JP2022056167A - Air blower and mounting device of electronic component - Google Patents

Abstract

To provide an air blower that can form a downflow capable of suppressing the blow-up of dust, and a mounting device of an electronic component.SOLUTION: An air blower 1 has: a fan filter unit (FFU) 10; a pressurizing chamber 20 into which gas from the FFU 10 flows; and a ventilation plate 30 that constitutes at least a part of the bottom surface of the pressurizing chamber 20 and has a plurality of vents 31 through which gas from the pressurizing chamber 20 passes, where a thickness t of the ventilation plate 30 is within a range of two-fifths to four-fifths of a diameter D of the vent 31.SELECTED DRAWING: Figure 1

Description

The present invention relates to a blower and a mounting device for electronic components.

A mounting machine that mounts electronic components such as semiconductor chips on a substrate needs to be mounted in a highly clean space in order to prevent mounting defects. For this reason, the mounting machine is provided with a cover that covers the mounting machine, and a downflow, which is an air flow downward from the ceiling, is generated in the cover to exhaust dust and the like generated from the mechanical portion and the like. Prevents dust from adhering to electronic components.

As a configuration for causing this downflow, a pressurizing chamber is provided above the space where the downflow is desired to be generated, and the pressure chamber is sucked by a fan, a blower, etc. to increase the air pressure inside the pressurizing chamber. It is configured to blow downward through a flow resistance imparting member provided at the bottom of the pressurizing chamber. Further, in order to improve the cleanliness of the air to be supplied, it is common to supply air to the pressurized chamber via a fan filter unit such as HEPA.

The flow resistance imparting member imparts sufficient flow resistance in order to bring the pressure distribution in the pressurizing chamber closer to uniform and cause downflow. As the flow resistance imparting member, in addition to the net material, a punching plate having through holes formed in a metal plate is generally used.

Japanese Unexamined Patent Publication No. 62-288433

In recent years, even in the mounting of electronic components, a clean environment that can obtain class 1 (ISO3) cleanliness at the pre-process level of semiconductor manufacturing has been required, and very fine control is also required for dust winding. It has come to be needed. For example, in a 3D package or hybrid bonding in which the degree of integration is increased by arranging semiconductor chips in multiple layers, it is necessary to bond electrodes having a very narrow pitch. Therefore, when mounting electronic components on a substrate, higher accuracy, for example, accuracy on the order of submicrons is required.

Further, at the time of mounting, an error due to the operation of the mechanical portion for mounting and dust generated by the operation may cause a bonding failure. However, even if the downflow is formed by using the fan filter unit as described above, unacceptable dust winding may occur in the required clean environment.

The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide a blower and an electronic component mounting device capable of forming a downflow capable of suppressing the winding of dust. To do.

The blower of the present invention constitutes at least one fan filter unit, a pressurizing chamber into which gas from the fine filter unit flows, and at least a part of the bottom surface of the pressurizing chamber, and is provided from the pressurizing chamber. It has a vent plate having a plurality of vents through which gas passes, and at least a part of the vents has a thickness of two-fifths to four-fifths of the diameter of the vents.

The electronic component mounting device of the present invention includes a chamber provided with the blower at the top, and a mounting machine provided in the chamber for mounting the electronic components.

The present invention is to provide a blower and an electronic component mounting device capable of forming a downflow capable of suppressing the roll-up of dust.

It is a partial cross-sectional view which shows the schematic structure of the mounting apparatus to which the blower of 1st Embodiment is applied. It is a perspective view which shows a part of a ventilation plate. It is a graph which shows the average velocity of the lateral wind in the downflow region in the case of an aperture ratio of 10%. It is a graph which shows the average velocity of the lateral wind in the downflow region in the case of an aperture ratio of 20%. It is a graph which shows the average velocity of the lateral wind in the downflow region in the case of an aperture ratio of 50%. It is a graph which shows the average velocity of the lateral wind in the downflow region in the case of an aperture ratio of 70%. It is a graph which shows the optimum ratio of the thickness of the ventilation plate and the diameter of the ventilation hole according to the opening ratio of the ventilation plate. It is explanatory drawing which shows the change of the wind direction of the downflow region when the thickness of a ventilation plate is changed. It is explanatory drawing which shows the air flow when the ventilation plate is made thinner than the optimum value. It is explanatory drawing which shows the air flow when the ventilation plate is made thicker than the optimum value. It is explanatory drawing which shows the air flow when the ventilation plate is set to the optimum value. It is explanatory drawing which shows the air flow when FFU is installed in the center of a pressurizing chamber. It is sectional drawing (A) and plan view (B) which show the mounting apparatus of 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
[Constitution]
As shown in FIG. 1, the blower 1 of the present embodiment has a fan filter unit (FFU: Fan Filter Unit) 10, a pressurizing chamber 20, and a ventilation plate 30. The blower 1 is provided in the upper part of the chamber 40 configured as a clean room.

Although not shown, the fan filter unit (hereinafter referred to as FFU) 10 has a ULPA filter installed downstream of the fan, and supplies purified air to the pressurizing chamber 20 via the ULPA filter. The pressurizing chamber 20 is a space in which the gas from the FFU 10 flows in and the atmospheric pressure is increased. The pressurizing chamber 20 has a rectangular parallelepiped shape in which the length of the vertical side is shorter than the length of the horizontal side.

The ventilation plate 30 constitutes the bottom surface of the pressurizing chamber 20. As shown in FIG. 2, the ventilation plate 30 has a plurality of ventilation holes 31 through which the gas from the pressurizing chamber 20 passes. The ventilation hole 31 is a cylindrical through hole about the vertical direction. In the present embodiment, the ventilation holes 31 are provided on the surface of the ventilation plate 30 at equal intervals. The ventilation plate 30 can be a punching plate having a ventilation hole 31 formed by punching, for example, a plate made of metal or resin.

The thickness t of the ventilation plate 30, that is, the length in the vertical direction is preferably 3 mm to 7 mm. However, in order to reduce bending, it is more preferably 5 mm to 6 mm. The relationship between the thickness t of the ventilation plate 30 and the diameter D of the ventilation holes 31 will be described later.

The chamber 40 is a rectangular parallelepiped-shaped container in which an electronic component mounting machine 50 is housed. By providing the blower 1 on the upper part of the chamber 40, the ventilation plate 30 of the pressurizing chamber 20 constitutes the ceiling of the chamber 40. An exhaust port 41 is provided at the bottom of the chamber 40. Therefore, the gas in the chamber 40 is discharged from the exhaust port 41 at the bottom of the chamber 40 together with the dust. The mounting machine 50 is installed on a gantry 60 installed on the floor surface F of a factory or the like.

である。通気孔３１の配置面積は、通気孔３１が形成された領域を囲う面積であり、通気板３０の全体に均等に通気孔３１が設けられている場合、配置面積は、通気板３０の全体の面積と同等である。 [Thickness of ventilation plate and diameter of ventilation holes]
The thickness t of the ventilation plate 30 is two-fifths to four-fifths the diameter of the ventilation holes 31. Further, the arrangement density of the ventilation holes 31 is (the number of arrangements of the ventilation holes) / (the arrangement area of the ventilation holes), and the cross-sectional area orthogonal to the axis of one (one) of the ventilation holes 31 is {π (π (. When the ventilation hole diameter is ^2/4 } (π is the circumference) and the opening ratio of the ventilation hole 31 is {π (ventilation diameter) ^2/4 } × (vent arrangement density). , At least a part of the thickness t of the ventilation plate 30

Is. The arrangement area of the ventilation holes 31 is an area surrounding the area where the ventilation holes 31 are formed, and when the ventilation holes 31 are evenly provided on the entire ventilation plate 30, the arrangement area is the entire ventilation plate 30. Equivalent to the area.

The inventor has found that the airflow flowing through the through hole of the punching plate conventionally used is influenced by the direction of the airflow in the pressurizing chamber. That is, the airflow in the pressurizing chamber above the punching plate does not necessarily go downward in the vertical direction. For example, due to the convenience of the equipment to be installed, it may be necessary to blow air from a direction that intersects laterally, that is, a vertical direction, through a duct. As described above, when the lateral flow component is included, the airflow passing through the through hole is also affected by the lateral flow, and the slope with respect to the vertical direction becomes a large downflow.

In order to deal with this, even if the fan filter unit is arranged directly above the center of the punching plate, the direction of the airflow becomes lateral as the distance from the center of the punching plate increases, so that the same phenomenon as described above occurs. It is also conceivable to arrange a large number of fan filter units so that air is supplied in the vertical direction toward the entire punching plate. However, the equipment that can secure such a space on the punching plate is limited, and preparing a large number of fan filter units has a problem in terms of cost. In addition, if the pressure loss in the punching plate is increased so that the air is supplied in the vertical direction toward the entire punching plate, a sufficient downflow flow rate cannot be obtained and dust is sufficiently discharged. I can't.

The inventor paid attention to the thickness t of the ventilation plate 30, the ratio of the thickness t to the diameter D, and the opening ratio of the ventilation hole 31, which were not conventionally considered for the air flow. Then, while making the thickness t of the ventilation plate 30 such as a punching plate having a simple structure durable for actual use, a value capable of causing a downflow close to vertical was examined.

The results are shown in FIGS. 3 to 6. 3 to 6 show that the thickness t of the ventilation plate 30 is the horizontal axis and the diameter D of the ventilation hole 31 is the vertical axis, and the opening ratio of the ventilation hole 31 is changed to ventilate the ventilation plate 30 and the airflow flows down. It is a graph which plotted the average wind speed of the crosswind generated in the downflow region with the shade of hatching. A positive value of wind speed m / s indicates that it is in the same lateral direction as above the ventilation plate 30, and a negative value indicates that it is in the opposite lateral direction. The wind speed was calculated by the three-dimensional finite element method. The "average wind speed of crosswinds generated in the downflow region" is the average value of the wind speed in the downstream cross section separated from the ventilation plate 30 by four times the length of the thickness t or the pitch of the ventilation holes 31, whichever is larger. Is. In each figure, the downflow flow rate per 1 m ² of horizontal area was set to 30 m ³ / min.

FIG. 3 shows an aperture ratio of 10%, FIG. 4 shows an aperture ratio of 20%, FIG. 5 shows an aperture ratio of 50%, and FIG. 6 shows an aperture ratio of 70%. In each figure, (A) and (B) have different angles at which the airflow in the pressurizing chamber 20 hits the ventilation holes 31 with respect to the vertical direction. (A) is 80 ° and (B) is 60 °. That is, the angle of the airflow flowing into the ventilation hole 31 is closer to horizontal and shallower in (A). The allowable crosswind is a region where the absolute value of the wind speed is 0.1 m / s or less, that is, the wind speed in the lateral direction is between −0.1 and +0.1 m / s. In the figure, the range of "OK" indicated by the dotted line and the double-headed arrow is the approximate allowable condition region of the crosswind. Therefore, it is preferable to select a ventilation plate 30 having a performance that satisfies such a condition region. It should be noted that the jaggedness at the boundary between the shades of hatching is due to an error in the numerical calculation.

As shown in FIGS. 3 to 6, when the inclination of the airflow with respect to the vertical direction is large, that is, when the angle of the airflow with respect to the surface of the ventilation plate 30 is small, the allowable condition region becomes narrow.

If the pressurizing chamber 20 is large and the height is secured, the airflow flowing from the pressurizing chamber 20 into the ventilation holes 31 can be brought close to the vertical direction. However, since the space of the pressurizing chamber 20 is limited, there is a limit to the expansion in the height direction. Therefore, it was considered to take measures at least when the inflow angle is about 80 ° or more.

Therefore, pay attention to the graphs of FIGS. 3 to 6 (A). In these graphs, the permissible condition region is the range inside the straight line through the origin indicated by the dotted line. Therefore, in order to suppress the crosswind generated in the downflow region to an acceptable range, it is necessary to set the ratio (t / D) of the thickness t to the diameter D to a peculiar value satisfying the allowable condition region.

The optimum t / D value is about three-fifths (0.6) in any of FIGS. 3 (A) to 6 (A). For example, in FIG. 6, when the thickness t of the ventilation plate 30 is 3 mm and the diameter of the ventilation hole 31 is 7 mm, one of the allowable conditions for crosswind is. That is, t / D = 3/7 = 0.43. Further, in FIG. 3, when the thickness t of the ventilation plate 30 is 3 mm and the diameter of the ventilation hole 31 is 4 mm, one of the acceptable conditions for crosswind is. That is, t / D = 3/4 = 0.75.

Further, for example, since the aperture ratio is different between FIGS. 3 and 6, it can be seen that the allowable conditions for crosswinds differ depending on the aperture ratio. Here, this relationship can be expressed by the following approximate expression 1.

The relationship between the optimum value of t / D and the aperture ratio α is shown in FIG. The angle of incidence of the airflow is 80 °, the downflow flow rate is 30 m ³ / min, and the plotted points and their range are determined under the permissible conditions where the permissible lateral wind speed is ± 0.1 m / s or less from FIGS. 3 to 6. bottom. Approximate equation 1 was obtained from this determined point. The dotted line is an approximate value of Equation 1.

Here, FIG. 8 schematically shows the change in the wind direction in the downflow region when the ventilation plate 30 has a different thickness t. The thickness t is 2 mm for (a), 3 mm for (b), 4 mm for (c), 6 mm for (d), 10 mm for (e), 20 mm for (f), and 50 mm for (g). Further, the diameter of the ventilation holes 31 is D5 mm, the arrangement pitch of the ventilation holes 31 is 10 mm (hole opening ratio 19.635%), and the downflow flow rate per 1 m ² of the horizontal area is 30 m ³ / min. The angle (incident angle) at which the airflow in the pressurizing chamber 20 hits the ventilation hole 31 is 80 °. The graph shown in the center of FIG. 8 is the same as that of FIG. 4 (A).

As shown in FIG. 8B, in the case of a thickness t within the optimum t / D range, the airflow in the pressurizing chamber 20 is down in the vertical direction even if the angle at which the airflow hits the ventilation hole 31 is close to horizontal. A flow can be generated. The direction of the air flow in the chamber 40 in this case can be indicated by, for example, the white arrow in FIG. 11 described later. On the other hand, as shown in FIG. 8A, when the thickness t is thinner than the optimum t / D range, the crosswind in the pressurizing chamber 20 is transmitted to the downflow region in the same direction. The direction of the air flow in the chamber 40 in this case can be indicated by, for example, the white arrow in FIG. 9 described later. On the other hand, as shown in FIGS. 8C to 8F, when the thickness t is thicker than the optimum t / D range, the airflow hits the side surface of the ventilation hole 31 and is reflected, so that the pressurizing chamber 20 An airflow in the opposite direction to the airflow inside is generated. The direction of the air flow in the chamber 40 in this case can be indicated by, for example, the white arrow in FIG. 10 described later. As shown in FIG. 8 (g), it is necessary to use a very thick ventilation plate 30 in order to suppress the air flow in the opposite direction generated by hitting the side surface of the ventilation hole 31. That is, it is necessary to prepare a very thick and heavy punching plate, and such a condition is not realistic. Even if it is like a nozzle having only ventilation holes, it is difficult to arrange a large number of nozzles.

[effect]
In this embodiment, the FFU 10, the pressurizing chamber 20 into which the gas from the FFU 10 flows in, and a plurality of ventilation holes 31 forming at least a part of the bottom surface of the pressurizing chamber 20 and through which the gas from the pressurizing chamber 20 passes. The thickness t of the ventilation plate 30 is two-fifths to four-fifths of the diameter D of the ventilation holes 31.

である。 Further, the arrangement density of the ventilation holes 31 is (the number of arrangements of the ventilation holes) / (the arrangement area of the ventilation holes), and the opening ratio of the ventilation holes 31 is {π (diameter of the ventilation holes) ^2/4 } × (vent holes). The thickness t of the ventilation plate 30 is

Is.

With such a configuration, regardless of the direction of the airflow of the pressurizing chamber 20, that is, regardless of the crosswind or the asymmetrical airflow, the downflow with a sufficient flow velocity and less crosswind by passing through the ventilation hole 31 of the ventilation plate 30. Airflow can be blown. Therefore, the vortex and stagnation of the airflow in the downflow region are suppressed, the winding up of dust is reduced, and the cleanliness can be improved. Moreover, it can be realized with a simple structure such as a punching plate.

[Modification example]
The FFU 10 cannot always be arranged above the pressurizing chamber 20. That is, as shown in FIGS. 9 to 11, air may be supplied by the FFU 10 from the lateral direction via the duct due to restrictions in the height direction. In this case, the duct portion becomes the pressurizing chamber 20.

In such a case, most of the air supply has a lateral component. For example, as shown in FIG. 9, the ventilation plate 30 (t / D is 0.3) thinner than the optimum thickness shown in the present embodiment. ) Is used, a downflow is generated in the chamber 40 with an inclination in the same direction as the air flow in the pressurizing chamber 20. As a result, a strong winding airflow (vortex airflow) is generated inside (in the upstream direction of the airflow of the pressurizing chamber 20). Further, as shown in FIG. 10, when a ventilation plate 30 (t / D is 1.5) thicker than the optimum thickness shown in the embodiment is used, the pressurizing chamber 20 is contained in the chamber 40. Downflow occurs due to the inclination of the airflow in the opposite direction. As a result, a strong winding airflow (vortex airflow) is generated on the outside (downstream direction of the airflow of the pressurizing chamber 20). On the other hand, when the ventilation plate 30 (t / D is 0.6) of the present embodiment is used, as shown in FIG. 11, a downflow close to vertical can be generated in the chamber 40. Therefore, the winding airflow generated beside the downflow is weak.

Further, as shown in FIG. 12, even if the FFU 10 is provided in the center of the pressurizing chamber 20, a downflow close to vertical can be generated in the region Ra directly under the FFU 10, but the peripheral region Rb can be generated. The farther away from the center, the greater the inclination of the airflow. Therefore, the present embodiment may not be applied to the ventilation plate 30 directly under the FFU 10, and the present embodiment may be applied only to the peripheral region Rb.

[Second Embodiment]
As a second embodiment, a mounting device 2 to which the above blower 1 is applied will be described with reference to FIG. In this embodiment, as shown in FIG. 13A, the mounting machine 50 and the gantry 60 are provided with exhaust paths 51a and 60a that are continuous in the downward direction from the ventilation plate 30. Further, an exhaust path 40a continuous in the downward direction from the ventilation plate 30 is provided between the gantry 60 and the inner wall of the chamber 40. The exhaust path 51a is a hole formed in the bottom of the main body of the mounting machine 50 and penetrating in the vertical direction. It is preferable that this hole is at least in the vicinity of a mechanical portion such as a motor or a sliding portion that is a source of dust.

The mounting machine 50 mounts a semiconductor chip on a substrate, for example. The mounting of the semiconductor chip can be face-up bonding with the circuit surface of the semiconductor chip facing upward. Further, face-down bonding may be performed with the circuit surface facing the substrate. In this case, so-called flip chip bonding is performed.

The exhaust path 60a is provided on the upper surface of the gantry 60 and has a through hole continuous with the exhaust path 51a, a gap provided inside the gantry 60, and a through hole provided at the bottom of the gantry 60. The void inside the gantry 60 is such that the wiring is left, and the control device and the like that obstruct the air flow are excluded to the outside as much as possible.

In the present embodiment as described above, the nearly vertical downflow from the blower 1 is exhausted from the exhaust port 41 on the floor surface F via the exhaust paths 51a, 40a, 60a. As a result, it is possible to suppress the roll-up of dust and the like, and to mount with high cleanliness.

As described above, the mounting device is also required to have a clean environment in which class 1 (ISO3) cleanliness at the pre-process level of semiconductor manufacturing can be obtained.

Conventionally, in a mounting device, in order to improve the cleanliness of the mounting device, an FFU such as HEPA is provided on the upper part, and the downflow from the FFU is exhausted from an exhaust fan provided on the back surface of the cover of the mounting machine. It was common. However, it sometimes generated a local high-speed airflow and generated a vortex airflow that swirled up dust. Therefore, it was difficult to reach Class 1. An example of a vortex airflow is an airflow near the side wall in the chamber 40 of FIGS. 9-11.

In this device, a downflow that is close to vertical flows from the ULPA FFU 10 through the ventilation hole 31 of the ventilation plate 30, and the exhaust paths 51a and 60a provided in the mounting machine 50 and the gantry 60 without using an exhaust fan, The exhaust path 40a provided between the gantry 60 and the inner wall of the chamber 40 guides the downflow to the exhaust on the floor surface F side. Therefore, the dust is prevented from being rolled up due to the generation of the vortex airflow, and Class 1 can be realized.

As shown in FIG. 13B, the FFU 10 is not arranged in the region where the entire chamber 40 is directly below. Even in such a case, by applying the ventilation plate 30 shown in the above embodiment, the lateral airflow can be made to be a downflow close to vertical. Further, as described above, the thickness t and the diameter D of the ventilation plate 30 may be applied only to the region other than directly under the FFU 10.

Further, if there is a region of the ventilation plate 30 in which the downflow is desired to be inclined in a desired direction with respect to the vertical direction, the present embodiment is not applied to that portion, and only a part of the present embodiment is applied. May be applied. That is, as described above, the direction of the airflow passing through the ventilation plate 30 can be determined from the thickness t of the ventilation plate 30, the diameter D of the ventilation hole 31, and the opening ratio α. Therefore, for example, at a position very close to the side wall in the chamber 40, the thickness t of the ventilation plate 30, the diameter D of the ventilation hole 31, and the opening ratio are set so that the airflow is along the side wall as the airflow in the direction toward the side wall. You can also set α. By doing so, the airflow that winds up along the side wall in the chamber 40 can be suppressed more effectively, and dust can be discharged smoothly.

Further, depending on the shape of the components such as the mounting machine 50 and the gantry 60 installed in the chamber 40 of the mounting device 2, an air flow is generated so as to avoid the components instead of a straight downflow from directly above the components. In some cases, it is possible to suppress the winding up of dust. In such a case, the thickness t of the ventilation plate 30, the diameter D of the ventilation holes 31, and the opening ratio α can be set so as to obtain a desired air flow.

The material of the ventilation plate 30 does not matter. It may be metal, resin, or ceramic, as long as it has the required rigidity and weight.

Further, in the above embodiment, the cross-sectional shape of the ventilation hole 31 is circular. This facilitates manufacturing. However, any shape such as an ellipse or a polygon may be used, and the effective diameter of the ventilated opening may be within the range shown in the above embodiment. In this case, the cross-sectional area orthogonal to the axis per one (one) of the ventilation holes 31 for obtaining the aperture ratio is the area of each shape such as an ellipse or a polygon.

[Other embodiments]
Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

1 Blower 2 Mounting device 10 Fan filter unit (FFU)
20 Pressurizing chamber 30 Ventilation plate 40 Chamber 60 Stand 51a, 60a, 40a Exhaust path D Diameter F Floor surface t Thickness

Claims (8)

With at least one fan filter unit,
A pressurizing chamber into which gas from the fan filter unit flows in, and
A vent plate that constitutes at least a part of the bottom surface of the pressurizing chamber and has a plurality of vents through which gas from the pressurizing chamber passes.
Have,
A blower characterized in that the thickness of at least a part of the ventilation plate is two-fifths to four-fifths the diameter of the ventilation holes. The arrangement density of the ventilation holes is (the number of arrangements of the ventilation holes) / (the arrangement area of the ventilation holes), and the opening ratio of the ventilation holes is {π (diameter of the ventilation holes) ^2/4 } × (arrangement of the ventilation holes). In the case of density), the thickness of at least a part of the ventilation plate is

The blower according to claim 1, wherein the blower is characterized by being. The ventilation plate has regions having different aperture ratios.
In each region where the aperture ratio is different, the thickness of the ventilation plate is

The blower according to claim 2, wherein the blower is characterized by being. In a region other than the region directly below the fan filter unit, the thickness of the ventilation plate is

The blower according to claim 2, wherein the blower is characterized by being. The blower according to any one of claims 1 to 4, wherein the ventilation plate has a thickness of 3 to 7 mm. A chamber provided with the blower according to any one of claims 1 to 5 on the upper portion,
A mounting machine provided in the chamber for mounting electronic components,
An electronic component mounting device characterized by having. The mounting machine is supported by a gantry provided in the chamber, and the mounting machine is supported.
The electronic component mounting device according to claim 6, wherein the mount and the mounting machine are provided with a continuous exhaust path in a direction downward from the ventilation plate. The electronic component mounting device according to claim 7, wherein a continuous exhaust path is provided between the gantry and the inner wall of the chamber in a direction downward from the ventilation plate.

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