JP2022080002A - Bus bar assembly and manufacturing method thereof - Google Patents

Abstract

To provide a framed planar type bus bar assembly.SOLUTION: A bus bar assembly comprises: a plurality of bus bars disposed within the same plane; a bus bar side insulation layer which includes a clearance filling part and a top face side lamination part and in which a top face side opening exposing top faces of the plurality of bus bars is provided in the top face side lamination part; and a frame including an annular frame main body in which a central hole is provided, and a frame side insulation layer covering an outer peripheral surface of the frame main body and fixed through the top face side lamination part to a top face of a bus bar connected body formed of the plurality of bus bars in a state where the top face side opening is positioned within the central hole in a planar view. In an opening opposed portion opposed to at least the top face side opening on an inner side face of the frame main body, a lower end at the other side in a plate thickness direction is most separated from a central position of the bus bar connected body in a planar direction among the other portions in the plate thickness direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to a bus bar assembly in which a plurality of bus bars are electrically insulated and mechanically connected, and a method for manufacturing the same.

A bus bar assembly having a plurality of bus bars that are electrically insulated from each other and mechanically connected to each other has been proposed and is used in various fields.

For example, a laminated bus bar assembly in which one flat plate-shaped bus bar and another flat-shaped bus bar are vertically laminated in a parallel state to each other has been proposed (see Patent Documents 1 and 2 below).

In the laminated bus bar assembly, the facing planes of one flat plate-shaped bus bar and the facing planes of the other flat plate-shaped bus bars are arranged so as to face each other with the insulating layer interposed therebetween, so that the reliability of insulation is sufficiently sufficient. There is a problem that it is difficult to secure.
In particular, if the thickness of the insulating layer between the one flat plate-shaped bus bar and the other flat plate-shaped bus bar is reduced in order to reduce the size in the vertical direction, a leak current may flow between the two bus bars.

In order to solve the problem of the laminated bus bar assembly, the applicant of the present application filed an application for a flat bus bar assembly in which the first and second bus bars of the conductive metal flat plate are arranged in parallel in the same plane, and patented. (See Patent Documents 3 and 4 below).

22 (a) shows a plan view of the flat plate type bus bar assembly 500, and FIG. 22 (b) shows a cross-sectional view taken along the line XXII (b) -XXII (b) in FIG. 22 (a). ..
Further, FIG. 23 shows a vertical cross-sectional view of a semiconductor module 600 in which a semiconductor element 110 such as an LED is mounted on the flat plate type bus bar assembly 500.

As shown in FIGS. 22 (a) and 22 (b) and FIG. 23, the plane-side bus bar assembly 500 is formed of a conductive flat plate-like member and is in the same plane with a gap 519 between facing side surfaces. The gap filling so as to cover the upper surface of the bus bar coupling body connected by the plurality of arranged bus bars 510, the gap filling portion 529 filled in the gap 519, and the gap filling portion 529 on one side in the plate thickness direction. An annular frame body 531 provided with a bus bar side insulating layer 520 including a bus bar side insulating layer 521 integrally extending from the portion 529 and a central hole 537 penetrating vertically, and a frame covering the outer peripheral surface of the frame body 531. It is provided with a frame body 530 having a body-side insulating layer 540.

In the illustrated embodiment, the bus bar assembly 500 has first to third bus bars 510 (1) to (3) as the plurality of bus bars 510, and the first and second bus bars 510 (1), (2) is juxtaposed via the first gap 519 (1), and the second and third bus bars 510 (2) and (3) are juxtaposed via the second gap 519 (2).
Then, the bus bar side insulating layer 520 serves as the gap filling portion 529, and the first and second gap filling portions 529 (1) filled in the first and second gaps 519 (1) and (2), respectively. Has (2).

In the planar bus bar assembly 500, a part of the first to third bus bars 510 (1) to (3) acts as an anode, and the rest acts as a cathode.

The first to third upper surface side openings 522 (1) to (3) expose at least a part of the upper surface of each of the first to third bus bars 510 (1) to (3) to the upper surface side laminated portion 521. ) Is provided.

A portion of the upper surface of the first bus bar 510 (1) exposed via the first upper surface side opening 522 (1) forms the upper surface side connecting portion 512 of the first bus bar 510 (1), and the second bus bar 510 (1) is formed. The portion of the upper surface of the bus bar 510 (2) exposed via the second upper surface side opening 522 (2) forms the upper surface side connecting portion 512 of the second bus bar 510 (2), and the third bus bar A portion of the upper surface of the 510 (3) exposed via the third upper surface side opening 522 (3) forms the upper surface side connecting portion 512 of the third bus bar 510 (3).

In the semiconductor module 600 shown in FIG. 23, the first and second bus bars 510 (1) and (2) are used as one of the anode and the cathode (for example, the anode), and the third bus bar 510 (3) is used. It is used as the other side of the anode and the cathode (for example, the cathode), and the first and second semiconductors such as LEDs are connected to the upper surface side connecting portions 512 of the first and second bus bars 510 (1) and (2), respectively. The elements 110 (1) and 110 (2) are mounted.

Specifically, each of the first and second semiconductor elements 110 includes an element main body 115 and an upper electrode layer 111 and a lower electrode layer 112 disposed on one side and the other side in the thickness direction of the element main body 115, respectively. Is assumed to have.

The lower electrode layer 112 of the first semiconductor element 110 (1) is fixed to the upper surface side connecting portion 512 of the corresponding first bus bar 510 (1), and the lower electrode layer of the second semiconductor element 110 (2) is fixed. The 112 is fixed to the upper surface side connecting portion 112 of the corresponding second bus bar 110 (2).

Then, the upper electrode layer 111 of the first semiconductor element 110 (1) is electrically connected to the upper surface side connecting portion 512 of the third bus bar 510 (3) via an electrical connecting member such as the first wire 120 (1). The upper electrode layer 111 of the second semiconductor element 110 (2) is electrically connected to the upper surface side connection portion 512 of the third bus bar 510 (3) via an electrical connection member such as the second wire 120 (2). Connected to.

In the illustrated embodiment, the bus bar side insulating layer 520 further includes a lower surface side laminated portion 523 that covers the lower surface of the bus bar connector on the other side in the plate thickness direction and a side surface side laminated portion that covers the side surface of the bus bar connector. It has 525, and the lower surface side laminated portion 523 exposes at least a part of the lower surface of each of the first to third bus bars 510 (1) to 510 (3) on the first to third lower surface side. The openings 524 (1) to (3) are provided.

A lower surface side connection portion 513 in which a portion of the lower surface of the first bus bar 510 (1) exposed via the first lower surface side opening 524 (1) acts as an external connection terminal of the first bus bar 510 (1). A lower surface side connection formed and exposed through the second lower surface side opening 524 (2) of the lower surface of the second bus bar 510 (2) acts as an external connection terminal of the second bus bar 510 (2). A portion of the lower surface of the third bus bar 510 (3) that forms the portion 513 and is exposed via the third lower surface side opening 524 (3) serves as an external connection terminal of the third bus bar 510 (2). The lower surface side connecting portion 513 that acts is formed.

As shown in FIG. 23, the frame 530 is a seal that protects the first and second semiconductor elements 110 (1) and (2) and the first and second wires 120 (1) and (2). It is a member for preventing the outflow and detachment of the resin body 130, and the bus bar is in a state where the first to third upper surface side openings 522 (1) to (3) are located in the central hole 537 in a plan view. It is fixed to the upper surface of the connecting body.

That is, the sealing resin body 130 is connected to the bus bar so as to surround the first and second semiconductor elements 110 (1) and (2) and the first and second wires 120 (1) and (2). It is formed by pouring an insulating resin onto the upper surface of the body and curing the insulating resin. The frame 530 prevents the insulating resin from flowing out before curing and seals the insulating resin after curing. It prevents the resin body 130 from being detached from the bus bar assembly 500.

The Patent Document 4 describes a manufacturing method (hereinafter, referred to as a conventional manufacturing method) capable of efficiently manufacturing the flat bus bar assembly 500 with a frame.
Hereinafter, the conventional manufacturing method will be described.

The conventional manufacturing method has a frame body forming process for forming the frame body 530.
FIG. 24A shows a plan view of the flat plate 700 for a frame used in the conventional manufacturing method.
The frame body forming process includes a step of preparing the frame body flat plate 700 made of a conductive metal including a frame body forming region 710 having a non-planar shape and a thickness corresponding to the frame body main body 531 and the frame body. It has a central hole forming step of forming the central hole 537 in the forming region 710 to form an annular body 720 corresponding to the frame body 531.
Note that FIG. 24A shows the state after the central hole forming step.

As shown in FIG. 24A, the frame body flat plate 700 is a frame body row 705 along the first direction (Y direction in FIG. 24) of the XY plane in which the frame body flat plate 700 is located. have.

The frame body row 705 includes a plurality of (five in the illustrated form) frame body forming regions 710 and the plurality of frame body forming regions 710 arranged in series along the first direction of the XY plane. It has a plurality of (six in the illustrated form) frame-side connecting pieces 730 that are integrally connected.

FIG. 24 (b) shows a cross-sectional view taken along the line XXIV (b) -XXIV (b) in FIG. 24 (a).
As shown in FIG. 24 (b), in the conventional manufacturing method, the central hole 537 formed by the central hole forming step has the same opening diameter over the entire plate thickness direction of the frame body forming region 710. (Same opening width).

The frame body forming process further includes a frame body side coating step of applying the frame body side insulating resin paint 740 that forms the frame body side insulating layer 540 on the outer peripheral surface of the annular body 720.
FIG. 25 shows a plan view of the flat plate 700 for the frame after the coating step on the frame side.

The conventional manufacturing method has a bus bar forming process performed before or after the frame forming process, or in parallel with the frame forming process.

FIG. 26 shows a plan view of the bus bar flat plate 650 used in the conventional manufacturing method.
The bus bar forming process includes a step of preparing the flat plate 650 for the bus bar made of conductive metal.
Note that FIG. 26 shows the state after the slit forming step below.

As shown in FIG. 26, the bus bar flat plate 650 has a bus bar row 655 along a first direction (Y direction in FIG. 26 below) of the XY plane in which the bus bar flat plate 650 is located. ..

The bus bar row 655 has a non-planar shape corresponding to the bus bar connector and has the same thickness as the bus bars 510 (the first to third bus bars 510 (1) to (3)), and the frame. A plurality of (five in the illustrated embodiment) bus bar forming regions 660 arranged in series with the frame forming region 710 along the same direction as the body row 705 (Y direction of the XY plane). It has a plurality of (six in the illustrated embodiment) bus bar side connecting pieces 680 for integrally connecting the plurality of bus bar forming regions 660.

The bus bar forming process has a slit forming step.
In the slit forming step, the first and second slits 669 (1) penetrating the bus bar forming region 660 in the plate thickness direction and having the same width as the first and second gaps 519 (1) and (2). , 669 (2) are formed, and the bus bar forming region 660 is formed from a plurality of first to third bus bar forming sites 670 (1) to (3) corresponding to the first to third bus bars 510 (1) to (3). It is configured to be partitioned into 3).

As shown in FIG. 26, the first and second slits 669 (1) and (2) formed in one bus bar forming region 660 in the slit forming step have one bus bar forming region 660 on one end side in the longitudinal direction. Extends into the bus bar side connecting piece 680 connected to one side (for example, the lower side in FIG. 26) of the first direction (Y direction in the illustrated embodiment), and the other end side in the longitudinal direction is the one bus bar forming region. It extends into the busbar side connecting piece 680 articulated to the other side of the 660 in the first direction (eg, the upper side in FIG. 26).

The bus bar forming process further comprises a bus bar side coating step of applying a bus bar side insulating resin paint 690 that forms the bus bar side insulating layer 520 in the first and second slits 669 and on the outer peripheral surface of the bus bar forming region 660. have.
FIG. 27 shows a plan view of the bus bar flat plate 650 after the bus bar side coating step.

The conventional manufacturing method further includes a plate fixing step of fixing the bus bar flat plate 650 and the frame flat plate 700 in a state where the frame body forming region 710 is polymerized on the bus bar forming region 660.
FIG. 28 shows a plan view of the bus bar flat plate 650 and the frame flat plate 700 after the flat plate fixing step.

The conventional manufacturing method further includes a laser light irradiation step executed after the plate fixing step.
FIG. 29 shows a plan view of the frame flat plate 700 and the bus bar flat plate 650 after the laser light irradiation step.

As shown in FIG. 29, the laser light irradiation step is applied to the upper surface of the bus bar forming region 660 to form the upper surface side laminated portion 521 (see FIGS. 22 (a), 22 (b) and 23). Of the bus bar side insulating resin paint 690, the regions where the first to third upper surface side openings 522 (1) to (3) should be formed (the first to third upper surface sides in FIGS. 30 (a) and 30 (b) below). The opening forming regions 522a (1) to (3)) are irradiated with laser light 290 to form the first to third upper surface side openings 522 (1) to (3).

However, in the conventional bus bar assembly 500, there is a possibility that a part of the bus bar side insulating resin paint 690 to be removed remains as a residue 695 in the upper surface side opening 522.

In the laser light irradiation step, the bus bar side insulating resin is applied to the lower surface of the bus bar forming region 660 to form the lower surface side laminated portion 523 (see FIGS. 22 (a), 22 (b) and 23). Of the paint 690, the regions where the first to third lower surface side openings 524 (1) to (3) should be formed (the first to third lower surface side opening forming regions 524a in FIGS. 30A and 30B below) ( It also has a process of irradiating 1) to (3) with a laser beam 290 to form the first to third lower surface side openings 524 (1) to (3).

FIG. 30 (a) shows a vertical cross-sectional view of the frame body forming region 710 and the bus bar forming region 660 after the plate fixing step along the XXX (a) -XXX (a) line in FIG. 28.

In the flat plate fixing step, the frame body forming region 710 is covered with the bus bar in a state where the frame body side insulating resin paint 740 is completely cured but the bus bar side insulating resin paint 690 is semi-cured. By crimping to the forming region 660 and completely curing the semi-cured bus bar side insulating resin paint 690, the frame flat plate 700 and the bus bar flat plate 650 are fixed.

Therefore, as shown in FIG. 30 (a), when the frame body forming region 710 is crimped to the upper surface of the bus bar forming region 660, the frame of the bus bar side insulating resin paint 690 in a semi-cured state. A part of the portion located directly below the body forming region 710 protrudes toward the inner side surface side of the frame forming region 710 (that is, in the direction of the central hole 537), and as a result, the frame forming region 710 In the lower end region of the inner side surface, the thickness of the bus bar side insulating layer 520 may be locally thickened (hereinafter, the portion where this thickness is thickened is referred to as a large film thickness portion 527).

FIG. 30B shows a vertical cross-sectional view of the frame body forming region 710 and the bus bar forming region 660 in a state where the laser beam 290 in the laser light irradiation step is schematically displayed.
Further, FIG. 30 (c) shows a vertical cross-sectional view of the frame forming region 710 and the bus bar forming region 660 after the laser light irradiation step along the XXX (c) -XXX (c) lines in FIG. 29. ..

Here, when the large film thickness portion 527 extends to the upper surface side opening forming region (the first and third upper surface side opening forming regions 522a (1), (3)) facing each other, FIG. 22 (a). ), FIG. 22 (b), FIG. 23 and FIG. 30 (c), in the first and third upper surface side openings 522a (1) and (3) that should be originally removed in the laser light irradiation step. The inconvenience that a part of the bus bar side insulating resin coating material 690 is left behind as a residue 695 may occur.

In particular, the bus bar assembly 500 is desired to be miniaturized in the plane direction as well, and in order to reduce the size in the plane direction as much as possible, the bus bar assembly 500 is provided with the upper surface side opening 522 facing the inner side surface of the frame body 531. It is desirable to reduce the planar distance between them.
However, if the distance in the plane direction between the inner side surface of the frame body 531 and the upper surface side opening 522 facing the frame body body 531 is narrowed, the inconvenience is likely to occur.

In FIG. 30D, the frame forming region in a state where the first and second semiconductor elements 110 (1) and (2) are mounted on the upper surface side connecting portion 512 exposed by the upper surface side opening 522. A vertical sectional view of the 710 and the bus bar forming region 660 is shown.
Further, FIG. 31 shows an enlarged view of the XXXI portion in FIG. 30 (d).

As shown in FIGS. 30 (d) and 31, the presence of the residue 695 may lead to poor contact of the semiconductor element 110 (1) mounted on the upper surface side connection portion 512.

Japanese Patent No. 4432913 Japanese Patent No. 6487769 Japanese Patent No. 6637002 Japanese Patent No. 6637003

In the present invention, a plurality of bus bars arranged in parallel in the same plane, a gap filling portion filled in the gap between adjacent bus bars, and a bus bar connection in which the plurality of bus bars are connected by the gap filling portion. A bus bar-side insulating layer including an upper surface-side laminated portion that covers the upper surface of the body, and the upper surface-side laminated portion is provided with one or a plurality of upper surface-side openings that expose at least a part of the upper surface of each of the plurality of bus bars. It has an annular frame body provided with a central hole penetrating in the plate thickness direction and a frame side insulating layer covering the outer peripheral surface of the frame body, and the upper surface side opening is inside the central hole in a plan view. It is a bus bar assembly provided with a frame body fixed to the peripheral edge of the upper surface of the bus bar connecting body so as to be located, and it is effective to generate a residue of the bus bar side insulating layer to be removed in the opening on the upper surface side. It is an object of the present invention to provide a bus bar assembly that can be prevented or reduced, and a method for manufacturing the bus bar assembly.

In order to achieve the above object, the present invention is formed by a plurality of bus bars formed by a conductive flat plate-like member and arranged in the same plane with a gap between facing side surfaces, and the gap is filled. The gap filling portion and the upper surface side laminated portion covering the upper surface on one side in the plate thickness direction of the bus bar connecting portion connected by the gap filling portion are included, and the upper surface side laminated portion includes the upper surface of each of the plurality of bus bars. An annular frame body provided with a bus bar side insulating layer provided with one or more upper surface side openings for exposing at least a part thereof, a central hole penetrating in the plate thickness direction, and an outer peripheral surface of the frame body. A frame having an insulating layer on the frame side to cover, and the one or a plurality of upper surface side openings are fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion in a state where the one or more upper surface side openings are located in the central hole in a plan view. The frame body includes an upper surface and a lower surface facing one side and the other side in the plate thickness direction, an inner side surface facing the central hole, and an outer surface located on the opposite side of the central hole. At least in the opening facing portion of the inner side surface facing the upper surface side opening, the lower end portion on the other side in the plate thickness direction is the center of the plan view of the bus bar connection rather than the other portion in the plate thickness direction. Provides the busbar assembly that is most distanced from position in the plane direction.

In the first aspect of the bus bar assembly according to the present invention, at least the opening facing portion of the inner side surface is a plane distance from the center position of the bus bar connection in the plan view from one side to the other in the plate thickness direction. Is considered to be an inclined surface that becomes large.

In the first aspect, preferably, the entire inner surface thereof is the inclined surface, and the central hole is a reverse tapered hole whose diameter is expanded from one side to the other side in the plate thickness direction of the frame body body. To.

In the second aspect of the bus bar assembly according to the present invention, at least the opening facing portion of the inner side surface is an upper plate thickness direction extending surface extending from the upper surface of the frame body to the other side in the plate thickness direction, and the above. A plate surface extending surface extending along the plate surface direction from the other end of the side plate thickness direction extending portion to the side opposite to the plan-view center position of the bus bar connecting body, and the plate thickness direction extending portion. It is assumed to have a lower plate thickness direction extending surface extending from an end portion on the surface opposite to the plan view center position to the other side in the plate thickness direction.

In the second aspect, it is preferable that the entire inner surface surface has the upper plate thickness direction extending surface, the plate surface direction extending surface, and the lower plate thickness direction extending surface, and the central hole is formed. A small diameter hole extending from the upper surface of the frame body to the other side in the plate thickness direction and ending within the plate thickness of the frame body body, and extending from the other end of the small diameter hole in the plate thickness direction to the other side in the plate thickness direction. It is a stepped hole having a large-diameter hole that reaches the lower surface of the frame body.

In the third aspect of the bus bar assembly according to the present invention, at least the opening facing portion of the inner side surface extends from the upper surface of the frame body to the other side in the plate thickness direction along the plate thickness direction. An inclined surface in which the distance in the plane direction increases from the other end of the upper plate thickness direction extending portion to the other side in the plate thickness direction of the existing surface and the center position in the plan view of the bus bar connecting body. Is assumed to have.

In the third aspect, it is preferable that the entire inner surface surface has the upper plate thickness direction extending surface and the inclined surface, and the central hole is the other side in the plate thickness direction from the upper surface of the frame body body. A composite hole having a small diameter hole extending to and ending within the plate thickness of the frame body, and a reverse taper hole whose diameter is expanded from the other end of the small diameter hole in the plate thickness direction to the other side in the plate thickness direction. Will be done.

Further, in the present invention, a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between the facing side surfaces, a gap filling portion filled in the gap, and the said The upper surface side laminated portion covering the upper surface on one side in the plate thickness direction of the bus bar connecting portion connected by the gap filling portion is included, and at least a part of the upper surface of each of the plurality of bus bars is exposed to the upper surface side laminated portion. An annular frame body and the frame provided with a bus bar-side insulating layer provided with one or more upper surface-side openings, and a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction. It has a frame-side insulating layer that covers the outer peripheral surface of the body body, and in a state where the one or more upper surface-side openings are located in the central hole in a plan view, the upper surface of the bus bar connector is interposed via the upper surface-side laminated portion. A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, which is a method of manufacturing a bus bar assembly provided with a frame body fixed to the bus bar. Then, one or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is formed into a plurality of bus bar forming portions corresponding to the plurality of bus bars. A step of forming a slit to be partitioned, a step of applying a bus bar side insulating resin paint for forming the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region, and a step of preparing the flat plate for the bus bar. This is a frame body forming process performed before, after, or in parallel with the bus bar side coating step, and is a frame body flat plate including a frame body forming region having a plan out-of-sight shape corresponding to the frame body body. The step of forming the central hole in the frame forming region to form an annular body corresponding to the frame body, and the frame-side insulating layer on the outer peripheral surface of the annular body. The frame forming process including the frame-side coating step of applying the frame-side insulating resin paint to be formed, and the frame-forming in a semi-cured state at least one of the bus bar-side insulating resin paint and the frame-side insulating resin paint. A plate fixing step of fixing the bus bar flat plate and the frame flat plate by crimping the lower surface of the region to the upper surface of the bus bar forming region and completely curing the semi-cured insulating resin paint, and the bus bar fixing step. One or more of the upper surface side laminated portions in the side insulating layer are irradiated with laser light to the upper surface side opening forming region where the upper surface side opening is to be formed. The central hole is provided with a laser light irradiation step of providing an opening on the upper surface side, and the central hole is a reverse tapered hole whose diameter is expanded from one side to the other in the plate thickness direction of the frame body, and the central hole forming diameter step is provided. Is a method for manufacturing a bus bar assembly, which is configured to prepare a tapered punch corresponding to a reverse tapered hole and press the punch from the lower surface side to the upper surface side of the frame body forming region. offer.

Further, in the present invention, a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between the facing side surfaces, a gap filling portion filled in the gap, and the said The upper surface side laminated portion covering the upper surface on one side in the plate thickness direction of the bus bar connecting portion connected by the gap filling portion is included, and at least a part of the upper surface of each of the plurality of bus bars is exposed to the upper surface side laminated portion. An annular frame body and the frame provided with a bus bar-side insulating layer provided with one or more upper surface-side openings, and a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction. It has a frame-side insulating layer that covers the outer peripheral surface of the body body, and in a state where the one or more upper surface-side openings are located in the central hole in a plan view, the upper surface of the bus bar connector is interposed via the upper surface-side laminated portion. A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, which is a method of manufacturing a bus bar assembly provided with a frame body fixed to the bus bar. Then, one or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is formed into a plurality of bus bar forming portions corresponding to the plurality of bus bars. A step of forming a slit to be partitioned, a step of applying a bus bar side insulating resin paint for forming the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region, and a step of preparing the flat plate for the bus bar. This is a frame body forming process performed before, after, or in parallel with the bus bar side coating step, and is a frame body flat plate including a frame body forming region having a plan out-of-sight shape corresponding to the frame body body. The step of forming the central hole in the frame forming region to form an annular body corresponding to the frame body, and the frame-side insulating layer on the outer peripheral surface of the annular body. The frame forming process including the frame-side coating step of applying the frame-side insulating resin paint to be formed, and the frame-forming in a semi-cured state at least one of the bus bar-side insulating resin paint and the frame-side insulating resin paint. A plate fixing step of fixing the bus bar flat plate and the frame flat plate by crimping the lower surface of the region to the upper surface of the bus bar forming region and completely curing the semi-cured insulating resin paint, and the bus bar fixing step. One or more of the upper surface side laminated portions in the side insulating layer are irradiated with laser light to the upper surface side opening forming region where the upper surface side opening is to be formed. A laser light irradiation step of providing an opening on the upper surface side is provided, and the central hole extends from the upper surface on one side in the plate thickness direction of the frame body to the other side in the plate thickness direction and ends within the plate thickness of the frame body. A stepped hole having a small-diameter hole and a large-diameter hole extending from the other end of the small-diameter hole to the other side in the plate-thickness direction and reaching the lower surface of the frame body is formed, and the central hole forming step is performed. A two-stage punch having a large-diameter portion having an outer diameter corresponding to the large-diameter hole and a small-diameter portion extending from the large-diameter portion to the tip side and having an outer-diameter small-diameter portion corresponding to the small-diameter hole. Provided is a method for manufacturing a bus bar assembly configured to press the two-stage punch from the lower surface side to the upper surface side of the frame body forming region.

Further, in the present invention, a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between the facing side surfaces, a gap filling portion filled in the gap, and the said The upper surface side laminated portion covering the upper surface on one side in the plate thickness direction of the bus bar connecting portion connected by the gap filling portion is included, and at least a part of the upper surface of each of the plurality of bus bars is exposed to the upper surface side laminated portion. An annular frame body and the frame provided with a bus bar-side insulating layer provided with one or more upper surface-side openings, and a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction. It has a frame-side insulating layer that covers the outer peripheral surface of the body body, and in a state where the one or more upper surface-side openings are located in the central hole in a plan view, the upper surface of the bus bar connector is interposed via the upper surface-side laminated portion. A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, which is a method of manufacturing a bus bar assembly provided with a frame body fixed to the bus bar. Then, one or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is formed into a plurality of bus bar forming portions corresponding to the plurality of bus bars. A step of forming a slit to be partitioned, a step of applying a bus bar side insulating resin paint for forming the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region, and a step of preparing the flat plate for the bus bar. This is a frame body forming process performed before, after, or in parallel with the bus bar side coating step, and is a frame body flat plate including a frame body forming region having a plan out-of-sight shape corresponding to the frame body body. The step of forming the central hole in the frame forming region to form an annular body corresponding to the frame body, and the frame-side insulating layer on the outer peripheral surface of the annular body. The frame forming process including the frame-side coating step of applying the frame-side insulating resin paint to be formed, and the frame-forming in a semi-cured state at least one of the bus bar-side insulating resin paint and the frame-side insulating resin paint. A plate fixing step of fixing the bus bar flat plate and the frame flat plate by crimping the lower surface of the region to the upper surface of the bus bar forming region and completely curing the semi-cured insulating resin paint, and the bus bar fixing step. One or more of the upper surface side laminated portions in the side insulating layer are irradiated with laser light to the upper surface side opening forming region where the upper surface side opening is to be formed. A laser light irradiation step of providing an opening on the upper surface side is provided, and the central hole extends from the upper surface on one side in the plate thickness direction of the frame body to the other side in the plate thickness direction and ends within the plate thickness of the frame body. It is a composite hole having a small-diameter hole and a reverse-tapered hole whose diameter is increased from the other end of the small-diameter hole in the plate-thickness direction toward the other side in the plate-thickness direction. A two-stage punch having a corresponding tapered portion and a small diameter portion extending from the tapered portion to the tip side and having an outer diameter corresponding to the small diameter hole is prepared, and the frame body forming region is prepared. A method for manufacturing a bus bar assembly configured to press the two-stage punch from the lower surface side to the upper surface side.

Preferably, the bus bar side coating step is configured to apply the bus bar side insulating resin paint to the lower surface of the bus bar forming region, and the laser light irradiation step is formed by the bus bar side insulating resin paint. It is configured to provide one or a plurality of lower surface side openings by irradiating the lower surface side opening forming region of the lower surface side laminated portion with laser light to expose at least a part of the lower surface of each of the plurality of bus bar forming portions. Ru.

Preferably, the bus bar flat plate integrally has a plurality of the bus bar forming regions arranged in series in the first direction along the longitudinal direction of the slit and a connecting region connecting the adjacent bus bar forming regions. It is supposed to be.

In this case, the slit formed in the one bus bar forming region extends into the connecting region in which one end side in the longitudinal direction is connected to one side in the first direction of the one bus bar forming region and the other end side in the longitudinal direction is the one bus bar. It is assumed to extend into the connecting region connected to the other side of the first direction of the forming region.

The frame flat plate connects a plurality of frame forming regions arranged in series in the first direction at the same pitch as the plurality of bus bar forming regions and the frame forming region adjacent to the first direction. It is assumed to have an integral connection area.

In the method for manufacturing a bus bar assembly according to the present invention, a semiconductor element is further mounted on the upper surface of a predetermined bus bar among the upper surfaces of the plurality of bus bars exposed by the one or more upper surface side openings after the flat plate fixing step. A semiconductor device mounting process may be provided.

The method for manufacturing a bus bar according to the present invention may further include a cutting step of cutting the bus bar forming region and the frame forming region from the bus bar flat plate and the frame flat plate after the semiconductor element mounting step.

In the bus bar assembly according to the present invention, a plurality of bus bars arranged in parallel in the same plane, a gap filling portion filled in the gap between the adjacent bus bars, and the plurality of bus bars are connected by the gap filling portion. The upper surface side laminated portion includes an upper surface side laminated portion covering the upper surface of the bus bar connecting body, and the upper surface side laminated portion is provided with one or a plurality of upper surface side openings for exposing at least a part of the upper surface of each of the plurality of bus bars. It has an insulating layer on the bus bar side, an annular frame body provided with a central hole penetrating in the plate thickness direction, and a frame side insulating layer covering the outer peripheral surface of the frame body, and the upper surface side opening is the above in plan view. The frame body is provided with a frame body fixed to the peripheral edge of the upper surface of the bus bar connecting body so as to be located in the central hole, and the frame body body faces at least the upper surface side opening of the inner side surface facing the central hole. In the opening facing portion, the lower end portion on the other side in the plate thickness direction is configured to be farthest from the center position in the plan view of the bus bar connection in the plane direction than the other portion in the plate thickness direction. It is possible to effectively prevent or reduce the large film thickness portion of the insulating layer that may occur at the lower end of the inner side surface of the frame body from extending into the upper surface side opening, whereby the insulating layer is formed in the upper surface side opening. It is possible to effectively prevent or reduce the formation of a residue.

1 (a) to 1 (c) are a plan view of a bus bar assembly according to an embodiment of the present invention, a cross-sectional view taken along the line I (b) -I (b) in FIG. 1 (a), and FIGS. It is sectional drawing along the line I (c) -I (c) in FIG. 1 (a). FIG. 2 is a vertical sectional view of a semiconductor module in which a semiconductor element such as an LED is mounted on the bus bar assembly. FIG. 3 is an enlarged view of part III in FIG. 1 (b). 4 (a) to 4 (c) are a plan view of the bus bar assembly according to the first modification of the above embodiment, IV (b) -IV (b) lines in FIG. 4 (a), and FIG. 4 (c), respectively. It is sectional drawing along the IV (c) -IV (c) line in a). FIG. 5 is a plan view of a flat plate for a bus bar used in the first manufacturing method for manufacturing the bus bar assembly according to the embodiment. FIG. 6 is a plan view of the flat plate for the bus bar after the slit forming step in the first manufacturing method. 7 (a) and 7 (b) are a plan view of the flat plate for the bus bar after the bus bar side coating step in the first manufacturing method and lines VII (b) to VII (b) in FIG. 7 (a), respectively. It is a cross-sectional view along. FIG. 8 is. It is a top view of the flat plate for a frame body used in the said 1st manufacturing method. 9 (a) and 9 (b) are a plan view of the flat plate for the frame body after the central hole forming step in the first manufacturing method, and IX (b) -IX (b) lines in FIG. 9 (a), respectively. It is a cross-sectional view along. 10 (a) to 10 (c) are schematic process diagrams of the central hole forming step. FIG. 11 is a plan view of the frame body flat plate after the frame body side coating step in the first manufacturing method. 12 (a) is a plan view of the flat plate for a frame body and the flat plate for a bus bar after the flat plate fixing step in the first manufacturing method, and FIG. 12 (b) is an XII (b) in FIG. 12 (a). )-A cross-sectional view taken along line XII (b). FIG. 13 is a plan view of the frame flat plate and the bus bar flat plate after the laser light irradiation step in the first manufacturing method. 14 (a) and 14 (b) are an enlarged view of part XIV (a) in FIG. 13 and a cross-sectional view taken along the line XIV (b) -XIV (b) in FIG. 14 (a), respectively. FIG. 15 (a) is a vertical cross-sectional view of the flat plate for a frame body and the flat plate for a bus bar after the flat plate fixing step and before the laser light irradiation step, and is a vertical cross-sectional view corresponding to FIG. 12 (b). be. FIG. 15B is a vertical cross-sectional view of the frame flat plate and the bus bar flat plate in a state where the laser light in the laser light irradiation step is schematically displayed. FIG. 15C is a vertical cross-sectional view of the frame flat plate and the bus bar flat plate after the laser light irradiation step. FIG. 15D is a vertical cross-sectional view of the frame flat plate and the bus bar flat plate in a state where the first and second semiconductor elements are mounted. FIG. 16 is a vertical cross-sectional view of the bus bar assembly according to the second modification of the embodiment. 17 (a) and 17 (b) are a plan view of a flat plate for a frame used in the second manufacturing method for manufacturing the bus bar assembly according to the second modification, respectively, and XVII (b) in FIG. 17 (a). -It is a cross-sectional view along the line XVII (b). 18 (a) to 18 (c) are schematic process diagrams of the central hole forming step in the second manufacturing method. FIG. 19 is a vertical cross-sectional view of the bus bar assembly according to the third modification of the embodiment. 20 (a) and 20 (b) are a plan view of a flat plate for a frame used in the third manufacturing method for manufacturing the bus bar assembly according to the third modification, respectively, and XX (b) in FIG. 20 (a). -It is a cross-sectional view along the line XX (b). 21 (a) to 21 (c) are schematic process diagrams of the central hole forming step in the third manufacturing method. 22 (a) and 22 (b) are a plan view of the conventional bus bar assembly and a cross-sectional view taken along the line XXII (b) -XXII (b) in FIG. 22 (a), respectively. FIG. 23 is a vertical sectional view of a semiconductor module in which a semiconductor element such as an LED is mounted on a conventional bus bar assembly. FIG. 24 (a) is a flat plate for a frame used in a conventional manufacturing method for manufacturing a conventional bus bar assembly, and is a plan view of the flat plate for the frame after the central hole forming step in the conventional manufacturing method. .. FIG. 24 (b) is a cross-sectional view taken along the line XXIV (b) -XXIV (b) in FIG. 24 (a). FIG. 25 is a plan view of the flat plate for the frame after the frame side coating step in the conventional manufacturing method. FIG. 26 is a plan view of a flat plate for a bus bar used in the conventional manufacturing method, and shows a state after the slit forming step in the conventional manufacturing method. FIG. 27 is a plan view of the flat plate for the bus bar after the bus bar side coating step in the conventional manufacturing method. FIG. 28 is a plan view of the bus bar flat plate and the frame flat plate after the flat plate fixing step in the conventional manufacturing method. FIG. 29 is a plan view of the frame flat plate and the bus bar flat plate after the laser light irradiation step in the conventional manufacturing method. FIG. 30 (a) shows a frame body forming region of the frame body flat plate after the plate fixing step and a bus bar forming region of the bus bar flat plate along the XXX (a) -XXX (a) line in FIG. 28. It is a vertical sectional view. FIG. 30B is a vertical cross-sectional view of the frame body forming region and the bus bar forming region in a state where the laser beam in the laser light irradiation step is schematically displayed. FIG. 30 (c) is a vertical cross-sectional view of the frame body forming region and the bus bar forming region after the laser light irradiation step along the XXX (c) -XXX (c) lines in FIG. 29. FIG. 30D is a vertical cross-sectional view of the frame body forming region and the bus bar forming region in a state where the first and second semiconductor elements are mounted. FIG. 31 is an enlarged view of the XXXI portion in FIG. 30 (d).

Hereinafter, an embodiment of the bus bar assembly according to the present invention will be described with reference to the accompanying drawings.
FIG. 1A shows a plan view of the bus bar assembly 1 according to the present embodiment.
Further, FIGS. 1 (b) and 1 (c) show cross-sectional views taken along the lines I (b) -I (b) and I (c) -I (c) in FIG. 1 (a), respectively.
Further, FIG. 2 shows a vertical cross-sectional view of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted on the bus bar assembly 1.

As shown in FIGS. 1 (a) to 1 (c) and FIG. 2, the bus bar assembly 1 is formed of a conductive flat plate-like member, and is parallel in the same plane with a gap 19 between facing side surfaces 15. A plurality of arranged bus bars 10, a gap filling portion 29 filled in the gap 19, and the plurality of bus bars 10 are connected by the gap filling portion 29, and the upper surface side stacking is arranged on the upper surface of the bus bar connecting body. It has a bus bar side insulating layer 20 including a portion 21, an annular frame body 31 provided with a central hole 37 penetrating in the plate thickness direction, and a frame side insulating layer 40 covering the outer peripheral surface of the frame body 31. It includes a frame body 30 fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion 21.

The bus bar 10 is formed of a conductive metal such as Cu.
The bus bar assembly 1 according to the present embodiment has three bus bars of the first to third bus bars 10 (1) to 10 (3) as the plurality of bus bars 10, and the gap 19 is the first. It has 1 and 2nd gaps 19 (1) and 19 (2).

That is, the bus bar assembly 1 includes the first bus bar 10 (1) and the second bus bar 10 (2) arranged adjacent to the first bus bar 10 (1) via the first gap 19 (1). It has a third bus bar 10 (3) arranged adjacent to the second bus bar 10 (2) via the second gap 19 (2).

Each of the bus bars 10 (1) to 10 (3) has an upper surface 11 and a lower surface 12 facing one side and the other side in the thickness direction, respectively, and a side surface 15 connecting the upper surface 11 and the lower surface 13. The side surfaces 15 of the adjacent bus bars 10 are opposed to each other via the gap 19.

The bus bar-side insulating layer 20 is formed of an insulating resin coating film having heat resistance and insulating properties such as polyamide-imide, polyimide, polyamide, and epoxy, and preferably using Insuled (registered trademark). It is formed.

The upper surface side laminated portion 21 is provided with one or more upper surface side openings 22 for exposing at least a part of the upper surface of each of the first to third bus bars 10 (1) and 10 (2).
In the present embodiment, as shown in FIGS. 1 and 2, a part of the upper surface of the first to third bus bars 10 (1) to 10 (3) is exposed to the upper surface side laminated portion 21, respectively. The first to third upper surface side openings 22 (1) to 22 (3) are provided.

Instead of this, a single unit that integrally exposes a part of the upper surface 11 of the plurality of bus bars 10 (the first to third bus bars 10 (1) to (3)) to the upper surface side laminated portion 21. It is also possible to provide an opening on the upper surface side.

Of the upper surfaces 11 of the first to third bus bars 10 (1) to (3), the upper surface side opening (in the present embodiment, the first to third upper surface side openings 22 (1) to (3)). The portion exposed through the above forms the upper surface side connecting portion 12.

As shown in FIG. 2, the upper surface side connecting portion 12 acts as an element connecting portion to which a semiconductor element 110 such as an LED mounted on the bus bar assembly 1 is mounted or electrically connected.

A part of the first to third bus bars 10 (1) to 10 (3) acts as a first electrode (for example, an anode) which is one of an anode and a cathode, and the first to third bus bars 10 (1) to The rest of 10 (3) acts as a second electrode (eg, cathode) that is the other of the anode and cathode.

In the semiconductor module 101 shown in FIG. 2, the first and second bus bars 10 (1) and 10 (2) act as the first electrode, and the third bus bar 10 (3) acts as the second electrode. ..

That is, in the semiconductor module 101, the first and second bus bars 10 (1) and 10 (2) acting as the first electrodes are the first and second semiconductor elements 110 (1) and 110 (2), respectively. ) Is installed.

Specifically, each of the first and second semiconductor elements 110 (1) and 110 (2) has an upper electrode layer 111 and a lower electrode layer 112 on the upper surface on one side in the thickness direction and the lower surface on the other side in the thickness direction, respectively. It has an element body 115 between the upper electrode layer 111 and the lower electrode layer 112.

In the semiconductor module 101, the lower electrode layer 112 of the first semiconductor element 110 (1) is electrically fixed to the upper surface side connecting portion 12 of the first bus bar 10 (1) in an electrically connected state, and the first is described. 2 The lower electrode layer 112 of the semiconductor element 110 (2) is electrically connected to the upper surface side connecting portion 12 of the second bus bar 10 (2) in a connected state.

Then, the upper electrode layers 111 of the first and second semiconductor elements 110 (1) and 110 (2) serve as second electrodes via the first and second wires 120 (1) and 120 (2), respectively. It is electrically connected to the upper surface side connecting portion 12 of the third bus bar 10 (3) that acts.

Preferably, a plating layer (not shown) is provided on the upper surfaces of the first to third bus bars 10 (1) to 10 (3).

In this case, the lower electrode layers 112 of the first and second semiconductor elements 110 (1) and 110 (2) are the upper surface connecting portions of the first and second bus bars 10 (1) and 10 (2), respectively. The upper electrode layers 111 of the first and second semiconductor elements 110 (1) and 110 (2) are die-bonded to the plating layer of 12, and the upper electrode layers 111 of the first and second semiconductor elements 110 (1) and 110 (2) are respectively the upper surface connecting portion 12 of the third bus bar 10 (3). The first and second wires 120 (1) and 120 (2) are wire-bonded to the plating layer (not shown).

At least a part of the lower surface 13 of each of the first to third bus bars 10 (1) and 10 (2) is exposed to form the lower surface side connecting portion 14.

In the present embodiment, as shown in FIG. 1 (b), the bus bar side insulating layer 20 has a lower surface side laminated portion 23 that covers the lower surface of the bus bar connecting body, and the lower surface side laminated portion 23. Is provided with first to third lower surface side openings 24 (1) to (3) that expose a part of the lower surfaces 13 of the first to third bus bars 10 (1) to (3), respectively.

Instead of this, a single unit that integrally exposes a part of the lower surface 13 of the plurality of bus bars 10 (the first to third bus bars 10 (1) to (3)) to the lower surface side laminated portion 23. It is also possible to provide an opening on the lower surface side.

Of the lower surfaces 13 of the first to third bus bars 10 (1) to 10 (3), the lower surface side opening (in the present embodiment, the first to third lower surface side openings 24 (1) to (3)). ), Which forms the lower surface side connecting portion 14.
The lower surface side connecting portion 14 acts as an external connection terminal for electrically connecting the corresponding bus bars 10 (1) to 10 (3) to the outside.

In the present embodiment, the bus bar side insulating layer 20 covers the side surface of the bus bar connecting portion in addition to the gap filling portion 29, the upper surface side laminated portion 21, and the lower surface side laminated portion 23. The side surface side laminated portion 25 is integrally provided.

The frame 30 includes the semiconductor element 110 (in the present embodiment, the first and second semiconductor elements 110 (1), 110 (2)) and the wire 120 (the present embodiment) mounted on the bus bar assembly 1. In the form of, it is a member for holding the sealing resin body 130 that protects the first and second wires 120 (1) and 120 (2)).

As shown in FIGS. 1 and 2, the frame body 30 has the upper surface side opening 22 (in the present embodiment, the first to third upper surface side openings 22 (1) to 22 (3)). Is fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion 21 in a state of being located in the central hole 37.

The frame body 31 can be formed of various materials.
For example, the frame body 31 is formed of a conductive metal member (preferably the same member as the bus bar 10).

The frame-side insulating layer 40 is formed of an insulating resin coating film having heat resistance and insulating properties such as polyamide-imide, polyimide, polyamide, and epoxy, and preferably using Insuled (registered trademark). It is formed.

The sealing resin layer 130 is formed of, for example, a transparent insulating resin material such as polyimide, polyamide, or epoxy.

Specifically, the insulating resin material forming the sealing resin layer 130 is the first and second semiconductor elements 110 (1), 110 (2) and the first and second wires 120 (1), 120 ( It is poured into the accommodation space defined by the frame 30 so as to surround 2).
The frame 30 prevents the insulating resin material from flowing out before curing and the sealing resin layer 130 after curing from detaching from the bus bar assembly 1.

FIG. 3 shows an enlarged view of part III in FIG. 1 (b).
As shown in FIGS. 1 to 3, the frame body 31 has an upper surface 32 and a lower surface 33 facing one side and the other side in the plate thickness direction, respectively, an inner side surface 34 facing the central hole 37, and the central hole. It has an outer surface 35 located on the opposite side of the 37.

Then, in at least the opening facing portion 34a of the inner side surface 34 facing the upper surface side opening 22, the lower end portion on the other side in the plate thickness direction is viewed in plan from the other portion in the plate thickness direction. It is farthest from the center position S (see FIG. 1A) in the plane direction.

In the present embodiment, as shown in FIG. 3, at least the opening facing portion 34a of the inner side surface 34 is located at the center position S (planar view center position S) of the bus bar connecting body from one side to the other in the plate thickness direction. It is an inclined surface in which the distance in the plane direction from (see FIG. 1 (a)) is large.

According to the bus bar assembly 1 having such a configuration, the insulating layer to be removed when the insulating layer in a predetermined region of the upper surface side laminated portion 21 is removed by laser light in order to form the upper surface side opening 22. It is possible to effectively prevent or reduce the situation where a part of the residue is left behind.
Such effects will be described in detail in the following description of the manufacturing method.

In the present embodiment, as shown in FIGS. 1A to 1C, the inner side surface 34 of the frame body 31 is an inclined surface over the entire circumference, and the central hole is formed. The 37 is a reverse tapered hole whose diameter is expanded from the upper surface 32 on one side in the plate thickness direction of the frame body 31 toward the lower surface 33 on the other side, but at least the opening facing portion of the inner side surface 34 is formed. As long as 34a is the inclined surface, various changes can be made.

FIG. 4A shows a plan view of the bus bar assembly 2A according to the first modification of the present embodiment.
Further, FIGS. 4 (b) and 4 (c) show cross-sectional views taken along the IV (b) -IV (b) line and the IV (c) -IV (c) line in FIG. 4 (a), respectively.
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

The bus bar assembly 2A according to the first modification has a frame body 60A instead of the frame body 30 as compared with the bus bar assembly 1 according to the present embodiment.

The frame body 60A has a frame body main body 31A and the frame body side insulating layer 40.

In the frame body 31A, of the inner side surface 34, only the opening facing portion 34a facing the central hole 37 goes from one side to the other in the plate thickness direction, and the central position S (planar view center position S) of the bus bar connecting body. It is said that the inclined surface (see FIG. 4B) has a large separation distance from (see FIG. 4A), and the other portions 34b other than the opening facing portion 34a are vertical planes along the plate thickness direction (see FIG. 4B). 4 (c)).

Hereinafter, a method for manufacturing the bus bar assembly 1 according to the present embodiment (hereinafter, referred to as a first manufacturing method) will be described.

FIG. 5 shows a plan view of the bus bar flat plate 200 used in the first manufacturing method.
The first manufacturing method includes a step of preparing the flat plate 200 for a bus bar made of conductive metal.

The flat plate 200 for a bus bar has a planar shape corresponding to the bus bar connecting body in which a plurality of bus bars 10 (the first to third bus bars 10 (1) to 10 (3)) are connected by the bus bar side insulating layer 20. And has a bus bar assembly forming region 210 having the same thickness as the bus bar 10.

That is, the length of the bus bar assembly forming region 210 in the first direction (Y direction in FIG. 5) in the plane where the bus bar flat plate 200 is located is the length in the direction parallel to the gap 19 of the bus bar assembly 1. In the plane, the second direction (the length in the X direction in FIG. 5) orthogonal to the first plane direction is orthogonal to the longitudinal direction of the gap 19 of the bus bar assembly 1. It is the same as the length.

As shown in FIG. 5, in the present embodiment, the bus bar flat plate 200 is arranged in series along a first direction (Y direction) in the plane in which the flat plate 200 is located (in the configuration shown in the figure). Has a bus bar row 205 including the bus bar assembly forming region 210 (five) and a connecting region 230 connecting between the bus bar assembly forming regions 210 adjacent to each other in the first direction, and forming the plurality of bus bar assemblies. Machining processing can be performed on the region 210 at the same time.

In this embodiment, the bus bar flat plate 200 has a pair of grip pieces 207 connected to one side and the other side in the longitudinal direction (Y direction) of the bus bar row 205, respectively, and the pair of grip pieces 207. Is provided with an alignment hole 208.

The plurality of bus bar rows 205 are arranged in parallel in the second direction (X direction) in the plane, and the plurality of bus bar rows 205 arranged in parallel in the X direction are integrally arranged by the pair of gripping pieces 207 and 207. It is also possible to hold.
According to such a modified configuration, more bus bar assemblies 1 can be manufactured at the same time.

The first manufacturing method further includes a slit forming step.
FIG. 6 shows a plan view of the bus bar flat plate 200 after the slit forming step.

In the slit forming step, one or a plurality of slits penetrating the bus bar assembly forming region 210 in the thickness direction and having the same width as the gap 19 (the first and second gaps 19 (1), 19 (2)). 219 (first and second slits 219 (1), 219 (2)) are formed, and the bus bar assembly forming region 210 is formed into the plurality of bus bars 10 (the first to third bus bars 10 (1) to 10 (1) to 10 (the first to third bus bars 10 (1) to 10 (2)). It is configured to be partitioned into a plurality of bus bar forming sites 220 (first to third bus bar forming sites 220 (1) to 220 (3)) corresponding to 3)).

In the bus bar assembly 1, the first gap 19 (1) located between the first and second bus bars 10 (1) and 10 (2) and the second and third bus bars 10 (2), 10 A second gap 19 (2) located between (3) is provided, and therefore, the slit forming step has the same width as the first and second gaps 19 (1) and 19 (2). It is configured to form the first and second slits 219 (1) and 219 (2)).

As shown in FIG. 6, in the present embodiment, the first and second slits 219 (1) and 219 (2) formed in one bus bar assembly forming region 210A have one side in the longitudinal direction (Y direction). It extends into one connecting region 230A connected to one side in the longitudinal direction (Y direction) of the one bus bar assembly forming region 210A, and the other side in the longitudinal direction (Y direction) is the longitudinal length of the one bus bar assembly forming region 230. It extends into the other connecting region 230B connected to the other side in the direction (Y direction).

Then, in the state after the slit forming step, adjacent first to third bus bars are formed via the first and second slits 219 (1) and 219 (2) formed in the one bus bar assembly forming region 210A. The portions 220 (1) to 220 (3) are configured to be maintained connected to each other via the one connecting region 230A and the other connecting region 230B.
By providing such a configuration, the first and second slits 219 (1) and 219 (2) (the first and second gaps 19 (1) and 19 (2)) can be formed with high accuracy. ..

The first manufacturing method has a bus bar side coating step performed after the slit forming step.
7 (a) and 7 (b) are a plan view of the flat plate 200 for a bus bar after the bus bar side coating step and a cross-sectional view taken along the line VII (b) -VII (b) in FIG. 7 (a), respectively. Is shown.

In the bus bar side coating step, the bus bar side that forms the bus bar side insulating layer 20 at least in the first and second slits 219 (1) and 219 (2) and in the entire area of the upper surface 211 of the bus bar assembly forming region 210. It is configured to apply the insulating resin paint 240.

The application of the insulating resin paint on the bus bar side can be performed by, for example, electrodeposition coating, electrostatic powder coating or spray coating.

As described above, in the bus bar assembly, the bus bar side insulating layer 20 is added to the gap filling portion 29 filled in the gap 19 and the upper surface side laminated portion 21 provided on the upper surface of the bus bar connecting body. It has a lower surface side laminated portion 21 and a side surface side laminated portion 25 provided on the lower surface and the side surface of the bus bar connecting body, respectively.

Therefore, in the bus bar side coating step, as shown in FIGS. 7 (a) and 7 (b), in addition to the upper surface of the bus bar assembly forming region 210, the lower surface 213 and the side surface 215 are also covered with the bus bar side insulating resin paint 240. Is configured to be applied.

The first manufacturing method further includes a frame forming process performed from the step of preparing the bus bar flat plate 200 to before or after the bus bar side coating step, or in parallel with these.

FIG. 8 shows a plan view of the frame flat plate 300 used in the first manufacturing method.
The frame body forming process includes a step of preparing the frame body flat plate 300.

The frame body flat plate 300 includes a frame body forming region 310 having a non-planar shape and a plate thickness corresponding to the frame body main body 31.

The frame flat plate 300 is made of various rigid materials.
The frame flat plate 300 is formed of, for example, a conductive metal flat plate, and is preferably formed of the same material as the bus bar flat plate 200 from the viewpoint of manufacturing efficiency.

The frame body flat plate 300 is configured so that the frame body forming region 310 is aligned with the bus bar assembly forming region 210 when polymerized on the bus bar flat plate 200.

Specifically, as described above, the bus bar flat plate 200 has a connecting region connecting a plurality of the bus bar assembly forming regions 210 arranged in series along the Y direction and the bus bar assembly forming regions 210 adjacent to each other in the Y direction. It has a busbar row 205 including 230.

Therefore, as shown in FIG. 8, the frame flat plate 300 is adjacent to the plurality of frame body forming regions 310 arranged in series in the Y direction at the same pitch as the plurality of bus bar assembly forming regions 210. It has a frame body row 305 including a connecting area 330 connecting between the frame body forming regions 310 to be formed.

As described above, the bus bar flat plate 200 has a pair of gripping pieces 207 connected to one side and the other side in the longitudinal direction (Y direction) of the bus bar row 205, respectively, and the pair of gripping pieces. The alignment hole 208 is provided in the 207.

Accordingly, as shown in FIG. 8, the frame body flat plate 300 is also provided with a pair of gripping pieces 307 connected to one side and the other side in the longitudinal direction (Y direction) of the frame body row 305, respectively. The pair of gripping pieces 307 is provided with an alignment hole 308 corresponding to the alignment hole 208.

The frame body forming process further includes a central hole forming step of forming the central hole 37 in the frame body forming region 310 to form an annular body 320 corresponding to the frame body main body 31.
FIG. 9A shows a plan view of the frame flat plate 300 after the central hole forming step.
Further, FIG. 9 (b) shows a cross-sectional view taken along the line IX (b) -IX (b) in FIG. 9 (a).

As described above, in the present embodiment, the central hole 37 is a reverse tapered hole whose diameter is expanded from the upper surface 311 on one side of the frame body 310 in the plate thickness direction to the lower surface 313 on the other side. (See Fig. 9 (b)).

10 (a) to 10 (c) show a schematic process diagram of the central hole forming process.
As shown in FIGS. 10A to 10C, in the central hole forming step, a tapered punch 380 corresponding to the reverse tapered hole is prepared, and the upper surface 311 from the lower surface 313 side of the frame body 310. It is configured to press the punch 380 toward the side of.
Reference numerals 398a and 398b in FIGS. 10A to 10B are fixing members for fixing the frame forming region 310 while providing the passage of the punch 380.

The frame body forming process further includes a frame body side coating step of applying the frame body side insulating resin paint 340 that forms the frame body side insulating layer 40 on the outer peripheral surface of the annular body 320.
FIG. 11 shows a plan view of the frame body flat plate 300 after the frame body side coating step.

The application of the frame-side insulating resin paint 340 can be performed by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

The first manufacturing method further includes a flat plate fixing step.
FIG. 12A shows a plan view of the frame flat plate 300 and the bus bar flat plate 200 after the flat plate fixing step.
Further, FIG. 12 (b) shows a cross-sectional view taken along the line XII (b) -XII (b) in FIG. 12 (a).

As shown in FIGS. 12 (a) and 12 (b), in the flat plate fixing step, the frame body forming region is formed when at least one of the bus bar side insulating resin paint 240 and the frame body side insulating resin paint 340 is in a semi-cured state. The lower surface of the 310 is crimped to the upper surface of the bus bar forming region 210 to completely cure the semi-cured insulating resin paint, whereby the flat plate 200 for the bus bar and the flat plate 300 for the frame are fixed. ing.

The first manufacturing method further includes a laser light irradiation step performed after the flat plate fixing step.
FIG. 13 shows a plan view of the frame flat plate 300 and the bus bar flat plate 200 after the laser light irradiation step.
Further, FIG. 14 (a) shows an enlarged view of the XIV (a) portion in FIG. 13, and FIG. 14 (b) shows a cross-sectional view taken along the line XIV (b) -XIV (b) in FIG. 14 (a). show.

As shown in FIGS. 13 and 14, in the laser light irradiation step, the first to third upper surface side openings 22 (1) to 22 (3) of the upper surface side laminated portions 21 in the bus bar side insulating layer 20 are provided. The first to third upper surfaces thereof are formed by irradiating the regions to be formed (the first to third upper surface side opening forming regions 22a (1) to 22a (3) in FIGS. 15 (a) and 15 (b) below) with laser light. The side openings 22 (1) to 22 (3) are configured to be provided.

As described above, in the present embodiment, the bus bar side insulating layer 20 includes the lower surface side laminated portion 23, and the lower surface side laminated portion 23 has the first to third lower surface side openings 24 (1). ) To 24 (3) are provided.

Therefore, in the laser light irradiation step, the regions of the lower surface side laminated portion 23 where the first to third lower surface side openings 24 (1) to 24 (3) should be formed (FIGS. 15 (a) and 15 (b) below). ), The first to third lower surface side opening forming regions 24a (1) to 24a (3)) are irradiated with laser light to provide the first to third lower surface side openings 24 (1) to 24 (3). It is configured as follows.

Here, the effect of the bus bar assembly according to the present embodiment will be described with reference to FIGS. 15 (a) to 15 (d).
FIG. 15 (a) is a vertical cross-sectional view of the frame flat plate 300 and the bus bar flat plate 200 after the flat plate fixing step and before the laser light irradiation step, and is a vertical cross section corresponding to FIG. 12 (b). It is a figure.
FIG. 15B is a vertical cross-sectional view of the frame flat plate 300 and the bus bar flat plate 200 in a state where the laser light 290 in the laser light irradiation step is schematically displayed.
15 (c) shows the first to third upper surface side openings 22 (1) to 22 (3) and the first to third lower surface side openings 24 (1) to 25 (3) depending on the laser light irradiation step. It is a vertical sectional view of the flat plate 300 for a frame body and the flat plate 200 for a bus bar in a state where the above-mentioned flat plate 300 is formed.
In FIG. 15 (d), the first and second semiconductor elements 110 (1) and 110 (2) are mounted in the regions exposed by the first and second upper surface side openings 22 (1) and 22 (2). It is a vertical sectional view of the flat plate 300 for a frame body and the flat plate 200 for a bus bar in a state of being made to stand.

As described above, in the flat plate fixing step, the process of crimping the lower surface 313 of the frame body forming region 310 (the annular body 320) to the upper surface 211 of the bus bar forming region 210 is performed by the frame body side insulating resin paint 340 and the bus bar. At least one of the side insulating resin paint 240 is in a semi-cured state (in the present embodiment, the frame side insulating resin paint 340 is in a completely cured state and the bus bar side insulating resin paint 240 is in a semi-cured state. It is done in the state of being.

Therefore, as shown in FIG. 15A, a part of the portion of the bus bar-side insulating resin paint 240 located directly below the frame forming region 310 (the annular body 320) is the annular body 320. It protrudes toward the inner side surface side (that is, in the direction of the central hole 37), and a situation occurs in which the film thickness of the bus bar side insulating layer 20 is locally thickened in the lower end region of the inner side surface of the annular body 320. (Hereinafter, the portion where this film thickness is thickened is referred to as a large film film portion 27).

On the other hand, as shown in FIGS. 14 (a) and 14 (b) and FIG. 15 (a), in the bus bar assembly 1 according to the present embodiment, as described above, the annular body 320 is formed. At least in the opening facing portion 34a of the inner side surface 34 of the frame body 31, the lower end portion is flatter from the center position S in the plan view of the bus bar connecting body than other parts in the plate thickness direction on the inner side surface 34. Most distant in terms of direction.

According to such a configuration, as shown in FIGS. 15 (b) and 15 (c), the large film thickness portion 27 reaches the first to third upper surface side opening forming regions 22a (1) to 22a (3). This can be effectively prevented or reduced, and when the first to third upper surface side openings 22 (1) to 22 (3) are formed by the laser light irradiation step, the first to third upper surface side openings are formed. It is possible to effectively prevent or reduce that a part of the bus bar side insulating layer 20 remains as a residue in the regions 22a (1) to 22a (3).

Therefore, as shown in FIG. 15 (d), in the semiconductor element mounting step executed after the flat plate fixing step, the upper surface side opening (in the present embodiment, the first and second upper surface side openings 22 (1)). , 22 (2)), the semiconductor elements 110 (1) and 110 (2) can be reliably mounted on the upper surface side connecting portion 12 in the correct posture.

The first manufacturing method further comprises a cutting step of cutting the fixed bus bar forming region 210 and the frame forming region 310 from the bus bar flat plate 200 and the frame flat plate 300 after the semiconductor element mounting step. Have.
The cutting step is configured to cut the boundary between the bus bar forming region 210 and the connecting region 230, and the boundary between the frame forming region 310 and the connecting region 330 with a dicing blade.

In the present embodiment, the central hole 37 of the frame body 31 (the annular body 320) is a reverse taper hole whose diameter is expanded from one side to the other side of the frame body 31 in the plate thickness direction. However, the present invention is not limited to such a form.

FIG. 16 shows a vertical cross-sectional view of the bus bar assembly 2B according to the second modification of the present embodiment.
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

The bus bar assembly 2B according to the second modification is different from the bus bar assembly 1 according to the present embodiment only in that the frame body 31 is changed to the frame body 71.

As shown in FIG. 16, in the frame body 71, at least the opening facing portion of the inner side surface 74 has an upper plate thickness direction extending surface 77 extending from the upper surface 72 of the frame body 71 to the other side in the plate thickness direction. The plate surface extending surface 78 extending from the other end of the upper plate thickness direction extending portion 77 in the plate thickness direction to the side opposite to the center position in the plan view of the bus bar connecting body in the plate surface direction. It is configured to have a lower plate thickness direction extending surface 79 extending from an end portion of the plate thickness direction extending surface 78 opposite to the center position in the plan view to the other side in the plate thickness direction.

The same effect as in the present embodiment can be obtained even in the bus bar assembly 2B according to the second modification having such a configuration.

In the bus bar assembly 2B according to the second modification, the inner side surface of the frame body 71 covers the entire circumference of the upper plate thickness direction extending surface 77, the plate surface direction extending surface 78, and the plate surface direction extending surface 78. The lower plate thickness direction extending surface 79 is provided, and the central hole 37 formed in the frame body 71 extends from the upper surface 72 of the frame body 71 to the other side in the plate thickness direction to form the frame body 71. A small diameter hole 37a that ends within the plate thickness of 71, and a large diameter hole 37b that extends from the other end of the small diameter hole 37a in the plate thickness direction to the other side in the plate thickness direction and reaches the lower surface 73 of the frame body 71. It is a stepped hole to have.

The bus bar assembly 2B according to the second modification can be efficiently manufactured by the second manufacturing method.

FIG. 17A shows a plan view of a flat plate 350 for a frame used when manufacturing the frame 71 in the bus bar assembly 2B according to the second modification.
Further, FIG. 17 (b) shows a cross-sectional view taken along the line XVII (b) -XVII (b) in FIG. 17 (a).
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

The second manufacturing method differs from the first manufacturing method only in that the central hole forming step is changed.

18 (a) to 18 (c) show a process diagram of the central hole forming step in the second manufacturing method.
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

As shown in FIGS. 18A to 18C, in the central hole forming step in the second manufacturing method, a large diameter portion 386 having an outer diameter corresponding to the large diameter hole 37b and a tip from the large diameter portion 386 are used. A two-stage punch 385 having a small diameter portion 387 extending to the side and having a small diameter portion 387 having an outer diameter corresponding to the small diameter hole 37a is prepared, and an upper surface 311 is prepared from the side of the lower surface 313 of the frame body forming region 320. It is configured to press the two-stage punch 385 toward the side of.

FIG. 19 shows a vertical cross-sectional view of the bus bar assembly 2C according to the third modification of the present embodiment.
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

The bus bar assembly 2C according to the third modification is different from the bus bar assembly 1 according to the present embodiment only in that the frame body 31 is changed to the frame body 81.

As shown in FIG. 19, in the frame body 81, at least the opening facing portion of the inner side surface 84 extends from the upper surface 82 of the frame body 81 to the other side in the plate thickness direction along the plate thickness direction. The distance in the plane direction between the extending surface 87 in the direction and the center position in the plan view of the bus bar connector increases from the other end in the thickness direction of the extending portion 87 in the upper plate thickness direction to the other side in the plate thickness direction. It is configured to have an inclined surface 88.

The same effect as in the present embodiment can be obtained even in the bus bar assembly 2C according to the third modification having such a configuration.

In the bus bar assembly 2C according to the third modification, the entire inner surface of the frame body 81 has the upper plate thickness direction extending surface 87 and the inclined surface 88, and the frame body body The central hole 37 formed in the 81 has a small diameter hole 37c extending from the upper surface 82 of the frame body 81 toward the other side in the plate thickness direction and ending within the plate thickness of the frame body 81, and a plate of the small diameter hole 37c. The diameter is increased from the other end in the thickness direction toward the other side in the plate thickness direction, and the composite hole has a reverse taper hole 37d that reaches the lower surface 83.

The bus bar assembly 2C according to the third modification can be efficiently manufactured by the third manufacturing method.

FIG. 20A shows a plan view of a flat plate 360 for a frame used when manufacturing the frame 81 in the bus bar assembly according to the third modification.
Further, FIG. 20 (b) shows a cross-sectional view taken along the line XX (b) -XX (b) in FIG. 20 (a).
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

The second manufacturing method differs from the first manufacturing method only in that the central hole forming step is changed.

21 (a) to 21 (c) show a process diagram of the central hole forming step in the third manufacturing method.
In the figure, the same members as in the present embodiment are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

As shown in FIGS. 21 (a) to 21 (c), the central hole forming step in the third manufacturing method extends from the tapered tapered portion 391 corresponding to the reverse tapered hole 37d and the tapered tapered portion 391 to the tip side. A two-stage punch 390 having a small diameter portion 392 having a small diameter portion 392 having an outer diameter corresponding to the small diameter hole 37c is prepared, and the frame body forming region 310 is provided from the lower surface 313 side to the upper surface 311 side. It is configured to press the two-stage punch 390 toward it.

1, 2A to 2C Bus bar assembly 10 (1) to 10 (3) 1st to 3rd bus bars 19 (1), 19 (2) 1st gap and 2nd gap 20 Bus bar side insulating layer 21 Top surface side laminated portion 22 ( 1) to 22 (3) First to third upper surface side openings 22a (1) to 22a (3) First to third upper surface side opening forming regions 24 (1) to 24 (3) First to third lower surface sides Openings 24a (1) to 24a (3) First to third lower surface side opening forming regions 29 Gap filling portion 30 Frame body 31 Frame body body 32 Top surface of frame body 33 Bottom surface of frame body 34 Inner surface of frame body 34a Opening facing portion 35 Outer surface of frame body 37 Central hole 37a Small diameter hole 37b Large diameter hole 37c Small diameter hole 37d Reverse taper hole 40 Frame side insulating layer 71 Frame body 72 Upper surface of frame body 73 Bottom surface of frame body 74 Inner side surface of the frame body 77 Upper plate thickness direction extension surface 78 Plate surface direction extension surface 79 Lower plate thickness direction extension surface 81 Frame body body 82 Top surface of the frame body 83 Bottom surface of the frame body 84 Bottom surface of the frame body Inner side surface 87 Upper plate thickness direction extending surface 88 Inclined surface 200 Flat plate for bus bar 210 Bus bar forming region 219 (1), 219 (2) First slit, second slit
220 (1) to 220 (3) 1st to 3rd bus bar forming sites 230 Connecting area 240 Bus bar side insulating resin paint 300 Flat plate for frame 310 Frame forming area 320 Ring body 330 Connecting area 340 Frame side insulating resin paint 380, 385, 390 Punch 386 Large diameter part 387 Small diameter part 391 Tapered taper part 392 Small diameter part S Center position in plan view of bus bar connector

Claims (14)

A plurality of bus bars formed by a conductive flat plate member and arranged in the same plane with a gap between opposite side surfaces.
The gap filling portion filled in the gap and the upper surface side laminated portion covering the upper surface on one side in the plate thickness direction of the bus bar connecting portion connected by the gap filling portion are included, and the upper surface side laminated portion includes the plurality of said. A busbar-side insulating layer provided with one or more top-side openings that expose at least a portion of each top surface of the busbar.
It has an annular frame body provided with a central hole penetrating in the plate thickness direction and a frame side insulating layer covering the outer peripheral surface of the frame body, and the one or more upper surface side openings are the central hole in a plan view. A frame body fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion in a state of being located inside is provided.
The frame body has an upper surface and a lower surface facing one side and the other side in the plate thickness direction, an inner side surface facing the central hole, and an outer surface located on the side opposite to the central hole.
At least in the opening facing portion of the inner side surface facing the upper surface side opening, the lower end portion on the other side in the plate thickness direction is in the plane direction from the center position in the plan view of the bus bar connection rather than the other portions in the plate thickness direction. Busbar assembly characterized by being the most separated with respect to. At least the opening facing portion of the inner side surface is an inclined surface in which the distance in the plane direction from the center position of the bus bar connection in the plan view increases from one side to the other side in the plate thickness direction. The bus bar assembly according to claim 1. A claim characterized in that the entire inner surface thereof is an inclined surface, and the central hole is a reverse tapered hole whose diameter is expanded from one side to the other side in the plate thickness direction of the frame body body. Item 2. The bus bar assembly according to item 2. Of the inner side surfaces, at least the opening facing portion is an upper plate thickness direction extending surface extending from the upper surface of the frame body to the other side in the plate thickness direction, and the other end portion of the upper plate thickness direction extending portion in the plate thickness direction. From, the extending surface in the plate surface direction extending along the plate surface direction to the side opposite to the central position in the plan view of the bus bar connecting body, and the end of the extending surface in the plate thickness direction opposite to the central position in the plan view. The bus bar assembly according to claim 1, further comprising a lower plate thickness direction extending surface extending from the portion to the other side in the plate thickness direction. The entire inner surface surface has the upper plate thickness direction extending surface, the plate surface direction extending surface, and the lower plate thickness direction extending surface, and the central hole is a plate from the upper surface of the frame body. A small diameter hole that extends to the other side in the thickness direction and ends within the plate thickness of the frame body, and extends from the other end of the small diameter hole in the plate thickness direction to the other side in the plate thickness direction to reach the lower surface of the frame body. The bus bar assembly according to claim 4, wherein the hole is a stepped hole having a large diameter hole. At least the opening facing portion of the inner side surface is an upper plate thickness direction extending surface extending from the upper surface of the frame body to the other side in the plate thickness direction along the plate thickness direction, and the upper plate thickness direction extending portion. Claim 1 is characterized by having an inclined surface in which the distance in the plane direction from the other end in the plate thickness direction to the other side in the plate thickness direction increases in the plan direction of the bus bar connector. Busbar assembly described in. The entire inner surface surface has the upper plate thickness direction extending surface and the inclined surface, and the central hole extends from the upper surface of the frame body body to the other side in the plate thickness direction and is the plate of the frame body body. A claim characterized by being a composite hole having a small-diameter hole that ends within Atsunai and a reverse-tapered hole that expands in diameter from the other end of the small-diameter hole toward the other side in the plate thickness direction. Item 6. The bus bar assembly according to item 6. It is connected by a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between facing side surfaces, a gap filling portion filled in the gap, and the gap filling portion. One or more upper surface sides that include an upper surface side laminated portion that covers the upper surface of one side in the plate thickness direction of the bus bar connecting body, and the upper surface side laminated portion exposes at least a part of the upper surface of each of the plurality of bus bars. An insulating layer on the bus bar side provided with an opening, an annular frame body provided with a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction, and an outer peripheral surface of the frame body. A frame having an insulating layer on the frame side to cover, and the one or a plurality of upper surface side openings are fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion in a state where the one or more upper surface side openings are located in the central hole in a plan view. It is a method of manufacturing a busbar assembly equipped with a body.
A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, and a step of preparing the flat plate for the bus bar.
One or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is divided into a plurality of bus bar forming portions corresponding to the plurality of bus bars. Slit formation process and
A bus bar side coating step of applying a bus bar side insulating resin paint that forms the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region.
A frame body forming process performed from the step of preparing the flat plate for the bus bar to before or after the bus bar side coating step, or in parallel with these, and has a frame body having a non-planar shape corresponding to the frame body main body. A step of preparing a flat plate for a frame body including a forming region, a central hole forming step of forming the central hole in the frame body forming region to form an annular body corresponding to the frame body main body, and an outer periphery of the annular body. A frame body forming process including a frame body side coating step of applying a frame body side insulating resin paint for forming the frame body side insulating layer on a surface, and
When at least one of the bus bar side insulating resin paint and the frame side insulating resin paint is in a semi-cured state, the lower surface of the frame body forming region is crimped to the upper surface of the bus bar forming region, and the semi-cured insulating resin paint is formed. The plate fixing step of fixing the bus bar flat plate and the frame flat plate by completely curing the
A laser light irradiation step of irradiating the upper surface side opening forming region where the upper surface side opening is to be formed in the upper surface side laminated portion of the bus bar side insulating layer to provide the one or more upper surface side openings is provided.
The central hole is a reverse taper hole whose diameter is expanded from one side to the other side in the plate thickness direction of the frame body body.
The central hole forming diameter step is configured to prepare a tapered tapered punch corresponding to the reverse tapered hole and press the punch from the lower surface side to the upper surface side of the frame body forming region. A method for manufacturing a bus bar assembly, which is characterized in that. It is connected by a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between facing side surfaces, a gap filling portion filled in the gap, and the gap filling portion. One or more upper surface sides that include an upper surface side laminated portion that covers the upper surface of one side in the plate thickness direction of the bus bar connecting body, and the upper surface side laminated portion exposes at least a part of the upper surface of each of the plurality of bus bars. An insulating layer on the bus bar side provided with an opening, an annular frame body provided with a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction, and an outer peripheral surface of the frame body. A frame having an insulating layer on the frame side to cover, and the one or a plurality of upper surface side openings are fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion in a state where the one or more upper surface side openings are located in the central hole in a plan view. It is a method of manufacturing a busbar assembly equipped with a body.
A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, and a step of preparing the flat plate for the bus bar.
One or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is divided into a plurality of bus bar forming portions corresponding to the plurality of bus bars. Slit formation process and
A bus bar side coating step of applying a bus bar side insulating resin paint that forms the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region.
A frame body forming process performed from the step of preparing the flat plate for the bus bar to before or after the bus bar side coating step, or in parallel with these, and has a frame body having a non-planar shape corresponding to the frame body main body. A step of preparing a flat plate for a frame body including a forming region, a central hole forming step of forming the central hole in the frame body forming region to form an annular body corresponding to the frame body main body, and an outer periphery of the annular body. A frame body forming process including a frame body side coating step of applying a frame body side insulating resin paint for forming the frame body side insulating layer on a surface, and
When at least one of the bus bar side insulating resin paint and the frame side insulating resin paint is in a semi-cured state, the lower surface of the frame body forming region is crimped to the upper surface of the bus bar forming region, and the semi-cured insulating resin paint is formed. The plate fixing step of fixing the bus bar flat plate and the frame flat plate by completely curing the
A laser light irradiation step of irradiating the upper surface side opening forming region where the upper surface side opening is to be formed in the upper surface side laminated portion of the bus bar side insulating layer to provide the one or more upper surface side openings is provided.
The central hole extends from the upper surface on one side of the frame body in the plate thickness direction to the other side in the plate thickness direction and ends within the plate thickness of the frame body, and the other end of the small diameter hole in the plate thickness direction. It is a stepped hole having a large-diameter hole extending from the portion to the other side in the plate thickness direction and reaching the lower surface of the frame body.
In the central hole forming step, a large-diameter portion having an outer diameter corresponding to the large-diameter hole and a small-diameter portion extending from the large-diameter portion to the tip side and having an outer diameter corresponding to the small-diameter hole are formed. Manufacture of a bus bar assembly characterized in that a two-stage punch having a two-stage shape is prepared and the two-stage punch is pressed from the lower surface side to the upper surface side of the frame body forming region. Method. It is connected by a plurality of bus bars formed by a conductive flat plate-shaped member and arranged in the same plane with a gap between facing side surfaces, a gap filling portion filled in the gap, and the gap filling portion. One or more upper surface sides that include an upper surface side laminated portion that covers the upper surface of one side in the plate thickness direction of the bus bar connecting body, and the upper surface side laminated portion exposes at least a part of the upper surface of each of the plurality of bus bars. An insulating layer on the bus bar side provided with an opening, an annular frame body provided with a central hole penetrating the upper surface on one side in the plate thickness direction and the lower surface on the other side in the plate thickness direction, and an outer peripheral surface of the frame body. A frame having an insulating layer on the frame side to cover, and the one or a plurality of upper surface side openings are fixed to the upper surface of the bus bar connecting body via the upper surface side laminated portion in a state where the one or more upper surface side openings are located in the central hole in a plan view. It is a method of manufacturing a busbar assembly equipped with a body.
A step of preparing a flat plate for a bus bar made of a conductive metal including a bus bar forming region having a non-planar shape corresponding to the bus bar connecting body, and a step of preparing the flat plate for the bus bar.
One or a plurality of slits penetrating in the plate thickness direction and having the same width as the gap are formed in the bus bar forming region, and the bus bar forming region is divided into a plurality of bus bar forming portions corresponding to the plurality of bus bars. Slit formation process and
A bus bar side coating step of applying a bus bar side insulating resin paint that forms the bus bar side insulating layer at least in the slit and on the upper surface of the bus bar forming region.
A frame body forming process performed from the step of preparing the flat plate for the bus bar to before or after the bus bar side coating step, or in parallel with these, and has a frame body having a non-planar shape corresponding to the frame body main body. A step of preparing a flat plate for a frame body including a forming region, a central hole forming step of forming the central hole in the frame body forming region to form an annular body corresponding to the frame body main body, and an outer periphery of the annular body. A frame body forming process including a frame body side coating step of applying a frame body side insulating resin paint for forming the frame body side insulating layer on a surface, and
When at least one of the bus bar side insulating resin paint and the frame side insulating resin paint is in a semi-cured state, the lower surface of the frame body forming region is crimped to the upper surface of the bus bar forming region, and the semi-cured insulating resin paint is formed. The plate fixing step of fixing the bus bar flat plate and the frame flat plate by completely curing the
A laser light irradiation step of irradiating the upper surface side opening forming region where the upper surface side opening is to be formed in the upper surface side laminated portion of the bus bar side insulating layer to provide the one or more upper surface side openings is provided.
The central hole extends from the upper surface on one side of the frame body in the plate thickness direction to the other side in the plate thickness direction and ends within the plate thickness of the frame body, and the other end of the small diameter hole in the plate thickness direction. It is a composite hole having a reverse taper hole whose diameter is expanded from the portion to the other side in the plate thickness direction.
The central hole forming step is a two-stage having a tapered portion corresponding to the reverse tapered hole and a small diameter portion extending from the tapered portion toward the tip side and having an outer diameter corresponding to the small diameter hole. A method for manufacturing a bus bar assembly, characterized in that a punch having a shape is prepared and the punch having the two-stage shape is pressed from the lower surface side to the upper surface side of the frame body forming region. The bus bar side coating step is configured to apply the bus bar side insulating resin paint to the lower surface of the bus bar forming region.
In the laser light irradiation step, the laser light is irradiated to the lower surface side opening forming region of the lower surface side laminated portion formed by the bus bar side insulating resin paint, and at least one of the lower surfaces of each of the plurality of bus bar forming portions. The method for manufacturing a bus bar assembly according to any one of claims 8 to 10, wherein the bus bar assembly is configured to have one or a plurality of lower surface side openings for exposing the portions. The bus bar flat plate integrally has a plurality of the bus bar forming regions arranged in series in the first direction along the longitudinal direction of the slit and a connecting region connecting the adjacent bus bar forming regions. ,
The slit formed in the one bus bar forming region extends into the connecting region in which one end side in the longitudinal direction is connected to one side in the first direction of the one bus bar forming region and the other end side in the longitudinal direction is the one bus bar forming region. It extends into the connecting region connected to the other side in the first direction.
The frame flat plate connects a plurality of frame forming regions arranged in series in the first direction at the same pitch as the plurality of bus bar forming regions and the frame forming region adjacent to the first direction. The method for manufacturing a bus bar assembly according to any one of claims 8 to 11, wherein the bus bar assembly is integrally provided with a connecting region. It is characterized by comprising a semiconductor element mounting step of mounting a semiconductor element on the upper surface of a predetermined bus bar among the upper surfaces of the plurality of bus bars exposed by the one or a plurality of upper surface side openings after the flat plate fixing step. The method for manufacturing a bus bar assembly according to any one of claims 8 to 12. The bus bar assembly according to claim 13, further comprising a cutting step of cutting the bus bar forming region and the frame body forming region from the bus bar flat plate and the frame body flat plate after the semiconductor element mounting step. Manufacturing method.

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