JP6610086B2 - Multilayer ceramic electronic components - Google Patents

Description

  The present invention relates to a multilayer ceramic electronic component, and in particular, has a ceramic body in which internal electrodes are embedded and external electrodes formed on end faces of the ceramic body so as to be electrically connected to the internal electrodes. The present invention relates to a multilayer ceramic electronic component such as a multilayer ceramic capacitor, a multilayer ceramic inductor, a multilayer ceramic thermistor, and a multilayer ceramic piezoelectric component.

  As a conventional multilayer ceramic electronic component, for example, as disclosed in Patent Document 1, a metal is a main component on both end faces of a ceramic body where the internal electrodes are exposed on the surface of the ceramic body in which the internal electrodes are embedded. An external electrode having a sintered electrode layer containing, a conductive resin electrode layer containing metal particles formed on the surface of the sintered electrode layer, and a plating layer formed on the surface of the conductive resin electrode layer Is known. In this multilayer ceramic electronic component, since the conductive resin electrode layer is formed between the sintered electrode layer and the plating layer, the ceramic body is cracked or mounted on the substrate in the temperature cycle during use. In some cases, the disadvantage of being weak in strength against the deflection of the substrate is solved to some extent.

JP-A-10-284343

  In the multilayer ceramic electronic component as described above, external electrodes are formed on both end faces of the ceramic body, but considering the mountability of the multilayer ceramic electronic component on the substrate, the main electrodes adjacent to the end face of the ceramic body are adjacent to it. External electrodes are formed so as to wrap around the surface. However, on the main surface of the ceramic element body, moisture easily enters from between the ceramic element body and the end of the external electrode, and the included moisture is contained in the conductive resin layer.

  Such a multilayer ceramic electronic component is mounted on a substrate by reflow. At the time of mounting by such reflow, the moisture contained in the conductive resin layer evaporates, causing a problem of “solder explosion” that scatters the solder used for mounting.

  Therefore, a main object of the present invention is to provide a multilayer ceramic electronic component capable of preventing moisture from entering the inside of the external electrode from the end of the external electrode on the main surface of the ceramic body.

The multilayer ceramic electronic component according to the present invention has an internal electrode embedded therein, a first main surface, a second main surface opposite to the first main surface, and the first main surface and the second main surface. A first side surface to be connected; a second side surface opposite to the first side surface; a first main surface, a second main surface, a first side surface, and a first end surface connected to the second side surface; A ceramic body having a second end face opposite to the first end face; a first end face and a second end face of the ceramic body electrically connected to the internal electrode; and a first main face; A multilayer ceramic electronic component comprising a second main surface, a first side surface, and an external electrode formed on the second side surface, wherein the external electrode is a sintered metal layer, a conductive layer in this order from the ceramic body side. A conductive resin layer and a plating layer, and a hook between the first main surface and the second main surface of the ceramic body and the conductive resin layer. There characterized by the presence, a laminated ceramic electronic component.
In the multilayer ceramic electronic component according to the present invention, the internal electrode is embedded, the first main surface, the second main surface opposite to the first main surface, the first main surface, and the second main surface. A first side surface connected to the surface, a second side surface opposite to the first side surface, and a first main surface, a second main surface, a first side surface connected to the second side surface, and the first side surface. A ceramic body having an end face and a second end face opposite to the first end face; a first end face and a second end face of the ceramic body electrically connected to the internal electrode; and a first main face A multilayer ceramic electronic component comprising a surface, a second main surface, a first side surface, and an external electrode formed on the second side surface, wherein the external electrode is a sintered metal layer in order from the ceramic body side A conductive resin layer and a plating layer, and between the first main surface and the second main surface of the ceramic body and the conductive resin layer Wherein the fluorine is detected by the TOF-SIMS analysis is present, is a multilayer ceramic electronic component.
In such a multilayer ceramic electronic component, fluorine may be present at the tip portion of the external electrode formed on the first main surface, the second main surface, the first side surface, and the second side surface of the ceramic body. preferable.
Here, fluorine can also exist between the sintered metal layer and the conductive resin layer.
Fluorine can also be present between the element body and the sintered metal layer.
A method for manufacturing a multilayer ceramic electronic component according to the present invention includes a first main surface, a second main surface opposite to the first main surface, and a first main surface and a second main surface connected to the first main surface. 1 side surface, 2nd side surface opposite to 1st side surface, 1st main surface, 2nd main surface, 1st end surface connected to 1st side surface and 2nd side surface, 1st A step of preparing a ceramic body having a second end face opposite to the end face of the substrate and a step of forming a fluorine layer by immersing the ceramic body in a fluorine solution and drying the fluorine solution adhering to the ceramic body And forming a sintered metal layer by applying and baking a conductive paste on the fluorine layer at both ends of the laminate, and applying a conductive resin on the sintered metal layer and curing the conductive metal layer. Forming a conductive resin layer and forming a plating layer on the conductive resin layer To include a step, a method of manufacturing a multilayer ceramic electronic component.
Furthermore, the method for manufacturing a multilayer ceramic electronic component according to the present invention includes a first main surface, a second main surface opposite to the first main surface, and the first main surface and the second main surface. A first side surface, a second side surface opposite the first side surface, a first main surface, a second main surface, a first end surface connected to the first side surface and the second side surface; A step of preparing a ceramic body having a second end surface opposite to the first end surface, a step of forming a sintered metal layer by applying and baking a conductive paste on both ends of the laminate, A process of forming a fluorine layer by immersing the ceramic body on which the binder metal layer is formed in a fluorine solution and drying the fluorine solution adhering to the ceramic body and the sintered metal layer, and forming on the sintered metal layer By applying a conductive resin on the cured fluorine layer and curing the conductive resin, And forming a layer, and forming a plating layer on the conductive resin layer, a method of manufacturing a multilayer ceramic electronic component.

  According to the present invention, the hydrophobicity of fluorine existing between the main surface of the ceramic body and the conductive resin layer suppresses the intrusion of moisture from the end of the external electrode, and the multilayer ceramic electronic component by reflow A multilayer ceramic electronic component capable of preventing solder explosion during mounting on a substrate can be obtained.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is a perspective view which shows an example of the multilayer ceramic capacitor concerning this invention. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 taken along line II-II in FIG. FIG. 2 is an illustrative view showing a configuration between a ceramic body of the multilayer ceramic capacitor shown in FIG. 1 and external electrodes. FIG. 8 is an illustrative view showing another example of a configuration between the ceramic body of the multilayer ceramic capacitor shown in FIG. 1 and an external electrode.

  A multilayer ceramic capacitor 10 shown in FIG. 1 includes, for example, a substantially rectangular parallelepiped ceramic body 12 having a length of 1 mm, a width of 0.5 mm, and a thickness of 0.15 mm. The ceramic body 12 includes a plurality of laminated ceramic layers 14, and includes a first main surface 12a and a second main surface 12b facing each other, and a first side surface 12c and a second side surface 12d facing each other. The first end surface 12e and the second end surface 12f are opposed to each other. The first side surface 12c and the second side surface 12d are connected to the first main surface 12a and the second main surface 12b, respectively. The first end surface 12e and the second end surface 12f are connected to the first main surface 12a, the second main surface 12b, the first side surface 12c, and the second side surface 12d, respectively. The ceramic body 12 has rounded corners and ridges. The ceramic body 12 may be formed in other sizes and shapes.

As the ceramic material of the ceramic layer 14 of the ceramic body 12, for example, a dielectric ceramic composed of main components such as BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ can be used. Moreover, you may use what added subcomponents, such as a Mn compound, Fe compound, Cr compound, Co compound, Ni compound, to these main components. Moreover, the thickness of the ceramic layer 14 of the ceramic body 12 can be set to 0.5 μm to 10 μm, for example.

As shown in FIG. 2, for example, a plurality of first internal electrodes 16 a and second internal electrodes 16 b having a substantially rectangular shape are equally spaced along the thickness direction of the ceramic body 12. It is embed | buried so that it may arrange | position alternately.
At one end portions of the first internal electrode 16a and the second internal electrode 16b, there are exposed portions 18a and 18b exposed at the first end surface 12e and the second end surface 12f of the ceramic body 12. Specifically, the exposed portion 18 a at one end of the first internal electrode 16 a is exposed at the first end face 12 e of the ceramic body 12. The exposed portion 18 b at one end of the second internal electrode 16 b is exposed at the second end surface 12 f of the ceramic body 12.
Further, each of the first internal electrode 16 a and the second internal electrode 16 b is parallel to the first main surface 12 a and the second main surface 12 b of the ceramic body 12. Further, the first internal electrode 16 a and the second internal electrode 16 b are opposed to each other with the ceramic layer 14 in the thickness direction of the ceramic body 12.
Each thickness of the 1st internal electrode 16a and the 2nd internal electrode 16b can be 0.2 micrometer-2 micrometers, for example. However, the thickness of each of the first internal electrode 16a and the second internal electrode 16b is not particularly limited.
The first internal electrode 16a and the second internal electrode 16b include, for example, Ni that is a base metal as a conductive material. The first internal electrode 16a and the second internal electrode 16b are made of, for example, a metal such as Ni, Cu, Ag, Pd, or Au or an alloy such as an Ag—Pd alloy containing one of these metals. Can be configured.

A first external electrode 20a and a second external electrode 20b are formed on the first end face 12e and the second end face 12f side of the ceramic body 12, respectively.
The first external electrode 20a is formed from the first end surface 12e of the ceramic body 12 to the first main surface 12a and the second main surface 12b, and the first side surface 12c and the second side surface 12d. . In this case, the first external electrode 20a is electrically connected to the exposed portion 18a of the first internal electrode 16a.
The second external electrode 20b is formed from the second end surface 12f of the ceramic body 12 to the first main surface 12a, the second main surface 12b, the first side surface 12c, and the second side surface 12d. ing. In this case, the second external electrode 20b is electrically connected to the exposed portion 18b of the second internal electrode 16b.

  As shown in FIG. 3, the first external electrode 20a includes a sintered metal layer 22a, a fluorine layer 23, a conductive resin layer 24a, and a plating layer 26a in this order from the ceramic body 12 side. Similarly, the second external electrode 20 includes a sintered metal layer 22b, a fluorine layer 23, a conductive resin layer 24b, and a plating layer 26b in this order from the ceramic body 12 side.

  The sintered metal layers 22a and 22b each contain Cu, which is a base metal, as a main component, and are formed on the outer surface of the ceramic body 12, that is, on the first end face 12e and the second end face 12f. And is physically and electrically connected to the first internal electrode 16a and the second internal electrode 16b. The sintered metal layers 22a and 22b are formed by applying and baking a conductive paste containing Cu powder and glass powder on the outer surface of the ceramic body 12, respectively. The thicknesses of the sintered metal layers 22a and 22b are, for example, 10 μm to 30 μm, respectively.

  The fluorine layer 23 is formed on the sintered metal layers 22a and 22b. At this time, the fluorine layer 23 is formed so as to cover the ceramic body 12 on which the sintered metal layers 22a and 22b are formed. . The fluorine layer 23 is applied by immersing the ceramic body 12 on which the sintered metal layers 22a and 22b are formed in a fluorine solution, and the applied fluorine solution is dried to form the fluorine layer 23. . As the fluorine solution used here, for example, a fluorine solution containing a fluorocopolymer can be used.

  The conductive resin layers 24a and 24b formed on the fluorine layer 23 each contain metal powder as a conductive material. The conductive resin layers 24a and 24b are formed on the fluorine layer 23a so as to cover the sintered metal layers 22a and 22b, and are layers obtained by heating and curing a mixture of metal powder and thermosetting resin. It is. The thicknesses of the conductive resin layers 24a and 24b are adjusted by the size of the ceramic body 12, for example. When the dimension in the length direction L × the dimension in the thickness direction T × the dimension in the width direction W of the ceramic body 12 is 0.6 mm × 0.3 mm × 0.3 mm, the thickness of the conductive resin layers 24a and 24b. Is set to 10 μm, and when the above-described dimensions of the ceramic body 12 are 1.0 mm × 0.5 mm × 0.5 mm, the thickness of the conductive resin layers 24a and 24b is set to 15 μm, and the ceramic body 12 When each of the above-mentioned dimensions is 3.2 mm × 2.6 mm × 2.6 mm, the thickness of the conductive resin layers 24 a and 24 b is set to 80 μm to 100 μm.

  Although it does not restrict | limit especially as a thermosetting resin contained in the conductive resin layers 24a and 24b, For example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, a polyimide resin etc. can be used.

  The plating layer 26a includes a Ni plating layer 28a and a Sn plating layer 30a. Similarly, the plating layer 26b includes a Ni plating layer 28b and a Sn plating layer 30b.

  The Ni plating layers 28a and 28b are formed by plating the surfaces of the conductive resin layers 24a and 24b with Ni, and each has a thickness of, for example, 1 μm to 5 μm. The Ni plating layers 28a and 28b function as a protective layer that prevents solder erosion.

  The Sn plating layers 30a and 30b are formed by plating the surfaces of the Ni plating layers 28a and 28b with Sn, and each has a thickness of, for example, 1 μm to 5 μm. The Sn plating layers 30a and 30b function to improve solderability.

  Further, in the multilayer ceramic capacitor 10, since the conductive resin layers 24a and 24b include metal particles made of metal powder, good conductivity is ensured in the conductive resin layers 24a and 24b.

  Furthermore, in this multilayer ceramic capacitor 10, since the sintered metal layers 22a and 22b contain Cu, good conductivity is ensured in the sintered metal layers 22a and 22b.

  In addition, although the fluorine layer 23 exists between the sintered metal layer 22a and the conductive resin layer 24a and between the sintered metal layer 22b and the conductive resin layer 24b, it is on the sinterable metal layers 22a and 22b. By applying a fluorine solution and drying the fluorine solution, a portion where fluorine exists and a portion where fluorine does not exist are generated. Therefore, moisture penetration from the outside is prevented by the hydrophobicity of fluorine in the portion where fluorine exists, and conduction between the sintered metal layer 22a and the conductive resin layer 24a and the sintered metal layer in the portion where fluorine does not exist. Electrical connection between 22b and the conductive resin layer 24b is ensured. In addition, you may provide a fluorine by the coating by plasma polymerization.

  Further, in this multilayer capacitor 10, since the plating layer 26a includes the Ni plating layer 28a and the plating layer 26b includes the Ni plating layer 28b, the Ni plating layers 28a and 28b can remove moisture inside the plating layers 26a and 26b. For example, during reflow mounting, solder explosion in which moisture inside the plating layers 26a and 26b explodes with the solder to the outside can be prevented.

  Further, in the multilayer ceramic capacitor 10, the first external electrode 20a and the second external electrode 20b are formed on the first main surface 12a and the second main surface 12b of the ceramic body 12, so that the first It is easy to mount both the main surface 12a and the second main surface 12b as the mounting surface.

  Further, in this multilayer ceramic capacitor 10, at the end portions of the first external electrode 20a and the second external electrode 20b, the ceramic body 12, the sintered metal layer 22a, the conductive resin layer 24a, and the sintered metal A fluorine layer 23 is formed between the layer 22b and the conductive resin layer 24b. Since the fluorine layer 23 has hydrophobicity, moisture can be prevented from entering between the ceramic body 12 and the ends of the first external electrode 20a and the second external electrode 20b. This prevents moisture from entering the conductive resin layers 24a and 24b from the outside. Thereby, when the multilayer ceramic electronic component 10 is mounted on the substrate by reflow, solder explosion due to evaporation of moisture contained in the conductive resin layers 24a and 24b can be prevented. Whether or not the fluorine layer 23 exists is determined by polishing the external electrodes 20a and 20b formed on the main surface side of the ceramic body 12 toward the main surface direction, removing the external electrodes by argon etching, The presence of fluorine can be confirmed by observing the peak value by TOF-SIMS analysis.

Here, the fluorine detected by the TOF-SIMS apparatus is BaF ⁺ , C ₃ F ₃ ⁺ , C ₂ F ₄ ⁺ , C ₂ F ₅ ⁺ , C ₃ F ₅ ⁺ ions, and BaF ⁺ ions are It is detected with the highest intensity. It should be noted that a TOF-SIMS device manufactured by ION-TOF: TOF. In the case of SIMS 5, the measurement conditions are as follows.
Primary ion: Bi ₃ ⁺⁺ (Primary ion energy: 25 kV)
Secondary in polarity: Positive ion
Measurement area: 300μm × 300μm
Number of scans: 16 times Number of pixels: 128 pixels

  Note that the fluorine layer 23 may be formed on the surface of the ceramic body 12 before forming the sintered metal layers 22a and 22b. In this case, as shown in FIG. 4, at the end of the ceramic body 12, a fluorine layer 23 is provided between the ceramic body 12 and the sintered metal layer 22a and between the ceramic body 12 and the sintered metal layer 22b. Are formed, and the ends of the conductive resin layers 24 a and 24 b are covered with the fluorine layer 23. In addition, since the conductive resin layers 24a and 24b are respectively covered with the sintered metal layers 22a and 22b and the plating layers 26a and 26b, moisture can be prevented from entering the conductive resin layers 24a and 24b. .

  Note that the fluorine layer 23 does not have to be formed so as to cover the entire end face of the ceramic body 12 or the entire sintered metal layers 22a and 22b, but the ends of the first external electrode 20a and the second external electrode 20b. In this case, if it is formed between the ceramic body 12 and the conductive resin layer 24a and between the ceramic body 12 and the conductive resin layer 24b, moisture can enter the conductive resin layers 24a and 24b. Can be prevented.

  Next, an example of a method for manufacturing the above-described multilayer ceramic capacitor 10 will be described.

  First, a ceramic green sheet containing a ceramic material for constituting the ceramic layer 14 in the ceramic body 12 is prepared.

  Next, a conductive pattern is formed on the ceramic green sheet by applying a conductive paste. The conductive paste can be applied by various printing methods such as a screen printing method. The conductive paste may contain a known binder or solvent in addition to the conductive fine particles.

  A plurality of ceramic green sheets on which no conductive pattern is formed, a ceramic green sheet on which a conductive pattern having a shape corresponding to the first internal electrode or the second internal electrode is formed, and the conductive pattern are formed. A plurality of ceramic green sheets that are not stacked are stacked in this order and pressed in the stacking direction to produce a mother stacked body.

  Then, by cutting the mother laminate along a virtual cut line on the mother laminate, a plurality of raw ceramic laminates are produced from the mother laminate. Note that the cutting of the mother laminate can be performed by dicing or pressing. The raw ceramic laminate may be subjected to barrel polishing or the like to round the ridge line portion or the corner portion.

  Then, the raw ceramic laminate is fired. In the firing step, the first internal electrode and the second internal electrode are fired. The firing temperature can be appropriately set depending on the type of ceramic material and conductive paste used. The firing temperature can be, for example, 900 ° C. to 1300 ° C.

  In order to form a fluorine layer between the ceramic laminate (ceramic body) thus obtained and the sintered metal layer, the ceramic body is immersed in a fluorine solution and dried.

  Then, a conductive paste is applied to both ends of the fired ceramic laminate (ceramic body) by a method such as dipping.

  Next, the conductive paste applied to the ceramic laminate is dried with hot air, for example, at 60 ° C. to 180 ° C. for 10 minutes.

  Thereafter, the dried conductive paste is baked to form a sintered metal layer.

  When a fluorine layer is formed between the sintered metal layer and the conductive resin layer, the ceramic body in which the sintered metal layer is formed is not a fluorine solution, but only the ceramic body is immersed in a fluorine solution. Immerse in the solution.

  Then, the multilayer ceramic capacitor 10 can be manufactured by applying a plating layer comprising a Ni plating layer and a Sn plating layer formed on the Ni plating layer on the conductive resin layer.

As described above, in the multilayer ceramic electronic component in which the fluorine layer is formed, such as the multilayer ceramic capacitor 10 having such a configuration, fluorine having hydrophobicity between the main surface of the ceramic element body and the conductive resin layer. Therefore, it is possible to prevent moisture from entering from the end of the external electrode. Thereby, it is possible to prevent moisture from being contained in the conductive resin layer, and it is possible to prevent solder explosion when the multilayer ceramic electronic component is mounted on the substrate by reflow.
In such a multilayer ceramic electronic component, if fluorine is present between the sintered metal layer and the conductive resin layer, the barrier between the conductive resin layer and the outside can be made stronger, and the conductive It is possible to prevent moisture from entering the resin layer.
Furthermore, even if fluorine is formed between the ceramic body and the sintered metal layer, the conductive resin layer and the outside can be strongly blocked, and moisture can enter the conductive resin layer. Can be prevented.

(Experimental example)
First, as an example, 20 laminated ceramic capacitors in which a fluorine layer is formed between a ceramic body and a sintered metal layer, and a laminate in which a fluorine layer is formed between a sintered metal layer and a conductive resin layer Twenty ceramic capacitors were produced.
As a comparative example, 20 multilayer ceramic capacitors not provided with a fluorine layer were produced.
When these multilayer ceramic capacitors were mounted on a substrate by reflow, in the comparative example, moisture permeated into the conductive resin layer, and 15 solder explosions were observed in 20 of them. No explosion occurred.

In the above-described embodiments and examples, the first external electrode and the second external electrode are also formed on the side surface of the ceramic body, but the first external electrode and the second external electrode are It does not have to be formed on the side of the body. The first external electrode and the second external electrode may be formed on both end surfaces of the ceramic body and at least the first main surface or the second main surface. When the first external electrode and the second external electrode are formed on the multilayer ceramic electronic component in this way, the multilayer ceramic electronic is formed using the first main surface or the second main surface on which these external electrodes are formed as a mounting surface. Easy to mount components.

  In the above-described embodiments and examples, the plating layer is composed of a Ni plating layer and a Sn plating layer, but the plating layer may be composed of one plating layer or three or more plating layers. Good.

In the above-described embodiments and examples, the dielectric ceramic is used as the material of the ceramic body. In the present invention, depending on the type of the multilayer ceramic electronic component, the ceramic body material may be a magnetic ceramic such as ferrite. Further, semiconductor ceramics such as spinel ceramics, and piezoelectric ceramics such as PZT ceramics can also be used.
The multilayer ceramic electronic component functions as a multilayer ceramic inductor when using a ceramic ceramic as a ceramic body, as a multilayer ceramic thermistor when using a semiconductor ceramic, and as a multilayer ceramic when using a piezoelectric ceramic. Functions as a piezoelectric component. However, when the multilayer ceramic electronic component functions as a multilayer ceramic inductor, the internal electrode is a coiled conductor.

  The ceramic electronic component according to the present invention is particularly preferably used as, for example, a multilayer ceramic capacitor, a multilayer ceramic inductor, a multilayer ceramic thermistor, a multilayer ceramic piezoelectric component, or the like.

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor 12 Ceramic body 12a 1st main surface 12b 2nd main surface 12c 1st side surface 12d 2nd side surface 12e 1st end surface 12f 2nd end surface 14 Ceramic layer 16a 1st internal electrode 16b Second internal electrode 18a Exposed portion 18b Exposed portion 20a First external electrode 20b Second external electrode 22a Sintered metal layer 22b Sintered metal layer 23 Fluorine layer 24a Conductive resin layer 24b Conductive resin layer 26a Plating layer 26b Plating layer 28a Ni plating layer 28b Ni plating layer 30a Sn plating layer 30b Sn plating layer

Claims (5)

An internal electrode embedded; a first main surface; a second main surface opposite to the first main surface; and a first side surface connected to the first main surface and the second main surface A second side surface opposite to the first side surface, the first main surface, the second main surface, the first side surface and the first end surface connected to the second side surface, A ceramic body having a second end face opposite to the first end face;
The first end surface and the second end surface of the ceramic body electrically connected to the internal electrode, the first main surface, the second main surface, the first side surface, and the first A laminated ceramic electronic component comprising external electrodes formed on two side surfaces,
The external electrode, in order from the ceramic body side, comprises a sintered metal layer, a conductive resin layer and a plating layer,
A fluorine layer is present on each of the first main surface , the second main surface , the first side surface, the second side surface, the first end surface, and the second end surface of the ceramic body. Multi-layer ceramic electronic parts. An internal electrode embedded; a first main surface; a second main surface opposite to the first main surface; and a first side surface connected to the first main surface and the second main surface A second side surface opposite to the first side surface, the first main surface, the second main surface, the first side surface and the first end surface connected to the second side surface, A ceramic body having a second end face opposite to the first end face;
The first end surface and the second end surface of the ceramic body electrically connected to the internal electrode, the first main surface, the second main surface, the first side surface, and the first A laminated ceramic electronic component comprising external electrodes formed on two side surfaces,
The external electrode, in order from the ceramic body side, comprises a sintered metal layer, a conductive resin layer and a plating layer,
Fluorine detected by TOF-SIMS analysis on each of the first main surface , the second main surface , the first side surface, the second side surface, the first end surface, and the second end surface of the ceramic body. A multilayer ceramic electronic component characterized in that a layer is present. The multilayer ceramic electronic component according to claim 1, wherein the fluorine layer ensures electrical conduction in a portion where fluorine is not present. A first main surface; a second main surface opposite to the first main surface; a first side surface connected to the first main surface and the second main surface; and the first side surface. A first side surface connected to the first main surface, the second main surface, the first side surface, and the second side surface,
Preparing a ceramic body having a second end face opposite to the first end face;
Forming a fluorine layer by immersing the ceramic body in a fluorine solution and drying the fluorine solution attached to the ceramic body;
Forming a sintered metal layer by applying and baking a conductive paste on the fluorine layer at both ends of the laminate;
Manufacture of a multilayer ceramic electronic component comprising a step of forming a conductive resin layer by applying and curing a conductive resin on the sintered metal layer, and a step of forming a plating layer on the conductive resin layer Method. The method for manufacturing a multilayer ceramic electronic component according to claim 4, wherein the fluorine layer ensures electrical conduction in a portion where fluorine does not exist.

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