JP2022047619A - External electrode forming jig, external electrode forming device, and method of manufacturing electronic component - Google Patents

Abstract

To suppress the formation of an external electrode in an area other than an area where the external electrode is formed, when forming the external electrode on an electronic component element.SOLUTION: An external electrode forming jig 10 is equipped with a container 1, and a cover 2 with a size entering the container 1. A bottom surface 1a of the container 1 is provided with a first hole, and the cover 2 is provided with a second hole. On an inner wall of the first hole, a first elastic body 41 tightly contacted with an electronic component element 20 is provided, and on an inner wall of the second hole, a second electric body 42 tightly contacted with the electronic component element 20 is provided. The external electrode forming jig 10 is configured so that a filling space 50 filling a coated member covering an area except for a first end portion 21 and a second end portion 22 on a surface of the electronic component element 20 can be formed between the container 1 and the cover 2, while one end portion of the electronic component element 20 is inserted in the first hole of the container 1 and the other end portion of the electronic component element 20 is inserted in the second hole of the cover 2.SELECTED DRAWING: Figure 2

Description

INDUSTRIAL APPLICABILITY The present invention relates to an external electrode forming jig used when forming an external electrode at the end of a plurality of electronic component elements, and an external electrode forming apparatus for forming an external electrode using an external electrode forming jig. , And a method for manufacturing an electronic component, which manufactures an electronic component by grasping an electronic component element body using an external electrode forming jig.

Electronic components having external electrodes at both ends of the electronic component prime field, such as multilayer ceramic capacitors, are known. In Patent Document 1, a plurality of electronic component elements are sandwiched between a pair of strips to be interconnected at predetermined intervals, and a plurality of electronic component elements are gripped, and the electronic component elements are held in that state. A method of forming an external electrode by adhering an electrode paste to an end portion is disclosed. According to this method, it is said that the adhesion dimension of the electrode paste can be stabilized.

Japanese Unexamined Patent Publication No. 9-2301

However, in the method described in Patent Document 1, since the electronic component element is sandwiched between the pair of bands, a gap is generated between the band and the electronic component element. Therefore, if the electrode paste enters the gap, a short circuit may occur between the pair of external electrodes.

The present invention solves the above-mentioned problems, and is an external electrode forming jig used for gripping an electronic component body to form external electrodes at both ends, except for a region for forming an external electrode. An external electrode forming jig capable of suppressing the formation of an external electrode in the region of the above, an external electrode forming device for forming an external electrode using such an external electrode forming jig, and an external electrode forming apparatus. It is an object of the present invention to provide a method for manufacturing an electronic component for manufacturing an electronic component by grasping an electronic component element body by using such an external electrode forming jig.

The jig for forming an external electrode of the present invention is a jig for forming an external electrode used when forming an external electrode at a first end portion and a second end portion of a plurality of electronic component prime fields.
With the container
A lid large enough to fit inside the container,
Equipped with
The bottom surface of the container is provided with a first hole for inserting one end of the first end and the second end of the electronic component body.
A second end for inserting the first end portion of the electronic component element and the other end portion of the second end portion into one main surface of the lid facing the bottom surface of the container. There is a hole in the hole,
The inner wall of the first hole is provided with a first elastic body that is in close contact with the electronic component element to be inserted.
The inner wall of the second hole is provided with a second elastic body that is in close contact with the electronic component element to be inserted.
With the one end of the electronic component body inserted into the first hole of the container and the other end of the electronic component body inserted into the second hole of the lid. , A filling space is formed between the container and the lid to fill a covering member covering a region excluding the first end portion and the second end portion of the surface of the electronic component prime field. It is characterized by being configured to be possible.

According to the external electrode forming jig of the present invention, one end of the electronic component body is inserted into the first hole of the container, and the other end of the electronic component body is inserted into the second hole of the lid. In the inserted state, a filling space is formed between the container and the lid to fill the covering member covering the area excluding the first end and the second end of the surface of the electronic component prime field. It is configured to be possible. With such a configuration, if the filling space is filled with a covering member and the lid and container are removed, the area where the external electrode is not formed can be covered with the covering member to expose the first end and the second end. can. Therefore, it is possible to prevent the external electrode from being formed in a region other than the region where the external electrode is formed.

It is a side sectional view schematically showing the structure of the jig for forming an external electrode in one Embodiment. It is a side sectional view which shows the state which attached the electronic component prime field to the jig for forming an external electrode in the process for forming an external electrode. It is a perspective view which shows typically the appearance shape of the multilayer ceramic capacitor which is an example of an electronic component manufactured from an electronic component prime field. It is a top view which shows the bottom surface of a container schematically. FIG. 6 is a diagram schematically showing another arrangement pattern of a first elastic body and a first hole on the bottom surface of a container. It is a top view which shows typically the bottom surface of the container when the shape of the outer periphery of the 1st elastic body is rectangular. It is a top view which shows the lid schematically. (A) is a side sectional view showing the detailed shape of the first elastic body provided in the container and the second elastic body provided in the lid, and (b) is a side sectional view showing the first hole and the first elastic body. It is a side sectional view which shows the state which the electronic component element body is inserted in the 2nd hole. (A) is a cross-sectional view of the first elastic body when the cross-sectional shape is a triangle, and (b) is a cross-sectional view of the first elastic body having a shape with a rounded tip. It is a flowchart for demonstrating the method of manufacturing an electronic component by grasping an electronic component prime body using a jig for forming an external electrode, and forming an external electrode at a 1st end portion and a 2nd end portion. .. (A) is a diagram showing a state in which the lid is dropped into the container, and (b) is a state in which a plurality of electronic component elements are placed in the first hole of the container and the second hole of the lid. (C) is a diagram showing a state in which the lid is lifted, (d) is a diagram showing a state in which a covering member is injected into the filling space, and (e) is a diagram showing a state in which the lid and the container are removed. It is a figure.

Hereinafter, embodiments of the present invention will be shown, and the features of the present invention will be specifically described.

FIG. 1 is a side sectional view schematically showing the configuration of the external electrode forming jig 10 in one embodiment. FIG. 2 is a side sectional view showing a state in which the electronic component prime field 20 is attached to the external electrode forming jig 10 in the process for forming the external electrode.

The external electrode forming jig 10 in one embodiment is a jig used when forming an external electrode on a first end portion 21 and a second end portion 22 of a plurality of electronic component prime fields 20. A container 1 and a lid 2 are provided.

In the present embodiment, the electronic component prime field 20 is obtained by removing a pair of external electrodes 26 and 27 from the multilayer ceramic capacitor 25 as shown in FIG. That is, the monolithic ceramic capacitor 25 includes an electronic component prime field 20, a first external electrode 26, and a second external electrode 27. The electronic component prime field 20 has a structure in which a plurality of internal electrodes and dielectric layers are alternately laminated.

The electronic component prime field 20 has a hexahedron shape. That is, the electronic component prime field 20 has a first end surface 28a and a second end surface 28b facing each other in the length direction L, and a first main surface 28c and a second main surface facing each other in the height direction T. It has a 28d and a first side surface 28e and a second side surface 28f facing each other in the width direction W.

The first external electrode 26 is formed on the entire first end surface 28a, and from the first end surface 28a, the first main surface 28c, the second main surface 28d, the first side surface 28e, and the first side surface 28e. , Is formed so as to wrap around the second side surface 28f. In the present embodiment, the first end portion 21 of the electronic component prime field 20 means a region on the surface of the electronic component prime field 20 where the first external electrode 26 is formed.

The second external electrode 27 is formed on the entire second end surface 28b, and from the second end surface 28b, the first main surface 28c, the second main surface 28d, the first side surface 28e, and the second end surface 28e. , Is formed so as to wrap around the second side surface 28f. In the present embodiment, the second end portion 22 of the electronic component prime field 20 means a region on the surface of the electronic component prime field 20 on which the second external electrode 27 is formed.

As an example of the size of the electronic component prime field 20, the dimensions in the length direction L, the width direction W, and the height direction T are, for example, 0.6 mm, 0.3 mm, and 0.3 mm. Further, the dimension L1 of the first end 21 and the dimension L1 of the second end 22 in the length direction L are, for example, 0.15 mm, and the first end 21 and the second end 22 The dimension L2 in the length direction L of the region between is, for example, 0.3 mm.

As another example of the size of the electronic component prime field 20, the dimensions in the length direction L, the width direction W, and the height direction T are, for example, 1.0 mm, 0.5 mm, and 0.5 mm. In that case, the dimension L1 of the first end 21 and the dimension L1 of the second end 22 in the length direction L are, for example, 0.25 mm, and the first end 21 and the second end 22 are 22. The dimension L2 in the length direction L of the region between and is, for example, 0.5 mm.

Further, as yet another example of the size of the electronic component prime field 20, the dimensions in the length direction L, the width direction W, and the height direction T are, for example, 0.4 mm, 0.2 mm, and 0.2 mm. .. In that case, the dimension L1 of the first end 21 and the dimension L1 of the second end 22 in the length direction L are, for example, 0.11 mm, and the first end 21 and the second end 22 are 22. The dimension L2 in the length direction L of the region between and is, for example, 0.18 mm.

The electronic component obtained from the electronic component prime field 20 is not limited to the monolithic ceramic capacitor 25, and may be an inductor, a thermistor, or the like.

The container 1 has a bottom surface 1a and a side wall 1b, and has a box-like shape. The container 1 is made of, for example, stainless steel. However, the material of the container 1 is not limited to stainless steel, and a metal such as iron whose surface is coated with a coating member having high chemical resistance, ceramic, resin, or the like may be used.

The bottom surface 1a of the container 1 is provided with a first hole 31 for inserting one end of the first end 21 and the second end 22 of the electronic component prime field 20. The first hole 31 may be formed so as to penetrate the bottom surface 1a of the container 1 or may be formed so as not to penetrate the bottom surface 1a. The depth of the first hole 31 is the same as the dimension L1 of one end in the direction (length direction L) where the first end 21 and the second end 22 of the electronic component prime field 20 face each other. be.

The inner wall of the first hole 31 is provided with a first elastic body 41 that is in close contact with the inserted electronic component prime field 20. It can be said that the inner wall of the first hole 31 is formed by the first elastic body 41.

FIG. 4 is a plan view schematically showing the bottom surface 1a of the container 1. As shown in FIG. 4, a plurality of first holes 31 are provided in the bottom surface 1a of the container 1. Further, a first elastic body 41 is provided around each of the plurality of first holes 31. In the present embodiment, the outer circumference of the first elastic body 41 has a circular shape when viewed in a direction orthogonal to the bottom surface 1a of the container 1.

The first hole 31 has a shape corresponding to the first end surface 28a and the second end surface 28b of the electronic component prime field 20 to be inserted, and in the present embodiment, is orthogonal to the bottom surface 1a of the container 1. When viewed in the direction, it has a rectangular shape. The first hole 31 is formed by the first elastic body 41 when one end of the first end 21 and the second end 22 of the electronic component body 20 is inserted. The size is such that the surface of the body 20 can be pressed to hold the electronic component prime field 20.

The size of the bottom surface 1a of the container 1 is, for example, 150 mm in length and 150 mm in width. The diameter of the first elastic body 41 having a circular outer circumference when viewed in a direction orthogonal to the bottom surface 1a of the container 1 is, for example, 0.6 mm. When viewed in a direction orthogonal to the bottom surface 1a of the container 1, the size of the first hole 31 having a rectangular shape is, for example, 0.3 mm in length and 0.3 mm in width. This is, for example, a size corresponding to the electronic component prime field 20 whose dimensions in the length direction L, the width direction W, and the height direction T are 0.6 mm, 0.3 mm, and 0.3 mm, respectively.

The arrangement pattern of the first elastic body 41 and the first hole 31 is not limited to that shown in FIG. FIG. 5 is a diagram schematically showing another arrangement pattern of the first elastic body 41 and the first hole 31. Further, as shown in FIG. 6, the shape of the outer circumference of the first elastic body 41 when viewed in a direction orthogonal to the bottom surface 1a of the container 1 may be rectangular.

The first elastic body 41 is made of a material having high chemical resistance, for example, fluororubber. However, the material of the first elastic body 41 is not limited to fluororubber, and chemicals such as butyl rubber (IIR), ethylene propylene rubber (EPM), chlorosulfonated polyethylene rubber (CSM), and nitrile rubber (NBR) are used. Any material may be used as long as it is resistant to cleaning with rubber.

As shown in FIG. 2, the lid 2 has a size that fits inside the container 1. The lid 2 is made of, for example, stainless steel. However, the material of the lid 2 is not limited to stainless steel, and a metal such as iron whose surface is coated with a coating member having high chemical resistance, ceramic, resin, or the like may be used.

A second end for inserting the other end of the first end 21 and the second end 22 of the electronic component element 20 into the main surface 2a of the lid 2 facing the bottom surface 1a of the container 1. Hole 32 is provided. The second hole 32 may be formed so as to penetrate the lid 2 or may be formed so as not to penetrate the lid 2. The depth of the second hole 32 is the same as the dimension L1 of the other end in the direction in which the first end 21 and the second end 22 of the electronic component element 20 face each other (length direction L). be. A second elastic body 42 that is in close contact with the inserted electronic component prime field 20 is provided on the inner wall of the second hole 32.

As described above, the depth of the first hole 31 is the same as the dimension L1 of one end of the first end 21 and the second end 22 of the electronic component prime field 20, and the second. Since the depth of the hole 32 is the same as the dimension L1 of the other end of the electronic component body 20, when the external electrode is formed, which will be described later, the first end 21 of the surface of the electronic component body 20 is formed. And it is possible to form an external electrode only at the second end 22.

FIG. 7 is a plan view schematically showing the lid 2. As shown in FIG. 7, the main surface 2a of the lid 2 is provided with a plurality of second holes 32, and a second elastic body 42 is provided around each of the plurality of second holes 32. It is provided.

The second elastic body 42 is made of a material having high chemical resistance, for example, fluororubber. However, the material of the second elastic body 42 is not limited to fluororubber, and chemicals such as butyl rubber (IIR), ethylene propylene rubber (EPM), chlorosulfonated polyethylene rubber (CSM), and nitrile rubber (NBR) are used. Any material may be used as long as it is resistant to cleaning with rubber.

As shown in FIG. 2, the first hole 31 formed in the bottom surface 1a of the container 1 and the second hole 32 formed in the lid 2 have a plurality of first electronic component elements 20. The position is adjusted so that it can be inserted into the hole 31 and the plurality of second holes 32, respectively. That is, the first hole 31 and the second hole 32 into which one electronic component element 20 is inserted are provided at positions where they overlap when viewed in the insertion direction of the electronic component element 20. The arrangement pattern of the second hole 32 shown in FIG. 7 corresponds to the arrangement pattern of the first hole 31 shown in FIG. When the arrangement pattern of the first hole 31 is as shown in FIG. 5, the arrangement pattern of the second hole 32 also corresponds to the arrangement pattern shown in FIG.

In the present embodiment, the first elastic body 41 has a shape that tapers toward the first hole 31, as shown in FIG. 8A. That is, in the insertion direction of the electronic component prime field 20, the size of the first hole 31 gradually decreases toward the center in the depth direction, and gradually increases from the center in the depth direction. Have. Further, as shown in FIG. 8A, the second elastic body 42 has a shape that tapers toward the second hole 32. That is, in the insertion direction of the electronic component prime field 20, the size of the second hole 32 gradually decreases toward the center in the depth direction, and gradually increases from the center in the depth direction. Have.

Since the first elastic body 41 has a shape that tapers toward the first hole 31, the insertion port of the electronic component body 20 in the first hole 31 is wide, so that the electronic component body 20 is the first. When transferring to the hole 31, the success rate of the transfer can be improved. Further, as will be described later, when the electronic component prime field 20 is pushed into the first hole 31, the first elastic body 41 can be pushed in with a smaller force than the shape in which the first elastic body 41 is not tapered. The same applies to the effect that the second elastic body 42 has a tapered shape.

When the electronic component prime field 20 is inserted into the first hole 31 and the second hole 32, as shown in FIG. 8B, a part of the first elastic body 41 and the second elastic body 42 is formed. Crush. As a result, the first elastic body 41 and the second elastic body 42 press the surface of the electronic component element 20 from the outside to firmly hold the electronic component element 20.

The shape in which the first elastic body 41 and the second elastic body 42 taper is not limited to the shape shown in FIG. 8A. Another shape example of the first elastic body 41 is shown in FIG. 9 (a) is a cross-sectional view of the first elastic body 41 when the cross-sectional shape is a triangle, and FIG. 9 (b) is a first elastic body 41 having a shape with a rounded tip. It is a cross-sectional view of. The shape of the second elastic body 42 can be the same as that of the first elastic body 41.

When the external electrode forming jig 10 is used, one end of the electronic component body 20 is inserted into the first hole 31 of the container 1, and the electronic component body 20 is inserted into the second hole 32 of the lid 2. With the other end of the electronic component inserted, it covers the area between the container 1 and the lid 2 except for the first end 21 and the second end 22 on the surface of the electronic component prime field 20. It is configured so that a filling space 50 for filling the covering member can be formed (see FIG. 2).

(Manufacturing method of electronic parts)
In the following, referring to the flowchart shown in FIG. 10, the electronic component prime field 20 is gripped by using the external electrode forming jig 10 in the present embodiment, and is attached to the first end portion 21 and the second end portion 22. A method of manufacturing an electronic component by forming an external electrode will be described.

In step S1, as shown in FIG. 11A, the lid 2 is dropped into the container 1. In this state, one main surface 2a of the lid 2 is in contact with the bottom surface 1a of the container 1.

In step S2 following step S1, as shown in FIG. 11B, a plurality of electronic component elements 20 are inserted into the first hole 31 of the container 1 and the second hole 32 of the lid 2. Specifically, after the plurality of electronic component elements 20 are transferred into the plurality of first holes 31 of the container 1, the plurality of first holes 31 and the lid 2 of the container 1 are used by using a pin or the like. Push it into the plurality of second holes 32 of the above. The transfer of the electronic component prime field 20 is performed by swinging, vibrating, tilting, or the like in the container 1. It should be noted that the plurality of electronic component elements 20 may be inserted into the first hole 31 and the second hole 32 by sucking from the opposite side of the second hole 32.

The electronic component body 20 is pushed in so that one end of the first end 21 and the second end 22 is covered by the bottom surface 1a of the container 1. FIG. 11B shows a state in which the first end 21 of the electronic component prime field 20 is covered by the bottom surface 1a of the container 1, but the second end 22 is covered by the bottom surface 1a of the container 1. You may be asked.

As described above, the first elastic body 41 has a shape that tapers toward the first hole 31, and the second elastic body 42 has a shape that tapers toward the second hole 32. Therefore, it is possible to improve the success rate of transferring the electronic component prime field 20 into the first hole 31 and the second hole 32. Further, when the electronic component prime field 20 is pushed in by using a pin or the like, the first elastic body 41 and the second elastic body 42 can be pushed in with a smaller force as compared with the shape in which the first elastic body 42 is not tapered.

In step S3 following step S2, as shown in FIG. 11C, the lid 2 is lifted to form the filling space 50. The method of lifting the lid 2 is not particularly limited, and for example, the lid 2 may be lifted by a suction force of air, or the lid 2 may be lifted by using a jig. Here, the lid 2 is lifted to a position where the other end of the first end 21 and the second end 22 of the electronic component element 20 is covered by the lid 2. As a result, the region of the surface of the electronic component prime field 20 excluding the first end 21 and the second end 22 is exposed in the filling space 50.

In step S4 following step S3, the covering member 60 is filled in the filling space 50 as shown in FIG. 11D. For example, the lid 2 is provided with an injection hole for injecting the covering member 60, and the covering member 60 is injected from the injection hole into the filling space 50. However, the injection hole may be provided in the container 1.

The covering member 60 is a liquid at the time of injection, but changes to a solid after being injected into the filling space 50, and for example, a thermosetting resin, a thermoplastic resin, a low melting point glass, a wax, or the like can be used. After injecting the covering member 60, a process for curing the covering member 60, such as heating as necessary, is performed. Since the covering member 60 may be exposed to a high temperature of about 100 to 150 ° C. during the external electrode forming process described later, the covering member 60 needs to have a property that softening or melting does not occur at a high temperature.

The pellet-shaped covering member 60 may be put into the filling space 50 and melted to form a fluid, which may be then cured.

In step S5 following step S4, the lid 2 and the container 1 are removed. The lid 2 and the container 1 may be removed by using a removal jig or the like, or by melting with a solvent or the like. When the lid 2 and the container 1 are removed, as shown in FIG. 11E, the region other than the first end 21 and the second end 22 on the surface of the electronic component prime field 20 is the covering member 60. It is in a state of being covered with.

When removing the lid 2 and the container 1, a mounting member such as a tray is arranged below the plurality of electronic component prime fields 20 shown in FIG. 11 (e), and after the lid 2 and the container 1 are removed, a plurality of mounting members are arranged. The electronic component prime field 20 may be received by the mounting member. Further, the adhesive member may be arranged on the surface of the mounting member so that the plurality of received electronic component prime fields 20 are adhesively held. Further, a bottomed cavity corresponding to the arrangement pattern of the plurality of electronic component primes 20 is provided on the surface of the mounting member so that the plurality of electronic component primes 20 are placed in the bottomed cavity and held. May be good.

In step S6 following step S5, external electrodes are formed on the first end 21 and the second end 22 of the plurality of electronic component prime fields 20 gripped by the covering member 60. The external electrode can be formed by, for example, sputtering, various vapor deposition, CVD (chemical vapor deposition), ALD (atomic layer deposition), dipping, electrolytic plating, electroless plating, or the like. In this case, the external electrode forming jig 10 of the present invention comprises an external electrode forming device for forming an external electrode on the first end portion 21 and the second end portion 22 of the plurality of electronic component prime fields 20. Become an element. When the external electrode is formed by sputtering, the external electrode forming device is a sputtering device.

When the covering member 60 is removed after forming the external electrode, a plurality of electronic components having external electrodes formed on the first end 21 and the second end 22 of the electronic component prime field 20 can be obtained.

As shown in FIG. 11 (e), on the surface of the electronic component prime field 20, the regions other than the first end portion 21 and the second end portion 22 are covered with the covering member 60. Since the covering member 60 is in close contact with the surface of the electronic component prime field 20, by forming the external electrode by the method described above, the external electrode is formed in a region other than the first end portion 21 and the second end portion 22. Can be suppressed from being formed. Further, since the external electrodes can be formed at once for the plurality of electronic component prime fields 20, the manufacturing efficiency of the electronic components can be improved.

In the method described in Patent Document 1 described above, since a plurality of electronic component elements are sandwiched between a pair of strips to be joined to each other, the electronic component elements may be damaged such as cracks or chipped chips. be. However, according to the external electrode forming method using the external electrode forming jig 10 in the present embodiment, since the plurality of electronic component prime fields 20 are gripped by the covering member 60 such as resin, the electronic component prime field 20 is used. Can be prevented from being damaged.

Further, in the method described in Patent Document 1 described above, for example, when a pair of strips sandwiching a plurality of electronic component prime fields is arranged in a chamber of a sputtering apparatus, the pair of strips bends, whereby the pair of strips bends. The position of the electronic component prime field may deviate from the desired position, resulting in variation in the film thickness of the external electrode. However, according to the external electrode forming method using the external electrode forming jig 10 in the present embodiment, the plurality of electronic component prime fields 20 are in a state of being fixed by the covering member 60 such as resin. It can be fixed in place in the chamber. This makes it possible to suppress variations in the film thickness of the external electrodes.

The present invention is not limited to the above embodiment, and various applications and modifications can be added within the scope of the present invention.

1 Container 1a Bottom surface of container 1b Side wall of container 2 Lid 10 External electrode forming jig 20 Electronic component prime field 21 First end 22 Second end 25 Multilayer ceramic capacitor 26 First external electrode 27 Second External electrode 31 First hole 32 Second hole 41 First elastic body 42 Second elastic body 50 Filling space 60 Covering member

Claims (10)

A jig for forming an external electrode used when forming an external electrode at the first end and the second end of a plurality of electronic component prime fields.
With the container
A lid large enough to fit inside the container,
Equipped with
The bottom surface of the container is provided with a first hole for inserting one end of the first end and the second end of the electronic component body.
A second end for inserting the first end portion of the electronic component element and the other end portion of the second end portion into one main surface of the lid facing the bottom surface of the container. There is a hole in the hole,
The inner wall of the first hole is provided with a first elastic body that is in close contact with the electronic component element to be inserted.
The inner wall of the second hole is provided with a second elastic body that is in close contact with the electronic component element to be inserted.
With the one end of the electronic component body inserted into the first hole of the container and the other end of the electronic component body inserted into the second hole of the lid. , A filling space is formed between the container and the lid to fill a covering member covering a region excluding the first end portion and the second end portion of the surface of the electronic component prime field. A jig for forming an external electrode, which is characterized in that it is configured to be possible. The depth of the first hole is the same as the dimension of the one end in the direction in which the first end and the second end of the electronic component element face each other.
The depth of the second hole is the same as the dimension of the other end in the direction in which the first end and the second end of the electronic component element face each other. The jig for forming an external electrode according to claim 1. The first elastic body has a shape that tapers toward the first hole.
The jig for forming an external electrode according to claim 1 or 2, wherein the second elastic body has a shape that tapers toward the second hole. The jig for forming an external electrode according to any one of claims 1 to 3, wherein the container and the lid are made of any one of metal, ceramic, and resin. The first elastic body and the second elastic body are made of any one of fluororubber, butyl rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber, and nitrile rubber. The external electrode forming jig according to any one of 1 to 4. For forming an external electrode at the first end portion and the second end portion of the electronic component element by using the external electrode forming jig according to any one of claims 1 to 5. External electrode forming device. The external electrode forming apparatus according to claim 6, wherein the external electrode forming apparatus is a sputtering apparatus that forms the external electrode by sputtering. A method of manufacturing an electronic component by grasping the electronic component prime field using the external electrode forming jig according to any one of claims 1 to 5.
The process of dropping the lid into the container and
A step of inserting a plurality of the electronic component elements into the first hole of the container and the second hole of the lid.
The step of lifting the lid to form the filling space and
The step of filling the covering member in the filling space and
The process of removing the lid and the container, and
A method of manufacturing an electronic component, which comprises. The electron according to claim 8, further comprising a step of forming an external electrode at the first end portion and the second end portion of the plurality of electronic component elements gripped by the covering member. How to manufacture parts. The method for manufacturing an electronic component according to claim 9, wherein the external electrode is formed by sputtering.

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