JP2022001407A - Liquid discharge head, discharge unit, liquid discharging device, bonded substrate - Google Patents

Liquid discharge head, discharge unit, liquid discharging device, bonded substrate Download PDF

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JP2022001407A
JP2022001407A JP2020106205A JP2020106205A JP2022001407A JP 2022001407 A JP2022001407 A JP 2022001407A JP 2020106205 A JP2020106205 A JP 2020106205A JP 2020106205 A JP2020106205 A JP 2020106205A JP 2022001407 A JP2022001407 A JP 2022001407A
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substrate
outside air
liquid
communication passage
air communication
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JP7452281B2 (en
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圭史 三輪
Keiji Miwa
拓磨 平林
Takuma HIRABAYASHI
昌央 吉田
Masao Yoshida
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Ricoh Co Ltd
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Abstract

To improve board electrical connection reliability.SOLUTION: A liquid discharge head comprises: a first substrate 201 including a piezoelectric element 40 which pressurizes a pressure chamber communication with a nozzle for discharging liquid, and a terminal electrode 44 connected to a pressure generating element 40; and a second substrate 202 which is joined to the first substrate 201, and has a terminal electrode opening 252 for exposing the terminal electrode 44. The first substrate 201 is provided with an open hole 29 that penetrates the first substrate 201, and the second substrate 202 is provided with a communication hole 253 that communicates with the open hole 29 of the first substrate 202. The second substrate 202 has an outside air communication passage 254, that communicates the terminal electrode opening 252 and the communication hole 253 with each other, on a side opposite to a surface joined to the first substrate 201, and the outside air communication passage 254 is provided at any one of four corners of the second substrate 202.SELECTED DRAWING: Figure 1

Description

本発明は液体吐出ヘッド、吐出ユニット、液体を吐出する装置、貼り合わせ基板に関する。 The present invention relates to a liquid discharge head, a discharge unit, a device for discharging liquid, and a bonded substrate.

例えば、液体吐出ヘッドとして、液体を吐出するノズルに通じる圧力室や圧力発生手段及び圧力発生手段に通じる端子電極を設けた第1基板と、第1基板の圧力室に液体を供給する流路などを設けた第2基板とを接合した接合基板(貼り合わせ基板)を使用するものがある。 For example, as a liquid discharge head, a first substrate provided with a pressure chamber leading to a nozzle for discharging liquid, a pressure generating means, and a terminal electrode communicating with the pressure generating means, a flow path for supplying liquid to the pressure chamber of the first substrate, and the like. There is one that uses a bonded substrate (bonded substrate) that is bonded to the second substrate provided with the above.

従来、ノズルプレートと、流路基板と、駆動手段と、振動板と、流路基板のノズルプレートとは反対側に接合された保持基板とを備え、保持基板は、流路基板側の駆動手段に対向する位置に、保持基板と流路基板とで囲まれる空間部を有し、空間部は、保持基板に設けられた溝部を介して大気と連通しているものが知られている(特許文献1)。 Conventionally, a nozzle plate, a flow path board, a drive means, a diaphragm, and a holding board joined to the side opposite to the nozzle plate of the flow path board are provided, and the holding board is a drive means on the flow path board side. It is known that a space portion surrounded by a holding substrate and a flow path substrate is provided at a position facing the holding substrate, and the space portion communicates with the atmosphere through a groove portion provided in the holding substrate (patented). Document 1).

特開2013−158991号公報Japanese Unexamined Patent Publication No. 2013-158991

ところで、液体吐出ヘッドの流路には耐液性を高めるための保護膜が成膜するが、保護膜が圧力発生手段に通じる端子電極に形成されると、電気的接続の信頼性が低下するという課題がある。 By the way, a protective film for enhancing liquid resistance is formed on the flow path of the liquid discharge head, but if the protective film is formed on the terminal electrode leading to the pressure generating means, the reliability of the electrical connection is lowered. There is a problem.

本発明は上記の課題に鑑みてなされたものであり、電気的接続の信頼性を向上することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to improve the reliability of electrical connection.

上記の課題を解決するため、本発明に係る液体吐出ヘッドは、
液体を吐出するノズルに通じる圧力室を加圧する圧力発生手段と、
前記圧力発生手段に接続された端子電極と、を含む第1基板と、
前記第1基板に接合され、前記端子電極を露出させる端子電極開口部を有する第2基板と、を備え、
前記第1基板には、前記第1基板を貫通する貫通孔が設けられ、
前記第2基板には、前記第1基板の前記貫通孔に通じる連通孔が設けられ、
前記第2基板には、前記第1基板との接合面とは反対側に、前記端子電極開口部と前記連通孔とを通じる外気連通路を有し、
前記外気連通路は、前記第2基板の四隅のいずれか一箇所、又は、対角の二箇所に設けられている
構成とした。
In order to solve the above problems, the liquid discharge head according to the present invention is
A pressure generating means that pressurizes the pressure chamber leading to the nozzle that discharges the liquid,
A first substrate including a terminal electrode connected to the pressure generating means,
A second substrate bonded to the first substrate and having a terminal electrode opening for exposing the terminal electrode is provided.
The first substrate is provided with a through hole that penetrates the first substrate.
The second substrate is provided with a communication hole leading to the through hole of the first substrate.
The second substrate has an outside air communication passage through the terminal electrode opening and the communication hole on the side opposite to the joint surface with the first substrate.
The outside air communication passage is configured to be provided at any one of the four corners of the second substrate or at two diagonal locations.

本発明によれば、電気的接続の信頼性を向上できる。 According to the present invention, the reliability of the electrical connection can be improved.

本発明の第1実施形態に係る液体吐出ヘッドを構成する貼り合わせ基板の平面説明図である。It is a plane explanatory view of the laminated substrate which constitutes the liquid discharge head which concerns on 1st Embodiment of this invention. 同貼り合わせ基板の第1基板及び第2基板の平面説明図である。It is a plane explanatory view of the 1st substrate and the 2nd substrate of the bonded substrate. 同じく第2基板の外気連通路部分の詳細を示す説明図である。Similarly, it is explanatory drawing which shows the detail of the outside air communication passage part of the 2nd substrate. 同じく外気連通路及びガス侵入検知室の説明に供する説明図である。Similarly, it is explanatory drawing provided for the explanation of the outside air communication passage and the gas intrusion detection room. 本発明の第1実施形態に係る液体吐出ヘッドを構成する貼り合わせ基板の平面説明図である。It is a plane explanatory view of the laminated substrate which constitutes the liquid discharge head which concerns on 1st Embodiment of this invention. 各実施形態の具体例の説明に供する説明図である。It is explanatory drawing which provides the explanation of the specific example of each embodiment. 本発明の第3実施形態に係る液体吐出ヘッドをノズル面側から見た外観斜視説明図である。It is an external perspective explanatory view of the liquid discharge head which concerns on 3rd Embodiment of this invention as seen from the nozzle surface side. 同じくノズル面と反対側から見た外観斜視説明図である。Similarly, it is an external perspective explanatory view seen from the side opposite to the nozzle surface. 同じく分解斜視説明図である。It is also an exploded perspective explanatory view. 同じく流路構成部材の分解斜視説明図である。Similarly, it is an exploded perspective explanatory view of the flow path constituent member. 図10の要部拡大斜視説明図である。FIG. 10 is an enlarged perspective explanatory view of a main part of FIG. 同じく流路部分の断面斜視説明図である。Similarly, it is a cross-sectional perspective explanatory view of a flow path portion. 本発明に係る液体を吐出する装置の一例の概略説明図である。It is a schematic explanatory drawing of an example of the apparatus which discharges a liquid which concerns on this invention. 同装置のヘッドユニットの一例の平面説明図である。It is a plane explanatory view of an example of the head unit of the same apparatus.

以下、本発明の実施形態について添付図面を参照して説明する。本発明の第1実施形態について図1ないし図3を参照して説明する。図1は同実施形態に係る液体吐出ヘッドを構成する貼り合わせ基板の平面説明図、図2は同貼り合わせ基板の第1基板及び第2基板の平面説明図である。図3は第2基板の外気連通路部分の詳細を示す説明図であり、(a)は平面説明図、(b)は(a)のA−A線に沿う断面説明図である。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan explanatory view of a bonded substrate constituting the liquid discharge head according to the same embodiment, and FIG. 2 is a planar explanatory view of a first substrate and a second substrate of the bonded substrate. 3A and 3B are explanatory views showing the details of the outside air communication passage portion of the second substrate, FIG. 3A is a plan explanatory view, and FIG. 3B is a cross-sectional explanatory view taken along the line AA of FIG.

貼り合わせ基板200は、第1基板201と第2基板202とを接着剤などで貼り合わせた(接合した)基板である。 The bonded substrate 200 is a substrate in which the first substrate 201 and the second substrate 202 are bonded (bonded) with an adhesive or the like.

第1基板201は、液体を吐出するノズルに通じる圧力室を加圧する圧力発生手段である複数の圧電素子40の列を2列備えている。圧電素子40は、圧電体41と、圧電体41を挟む共通電極としての下電極42及び個別電極としての上電極43とで構成されている。第1基板201には、上電極43に接続された端子電極44が設けられている。 The first substrate 201 includes two rows of a plurality of rows of piezoelectric elements 40 which are pressure generating means for pressurizing a pressure chamber leading to a nozzle for discharging a liquid. The piezoelectric element 40 is composed of a piezoelectric body 41, a lower electrode 42 as a common electrode sandwiching the piezoelectric body 41, and an upper electrode 43 as individual electrodes. The first substrate 201 is provided with a terminal electrode 44 connected to the upper electrode 43.

第1基板201には、複数の圧力室にそれぞれ液体を供給する複数の供給口となる開口32が設けられている。 The first substrate 201 is provided with openings 32 that serve as a plurality of supply ports for supplying liquids to the plurality of pressure chambers.

第1基板201には、第2基板202と貼り合わせる土台28が設けられ、貼り合わせ土台28の部分に第1基板201を貫通する貫通孔29が設けられている。 The first substrate 201 is provided with a base 28 to be bonded to the second substrate 202, and a through hole 29 penetrating the first substrate 201 is provided in the portion of the bonded base 28.

第2基板202には、共通供給流路58と、共通供給流路58と第1基板201の開口32とを通じる供給口54とが設けられている。 The second substrate 202 is provided with a common supply flow path 58 and a supply port 54 through the common supply flow path 58 and the opening 32 of the first substrate 201.

第2基板202には、第1基板201の圧電素子40を収容する収容部251と、第1基板201の端子電極44を露出する端子開口部252とを有する。 The second substrate 202 has an accommodating portion 251 for accommodating the piezoelectric element 40 of the first substrate 201, and a terminal opening 252 for exposing the terminal electrode 44 of the first substrate 201.

第2基板202には、第1基板201の貫通孔29に通じる連通孔253が設けられている。また、第2基板202には、第1基板201との接合面とは反対側に、端子開口部252と連通孔253とを通じる外気連通路254を有している。 The second substrate 202 is provided with a communication hole 253 leading to the through hole 29 of the first substrate 201. Further, the second substrate 202 has an outside air communication passage 254 through which the terminal opening 252 and the communication hole 253 pass on the side opposite to the joint surface with the first substrate 201.

ここで、外気連通路254は、第2基板202の四隅のいずれか一箇所に設けている。第2基板202の四隅とは、平面形状において、端子開口部252に臨むほぼ矩形状の領域の4つの隅部分である。言い換えれば、本実施形態では、第2の基板202の複数の収容部251の並び方向(圧電素子の並び方向、ノズルの並び方向)における端部の収容部251に並ぶ部分である。 Here, the outside air communication passage 254 is provided at any one of the four corners of the second substrate 202. The four corners of the second substrate 202 are four corners of a substantially rectangular region facing the terminal opening 252 in a planar shape. In other words, in the present embodiment, it is a portion of the second substrate 202 that is aligned with the accommodating portion 251 at the end in the arrangement direction (arrangement direction of the piezoelectric elements, arrangement direction of the nozzles) of the plurality of accommodating portions 251.

外気連通路254は、図3(a)に示すように、連通孔253と端子開口部252との間で折れ曲がりながら蛇腹状に形成されたパターン形状を有している。外気連通路254の断面積をS(図3(b)参照)、長さをLとするとき、本実施形態では、L/Sが0.50〜20.00の範囲内になるようにしている。 As shown in FIG. 3A, the outside air communication passage 254 has a pattern shape formed in a bellows shape while being bent between the communication hole 253 and the terminal opening 252. When the cross-sectional area of the outside air communication passage 254 is S (see FIG. 3B) and the length is L, in this embodiment, the L / S is set to be within the range of 0.50 to 20.00. There is.

そして、外気連通路254には、所定の間隔で、複数のガス侵入検知室255が連通している。ガス侵入検知室255の幅W1、W2は外気連通路254の幅W3よりも大きくしている。 A plurality of gas intrusion detection chambers 255 communicate with the outside air communication passage 254 at predetermined intervals. The widths W1 and W2 of the gas intrusion detection chamber 255 are larger than the width W3 of the outside air communication passage 254.

次に、本実施形態の作用について図4も参照して説明する。図4は第1基板及び第2基板の多数個取りを行う場合の説明に供する説明図である。 Next, the operation of this embodiment will be described with reference to FIG. FIG. 4 is an explanatory diagram for explaining a case where a large number of the first substrate and the second substrate are taken.

第1基板201は、例えば、6インチのシリコン基板203を使用して、CVD法、スパッタリング法、スピンコート法などにより所要の薄膜を形成し、フォトリソグラフィー法により加工して多数個の第1基板201を作製して、個々の第1基板201に分割する。第2基板202についても、同様に、Si基板200上に多数個の第2基板202を作製して、個々の第2基板202に分割する。 For the first substrate 201, for example, a 6-inch silicon substrate 203 is used to form a required thin film by a CVD method, a sputtering method, a spin coating method, or the like, and the first substrate 201 is processed by a photolithography method to form a large number of first substrates. 201 is made and divided into individual first substrates 201. Similarly, for the second substrate 202, a large number of second substrates 202 are manufactured on the Si substrate 200 and divided into individual second substrates 202.

そして、第1基板201と第2基板202とを接合した(貼り合わせた)状態で、流路の壁面を保護する耐液性の保護膜を形成する。この場合、生産性を向上させるため、保護膜形成は、複数の貼り合わせ基板(接合基板)200を、保護膜形成装置のチャンバー内に配置し、バッチ処理する。 Then, in a state where the first substrate 201 and the second substrate 202 are joined (bonded together), a liquid-resistant protective film that protects the wall surface of the flow path is formed. In this case, in order to improve the productivity, in the protective film formation, a plurality of bonded substrates (bonded substrates) 200 are arranged in the chamber of the protective film forming apparatus and batch-processed.

バッチ処理では、第1基板201、第2基板202の全面に膜が付着するが、保護膜は絶縁膜であり、端子電極44に保護膜が付着すると外部接続がとれなくなる。そのため、第2基板202の第1基板201と貼り合わせる面と対向する面に、基板形状に切り抜いた保護テープを貼った状態で、保護膜を成膜する。 In the batch processing, the film adheres to the entire surface of the first substrate 201 and the second substrate 202, but the protective film is an insulating film, and if the protective film adheres to the terminal electrode 44, the external connection cannot be taken. Therefore, a protective film is formed on the surface of the second substrate 202 facing the surface to be bonded to the first substrate 201 with the protective tape cut out in the shape of the substrate attached.

これにより、端子電極44には保護膜が形成されず、流路である共通供給流路58、供給口54、開口32、圧力室に保護膜を形成することができる。 As a result, the protective film is not formed on the terminal electrode 44, and the protective film can be formed on the common supply flow path 58, the supply port 54, the opening 32, and the pressure chamber, which are the flow paths.

しかしながら、保護テープを第2基板202に貼るときは、ボイドのかみ込みを抑制するために真空状態で行うことが好ましい。保護テープを貼り付け後に真空から大気圧に戻すとき、保護テープと第2基板202と第1基板201に囲まれて、第2基板202、第1基板201を貫通していない部分は真空状態になる。 However, when the protective tape is attached to the second substrate 202, it is preferably performed in a vacuum state in order to suppress the biting of voids. When returning from vacuum to atmospheric pressure after attaching the protective tape, the part surrounded by the protective tape, the second substrate 202 and the first substrate 201 and not penetrating the second substrate 202 and the first substrate 201 is in a vacuum state. Become.

本実施形態では、端子開口部252が真空状態のまま大気開放されるが、大気圧下では真空状態の端子電極44の保護テープが第1基板201側に押されて大きく変形する。 In the present embodiment, the terminal opening 252 is opened to the atmosphere in a vacuum state, but under atmospheric pressure, the protective tape of the terminal electrode 44 in the vacuum state is pushed toward the first substrate 201 and is greatly deformed.

この保護テープの変形により、例えば共通供給流路58と端子開口部252の保護テープが剥離してしまう場合、保護膜を成膜するときに、成膜ガスが供給口54から侵入し、端子電極44に保護膜が形成される。 When, for example, the protective tape of the common supply flow path 58 and the terminal opening 252 is peeled off due to the deformation of the protective tape, the film-forming gas invades from the supply port 54 when the protective film is formed, and the terminal electrode A protective film is formed on 44.

また、大気圧下の保護テープの変形で、保護テープの剥離を起こさずに保護膜の成膜工程に移行できても、保護膜の成膜時は保護テープ貼り付け時よりもさらに高真空で行う必要があり、今度は端子開口部252が膨張し、保護テープが剥離することがある。 In addition, even if the protective tape can be deformed under atmospheric pressure and the protective film film formation process can be started without causing the protective tape to peel off, the protective film can be formed with a higher vacuum than when the protective tape is attached. This time, the terminal opening 252 may expand and the protective tape may peel off.

これを解消するために、例えば粘着力の高い保護テープを採用し、保護テープの圧力差による変形を抑制することが考えられる。しかしながら、粘着力の高い保護テープは、真空下でアウトガスが多く、保護膜の膜質の低下、及びアウトガス成分の基板への付着により保護膜の密着強度が低下することがある。 In order to solve this problem, it is conceivable to adopt, for example, a protective tape having high adhesive strength to suppress deformation due to the pressure difference of the protective tape. However, a protective tape having a high adhesive strength has a large amount of outgas under vacuum, and the adhesive strength of the protective film may decrease due to deterioration of the film quality of the protective film and adhesion of the outgas component to the substrate.

一方、保護テープの変形が起こらないように剛性の高い保護テープを採用しようとすると、変形の抑制と耐熱性を両立できない。さらに、保護テープの剛性を高くするために厚みが厚くなると、保護テープ自体の加工が難しくなり、貼り付け時に気泡が噛み込みやすいなどの不都合が生じる。 On the other hand, if an attempt is made to adopt a protective tape having high rigidity so that the protective tape is not deformed, it is not possible to achieve both deformation suppression and heat resistance. Further, if the thickness is increased in order to increase the rigidity of the protective tape, it becomes difficult to process the protective tape itself, which causes inconveniences such as air bubbles easily getting caught during sticking.

そこで、本実施形態では、第2基板202の外気連通路254及び連通孔253により、保護テープ貼り付け後に真空状態になる端子開口部252と第1基板201の貫通孔29を連通する。 Therefore, in the present embodiment, the outside air communication passage 254 and the communication hole 253 of the second substrate 202 communicate the terminal opening 252, which is in a vacuum state after the protective tape is attached, with the through hole 29 of the first substrate 201.

これにより、大気圧に戻した場合、貫通孔29、連通孔253、外気連通路254を介して端子開口部252も大気圧になるため、保護テープの変形を抑制できる。また、保護膜を成膜するときの高真空チャンバー内で端子開口部252が膨張する場合も、貫通孔29、連通孔253、外気連通路254を介して端子開口部252も高真空になるため保護テープの変形を抑制できる。 As a result, when the pressure is returned to the atmospheric pressure, the terminal opening 252 also becomes the atmospheric pressure via the through hole 29, the communication hole 253, and the outside air communication passage 254, so that the deformation of the protective tape can be suppressed. Further, even when the terminal opening 252 expands in the high vacuum chamber when the protective film is formed, the terminal opening 252 also becomes a high vacuum through the through hole 29, the communication hole 253, and the outside air communication passage 254. Deformation of the protective tape can be suppressed.

したがって、端子電極に保護膜が成膜されることが防止され、電気的接続の信頼性が向上する。 Therefore, it is prevented that a protective film is formed on the terminal electrodes, and the reliability of the electrical connection is improved.

外気連通路254の形状、長さ、深さは容易に設定することができ、保護テープの材料や保護テープ貼り付け及び保護膜成膜時の真空度、真空開放時間などに応じて適切に設定する。また、外気連通路254の流路長さ、深さは、貫通孔253から成膜ガスができる限り侵入しないよう設定する。 The shape, length, and depth of the outside air communication passage 254 can be easily set, and are appropriately set according to the material of the protective tape, the degree of vacuum at the time of attaching the protective tape and forming the protective film, the vacuum opening time, and the like. do. Further, the length and depth of the flow path of the outside air communication passage 254 are set so that the film-forming gas does not enter through the through hole 253 as much as possible.

次に、外気連通路254に通じるガス侵入検知室255の作用について説明する。 Next, the operation of the gas intrusion detection chamber 255 leading to the outside air communication passage 254 will be described.

保護膜を形成した後、成膜ガスの端子開口部252への侵入の有無について確認する必要がある。成膜ガスの侵入の有無の確認には、端子電極44上に成膜ガス成分が付着しているか成分分析する、端子電極44の抵抗試験を行う、端子電極44や連通流路の成膜ガス付着による変色の確認などを行うことが考えられる。 After forming the protective film, it is necessary to confirm whether or not the film-forming gas has invaded the terminal opening 252. To confirm the presence or absence of intrusion of the film-forming gas, analyze the component to see if the film-forming gas component adheres to the terminal electrode 44, perform a resistance test of the terminal electrode 44, and perform a film-forming gas on the terminal electrode 44 and the communication flow path. It is conceivable to confirm discoloration due to adhesion.

しかしながら、成膜ガスの成分分析には時間がかかる。抵抗試験は、異物を発生させるおそれがある。端子電極44の変色判別は付着する成膜ガスが微量であるため判別困難である。連通流路部の変色確認は、連通流路の幅や深さによっては光が乱反射し、変色の有無を確認できない。 However, it takes time to analyze the components of the film-forming gas. The resistance test may generate foreign matter. Discoloration of the terminal electrode 44 is difficult to discriminate because the amount of deposited gas adhering to the terminal electrode 44 is very small. When confirming the discoloration of the communication flow path, light is diffusely reflected depending on the width and depth of the communication flow path, and the presence or absence of discoloration cannot be confirmed.

そこで、本実施形態では、ガス侵入検知室255を外気連通路254に連通させている。ガス侵入検知室255は、外気連通路254よりも幅を広くし、光の乱反射を抑制し、変色が見やすい大きさとする。 Therefore, in the present embodiment, the gas intrusion detection chamber 255 is communicated with the outside air communication passage 254. The gas intrusion detection chamber 255 is wider than the outside air communication passage 254, suppresses diffused reflection of light, and has a size that makes it easy to see discoloration.

このガス侵入検知室255を、外気連通路254の連通孔253から端子開口部252の間に所定の間隔で複数接続する。 A plurality of the gas intrusion detection chambers 255 are connected between the communication holes 253 of the outside air communication passage 254 and the terminal openings 252 at predetermined intervals.

これにより、成膜ガスの侵入による変色が外気連通路254のいずれの位置にあるかを確認でき、端子開口部252への成膜ガスの侵入を容易に判別できる。 As a result, it is possible to confirm at which position of the outside air communication passage 254 the discoloration due to the intrusion of the film-forming gas is located, and it is possible to easily determine the intrusion of the film-forming gas into the terminal opening 252.

次に、本発明の第2実施形態について図5を参照して説明する。図5は同実施形態に係る液体吐出ヘッドを構成する貼り合わせ基板の平面説明図である。 Next, the second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan explanatory view of a bonded substrate constituting the liquid discharge head according to the same embodiment.

本実施形態では、第2基板202の四隅の対角部分の2箇所に外気連通路254を設け、各外気連通路254は連通孔253及び端子開口部252にそれぞれ連通させている。 In the present embodiment, outside air communication passages 254 are provided at two diagonal portions of the four corners of the second substrate 202, and each outside air communication passage 254 communicates with the communication hole 253 and the terminal opening 252, respectively.

本実施形態でも、前記第1実施形態と同様な作用効果を得ることができる。 Also in this embodiment, the same effect as that of the first embodiment can be obtained.

次に、成膜ガスの侵入に関する具体例について図6を参照して説明する。図6は同具体例の説明に供する説明図である。 Next, a specific example of the intrusion of the film-forming gas will be described with reference to FIG. FIG. 6 is an explanatory diagram for explaining the specific example.

ここでは、第1基板201を50枚製作した。一方、第2基板202について、前述したように、外気連通路254の断面積をS、流路の長さをL(図3参照)としたとき、L/Sを図5に示すように振った第1実施形態及び第2実施形態の各第2基板202をそれぞれ5枚ずつ製作した。 Here, 50 first substrates 201 were manufactured. On the other hand, regarding the second substrate 202, as described above, when the cross-sectional area of the outside air communication passage 254 is S and the length of the flow path is L (see FIG. 3), the L / S is shaken as shown in FIG. The second substrate 202 of each of the first embodiment and the second embodiment was manufactured five times each.

実施例1は、外気連通路254が最も狭く長い構成になるため、外気と連通するのに最も時間がかかり、その間、保護テープの変形が発生しやすいが、成膜ガスは最も端子開口部252に入りづらい構成である。 In the first embodiment, since the outside air communication passage 254 has the narrowest and longest configuration, it takes the longest time to communicate with the outside air, and during that time, the protective tape is likely to be deformed, but the film-forming gas has the most terminal opening 252. It is a structure that is difficult to enter.

一方、実施例9は、保護テープの変形は最も発生しづらいが、成膜ガスが侵入しやすい構成である。 On the other hand, in the ninth embodiment, the protective tape is most unlikely to be deformed, but the film-forming gas is easily invaded.

接続数は、子開口部252に対する外気連通路254の接続数である。接続数「1」は前記第1実施形態のように、1つのチップに対して1つの外気連通路254を配置した状態である(実施例1−9)。接続数「2」は前記第2実施形態ように1つのチップに対して対角に2つの外気連通路254、254を配置し、端子開口部252にそれぞれ外気連通路254が配置された状態である(実施例10)。第2実施形態の構成(接続数2)では、L/Sの値は1つの外気連通路254の値を記載している。 The number of connections is the number of connections of the outside air communication passage 254 to the child opening 252. The number of connections "1" is a state in which one outside air communication passage 254 is arranged for one chip as in the first embodiment (Example 1-9). The number of connections "2" is such that two outside air communication passages 254 and 254 are arranged diagonally with respect to one chip as in the second embodiment, and the outside air communication passages 254 are arranged in the terminal openings 252, respectively. There is (Example 10). In the configuration of the second embodiment (number of connections 2), the value of L / S describes the value of one outside air communication passage 254.

ガス侵入検知室255については、100μm×100μm(図3のW1×W2)の大きさが必要であることが事前の評価で判明した。 Prior evaluation revealed that the gas intrusion detection chamber 255 needs to have a size of 100 μm × 100 μm (W1 × W2 in FIG. 3).

そこで、100μm×100μmの大きさのガス侵入検知室255を外気連通路254の折り返し部と接続した。ガス侵入検知室255の接続数は、外気連通路254の折り返し部の数により適宜設定した。 Therefore, a gas intrusion detection chamber 255 having a size of 100 μm × 100 μm was connected to the folded portion of the outside air communication passage 254. The number of connections of the gas intrusion detection chamber 255 was appropriately set according to the number of folded portions of the outside air communication passage 254.

外気連通路254の効果を確認するために、比較対象として外気連通路254を配置しない比較例1の第2基板202を5枚製作した。 In order to confirm the effect of the outside air communication passage 254, five second boards 202 of Comparative Example 1 in which the outside air communication passage 254 is not arranged were manufactured.

各実施形態では、外気連通路254は1チップ当たり、図1に示すように1つ配置し、又は、図5に示すように2つ配置し、外気連通路254のパターン形状は折り返しパターンとしている。なお、所望のテープ貼り付け条件、保護膜成膜条件などのプロセス条件に応じて形状は適宜設定できる。 In each embodiment, one outside air communication passage 254 is arranged per chip as shown in FIG. 1, or two are arranged as shown in FIG. 5, and the pattern shape of the outside air communication passage 254 is a folded pattern. .. The shape can be appropriately set according to the process conditions such as desired tape application conditions and protective film film forming conditions.

外気連通路254の配置数及び配置箇所は、四隅のうちのいずれかに一箇所、又は四隅の対角の二箇所とすることで、外気連通路254を設けることによる第2基板202の強度低下を抑えることができる。 By arranging the number and location of the outside air communication passage 254 at one of the four corners or at two diagonal points of the four corners, the strength of the second substrate 202 is reduced by providing the outside air communication passage 254. Can be suppressed.

また、実施形態では液体が通らない連通孔253を端子開口部252に接続したが、レイアウトに余裕がなく、液体が通らない連通孔253を設けることができない場合もある。この場合、後工程で外気連通路254を封止する工程を設ければ、本実施形態における共通供給流路58を連通孔として端子開口部252を接続しても、同様の効果を得ることができる。 Further, in the embodiment, the communication hole 253 through which the liquid does not pass is connected to the terminal opening 252, but there may be a case where the communication hole 253 through which the liquid does not pass cannot be provided due to lack of room in the layout. In this case, if a step of sealing the outside air communication passage 254 is provided in a subsequent step, the same effect can be obtained even if the terminal opening 252 is connected by using the common supply flow path 58 in the present embodiment as a communication hole. can.

保護テープを貼りつけた際に、端子開口部252が閉空間にならず、テープの変形によるテープ剥離を抑制できる。第1基板201と貼り合わせる面にパターンを形成してもよいが、貼り合わせる際に接着剤などで埋まらないように注意する必要がある。 When the protective tape is attached, the terminal opening 252 does not become a closed space, and tape peeling due to deformation of the tape can be suppressed. A pattern may be formed on the surface to be bonded to the first substrate 201, but care must be taken not to be filled with an adhesive or the like when bonding.

次に、第2基板202の圧電素子収容部151を形成した面に、フレキソ印刷により接着剤を薄膜転写し、ウェハ接合装置を用いて、第1基板201と第2基板202を加圧/加熱接合し、貼り合わせ基板を50枚製作した。 Next, a thin film of the adhesive is transferred to the surface of the second substrate 202 on which the piezoelectric element accommodating portion 151 is formed by flexographic printing, and the first substrate 201 and the second substrate 202 are pressurized / heated using a wafer bonding device. 50 sheets of bonded boards were manufactured by joining them.

そして、製作した基板を用いて、保護テープ貼り付け後の保護テープ変形の有無、保護膜形成後の外気連通路254を介した成膜ガス侵入の有無、接続抵抗、流動時の基板破損の有無を評価した。 Then, using the manufactured substrate, whether or not the protective tape is deformed after the protective tape is attached, whether or not the film-forming gas invades through the outside air communication passage 254 after the protective film is formed, and whether or not the substrate is damaged during flow. Was evaluated.

保護テープ変形有無の評価に関しては、微小なテープの変形状態をとらえるために、端子開口エリアをマイクロスコープで詳細に観察した。そして、僅かでも保護テープの変形が見られたものに関しては、図6の保護テープ変形欄に、「若干の変形あり」と結果を記載している。 Regarding the evaluation of the presence or absence of deformation of the protective tape, the terminal opening area was observed in detail with a microscope in order to capture the deformation state of the minute tape. Then, for those in which even a slight deformation of the protective tape was observed, the result is described as "there is some deformation" in the protective tape deformation column of FIG.

保護テープの貼り付けは、25℃、100Paの条件で行い、保護膜の形成は、120℃、2Pa、8hの条件で行った。この結果を図6に示している。 The protective tape was attached under the conditions of 25 ° C. and 100 Pa, and the protective film was formed under the conditions of 120 ° C. and 2 Pa and 8 h. This result is shown in FIG.

外気連通路254を設けない比較例1の5枚に関しては、すべてのチップに保護テープの変形、及び、変形部からの成膜ガスの侵入があり、すべてのチップが接続抵抗不良(NG)となった。 Regarding the five chips of Comparative Example 1 in which the outside air communication passage 254 is not provided, all the chips have deformation of the protective tape and intrusion of the film-forming gas from the deformed portion, and all the chips have poor connection resistance (NG). became.

一方で、外気連通路254を設けた基板に関しては、L/Sの値により差が見られた。 On the other hand, with respect to the substrate provided with the outside air communication passage 254, a difference was observed depending on the L / S value.

L/Sの値が1.00〜10.00の実施例5〜7に関しては、保護テープ変形無し、成膜ガス侵入無し、接続抵抗OK、基板の破損無し、という良好な品質が得られた。 For Examples 5 to 7 having an L / S value of 1.00 to 10.00, good qualities such as no deformation of the protective tape, no film formation gas intrusion, connection resistance OK, and no substrate damage were obtained. ..

L/Sの値が0.50の実施例8に関しては、保護テープ変形、基板の破損はなく、接続抵抗もOKであるが、端子開口部252にわずかに成膜ガスの侵入がみられた。 In Example 8 having an L / S value of 0.50, there was no deformation of the protective tape, no damage to the substrate, and the connection resistance was OK, but a slight intrusion of film-forming gas was observed in the terminal opening 252. ..

L/Sの値が15.00、20.00の実施例4、3に関しては、成膜ガス侵入、基板の破損はなく、接続抵抗もOKであるが、わずかに保護テープの変形が見られた。 Regarding Examples 4 and 3 having an L / S value of 15.00 and 20.00, there was no film formation gas intrusion, no substrate damage, and the connection resistance was OK, but slight deformation of the protective tape was observed. rice field.

L/Sの値が0.25の実施例9に関しては、保護テープの変形、基板の破損はなかったが、端子開口部252にわずかに成膜ガスの侵入がみられ、接続抵抗もOKではあったが、規格の上限付近であった。 In Example 9 having an L / S value of 0.25, the protective tape was not deformed and the substrate was not damaged, but a slight intrusion of film-forming gas was observed in the terminal opening 252, and the connection resistance was OK. There was, but it was near the upper limit of the standard.

L/Sの値が30.00の実施例2に関しては、外気連通路254を介した成膜ガス侵入、基板の破損はなかったが、わずかに保護テープが変形し、そこからわずかに端子開口部252への成膜ガス侵入が見られた。接続抵抗に関してはOKではあったが、規格の上限付近であった。 In Example 2 having an L / S value of 30.00, there was no film formation gas intrusion through the outside air communication passage 254 and no damage to the substrate, but the protective tape was slightly deformed and the terminal opening was slightly from there. Intrusion of the film-forming gas into the portion 252 was observed. The connection resistance was OK, but it was near the upper limit of the standard.

L/Sの値が50.00の実施例1に関しては、外気連通路254を介した成膜ガス侵入、基板の破損はなかったが、わずかに保護テープが変形し、そこからわずかに端子開口部252への成膜ガス侵入が見られた。接続抵抗に関してはOKではあったが、実施例2と比べると、さらに上限ぎりぎりOKであった。 In Example 1 having an L / S value of 50.00, there was no intrusion of the film-forming gas through the outside air communication passage 254 and no damage to the substrate, but the protective tape was slightly deformed and the terminal opening was slightly from there. Intrusion of the film-forming gas into the portion 252 was observed. Although the connection resistance was OK, it was OK at the upper limit as compared with Example 2.

以上から、L/Sの値を0.50〜20.00の範囲内にすることで所望の接続抵抗が得られることが分かる。また、L/Sの値を1.00〜10.00の範囲内にすることでよりマージンのある外気連通路254にできることが分かる。また、L/Sの値が0.25〜10.00の範囲内にすることで、マイクロスコープによる観察でも保護テープの僅かの変形も認められない状態にすることができることが分かる。 From the above, it can be seen that a desired connection resistance can be obtained by setting the L / S value within the range of 0.50 to 20.00. Further, it can be seen that the outside air communication passage 254 with a larger margin can be obtained by setting the L / S value within the range of 1.00 to 10.00. Further, it can be seen that by setting the L / S value within the range of 0.25 to 10.00, it is possible to make the protective tape in a state in which no slight deformation is observed even when observed with a microscope.

また、外気連通路254の配置を一箇所、又は対角の2箇所にすることで、いずれの基板にも破損はみられなかった。 Further, by arranging the outside air communication passages 254 at one place or two diagonal places, no damage was observed on any of the substrates.

次に、本発明の第3実施形態について図7ないし図12を参照して説明する。図7は同実施形態に係る液体吐出ヘッドをノズル面側から見た外観斜視説明図、図8は同じくノズル面と反対側から見た外観斜視説明図、図9は同じく分解斜視説明図、図10は同じく流路構成部材の分解斜視説明図、図11は図10の要部拡大斜視説明図、図12は同じく流路部分の断面斜視説明図である。 Next, the third embodiment of the present invention will be described with reference to FIGS. 7 to 12. 7 is an explanatory view of an external perspective of the liquid discharge head according to the same embodiment as viewed from the nozzle surface side, FIG. 8 is an explanatory view of an external perspective seen from the side opposite to the nozzle surface, and FIG. 9 is an explanatory view of an exploded perspective view. 10 is an exploded perspective explanatory view of the flow path constituent member, FIG. 11 is an enlarged perspective explanatory view of a main part of FIG. 10, and FIG. 12 is a cross-sectional perspective explanatory view of the flow path portion.

液体吐出ヘッド1は、ノズル板10と、流路板(個別流路部材)20と、振動板部材30と、共通流路支流部材50と、ダンパ部材60と、共通流路本流部材70、フレーム部材80と、第2基板となる配線部材(フレキシブル配線基板)101などを備えている。配線部材101にはヘッドドライバ(ドライバIC)102が実装されている。本実施形態では、個別流路部材20と振動板部材30とによって第1基板となるアクチュエータ基板2を構成している。 The liquid discharge head 1 includes a nozzle plate 10, a flow path plate (individual flow path member) 20, a diaphragm member 30, a common flow path tributary member 50, a damper member 60, a common flow path mainstream member 70, and a frame. It includes a member 80, a wiring member (flexible wiring board) 101 as a second substrate, and the like. A head driver (driver IC) 102 is mounted on the wiring member 101. In the present embodiment, the individual flow path member 20 and the diaphragm member 30 constitute an actuator board 2 as a first board.

ノズル板10には、液体を吐出する複数のノズル11を有している。複数のノズル11は、二次元状にマトリクス配置されている。 The nozzle plate 10 has a plurality of nozzles 11 for discharging a liquid. The plurality of nozzles 11 are arranged in a two-dimensional matrix.

個別流路部材20は、複数のノズル11に各々連通する複数の圧力室(個別液室)21と、複数の圧力室21に各々通じる複数の個別供給流路22と、複数の圧力室21に各々通じる複数の個別回収流路23とを形成している。1つの圧力室21及びこれに通じる個別供給流路22と個別回収流路23を併せて個別流路25と称する。 The individual flow path member 20 includes a plurality of pressure chambers (individual liquid chambers) 21 communicating with the plurality of nozzles 11, a plurality of individual supply flow paths 22 communicating with the plurality of pressure chambers 21, and a plurality of pressure chambers 21. It forms a plurality of individual collection flow paths 23 that communicate with each other. One pressure chamber 21, an individual supply flow path 22 leading to the pressure chamber 21, and an individual recovery flow path 23 are collectively referred to as an individual flow path 25.

振動板部材30は、圧力室21の変形な可能な壁面である振動板31を形成し、振動板31には圧電素子40が一体に設けられている。また、振動板部材30には、個別供給流路22に通じる供給側開口32と、個別回収流路23に通じる回収側開口33とが形成されている。圧電素子40は、振動板31を変形させて圧力室21内の液体を加圧する圧力発生手段である。 The diaphragm member 30 forms a diaphragm 31 which is a deformable wall surface of the pressure chamber 21, and the diaphragm 31 is integrally provided with a piezoelectric element 40. Further, the diaphragm member 30 is formed with a supply side opening 32 leading to the individual supply flow path 22 and a recovery side opening 33 leading to the individual recovery flow path 23. The piezoelectric element 40 is a pressure generating means that deforms the diaphragm 31 to pressurize the liquid in the pressure chamber 21.

なお、個別流路部材20と振動板部材30とは、部材として別部材であることに限定さるものではない。例えば、SOI(Silicon on Insulator)基板を使用して個別流路部材20及び振動板部材30を同一部材で一体に形成することができる。つまり、シリコン基板上に、シリコン酸化膜、シリコン層、シリコン酸化膜の順に成膜されたSOI基板を使用し、シリコン基板を個別流路部材20とし、シリコン酸化膜、シリコン層及びシリコン酸化膜とで振動板31を形成することができる。この構成では、SOI基板のシリコン酸化膜、シリコン層及びシリコン酸化膜の層構成が振動板部材30となる。このように、振動板部材30は個別流路部材20の表面に成膜された材料で構成されるものを含む。 The individual flow path member 20 and the diaphragm member 30 are not limited to being separate members. For example, the individual flow path member 20 and the diaphragm member 30 can be integrally formed of the same member by using an SOI (Silicon on Insulator) substrate. That is, an SOI substrate in which a silicon oxide film, a silicon layer, and a silicon oxide film are formed in this order on a silicon substrate is used, and the silicon substrate is used as an individual flow path member 20, and the silicon oxide film, the silicon layer, and the silicon oxide film are used. The vibrating plate 31 can be formed with. In this configuration, the layer structure of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate is the diaphragm member 30. As described above, the diaphragm member 30 includes a member made of a material formed on the surface of the individual flow path member 20.

そして、個別流路部材20に設けた貫通孔29Aと振動板部材30に設けた貫通孔29Bによって第1基板であるアクチュエータ基板2を貫通する貫通孔29を形成している。 Then, a through hole 29A provided in the individual flow path member 20 and a through hole 29B provided in the diaphragm member 30 form a through hole 29 penetrating the actuator substrate 2 which is the first substrate.

共通流路支流部材50は、2以上の個別供給流路22に通じる複数の共通供給流路支流52と、2以上の個別回収流路23に通じる複数の共通回収流路支流53とを交互に隣接して形成している。 The common flow path tributary member 50 alternately alternates between a plurality of common supply flow path tributaries 52 leading to two or more individual supply flow paths 22 and a plurality of common recovery flow path tributaries 53 leading to two or more individual recovery flow paths 23. It is formed adjacent to each other.

共通流路支流部材50には、個別供給流路22の供給側開口32と共通供給流路支流52を通じる供給口54となる貫通孔と、個別回収流路23の回収側開口33と共通回収流路支流53を通じる回収口55となる貫通孔が形成されている。 The common flow path tributary member 50 has a through hole serving as a supply port 54 through the supply side opening 32 of the individual supply flow path 22 and the common supply flow path tributary 52, and the recovery side opening 33 of the individual recovery flow path 23 and common recovery. A through hole is formed to serve as a recovery port 55 through the channel tributary 53.

また、共通流路支流部材50は、複数の共通供給流路支流52に通じる1又は複数の共通供給流路本流56の一部56aと、複数の共通回収流路支流53に通じる1又は複数の共通回収流路本流57の一部57aを形成している。 Further, the common flow path tributary member 50 includes one or a part 56a of one or a plurality of common supply flow path main streams 56 leading to the plurality of common supply flow path tributaries 52, and one or a plurality of common flow path tributaries 53 leading to the plurality of common recovery flow path tributaries 53. A part 57a of the common recovery flow path main stream 57 is formed.

共通流路支流部材50は、第1基板であるアクチュエータ基板2と接合する第2基板である。共通流路支流部材50には、アクチュエータ基板2の圧電素子40を収容する収容部151と、アクチュエータ基板2の圧電素子40の端子電極(前記第1実施形態の端子電極44)を露出する端子開口部252とを有する。 The common flow path tributary member 50 is a second substrate to be joined to the actuator substrate 2 which is the first substrate. The common flow path tributary member 50 has a terminal opening that exposes the accommodating portion 151 that houses the piezoelectric element 40 of the actuator substrate 2 and the terminal electrode (terminal electrode 44 of the first embodiment) of the piezoelectric element 40 of the actuator substrate 2. It has a portion 252 and the like.

また、共通流路支流部材50には、アクチュエータ基板2の貫通孔29に通じる連通孔253が設けられ、アクチュエータ基板2との接合面とは反対側に、端子開口部252と連通孔253とを通じる外気連通路254を有している。 Further, the common flow path tributary member 50 is provided with a communication hole 253 communicating with the through hole 29 of the actuator board 2, and the terminal opening 252 and the communication hole 253 are provided on the side opposite to the joint surface with the actuator board 2. It has an outside air communication passage 254 leading to it.

外気連通路254は、連通孔253と端子開口部252との間で折れ曲がりながら蛇腹状に形成されたパターン形状を有し、外気連通路254には、所定の間隔で、複数のガス侵入検知室255が連通している。 The outside air communication passage 254 has a pattern shape formed in a bellows shape while bending between the communication hole 253 and the terminal opening 252, and the outside air communication passage 254 has a plurality of gas intrusion detection chambers at predetermined intervals. 255 communicates.

ダンパ部材60は、共通供給流路支流52の供給口54と対面する(対向する)供給側ダンパ62と、共通回収流路支流53の回収口55と対面する(対向する)回収側ダンパ63を有している。 The damper member 60 has a supply-side damper 62 facing (opposing) the supply port 54 of the common supply flow path tributary 52 and a collection-side damper 63 facing (opposing) the collection port 55 of the common recovery flow path tributary 53. Have.

ここで、共通供給流路支流52及び共通回収流路支流53は、同じ部材である共通流路支流部材50に交互に並べて配列された溝部を、変形可能な壁面を形成するダンパ部材60で封止することで構成している。 Here, in the common supply flow path tributary 52 and the common recovery flow path tributary 53, the grooves arranged alternately in the common flow path tributary member 50, which are the same members, are sealed with a damper member 60 forming a deformable wall surface. It consists of stopping.

共通流路本流部材70は、複数の共通供給流路支流52に通じる共通供給流路本流56と、複数の共通回収流路支流53に通じる共通回収流路本流57を形成する。 The common flow path mainstream member 70 forms a common supply flow path main stream 56 leading to the plurality of common supply flow path tributaries 52 and a common recovery flow path main stream 57 leading to the plurality of common recovery flow path tributaries 53.

フレーム部材80には、通供給流路本流56の一部56bと、共通回収流路本流57の一部57bが形成されている。共通供給流路本流56の一部56bはフレーム部材80に設けた供給ポート81に通じ、共通回収流路本流57の一部57bはフレーム部材80に設けた回収ポート82に通じている。 The frame member 80 is formed with a part 56b of the main stream 56 of the flow supply flow path and a part 57b of the main stream 57 of the common recovery flow path. A part 56b of the common supply flow path main stream 56 leads to a supply port 81 provided in the frame member 80, and a part 57b of the common recovery flow path main stream 57 leads to a recovery port 82 provided in the frame member 80.

このように構成したので、前記第1実施形態と同様に、圧力発生手段に通じる端子電極に保護膜が成膜されることが防止され、電気的接続の信頼性が向上する。 With this configuration, as in the first embodiment, it is possible to prevent a protective film from being formed on the terminal electrodes leading to the pressure generating means, and the reliability of the electrical connection is improved.

次に、本発明に係る液体を吐出する装置の一例について図13及び図14を参照して説明する。図13は同装置の概略説明図、図14は同装置のヘッドユニットの一例の平面説明図である。 Next, an example of the device for discharging the liquid according to the present invention will be described with reference to FIGS. 13 and 14. FIG. 13 is a schematic explanatory view of the device, and FIG. 14 is a plan view of an example of the head unit of the device.

この液体を吐出する装置である印刷装置500は、連続体510を搬入する搬入手段501と、搬入手段501から搬入された連帳紙、シート材などの連続体510を印刷手段505に案内搬送する案内搬送手段503と、連続体510に対して液体を吐出して画像を形成する印刷を行う印刷手段505と、連続体510を乾燥する乾燥手段507と、連続体510を搬出する搬出手段509などを備えている。 The printing device 500, which is a device for discharging this liquid, guides and conveys the carrying-in means 501 for carrying in the continuous body 510 and the continuous body 510 such as continuous book paper and sheet material carried in from the carrying-in means 501 to the printing means 505. Guidance transport means 503, printing means 505 that discharges liquid to the continuum 510 to form an image, drying means 507 that dries the continuum 510, carry-out means 509 that carries out the continuum 510, and the like. It is equipped with.

連続体510は搬入手段501の元巻きローラ511から送り出され、搬入手段501、案内搬送手段503、乾燥手段507、搬出手段509の各ローラによって案内、搬送されて、搬出手段509の巻取りローラ591にて巻き取られる。 The continuous body 510 is sent out from the original winding roller 511 of the carrying-in means 501, guided and conveyed by the rollers of the carrying-in means 501, the guiding and transporting means 503, the drying means 507, and the carrying-out means 509, and is guided and conveyed by the winding roller 591 of the carrying-out means 509. It is wound up at.

この連続体510は、印刷手段505において、搬送ガイド部材559上を吐出ユニット550及び吐出ユニット555に対向して搬送され、吐出ユニット550から吐出される液体によって画像が形成され、吐出ユニット555から吐出される処理液で後処理が行われる。 In the printing means 505, the continuous body 510 is conveyed on the transfer guide member 559 facing the discharge unit 550 and the discharge unit 555, an image is formed by the liquid discharged from the discharge unit 550, and the continuous body 510 is discharged from the discharge unit 555. Post-treatment is performed with the treatment liquid to be treated.

ここで、吐出ユニット550には、例えば、搬送方向上流側から、4色分のフルライン型ヘッドアレイ551A、551B、551C、551D(以下、色の区別しないときは「ヘッドアレイ551」という。)が配置されている。 Here, the discharge unit 550 is, for example, a full-line head array 551A, 551B, 551C, 551D for four colors from the upstream side in the transport direction (hereinafter, referred to as "head array 551" when the colors are not distinguished). Is placed.

各ヘッドアレイ551は、液体吐出手段であり、それぞれ、搬送される連続体510に対してブラックK,シアンC、マゼンタM、イエローYの液体を吐出する。なお、色の種類及び数はこれに限るものではない。 Each head array 551 is a liquid discharging means, and discharges black K, cyan C, magenta M, and yellow Y liquids to the conveyed continuum 510, respectively. The types and numbers of colors are not limited to this.

ヘッドアレイ551は、例えば、本発明に係る液体吐出ヘッド(これを、単に「ヘッド」ともいう。)100をベース部材552上に千鳥状に並べて配置したものであるが、これに限らない。 The head array 551 is, for example, arranged with the liquid discharge heads (which are also simply referred to as “heads”) 100 according to the present invention arranged in a staggered pattern on the base member 552, but is not limited to this.

なお、上記実施形態においては、貼り合わせ基板が液体吐出ヘッドを構成部材である例で説明しているが、これに限るものではない。つまり、端子電極を含む第1基板と、第1基板の端子電極を露出させる端子電極開口部を有する第2基板とを接合した貼り合わせ基板において、第1基板には、第1基板を貫通する貫通孔が設けられ、第2基板には、第1基板の貫通孔に通じる連通孔が設けられ、第2基板には、第1基板との接合面とは反対側に、端子電極開口部と連通孔とを通じる外気連通路を有し、外気連通路は、第2基板の四隅のいずれか一箇所、又は、対角の二箇所に設けられている構成とする。 In the above embodiment, the liquid discharge head is described as an example in which the bonded substrate is a constituent member, but the present invention is not limited to this. That is, in a bonded substrate in which a first substrate including a terminal electrode and a second substrate having a terminal electrode opening for exposing the terminal electrodes of the first substrate are bonded, the first substrate penetrates the first substrate. A through hole is provided, the second substrate is provided with a communication hole leading to the through hole of the first substrate, and the second substrate has a terminal electrode opening on the side opposite to the joint surface with the first substrate. It has an outside air communication passage that passes through the communication hole, and the outside air communication passage is configured to be provided at any one of the four corners of the second substrate or at two diagonal locations.

このような貼り合わせ基板としては、例えば半導体基板などを挙げることができる。 Examples of such bonded substrates include semiconductor substrates.

これにより、電気的接続の信頼性を向上できる。 This can improve the reliability of the electrical connection.

本願において、吐出される液体は、ヘッドから吐出可能な粘度や表面張力を有するものであればよく、特に限定されないが、常温、常圧下において、または加熱、冷却により粘度が30mPa・s以下となるものであることが好ましい。より具体的には、水や有機溶媒等の溶媒、染料や顔料等の着色剤、重合性化合物、樹脂、界面活性剤等の機能性付与材料、DNA、アミノ酸やたんぱく質、カルシウム等の生体適合材料、天然色素等の可食材料、などを含む溶液、懸濁液、エマルジョンなどであり、これらは例えば、インクジェット用インク、表面処理液、電子素子や発光素子の構成要素や電子回路レジストパターンの形成用液、3次元造形用材料液等の用途で用いることができる。 In the present application, the liquid to be discharged may have a viscosity and surface tension that can be discharged from the head, and is not particularly limited, but the viscosity becomes 30 mPa · s or less at room temperature, under normal pressure, or by heating or cooling. It is preferable that it is a thing. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, functionalizable materials such as polymerizable compounds, resins and surfactants, biocompatible materials such as DNA, amino acids and proteins, and calcium. , Solvents, suspensions, emulsions, etc. containing edible materials such as natural dyes, etc., for example, inks for inkjets, surface treatment liquids, components of electronic elements and light emitting elements, and formation of electronic circuit resist patterns. It can be used in applications such as liquids and material liquids for three-dimensional modeling.

液体を吐出するエネルギー発生源(圧力発生手段)として、圧電アクチュエータ(積層型圧電素子及び薄膜型圧電素子)、発熱抵抗体などの電気熱変換素子を用いるサーマルアクチュエータ、振動板と対向電極からなる静電アクチュエータなどを使用するものが含まれる。 As an energy generation source (pressure generating means) for discharging liquid, a piezoelectric actuator (laminated piezoelectric element and thin film piezoelectric element), a thermal actuator using an electric heat conversion element such as a heat generating resistor, and a static electricity plate and a counter electrode are composed of a vibration plate and a counter electrode. Those that use electric actuators are included.

「吐出ユニット」は、液体吐出ヘッドに機能部品、機構が一体化したものであり、液体の吐出に関連する部品の集合体が含まれる。例えば、「吐出ユニット」は、ヘッドタンク、キャリッジ、供給機構、維持回復機構、主走査移動機構、液体循環装置の構成の少なくとも一つを液体吐出ヘッドと組み合わせたものなどが含まれる。 The "discharge unit" is a liquid discharge head integrated with functional parts and a mechanism, and includes a collection of parts related to liquid discharge. For example, the "discharge unit" includes a head tank, a carriage, a supply mechanism, a maintenance / recovery mechanism, a main scanning movement mechanism, a liquid circulation device in which at least one of the configurations is combined with a liquid discharge head, and the like.

ここで、一体化とは、例えば、液体吐出ヘッドと機能部品、機構が、締結、接着、係合などで互いに固定されているもの、一方が他方に対して移動可能に保持されているものを含む。また、液体吐出ヘッドと、機能部品、機構が互いに着脱可能に構成されていても良い。 Here, the term "integration" means, for example, a liquid discharge head and a functional component, a mechanism in which the mechanism is fixed to each other by fastening, bonding, engagement, etc., or one in which one is movably held with respect to the other. include. Further, the liquid discharge head, the functional component, and the mechanism may be configured to be detachable from each other.

例えば、吐出ユニットとして、液体吐出ヘッドとヘッドタンクが一体化されているものがある。また、チューブなどで互いに接続されて、液体吐出ヘッドとヘッドタンクが一体化されているものがある。ここで、これらの吐出ユニットのヘッドタンクと液体吐出ヘッドとの間にフィルタを含むユニットを追加することもできる。 For example, as a discharge unit, there is a unit in which a liquid discharge head and a head tank are integrated. In some cases, the liquid discharge head and the head tank are integrated by being connected to each other by a tube or the like. Here, a unit including a filter can be added between the head tank of these discharge units and the liquid discharge head.

また、吐出ユニットとして、液体吐出ヘッドとキャリッジが一体化されているものがある。 Further, as a discharge unit, there is a unit in which a liquid discharge head and a carriage are integrated.

また、吐出ユニットとして、液体吐出ヘッドを走査移動機構の一部を構成するガイド部材に移動可能に保持させて、液体吐出ヘッドと走査移動機構が一体化されているものがある。また、液体吐出ヘッドとキャリッジと主走査移動機構が一体化されているものがある。 Further, there is a discharge unit in which the liquid discharge head and the scanning movement mechanism are integrated by holding the liquid discharge head movably by a guide member constituting a part of the scanning movement mechanism. In some cases, the liquid discharge head, the carriage, and the main scanning movement mechanism are integrated.

また、吐出ユニットとして、液体吐出ヘッドが取り付けられたキャリッジに、維持回復機構の一部であるキャップ部材を固定させて、液体吐出ヘッドとキャリッジと維持回復機構が一体化されているものがある。 Further, as a discharge unit, there is a carriage to which a liquid discharge head is attached, in which a cap member which is a part of the maintenance / recovery mechanism is fixed, and the liquid discharge head, the carriage, and the maintenance / recovery mechanism are integrated.

また、吐出ユニットとして、ヘッドタンク若しくは流路部品が取付けられた液体吐出ヘッドにチューブが接続されて、液体吐出ヘッドと供給機構が一体化されているものがある。このチューブを介して、液体貯留源の液体が液体吐出ヘッドに供給される。 Further, as a discharge unit, there is a unit in which a tube is connected to a head tank or a liquid discharge head to which a flow path component is attached, and the liquid discharge head and a supply mechanism are integrated. The liquid of the liquid storage source is supplied to the liquid discharge head through this tube.

主走査移動機構は、ガイド部材単体も含むものとする。また、供給機構は、チューブ単体、装填部単体も含むものする。 The main scanning movement mechanism shall include a single guide member. Further, the supply mechanism includes a single tube and a single loading unit.

なお、ここでは、「吐出ユニット」について、液体吐出ヘッドとの組み合わせで説明しているが、「吐出ユニット」には上述した液体吐出ヘッドを含むヘッドモジュールやヘッドユニットと上述したような機能部品、機構が一体化したものも含まれる。 Although the "discharge unit" is described here in combination with the liquid discharge head, the "discharge unit" includes a head module or head unit including the above-mentioned liquid discharge head and functional parts as described above. The one with integrated mechanism is also included.

「液体を吐出する装置」には、液体吐出ヘッド、吐出ユニット、ヘッドモジュール、ヘッドユニットなどを備え、液体吐出ヘッドを駆動させて液体を吐出させる装置が含まれる。液体を吐出する装置には、液体が付着可能なものに対して液体を吐出することが可能な装置だけでなく、液体を 気中や液中に向けて吐出する装置も含まれる。 The "device for discharging a liquid" includes a device including a liquid discharge head, a discharge unit, a head module, a head unit, and the like, and driving the liquid discharge head to discharge the liquid. The device for discharging a liquid includes not only a device capable of discharging a liquid to a device to which the liquid can adhere, but also a device for discharging the liquid into the air or into the liquid.

この「液体を吐出する装置」は、液体が付着可能なものの給送、搬送、排紙に係わる手段、その他、前処理装置、後処理装置なども含むことができる。 The "device for discharging the liquid" can also include means for feeding, transporting, and discharging paper to which the liquid can adhere, as well as a pretreatment device, a posttreatment device, and the like.

例えば、「液体を吐出する装置」として、インクを吐出させて用紙に画像を形成する装置である画像形成装置、立体造形物(三次元造形物)を造形するために、粉体を層状に形成した粉体層に造形液を吐出させる立体造形装置(三次元造形装置)がある。 For example, as a "device that ejects a liquid", an image forming device that is a device that ejects ink to form an image on paper, and a three-dimensional object (three-dimensional object) are formed in layers in order to form a three-dimensional object. There is a three-dimensional modeling device (three-dimensional modeling device) that discharges the modeling liquid into the powder layer.

また、「液体を吐出する装置」は、吐出された液体によって文字、図形等の有意な画像が可視化されるものに限定されるものではない。例えば、それ自体意味を持たないパターン等を形成するもの、三次元像を造形するものも含まれる。 Further, the "device for discharging a liquid" is not limited to a device in which a significant image such as characters and figures is visualized by the discharged liquid. For example, those that form patterns that have no meaning in themselves and those that form a three-dimensional image are also included.

上記「液体が付着可能なもの」とは、液体が少なくとも一時的に付着可能なものであって、付着して固着するもの、付着して浸透するものなどを意味する。具体例としては、用紙、記録紙、記録用紙、フィルム、布などの被記録媒体、電子基板、圧電素子などの電子部品、粉体層(粉末層)、臓器モデル、検査用セルなどの媒体であり、特に限定しない限り、液体が付着するすべてのものが含まれる。 The above-mentioned "thing to which a liquid can adhere" means a material to which a liquid can adhere at least temporarily, such as a material to which the liquid adheres and adheres, and a material to which the liquid adheres and permeates. Specific examples include paper, recording paper, recording paper, film, recorded media such as cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers (powder layers), organ models, and media such as inspection cells. Yes, and includes everything to which the liquid adheres, unless otherwise specified.

上記「液体が付着可能なもの」の材質は、紙、糸、繊維、布帛、皮革、金属、プラスチック、ガラス、木材、セラミックスなど液体が一時的でも付着可能であればよい。 The material of the above-mentioned "material to which a liquid can adhere" may be paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics or the like as long as the liquid can adhere even temporarily.

また、「液体を吐出する装置」は、液体吐出ヘッドと液体が付着可能なものとが相対的に移動する装置があるが、これに限定するものではない。具体例としては、液体吐出ヘッドを移動させるシリアル型装置、液体吐出ヘッドを移動させないライン型装置などが含まれる。 Further, the "device for discharging the liquid" includes, but is not limited to, a device in which the liquid discharge head and the device to which the liquid can adhere move relatively. Specific examples include a serial type device that moves the liquid discharge head, a line type device that does not move the liquid discharge head, and the like.

また、「液体を吐出する装置」としては、他にも、用紙の表面を改質するなどの目的で用紙の表面に処理液を塗布するために処理液を用紙に吐出する処理液塗布装置、原材料を溶液中に分散した組成液を、ノズルを介して噴射させて原材料の微粒子を造粒する噴射造粒装置などがある。 In addition, as a "device for ejecting a liquid", a treatment liquid coating device for ejecting a treatment liquid to the paper in order to apply the treatment liquid to the surface of the paper for the purpose of modifying the surface of the paper, etc. There is an injection granulation device that granulates fine particles of raw materials by injecting a composition liquid in which raw materials are dispersed in a solution through a nozzle.

なお、本願の用語における、画像形成、記録、印字、印写、印刷、造形等はいずれも同義語とする。 In addition, in the term of this application, image formation, recording, printing, printing, printing, modeling, etc. are all synonymous.

1 液体吐出ヘッド
2 アクチュエータ基板(第1基板)
10 ノズル板
11 ノズル
20 個別流路部材
21 圧力室
22 個別供給流路
23 個別回収流路
30 振動板部材
40 圧電素子
50 共通流路部材
52 共通供給流路支流
53 共通回収流路支流
56 共通供給流路本流
57 共通回収流路本流
101 配線部材(第2基板)
201 第1基板
202 第2基板
203 異方性導電膜
212 配線電極
213 第1絶縁膜
214 第2絶縁膜
222 配線電極
500 印刷装置(液体を吐出する装置)
550 吐出ユニット
1 Liquid discharge head 2 Actuator board (first board)
10 Nozzle plate 11 Nozzle 20 Individual flow path member 21 Pressure chamber 22 Individual supply flow path 23 Individual recovery flow path 30 Diaphragm member 40 Piezoelectric element 50 Common flow path member 52 Common supply flow path tributary 53 Common recovery flow path tributary 56 Common supply Channel main stream 57 Common recovery channel main stream 101 Wiring member (second substrate)
201 1st substrate 202 2nd substrate 203 anisotropic conductive film 212 wiring electrode 213 1st insulating film 214 2nd insulating film 222 wiring electrode 500 Printing device (device for discharging liquid)
550 discharge unit

Claims (9)

液体を吐出するノズルに通じる圧力室を加圧する圧力発生手段と、
前記圧力発生手段に接続された端子電極と、を含む第1基板と、
前記第1基板に接合され、前記端子電極を露出させる端子電極開口部を有する第2基板と、を備え、
前記第1基板には、前記第1基板を貫通する貫通孔が設けられ、
前記第2基板には、前記第1基板の前記貫通孔に通じる連通孔が設けられ、
前記第2基板には、前記第1基板との接合面とは反対側に、前記端子電極開口部と前記連通孔とを通じる外気連通路を有し、
前記外気連通路は、前記第2基板の四隅のいずれか一箇所、又は、対角の二箇所に設けられている
ことを特徴とする液体吐出ヘッド。
A pressure generating means that pressurizes the pressure chamber leading to the nozzle that discharges the liquid,
A first substrate including a terminal electrode connected to the pressure generating means,
A second substrate bonded to the first substrate and having a terminal electrode opening for exposing the terminal electrode is provided.
The first substrate is provided with a through hole that penetrates the first substrate.
The second substrate is provided with a communication hole leading to the through hole of the first substrate.
The second substrate has an outside air communication passage through the terminal electrode opening and the communication hole on the side opposite to the joint surface with the first substrate.
The liquid discharge head is characterized in that the outside air communication passage is provided at any one of the four corners of the second substrate or at two diagonal locations.
前記外気連通路は、断面積をS、長さをL、とするとき、L/Sが0.50〜20.00の範囲内である
ことを特徴とする請求項1に記載の液体吐出ヘッド。
The liquid discharge head according to claim 1, wherein the outside air communication passage has an L / S in the range of 0.50 to 20.00 when the cross-sectional area is S and the length is L. ..
前記外気連通路は、断面積をS、長さをL、とするとき、L/Sが1.00〜10.00の範囲内である
ことを特徴とする請求項1に記載の液体吐出ヘッド。
The liquid discharge head according to claim 1, wherein the outside air communication passage has an L / S in the range of 1.00 to 10.00 when the cross-sectional area is S and the length is L. ..
前記第1基板の前記貫通孔は、前記液体の流路とは独立している
ことを特徴とする請求項1ないし3のいずれかに記載の液体吐出ヘッド。
The liquid discharge head according to any one of claims 1 to 3, wherein the through hole of the first substrate is independent of the liquid flow path.
前記第2基板の前記外気連通路には、前記外気連通路の幅以上のガス侵入検知室が連通している
ことを特徴とする請求項1ないし4のいずれかに記載の液体吐出ヘッド。
The liquid discharge head according to any one of claims 1 to 4, wherein a gas intrusion detection chamber having a width equal to or larger than the width of the outside air communication passage communicates with the outside air communication passage of the second substrate.
前記ガス侵入検知室は、所定の間隔で複数配置されている
ことを特徴とする請求項5に記載の液体吐出ヘッド。
The liquid discharge head according to claim 5, wherein a plurality of the gas intrusion detection chambers are arranged at predetermined intervals.
請求項1ないし6のいずれかに記載の液体吐出ヘッドを備えている
ことを特徴とする吐出ユニット。
A discharge unit including the liquid discharge head according to any one of claims 1 to 6.
請求項1ないし6のいずれかに記載の液体吐出ヘッド、又は、請求項7に記載の吐出ユニットを備えている
ことを特徴とする液体を吐出する装置。
A device for discharging a liquid, which comprises the liquid discharge head according to any one of claims 1 to 6 or the discharge unit according to claim 7.
端子電極を含む第1基板と、
前記第1基板に接合され、前記端子電極を露出させる端子電極開口部を有する第2基板と、を備え、
前記第1基板には、前記第1基板を貫通する貫通孔が設けられ、
前記第2基板には、前記第1基板の前記貫通孔に通じる連通孔が設けられ、
前記第2基板には、前記第1基板との接合面とは反対側に、前記端子電極開口部と前記連通孔とを通じる外気連通路を有し、
前記外気連通路は、前記第2基板の四隅のいずれか一箇所、又は、対角の二箇所に設けられている
ことを特徴とする貼り合わせ基板。
The first substrate including the terminal electrodes and
A second substrate bonded to the first substrate and having a terminal electrode opening for exposing the terminal electrode is provided.
The first substrate is provided with a through hole that penetrates the first substrate.
The second substrate is provided with a communication hole leading to the through hole of the first substrate.
The second substrate has an outside air communication passage through the terminal electrode opening and the communication hole on the side opposite to the joint surface with the first substrate.
The bonded substrate is characterized in that the outside air communication passage is provided at any one of the four corners of the second substrate or at two diagonal locations.
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