JP2022043196A - Laser peeling device, laser peeling method, and manufacturing method of organic EL display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser peeling device which can uniformly separate a peeling layer from a substrate.

SOLUTION: According to one embodiment, a laser peeling device 1 radiates laser light 16 to an interface between a substrate 11 and a peeling layer 12 in a workpiece 10, which includes at least the substrate 11 and the peeling layer 12 formed on the substrate 11, from the substrate 11 side to peel the peeling layer 12 from the substrate 11. The laser peeling device 1 includes: an injection unit 22 which blows a gas 35 onto the workpiece 10 to blow off dust existing on a surface of the workpiece 10; and a duct collection unit 23 which has an opening 52 at a position corresponding to a laser light 16 radiation position and suctions the blown dust from the opening 52 to collect the dust.

SELECTED DRAWING: Figure 7

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a laser peeling device, a laser peeling method, and a method for manufacturing an organic EL display, for example, a laser peeling device for separating a peeling layer from a substrate using laser light, a laser peeling method, and a method for manufacturing an organic EL display.

A laser peeling device is known in which a peeling layer formed on a substrate is irradiated with laser light from the substrate side to peel the peeling layer from the substrate. Patent Document 1 discloses a laser processing apparatus used in a laser peeling step of separating a thin film from a substrate.

Japanese Patent No. 5221333

As described in the background art, the laser peeling device irradiates the peeling layer formed on the substrate with laser light from the substrate side to peel the peeling layer from the substrate. At this time, if dust (particles) is attached to the substrate, the laser beam does not reach the release layer at the portion where the dust is attached, so that the substrate and the release layer are not separated at this portion. Therefore, there is a problem that the substrate and the release layer cannot be uniformly separated.

The laser peeling device according to one embodiment includes an injection unit that blows gas onto the work and a dust collection unit that sucks dust from an opening to collect dust.

The laser peeling device according to one embodiment has a dust collecting unit including an optical path space through which a laser beam passes and an exhaust space arranged outside the optical path space. The optical path space has a side wall arranged around the opening, and an air supply hole for supplying gas to the optical path space is formed in the side wall. The gas supplied from the air supply hole to the optical path space is configured to flow to the work side along the side wall, then pass between the lower end of the side wall and the work, and flow to the exhaust space.

In the laser peeling method according to one embodiment, when the work is conveyed while irradiating with laser light, gas is blown onto the work, and the blown gas is sucked to collect dust.

The method for manufacturing an organic EL display according to an embodiment includes a step of separating a substrate and a release layer, and when the work is conveyed while irradiating a laser beam in the separation step, gas is sprayed onto the work and sprayed. It sucks the collected gas and collects dust.

According to the above embodiment, it is possible to provide a laser peeling device capable of uniformly separating a peeling layer from a substrate, a laser peeling method, and a method for manufacturing an organic EL display.

It is sectional drawing which shows an example of an organic EL display. It is a figure for demonstrating the outline of the manufacturing process of an organic EL display. It is sectional drawing for demonstrating the laser peeling apparatus. It is a top view and a side view for demonstrating a laser peeling process. It is a top view and a side view for demonstrating a laser peeling process. It is a top view and a side view for demonstrating a laser peeling process. It is sectional drawing for demonstrating the laser peeling process. It is sectional drawing for demonstrating the laser peeling apparatus which concerns on Embodiment 1. FIG. It is a top view for demonstrating the laser peeling apparatus which concerns on Embodiment 1. FIG. It is a bottom view for demonstrating the laser peeling apparatus which concerns on Embodiment 1. FIG. It is an enlarged sectional view of the vicinity of a work of a dust collecting unit. It is sectional drawing for demonstrating the laser peeling apparatus which concerns on Embodiment 2. It is a perspective view for demonstrating the detail of the dust collecting unit provided in the laser peeling apparatus which concerns on Embodiment 2. FIG. It is a perspective view for demonstrating the detail of the dust collecting unit provided in the laser peeling apparatus which concerns on Embodiment 2. FIG. It is sectional drawing for demonstrating the laser peeling apparatus which concerns on Embodiment 3. FIG. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 3. FIG. It is sectional drawing for demonstrating another configuration example of the laser peeling apparatus which concerns on Embodiment 3. FIG. It is sectional drawing for demonstrating the laser peeling apparatus which concerns on Embodiment 4. FIG. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 4. FIG. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 5. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 5. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 5. It is a side view for demonstrating the laser peeling apparatus which concerns on Embodiment 5. FIG. 5 is a diagram illustrating the movement of a work inside a chamber in the laser peeling device according to the fifth embodiment. FIG. 5 is a diagram illustrating the relationship between the presence / absence of filters on the front wall and the rear wall and the arrival of air on the front wall side and the stage inside the chamber in the laser peeling device according to the fifth embodiment. FIG. 5 is a diagram illustrating an air flow inside the chamber when an air supply fan is installed on the front wall of the chamber and an exhaust port for an exhaust duct is installed on the rear wall of the laser peeling device according to the fifth embodiment. , (A) show a perspective view, and (b) shows a top view. FIG. 5 is an example of an air flow inside the chamber when an air supply fan is installed on the front wall of the chamber and an exhaust port for an exhaust duct and a filter are installed on the rear wall in the laser peeling device according to the fifth embodiment. (A) shows a perspective view, and (b) shows a top view. In the laser peeling device according to the fifth embodiment, the air flow inside the chamber when the air supply fan and the filter are installed on the front wall of the chamber and the exhaust port for the exhaust duct and the filter are installed on the rear wall is exemplified. (A) shows a perspective view, and (b) shows a top view. It is sectional drawing which illustrates the chamber when the pressure inside the chamber becomes larger than the pressure outside. It is a graph which exemplifies the ratio of the displacement with respect to the supply air amount in the dust collecting unit, and the particle density | concentration in the laser peeling apparatus which concerns on Embodiment 5. It is a graph which exemplifies the relationship between the operation of FFU and the ratio of the exhaust amount / air supply amount in the dust collection unit which concerns on Embodiment 5, and the particle density. It is a block diagram which illustrates the operation of FFU which concerns on Embodiment 5, and the control method of air supply and exhaust of a dust collection unit. It is a figure exemplifying the control of the controller of the laser peeling apparatus which concerns on Embodiment 5. FIG. It is a perspective view for demonstrating the laser peeling apparatus which concerns on Embodiment 6. In the laser peeling apparatus according to the sixth embodiment, it is a figure exemplifying the movement of the work in the chamber, (a) is the figure projected on the upper surface wall, (b) is the figure projected on the bottom wall. Is. It is a figure which illustrates the flow of the air inside the chamber in the laser peeling apparatus which concerns on Embodiment 6. (A) and (b) are diagrams illustrating the flow of air in the chamber in the laser exfoliation device according to the sixth embodiment, and (a) shows a case where the supply air amount is larger than the exhaust amount. , (B) show the case where the supply air amount is smaller than the exhaust amount.

<Organic EL display>
First, the structure of an organic EL (Electroluminescence) display will be described with reference to FIG. 1A. FIG. 1A is a cross-sectional view showing an example of an organic EL display. The organic EL display 300 shown in FIG. 1A is an active matrix type display device in which a TFT is arranged in each pixel PX.

The organic EL display 300 includes a substrate 218, a release layer 212, a TFT (Thin Film Transistor) layer 311, an organic layer 312, a color filter layer 313, and a protective layer 214. FIG. 1A shows a top-emission organic EL display in which the protective layer 214 side is the visual recognition side. The following description shows an example of the configuration of the organic EL display, and the present embodiment is not limited to the configuration described below. For example, in the present embodiment, it may be used for a bottom emission type organic EL display.

The substrate 218 is a plastic film, which can be bent by applying stress. A release layer 212 and a TFT layer 311 are provided on the substrate 218. The TFT layer 311 has a TFT 311a arranged in each pixel PX. Further, the TFT layer 311 has wiring (not shown) connected to the TFT 311a. The TFT 311a, wiring, and the like constitute a pixel circuit.

An organic layer 312 is provided on the TFT layer 311. The organic layer 312 has an organic EL light emitting element 312a arranged for each pixel PX. The organic EL light emitting device 312a has, for example, a laminated structure in which an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated. In the case of the top emission method, the anode is a metal electrode and the cathode is a transparent conductive film such as ITO (Indium Tin Oxide). Further, the organic layer 312 is provided with a partition wall 312b for separating the organic EL light emitting element 312a between the pixels PX.

A color filter layer 313 is provided on the organic layer 312. The color filter layer 313 is provided with a color filter 313a for performing color display. That is, each pixel PX is provided with a resin layer colored in R (red), G (green), or B (blue) as a color filter 313a. When the white light emitted from the organic layer 312 passes through the color filter 313a, it is converted into RGB color light. In the case of a three-color system in which the organic layer 312 is provided with an organic EL light emitting element that emits each color of RGB, the color filter layer 313 may be omitted.

A protective layer 214 is provided on the color filter layer 313. The protective layer 214 is made of a resin material and is provided to prevent deterioration of the organic EL light emitting element of the organic layer 312.

The current flowing through the organic EL light emitting element 312a of the organic layer 312 changes depending on the display signal supplied to the pixel circuit. Therefore, by supplying a display signal corresponding to the display image to each pixel PX, it is possible to control the amount of light emitted by each pixel PX. This makes it possible to display a desired image.

<Manufacturing process of organic EL display>
Next, the manufacturing process of the organic EL display described above will be described with reference to FIG. 1B. When manufacturing an organic EL display, first, the substrate 211 is prepared (step A). For example, a glass substrate that transmits laser light is used for the substrate 211. Next, the release layer 212 is formed on the substrate 211 (step B). For the release layer 212, for example, polyimide can be used. After that, the circuit element 213 is formed on the release layer 212 (step C). Here, the circuit element 213 includes the TFT layer 311 shown in FIG. 1A, the organic layer 312, and the color filter layer 313. The circuit element 213 can be formed by using a photolithography technique or a film forming technique. After that, a protective layer 214 for protecting the circuit element 213 is formed on the circuit element 213 (step D).

Next, the substrate 211 is inverted so that the substrate 211 is on top (step E), and the release layer 212 is irradiated with the laser beam 216 from the substrate 211 side (step F). A line beam can be used for the laser beam 216. In the case shown in FIG. 1B, since the substrate 211 is conveyed in the x direction, the laser beam 216 is irradiated from the right side to the left side of the substrate 211. After that, the substrate 211 and the release layer 212 are separated (step G). Finally, the film 218 is laminated on the release layer 212. For example, the film 218 is a plastic film, which can be bent by applying stress. By using such a manufacturing process, a bendable organic EL display 300 can be manufactured.

<Laser peeling device (comparative example)>
Next, the laser peeling device (comparative example) used in the step F will be specifically described. FIG. 2 is a cross-sectional view for explaining a laser peeling device (laser lift-off device). As shown in FIG. 2, the laser peeling device 201 includes an optical system 220 and a stage 221. Laser light is supplied to the optical system 220 from a laser light source (not shown). As the laser light source, for example, an excimer laser or a laser generator that generates an ultraviolet (UV) laser can be used. The optical system 220 is configured by using a plurality of lenses. In the optical system 220, the shape of the laser beam supplied from the laser light source is a line shape, specifically, the laser beam 216 whose focal point extends in the y-axis direction.

The stage 221 is configured to be able to transport the work 210 arranged on the stage 221 in the transport direction (x-axis direction). Here, the work 210 includes at least a substrate 211 and a release layer 212. The circuit elements and the like formed on the release layer 212 are not shown. The work 210 is arranged on the stage 221 so that the substrate 211 is on the upper side so that the laser beam 216 is irradiated from the substrate 211 side to the interface between the substrate 211 and the release layer 212. Further, the stage 221 is configured to be movable in the vertical direction (direction along the z-axis) so that the focal point of the laser beam 216 is aligned with the interface between the substrate 211 and the release layer 212.

As shown in FIG. 2, while irradiating the laser beam 216, the stage 221 is moved in the transport direction (x-axis direction) to transport the work 210 in the transport direction, whereby the laser beam 216 is scanned on the work 210. be able to. At this time, when the laser beam 216 is irradiated, the bonds of atoms and molecules are decomposed in the vicinity of the interface between the substrate 211 and the release layer 212. Therefore, as shown in FIG. 3, the interface between the substrate 211 and the release layer 212 is formed. Soot-like smoke 219 is generated from. The soot-like smoke 219 is released into the atmosphere from the end face 217 of the work 210. This soot-like smoke 219 is a decomposition product of the release layer 212. As shown in FIG. 4, the soot-shaped smoke 219 is deposited on the surface of the substrate 211 to become dust (particles) 231.

Then, when the laser light 216 is scanned with the dust 231 deposited on the surface of the substrate 211, as shown in FIG. 5, the laser light 216 is blocked by the dust 231 and the laser light 216 does not reach the release layer 212. Dark spot (dark unevenness) 232 is generated. In the dark spot 232, which the laser beam 216 does not reach, the substrate 211 and the release layer 212 are in a state of being adhered to each other. Therefore, as shown in FIG. 6, when the substrate 211 and the peeling layer 212 are peeled off, a portion where the substrate 211 and the peeling layer 212 are not separated is generated in the portion corresponding to the dark spot 232. If the substrate 211 and the release layer 212 are forcibly separated in this state, the surface of the release layer 212 becomes uneven, and the smoothness of the surface of the release layer 212 becomes uneven. In other words, the thickness of the release layer 212 becomes uneven. Therefore, there is a problem that the substrate 211 and the release layer 212 cannot be uniformly separated. In particular, when a laser peeling device is used in the manufacturing process of an organic EL display, if the substrate 211 and the peeling layer 212 are not uniformly separated, the display screen of the organic EL display becomes uneven.

In order to solve such a problem, the laser peeling apparatus according to the first to fourth embodiments described below includes a mechanism for removing dust on the substrate. Hereinafter, a specific description will be given.

<Embodiment 1>
Hereinafter, the first embodiment will be described with reference to the drawings. 7 to 9 are a cross-sectional view, a plan view, and a bottom view for explaining the laser peeling apparatus according to the first embodiment, respectively. As shown in FIG. 7, the laser peeling device 1 includes an optical system 20, a stage 21, an injection unit 22, and a dust collecting unit 23. The laser peeling device 1 according to the present embodiment transfers the work 10 to the work 10 including at least the substrate 11 and the peeling layer 12 formed on the substrate 11, and from the substrate 11 side to the substrate 11. It is a device that irradiates the interface with the peeling layer 12 with a laser beam 16 to peel the peeling layer 12 from the substrate 11. When the work 10 is conveyed while irradiating the work 10 with the laser beam, the laser peeling device 1 blows a gas onto the work 10 and sucks the blown gas to collect dust.

Laser light is supplied to the optical system 20 from a laser light source (not shown). As the laser light source, for example, an excimer laser or a laser generator that generates an ultraviolet (UV) laser can be used. The optical system 20 is configured by using a plurality of lenses. In the optical system 20, the shape of the laser beam supplied from the laser light source is a line shape, specifically, the laser beam 16 (see FIG. 8) whose focal point extends in the y-axis direction.

The stage 21 is configured to be able to transport the work 10 arranged on the stage 21 in the transport direction (x-axis direction). Here, the work 10 includes at least a substrate 11 and a release layer 12. The circuit elements and the like formed on the release layer 12 are not shown (the same applies hereinafter). The work 10 is arranged on the stage 21 so that the substrate 11 is on the upper side so that the laser beam 16 is irradiated from the substrate 11 side to the interface between the substrate 11 and the release layer 12. Further, the stage 21 is configured to be movable in the vertical direction (direction along the z-axis) so that the focal point of the laser beam 16 is aligned with the interface between the substrate 11 and the peeling layer 12.

The injection unit 22 blows gas onto the work 10 to blow off dust (particles) existing on the surface of the work 10. As shown in FIG. 7, the injection unit 22 is arranged on the downstream side (x-axis plus side) of the work 10 with respect to the dust collection unit 23. The injection unit 22 includes a main body 31, a nozzle 32, and an air supply pipe 33. As shown in FIGS. 8 and 9, the main body 31 and the nozzle 32 are arranged so as to extend in the y-axis direction (in other words, parallel to the surface of the work 10 and perpendicular to the transport direction of the work 10). ing.

Gas (compressed gas) is supplied to the main body 31 of the injection unit 22 from the air supply pipe 33. Then, the gas supplied to the main body 31 is ejected from the tip of the nozzle 32 toward the surface of the work 10 (indicated by the arrow 35). As shown in FIG. 7, since the flow path of the noise 32 is narrow, the nozzle 32 functions as a diaphragm. Therefore, the pressure inside the main body 31 becomes high, and the gas is vigorously blown out from the tip of the nozzle 32. At this time, the injection unit 22 blows gas in the direction opposite to the transport direction of the work 10 (on the minus side of the x-axis) to form a laminar flow on the surface of the work 10 in the direction opposite to the transport direction of the work 10. The injection unit 22 can be formed by using a metal material such as stainless steel or a resin material. Further, as the gas supplied from the air supply pipe 33, compressed inert gas (nitrogen or the like), compressed air or the like can be used.

As shown in FIG. 7, the dust collecting unit 23 is arranged on the upstream side (x-axis minus side) of the work 10 with respect to the injection unit 22, and is blown off by the gas 35 sprayed from the injection unit 22. The dust is sucked from the opening 52 and collected. The dust collecting unit 23 includes a side wall 41, an upper plate 42 provided on the upper part of the side wall 41 (see FIG. 8), and plate-shaped members 44 and 45 (see FIG. 9) provided on the lower part of the side wall 41. It is configured using. As shown in FIG. 8, the upper plate 42 is formed with an upper opening 51 extending in the y-axis direction, and the upper opening 51 is covered with a lid 48.

As shown in FIG. 7, an opening 52 is formed between the plate-shaped member 44 and the plate-shaped member 45. Specifically, as shown in FIG. 9, the opening 52 has a plate-shaped member 44 extending in the y-axis direction provided on the upstream side of the opening 52 in the transport direction, and the opening 52 in the transport direction with respect to the opening 52. It is formed by using a plate-shaped member 45 extending in the y-axis direction provided on the downstream side.

As shown in FIG. 7, an exhaust pipe 46 (46a, 46b) is attached to the side wall 41, and the side wall 41 and the upper plate 42 are exhausted by using the exhaust pipe 46 (46a, 46b). , The space surrounded by the plate-shaped members 44, 45, and the lid 48 is depressurized. As a result, dust can be sucked from the opening 52.

At this time, as shown in FIG. 9, the length L1 of the opening 52 in the y-axis direction may be longer than the length L2 of the nozzle 32 of the injection unit 22 in the y-axis direction. With such a configuration, the dust blown off by the gas 35 blown from the nozzle 32 can be reliably sucked from the opening 52.

The opening 52 is arranged at a position corresponding to the irradiation position of the laser beam 16 (see FIGS. 7 and 9). Further, the upper opening 51 is provided at a position corresponding to an optical path through which the laser beam passes. Further, the upper opening 51 is covered with a lid 48 made of a material that transmits laser light. For example, the lid 48 can be formed using glass or sapphire. As shown in FIGS. 8 and 9, the upper opening 51 and the opening 52 are formed so as to extend in the y-axis direction. Therefore, as shown in FIG. 7, the line-shaped laser beam 16 passes through the upper opening 51 of the dust collecting unit 23, then passes through the opening 52, and reaches the interface between the substrate 11 and the release layer 12. .. The side wall 41, the upper plate 42, and the plate-shaped members 44, 45 of the dust collecting unit 23 can be formed by using a metal material such as stainless steel or a resin material.

FIG. 10 is an enlarged cross-sectional view of the vicinity of the work 10 of the dust collecting unit 23. As shown in FIG. 10, the plate-shaped members 44 and 45 are arranged so that the gap d2 between the plate-shaped member 45 and the work 10 is wider than the gap d1 between the plate-shaped member 44 and the work 10. By arranging the plate-shaped members 44 and 45 in this way, it is possible to reduce the air resistance in the gap d2 between the plate-shaped member 45 and the work 10. As a result, the gas 35 easily flows in the gap d2 between the plate-shaped member 45 and the work 10, and the gas 35 easily flows in the opening 52 of the dust collecting unit 23.

Further, as shown in FIG. 10, the cross-sectional shape of the opening 52 of the plate-shaped member 44 may be a shape including an inclined surface 55 such that the angle formed with the lower surface of the plate-shaped member 44 is an acute angle. Further, the cross-sectional shape of the opening 52 of the plate-shaped member 45 may be a shape including an inclined surface 56 such that the angle formed with the upper surface of the plate-shaped member 45 is an acute angle. By forming the plate-shaped members 44 and 45 in such a shape, the air resistance in the opening 52 of the dust collecting unit 23 can be reduced, and the gas 35 can easily flow through the opening 52.

As described above, the laser peeling device 1 according to the present embodiment has a jet unit 22 that blows gas 35 onto the work 10 to blow off dust existing on the surface of the work 10, and an irradiation position of the laser beam 16. It has an opening 52 at a corresponding position, and includes a dust collecting unit 23 that sucks and collects the blown dust from the opening 52. Therefore, when the work 10 is irradiated with the laser beam 16 while being conveyed by the laser peeling device 1, the dust existing on the surface of the work 10 can be blown off and removed.

As a result, it is possible to prevent the laser beam 16 from being blocked by dust and the generation of dark spots, which are portions where the laser beam 16 does not reach the release layer 12, from being generated. Therefore, it is possible to suppress the generation of a portion where the substrate 11 and the peeling layer 12 are not separated, so that the substrate 11 and the peeling layer 12 can be uniformly separated. That is, when the substrate 11 and the release layer 12 are separated, the surface of the release layer 12 can be prevented from becoming uneven, and the surface of the release layer 12 can be made smooth. In other words, it is possible to suppress the occurrence of unevenness in the thickness of the release layer 12.

Further, by using the laser peeling device 1 according to the present embodiment in the manufacturing process of the organic EL display, the substrate 11 and the peeling layer 12 can be uniformly separated, and unevenness on the display screen of the organic EL display can be caused. The occurrence can be suppressed.

Further, in the laser peeling device 1 according to the present embodiment, an opening 52 is provided at a position corresponding to the irradiation position of the laser light 16, and dust is sucked from the opening 52. Therefore, the irradiation position of the laser light 16 Dust in the vicinity can be removed. In particular, since the gas can flow on the optical axis of the laser beam 16 with such a configuration, the soot-like smoke (see FIG. 3) generated by irradiating the release layer 12 with the laser beam 16 is opened. It can be removed by suction from 52. Therefore, it is possible to prevent dust from adhering to the work 10.

Further, in the laser peeling device 1 according to the present embodiment, the injection unit 22 is arranged on the downstream side in the transport direction of the work 10 with respect to the dust collection unit 23 (opening 52), and the injection unit 22 is connected to the transport direction of the work 10. The gas 35 is sprayed in the opposite direction to form a laminar flow 35 on the surface of the work 10 in the direction opposite to the transport direction of the work 10. Therefore, it is possible to remove the dust existing on the surface of the work 10 before the laser beam 16 irradiates the work 10.

According to the present embodiment described above, it is possible to provide a laser peeling device capable of uniformly separating the peeling layer from the substrate, a laser peeling method, and a method for manufacturing an organic EL display.

<Embodiment 2>
Next, the second embodiment will be described. FIG. 11 is a cross-sectional view for explaining the laser peeling apparatus according to the second embodiment. As shown in FIG. 11, the laser peeling device 2 includes an optical system 20, a stage 21, and a dust collecting unit 60. The laser peeling device 2 according to the present embodiment transfers the work 10 to the work 10 including at least the substrate 11 and the peeling layer 12 formed on the substrate 11, and from the substrate 11 side to the substrate 11. It is a device that irradiates the interface with the peeling layer 12 with a laser beam 16 to peel the peeling layer 12 from the substrate 11.

Laser light is supplied to the optical system 20 from a laser light source (not shown). As the laser light source, for example, an excimer laser or a laser generator that generates an ultraviolet (UV) laser can be used. The optical system 20 is configured by using a plurality of lenses. In the optical system 20, the shape of the laser beam supplied from the laser light source is a line shape, specifically, the laser beam 16 whose focal point extends in the y-axis direction.

The stage 21 is configured to be capable of transporting the work 10 arranged on the stage 21 in the transport direction (x-axis direction). Here, the work 10 includes at least a substrate 11 and a release layer 12. The circuit elements and the like formed on the release layer 12 are not shown. The work 10 is arranged on the stage 21 so that the substrate 11 is on the upper side so that the laser beam 16 is irradiated from the substrate 11 side to the interface between the substrate 11 and the release layer 12. Further, the stage 21 is configured to be movable in the vertical direction (direction along the z-axis) in order to focus the laser beam 16 on the interface between the substrate 11 and the release layer 12.

Next, the configuration of the dust collecting unit 60 will be described in detail. 12 and 13 are perspective views for explaining the details of the dust collecting unit 60 included in the laser peeling device 2 according to the present embodiment. Note that FIG. 13 also shows a cross-sectional shape obtained by cutting a part of the dust collecting unit 60 in the xz plane.

As shown in FIGS. 11 to 13, the dust collecting unit 60 includes an optical path space 70, an air supply space 71, 72, and an exhaust space 73, 74.

The optical path space 70 is a space through which the laser beam 16 passes, and has an opening 78 at a position corresponding to the irradiation position of the laser beam 16. The optical path space 70 includes side walls 61, 62, 81, 82 (see FIG. 12) arranged around the optical path space 70, and a lid 68 (see FIG. 11) arranged so as to cover the upper portions of the side walls 61, 62. It is configured using and. Here, the side wall 61 is a plate-shaped member arranged on the upstream side (x-axis minus side) of the work 10 with respect to the optical path space 70. The side wall 62 is a plate-shaped member arranged on the downstream side (x-axis plus side) of the work 10 with respect to the optical path space 70.

As shown in FIG. 12, the side wall 61 and the side wall 62 are arranged so as to extend in the y-axis direction. Further, side walls 81 and 82 are arranged at both ends of the side wall 61 and the side wall 62 in the y-axis direction, respectively. As shown in FIG. 13, the opening 78 is arranged so as to extend in the y-axis direction. The side wall 61 and the side wall 62 are arranged so as to face each other, and the side wall 81 and the side wall 82 are arranged so as to face each other. The optical path space 70 is a space surrounded by side walls 61, 62, 81, and 82.

As shown in FIG. 11, in the present embodiment, the side walls 61 and 62 are arranged so as to be oblique with respect to the vertical direction (z-axis direction) so that the side walls 61 and 62 do not obstruct the optical path. However, if the side walls 61 and 62 do not obstruct the optical path, the side walls 61 and 62 may be arranged so as to be parallel to the vertical direction.

As shown in FIG. 11, the lid 68 is arranged on the upper plate 65. That is, the optical path space 70 is covered with the lid body 68. The lid 68 is made of a material that transmits laser light, and can be formed by using, for example, glass or sapphire. In FIG. 12, the upper plate 65 and the lid 68 are not shown. Further, in FIG. 13, the illustration of the lid body 68 is omitted. As shown in FIG. 12, since the optical path space 70 is formed so as to extend in the y-axis direction, a line-shaped laser beam 16 extending in the y-axis direction can be passed through. Therefore, as shown in FIG. 11, the line-shaped laser beam 16 passes through the optical path space 70 of the dust collecting unit 23, then passes through the opening 78, and reaches the interface between the substrate 11 and the release layer 12.

As shown in FIG. 11, the side walls 61 and 62 are formed with air supply holes 75 and 76 for supplying gas to the optical path space 70, respectively. That is, the optical path space 70 and the air supply space 71 are connected to each other via the air supply hole 75, and gas is supplied to the optical path space 70 from the air supply space 71 through the air supply hole 75. Further, the optical path space 70 and the air supply space 72 are connected to each other through the air supply hole 76, and gas is supplied to the optical path space 70 from the air supply space 72 through the air supply hole 76. As shown in FIGS. 12 and 13, for example, the air supply holes 75 and 76 are formed so as to be arranged along the y-axis direction.

The air supply spaces 71 and 72 are arranged outside the optical path space 70. Specifically, the air supply space 71 is arranged on the upstream side (x-axis minus side) of the work 10 in the transport direction with respect to the optical path space 70, and is arranged above the exhaust space 73. Further, the air supply space 72 is arranged on the downstream side (x-axis plus side) of the work 10 in the transport direction with respect to the optical path space 70, and above the exhaust space 74. As shown in FIG. 12, the air supply spaces 71 and 72 are spatially connected at both ends of the dust collecting unit 60 in the y-axis direction. That is, the air supply spaces 71 and 72 are arranged so as to surround the outside of the optical path space 70.

As shown in FIG. 12, the air supply spaces 71 and 72 include the plate-shaped members 63 and 64, the plate-shaped members 83 and 84, the side walls 61 and 62, the side walls 81 and 82, the partition plates 66 and 67, and the upper plate 65 ( It is a space surrounded by (see FIG. 13). As shown in FIG. 12, the end of the dust collecting unit 60 on the negative side in the y-axis direction, that is, the plate-shaped member 84 is formed with an air supply port 85 for supplying gas to the air supply spaces 71 and 72. There is. A positive pressure gas such as compressed inert gas (nitrogen or the like) or compressed air is supplied to the air supply port 85.

As shown in FIGS. 11 and 13, the exhaust spaces 73 and 74 are arranged outside the optical path space 70. Specifically, the exhaust space 73 is arranged on the upstream side (x-axis minus side) of the work 10 with respect to the optical path space 70 and below the air supply space 71. Further, the exhaust space 74 is arranged on the downstream side (x-axis plus side) of the work 10 in the transport direction with respect to the optical path space 70, and below the air supply space 72. As in the case of the supply air spaces 71 and 72, the exhaust spaces 73 and 74 are spatially connected at both ends of the dust collecting unit 60 in the y-axis direction.

As shown in FIGS. 11 to 13, the exhaust spaces 73 and 74 are surrounded by the plate-shaped members 63 and 64, the plate-shaped members 83 and 84, the side walls 61 and 62, the side walls 81 and 82, and the partition plates 66 and 67. It is a space. The work 10 side of the exhaust spaces 73 and 74 is open. An exhaust port 77 (77a, 77b) is attached to the plate-shaped member 64 of the dust collecting unit 60, and exhaust is performed by using a fan, a pump, or the like attached to the tip of the exhaust port 77 (77a, 77b). Then, the pressures in the exhaust spaces 73 and 74 become negative pressures.

The side walls 61, 62, 81, 82, the plate-shaped members 63, 64, 83, 84, the upper plate 65, the partition plates 66, 67, and the exhaust ports 77a, 77b included in the dust collecting unit 60 are made of a metal material such as stainless steel. Can be formed using.

Next, the operation of the dust collecting unit 60 will be described. When operating the dust collecting unit 60, positive pressure gas is supplied to the air supply spaces 71 and 72 from the air supply port 85 shown in FIG. Further, the exhaust spaces 73 and 74 are exhausted through the exhaust ports 77a and 77b shown in FIG. 13, and the pressure in the exhaust spaces 73 and 74 is set as a negative pressure.

As shown in FIG. 11, when the air supply spaces 71 and 72 become positive pressure, gas flows from the air supply spaces 71 and 72 to the optical path space 70 through the air supply holes 75 and 76. At this time, since the diameters of the air supply holes 75 and 76 are sufficiently small, the pressure in the air supply spaces 71 and 72 becomes uniform over the entire area of the air supply spaces 71 and 72. Therefore, the flow rates of the gases flowing out from the air supply holes 75 and 76 are substantially the same. The gas flow is indicated by a broken line arrow in FIG. The same applies to FIGS. 14, 16 and 17.

The gas supplied from the air supply holes 75 and 76 to the optical path space 70 flows toward the work 10 along the side walls 61 and 62, and then passes between the lower ends of the side walls 61 and 62 and the work 10 to pass through the exhaust space 73. , 74 flows. That is, the gas supplied from the air supply holes 75 and 76 forms a downflow, collides with the work 10, and then branches into the upstream side and the downstream side in the transport direction of the work 10. The gas branched upstream in the transport direction of the work 10 flows into the exhaust space 73. Further, the gas branched to the downstream side in the transport direction of the work 10 flows into the exhaust space 74. Then, the gas flowing into the exhaust spaces 73 and 74 is subsequently exhausted from the exhaust ports 77 (77a and 77b).

As described above, in the laser peeling device 2 according to the present embodiment, the dust generated by irradiating the laser beam by creating the gas flow described above inside the dust collecting unit 60 (FIGS. 3 and 3). 4) can be exhausted from the exhaust ports 77 (77a, 77b) along the flow of gas. At this time, the gas supplied from the air supply holes 75 and 76 becomes a downflow and collides with the work 10, so that dust existing on the surface of the work 10 can be blown off. Then, the blown dust can be exhausted from the exhaust ports 77 (77a, 77b) along the flow of gas.

At this time, the amount of gas exhausted from the exhaust ports 77 (77a, 77b) is larger than the amount of gas supplied from the supply air port 85 to the supply air spaces 71 and 72, so that the exhaust spaces 73 and 74 have. The pressure can be further reduced. By further reducing the pressure in the exhaust spaces 73 and 74 in this way, from the outside of the dust collecting unit 60, between the lower ends of the plate-shaped members 63, 64, 83, 84 (see FIG. 12) and the work 10. It can be allowed to pass through and allow gas to flow in. Therefore, even if the dust floats inside the dust collecting unit 60, it is possible to prevent the dust from coming out to the outside of the dust collecting unit 60.

As described above, the laser peeling device 2 according to the present embodiment has an opening 78 at a position corresponding to the irradiation position of the laser beam 16, and has an optical path space 70 through which the laser beam 16 passes and an optical path space. It has a dust collecting unit 60 including exhaust spaces 73, 74 arranged outside the 70. Air supply holes 75 and 76 for supplying gas to the optical path space 70 are formed on the side walls 61 and 62 of the optical path space 70. Then, the gas supplied from the air supply holes 75 and 76 to the optical path space 70 flows to the work 10 side along the side walls 61 and 62, and then passes between the lower ends of the side walls 61 and 62 and the work 10 and is exhausted. It flows into spaces 73 and 74. As described above, in the laser peeling device 2 according to the present embodiment, the dust collecting unit 60 is used to create a gas flow as described above, and the dust generated by irradiating the laser beam 16 (dust (). (See FIGS. 3 and 4) can be exhausted along the flow of gas.

As a result, it is possible to prevent the laser beam 16 from being blocked by dust and the generation of dark spots, which are portions where the laser beam 16 does not reach the release layer 12, from being generated. Therefore, it is possible to suppress the generation of a portion where the substrate 11 and the peeling layer 12 are not separated, so that the substrate 11 and the peeling layer 12 can be uniformly separated. That is, when the substrate 11 and the release layer 12 are separated, the surface of the release layer 12 can be prevented from becoming uneven, and the surface of the release layer 12 can be made smooth. In other words, it is possible to suppress the occurrence of unevenness in the thickness of the release layer 12.

Further, since the gas supplied from the air supply holes 75 and 76 flows down along the side walls 61 and 62 on the optical axis of the laser beam 16, soot-like smoke generated by irradiating the laser beam is generated. And dust (see FIGS. 3 and 4) can be prevented from adhering to the side walls 61 and 62 and the lower surface of the lid.

Further, by using the laser peeling device 2 according to the present embodiment in the manufacturing process of the organic EL display, the substrate 11 and the peeling layer 12 can be uniformly separated, and unevenness on the display screen of the organic EL display can be caused. The occurrence can be suppressed.

According to the present embodiment described above, it is possible to provide a laser peeling device capable of uniformly separating the peeling layer from the substrate, a laser peeling method, and a method for manufacturing an organic EL display.

<Embodiment 3>
Next, the third embodiment will be described. FIG. 14 is a cross-sectional view for explaining the laser peeling apparatus according to the third embodiment. The laser peeling device 3 according to the present embodiment is different from the laser peeling device 2 described in the second embodiment in that the bottom plate members 91 to 94 are provided at the bottom of the dust collecting unit 90. Other than this, since it is the same as the laser peeling device 2 described in the second embodiment, the same components are designated by the same reference numerals, and duplicated description will be omitted.

As shown in FIGS. 14 and 15, an intake port 95 is formed in the lower part of the exhaust space 73 included in the dust collecting unit 90. The intake port 95 can be formed by arranging the bottom plate member 91 extending in the y-axis direction and the bottom plate member 92 so as to face each other. The bottom plate member 91 is attached to the lower part of the side wall 61, and the bottom plate member 92 is attached to the lower part of the plate-shaped member 63. The intake port 95 is formed so that the flow path between the surface of the work 10 and the exhaust space 73 is narrowed.

Similarly, an intake port 96 is formed in the lower part of the exhaust space 74 included in the dust collecting unit 90. The intake port 96 can be formed by arranging the bottom plate member 93 extending in the y-axis direction and the bottom plate member 94 facing each other. The bottom plate member 93 is attached to the lower part of the side wall 62, and the bottom plate member 94 is attached to the lower part of the plate-shaped member 64. The intake port 96 is formed so that the flow path between the surface of the work 10 and the exhaust space 74 is narrowed.

By providing the intake ports 95 and 96 in this way, the flow path between the surface of the work 10 and the exhaust spaces 73 and 74 can be narrowed. As a result, pressure loss occurs in the exhaust spaces 73 and 74. The pressure inside the exhaust space can be made uniform throughout the exhaust space. Therefore, the gas can be efficiently recovered from the surface of the work 10 into the exhaust spaces 73 and 74. In other words, since the suction force at the intake ports 95 and 96 can be increased, the flow velocity of the gas on the surface of the work 10 can be increased. Therefore, the dust can be reliably sucked.

At this time, the cross-sectional shape of the intake port 95 of the bottom plate member 91 may be a shape including an inclined surface 97 such that the angle formed with the upper surface of the bottom plate member 91 is an acute angle. Further, the cross-sectional shape of the bottom plate member 93 at the intake port 96 may be a shape including an inclined surface 98 such that the angle formed with the upper surface of the bottom plate member 93 is an acute angle. By providing the inclined surfaces 97 and 98 in this way, gas can easily flow from the opening 78 side toward the intake ports 95 and 96.

FIG. 16 is a cross-sectional view showing another configuration example of the laser peeling device according to the present embodiment. In the present embodiment, as in the laser peeling device 4 shown in FIG. 16, inclined surfaces 103 and 104 may be formed on the bottom plate members 101 and 102 provided at the bottom of the dust collecting unit 100, respectively. That is, the cross-sectional shape of the bottom plate member 103 at the intake port 95 may be a shape including an inclined surface 103 such that the angle formed with the upper surface of the bottom plate member 101 is an acute angle. Further, the cross-sectional shape of the bottom plate member 102 at the intake port 96 may be a shape including an inclined surface 104 such that the angle formed with the upper surface of the bottom plate member 102 is an acute angle. By providing the inclined surfaces 103 and 104 in this way, gas can easily flow from the outside of the dust collecting unit 100 toward the intake ports 95 and 96.

Also in the present embodiment described above, it is possible to provide a laser peeling device capable of uniformly separating the peeling layer from the substrate, a laser peeling method, and a method for manufacturing an organic EL display.

<Embodiment 4>
Next, the fourth embodiment will be described. FIG. 17 is a cross-sectional view for explaining the laser peeling device 5 according to the fourth embodiment. The laser peeling device 5 according to the present embodiment is different from the laser peeling device 3 (see FIG. 14) described in the third embodiment in that the dust collecting unit 110 does not have the air supply spaces 71 and 72. Other than this, since it is the same as the laser peeling device 3 described in the third embodiment, the same components are designated by the same reference numerals, and duplicated description will be omitted.

As shown in FIGS. 17 and 18, the dust collecting unit 110 included in the laser peeling device 5 according to the present embodiment includes an optical path space 70 and exhaust spaces 73 and 74. Since the optical path space 70 and the exhaust spaces 73 and 74 are the same as those described in the second and third embodiments, the description thereof will be omitted.

In the present embodiment, the pipes 113 and 114 are connected to the air supply holes 75 and 76 provided in the side walls 61 and 62 of the dust collecting unit 110, respectively, and the optical path from the pipes 113 and 114 via the air supply holes 75 and 76. A positive pressure gas is supplied to the space 70. That is, in the present embodiment, the lengths of the plate-shaped members 111 and 112 in the z-axis direction are shortened as compared with the laser peeling device 4 described in the third embodiment, and the upper plate 65 (see FIG. 14) is used. The air supply spaces 71 and 72 are omitted as a configuration that is not provided. Further, since the upper plate 65 is not provided in the present embodiment, the lid 68 is provided above the side walls 61 and 62.

As described above, in the laser peeling device 5 according to the present embodiment, the pipes 113 and 114 are connected to the air supply holes 75 and 76, and positive pressure gas is supplied from the pipes 113 and 114 to the optical path space 70. Therefore, since the air supply spaces 71 and 72 (see FIG. 14) can be omitted, the device configuration can be simplified.

The configuration of the laser peeling device 5 according to the present embodiment, that is, the configuration omitting the air supply spaces 71 and 72, can also be applied to the laser peeling device 2 described in the second embodiment. In other words, in the laser peeling device 5 according to the present embodiment shown in FIG. 17, the bottom plate members 91 to 94 may be omitted. Further, the configuration of the laser peeling device 5 according to the present embodiment may be applied to the laser peeling device 4 according to another configuration example of the third embodiment shown in FIG.

<Embodiment 5> (equipped with a side flow chamber)
Next, the fifth embodiment will be described. First, the configuration of the laser peeling device according to the fifth embodiment will be described. 19 to 21 are perspective views for explaining the laser peeling apparatus according to the fifth embodiment. FIG. 22 is a side view for explaining the laser peeling device according to the fifth embodiment. In FIGS. 19 to 22, in order to explain the internal structure, the constituent members are appropriately omitted.

As shown in FIGS. 19 to 22, the laser peeling device 500 according to the present embodiment is different from the laser peeling device described in the first to fourth embodiments in that it includes a chamber 510. Inside the chamber 510, any one of the dust collecting units 23, 60, 90, 100 and 110 described in the first to fourth embodiments is arranged. Further, the work 10 arranged on the stage 21 is also arranged inside the chamber 510.

In the present embodiment, among the dust collecting units of the first to fourth embodiments, the dust collecting unit 60 will be described as being arranged inside the chamber 510. In addition, another dust collecting unit may be used instead of the dust collecting unit 60. In order to explain the laser peeling device 500, an XYZ Cartesian coordinate system applied to the dust collecting unit 60 is introduced. Therefore, the transport direction of the work 10 is the X-axis direction.

<Chamber configuration>
The chamber 510 has, for example, a rectangular parallelepiped outer shape and has a space inside surrounded by the chamber wall. The chamber 510 is supported by a support base 530 from below. The support base 530 has a base 531 and a plurality of columns 532. The base 531 is a flat plate-like member installed flat on the floor surface and supports the weight of the chamber 510. The chamber 510 is supported by a plurality of columns 532 provided so as to extend upward from the base 531.

The chamber 510 is configured, for example, in a rectangular parallelepiped shape by the bottom wall 511 and the top wall 512, the front wall 513 and the rear wall 514, and the side walls 515 and 516. The bottom wall 511 and the top wall 512 face each other in the Z-axis direction, that is, in the vertical direction. The front wall 513 and the rear wall 514 face each other in the X-axis direction, that is, in the transport direction of the work 10. The side walls 515 and 516 face each other in the Y-axis direction. The shape of the chamber 510 is not limited to the rectangular parallelepiped shape.

When viewed from above, the bottom wall 511 has, for example, a rectangular flat plate having a long side along the X-axis direction and a short side along the Y-axis direction. The bottom wall 511 is arranged on the −Z axis direction side of the top wall 512. The bottom wall 511 is supported by a plurality of columns 532 with the plate surface horizontal.

When viewed from the X-axis direction, the front wall 513 has, for example, a rectangular flat plate having a long side along the Y-axis direction and a short side along the Z-axis direction. The front wall 513 is arranged on the −X-axis direction side of the rear wall 514 and faces the rear wall 514. Therefore, if the front wall 513 is one wall, the rear wall 514 is the other wall facing one wall. Further, the front wall 513 is orthogonal to the transport direction. The front wall 513 is provided with an air supply fan 541 and a filter 542. Therefore, the front wall 513 constitutes an FFU (Fan Filter Unit) in which an air supply fan 541 and a filter 542 are incorporated.

The air supply fan 541 is arranged at the center of the front wall 513 in the Y-axis direction, for example. The air supply fan 541 supplies gas from the outside of the chamber 510 to the inside of the chamber 510. The gas is, for example, air. The gas supplied from the outside to the inside of the chamber 510 (also referred to as an air supply gas) is not limited to air, and may be an inert gas such as nitrogen. In the following description, the gas taken into the inside of the chamber 510 will be described as air. The air supply fan 541 blows the air taken into the inside of the chamber 510 in the + X axis direction. For example, the air supply fan 541 supplies air at a flow rate of 500 to 1500 L / min per fan.

One or more filters 542 are provided on the front wall 513, for example. For example, two filters 542 are provided on both sides of the air supply fan 541 in the Y-axis direction of the front wall 513 so as to sandwich the air supply fan 541. Therefore, the air supply fan 541 is arranged between the filters 542 arranged apart from each other in the Y-axis direction.

When viewed from the X-axis direction, the rear wall 514 has, for example, a rectangular flat plate having a long side along the Y-axis direction and a short side along the Z-axis direction. The rear wall 514 is provided with an exhaust port 543 for an exhaust duct and a filter 542.

The exhaust port 543 for the exhaust duct is arranged, for example, at the center of the rear wall 514 in the Y-axis direction. The exhaust port 543 for the exhaust duct exhausts air from the inside of the chamber 510 to the outside of the chamber 510. An exhaust duct 544 is connected to the exhaust port 543 for the exhaust duct from the outside of the chamber 510. The air taken into the inside of the chamber 510 by the air supply fan 541 is exhausted to the exhaust duct 544 through the exhaust port 543 for the exhaust duct. Therefore, the exhaust port 543 for the exhaust duct is arranged together with the air supply fan 541 to form an air flow along the + X axis direction inside the chamber 510. An exhaust fan 548 may be provided in the exhaust port 543 for the exhaust duct.

One or more filters 542 are provided on the rear wall 514, for example. For example, two filters 542 are provided on both sides of the exhaust duct exhaust port 543 in the Y-axis direction of the rear wall 514 so as to sandwich the exhaust duct exhaust port 543. Therefore, the exhaust port 543 for the exhaust duct is arranged between the filters 542 arranged apart from each other in the Y-axis direction. The number and location of the filters 542 may be appropriately changed, and for example, the number of filters 542 provided on the rear wall 514 may be changed depending on the shape of the rear wall 514 and the like.

The side walls 515 and 516 are rectangular flat plates having, for example, a long side along the X-axis direction and a short side along the Z-axis direction when viewed from the Y-axis direction. The side wall 515 is arranged on the −Y axis direction side of the side wall 516. A work entrance / exit 515a through which the work 10 can be taken in and out is formed on the side wall 515. The work entrance / exit 515a is sealed during laser irradiation.

When viewed from above, the upper surface wall 512 has, for example, a rectangular flat plate having a long side along the X-axis direction and a short side along the Y-axis direction. The upper wall 512 is provided with an opening 545. The opening 545 is connected to the optical path space 70 of the dust collecting unit 60. When the optical system 20 is arranged on the upper surface wall 512, the laser beam 16 is incident on the inside of the dust collecting unit 60 from the opening 545 (see FIG. 11). As a result, the laser beam 16 irradiates the work 10 through the optical path space 70.

<Members inside the chamber>
A stage 21 and a dust collecting unit 60 are arranged inside the chamber 510. The stage 21 is arranged on the scanning device 551 arranged on the bottom wall 511. The work 10 is placed on the stage 21. The work 10 arranged on the stage 21 can move in the X-axis direction, the Y-axis direction, and the Z-axis direction by being arranged on the scanning device 551.

FIG. 23 is a diagram illustrating the movement of the work 10 inside the chamber 510 in the laser peeling device 500 according to the fifth embodiment. As shown in FIG. 23, the work 10 arranged on the stage 21 moves, for example, from the vicinity of the work entrance / exit 515a along the X axis in the transport direction. At this time, the work 10 is irradiated with a laser. Irradiating a laser while moving the work 10 in the transport direction is also referred to as scanning. The work 10 may be scanned once, then shifted in the + Y-axis direction to return to the scan start position, and then scanned again.

As shown in FIGS. 20 to 22, the dust collecting unit 60 is arranged, for example, below the upper surface wall 512. The dust collecting unit 60 is arranged so that the optical path space 70 of the dust collecting unit 60 is arranged directly below the opening 545 of the upper surface wall 512. The dust collecting unit 60 is provided with an air supply port 85. For example, the air supply port 85 is provided on the −Y axis direction side of the dust collecting unit 60. An air supply pipe 521 is connected to the air supply port 85. The air supply pipe 521 extends from the air supply port 85 in the −Y axis direction, bends, and extends in the + X axis direction. The air supply pipe 521 extends in the + X-axis direction to the front of the rear wall 514 and bends downward in front of the rear wall 514. Then, the air supply pipe 521 penetrates to the outside of the chamber 510 at the lower part of the rear wall 514. The air supply pipe 521 is connected to an air supply / exhaust fan 520 for a dust collecting unit arranged below the chamber 510 outside the chamber 510.

The dust collecting unit 60 is provided with exhaust ports 77a and 77b. For example, two exhaust ports 77a and 77b are provided on the + X axis direction side of the dust collecting unit 60. Exhaust pipes 522a and 522b are connected to the exhaust ports 77a and 77b. The exhaust pipes 522a and 522b extend from the exhaust ports 77a and 77b in the + X-axis direction, coalesce in front of the rear wall 514, and penetrate from the rear wall 514 to the outside of the chamber 510. The exhaust pipe 77 is connected to the air supply / exhaust fan 520 for the dust collection unit outside the chamber 510.

The air supply / exhaust fan 520 for the dust collection unit is arranged below the chamber 510. An air supply pipe 521 is connected to the air supply / exhaust fan 520 for the dust collection unit. The air supply / exhaust fan 520 for the dust collection unit supplies gas from the air supply spaces 71 and 72 of the dust collection unit 60 to the optical path space 70 via the air supply pipe 521. Further, an exhaust pipe 522 is connected to the air supply / exhaust fan 520 for the dust collection unit. The air supply / exhaust fan 520 for the dust collection unit exhausts the exhaust spaces 73 and 74 of the dust collection unit 60 via the exhaust pipe 522. As a result, the gas sucked by the dust collecting unit 60 is exhausted to the outside of the chamber 510. For example, the air supply / exhaust fan 520 for the dust collecting unit supplies and exhausts air having a flow rate of 500 L / min to 1500 L / min.

<Air flow inside the chamber>
Next, the air flow inside the chamber 510 will be described.
FIG. 24 shows the relationship between the presence / absence of the filter 542 on the front wall 513 and the rear wall and the arrival of air on the front wall 513 side and the stage 21 inside the chamber 510 in the laser peeling device 500 according to the fifth embodiment. It is a figure exemplifying.

FIG. 25 shows the chamber 510 in the case where the air supply fan 541 is installed on the front wall 513 of the chamber 510 and the exhaust port 543 for the exhaust duct is installed on the rear wall 514 in the laser peeling device 500 according to the fifth embodiment. It is a figure exemplifying the flow of the air inside, (a) shows the perspective view, (b) shows the top view.

The column A in FIG. 24 shows the case of the chamber 510 shown in FIG. 25. As shown in FIGS. 24 and 25 (a) and 25 (b), when the air supply fan 541 is installed on the front wall 513 of the chamber 510 and the exhaust port 543 for the exhaust duct is installed on the rear wall 514, The air taken into the chamber 510 from the air supply fan 541 flows in the + X-axis direction, and when approaching the rear wall 514, spreads in the Y-axis direction and the Z-axis direction.

On the other hand, there is a portion where air does not reach the front wall 513 side inside the chamber 510. For example, air does not reach the ends 546 on the + Y-axis direction side and the −Y-axis direction side on the front wall 513 side. In particular, so to speak, fresh air has not arrived immediately after being taken into the chamber 510. As described above, if there is a portion inside the chamber 510 where air does not reach, particles and the like are accumulated and become a snowdrift, and the inside of the chamber 510 cannot be kept clean. The arrival time of fresh air to stage 21 is 10 seconds.

FIG. 26 shows a case where the air supply fan 541 is installed on the front wall 513 of the chamber 510 and the exhaust port 543 for the exhaust duct and the filter 542 are installed on the rear wall 514 in the laser peeling device 500 according to the fifth embodiment. It is a figure exemplifying the flow of the air inside a chamber 510, (a) shows the perspective view, (b) shows the top view.

The column B in FIG. 24 shows the case of the chamber 510 shown in FIG. 25. As shown in FIGS. 24 and 26 (a) and 26 (b), when the air supply fan 541 is installed on the front wall 513 of the chamber 510 and the exhaust port 543 and the filter 542 for the exhaust duct are installed on the rear wall 514. The air taken into the chamber 510 from the air supply fan 541 flows in the + X-axis direction, and when approaching the rear wall 514, spreads in the Y-axis direction and the Z-axis direction.

Air also reaches the front wall 513 side inside the chamber 510. For example, air reaches the end portions 546 on the + Y-axis direction side and the −Y-axis direction side on the front wall 513 side, though not as much as the rear wall 514. Therefore, the inside of the chamber 510 can be kept clean. The arrival time of fresh air to stage 21 is 50 seconds.

FIG. 27 shows that in the laser peeling device 500 according to the fifth embodiment, the air supply fan 541 and the filter 542 are installed on the front wall 513 of the chamber 510, and the exhaust port 543 and the filter 542 for the exhaust duct are installed on the rear wall 514. It is a figure exemplifying the flow of the air inside the chamber 510 in the case where (a) shows the perspective view, and (b) shows the top view.

The column C in FIG. 24 shows the case of the chamber 510 shown in FIG. 27. As shown in FIGS. 24 and 27 (a) and 27 (b), an air supply fan 541 and a filter 542 are installed on the front wall 513 of the chamber 510, and an exhaust duct exhaust port 543 and a filter 542 are installed on the rear wall 514. When installed, the air taken into the chamber 510 from the air supply fan 541 flows in the + X-axis direction, and when approaching the rear wall 514, spreads in the Y-axis direction and the Z-axis direction.

Air also reaches the front wall 513 side inside the chamber 510. For example, more air reaches the + Y-axis direction side and the −Y-axis direction end portion 546 on the front wall 513 side than in the case of FIG. 26. Therefore, the inside of the chamber 510 can be kept sufficiently clean. The arrival time of fresh air to stage 21 is 36 seconds. Therefore, fresher air has reached the stage 21 than in the case of FIG. 26.

As described above, in the present embodiment, by forming a laminar flow in the space inside the chamber 510, it is possible to suppress the dust generated from the inside of the chamber 510 from reaching the irradiation region of the laser beam 16. Further, by providing the filter 542 on the rear wall 514, it is possible to prevent the formation of a snowdrift on the front wall 513 side inside the chamber 510. Further, by providing the filter 542 on the front wall 513 as well, it is possible to prevent the formation of a snowdrift on the front wall 513 side inside the chamber 510, and to shorten the time for the fresh air to reach the stage 21. Can be done. Therefore, the dust existing on the surface of the work 10 can be blown off, and the release layer can be uniformly separated from the substrate.

The filter 542 allows air to pass through. The filter 542 may allow air to pass from the outside of the chamber 510 to the inside, or may allow air to pass from the inside of the chamber 510 to the outside. For example, when the pressure in the vicinity of the filter 542 inside the chamber 510 is reduced, the filter 542 allows air to pass from the outside to the inside of the chamber 510. Conversely, as the pressure of air in the vicinity of the filter 542 inside the chamber 510 increases, the filter 542 allows air to pass from the inside of the chamber 510 to the outside. In this way, the filter 542 balances the pressure inside the chamber 510 with the pressure outside the chamber 510. If the outside of the chamber 510 is atmospheric pressure, the filter 542 balances the pressure inside the chamber 510 with the atmospheric pressure outside the chamber 510.

FIG. 28 is a cross-sectional view illustrating the chamber 510 when the pressure inside the chamber 510 becomes higher than the pressure outside. As shown in FIG. 28, when the pressure inside the chamber 510 is greater than the pressure outside the chamber 510, the chamber wall of the chamber 510 expands outward. Then, for example, the central portion of the bottom wall 511 on which the bottom surface of the scanning device 551 is arranged is recessed downward. As a result, when the laser beam 16 is applied to the work 10 via the dust collecting unit 60, the focus of the laser beam 16 is defocused 547. Therefore, the laser beam 16 cannot be focused on the work 10. On the contrary, even when the inside of the chamber 510 is depressurized, the focal point of the laser beam 16 is defocused 547 due to the deformation of the chamber wall.

On the other hand, in the present embodiment, the chamber 510 is provided with a filter 542. The filter 542 allows the air inside the chamber 510 to pass to the outside when the pressure inside the chamber 510 becomes high. When the pressure inside the chamber 510 becomes low, the air outside the chamber 510 is allowed to pass inside. In this way, the filter 542 can be balanced with the pressure outside the chamber 510.

In the laser peeling device 500 as in the present embodiment, the amount of air supplied to the chamber 510 is 500 to 1500 L / min. The flow rate in the excimer laser annealing device (ELA), which is mentioned as a similar device, is large as compared with the flow rate of 50 cc / min to 5 L / min. In the present embodiment, since the filter 542 is provided, it is possible to prevent the internal pressure from increasing even if a large flow rate of air is supplied, and the performance of the laser peeling device 500 can be maintained.

<Displacement of dust collection unit>
Next, the amount of air supplied to the dust collecting unit 60 and the amount of exhausted air from the dust collecting unit 60 will be described. FIG. 29 is a graph illustrating the ratio of the exhaust amount to the supply air amount and the particle concentration in the exhaust pipe 522 in the laser peeling device 500 according to the fifth embodiment. The particle density is a particle density (hereinafter referred to as small particle) having a particle size of 0.3 to 1.0 μm (indicated by a circle in the graph) and a particle size of 1.0 to 10 μm (square mark in the graph). The concentration of particles (hereinafter referred to as medium particles) and the concentration of particles having a particle size of 10 μm or more (indicated by a triangular mark in the graph) (hereinafter referred to as large particles) are shown.

The particle density is measured by a particle counter for each particle in the exhaust pipes 522a and 522b at regular intervals during laser irradiation. The higher the particle density, the more particles are taken into the exhaust pipes 522a and 522b, and therefore the smaller the particle density remaining on the work 10.

As shown in FIG. 29, when the ratio of the exhaust amount to the air supply amount of the dust collecting unit 60 is 1.4, the small particles in the exhaust pipes 722a and 722b. The concentration of is about 100,000 particles / ft ³ , the concentration of medium particles is about 7,000 particles / ft ³ , and the concentration of large particles is about 30 to 100 particles / ft ³ . .. When the displacement / supply air ratio is 1.8, the concentration of small particles in the exhaust pipes 722a and 722b is about 100,000 / ft ³ , and the concentration of medium particles is 7,000. It shows about 100 pieces / ft ³ and the concentration of large particles shows about 100 pieces / ft ³ . As described above, when the ratio of the exhaust amount / the supply air amount is 1.4 to 1.8, the particle concentration in the exhaust pipes 722a and 722b hardly changes.

On the other hand, when the ratio of the exhaust amount / the supply air amount of the dust collecting unit 60 is 3.0, the concentration of the small particles in the exhaust pipes 722a and 722b is about 300,000 / ft ³ , and the medium particles. The concentration of large particles is about 20,000 / ft ³ , and the concentration of large particles is about 100 / ft ³ . As described above, when the ratio of the exhaust amount / the supply air amount is 3.0, the particle concentration in the exhaust pipes 722a and 722b is increased. This indicates that the pressure in the exhaust spaces 73 and 74 can be further reduced by increasing the ratio of the exhaust amount / supply air amount to 3 times or more, and the amount of dust flowing in together with the gas is increased. ing.

In this way, by setting the ratio of the amount of gas discharged from the discharge space to the amount of gas supplied to the optical path space to 3 or more, dust is generated outside the dust collection unit 60. This can be suppressed, and the release layer can be uniformly separated from the substrate. Although not shown in the figure, when the ratio of displacement / supply air is larger than 3, the number of particles is about the same as 3 or larger than 3.

<Relationship between the air supply / exhaust volume of the dust collection unit, the air flow in the chamber, and the particles>
In the present embodiment, the air flow inside the chamber 510 and the air supply and exhaust paths in the dust collecting unit 60 are separate paths. In the present embodiment, the air flow inside the chamber 510 is controlled by the air supply fan 541 and the filter 542 (FFU), and the air supply amount and the exhaust amount in the dust collection unit 60 are controlled by the dust collection unit supply / exhaust fan 520. I'm in control.

FIG. 30 is a graph illustrating the relationship between the operation of the FFU and the ratio of the exhaust amount / the air supply amount in the dust collecting unit 60 and the particle concentration according to the fifth embodiment. The particle density is a value obtained by measuring the particle density in the vicinity of the duct collector with a particle counter.

As shown in FIG. 30, when the FFU in the chamber 510 is operated and the ratio of the exhaust amount / the air supply amount in the dust collecting unit 60 is 3: 1 (hereinafter referred to as ON / ON state), large particles are used. The concentration of is below the measurement limit, the concentration of medium particles is about 40 particles / ft ³ , and the concentration of small particles is about 100 particles / ft ³ . When the FFU in the chamber 510 is operated and the dust collecting unit 60 is neither supplied nor exhausted (hereinafter referred to as ON / OFF state), the concentration of large particles is below the measurement limit, and the concentration of medium particles is. , 70 particles / ft ³ is shown, and the concentration of small particles is about 300 particles / ft ³ . When the FFU in the chamber 510 is stopped and the ratio of the exhaust amount / the air supply amount in the dust collecting unit 60 is 3: 1 (hereinafter referred to as OFF / ON state), the concentration of large particles is below the measurement limit. The density of the medium particles is about 400 particles / ft ³ , and the concentration of the small particles is about 2000 particles / ft ³ .

In this way, the particles can be suppressed by turning them on and off. On the other hand, in the OFF / ON state, the particle density becomes remarkably high. Even in the ON / OFF state, the particle density can be suppressed as compared with the OFF / ON state, but the particle density is higher than in the ON / ON state.

<Control of chamber and dust collection unit>
Next, the operation of the FFU of the chamber 510 and the control of the air supply and the exhaust of the dust collecting unit 60 will be described. FIG. 31 is a block diagram illustrating the operation of the FFU according to the fifth embodiment and the control method of air supply and exhaust of the dust collecting unit 60.

As shown in FIG. 31, the laser peeling device 500 of the present embodiment includes a controller 552 that controls the operation of the FFU and the supply and exhaust of the dust collecting unit 60. The controller 552 is connected to the air supply fan 541, the exhaust fan 548, the work inlet / outlet 515b, the optical system 20, and the air supply / exhaust fan 520 for the dust collection unit by an information transmission means such as a signal line or wireless. It is assumed that the exhaust fan 548 is provided in the exhaust port 543 for the exhaust duct.

The controller 552 controls the operation and stop of the air supply fan 541 and the air supply amount of the air 517. The controller 552 controls the operation and stop of the exhaust fan 548 and the displacement of the air 517. The controller 552 controls the operation and stop of the air supply / exhaust fan 520 for the dust collection unit and the supply / exhaust amount of the air 517.

Further, the controller 552 acquires information about putting in and taking out the work 10 from the work entrance / exit 515b. The controller 552 acquires laser irradiation information from the optical system 20.

FIG. 32 is a diagram illustrating the control of the controller 552 of the laser peeling device 500 according to the fifth embodiment. As shown in FIGS. 31 and 32, when the controller 552 acquires information about the loading and unloading of the work 10 from the work inlet / outlet 515b, the controller 552 stops the dust collecting unit air supply / exhaust fan 520 and supplies air to the chamber 510. Stop the fan 541. Further, the controller 552 reduces the rotation speed of the exhaust fan 548 of the chamber 510, and lowers the displacement of the exhaust fan 548.

When the controller 552 acquires the irradiation information of the laser beam 16 from the optical system 20, the controller 552 operates the air supply / exhaust fan 520 for the dust collecting unit, and operates the air supply fan 541 and the exhaust fan 548 of the chamber 510. Let me.

Further, the controller 552 lowers the rotation speed of the air supply / exhaust fan 520 for the dust collection unit when the work is taken in / out and the laser beam 16 is irradiated, for example, when idling, and the air supply fan 541 and the exhaust fan 548 of the chamber 510 are used. The rotation speed of the air 517 is lowered, and the supply air amount and the exhaust amount of the air 517 are lowered.

As described above, the controller 552 transfers the supply amount of the supply air gas by the supply air fan 541 and the supply amount and the discharge amount of the air supply / exhaust fan 520 for the dust collection unit to the chamber 510 of the work 10 and the laser beam. Control based on 16 irradiations.

Next, the operation of the laser peeling device 500 according to the fifth embodiment will be described.
As shown in FIG. 22, the work 10 is arranged on the stage 21 arranged inside the chamber 510. For example, the work 10 is inserted into the chamber 510 from the work entrance / exit 515a provided on the side wall 515 and arranged on the stage 21.

Next, the air supply fan 541 provided on the front wall 513 of the chamber 510 is operated. As a result, an air flow in the + X axis direction is formed in the chamber 510. In addition, the air supply / exhaust fan 520 for the dust collection unit is operated. The air supply fan 541 and the air supply / exhaust fan 520 for the dust collection unit are controlled by the controller 552.

Next, the work 10 on the stage 21 is scanned, and the work 10 is irradiated with a laser beam. In this way, the laser peeling device 500 peels the peeling layer from the substrate of the work 10.

Next, the effect of this embodiment will be described.
According to the present embodiment, by forming a laminar flow in the space inside the chamber 510, it is possible to suppress the dust generated from the inside of the chamber 510 from reaching the irradiation region of the laser beam 16. In particular, dust generated from the traveling rail of the stage 21 arranged inside the chamber 510, the bearings incorporated in the rail, the cable, the cable bear (registered trademark) supporting the cable, the wiring pipe, etc. is removed from the vicinity of the work 10. can do.

Further, by providing the filter 542 in the chamber 510, it is possible to prevent the formation of a snowdrift on the front wall 513 side inside the chamber 510. In addition, the time for the fresh air to reach the stage 21 can be shortened. Therefore, the dust existing on the surface of the work 10 can be blown off, and the release layer can be uniformly separated from the substrate. Further, by providing the filter 542, it is possible to balance the pressure with the outside of the chamber 510 and suppress the defocus of the laser beam 16 due to the deformation of the chamber 510.

By making the amount of exhaust air to the dust collection unit 60 larger than the amount of air supply and making the exhaust spaces 73 and 74 negative pressure, even if dust floats inside the dust collection unit 60, the dust collection unit 60 It is possible to suppress the generation of dust to the outside. Further, this effect can be made remarkable by setting the ratio of the exhaust amount to the supply air amount to 3 or more.

By arranging the work 10 inside the chamber 510, the work 10 is not exposed to the outside air, so that the surface of the work 10 can be kept clean. Since other effects are the same as those of the first to fourth embodiments, the description thereof will be omitted.

<Embodiment 6> (equipped with a downflow chamber)
Next, the sixth embodiment will be described. First, the laser peeling device according to the sixth embodiment will be described. FIG. 33 is a perspective view for explaining the laser peeling device according to the sixth embodiment.

As shown in FIG. 33, the laser peeling device 600 according to the sixth embodiment has an air supply fan 641 and an exhaust fan 648 in the chamber 610 as compared with the chamber 510 of the laser peeling device 500 described in the fifth embodiment. The position where the filter 642 is provided is different. Also in this embodiment, it is assumed that the dust collecting unit 60 is provided inside the chamber 610, and the XYZ Cartesian coordinate system applied to the dust collecting unit 60 is introduced. Therefore, the transport direction of the work 10 is the X-axis direction.

<Chamber configuration>
The chamber 610 has, for example, a rectangular parallelepiped outer shape and has a space inside surrounded by a chamber wall. The chamber 610 has, for example, lengths of about 5.5 m, about 4.5 m, and about 2 m in the X-axis direction, the Y-axis direction, and the Z-axis direction. The chamber 510 of the fifth embodiment is, for example, smaller than the chamber 610. The chamber 610 is supported from below by a plurality of stanchions 632.

In addition to the bottom wall 611 and the top wall 612, the chamber 610 includes the front wall 613 and the rear wall 614, and the side walls 615 and 616 (see FIG. 35 for the front wall 613 and the rear wall 614, and the side walls 615 and 616). For example, it is configured in a rectangular parallelepiped shape. In the figure, the front wall 613 and the rear wall 614, and the side walls 615 and 616 are omitted. The bottom wall 611 and the top wall 612 face each other in the Z-axis direction, that is, in the vertical direction. The front wall 613 and the rear wall 614 face each other in the X-axis direction, that is, in the transport direction of the work 10, and the side walls 615 and 616 face each other in the Y-axis direction. The shape of the chamber 510 is not limited to the rectangular parallelepiped shape.

When viewed from above, the upper surface wall 512 has, for example, a rectangular flat plate having a long side along the X-axis direction and a short side along the Y-axis direction. The upper surface wall 612 is arranged on the + Z axis direction side of the bottom surface wall 611 and faces the bottom surface wall 611. Therefore, if the top wall 612 is one wall, the bottom wall 611 is the other wall facing one wall. The upper surface wall 512 and the bottom surface wall 511 are parallel to each other in the X-axis direction and the Y-axis direction.

The upper wall 612 is provided with a plurality of air supply fans 641 and a plurality of filters 642. Therefore, the upper surface wall 612 constitutes an FFU in which the air supply fan 641 and the filter 642 are incorporated.

Here, the positions where the plurality of air supply fans 641 and the plurality of filters 642 are arranged on the upper surface wall 612 will be described. FIG. 34 is a diagram illustrating the movement of the work 10 inside the chamber 610 in the laser peeling device 600 according to the sixth embodiment, (a) is a diagram projected onto the upper surface wall 612, and (b) is a diagram. Is a diagram projected onto the bottom wall 611.

As shown in FIG. 34 (a), when the upper surface wall 612 is viewed from above, the movable region 649 in which the work 10 can move due to the transport of the work 10 overlaps the central portion of the upper surface wall 612. .. However, the edge portion of the upper surface wall 612 does not overlap the movable region 649. For example, the edge portions 612a and 612b at both ends in the X-axis direction of the upper surface wall 612 and the edge portions 612c and 612d at both ends in the Y-axis direction do not overlap the movable region 649. Therefore, the air supply fan 641 is arranged at the edge portions 612c and 612d on both ends of the upper surface wall 612 in the Y-axis direction. For example, two air supply fans 641 are arranged on the edge portion 612c so as to be arranged along the X-axis direction, and two air supply fans 641 are arranged on the edge portion 612d so as to be arranged along the X-axis direction.

The air supply fan 641 supplies gas from the outside of the chamber 610 to the inside of the chamber 610. Similar to the fifth embodiment, in the following description, the gas taken into the inside of the chamber 610 will be described as air. The air supply fan 641 blows the air taken into the inside of the chamber 610 in the −Z axis direction.

A plurality of filters 642 are provided, for example, on the upper surface wall 612. For example, the filter 642 is provided at the corner of the upper surface wall 612 so as to sandwich the plurality of air supply fans 641 at the edge portion 612c. Further, the filter 642 is provided at the corner of the upper surface wall 612 so as to sandwich the plurality of air supply fans 641 at the edge portion 612d. Therefore, in the edge portions 612c and 612d, the air supply fan 641 is arranged between the filters 642 arranged apart from each other in the X-axis direction.

As shown in FIG. 33, the upper surface wall 612 is provided with an opening 645. The opening 645 is connected to the optical path space 70 of the dust collecting unit 60. The opening 645 extends in the Y-axis direction. When the optical system 20 is arranged on the upper surface wall 612, the laser beam 16 is incident on the inside of the dust collecting unit 60 from the opening 645 (see FIG. 11). As a result, the laser beam 16 irradiates the work 10 through the optical path space 70.

As shown in FIG. 33, the bottom wall 611 has a rectangular flat plate shape in which the long side is along the X-axis direction and the short side is along the Y-axis direction when viewed from above. The bottom wall 611 is arranged on the −Z axis direction side of the top wall 612 and faces the top wall 612. A plurality of exhaust fans 648 are provided on the bottom wall 611.

As shown in FIGS. 33 and 34 (b), the movable region 649 overlaps the central portion of the bottom wall 611 when the bottom wall 611 is viewed from above. However, the edge portion of the bottom wall 611 does not overlap the movable region 649. For example, the edge portions 611a and 611b at both ends in the X-axis direction of the bottom wall 611, and the edge portions 611c and 611d at both ends in the Y-axis direction do not overlap the movable region 649. Therefore, a plurality of exhaust fans 648 are arranged on the edge portions 611a and 611b on both ends of the bottom wall 611 in the X-axis direction. For example, four exhaust fans 648 are arranged on the edge portion 611a so as to be arranged along the Y-axis direction, and four exhaust fans 648 are arranged on the edge portion 611b so as to be arranged along the Y-axis direction. The exhaust fan 648 exhausts air from the inside of the chamber 610 to the outside of the chamber 610 in the −Z axis direction.

<Air flow inside the chamber>
Next, the air flow inside the chamber 610 will be described.
FIG. 35 is a diagram illustrating the flow of air inside the chamber 610 in the laser peeling device 600 according to the sixth embodiment. As shown in FIG. 35, a downflow from the top wall 612 to the bottom wall 611 is formed inside the chamber 610. In particular, downflows are formed at both ends in the Y-axis direction inside the chamber 610. Particles such as dust are basically deposited on the bottom wall 611. Therefore, by making the down flow, it is possible to prevent the particles deposited on the bottom wall 611 from rolling up on the stage 21.

By providing the air supply fan 641 on the entire surface of the upper surface wall 612 of the chamber 610 and the exhaust fan 648 on the entire surface of the bottom wall 611, it may be possible to make the inside of the chamber 610 a complete downflow. However, since members such as the stage 21 and the scanning device are arranged inside the chamber 610, it is not possible to completely downflow the inside of the chamber 610. Therefore, in the present embodiment, the air supply fan 641, the filter 642, and the exhaust fan 648 are arranged at positions where the influence of dust can be suppressed even if a member that hinders the downflow is arranged inside the chamber 610. .. By arranging as shown in FIG. 35, a downflow can be formed inside the chamber 610, and it is possible to suppress the dust from reaching the irradiation region of the laser beam 16.

36 (a) and 36 (b) are views exemplifying the air flow of the chamber 610 in the laser peeling device 600 according to the sixth embodiment, and FIG. 36 (a) shows the supply air amount larger than the exhaust amount. (B) shows the case where the supply air amount is smaller than the exhaust amount.

As shown in FIGS. 36 (a) and 36 (b), by making the inside of the chamber 610 a downflow, air can reach the entire inside of the chamber 610. In particular, as shown in FIG. 36 (a), the supply air amount is made larger than the exhaust amount and the inside of the chamber 610 is made a positive pressure so that the supply air amount is made smaller than the exhaust amount and the chamber 610 is used. Air can be distributed inside the chamber 610 rather than having a negative pressure inside.

According to the present embodiment, by forming a downflow in the space inside the chamber 610, it is possible to suppress the dust generated from the inside of the chamber 610 from reaching the irradiation region of the laser beam 16.

Further, due to the downflow, air reaches every corner through the inside of the chamber 610. Therefore, it is possible to suppress the generation of snowdrifts inside the chamber 610. Since other operations and effects are the same as those of the first to fifth embodiments, the description thereof will be omitted.

Although the invention made by the present inventors has been specifically described above based on the embodiment, the present invention is not limited to the above embodiment and can be variously modified without departing from the gist thereof. Needless to say.

1, 2, 3, 4, 5 Laser peeling device 10 Work 11 Substrate 12 Peeling layer 16 Laser light 20 Optical system 21 Stage 22 Injection unit 23 Dust collecting unit 31 Main body 32 Nozzle 33 Air supply piping 41 Side wall 42 Top plate 44 , 45 Plate-shaped member 48 Cover 51 Upper opening 52 Opening 60 Dust collecting unit 61, 62 Side wall 63, 64 Plate-shaped member 65 Upper plate 66, 67 Partition plate 68 Lid 70 Optical path space 71, 72 Air supply space 73 , 74 Exhaust space 75, 76 Air supply holes 77, 77a, 77b Exhaust port 78 Opening 81, 82 Side wall 83, 84 Plate-shaped member 85 Air supply port 90 Dust collecting unit 91, 92, 93, 94 Bottom plate member 95 Intake port 100 Dust collection unit 101, 102 Bottom plate member 110 Dust collection unit 111, 112 Plate-shaped member 113, 114 Piping 500 Laser peeling device 510 Chamber 511 Bottom wall 512 Top wall 513 Front wall 514 Rear wall 515 Side wall 515a Work entrance 516 Side wall 517 Air 520 Air supply / exhaust fan 521 for dust collection unit 521 Air supply pipe 522, 522a, 522b Exhaust pipe 530 Support base 531 Base 532 Support 541 Air supply fan 542 Filter 543 Exhaust duct exhaust port 544 Exhaust duct 545 Opening 546 End 547 Focus 548 Exhaust fan 551 Scanning device 552 Controller 600 Laser peeling device 610 Chamber 611 Bottom wall 611c, 611d Edge part 612 Top wall 612a, 612b Edge part 613 Front wall 614 Rear wall 615 Side wall 616 Side wall 648 Exhaust fan 649 Movable region

Claims (9)

A laser peeling device that irradiates a work provided with a substrate and a peeling layer formed on the substrate with a laser beam to peel the peeling layer from the substrate.
It has a space inside surrounded by a chamber wall, and includes a stage and a chamber in which the work placed on the stage is placed inside.
The chamber is
An air supply fan that supplies air to the inside of the chamber from the outside of the chamber to the inside of the chamber.
An exhaust fan that exhausts the supply air gas from the inside to the outside,
Have,
Laser peeling device. The chamber wall
A flat plate-shaped first wall parallel to the surface of the work,
A flat plate-shaped second wall arranged below the first wall, facing the first wall and parallel to the surface of the work,
Equipped with
The air supply fan is provided on the first wall.
The laser peeling device according to claim 1. The exhaust fan is provided on the second wall.
The laser peeling device according to claim 2. When the pressure inside the chamber becomes higher than the pressure outside the chamber, the air supply gas inside the chamber is passed to the outside, and the pressure inside the chamber becomes lower than the pressure outside the chamber. Further provided with a filter that allows the air supply gas outside the chamber to pass inside.
The laser peeling device according to claim 3. The chamber wall
A flat plate-shaped third wall that is parallel to the surface of the work and is orthogonal to the first direction that is perpendicular to the transport direction of the work, and the first wall that faces the third wall. A flat plate-shaped fourth wall orthogonal to the direction of 1 and
A flat plate-shaped fifth wall orthogonal to the transport direction of the work, and a flat plate-shaped sixth wall facing the fifth wall and orthogonal to the transport direction.
Including
The filter is provided on at least one of the third wall, the fourth wall, the fifth wall and the sixth wall.
The laser peeling device according to claim 4. The chamber wall
A flat plate-shaped third wall that is parallel to the surface of the work and is orthogonal to the first direction that is perpendicular to the transport direction of the work, and the first wall that faces the third wall. A flat plate-shaped fourth wall orthogonal to the direction of 1 and
A flat plate-shaped fifth wall orthogonal to the transport direction of the work, and a flat plate-shaped sixth wall facing the fifth wall and orthogonal to the transport direction.
Including
The exhaust fan is provided on at least one of the third wall, the fourth wall, the fifth wall, and the sixth wall.
The laser peeling device according to claim 2. A dust collecting unit having an opening at a position corresponding to the irradiation position of the laser beam and having an optical path space through which the laser beam passes and an exhaust space arranged outside the optical path space is further provided.
The dust collecting unit is arranged inside the chamber.
The optical path space is configured by using a side wall arranged around the opening and a lid for transmitting the laser beam arranged so as to cover the upper part of the side wall.
An air supply hole for supplying gas to the optical path space is formed on the side wall.
The gas supplied from the air supply hole to the optical path space flows to the work side along the side wall, then passes between the lower end of the side wall and the work, and flows to the exhaust space.
The opening is arranged so as to extend in a first direction parallel to the surface of the work and perpendicular to the transport direction of the work.
The side wall includes a first plate-shaped member arranged on the upstream side in the transport direction of the work and a second plate-shaped member arranged on the downstream side in the transport direction of the work.
The exhaust space includes a first exhaust space arranged on the upstream side in the transport direction with respect to the optical path space, and a second exhaust space arranged on the downstream side in the transport direction with respect to the optical path space. Prepare,
The gas supplied to the optical path space from the air supply hole formed in the first plate-shaped member flows to the work side along the surface of the first plate-shaped member, and then the first plate-shaped member. Passing between the lower end of the member and the work, it flows into the first exhaust space,
The gas supplied to the optical path space from the air supply hole formed in the second plate-shaped member flows to the work side along the surface of the second plate-shaped member, and then the second plate-shaped member. Passing between the lower end of the member and the work, it flows into the second exhaust space,
At the lower part of the first exhaust space, a first intake port is formed so as to narrow the flow path between the surface of the work and the first exhaust space.
At the lower part of the second exhaust space, a second intake port is formed so as to narrow the flow path between the surface of the work and the second exhaust space.
A first bottom plate member extending in the first direction is provided on the downstream side of the first intake port in the transport direction, and the first one is provided on the upstream side of the first intake port in the transport direction. A second bottom plate member extending in the direction is provided,
The cross-sectional shape of the first bottom plate member at the first intake port is a shape including an inclined surface such that the angle formed with the upper surface of the first bottom plate member is an acute angle.
A third bottom plate member extending in the first direction is provided on the upstream side of the second intake port in the transport direction, and the first one is provided on the downstream side of the second intake port in the transport direction. A fourth bottom plate member extending in the direction is provided,
The cross-sectional shape of the third bottom plate member at the second intake port is a shape including an inclined surface such that the angle formed with the upper surface of the third bottom plate member is an acute angle.
The laser peeling apparatus according to any one of claims 1 to 6. A laser peeling method in which a work provided with a substrate and a peeling layer formed on the substrate is irradiated with laser light to peel the peeling layer from the substrate.
It is a laser exfoliation method using a chamber in which a stage and the work arranged on the stage have a space inside surrounded by a chamber wall and the work is arranged inside the stage.
The chamber is
An air supply fan that supplies air to the inside of the chamber from the outside of the chamber to the inside of the chamber.
An exhaust fan that exhausts the supply air gas from the inside to the outside,
Have,
Laser peeling method. (A) The process of forming a release layer on the substrate and
(B) A step of forming a driving element and an organic EL element on the peeling layer, and
(C) A step of separating the substrate and the release layer,
(D) A method for manufacturing an organic EL display, comprising a step of laminating a film on the release layer.
(C) The step of separating the substrate and the peeling layer is a step of irradiating a work including the substrate and the peeling layer with a laser beam to peel the peeling layer from the substrate.
A method for manufacturing an organic EL display, which has a space inside surrounded by a chamber wall, and uses a stage and a chamber in which the work placed on the stage is arranged inside.
The chamber is
An air supply fan that supplies air to the inside of the chamber from the outside of the chamber to the inside of the chamber.
An exhaust fan that exhausts the supply air gas from the inside to the outside,
Have,
A method for manufacturing an organic EL display.

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