JP2021527722A - Pedotフィルムの製造方法 - Google Patents
Pedotフィルムの製造方法 Download PDFInfo
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- JP2021527722A JP2021527722A JP2020560971A JP2020560971A JP2021527722A JP 2021527722 A JP2021527722 A JP 2021527722A JP 2020560971 A JP2020560971 A JP 2020560971A JP 2020560971 A JP2020560971 A JP 2020560971A JP 2021527722 A JP2021527722 A JP 2021527722A
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- pedot
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- polymerization
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Abstract
【選択図】なし
Description
a)上記基板の少なくとも1つの表面上に酸化剤および塩基阻害剤を含む溶液を塗布して、上記基板の少なくとも1つの表面上に酸化剤コーティングを形成するステップと、
b)ステップa)で形成された酸化剤コーティングされた上記基板が、酸化剤コーティングされた上記基板の上記表面を重合温度で3,4−エチレンジオキシチオフェン(EDOT)モノマー蒸気に暴露することによって重合ステップを受けることで、酸化剤コーティングされた上記基板の上記表面上にPEDOT層を形成するステップと、
を含み、
上記重合ステップの間、酸化剤コーティングされた上記基板の温度は、制御された基板温度に保たれ、制御された上記基板温度は、上記重合温度より2〜40℃低い。
c)ステップb)で形成された上記PEDOT層の少なくとも1つの表面上に上記酸化剤および上記塩基阻害剤を含む上記溶液を塗布して、上記PEDOT層の上記少なくとも1つの表面上に酸化剤コーティングを形成するステップと、
d)ステップc)で形成された酸化剤コーティングされた上記PEDOT層が、酸化剤コーティングされた上記PEDOT層の上記表面を重合温度で3,4−エチレンジオキシチオフェン(EDOT)モノマー蒸気に暴露することによって重合ステップを受けることで、酸化剤コーティングされた上記PEDOT層の上記表面上に後続のPEDOT層を形成するステップと、
を含み、
上記重合ステップの間、酸化剤コーティングされた上記PEDOTフィルムの温度は、制御された基板温度に保たれ、制御された上記基板温度は、上記重合温度よりも2〜40℃低い。
r=rsheetd (1)
s=1/r (2)
面積容量: CA=Q/(ΔV*A) (3)
体積容量: CV=Q/(ΔV*V) (4)
ここで、「ΔV」は電位窓で、「A」は面積で、「V」は作用電極の体積である。
(%T)=(10^(Abs))*100 (5)
ガラススライド(基板)(37.5mm×25mm)を、それぞれアセトン、水およびEtOHで5分間にわたって超音波処理して洗浄した。洗浄した基板を、容積比が5:1:1のH2O:NH4OH(25%):H2O2(30%)の高温溶液(80℃)に5分間にわたって浸漬し、表面に残った有機不純物を除去した後、5分間にわたって酸素プラズマ処理した。酸化剤溶液60μLを1450rpmで20秒間にわたって基板上にスピンコーティングした。酸化剤コーティングした基板を、90℃のホットプレート上で90秒間乾燥した。乾燥した基板を、コーティングされた表面が蒸気に面するように、75℃で予熱したEDOTモノマー6を含むセル1に移した。重合を3つの異なるステップで4分間にわたって行った。最初の90秒間にわたって、セル1をガラス蓋2で覆った。その後、セル1の覆いを外し、次の90秒間にわたって、加熱された金属ブロック5によって、基板温度を65℃に保った。金属ブロック5を除去し、セル1をガラス蓋2で60秒間にわたって覆った。フィルムのアニールは、90℃のホットプレート上で90秒間にわたって重合した後に行った。アニール後、フィルムを室温まで冷却し、エタノール、続いてMeCN中で十分にすすぎ、未反応の酸化剤、モノマーおよび任意の他の不純物を除去した。洗浄を行って、消費されていない酸化剤およびモノマーのトレースを除去した。洗浄しなければ、コンダクタンスを低下させることもあるからである。洗浄後、フィルムを乾燥窒素ガス流下で乾燥させた。この手順をスピンコーティングするステップから繰り返し、ガラス基板4上に1層〜6層のPEDOT(1L〜6LのPEDOT)を調製した。セル1および金属ブロック5の温度は、恒温槽7、5によって制御した。
Renishaw社製のQontor inViaラマン顕微鏡を使用して、ラマンスペクトル(785nm励磁)を記録した。Agilent8453(最大1000nmまで)およびCary 5E分光光度計(VARIAN)(最大2400nmまで)を用いて、UV−Vis−NIR測定を記録した(バックグラウンド補正は、コーティングされていない顕微鏡ガラススライドを用いて行った)。Van der Pauw法を用いて、1L〜6LのPEDOTのシート抵抗(rsheet)を計算した。抵抗値は、四点プローブ(一辺a=2.2mmの正方形)およびKeithley社製マルチメーター(モデル2000)を用いた3つの測定値の平均として記録した。フィルムの比抵抗(r)と導電率(s)は、式(1)と式(2)から算出した。
PEDOTフィルムのシート抵抗および粗さ平均に対する基板温度の影響を表1に示す。
図2は、6層PEDOTフィルムのラマンスペクトルを示す。577、699、989、1095、1255、1367、1415、および1530cm−1のバンドは、それぞれ、オキシエチレン環変形、対称C−S−C変形、オキシエチレン環変形、C−O−C変形、Cα−Cα’環間伸縮、Cβ−Cβ’伸縮、対称Cα=Cβ(−O)伸縮、およびCα=Cβ伸縮に割り当てられる。
Claims (31)
- 基板と、前記基板の少なくとも1つの表面上に少なくとも1つのPEDOT層とを含むポリ(3,4−エチレンジオキシチオフェン)(PEDOT)フィルムの製造方法であって、
a)前記基板の少なくとも1つの表面上に酸化剤および塩基阻害剤を含む溶液を塗布して、前記基板の少なくとも1つの表面上に酸化剤コーティングを形成するステップと、
b)ステップa)で形成された酸化剤コーティングされた前記基板が、酸化剤コーティングされた前記基板の前記表面を重合温度で3,4−エチレンジオキシチオフェン(EDOT)モノマー蒸気に暴露することによって重合ステップを受けることで、酸化剤コーティングされた前記基板の前記表面上にPEDOT層を形成するステップと、
を含み、
前記重合ステップの間、酸化剤コーティングされた前記基板の温度は、制御された基板温度に保たれ、制御された前記基板温度は、前記重合温度より2〜40℃低い、PEDOTフィルムの製造方法。 - 前記基板が非導電性基板である、請求項1に記載のPEDOTフィルムの製造方法。
- 前記PEDOTフィルムの製造方法が、
c)ステップb)で形成された前記PEDOT層の少なくとも1つの表面上に前記酸化剤および前記塩基阻害剤を含む前記溶液を塗布して、前記PEDOT層の前記少なくとも1つの表面上に酸化剤コーティングを形成するステップと、
d)ステップc)で形成された酸化剤コーティングされた前記PEDOT層が、酸化剤コーティングされた前記PEDOT層の前記表面を重合温度で3,4−エチレンジオキシチオフェン(EDOT)モノマー蒸気に暴露することによって重合ステップを受けることで、酸化剤コーティングされた前記PEDOT層の前記表面上に後続のPEDOT層を形成するステップと、
を含み、
前記重合ステップの間、酸化剤コーティングされた前記PEDOTフィルムの温度は、制御された基板温度に保たれ、制御された前記基板温度は、前記重合温度よりも2〜40℃低い、請求項1または2に記載のPEDOTフィルムの製造方法。 - 前記PEDOTフィルムの製造方法が、ステップc)およびステップd)を少なくとも1回繰り返すことを含む、請求項3に記載のPEDOTフィルムの製造方法。
- 酸化剤コーティングされた前記基板の温度は、前記重合ステップの間、制御された基板温度に保たれ、制御された前記基板温度は、前記重合温度よりも2〜30℃、または3〜20℃、または3〜15℃、または5〜15℃、または8〜12℃低い、請求項1〜4のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記PEDOTフィルムの製造方法が気相重合(VPP)である、請求項1〜5のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記重合温度が55〜95℃で、制御された前記基板温度が40〜70℃であるか、または60〜85℃で、制御された前記基板温度が45〜70℃であるか、または前記重合温度が65〜80℃で、制御された前記基板温度が55〜70℃であるか、または前記重合温度が67〜77℃で、制御された前記基板温度が56〜66℃であるか、または前記重合温度が72〜77℃で、制御された前記基板温度が61〜66℃である、請求項1〜6のいずれか一項に記載のPEDOTフィルムの製造方法。
- 酸化剤コーティングされた前記基板および/または酸化剤コーティングされた前記PEDOTフィルムの温度が、実質的に前記重合ステップの全体にわたって、制御された前記基板温度に保たれる、請求項1〜7のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記重合ステップが2つの連続する処理期間を含み、酸化剤コーティングされた前記基板および/または酸化剤コーティングされた前記PEDOTフィルムの温度が、前記処理期間のうちの1つを通して制御された前記基板温度に保たれる、請求項1〜7のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記重合ステップが、3つの連続する処理期間を含み、酸化剤コーティングされた前記基板および/または酸化剤コーティングされた前記PEDOTフィルムの温度が、中間の前記処理期間を通して、制御された前記基板温度に保たれる、請求項1〜7または9のいずれか一項に記載のPEDOTフィルムの製造方法。
- ステップa)の前に前記基板を洗浄するステップを含む、請求項1〜10のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記酸化剤および前記塩基阻害剤を含む前記溶液が、ステップa)において前記基板の少なくとも1つの表面上に、および/またはステップc)において形成された前記PEDOT層の少なくとも1つの表面上にスピンコーティングされる、請求項1〜10のいずれか一項に記載のPEDOTフィルムの製造方法。
- ステップb)の前に酸化剤コーティングされた前記基板、および/またはステップd)の前に、ステップc)からの前記PEDOTポリマーフィルムを洗浄、乾燥および/または加熱するステップを含む、請求項1〜12のいずれか一項に記載のPEDOTフィルムの製造方法。
- 重合後に50〜100℃の温度で前記PEDOTフィルムをアニールするステップと、任意選択でアニールした前記PEDOTフィルムを洗浄、乾燥するステップとを含む、請求項1〜13のいずれか一項に記載のPEDOTフィルムの製造方法。
- ステップc)の前に、ステップb)から受け取った前記PEDOTポリマーフィルムを洗浄するステップを含む、請求項2〜14のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記重合ステップの持続時間が、1〜20分、または1〜10分、または2〜8分である、請求項1〜15のいずれか一項に記載のPEDOTフィルムの製造方法。
- 酸化剤コーティングされた前記基板および/または酸化剤コーティングされた前記PEDOTフィルムの温度が、制御された基板温度に保たれる前記重合ステップ処理期間の持続時間が、前記重合ステップの持続時間の20〜80%、または30〜60%、または35〜40%である、請求項1〜16のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記非導電性基板がガラスまたはポリエチレンテレフタレート(PET)である、請求項1〜17のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記酸化剤がp−トルエンスルホン酸鉄(III)六水和物(FETOS)である、請求項1〜16のいずれか一項に記載のPEDOTフィルムの製造方法。
- 前記塩基阻害剤がピリジンである、請求項1〜19のいずれか一項に記載のPEDOTフィルムの製造方法。
- 非導電性基板と、
PEDOT層であって、前記非導電性基板上の前記PEDOT層に埋め込まれた1つ/複数の酸化剤からのアニオンを有する、PEDOT層と、
を備える、導電性PEDOTフィルムであって、
2100S/cm超の導電率および200Ω/□未満のシート抵抗を有する、導電性PEDOTフィルム。 - 非導電性基板と、
PEDOT層であって、前記非導電性基板上の前記PEDOT層に埋め込まれた1つ/複数の酸化剤からのアニオンを有する、PEDOT層と、
を備える、請求項2〜20のいずれか一項に記載のPEDOTフィルムの製造方法によって取得可能な導電性PEDOTフィルムであって、
2100S/cm超の導電率および200Ω/□未満のシート抵抗を有する、導電性PEDOTフィルム。 - 前記非導電性基板上に1つ〜20または1つ〜15のPEDOT層を含む、請求項21または22に記載の導電性PEDOTフィルム。
- 前記導電性PEDOTフィルムの粗さ平均が3.5nm未満である、請求項21〜23のいずれか一項に記載の導電性PEDOTフィルム。
- 前記導電性PEDOTフィルムの%透過率が30%T超である、請求項21〜24のいずれか一項に記載の導電性PEDOTフィルム。
- 前記非導電性基板がガラスまたはポリエチレンテレフタレート(PET)である、請求項21〜25のいずれか一項に記載の導電性PEDOTフィルム。
- 前記PEDOT層が、前記非導電性基板上の前記PEDOT層に埋め込まれたp−トルエンスルホン酸鉄(III)六水和物(FETOS)からのアニオンを有する、請求項21〜26のいずれか一項に記載の導電性PEDOTフィルム。
- 前記導電性PEDOTフィルムの厚さが10〜500nmまたは10〜200nmである、請求項21〜27のいずれか一項に記載の導電性PEDOTフィルム。
- 請求項21〜28のいずれか一項に記載の導電性PEDOTフィルムを含むことを特徴とする、電子デバイス。
- 前記電子デバイスが、ディスプレイ、フラットパネルディスプレイ、有機発光ダイオード(OLED)などの光電子デバイス、有機太陽電池、色素増感太陽電池、ペロブスカイト太陽電池、スマートウィンドウ、燃料電池、有機電気化学トランジスタ、電気化学トランスデューサ、エレクトロクロミックデバイス、エレクトロルミネセントデバイス、エレクトロルミネセントディスプレイ、有機キャパシタ、スーパーキャパシタ、センサ、バイオセンサ、エネルギーハーベスティングデバイス、帯電防止材料、光起電デバイス、ストレージデバイス、または熱電デバイスである、請求項29に記載の電子デバイス。
- 請求項21〜28のいずれか一項に記載の導電性PEDOTフィルムの、電子デバイス内の/電子デバイスの帯電防止コーティングまたは電極としての使用。
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