JP2022067705A - Electronic cooling module and optical module - Google Patents

Abstract

To provide an electronic cooling module that can suitably adjust the temperature of a member where temperature distribution occurs, and that can make the workability at the manufacture favorable.SOLUTION: An electronic cooling module 30A includes a heat radiation plate 31A, a heat absorption plate 32A with a shape like a plate that includes a first region 34A and a second region 34B disposed apart from the first region 34A in a thickness direction and that is disposed apart from the heat radiation plate 31A in the thickness direction, a plurality of first semiconductor columns 33A that are disposed between the heat radiation plate 31A and the heat absorption plate 32A in a region overlapping with the first region 34A when viewed in the thickness direction of the heat absorption plate 32A and that are connected to the heat radiation plate 31A and the heat absorption plate 32A, a plurality of second semiconductor columns 33A that are disposed between the heat radiation plate 31A and the heat absorption plate 32A in a region overlapping with the second region 34B when viewed in the thickness direction of the heat absorption plate 32A and that are connected to the heat radiation plate 31A and the heat absorption plate 32A, a first electric circuit 37A configured by electrically connecting the first semiconductor columns 33A, and a second electric circuit 37B configured by electrically connecting the second semiconductor columns 33B.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to electronic cooling modules and optical modules.

A laser module including a first thermoelectric cooling module and a second thermoelectric cooling module and including a temperature control device for heat exchange using the Pelche effect is known (see, for example, Patent Document 1). Further, an optical module having a plate-shaped lower substrate and a plurality of plate-shaped upper substrates and having a temperature controller for controlling the temperature of the laser element by a Pelche element is known (for example, Patent Document 2). reference). Further, there is known a thermo module in which the size of each electrode formed on a pair of insulating substrates is set to a size that allows only one end face of a thermoelectric element to be joined (see, for example, Patent Document 3).

Japanese Unexamined Patent Publication No. 2004-134776 Japanese Unexamined Patent Publication No. 2019-140306 Japanese Unexamined Patent Publication No. 2007-266084

The electronic cooling module includes a heat sink, a heat sink, and a plurality of semiconductor columns arranged between the heat sink and the heat sink. The semiconductor columns are composed of Pelche elements, and p-type semiconductor columns and n-type semiconductor columns are alternately arranged next to each other. An electric circuit is constructed by alternately electrically connecting the ends of adjacent semiconductor columns in series. In the electronic cooling module, a member for detecting temperature is placed on a heat absorbing plate. Then, when a current is passed through the electric circuit, for example, the endothermic plate side is cooled and the heat sink side generates heat. In this way, the Perche effect is used to cool the member placed on the endothermic plate, for example, to control the temperature.

As a member for adjusting the temperature by the electronic cooling module, for example, there may be a bias in the arrangement of the heat generating region. In such a case, if the members arranged on the endothermic plate are uniformly cooled by the electronic cooling module, a temperature distribution will occur. When it is not desired that such a temperature distribution occurs, it becomes difficult to deal with it.

In Patent Document 1, the first thermoelectric cooling module and the second thermoelectric cooling module are used. However, since the electronic cooling modules are separate parts, it is necessary to assemble the two parts at the time of manufacturing, and the workability is inferior. Regarding the temperature controller disclosed in Patent Document 2, the upper substrate serving as the endothermic plate is divided. However, although the lower substrate that serves as the heat sink is common, since a plurality of upper substrates that serve as endothermic plates are provided, for example, warpage occurs due to a temperature change of the heat sink, and the relative members arranged on the two upper substrates are relative to each other. There is a risk that the target position will shift. Therefore, it becomes difficult to cope with the case where strict arrangement of parts is required. Further, according to Patent Document 3, there are restrictions on the shape, which may impair convenience in mounting electronic components. In the electronic cooling module utilizing the Pelche effect as described above, it is desired that the temperature of the member in which the temperature distribution occurs can be appropriately adjusted and the workability at the time of manufacturing is improved.

Therefore, one of the objects of the present disclosure is to provide an electronic cooling module capable of appropriately adjusting the temperature of a member in which a temperature distribution occurs and improving workability during manufacturing.

The electronic cooling module according to the present disclosure includes a single heat sink, a single plate shape, a first region, and a second region arranged apart from the first region in the thickness direction. It is arranged in a region between the heat absorbing plate and the heat absorbing plate, which is arranged apart from the heat absorbing plate in the thickness direction, and overlaps with the first region in the thickness direction of the heat absorbing plate. A plurality of first semiconductor columns connected to the heat radiating plate and the heat absorbing plate are arranged in a region between the radiating plate and the heat absorbing plate and overlapping with the second region when viewed in the thickness direction of the heat absorbing plate. A plurality of second semiconductor columns connected to a heat absorbing plate, a first electric circuit configured by electrically connecting a plurality of first semiconductor columns, and a plurality of second semiconductor columns are electrically connected. Includes a second electrical circuit configured in.

According to the electronic cooling module, the temperature of the member in which the temperature distribution is generated can be appropriately adjusted, and the workability at the time of manufacturing can be improved.

FIG. 1 is a schematic side view of the electronic cooling module according to the first embodiment. FIG. 2 is a schematic plan view of the electronic cooling module of the first embodiment shown in FIG. FIG. 3 is a schematic perspective view schematically showing a part of the electronic cooling module of the first embodiment. FIG. 4 is an external perspective view showing the structure of the optical module including the electronic cooling module according to the first embodiment. FIG. 5 is an external perspective view showing a state in which the cap of the optical module shown in FIG. 4 is removed. FIG. 6 is a schematic cross-sectional view of an optical module including an electronic cooling module according to the first embodiment. FIG. 7 is a schematic cross-sectional view of an optical module including an electronic cooling module according to the first embodiment. FIG. 8 is a schematic side view of the electronic cooling module according to the third embodiment. FIG. 9 is a schematic side view of the electronic cooling module according to the fourth embodiment. FIG. 10 is a schematic side view of the electronic cooling module according to the fifth embodiment.

[Explanation of Embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described. The electronic cooling module according to the present disclosure has a single heat sink, a single plate shape, and a first region and a second region arranged apart from the first region in the thickness direction. A heat absorbing plate including the heat absorbing plate and arranged apart from the heat absorbing plate in the thickness direction, and a region between the heat absorbing plate and the heat absorbing plate and overlapping with the first region in the thickness direction of the heat absorbing plate, and dissipating heat. A plurality of first semiconductor columns connected to the plate and the heat absorbing plate, and the heat radiating plate and the heat absorbing plate are arranged in a region overlapping the second region in the thickness direction of the heat absorbing plate. A plurality of second semiconductor columns connected to a heat absorbing plate, a first electric circuit configured by electrically connecting a plurality of first semiconductor columns, and a plurality of second semiconductor columns electrically connected to each other. Includes a second electrical circuit that is configured.

In the electronic cooling module of the present disclosure, the endothermic plate includes a first region and a second region disposed apart from the first region. In the first region, the temperature in the first region can be adjusted by controlling the amount of current flowing through the first electric circuit configured by electrically connecting a plurality of first semiconductor columns. Further, in the second region, the temperature in the second region can be adjusted by controlling the amount of current flowing through the second electric circuit configured by electrically connecting a plurality of second semiconductor columns. That is, the temperature can be adjusted separately in the first region and the second region of the endothermic plate. Further, since the endothermic plate is composed of a single plate-shaped member, even if the heat sink is warped due to thermal expansion or contraction due to a temperature change, the relative members on the heat sink due to the warp of the heat sink. It is possible to suppress the deviation of the target position. In addition, it is not necessary to prepare and install a plurality of electronic cooling modules, and workability can be improved. Therefore, according to such an electronic cooling module, the temperature of the member in which the temperature distribution occurs can be appropriately adjusted, and the workability at the time of manufacturing can be improved.

The electronic cooling module may further include a first temperature detecting unit that detects the temperature in the first region and a second temperature detecting unit that detects the temperature in the second region. By doing so, the temperature of each region can be adjusted based on the temperature of the first region detected by the first temperature detection unit and the temperature of the second region detected by the second temperature detection unit. can. Therefore, the temperature of each of the first region and the second region can be adjusted more appropriately.

The electronic cooling module may have a groove portion that is arranged between the first region and the second region when viewed in the thickness direction of the heat absorbing plate and reduces the wall thickness of the heat absorbing plate. By doing so, it is possible to suppress heat transfer through the heat absorbing plate between the first region and the second region. Therefore, the temperature of each of the first region and the second region can be adjusted more appropriately.

In the electronic cooling module, the distance between the first region and the second region is wider than the distance between the plurality of first semiconductor columns and the distance between the plurality of second semiconductor columns when viewed in the thickness direction of the endothermic plate. You may. By doing so, the first region and the second region can be physically widely spaced apart. Therefore, the temperature of each of the first region and the second region can be adjusted more appropriately.

In the electronic cooling module, it is arranged between the first region and the second region when viewed in the thickness direction of the endothermic plate, and is electrically connected to both the first electric circuit and the second electric circuit. However, a third semiconductor column connecting the heat radiating plate and the heat absorbing plate may be further included. By doing so, the first region and the second region can be separated by the region in which the third semiconductor column is arranged, and heat transfer between the first region and the second region is suppressed. be able to. Therefore, the temperature of each of the first region and the second region can be adjusted more appropriately.

The optical module according to the present disclosure includes a support plate, the electronic cooling module arranged on the support plate, and an optical forming unit configured to form light and arranged on the electronic cooling module. The light forming portion includes a semiconductor light emitting device that is arranged in the first region and emits light when viewed in the thickness direction of the endothermic plate.

The light forming unit having a semiconductor light emitting element that emits light is set within a certain range by adjusting the temperature of the light forming unit even when the temperature of the surrounding environment changes by the electronic cooling module included in the optical module. The output of the emitted light can be stabilized. In the light forming portion, since the semiconductor light emitting element generates heat when the light is emitted, the region where the semiconductor light emitting element is arranged is greatly affected by the heat generation, and the temperature becomes relatively high. Therefore, it is necessary to positively absorb heat by cooling. On the other hand, in the region where the semiconductor light emitting element is not arranged, the influence of heat generation is small and the temperature remains relatively low. Therefore, it is not necessary to positively absorb heat by cooling. That is, such an optical module is a member in which a temperature distribution occurs when the optical module operates, that is, when light is emitted.

Here, according to the optical module of the present disclosure, by arranging the region in which the semiconductor light emitting element is arranged in the first region, control by the first electric circuit in the first region can be performed. Therefore, the temperature can be adjusted separately in the first region and the second region in which the semiconductor light emitting device is not arranged. Therefore, according to such an optical module, it is possible to reduce the influence of temperature on the members other than the semiconductor light emitting element constituting the optical module, and it is possible to appropriately adjust the temperature.

The optical module may further include a mirror drive mechanism that is arranged in the second region when viewed in the thickness direction of the endothermic plate and scans the light emitted from the semiconductor light emitting device. The mirror drive mechanism scans the light emitted from the semiconductor light emitting element by periodically swinging the mirror that reflects the light emitted from the semiconductor light emitting element. When the optical module includes a mirror drive mechanism, the light emitted from the semiconductor light emitting element can be scanned and emitted to the outside of the optical module. Then, the optical module can draw using the light emitted from the semiconductor light emitting element. Here, the swing motion of the mirror is highly temperature-dependent, and the swing angle of the mirror changes significantly unless the temperature of the mirror drive mechanism is within a certain temperature range. Then, the light emitted from the semiconductor light emitting device cannot be properly scanned. Further, if the relative position of the mirror drive mechanism with respect to the semiconductor light emitting element is displaced in an environment where the temperature changes, the amount of displacement of the optical axis adjusted while the optical module is not operating becomes large. That is, even in an environment where the temperature changes, a strict arrangement of the mirror drive mechanism for the semiconductor light emitting device is required.

However, by arranging the mirror drive mechanism in the second region, the temperature of the mirror drive mechanism can be adjusted by the second electric circuit in the second region. Therefore, the temperature of the mirror drive mechanism can be adjusted separately from the semiconductor light emitting device which is arranged in the first region and generates heat during operation. Therefore, the temperature of each of the semiconductor light emitting device and the mirror drive mechanism can be appropriately adjusted. As a result, the change in the runout angle of the mirror can be reduced. Further, since the endothermic plate is composed of a single plate-shaped member, even if the heat sink is warped due to thermal expansion or contraction due to a temperature change, the relative members on the heat sink due to the warp of the heat sink. It is possible to suppress the deviation of the target position. Therefore, even in an environment where the temperature changes, it is possible to suppress the deviation of the optical axis of the light emitted from the semiconductor light emitting element, which is adjusted for the swinging mirror. As a result, drawing by the optical module can be appropriately performed.

[Details of Embodiments of the present disclosure]
Next, an embodiment of the optical module of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals and the description thereof will not be repeated.

(Embodiment 1)
The electronic cooling module according to the first embodiment of the present disclosure will be described. FIG. 1 is a schematic side view of the electronic cooling module according to the first embodiment. FIG. 2 is a schematic plan view of the electronic cooling module of the first embodiment shown in FIG. FIG. 3 is a schematic perspective view schematically showing a part of the electronic cooling module of the first embodiment. In FIG. 2, the thermistors 101A and 101B, which will be described later, are omitted from the illustration, and the heat sink 31A and the endothermic plate 32A, which will be described later, are shown by broken lines. Further, in FIG. 3, the endothermic plate 32A is shown by a broken line.

With reference to FIGS. 1, 2 and 3, the electronic cooling module 30A according to the first embodiment includes a heat sink 31A and an endothermic plate 32A. The electronic cooling module 30A may be referred to as a TEC (Thermo-Electric Cooler). The heat radiating plate 31A and the heat absorbing plate 32A each have a flat plate shape. The heat radiating plate 31A and the heat absorbing plate 32A each have a rectangular shape, specifically, a rectangular shape when viewed in the thickness direction, and have the same shape. Also, the thickness is the same. In FIGS. 1, 2 and 3, the direction indicated by the arrow X or vice versa indicates the longitudinal direction of the heat radiating plate 31A and the heat absorbing plate 32A, and is indicated by the direction indicated by the arrow Y or vice versa. The direction indicates the lateral direction of the heat radiating plate 31A and the heat absorbing plate 32A, and the direction indicated by the arrow Z or the opposite direction indicates the thickness direction of the heat radiating plate 31A and the heat absorbing plate 32A.

The endothermic plate 32A is arranged apart from the heat sink 31A in the thickness direction. As the material of the heat radiating plate 31A and the heat absorbing plate 32A, for example, alumina is selected. The heat sink 31A includes one main surface 11A facing the endothermic plate 32A in the thickness direction and the other main surface 11B located on the opposite side of the one main surface 11A in the thickness direction. The endothermic plate 32A includes one main surface 12A and the other main surface 12B located on the opposite side of the one main surface 12A in the thickness direction and facing the heat sink 31A.

The endothermic plate 32A includes a first region 34A shown by a region surrounded by a two-dot chain line and a second region 34B shown by a region surrounded by a two-dot chain line. The first region 34A and the second region 34B are arranged apart from each other in the thickness direction of the endothermic plate 32A. In the present embodiment, the first region 34A and the second region 34B are arranged apart from each other in the X direction. Each of the first region 34A and the second region 34B has a rectangular shape in which the length in the Y direction is longer than the length in the X direction when viewed in the thickness direction of the endothermic plate 32A.

The electronic cooling module 30A includes a plurality of first semiconductor columns 33A and a plurality of second semiconductor columns 33B. The plurality of first semiconductor columns 33A and the plurality of second semiconductor columns 33B are each composed of a Pelche element, and include a p-type one and an n-type one. The first semiconductor column 33A and the second semiconductor column 33B are manufactured by using, for example, a BiTe-based material. The first semiconductor pillar 33A and the second semiconductor pillar 33B are arranged with a space between the heat radiating plate 31A and the heat absorbing plate 32A, respectively. The plurality of first semiconductor columns 33A are arranged in a region overlapping the first region 34A (in the XY plane) in the thickness direction of the endothermic plate 32A. The plurality of second semiconductor columns 33B are arranged in a region overlapping the second region 34B (in the XY plane) when viewed in the thickness direction of the endothermic plate 32A. A plurality of p-type first semiconductor columns 33A and a plurality of n-type first semiconductor columns 33A are alternately arranged at intervals. Similarly, the plurality of p-type second semiconductor columns 33B and the plurality of n-type second semiconductor columns 33B are alternately arranged at intervals.

The first semiconductor column 33A is connected to the heat radiating plate 31A with the thin plate-shaped electrode 35A, which is rectangular in the thickness direction of the endothermic plate 32A, interposed therebetween. The first semiconductor column 33A is connected to the heat absorbing plate 32A with the thin plate-shaped electrode 36A, which is rectangular in the thickness direction of the heat absorbing plate 32A, interposed therebetween. In FIG. 2, the electrode 35A is shown by a solid line, and the electrode 36A is shown by a broken line. The end of the p-type first semiconductor column 33A is connected to the end of the n-type first semiconductor column 33A adjacent to one side by a thin plate-shaped electrode 35A. Further, the end portion of the p-type first semiconductor column 33A different from the end portion is connected to the n-type first semiconductor column 33A adjacent to the side different from the one side by the thin plate-shaped electrode 36A. In this way, all the first semiconductor columns 33A are connected in series. The power supply 39A and the control unit 38A that electrically controls the circuit are electrically connected to the first semiconductor column 33A connected in series, and the first electric circuit 37A included in the electronic cooling module 30A is configured. .. That is, the first electric circuit 37A is configured by electrically connecting a plurality of first semiconductor columns 33A.

The second semiconductor column 33B is connected to the heat radiating plate 31A with the thin plate-shaped electrode 35B, which is rectangular in the thickness direction of the heat absorbing plate 32A, interposed therebetween. The second semiconductor column 33B is connected to the heat absorbing plate 32A with the thin plate-shaped electrode 36B, which is rectangular in the thickness direction of the heat absorbing plate 32A, interposed therebetween. In FIG. 2, the electrode 35B is shown by a solid line, and the electrode 36B is shown by a broken line. The end of the p-type second semiconductor column 33B is connected to the end of the n-type second semiconductor column 33B adjacent to one side by a thin plate-shaped electrode 35B. Further, the end portion of the p-type second semiconductor column 33B different from the end portion is connected to the n-type second semiconductor column 33B adjacent to the side different from the one side by the thin plate-shaped electrode 36B. In this way, all the second semiconductor columns 33B are connected in series. The power supply 39B and the control unit 38B that electrically controls the circuit are electrically connected to the second semiconductor column 33B connected in series, and the second electric circuit 37B included in the electronic cooling module 30A is configured. .. That is, the second electric circuit 37B is configured by electrically connecting a plurality of second semiconductor columns 33B.

The electronic cooling module 30A includes a thermistor 101A as a first temperature detecting unit that detects the temperature of the first region 34A, and a thermistor 101B as a second temperature detecting unit that detects the temperature of the second region 34B. The thermistor 101A is mounted on one main surface 12A in the first region 34A of the endothermic plate 32A. The thermistor 101A can detect the temperature of the endothermic plate 32A in the first region 34A. The thermistor 101B is mounted on one main surface 12A in the second region 34B of the endothermic plate 32A. The thermistor 101B can detect the temperature of the endothermic plate 32A in the second region 34B.

In such an electronic cooling module 30A, consider a case where a member having a temperature distribution is arranged on a heat absorbing plate 32A so that a temperature distribution is generated between the first region 34A and the second region 34B. The endothermic plate 32A includes a first region 34A and a second region 34B disposed apart from the first region 34A. In the first region 34A, the temperature of the first region 34A can be adjusted by controlling the amount of current flowing through the first electric circuit 37A configured by electrically connecting a plurality of first semiconductor columns 33A. .. Further, in the second region 34B, the temperature of the second region 34B is adjusted by controlling the amount of current flowing through the second electric circuit 37B configured by electrically connecting a plurality of second semiconductor columns 33B. Can be done. That is, the temperature can be adjusted separately in the first region 34A and the second region 34B of the endothermic plate 32A. Specifically, for example, when the members are arranged in a temperature distribution such that the temperature of the first region 34A of the heat absorbing plate 32A is higher than that of the second region 34B of the heat absorbing plate 32A, the members are arranged in the first electric circuit 37A. The current flowing through the second electric circuit 37B can be increased and the current flowing through the second electric circuit 37B can be reduced, so that the first region 34A can be positively cooled as compared with the second region 34B. In FIG. 3, the magnitude of the flowing current is schematically shown by the magnitude of the arrow. Further, since the heat absorbing plate 32A is composed of a single plate-shaped member, even if the heat radiating plate 31A is warped due to thermal expansion or contraction due to a temperature change, the heat absorbing plate 32A is on the heat absorbing plate 32A due to the warping of the heat radiating plate 31A. It is possible to suppress the relative positional deviation of the members of. In addition, it is not necessary to prepare and install a plurality of electronic cooling modules, and workability can be improved. Therefore, according to such an electronic cooling module 30A, the temperature of the member in which the temperature distribution occurs can be appropriately adjusted, and the workability at the time of manufacturing can be improved.

In the present embodiment, the thermistor 101A as a first temperature detecting unit for detecting the temperature of the first region 34A and the thermistor 101B as a second temperature detecting unit for detecting the temperature of the second region 34B are included. Therefore, the temperature of each region can be adjusted based on the temperature of the first region 34A detected by the thermistor 101A and the temperature of the second region 34B detected by the thermistor 101B. Therefore, the temperature of each of the first region 34A and the second region 34B can be adjusted more appropriately.

(Embodiment 2)
Next, as the second embodiment, the optical module including the electronic cooling module 30A in the first embodiment will be described. FIG. 4 is an external perspective view showing the structure of the optical module including the electronic cooling module according to the first embodiment. FIG. 5 is an external perspective view showing a state in which the cap of the optical module shown in FIG. 4 is removed. 6 and 7 are schematic cross-sectional views of an optical module including an electronic cooling module according to the first embodiment. FIG. 6 is a view of the optical module shown in FIG. 4 cut in an XY plane including a cap and not including a light forming portion, and viewed in the thickness direction of a support plate. FIG. 7 shows the optical module shown in FIG. 4 cut in an XX plane including a cap and not including a light forming portion, and viewed in a direction perpendicular to the thickness direction of the support plate, specifically in the Y direction. It is a figure.

With reference to FIGS. 4 to 7, the optical module 1 is configured to form light with the electronic cooling module 30A of the first embodiment described above, and is arranged on the electronic cooling module 30A. A portion 20 and a protective member 2 that surrounds the light forming portion 20 and seals the light forming portion 20 are provided. The protective member 2 includes a flat plate-shaped support plate 10 as a base body and a cap 40 which is a lid portion welded to the support plate 10. The electronic cooling module 30A is arranged on one main surface 10A of the support plate 10 so that the other main surface 11B of the heat sink 31A comes into contact with one main surface 10A of the support plate 10. The light forming portion 20 is mounted on the support plate 10. Specifically, the light forming unit 20 is arranged on the electronic cooling module 30A arranged on one main surface 10A of the support plate 10. The cap 40 is arranged in contact with one main surface 10A of the support plate 10 so as to cover the light forming portion 20. The light forming portion 20 is hermetically sealed by the protective member 2. Since the light forming portion 20 is surrounded by the support plate 10 and the cap 40, each member included in the light forming portion 20 is effectively protected from the external environment. A plurality of lead pins 51 are provided on the support plate 10 so as to penetrate from the other main surface 10B side of the support plate 10 to the one main surface 10A side and project to both sides of one main surface 10A side and the other main surface 10B side. It is installed in.

The light forming unit ₂₀ includes a red laser diode 81 as a semiconductor light emitting device that emits red light in the direction indicated by the arrow L1 and _a green laser as a semiconductor light emitting element that emits green light in the direction indicated by the arrow L2. A diode 82, a blue laser diode 83 as a semiconductor light emitting device that emits blue light in the direction indicated by the arrow L3 _, a first lens 91, a second lens 92, a third lens 93, and a first filter 97. A second filter 98, a third filter 99, a plate-shaped laser diode base 60, and a rectangular block portion 61 are included. The light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 is combined and emitted from the window 42 to the outside of the optical module 1.

The laser diode base 60 has one main surface 60A and the other main surface 60B having a rectangular shape (square shape) when viewed in the thickness direction. The laser diode base 60 is arranged on one main surface 12A of the endothermic plate 32A so that the other main surface 60B of the laser diode base 60 contacts one main surface 12A of the endothermic plate 32A. The laser diode base 60 is arranged in the first region 34A. The block portion 61 is mounted on a part of one main surface 60A of the laser diode base 60.

On one main surface 61A of the block portion 61, a flat plate-shaped first submount 71, a second submount 72, and a third submount 73 are arranged side by side. A red laser diode 81 is arranged on the first submount 71. A green laser diode 82 is arranged on the second submount 72. A blue laser diode 83 is arranged on the third submount 73. A thermistor 101A for detecting the temperature of the block portion 61 is arranged on one main surface 61A of the block portion 61. Here, the light forming unit 20 is arranged in the first region 34A when viewed in the thickness direction of the heat absorbing plate 32A, and is a red laser diode 81, a green laser diode 82, and a blue laser as semiconductor light emitting elements that emit light. Includes diode 83.

A first lens 91, a second lens 92, and a third lens 93 that convert the spot size of light are arranged on one main surface 60A of the laser diode base 60. The first lens 91, the second lens 92, and the third lens 93 convert the spot size of the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83, respectively. The light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 is converted into collimated light by the first lens 91, the second lens 92, and the third lens 93.

A first filter 97, a second filter 98, and a third filter 99 are arranged on one main surface 60A of the laser diode base 60. The first filter 97 reflects red light. The second filter 98 transmits red light and reflects green light. The third filter 99 transmits red light and green light and reflects blue light. As described above, the first filter 97, the second filter 98 and the third filter 99 selectively transmit and reflect light having a specific wavelength. As a result, the first filter 97, the second filter 98, and the third filter 99 combine the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. The combined light travels along the direction indicated by the arrow _L4 .

Further, the optical module 1 includes an aperture member 55 as a beam shaping portion of light formed by the light forming portion 20. The aperture member 55 has a flat plate shape. The aperture member 55 has a through hole 55A that penetrates the aperture member 55 in the thickness direction. In the present embodiment, the shape of the through hole 55A in the cross section perpendicular to the extending direction is circular. The aperture member 55 is emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 in a cross section perpendicular to the traveling direction of the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. Shape the shape of the light. The aperture member 55 is arranged on one main surface 12A of the endothermic plate 32A. Specifically, the aperture member 55 is arranged in the second region 34B when viewed in the thickness direction of the endothermic plate 32A. The aperture member 55 is arranged on the side opposite to the second filter 98 when viewed from the third filter 99. The aperture member 55 is arranged so that the through hole 55A is located in the region corresponding to the optical path of the combined light in the first filter 97, the second filter 98, and the third filter 99. The aperture member 55, the stage 65A described later, and the mirror drive mechanism 110 are also hermetically sealed by the protective member 2 together with the light forming portion 20 and the like.

Further, the optical module 1 is a mirror drive that scans the light emitted from the light forming unit 20, specifically, the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83, and the combined light is scanned. The mechanism 110 and the stage 65A are included. The mirror drive mechanism 110 includes a mirror 111 capable of swinging motion. The mirror drive mechanism 110 scans by reflecting the light emitted from the light forming unit 20 by the mirror 111 that is swung at high speed. A part of the scanned light is indicated by an arrow _L5 in FIG. The stage 65A has the shape of a straight triangular prism. The stage 65A supports the mirror drive mechanism 110. The stage 65A that supports the mirror drive mechanism 110 is arranged on the endothermic plate 32A. The stage 65A is also arranged on one main surface 12A of the endothermic plate 32A, similarly to the aperture member 55. Specifically, the stage 65A is arranged in the second region 34B when viewed in the thickness direction of the endothermic plate 32A. That is, the optical module 1 is arranged in the second region 34B when viewed in the thickness direction of the heat absorbing plate 32A, and is a mirror drive that scans the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. Includes mechanism 110. The stage 65A and the mirror drive mechanism 110 are arranged on the side opposite to the third filter 99, which will be described later, when viewed from the aperture member 55.

According to the optical module 1 of the present disclosure, the region in which the red laser diode 81, the green laser diode 82, and the blue laser diode 83, which are semiconductor light emitting elements, are arranged is arranged in the first region 34A, whereby in the first region 34A. It can be controlled by the first electric circuit 37A. Therefore, the temperature can be adjusted separately in the first region 34A and the second region 34B in which the red laser diode 81, the green laser diode 82, and the blue laser diode 83 are not arranged. Therefore, according to such an optical module 1, the influence of temperature on the members other than the red laser diode 81, the green laser diode 82, and the blue laser diode 83 constituting the optical module 1 can be reduced, and the temperature can be appropriately adjusted. Can be adjusted.

Here, the swing motion of the mirror 111 is highly temperature-dependent, and the swing angle of the mirror 111 changes significantly unless the temperature of the mirror drive mechanism 110 is within a certain temperature range. Then, the light emitted from the light forming unit 20 cannot be properly scanned. Further, if the relative positions of the mirror drive mechanism 110 with respect to the red laser diode 81, the green laser diode 82, and the blue laser diode 83 shift in an environment where the temperature changes, the optical module 1 is adjusted in a non-operating state. The amount of deviation of the optical axis becomes large. That is, even in an environment where the temperature changes, a strict arrangement of the mirror drive mechanism 110 with respect to the red laser diode 81, the green laser diode 82, and the blue laser diode 83 is required. By arranging the mirror drive mechanism 110 in the second region 34B in the optical module 1, the temperature of the mirror drive mechanism 110 can be adjusted by the second electric circuit 37B in the second region 34B. Therefore, the temperature of the mirror drive mechanism 110 can be adjusted separately from the red laser diode 81, the green laser diode 82, and the blue laser diode 83, which are arranged in the first region 34A and generate heat during operation. Therefore, the temperature of each of the red laser diode 81, the green laser diode 82, the blue laser diode 83, and the mirror drive mechanism 110 can be appropriately adjusted. As a result, the change in the runout angle of the mirror 111 can be reduced. Further, since the heat absorbing plate 32A is composed of a single plate-shaped member, even if the heat radiating plate 31A is warped due to thermal expansion or contraction due to a temperature change, the heat absorbing plate 32A is on the heat absorbing plate 32A due to the warping of the heat radiating plate 31A. It is possible to suppress the relative positional deviation of the members of. Therefore, even in an environment where the temperature changes, it is possible to suppress the deviation of the optical axis of the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83, which are adjusted for the swinging mirror 111. Can be done. As a result, drawing by the optical module 1 can be appropriately performed.

(Embodiment 3)
Next, the third embodiment, which is still another embodiment, will be described. FIG. 8 is a schematic side view of the electronic cooling module according to the third embodiment. The shape of the endothermic plate of the electronic cooling module of the third embodiment is different from that of the first embodiment.

With reference to FIG. 8, the electronic cooling module 30B of the third embodiment includes a heat sink 31B and an endothermic plate 32B. The electronic cooling module 30B is arranged between the first region 34A and the second region 34B when viewed in the thickness direction of the heat absorbing plate 32B, and has a groove portion 13 for reducing the wall thickness of the heat absorbing plate 32B. The groove portion 13 is formed on one main surface 12A side. The groove portion 13 is formed so as to extend in the Y direction. By doing so, it is possible to suppress heat transfer through the heat absorbing plate 32B between the first region 34A and the second region 34B. Therefore, the temperature of each of the first region 34A and the second region 34B can be adjusted more appropriately.

In the above embodiment, the groove portion 13 may be formed on the other main surface 12B side. Further, the groove portions 13 may not be continuous in the Y direction and may be partially formed. Further, a configuration in which a plurality of groove portions 13 are formed intermittently may be adopted. The groove portion 13 may have a cross section formed of a curved surface such as an arc surface.

(Embodiment 4)
Next, the fourth embodiment, which is still another embodiment, will be described. FIG. 9 is a schematic side view of the electronic cooling module according to the fourth embodiment. In the electronic cooling module of the fourth embodiment, the configuration of the arrangement of the semiconductor columns is different from that of the first embodiment.

With reference to FIG. 9, the electronic cooling module 30C of the fourth embodiment includes a heat sink 31C and an endothermic plate 32C. When viewed in the thickness direction of the heat absorbing plate 32C, the distance between the first region 34A and the second region 34B is wider than the distance between the plurality of first semiconductor columns 33A and the distance between the plurality of second semiconductor columns 33B. In this case, the areas of the heat radiating plate 31C and the heat absorbing plate 32C are increased, specifically, the length in the X direction is made longer than in the case of the first embodiment, and the first region 34A and the second region 34B are formed. There is an interval between. By doing so, the first region 34A and the second region 34B can be physically widely spaced apart. Therefore, the temperature of each of the first region 34A and the second region 34B can be adjusted more appropriately. In the above embodiment, a notch may be provided in the region between the first region 34A and the second region 34B so as to penetrate in the thickness direction of the endothermic plate 32A.

(Embodiment 5)
Next, the fifth embodiment, which is still another embodiment, will be described. FIG. 10 is a schematic side view of the electronic cooling module according to the fifth embodiment. In the electronic cooling module of the fifth embodiment, the configuration of the arrangement of the semiconductor columns is different from that of the fourth embodiment.

With reference to FIG. 10, the electronic cooling module 30D of the fifth embodiment includes a heat sink 31D and an endothermic plate 32D. The electronic cooling module 30D is arranged between the first region 34A and the second region 34B when viewed in the thickness direction of the endothermic plate 32D, and is electrically connected to both the first electric circuit 37A and the second electric circuit 37B. Includes a third semiconductor column 33D that is not connected and connects the heat dissipation plate 31D and the endothermic plate 32D. By doing so, the first region 34A and the second region 34B can be separated by the region in which the third semiconductor column 33D is arranged, and the first region 34A and the second region 34B can be separated from each other. Heat transfer can be suppressed. Therefore, the temperature of each of the first region 34A and the second region 34B can be adjusted more appropriately.

(Other embodiments)
In the above embodiment, the optical module 1 is configured to include a red laser diode, a green laser diode, and a blue laser diode, but the present invention is not limited to this, and at least one color, that is, a red laser diode. The configuration may include at least one of a green laser diode and a blue laser diode.

Further, in the above embodiment, the case where the member is cooled on the endothermic plate side on which the member is placed has been described, but the member is heated on the endothermic plate side according to the temperature of the surrounding environment or the temperature of the member to be adjusted. However, it may be configured to cool on the heat sink side.

In the above embodiment, the endothermic plate includes a first region and a second region arranged apart from the first region in the thickness direction, but the present invention is not limited to this. The endothermic plate may include a third region different from the first region and the second region. That is, the endothermic plate is arranged separately from the first region, the second region arranged apart from the first region in the thickness direction, and the first region and the second region in the thickness direction. The third region to be processed may be included. The electronic cooling module is arranged between the heat radiating plate and the heat absorbing plate in a region overlapping the third region when viewed in the thickness direction of the heat absorbing plate, and is connected to the heat radiating plate and the heat absorbing plate. It may include four semiconductor columns and a third electric circuit configured by electrically connecting a plurality of fourth semiconductor columns. By doing so, in addition to the temperature control in the first region and the second region of the endothermic plate, the temperature control in the third region of the endothermic plate can be performed separately from the first region and the second region, respectively. can. Therefore, more precise temperature control on the endothermic plate can be performed. Of course, a fourth region, a fifth region, and the like in which temperature control is performed individually may be provided.

It should be understood that the embodiments disclosed here are exemplary in all respects and are not restrictive in any way. The scope of the present invention is defined by the scope of claims, not the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

The electronic cooling module and the optical module of the present disclosure are particularly advantageously applied when it is required that the temperature of a member in which a temperature distribution occurs can be appropriately adjusted and workability during manufacturing can be improved. obtain.

1 Optical module 2 Protective member 4 Base member 10 Support plate 10A, 10B, 11A, 11B, 12A, 12B, 60A, 60B, 61A Main surface 13 Groove 20 Optical forming part 30A, 30B, 30C, 30D Electronic cooling module 31A, 31B , 31C, 31D Heat dissipation plate 32A, 32B, 32C, 32D Heat absorbing plate 33A 1st semiconductor pillar 33B 2nd semiconductor pillar 33D 3rd semiconductor pillar 34A 1st region 34B 2nd region 35A, 35B, 36A, 36B Electrode 37A 1st Electric circuit 37B Second electric circuit 38A, 38B Control unit 39A, 39B Power supply 40 Cap 42 Window 51 Lead pin 55 Aperture member 55A Through hole 60 Laser diode base 61 Block part 65A Stage 71 First submount 72 Second submount 73 Second 3 Submount 81 Red laser diode 82 Green laser diode 83 Blue laser diode 91 1st lens 92 2nd lens 93 3rd lens 97 1st filter 98 2nd filter 99 3rd filter 101A, 101B Thermista 110 Mirror drive mechanism 111 Mirror L ₁ , L ₂ , L ₃ , L ₄ , L ₅ Arrows

Claims (7)

One heat sink and
It has a single plate shape, includes a first region and a second region arranged apart from the first region when viewed in the thickness direction, and is arranged apart from the heat sink in the thickness direction. With a heat sink,
A plurality of first units arranged between the heat radiating plate and the heat absorbing plate and overlapping the first region in the thickness direction of the heat absorbing plate, and connected to the heat radiating plate and the heat absorbing plate. With semiconductor pillars
A plurality of second units arranged between the heat radiating plate and the heat absorbing plate and overlapping the second region in the thickness direction of the heat absorbing plate, and connected to the heat radiating plate and the heat absorbing plate. With semiconductor pillars
A first electric circuit configured by electrically connecting the plurality of first semiconductor columns,
An electronic cooling module including a second electric circuit configured by electrically connecting the plurality of second semiconductor columns. A first temperature detection unit that detects the temperature in the first region,
The electronic cooling module according to claim 1, further comprising a second temperature detecting unit for detecting the temperature in the second region. The electronic cooling according to claim 1 or 2, which is arranged between the first region and the second region when viewed in the thickness direction of the endothermic plate and has a groove portion for reducing the wall thickness of the endothermic plate. module. Any one of claims 1 to 3, wherein the distance between the first region and the second region is wider than the distance between the plurality of first semiconductor columns and the distance between the plurality of second semiconductor columns. Electronic cooling module as described in the section. It is arranged between the first region and the second region when viewed in the thickness direction of the endothermic plate, and is electrically connected to both the first electric circuit and the second electric circuit. The electronic cooling module according to any one of claims 1 to 4, further comprising a third semiconductor column connecting the heat radiating plate and the endothermic plate. Support plate and
The electronic cooling module according to any one of claims 1 to 5, which is arranged on the support plate.
It comprises a light forming unit configured to form light and arranged on the electronic cooling module.
The light forming part is
An optical module including a semiconductor light emitting element that is arranged in the first region when viewed in the thickness direction of the endothermic plate and emits light. The optical module according to claim 6, further comprising a mirror drive mechanism that is arranged in the second region when viewed in the thickness direction of the endothermic plate and scans the light emitted from the semiconductor light emitting device.

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