また、カバー部材９を樹脂封止部材７に固定すると、弾性部材１６の先端部１６２が導電部材９２に接触して一方側Ｌ１に押されるので、接続部１６３は軸線方向に撓む。これにより、弾性部材１６は、導電部材９２とグランド接続部８３との間で弾性変形した状態となり、導電部材９２およびグランド接続部８３に弾性接触する。したがって、弾性部材１６は、導電部材９２とグランド接続部８３とを電気的に接続する。 In this embodiment, the heat transfer member 15 is surely brought into contact with the facing portion 925 and the electronic element 81 by adjusting the amount of welding between the frame member 91 and the tubular portion 74. Further, when the cover member 9 is fixed to the resin sealing member 7, the tip portion 162 of the elastic member 16 comes into contact with the conductive member 92 and is pushed to one side L1, so that the connecting portion 163 bends in the axial direction. As a result, the elastic member 16 is elastically deformed between the conductive member 92 and the ground connecting portion 83, and is in elastic contact with the conductive member 92 and the ground connecting portion 83. Therefore, the elastic member 16 electrically connects the conductive member 92 and the ground connecting portion 83.

（作用効果）
以上のように、本形態のポンプ装置１は、回転中心軸線Ｌを中心に回転するロータ５と、ロータ５の周囲に配置されたステータ６と、ロータ５に対して回転中心軸線Ｌが延在する軸線方向の一方側Ｌ１に配置されたインペラ４と、ステータ６を覆うとともに、軸線方向の他方側Ｌ２において開口する筒部７４を備える樹脂封止部材７と、筒部７４に収容され、グランド接続部８３を備えた回路基板８と、筒部７４を他方側Ｌ２から覆うとともに、導電部材９２を備えたカバー部材９と、回路基板８と導電部材９２との間に配置され、導電部材９２およびグランド接続部８３と弾性接触する弾性部材１６とを有する。樹脂封止部材７は、筒部７４の内部において回路基板８が他方側Ｌ２から載置される載置部７９を備える。弾性部材１６は、回路基板８を載置部７９に固定する固定部材７９１によって回路基板８とともに載置部７９に固定される。 (Action effect)
As described above, in the pump device 1 of the present embodiment, the rotor 5 rotating around the rotation center axis L, the stator 6 arranged around the rotor 5, and the rotation center axis L extend with respect to the rotor 5. The impeller 4 arranged on one side L1 in the axial direction, the resin sealing member 7 including the tubular portion 74 that covers the stator 6 and opens on the other side L2 in the axial direction, and the ground that is accommodated in the tubular portion 74. The circuit board 8 provided with the connecting portion 83 and the tubular portion 74 are covered from the other side L2, and the cover member 9 provided with the conductive member 92 is arranged between the circuit board 8 and the conductive member 92. It also has an elastic member 16 that is in elastic contact with the ground connection portion 83. The resin sealing member 7 includes a mounting portion 79 on which the circuit board 8 is mounted from the other side L2 inside the tubular portion 74. The elastic member 16 is fixed to the mounting portion 79 together with the circuit board 8 by the fixing member 791 that fixes the circuit board 8 to the mounting portion 79.

このように構成すれば、導電部材９２は、弾性部材１６を介して、回路基板８のグランド接続部８３と電気的に接続する。このため、モータ３を制御する際に回路基板８から発生したノイズ（電磁波）は、導電部材９２によって吸収されるので、外部へのノイズの放出が抑制される。また、ポンプ装置１の周辺に配置された機器から発生したノイズは、導電部材９２によって吸収されるので、回路基板８への影響が低減される。この結果、ポンプ装置１は、回路基板８から発生した電磁波、および、外部からの電磁波をシールドすることが可能となる。 With this configuration, the conductive member 92 is electrically connected to the ground connection portion 83 of the circuit board 8 via the elastic member 16. Therefore, the noise (electromagnetic wave) generated from the circuit board 8 when controlling the motor 3 is absorbed by the conductive member 92, so that the emission of the noise to the outside is suppressed. Further, since the noise generated from the equipment arranged around the pump device 1 is absorbed by the conductive member 92, the influence on the circuit board 8 is reduced. As a result, the pump device 1 can shield the electromagnetic wave generated from the circuit board 8 and the electromagnetic wave from the outside.

また、回路基板８は載置部７９に他方側から載置されているので、弾性部材１６の付勢力が回路基板８に加わった場合に、回路基板８が撓むことを抑制することができる。これにより、回路基板８の破損や変形を抑制でき、回路基板８上の電子素子の不具合を抑制できる。また、弾性部材１６と回路基板８は、共通の固定部材７９１により固定されるので、弾性部材１６と回路基板８とを、別々に載置部に固定する構成と比べて、構成を簡素にすることができる。 Further, since the circuit board 8 is mounted on the mounting portion 79 from the other side, it is possible to prevent the circuit board 8 from bending when the urging force of the elastic member 16 is applied to the circuit board 8. .. As a result, damage or deformation of the circuit board 8 can be suppressed, and defects of the electronic elements on the circuit board 8 can be suppressed. Further, since the elastic member 16 and the circuit board 8 are fixed by the common fixing member 791, the configuration is simplified as compared with the configuration in which the elastic member 16 and the circuit board 8 are separately fixed to the mounting portion. be able to.

本形態において、カバー部材９は、軸線方向に開口する開口部９１ａを備える樹脂製の枠部材９１と、開口部９１ａを覆う導電部材９２とを備える。枠部材９１と筒部７４との間には、枠部材９１と筒部７４とを接合する溶着部９４が設けられる。このように構成すれば、カバー部材９は、枠部材９１が樹脂製であるので、樹脂封止部材７の筒部７４に溶着によって固定することが可能である。したがって、カバー部材９の固定にネジ等を用いる必要がないので、カバー部材９および筒部７４にネジ孔を設ける部位を形成する必要がない。したがって、カバー部材９および筒部７４の大型化を回避できるので、ポンプ装置１を全体的にコンパクトにすることができる。 In the present embodiment, the cover member 9 includes a resin frame member 91 having an opening 91a that opens in the axial direction, and a conductive member 92 that covers the opening 91a. A welding portion 94 for joining the frame member 91 and the tubular portion 74 is provided between the frame member 91 and the tubular portion 74. With this configuration, since the frame member 91 of the cover member 9 is made of resin, it can be fixed to the tubular portion 74 of the resin sealing member 7 by welding. Therefore, since it is not necessary to use a screw or the like for fixing the cover member 9, it is not necessary to form a portion for providing a screw hole in the cover member 9 and the tubular portion 74. Therefore, since it is possible to avoid increasing the size of the cover member 9 and the tubular portion 74, the pump device 1 can be made compact as a whole.

本形態において、載置部７９は、筒部７４の径方向の中央に配置されている。このように構成すれば、固定部材７９１によって弾性部材１６と回路基板８とを載置部７９に固定する際の作業性が向上する。また、回路基板８の中央の１箇所を載置部７９によって支持できるので、回路基板８をバランス良く支持でき、回路基板８の撓みを少なくすることができる。 In this embodiment, the mounting portion 79 is arranged at the center of the tubular portion 74 in the radial direction. With this configuration, workability when fixing the elastic member 16 and the circuit board 8 to the mounting portion 79 by the fixing member 791 is improved. Further, since one central portion of the circuit board 8 can be supported by the mounting portion 79, the circuit board 8 can be supported in a well-balanced manner, and the bending of the circuit board 8 can be reduced.

本形態において、回路基板８は、軸線方向から見て載置部７９と重なる貫通穴８ａを備え、弾性部材１６は、軸線方向から見て貫通穴８ａと重なる固定穴１６４を備える。載置部７９は、他方側Ｌ２に突出し貫通穴８ａよび固定穴１６４に挿入された突出部７９１ａを備える。固定部材７９１は、突出部７９１ａを熱カシメすることによって形成されたカシメ部である。このように構成すれば、弾性部材１６と回路基板８とを載置部７９に固定することが容易である。また、弾性部材１６の付勢力は回路基板８と載置部７９とが軸線方向に重なる箇所に加わるので、回路基板８にほとんど負荷をかけずに電気的接続を行うことができる。 In the present embodiment, the circuit board 8 includes a through hole 8a that overlaps with the mounting portion 79 when viewed from the axial direction, and the elastic member 16 includes a fixing hole 164 that overlaps with the through hole 8a when viewed from the axial direction. The mounting portion 79 includes a protruding portion 791a protruding from the other side L2 and inserted into a through hole 8a and a fixing hole 164. The fixing member 791 is a caulked portion formed by heat caulking the protruding portion 791a. With this configuration, it is easy to fix the elastic member 16 and the circuit board 8 to the mounting portion 79. Further, since the urging force of the elastic member 16 is applied to the portion where the circuit board 8 and the mounting portion 79 overlap in the axial direction, the circuit board 8 can be electrically connected with almost no load.

本形態において、回路基板８は、筒部７４に係合する係合部８５を備える。筒部７４に係合部８５が係合することにより、回路基板８が周方向に位置決めされる。本形態では、固定部材７９１による固定箇所では回路基板８の周方向の位置決めを行っていないが、筒部７４の内周面に係合部８５が嵌まる位置規制部７６１が設けられている。したがって、回路基板８を固定部材７９１のみで載置部に固定した場合でも、回路基板８が周方向に位置決めされるので、回路基板８が筒部７４の内部で回転することを防止することができる。 In this embodiment, the circuit board 8 includes an engaging portion 85 that engages with the tubular portion 74. By engaging the engaging portion 85 with the tubular portion 74, the circuit board 8 is positioned in the circumferential direction. In this embodiment, the circuit board 8 is not positioned in the circumferential direction at the fixed portion by the fixing member 791, but the position restricting portion 761 in which the engaging portion 85 is fitted is provided on the inner peripheral surface of the tubular portion 74. Therefore, even when the circuit board 8 is fixed to the mounting portion only by the fixing member 791, the circuit board 8 is positioned in the circumferential direction, so that the circuit board 8 can be prevented from rotating inside the cylinder portion 74. can.

本形態において、導電部材９２は、金属製の放熱部材であり、放熱部材（導電部材９２）と回路基板８との間には、放熱部材（導電部材９２）および回路基板８に配置される電子素子８１に接触する熱伝達部材１５が配置される。このように構成すれば、回路基板８の電子素子８１で発生した熱を、熱伝達部材１５を介して放熱部材（導電部材９２）に伝達することができる。したがって、放熱を早めることができ、回路基板８の電子素子８１の温度上昇を抑制できる。 In the present embodiment, the conductive member 92 is a metal heat-dissipating member, and between the heat-dissipating member (conductive member 92) and the circuit board 8, the heat-dissipating member (conductive member 92) and the electrons arranged on the circuit board 8 are placed. A heat transfer member 15 that comes into contact with the element 81 is arranged. With this configuration, the heat generated by the electronic element 81 of the circuit board 8 can be transferred to the heat dissipation member (conductive member 92) via the heat transfer member 15. Therefore, heat dissipation can be accelerated, and the temperature rise of the electronic element 81 of the circuit board 8 can be suppressed.

本形態において、弾性部材１６は、金属製の板バネであるため、弾性部材１６を介して回路基板８の熱を放熱部材である導電部材９２に伝達できる。また、電子素子８１の熱はグランド接続部８３を介して弾性部材１６に伝わるので、弾性部材１６を介して電子素子８１の熱を放熱部材（導電部材９２）に伝達できる。特に、本形態では、電子素子８１とグランド接続部８３が回路基板８上において隣り合う位置に配置されており、電子素子８１は、グランド接続部８３の近傍に配置されている。したがって、電子素子８１で発生した熱は、グランド接続部８３に伝わりやすい。そして、グランド接続部８３に伝わった熱を、弾性部材１６を介して放熱部材（導電部材９２）に伝達することができる。したがって、放熱を早めることができ、回路基板８の電子素子８１の温度上昇を抑制できる。 In the present embodiment, since the elastic member 16 is a leaf spring made of metal, the heat of the circuit board 8 can be transferred to the conductive member 92 which is a heat dissipation member via the elastic member 16. Further, since the heat of the electronic element 81 is transferred to the elastic member 16 via the ground connection portion 83, the heat of the electronic element 81 can be transferred to the heat dissipation member (conductive member 92) via the elastic member 16. In particular, in this embodiment, the electronic element 81 and the ground connection portion 83 are arranged at adjacent positions on the circuit board 8, and the electronic element 81 is arranged in the vicinity of the ground connection portion 83. Therefore, the heat generated by the electronic element 81 is easily transferred to the ground connection portion 83. Then, the heat transferred to the ground connecting portion 83 can be transferred to the heat radiating member (conductive member 92) via the elastic member 16. Therefore, heat dissipation can be accelerated, and the temperature rise of the electronic element 81 of the circuit board 8 can be suppressed.

本形態において、回路基板８は、グランド接続部８３が電気的に接続するグランド層８４を備える。電子素子８１は、放熱部材（導電部材９２）とグランド層８４とに挟まれる。ここで、モータ３を制御する際に回路基板８から発生するノイズは、電子素子８１から発生しやすい。また、電子素子８１は、ポンプ装置１の周辺に配置された機器から発生したノイズの影響を受けやすい。本形態では、電子素子８１は放熱部材（導電部材９２）とグランド層８４とによって軸線方向の両側から挟まれるので、モータ３を制御する際に回路基板８の電子素子８１から発生した電磁波（ノイズ）は、放熱部材（導電部材９２）によって、より効率的に吸収される。この結果、ポンプ装置１は、回路基板８に対して電磁波をシールドする効果を、さらに向上させることができる。 In this embodiment, the circuit board 8 includes a ground layer 84 to which the ground connection portion 83 is electrically connected. The electronic element 81 is sandwiched between the heat radiating member (conductive member 92) and the ground layer 84. Here, the noise generated from the circuit board 8 when controlling the motor 3 is likely to be generated from the electronic element 81. Further, the electronic element 81 is easily affected by noise generated from equipment arranged around the pump device 1. In this embodiment, since the electronic element 81 is sandwiched between the heat radiating member (conductive member 92) and the ground layer 84 from both sides in the axial direction, electromagnetic waves (noise) generated from the electronic element 81 of the circuit board 8 when controlling the motor 3 are obtained. ) Is absorbed more efficiently by the heat radiating member (conductive member 92). As a result, the pump device 1 can further improve the effect of shielding electromagnetic waves from the circuit board 8.

（他の実施形態）
上記形態では、固定部材７９１は、他方側Ｌ２に突出した突出部７９１ａを熱カシメすることにより形成されたが、この構成に限定されない。例えば、固定部材７９１は、ネジにより構成してもよい。ネジ（固定部材７９１）を貫通穴８ａおよび固定穴１６４に挿入した状態で、載置部７９にネジ止めすることによって、回路基板８および弾性部材１６を共通の固定部材７９１によって載置部７９に固定する構成としてもよい。 (Other embodiments)
In the above embodiment, the fixing member 791 is formed by heat caulking the protruding portion 791a protruding from the other side L2, but is not limited to this configuration. For example, the fixing member 791 may be configured by a screw. The circuit board 8 and the elastic member 16 are attached to the mounting portion 79 by the common fixing member 791 by screwing the screw (fixing member 791) into the mounting portion 79 with the screw (fixing member 791) inserted into the through hole 8a and the fixing hole 164. It may be fixed.

上記形態では、導電部材９２の周壁部９２２は、軸線方向と直交する方向において、回路基板８と重ならないが、回路基板８と重なる位置まで延びてもよい。このように構成すれば、周壁部９２２によって回路基板８の径方向外側を囲うことができるので、回路基板８に対して電磁波をシールドする効果を、より高めることができる。 In the above embodiment, the peripheral wall portion 922 of the conductive member 92 does not overlap with the circuit board 8 in the direction orthogonal to the axial direction, but may extend to a position where it overlaps with the circuit board 8. With this configuration, the peripheral wall portion 922 can surround the outside of the circuit board 8 in the radial direction, so that the effect of shielding electromagnetic waves from the circuit board 8 can be further enhanced.

上記形態では、固定穴１６４は円形であったが、多角形であってもよい。例えば、固定穴１６４は、正六角形であってもよい。このように構成すれば、固定穴１６４に突出部７９１ａを挿入した状態で、突出部７９１ａを熱カシメすると、突出部７９１ａが熱変形して固定穴１６４に密着するので、弾性部材１６は載置部７９に対して周方向の位置が規制される。すなわち、固定穴１６４は、弾性部材１６の回り止めとして機能する。 In the above form, the fixing hole 164 is circular, but it may be polygonal. For example, the fixing hole 164 may be a regular hexagon. With this configuration, when the protrusion 791a is heat-caulked with the protrusion 791a inserted in the fixing hole 164, the protrusion 791a is thermally deformed and comes into close contact with the fixing hole 164, so that the elastic member 16 is placed. The position in the circumferential direction is restricted with respect to the portion 79. That is, the fixing hole 164 functions as a detent for the elastic member 16.

上記形態では、弾性部材１６は、板バネであったが、コイルバネなどであってもよい。 In the above embodiment, the elastic member 16 is a leaf spring, but may be a coil spring or the like.

１…ポンプ装置、２…ケース、３…モータ、４…インペラ、５…ロータ、６…ステータ、７…樹脂封止部材、８…回路基板、８ａ…貫通穴、９…カバー部材、１０…磁石、１１…支持軸、１２…板部材、１５…熱伝達部材、１６…弾性部材、２０…ポンプ室、２１…吸入管、２１ａ…吸入口、２２…吐出管、２２ａ…吐出口、２３…対向壁、２４…側壁、４１…第１プレート、４２…羽根部、４３…第２プレート、５１…ホルダ、５２…小径部、５３…当接部、５４…大径部、５６…軸受、６１…ステータコア、６２…インシュレータ、６３…コイル、７１…第１隔壁部、７２…第２隔壁部、７３…第３隔壁部、７３ａ…孔部、７４…筒部、７５…小径部、７６…大径部、７７…フランジ部、７８…コネクタハウジング、７９…載置部、８１…電子素子、８２…コネクタピン、８３…グランド接続部、８４…グランド層、８５…係合部、９１ａ…開口部、９１…枠部材、９２…導電部材（放熱部材）、９３…シール部材、９４…溶着部、１６１…基部、１６２…先端部、１６３…接続部、１６４…固定穴、６２１…第１鍔部、６２２…第２鍔部、７６１…位置規制部、７９１…固定部材、７９１ａ…突出部、９１１…円環部、９１２…環状壁部、９１３…外面、９１４…内面内周部、９１５…内面外周部、９１６…位置決め部、９１７…位置決め凸部、９１８…段部、９１９…爪部、９１９ａ…変形部、９２１…遮蔽部、９２２…周壁部、９２３…フランジ部、９２４…平面部、９２５…対向部、９２６…切欠き部、９５１…溶着用凸部、９５２…溶着用凹部、Ｇ…ゲート痕、Ｌ…回転中心軸線、Ｌ１…一方側、Ｌ２…他方側、Ｓ…接触回避空間
1 ... pump device, 2 ... case, 3 ... motor, 4 ... impeller, 5 ... rotor, 6 ... stator, 7 ... resin sealing member, 8 ... circuit board, 8a ... through hole, 9 ... cover member, 10 ... magnet , 11 ... Support shaft, 12 ... Plate member, 15 ... Heat transfer member, 16 ... Elastic member, 20 ... Pump chamber, 21 ... Suction pipe, 21a ... Suction port, 22 ... Discharge pipe, 22a ... Discharge port, 23 ... Opposing Wall, 24 ... Side wall, 41 ... First plate, 42 ... Blade part, 43 ... Second plate, 51 ... Holder, 52 ... Small diameter part, 53 ... Contact part, 54 ... Large diameter part, 56 ... Bearing, 61 ... Stator core, 62 ... Insulator, 63 ... Coil, 71 ... First partition, 72 ... Second partition, 73 ... Third partition, 73a ... Hole, 74 ... Cylinder, 75 ... Small diameter, 76 ... Large diameter Part, 77 ... Flange part, 78 ... Connector housing, 79 ... Mounting part, 81 ... Electronic element, 82 ... Connector pin, 83 ... Ground connection part, 84 ... Ground layer, 85 ... Engagement part, 91a ... Opening part, 91 ... Frame member, 92 ... Conductive member (heat dissipation member), 93 ... Seal member, 94 ... Welding part, 161 ... Base part, 162 ... Tip part, 163 ... Connection part, 164 ... Fixing hole, 621 ... First flange part, 622 ... Second flange part, 761 ... Position regulation part, 791 ... Fixing member, 791a ... Protruding part, 911 ... Circular part, 912 ... Circular wall part, 913 ... Outer surface, 914 ... Inner surface inner peripheral part, 915 ... Inner surface outer circumference Part, 916 ... Positioning part, 917 ... Positioning convex part, 918 ... Step part, 919 ... Claw part, 919a ... Deformation part, 921 ... Shielding part, 922 ... Peripheral wall part, 923 ... Flange part, 924 ... Flat part, 925 ... Opposing part, 926 ... notch, 951 ... welding convex part, 952 ... welding concave part, G ... gate mark, L ... rotation center axis, L1 ... one side, L2 ... other side, S ... contact avoidance space

Claims

A rotor that rotates around the center axis of rotation,
With the stator arranged around the rotor,
An impeller arranged on one side in the axial direction in which the rotation center axis extends with respect to the rotor, and
A resin sealing member that covers the stator and has a tubular portion that opens on the other side in the axial direction.
A circuit board housed in the cylinder and provided with a ground connection,
A cover member provided with a conductive member while covering the tubular portion from the other side,
It has a conductive elastic member that is arranged between the circuit board and the conductive member and that elastically contacts the conductive member and the ground connection portion.
The resin sealing member includes a mounting portion on which the circuit board is mounted from the other side inside the tubular portion.
The pump device is characterized in that the elastic member is fixed to the previously described mounting portion together with the circuit board by a fixing member for fixing the circuit board to the previously described mounting portion.

In the pump device according to claim 1,
The cover member includes a resin frame member having an opening that opens in the axial direction, and the conductive member that covers the opening.
A pump device characterized in that a welding portion for joining the frame member and the cylinder portion is provided between the frame member and the cylinder portion.

In the pump device according to claim 1 or 2.
The above-mentioned placement portion is a pump device characterized in that it is arranged at the center in the radial direction of the cylinder portion.

In the pump device according to any one of claims 1 to 3.
The circuit board is provided with a through hole that overlaps with the previously described mounting portion when viewed from the axial direction.
The elastic member includes a fixing hole that overlaps with the through hole when viewed from the axial direction.
The pump device is a pump device characterized by being a caulking portion formed by thermally caulking the through hole and the tip of the projecting portion inserted into the fixing hole so as to project from the above-mentioned mounting portion to the other side. ..

In the pump device according to any one of claims 1 to 4.
The circuit board comprises an engaging portion that engages the tubular portion.
A pump device characterized in that the circuit board is positioned in the circumferential direction by engaging the engaging portion with the tubular portion.

In the pump device according to any one of claims 1 to 5.
The conductive member is a metal heat-dissipating member and is a heat-dissipating member.
A pump device characterized in that a transmission member in contact with the heat radiation member and an electronic element arranged on the circuit board is arranged between the heat radiation member and the circuit board.

In the pump device according to claim 6,
The elastic member is a pump device characterized by being a leaf spring made of metal.

In the pump device according to claim 6 or 7.
The circuit board includes a ground layer to which the ground connection portion is electrically connected.
The electronic element is a pump device characterized in that it is sandwiched between the heat radiating member and the ground layer.