JP2022015758A - Wiring board - Google Patents

Abstract

To provide a wiring board having high reliability.SOLUTION: A wiring board 10 includes resin insulation layers 101, a plurality of conductor pads 102p formed on the resin insulation layers 101, a coating insulation layer 103 coating the resin insulation layers 101 and the conductor pads 102p, and a plurality of metal posts 104 which are connected onto each of the plurality of conductor pads 102p and project from the coating insulation layer 103. The plurality of metal posts 104 include first metal posts 104f and second metal posts 104s having diameters larger than those of the first metal posts 104f, heights to the surface of the coating insulation layer 103 of the first metal posts 104f and the second metal posts 104s are substantially equal to each other, and a thickness of the conductor pad 102pf connected with the first metal posts 104f is thicker than a thickness of the conductor pad 102ps connected with the second metal post 104s.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wiring board.

Patent Document 1 discloses a wiring board formed on a wiring layer and having a plurality of metal posts protruding from a solder resist layer. The wiring layer to which each of the plurality of metal posts is connected is formed to have the same thickness.

Japanese Unexamined Patent Publication No. 2016-18806

In the wiring substrate of Patent Document 1, when a metal post having a smaller diameter is formed on the wiring layer, it is considered that the ratio of the height to the diameter of the metal post increases and the rigidity of the metal post decreases. .. It is considered that the physical resistance to the external force applied to the metal post is low, and there is a possibility that defects such as peeling of the connection portion may occur.

The wiring board of the present invention includes a resin insulating layer, a plurality of conductor pads formed on the resin insulating layer, a coated insulating layer covering the resin insulating layer and the conductor pad, and the plurality of conductor pads, respectively. It comprises a plurality of metal posts, which are connected on top of and project from the coated insulating layer. The plurality of metal posts include a first metal post and a second metal post having a diameter larger than that of the first metal post, and the first metal post and the covering insulating layer of the second metal post. The height with respect to the surface of the metal post is substantially equal, and the thickness of the conductor pad to which the first metal post is connected is larger than the thickness of the conductor pad to which the second metal post is connected.

According to an embodiment of the present invention, even a metal post having a relatively small diameter can provide a structure having high physical resistance to an external force. It is possible to provide a highly reliable wiring board capable of suppressing the occurrence of defects such as peeling at the connection portion between the metal post and the conductor pad.

FIG. 6 is a cross-sectional view partially showing an example of a wiring board according to an embodiment of the present invention. A partially enlarged view of a cross-sectional view of the wiring board of FIG. FIG. 2 is a cross-sectional view showing a different example of the wiring board shown in FIG. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention. The cross-sectional view which shows the manufacturing method of the wiring board of one Embodiment of this invention.

Next, a wiring board according to an embodiment of the present invention will be described with reference to the drawings. In the drawings referred to below, it is not intended to show the exact ratio of the dimensions of each component, and the features of the present invention are emphasized for easy understanding. FIG. 1 partially shows a cross section of a wiring board 10 which is an example of the wiring board of the present embodiment. The wiring board 10 is formed of an insulating layer and a conductor layer that are alternately laminated, and FIG. 1 shows a part of the resin insulating layer 101, the coated insulating layer 103, and the conductor layer 102. One surface F of the illustrated wiring board 10 is formed as a component mounting surface on which an external electronic component such as a semiconductor element is mounted. The component mounting surface F of the wiring board 10 shown in FIG. 1 is composed of the surface of the coated insulating layer 103 and the surface of the metal post 104 protruding from the coated insulating layer 103.

In the description of the wiring board 10 of the present embodiment, the component mounting surface F side of each element constituting the wiring board 10, that is, the upper side on the paper surface is referred to as "upper side" or simply "upper side", and the opposite side is referred to as "lower side". Or simply referred to as "below". Therefore, the upper end of each element is also referred to as the "upper end" and the lower end is also referred to as the "lower end".

In FIG. 1, among a plurality of resin insulating layers 101 and conductor layers 102 included in the wiring board 10, three layers on the component mounting surface F side are shown. The number of layers of the resin insulating layer 101 and the conductor layer 102 included in the wiring board 10 of the embodiment is not particularly limited and may be increased or decreased as appropriate. By including the wiring board 10 in a larger number of conductor layers, a larger scale and complicated electric circuit can be formed in the wiring board 10 without increasing the planar size of the wiring board 10.

The conductor layer 102 in contact with the resin insulating layer 101 has an arbitrary conductor pattern. The conductor layer 102 is electrically connected to the conductor layer 102 on the opposite side of the resin insulating layer 101 via a via conductor 112 formed through the resin insulating layer 101. In the illustrated example, each via conductor 112 has a tapered shape in which the diameter is reduced from the component mounting surface F toward the opposite side, but the shape of the via conductor 112 is not limited to this. The diameter may be reduced toward the component mounting surface F, or the resin insulating layer 101 may be formed in a cylindrical shape having the same diameter in the thickness direction and substantially orthogonal to the conductor layer 102. For convenience, the word "reduced diameter" is used, but the opening shape of the via conductor 112 is not necessarily limited to a circular shape. "Reduced diameter" simply means that the distance between the longest two points on the outer circumference in the horizontal cross section of the via conductor 112 is reduced.

The conductor layer 102 formed closest to the component mounting surface F among the three conductor layers 102 shown includes the conductor pad 102p. The conductor pad 102p is electrically connected to a connection pad of an external electronic component such as a semiconductor element via a metal post 104 formed on the conductor pad 102p. The metal post 104 projects from the coated insulating layer 103 formed so as to cover the surfaces of the conductor pad 102p and the resin insulating layer 101 toward the component mounting surface F side.

The plurality of metal posts 104 included in the wiring board 10 of the present embodiment include metal posts 104f and 104s having different diameters. Specifically, it includes a first metal post 104f having a relatively small diameter and a second metal post 104s having a diameter larger than that of the first metal post 104f. The first and second metal posts 104f, 104s have substantially the same height with respect to the covering insulating layer 103. The first metal post 104f is connected to the conductor pad 102pf having a relatively large thickness among the plurality of conductor pads 102p, and the second metal post 104s is connected to the conductor pad 102ps having a relatively small thickness. ing. Here, the term "diameter" in the terms "small diameter" and "large diameter" means the longest distance between two points on the outer circumference at the lower end of the metal post 104. Therefore, the terms "small diameter" or "large diameter" mean that the longest distance between two points on the outer circumference at the lower ends of the two contrasted metal posts 104 is comparatively small or large.

As described above, since the thickness of the conductor pad 102pf to which the first metal post 104f having a relatively small diameter is connected is relatively large, the height with respect to the diameter of the lower end of the metal post 104f (thickness of the wiring board 10). It is suppressed that the ratio of length) in the direction becomes excessive. That is, physical weakening due to the elongated shape of the metal post 104f can be avoided, and the metal post 104f having relatively high rigidity can be provided.

In the illustrated example, the metal post 104 has a shape in which the diameter increases from the component mounting surface F side (upper end side) toward the conductor pad 102 side (lower end side). In particular, when the first metal post 104f has such a shape, the rigidity of 104f can be further ensured satisfactorily. A relatively wide connection surface is secured at the connection portion between the metal post 104f and the conductor pad 102pf, and it is possible to obtain a highly reliable and good connection.

The resin insulating layer 101 of the wiring board 10 is formed by using an arbitrary insulating resin such as an epoxy resin. Polyimide resin, BT resin (bismaleimide-triazine resin), polyphenylene ether resin, phenol resin and the like can also be used. The resin insulating layer 101 may contain an inorganic filler such as silica. In the wiring board 10 of the illustrated example, the resin insulating layer 101 does not contain a core material, but may contain a core material such as glass fiber or aramid fiber if necessary. The strength of the wiring board 10 can be improved by including the core material. The plurality of resin insulating layers 101 may be made of different materials, or all of them may be made of the same material.

The conductor layer 102 can be formed using any material having appropriate conductivity, such as copper or nickel. The conductor layer 102 is formed, for example, by a metal film layer (preferably an electrolytic copper plating film layer) or an electrolytic plating film layer (preferably an electrolytic copper plating film layer), or a combination thereof. In the illustrated example, it is formed by a two-layer structure of a metal film layer 102n and an electrolytic plating film layer 102e. However, the configuration of each conductor layer 102 constituting the wiring board 10 is not limited to the multilayer structure exemplified in FIG. 1. The conductor layer 102 may be composed of, for example, a three-layer structure of a metal foil layer, a metal film layer, and an electrolytic plating film layer.

As shown in FIG. 1, the via conductor 112 may be integrally formed with the metal film layer 102n and the electrolytic plating film layer 102e constituting the conductor layer 102. The via conductor 112 is a so-called filled via that fills the inside of the conduction hole 112h, and is composed of a metal film layer and an electrolytic plating film layer that cover the bottom surface and the side surface in the conduction hole 112h.

The coating insulating layer 103 is formed by using an arbitrary insulating resin material. The coating insulating layer 103 is formed by using, for example, a photosensitive polyimide resin, an epoxy resin, or the like. The coating insulating layer 103 covers the conductor pad 102p, a part of the side surface of the metal post 104 formed on the conductor pad 102p, and the surface of the resin insulating layer 101 exposed between the plurality of conductor pads 102p. .. The coated insulating layer 103 can be a solder resist layer.

The metal post 104 is formed using, for example, copper or nickel. The metal post 104 can be formed by electroplating an arbitrary metal material on the conductor pad 102p, as will be described in detail later. When the metal post 104 contains a metal material of the same type as the metal contained in the conductor pad 102p, the connectivity between the conductor pad 102p and the metal post 104 may be improved. For example, when the conductor pad 102p is composed of the electrolytic copper plating film layer and the electrolytic copper plating film layer, the metal post 104 may also be composed of the electrolytic copper plating film layer or the electrolytic copper plating film layer. preferable. A protective layer (not shown) may be formed on the upper end of the metal post 104. For example, a protective layer made of Ni / Sn, Ni / Pd / Au, or the like is provided. The protective layer may be formed of Ni / Au or Sn. An OSP film may be formed.

FIG. 2 is an enlarged view of the region II surrounded by the alternate long and short dash line in FIG. As shown, the diameter of the first metal post 104f is smaller than the diameter of the second metal post 104s. The first metal post 104f and the second metal post 104s having different sizes have substantially the same height with respect to the covering insulating layer 103. The thickness fH2 of the conductor pad 102pf to which the first metal post 104f is connected (height from the surface of the resin insulating layer 101) fH2 is larger than the thickness sH2 of the second conductor pad 102ps. That is, the height fH1 of the first metal post 104f having a relatively small diameter is smaller than the height sH1 of the second metal post 104s having a relatively large diameter.

As described above, the height fH1 of the first metal post 104f having a small diameter is relatively small, so that the first metal post 104f can have high rigidity. Physical resistance to external forces that may be applied when electronic components are mounted on the component mounting surface F is enhanced, and the occurrence of defects such as peeling and breakage at the connection portion between the first metal post 104f and the conductor pad 102pf can be suppressed. .. Specifically, the ratio of the height fH1 of the first metal post 104f to the diameter 104fd on the proximal end side of the first metal post 104f is preferably 1.5 or more and 3.5 or less. .. The conductor pad 102pf is formed so as to have a thickness fH2 corresponding to the dimension of the diameter 104fd of the metal post 104f connected on the conductor pad 102pf and the dimension of the height fH1 that the metal post 104f should have.

In the illustrated example, the metal posts 104f and 104s have a shape whose diameter increases toward the conductor pads 102pf and 102ps. That is, the diameter on the lower end (base end) side connected to the conductor pads 102pf and 102ps of the metal posts 104f and 104s is larger than the diameter on the opposite side (upper end side). Having such a shape may improve the connection reliability between the metal posts 104f and 104s and the conductor pads 102pf and 102ps. In particular, the first metal post 104f, which has a relatively small diameter, may have a relatively narrow center-to-center distance (pitch) with respect to the adjacent metal post 104f. Even in such a case, a relatively wide separation distance (gap) with respect to the adjacent metal post 104f can be secured on the upper end side. While the short circuit between the adjacent metal posts 104f on the upper end side is suppressed, the connection reliability with the conductor pad 102pf on the proximal end side can be improved. From the viewpoint of short-circuit suppression and connection reliability, the ratio of the area of the surface on the upper end side of the metal post 104f to the area of the surface on the proximal end side is preferably 0.75 or more and 0.95 or less. .. However, the shapes of the metal posts 104f and 104s are not limited to this. The metal posts 104f and 104s may be formed in a columnar shape having substantially the same diameter from the base end side to the upper end side.

FIG. 3 shows an example in which the conductor pad 102p has a structure different from the structure shown in FIG. In the illustrated example, the surface on the side (upper side) connected to the metal posts 104f and 104s of the conductor pads 102pf and 102ps is raised toward the upper side. That is, the upper surface of the conductor pads 102pf and 102ps is curved so as to be convex toward the metal posts 104f and 104s. A wide connection area can be secured by bending the connection surface of the conductor pads 102pf and 102ps with the metal posts 104f and 104s. The upper end surface of the metal posts 104f and 104s may also be raised along with the raised shape of the conductor pads 102pf and 102ps. The ridges on the upper ends of the metal posts 104f, 104s can improve the reliability of connection between the metal posts 104 and connection pads such as electronic components.

As shown in FIG. 3, from the viewpoint of adhesion between the coated insulating layer 103 and the metal posts 104f and 104s, the surface of the metal posts 104f and 104s (particularly the surface covered by the coated insulating layer 103) is formed as a rough surface. It is desirable that it is done. Further, since the surface of the conductor pad 102p is similarly roughened, the adhesion between the covering insulating layer 103 and the conductor pad 102p can be improved. For example, the surfaces of the metal posts 104f, 104s and the conductor pad 102p are subjected to a common roughening treatment, and the surfaces of the metal posts 104f, 104s and the conductor pad 102p covered with the covering insulating layer 103 have substantially the same surface roughness. It can be formed on a rough surface with a metal.

Hereinafter, a method for manufacturing the wiring board 10 shown in FIG. 1 will be described with reference to FIGS. 4A to 4G. In FIGS. 4A to 4G, as in FIG. 1, the entire wiring board 10 is not shown, and only a partial cross section on the component mounting surface F side on which the metal post 104 is formed is shown. In the following description, in each element, the component mounting surface F side (upper side on the paper surface) of the wiring board 10 is referred to as "upper" or "upper side", and is also referred to as "outer side" or simply "outer side".

First, as shown in FIG. 4A, a wiring board 10p in which the outermost resin insulating layer 101 has been laminated is prepared. The wiring board 10p is manufactured by a general method for manufacturing a wiring board by a build-up method in which a plurality of insulating layers and conductor layers are laminated.

Next, as shown in FIG. 4B, the conduction hole 112h penetrating the outermost resin insulating layer 101 at a position corresponding to the formation portion of the via conductor 112 of the outermost resin insulating layer 101 of the wiring board 10p. Is formed. The conduction hole 112h is drilled by irradiation with a laser beam such as a carbon dioxide laser or a YAG laser. Then, for example, a metal film layer 102n, which is an electroless copper plating film layer, is formed over the inside of the conduction hole 112h and the entire surface of the resin insulating layer 101.

Subsequently, a plating resist 102r for electrolytic plating is formed on the metal film layer 102n. The plating resist 102r is formed by using, for example, a dry film resist containing an acrylic resin or the like. The plating resist 102r is formed so as to have an opening 102rh corresponding to the conductor pattern including the conductor pad 102p, which the outermost conductor layer 102 of the wiring board 10 should have. The aperture 102rh can be formed using photolithography by exposure and development with a mask having a suitable aperture pattern.

Next, as shown in FIG. 4C, the inside of the conduction hole 112h of the resin insulating layer 101 and the inside of the opening 102rh of the plating resist 102r are filled by electrolytic plating using the metal film layer 102n as a feeding layer. To. The via conductor 112 and the conductor pads 102 pf and 102 ps are formed. The conductor pads 102pf and 102ps are formed to have different thicknesses depending on the size of the diameter of the metal post 104 formed on the conductor pads 102pf and 102ps. Specifically, the conductor pad 102pf on which the first metal post 104f having a small diameter is formed is formed thicker than the conductor pad 102ps on which the second metal post 104s having a large diameter is formed. Ru.

The degree of the difference in thickness between the conductor pads 102 pf and 102 ps can be influenced by the size of the via conductor 112 that can be integrally formed with the conductor pads 102 pf and 102 ps, that is, the size of the conduction hole 112h. Further, the difference in dimensions between the opening 102rh for the conductor pad 102pf and the opening 102rh for the conductor pad 102ps, that is, the difference in the dimensions in the plane direction between the conductor pad 102pf and the conductor pad 102ps may also be affected. Therefore, the dimensions of the conduction hole 112h and the dimensions of the opening 102rh can be adjusted according to the thickness that the conductor pads 102pf and 102ps should have. Further, by appropriately adjusting the electroplating conditions (temperature, current density, plating time, etc.) in consideration of these influences, conductor pads 102 pf and 102 ps having different thicknesses can be formed. In the illustrated example, the upper surface of the conductor pads 102pf and 102ps is formed flat. It is also possible to obtain conductor pads 102 pf and 102 ps that rise upward depending on the conditions of electroplating. After the conductor pads 102pf and 102ps are formed, the plating resist 102r is removed.

Next, as shown in FIG. 4D, a resist layer 104r for forming a metal post 104 is formed on the metal film layer 102n exposed by removing the plating resist 102r and on the conductor pads 102pf and 102ps. The resist layer 104r is formed by using a photosensitive dry film resist containing, for example, an acrylic resin. An opening 104rh for forming the metal post 104 is formed in the resist layer 104r. Photolithography is used to form the opening 104rh. Due to the opening shape of the photomask in photolithography, a relatively small-diameter opening 104rhf is formed on the conductor pad 102ps, and a relatively large-diameter opening 104rhs is formed on the conductor pad 102ps. Depending on the exposure conditions, openings 104rhf and 104rhs having a shape whose diameter increases from the upper side to the lower side can be formed.

Subsequently, the inner surfaces of the openings 104rhf and 104rhs of the resist layer 104r are subjected to electrolytic plating using the metal film layer 102n as a feeding layer to form metal posts 104f and 104s. The electrolytic plating used for forming the metal posts 104f and 104s is, for example, electrolytic copper plating or electrolytic nickel plating. The plating layer formed by electroplating grows upward from the surface of the conductor pads 102 pf, 102 ps in a so-called bottom-up manner.

Electroplating is completed with the metal posts 104f filled to a desired position in the opening 104rh, and the formation of the metal posts 104f and 104s is completed. In this state, the upper end surface of the metal post 104f and the upper end surface of the metal post 104s are formed at substantially the same height with respect to the surface of the resin insulating layer 101. The shape of the upper surface (upper end surface) of the metal posts 104f and 104s may change depending on the shape of the surface of the conductor pads 102pf and 102ps in contact with the metal posts 104f and 104s, the conditions of electrolytic plating, and the like. A surface protective film (not shown) made of Ni / Sn, Au, Ni / Au, Ni / Pd / Au, or the like may be formed on the upper end surfaces of the metal posts 104f, 104s, if necessary.

Next, as shown in FIG. 4E, the resist layer 104r is removed. The metal film layer 102n exposed by removing the resist layer 104r is removed by etching. The conductor pads 102 pf, 102 ps and the metal posts 104 f, 104 s are completely exposed, and the surface of the resin insulating layer 101 is exposed from between the plurality of conductor pads 102 pf, 102 ps. The surfaces of the exposed metal posts 104f, 104s and the conductor pads 102pf, 102ps may be subjected to a common roughening treatment, if necessary.

Next, as shown in FIG. 4F, the coated insulating layer so as to cover the surface of the resin insulating layer 101 exposed from between the plurality of conductor pads 102 pf, 102 ps, the conductor pads 102 pf, 102 ps, and the metal posts 104 f, 104 s. 103 is formed. The coated insulating layer 103 completely covers the conductor pads 102 pf, 102 ps and the metal posts 104 f, 104 s. As a result, the metal posts 104f and 104s are buried in the covering insulating layer 103.

Then, as shown in FIG. 4G, a part of the covering insulating layer 103 in the thickness direction is removed, and a part of the metal posts 104f and 104s is exposed from the covering insulating layer 103. The metal posts 104f and 104s are in a state of protruding upward from the covering insulating layer 103. A dry process such as plasma etching with CF ₄ or CF ₄ + O ₂ can be used for partial removal of the coating insulating layer 103 in the thickness direction. Further, the metal posts 104f and 104s may be exposed by removing a part of the covering insulating layer 103 in the thickness direction by the blast treatment. By the above steps, the wiring board 10 shown in FIG. 1 is completed. A surface protective film (not shown) made of a heat-resistant preflux or the like may be formed on a portion of the metal posts 104f, 104s exposed from the covering insulating layer 103.

In the production of the wiring board 10 of the embodiment, after the plating resist 102r is removed following the formation of the conductor pad 102p shown in FIG. 4C, the wiring board 10 may be manufactured through a process different from the above-mentioned process. For example, the resist layer 104r is not formed on the metal film layer 102n, and following the removal of the plating resist 102r, the metal film layer 102n exposed between the conductor pads 102pf and 102ps is also removed. The coated insulating layer 103 is formed on the surface of the resin insulating layer 101 exposed by the removal of the metal film layer 102n and on the conductor pads 102 pf and 102 ps.

For example, the coated insulating layer 103 serving as a solder resist covers the surface of the resin insulating layer 101 and the conductor pads 102 pf and 102 ps. Then, an opening for exposing the conductor pads 102 pf and 102 ps is formed in the coated insulating layer 103 by exposure and development. At this time, as in the case where the openings 104rhf and 104rhs are formed in the resist layer 104r, a relatively small diameter opening is formed on the conductor pad 102pf, and a relatively large diameter opening is formed on the conductor pad 102ps. Will be done. Next, the metal posts 104f and 104s are formed by electroless plating in the openings formed in the covering insulating layer 103. In this case, in the formation of the metal posts 104f and 104s, a catalyst layer for plating precipitation may be formed in the opening prior to electroless plating. For the catalyst layer, for example, a metal such as palladium (Pd), gold (Au), platinum (Pt), or ruthenium (Ru) can be used. Following the formation of the metal posts 104f, 104s, a part of the covering insulating layer 103 in the thickness direction is removed. The metal posts 104f, 104s are partially exposed from the covering insulating layer 103 and project upward. The formation of the wiring board 10 is completed.

The wiring board of the embodiment is not limited to the structure exemplified in each drawing and the one provided with the structure and the material exemplified in the present specification. For example, the conductor layer 102 closest to the component mounting surface F may include a different conductor pattern in addition to the conductor pad 102p. Further, the method for manufacturing the wiring board of the embodiment is not limited to the method described with reference to each drawing, and the conditions and order thereof may be appropriately changed. Depending on the structure of the wiring board actually manufactured, some steps may be omitted or another step may be added.

101 Resin Insulation Layer 102 Conductor Layer 102p, 102pf, 102ps Conductor Pad 103 Coated Insulation Layer 104 Metal Post 104f First Metal Post 104s Second Metal Post 112 Via Conductor 102n Metal Film Layer 102e Electrolytic Plating Film Layer 102r Plating Resist 104r Resist Layer fH1, sH1 Height fH2, sH2 Thickness

Claims (9)

A resin insulating layer, a plurality of conductor pads formed on the resin insulating layer, a coated insulating layer covering the resin insulating layer and the conductor pad, and the coating connected on each of the plurality of conductor pads. A wiring board comprising a plurality of metal posts protruding from an insulating layer.
The plurality of metal posts include a first metal post and a second metal post having a diameter larger than that of the first metal post.
The thickness of the conductor pad to which the first metal post is connected is larger than the thickness of the conductor pad to which the second metal post is connected. In the wiring board according to claim 1, the heights of the first metal post and the second metal post with respect to the surface of the coated insulating layer are substantially the same. In the wiring board according to claim 1, the ratio of the height of the first metal post to the diameter of the lower end side of the first metal post is 1.5 or more and 3.5 or less. In the wiring board according to claim 1, the area of the upper end surface of the first metal post is smaller than the area of the lower end surface of the first metal post. The ratio of the area of the upper end surface of the first metal post to the area of the lower end surface of the first metal post in the wiring board according to claim 4 is 0.75 or more and 0.95 or less. Is. The wiring board according to claim 1, wherein the conductor pad and the metal post contain the same kind of metal material. The surface of the wiring board according to claim 1, which is connected to the metal post of the conductor pad, is raised toward the metal post side. The surface of the wiring board according to claim 1 covered by the covering insulating layer of the metal post is formed as a rough surface. In the wiring board according to claim 8, the surface of the metal post covered by the coated insulating layer and the surface of the conductor pad covered by the coated insulating layer have substantially the same surface roughness. It is formed on the surface.

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