JP2021068863A - Device, liquid discharge head, discharge unit, and liquid discharge device - Google Patents

Abstract

To suppress the reduction of conductor particles when connecting with an anisotropic conductive film.SOLUTION: In a first substrate 201, a plurality of wiring electrodes 212 are arranged side by side on the surface of a base member 211, and a first insulating film 213 is provided between adjacent wiring electrodes 212 of the first substrate 201, and the first insulating film 213 is provided over a side surface 212c of the wiring electrode 212 and an edge portion 212c of the surface 212a of the wiring electrode 212 in the alignment direction of the wiring electrodes 212 (electrode alignment direction).SELECTED DRAWING: Figure 3

Description

The present invention relates to a device, a liquid discharge head, a discharge unit, and a device for discharging a liquid.

There are devices that use anisotropic conductive film (AFC) to connect the wiring electrodes of a flexible substrate or a rigid substrate.

Conventionally, the bump on the lower surface of the IC chip and the wiring provided on the substrate surface are connected by heating and pressurizing through an anisotropic conductive film in which a large number of fine conductive particles are dispersed. It is known that an insulating film having a small opening and an insulating film for suppressing the outflow of conductive particles from under the bump during heating and pressurization is provided by the end of the opening (Patent Document 1).

Japanese Unexamined Patent Publication No. 09-244047

By the way, for example, when the wiring electrodes of the substrate and the wiring member are connected by an anisotropic conductive film, there is a problem that the conductor particles are flown together with the resin by heating and pressurizing, and the amount of the conductor particles captured is reduced.

The present invention has been made in view of the above problems, and an object of the present invention is to suppress a decrease in conductor particles when connecting with an anisotropic conductive film.

In order to solve the above problems, the device according to the present invention is
Multiple wiring electrodes are arranged side by side,
A first insulating film is provided between the adjacent wiring electrodes.
The first insulating film is provided over the side surface of the wiring electrode and the edge of the surface of the wiring electrode in the arrangement direction of the wiring electrode.

According to the present invention, it is possible to suppress a decrease in conductor particles when connecting with an anisotropic conductive film.

It is a plane explanatory view of the 1st substrate which is the device which concerns on 1st Embodiment of this invention. Similarly, it is a cross-sectional explanatory view along the line AA of FIG. 1 in the state before the connection between the first substrate and the second substrate. Similarly, it is a cross-sectional explanatory view along the line AA of FIG. 1 in the state after the connection between the first substrate and the second substrate. It is a plane explanatory view of the 1st substrate which is the device which concerns on 2nd Embodiment of this invention. It is an external perspective explanatory view of the liquid discharge head which concerns on 3rd Embodiment of this invention as seen from the nozzle surface side. Similarly, it is an external perspective explanatory view seen from the side opposite to the nozzle surface. It is also an exploded perspective explanatory view. Similarly, it is an exploded perspective explanatory view of the flow path constituent member. FIG. 8 is an enlarged perspective explanatory view of a main part of FIG. Similarly, it is a cross-sectional perspective explanatory view of the flow path portion. It is the schematic explanatory drawing of an example of the apparatus which discharges a liquid which concerns on this invention. It is a plane explanatory view of an example of the head unit of the same apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan explanatory view of a first substrate which is a device according to the same embodiment. FIG. 2 is an explanatory cross-sectional view taken along the line AA of FIG. 1 in the state before the connection between the first substrate and the second substrate, and FIG. 3 is a diagram of the state after the connection between the first substrate and the second substrate. It is sectional drawing which follows the AA line of 1.

In the first substrate 201, a plurality of wiring electrodes (BUMP) 212 are arranged side by side on the surface of the base member (base material) 211. A first insulating film 213 is provided between the adjacent wiring electrodes 212 and 212 of the first substrate 201.

The first insulating film 213 is provided over the side surface 212c of the wiring electrode 212 and the edge portion 212b of the surface 212a of the wiring electrode 212 in the alignment direction of the wiring electrodes 212 (electrode alignment direction).

In the present embodiment, as shown in FIGS. 2 and 3, the first insulating film 213 is also formed on the surface (board surface) 211a between the wiring electrodes 212 and 212 of the base member 211 (in FIG. 1). It is omitted for the sake of clarity.)

Further, the first insulating film 213 is also provided on the end surface 212d of the wiring electrode 212 in a direction orthogonal to the alignment direction (electrode alignment direction) of the wiring electrodes 212.

Then, in the present embodiment, the second substrate 202 is connected to the first substrate 201 via the anisotropic conductive film 203.

In the second substrate 202, a plurality of wiring electrodes (BUMP) 222 are arranged side by side on the surface of a base member (base material) 221 such as a film member.

In the anisotropic conductive film 203, a large number of conductor particles (conductive particles, metal particles) 232 are dispersed in the binder 231.

In the present embodiment, when the wiring electrode 212 of the first substrate 201 and the wiring electrode 222 of the second substrate 202 are connected via the anisotropic conductive film 203, the first substrate 201 and the first substrate 201 and the second substrate 202 are connected as shown in FIG. An anisotropic conductive film 203 is sandwiched between the two substrates 202 and heated and pressurized.

As a result, as shown in FIG. 3, the conductor particles 232 of the anisotropic conductive film 203 are crushed by the wiring electrode 212 of the first substrate 201 and the wiring electrode 222 of the second substrate 202, and the first substrate 201 The wiring electrode 212 and the wiring electrode 222 of the second substrate 202 are electrically connected.

Here, when the binder 231 of the anisotropic conductive film 203 is swept away from under the wiring electrode 222 of the second substrate 202 during heating and pressurization, the conductor particles 232 that tend to flow out between the wiring electrodes 222 and 222. Occurs.

At this time, the conductor particles 232 that are about to flow out between the wiring electrodes 222 and 222 are easily caught between the wiring electrodes 212 and the wiring electrodes 222 (easily staying) by being caught at the end of the first insulating film 213. .).

As a result, the decrease of the conductor particles 232 between the wiring electrode 212 of the first substrate 201 and the wiring electrode 222 of the second substrate 202 is suppressed, and good electrical characteristics can be obtained.

Next, the second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan explanatory view of a first substrate which is a device according to the same embodiment.

In the present embodiment, a second insulating film 214 is provided on the surface of the wiring electrode 212 of the first substrate 201 along the arrangement direction of the wiring electrodes 212. At this time, the second insulating film 214 crosses the wiring electrode 212. As a result, the surface of the wiring electrode 212 has an opening 215 surrounded by the first insulating film 213 and the second insulating film 214.

Further, the thickness of the first insulating film 213 provided at the edge of the surface of the wiring electrode 212 and the thickness of the second insulating film 214 are the same.

According to the present embodiment, the conductor particles 232 flowing out in the longitudinal direction of the wiring electrodes 212 and 222 can be hooked by the second insulating film 214, and the amount of the conductor particles 232 captured can be further increased, which is an electrical characteristic. Can be further improved.

The height (thickness) of the first insulating film 213 and the second insulating film 214 is about 1/8 of the diameter of the conductor particles 232. For example, when the diameter of the conductor particles 232 is 4 μm, it is about 0.5 μm. Further, the first insulating film 213 and the second insulating film 214 are all formed of a passivation film formed for surface protection with the same thickness.

Next, the third embodiment of the present invention will be described with reference to FIGS. 5 to 10. 5 is an explanatory view of an external perspective of the liquid discharge head according to the same embodiment as viewed from the nozzle surface side, FIG. 6 is an explanatory view of an external perspective seen from the side opposite to the nozzle surface, and FIG. 7 is an explanatory view of an exploded perspective view. 8 is an exploded perspective explanatory view of the flow path constituent member, FIG. 9 is an enlarged perspective explanatory view of a main part of FIG. 8, and FIG. 10 is a cross-sectional perspective explanatory view of the flow path portion.

The liquid discharge head 1 includes a nozzle plate 10, a flow path plate (individual flow path member) 20, a diaphragm member 30, a common flow path tributary member 50, a damper member 60, a common flow path mainstream member 70, and a frame. It includes a member 80, a wiring member (flexible wiring board) 101 as a second substrate, and the like. A head driver (driver IC) 102 is mounted on the wiring member 101. In the present embodiment, the individual flow path member 20 and the diaphragm member 30 constitute an actuator substrate to be the first substrate.

The nozzle plate 10 has a plurality of nozzles 11 for discharging a liquid. The plurality of nozzles 11 are arranged in a two-dimensional matrix.

The individual flow path member 20 is provided in a plurality of pressure chambers (individual liquid chambers) 21 communicating with the plurality of nozzles 11, a plurality of individual supply flow paths 22 communicating with the plurality of pressure chambers 21, and a plurality of pressure chambers 21. A plurality of individual collection flow paths 23 that communicate with each other are formed. One pressure chamber 21, an individual supply flow path 22 leading to the pressure chamber 21, and an individual recovery flow path 23 are collectively referred to as an individual flow path 25.

The diaphragm member 30 forms a diaphragm 31 which is a deformable wall surface of the pressure chamber 21, and the piezoelectric element 40 is integrally provided on the diaphragm 31. Further, the diaphragm member 30 is formed with a supply side opening 32 leading to the individual supply flow path 22 and a recovery side opening 33 leading to the individual recovery flow path 23. The piezoelectric element 40 is a pressure generating means that deforms the diaphragm 31 to pressurize the liquid in the pressure chamber 21.

The individual flow path member 20 and the diaphragm member 30 are not limited to being separate members. For example, the individual flow path member 20 and the diaphragm member 30 can be integrally formed of the same member by using an SOI (Silicon on Insulator) substrate. That is, an SOI substrate in which a silicon oxide film, a silicon layer, and a silicon oxide film are formed on the silicon substrate in this order is used, and the silicon substrate is used as an individual flow path member 20, and the silicon oxide film, the silicon layer, and the silicon oxide film are formed. The vibrating plate 31 can be formed with. In this configuration, the layer structure of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate is the diaphragm member 30. As described above, the diaphragm member 30 includes a member made of a material formed on the surface of the individual flow path member 20.

The common flow path tributary member 50 alternately alternates between a plurality of common supply flow path tributaries 52 leading to two or more individual supply flow paths 22 and a plurality of common recovery flow path tributaries 53 leading to two or more individual recovery flow paths 23. It is formed adjacent to each other.

The common flow path tributary member 50 has a through hole serving as a supply port 54 through the supply side opening 32 of the individual supply flow path 22 and the common supply flow path tributary 52, and a common recovery with the recovery side opening 33 of the individual recovery flow path 23. A through hole is formed to serve as a recovery port 55 through the flow path tributary 53.

Further, the common flow path tributary member 50 is a part 56a of one or a plurality of common supply flow path main streams 56 leading to the plurality of common supply flow path tributaries 52, and one or a plurality of common flow path tributaries 53 leading to the plurality of common recovery flow path tributaries 53. A part 57a of the common recovery flow path main stream 57 is formed.

The damper member 60 has a supply side damper 62 facing (opposing) the supply port 54 of the common supply flow path tributary 52 and a recovery side damper 63 facing (opposing) the recovery port 55 of the common recovery flow path tributary 53. Have.

Here, the common supply flow path tributary 52 and the common recovery flow path tributary 53 seal the grooves arranged alternately in the common flow path tributary member 50, which are the same members, with a damper member 60 forming a deformable wall surface. It consists of stopping.

The common flow path mainstream member 70 forms a common supply flow path main stream 56 leading to the plurality of common supply flow path tributaries 52 and a common recovery flow path main stream 57 leading to the plurality of common recovery flow path tributaries 53.

The frame member 80 is formed with a part 56b of the main stream 56 of the flow supply flow path and a part 57b of the main stream 57 of the common recovery flow path. A part 56b of the common supply flow path main stream 56 leads to a supply port 81 provided in the frame member 80, and a part 57b of the common recovery flow path main stream 57 leads to a recovery port 82 provided in the frame member 80.

Then, in the present embodiment, the actuator substrate 2 is used as the first substrate, the wiring member 101 is used as the second substrate, and the wiring electrode connected to the piezoelectric element 40 of the actuator substrate 2 and the wiring electrode of the wiring member 101 are anisotropically conductive. It is electrically connected via a membrane.

As a result, the piezoelectric element 40 of the actuator board 2 and the wiring member 101 can be satisfactorily electrically connected.

Next, an example of the device for discharging the liquid according to the present invention will be described with reference to FIGS. 11 and 12. FIG. 11 is a schematic explanatory view of the device, and FIG. 12 is a plan explanatory view of an example of the head unit of the device.

The printing device 500, which is a device for discharging this liquid, guides and conveys the carry-in means 501 for carrying in the continuous body 510 and the continuous body 510 such as the continuous book paper and the sheet material carried in from the carry-in means 501 to the printing means 505. Guidance transport means 503, printing means 505 that discharges liquid to the continuum 510 to form an image, drying means 507 that dries the continuum 510, carry-out means 509 that carries out the continuum 510, and the like. It has.

The continuum 510 is sent out from the original winding roller 511 of the carrying-in means 501, guided and conveyed by the rollers of the carrying-in means 501, the guiding and conveying means 503, the drying means 507, and the carrying-out means 509, and is guided and conveyed by the winding roller 591 of the carrying-out means 509. It is wound up at.

The continuum 510 is conveyed on the transfer guide member 559 by the printing means 505 facing the discharge unit 550 and the discharge unit 555, an image is formed by the liquid discharged from the discharge unit 550, and the continuous body 510 is discharged from the discharge unit 555. Post-treatment is performed with the treatment liquid to be treated.

Here, the discharge unit 550 is provided with, for example, full-line head arrays 551A, 551B, 551C, 551D for four colors from the upstream side in the transport direction (hereinafter, referred to as "head array 551" when the colors are not distinguished). Is placed.

Each head array 551 is a liquid discharging means, and discharges black K, cyan C, magenta M, and yellow Y liquids to the conveyed continuum 510, respectively. The types and numbers of colors are not limited to this.

The head array 551 is, for example, in which the liquid discharge heads (which are also simply referred to as “heads”) 100 according to the present invention are arranged in a staggered pattern on the base member 552, but the head array 551 is not limited to this.

In the present application, the liquid to be discharged may have a viscosity and surface tension that can be discharged from the head, and is not particularly limited, but the viscosity becomes 30 mPa · s or less at room temperature, under normal pressure, or by heating or cooling. It is preferable that it is a thing. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functionalizing materials such as surfactants, biocompatible materials such as DNA, amino acids and proteins, and calcium. , Solvents, suspensions, emulsions, etc. containing edible materials such as natural pigments, etc., for example, inks for inkjets, surface treatment liquids, constituents of electronic elements and light emitting elements, and formation of electronic circuit resist patterns. It can be used for applications such as a liquid for use and a material liquid for three-dimensional modeling.

Piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heat-generating resistors, and electrostatic actuators that consist of a vibrating plate and counter electrodes are used as energy sources for discharging liquid. Includes what to do.

The "discharge unit" is a liquid discharge head integrated with functional parts and a mechanism, and includes an aggregate of parts related to liquid discharge. For example, the "discharge unit" includes a head tank, a carriage, a supply mechanism, a maintenance / recovery mechanism, a main scanning movement mechanism, a liquid circulation device in which at least one of the configurations is combined with a liquid discharge head, and the like.

Here, "integration" means, for example, a liquid discharge head and a functional component, a mechanism in which the mechanism is fixed to each other by fastening, adhesion, engagement, etc., or one in which one is movably held with respect to the other. Including. Further, the liquid discharge head, the functional parts, and the mechanism may be detachably attached to each other.

For example, as a discharge unit, there is a unit in which a liquid discharge head and a head tank are integrated. In addition, there are cases in which the liquid discharge head and the head tank are integrated by being connected to each other by a tube or the like. Here, a unit including a filter can be added between the head tank of these discharge units and the liquid discharge head.

Further, as a discharge unit, there is a unit in which a liquid discharge head and a carriage are integrated.

Further, as a discharge unit, there is a unit in which the liquid discharge head and the scanning movement mechanism are integrated by holding the liquid discharge head movably by a guide member forming a part of the scanning movement mechanism. In some cases, the liquid discharge head, the carriage, and the main scanning movement mechanism are integrated.

Further, as a discharge unit, there is a carriage to which a liquid discharge head is attached, in which a cap member which is a part of the maintenance / recovery mechanism is fixed, and the liquid discharge head, the carriage, and the maintenance / recovery mechanism are integrated.

Further, as a discharge unit, there is a unit in which a tube is connected to a liquid discharge head to which a head tank or a flow path component is attached, and the liquid discharge head and a supply mechanism are integrated. Through this tube, the liquid of the liquid storage source is supplied to the liquid discharge head.

The main scanning movement mechanism shall also include a single guide member. Further, the supply mechanism includes a single tube and a single loading unit.

Although the "discharge unit" is described here in combination with the liquid discharge head, the "discharge unit" includes a head module or head unit including the above-mentioned liquid discharge head and functional parts as described above. The one with integrated mechanism is also included.

The "device for discharging a liquid" includes a device including a liquid discharge head, a discharge unit, a head module, a head unit, and the like, and driving the liquid discharge head to discharge the liquid. The device for discharging the liquid includes not only a device capable of discharging the liquid to a device to which the liquid can adhere, but also a device for discharging the liquid into the air or the liquid.

The "device for discharging the liquid" can also include means for feeding, transporting, and discharging paper to which the liquid can adhere, as well as a pretreatment device, a posttreatment device, and the like.

For example, as a "device that ejects a liquid", an image forming apparatus that ejects ink to form an image on paper, and a three-dimensional object (three-dimensional object) are formed in layers in order to form a three-dimensional object. There is a three-dimensional modeling device (three-dimensional modeling device) that discharges the modeling liquid into the powder layer.

Further, the "device for discharging a liquid" is not limited to a device in which a significant image such as characters and figures is visualized by the discharged liquid. For example, those that form patterns that have no meaning in themselves and those that form a three-dimensional image are also included.

The above-mentioned "material to which a liquid can adhere" means a material to which a liquid can adhere at least temporarily, such as one that adheres and adheres, and one that adheres and permeates. Specific examples include paper, recording paper, recording paper, film, recording media such as cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers (powder layers), organ models, and media such as inspection cells. Yes, including anything to which the liquid adheres, unless otherwise specified.

The material of the above-mentioned "material to which liquid can be attached" may be paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics or the like as long as the liquid can be attached even temporarily.

Further, the "device for discharging the liquid" includes, but is not limited to, a device in which the liquid discharge head and the device to which the liquid can adhere move relatively. Specific examples include a serial type device that moves the liquid discharge head, a line type device that does not move the liquid discharge head, and the like.

In addition, as a "device for ejecting a liquid", a treatment liquid coating device for ejecting a treatment liquid to the paper in order to apply the treatment liquid to the surface of the paper for the purpose of modifying the surface of the paper, etc. There is an injection granulator that injects a composition liquid in which a raw material is dispersed in a solution through a nozzle to granulate fine particles of the raw material.

In addition, image formation, recording, printing, printing, printing, modeling, etc. in the terms of the present application are all synonymous.

1 Liquid discharge head 2 Actuator board (first board)
10 Nozzle plate 11 Nozzle 20 Individual flow path member 21 Pressure chamber 22 Individual supply flow path 23 Individual recovery flow path 30 Diaphragm member 40 Piezoelectric element 50 Common flow path member 52 Common supply flow path tributary 53 Common recovery flow path tributary 56 Common supply Channel main stream 57 Common recovery channel main stream 101 Wiring member (second substrate)
201 1st substrate 202 2nd substrate 203 Anisically conductive film 212 Wiring electrode 213 1st insulating film 214 2nd insulating film 222 Wiring electrode 500 Printing device (device that discharges liquid)
550 discharge unit

Claims (7)

Multiple wiring electrodes are arranged side by side,
A first insulating film is provided between the adjacent wiring electrodes.
A device characterized in that the first insulating film is provided over the side surface of the wiring electrode and the edge portion of the surface of the wiring electrode in the arrangement direction of the wiring electrode. A second insulating film along the arrangement direction of the wiring electrodes is provided on the surface of the wiring electrodes.
The device according to claim 1, wherein an opening surrounded by the first insulating film and the second insulating film is formed on the surface of the wiring electrode. The device according to claim 2, wherein the thickness of the first insulating film provided on the edge of the surface of the wiring electrode is the same as the thickness of the second insulating film. The device according to any one of claims 1 to 3, wherein the wiring member is connected via an anisotropic conductive film containing conductor particles. A liquid discharge head comprising the device according to any one of claims 1 to 4. A discharge unit including the liquid discharge head according to claim 5. A device for discharging a liquid, which comprises at least one of the liquid discharge head according to claim 5 and the discharge unit according to claim 6.

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