JP2021517294A5 - - Google Patents
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- Publication number
- JP2021517294A5 JP2021517294A5 JP2020546095A JP2020546095A JP2021517294A5 JP 2021517294 A5 JP2021517294 A5 JP 2021517294A5 JP 2020546095 A JP2020546095 A JP 2020546095A JP 2020546095 A JP2020546095 A JP 2020546095A JP 2021517294 A5 JP2021517294 A5 JP 2021517294A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- components
- function
- computer system
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 30
- 230000006870 function Effects 0.000 claims 26
- 238000013473 artificial intelligence Methods 0.000 claims 4
- 230000006386 memory function Effects 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 238000003491 array Methods 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/921,311 | 2018-03-14 | ||
| US15/921,311 US10165667B1 (en) | 2018-03-14 | 2018-03-14 | Computing system with superconducting and non-superconducting components located on a common substrate |
| PCT/US2018/063509 WO2019177673A1 (en) | 2018-03-14 | 2018-12-01 | Computing system with superconducting and non-superconducting components located on a common substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021517294A JP2021517294A (ja) | 2021-07-15 |
| JP2021517294A5 true JP2021517294A5 (https=) | 2021-12-09 |
| JP7304872B2 JP7304872B2 (ja) | 2023-07-07 |
Family
ID=64692269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020546095A Active JP7304872B2 (ja) | 2018-03-14 | 2018-12-01 | 超伝導及び非超伝導コンポーネントが共通基板上に配置されたコンピュータシステム |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US10165667B1 (https=) |
| EP (1) | EP3765939B1 (https=) |
| JP (1) | JP7304872B2 (https=) |
| KR (1) | KR102609929B1 (https=) |
| CN (1) | CN111837093B (https=) |
| AU (1) | AU2018413356B2 (https=) |
| BR (1) | BR112020016789A2 (https=) |
| CA (1) | CA3092180A1 (https=) |
| IL (1) | IL277082B2 (https=) |
| MX (1) | MX2020009402A (https=) |
| MY (1) | MY209223A (https=) |
| PH (1) | PH12020551509A1 (https=) |
| SG (1) | SG11202008357XA (https=) |
| WO (1) | WO2019177673A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11125664B2 (en) | 2017-12-04 | 2021-09-21 | Montana Instruments Corporation | Analytical instruments, methods, and components |
| US10394292B1 (en) * | 2018-06-11 | 2019-08-27 | Microsoft Technology Licensing, Llc | Cryogenic computing system with thermal management using a metal preform |
| US10782258B2 (en) | 2018-09-04 | 2020-09-22 | Northrop Grumman Systems Corporation | Superconductor critical temperature measurement |
| US12253205B1 (en) | 2018-09-28 | 2025-03-18 | Montana Instruments Corporation | Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods |
| US20200109764A1 (en) | 2018-10-09 | 2020-04-09 | Montana Instruments Corporation | Cryocooler Assemblies and Methods |
| US10575437B1 (en) * | 2019-03-20 | 2020-02-25 | Northrop Grumman Systems Corporation | Temperature control method, system, and apparatus |
| US10595441B1 (en) * | 2019-04-03 | 2020-03-17 | Northrop Grumman Systems Corporation | Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment |
| US12181202B2 (en) | 2019-06-04 | 2024-12-31 | Montana Instruments Corporation | Thermal connection assemblies and methods |
| US10785891B1 (en) * | 2019-06-17 | 2020-09-22 | Microsoft Technology Licensing, Llc | Superconducting computing system in a liquid hydrogen environment |
| US10944039B2 (en) | 2019-06-19 | 2021-03-09 | International Business Machines Corporation | Fabricating transmon qubit flip-chip structures for quantum computing devices |
| US11032935B1 (en) * | 2019-12-10 | 2021-06-08 | Northrop Grumman Systems Corporation | Support structure for a flexible interconnect of a superconductor |
| US11956924B1 (en) | 2020-08-10 | 2024-04-09 | Montana Instruments Corporation | Quantum processing circuitry cooling systems and methods |
| US11917794B2 (en) * | 2020-10-30 | 2024-02-27 | Advanced Micro Devices, Inc. | Separating temperature domains in cooled systems |
| US11533825B2 (en) * | 2020-12-08 | 2022-12-20 | Microsoft Technology Licensing, Llc | Systems with indium application to heat transfer surfaces |
| KR20220096437A (ko) * | 2020-12-31 | 2022-07-07 | 삼성전자주식회사 | 전력 관리 방법 및 장치 |
| EP3958188B8 (en) * | 2021-03-08 | 2023-07-19 | Quantum Motion Technologies Limited | Compact silicon qubit cell with embedded readout |
| EP4496441A1 (en) * | 2023-07-17 | 2025-01-22 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | System and method for operating a set of qubits at a cryogenic operating temperature |
| US12426210B2 (en) * | 2023-08-14 | 2025-09-23 | Microsoft Technology Licensing, Llc | Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane using a superconducting rigid-flex circuit |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59216216A (ja) * | 1983-05-23 | 1984-12-06 | Toshiba Corp | 高速計算機システム |
| JPH0715048A (ja) * | 1993-06-21 | 1995-01-17 | Hitachi Ltd | 信号処理装置 |
| US5773875A (en) | 1996-02-23 | 1998-06-30 | Trw Inc. | High performance, low thermal loss, bi-temperature superconductive device |
| JP2993926B2 (ja) * | 1998-01-14 | 1999-12-27 | 株式会社移動体通信先端技術研究所 | 超伝導回路の実装構造 |
| JP2000068566A (ja) * | 1998-08-24 | 2000-03-03 | Kyocera Corp | 電子装置 |
| EP1557076A4 (en) * | 2002-10-22 | 2010-01-13 | Jason Sullivan | SYSTEMS AND METHODS FOR DEVELOPING A DYNAMICALLY MODULAR PROCESSING UNIT |
| CN2720778Y (zh) * | 2004-08-10 | 2005-08-24 | 宁波市北仑海伯精密机械制造有限公司 | 一种热超导管 |
| US20060076634A1 (en) | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
| CN101227811B (zh) * | 2007-01-19 | 2011-05-04 | 林义民 | 真空超热导散热器 |
| US8363418B2 (en) * | 2011-04-18 | 2013-01-29 | Morgan/Weiss Technologies Inc. | Above motherboard interposer with peripheral circuits |
| US8929066B2 (en) * | 2012-08-28 | 2015-01-06 | Skyera, Inc. | Chassis with separate thermal chamber for solid state memory |
| US8957525B2 (en) * | 2012-12-06 | 2015-02-17 | Texas Instruments Incorporated | 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor |
| EP3005020B1 (en) * | 2013-06-07 | 2018-05-02 | Apple Inc. | Computer thermal system |
| FR3011326B1 (fr) * | 2013-10-02 | 2016-04-01 | Soc Fr Detecteurs Infrarouges Sofradir | Circuit imprime flexible a faible emissivite |
| US9460397B2 (en) | 2013-10-04 | 2016-10-04 | Samsung Electronics Co., Ltd. | Quantum computing device spin transfer torque magnetic memory |
| CN104810366B (zh) * | 2014-01-26 | 2018-09-11 | 中芯国际集成电路制造(上海)有限公司 | 一种集成电路及其制造方法 |
| US9520180B1 (en) | 2014-03-11 | 2016-12-13 | Hypres, Inc. | System and method for cryogenic hybrid technology computing and memory |
| US20160128238A1 (en) * | 2014-10-27 | 2016-05-05 | Ebullient, Llc | Hot-swappable server with cooling line assembly |
| US10102327B2 (en) * | 2014-12-31 | 2018-10-16 | Stmicroelectronics, Inc. | Integrated circuit layout wiring for multi-core chips |
| IL236544A0 (en) * | 2014-12-31 | 2015-04-30 | Elbit Systems Ltd | Thermal management of printed circuit board components |
| CN204347742U (zh) * | 2015-01-23 | 2015-05-20 | 常州信息职业技术学院 | 一种计算机水冷机箱 |
| KR20160099440A (ko) * | 2015-02-12 | 2016-08-22 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 기판 분리 및 비도핑 채널을 갖는 집적 회로 구조물 |
| US9524470B1 (en) | 2015-06-12 | 2016-12-20 | International Business Machines Corporation | Modular array of vertically integrated superconducting qubit devices for scalable quantum computing |
| CN108349725B (zh) * | 2015-11-12 | 2021-11-19 | 罗切斯特大学 | 用于高性能能量有效低温计算的超导系统架构 |
| US10159161B2 (en) | 2015-11-17 | 2018-12-18 | Northrop Grumman Systems Corporation | Circuit card rack system and method |
| US9648749B1 (en) | 2015-11-17 | 2017-05-09 | Northrop Grumman Systems Corporation | Circuit card assembly and method of providing same |
| US9681533B2 (en) | 2015-11-17 | 2017-06-13 | Northrop Grumman Systems Corporation | Apparatus and method for providing a temperature-differential circuit card environment |
| US10410760B2 (en) * | 2016-01-11 | 2019-09-10 | Raytheon Company | Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together |
-
2018
- 2018-03-14 US US15/921,311 patent/US10165667B1/en active Active
- 2018-12-01 BR BR112020016789-4A patent/BR112020016789A2/pt unknown
- 2018-12-01 CA CA3092180A patent/CA3092180A1/en active Pending
- 2018-12-01 EP EP18821904.2A patent/EP3765939B1/en active Active
- 2018-12-01 SG SG11202008357XA patent/SG11202008357XA/en unknown
- 2018-12-01 AU AU2018413356A patent/AU2018413356B2/en active Active
- 2018-12-01 MX MX2020009402A patent/MX2020009402A/es unknown
- 2018-12-01 WO PCT/US2018/063509 patent/WO2019177673A1/en not_active Ceased
- 2018-12-01 CN CN201880091155.7A patent/CN111837093B/zh active Active
- 2018-12-01 KR KR1020207025500A patent/KR102609929B1/ko active Active
- 2018-12-01 JP JP2020546095A patent/JP7304872B2/ja active Active
- 2018-12-01 MY MYPI2020004613A patent/MY209223A/en unknown
- 2018-12-01 IL IL277082A patent/IL277082B2/en unknown
-
2020
- 2020-09-14 PH PH12020551509A patent/PH12020551509A1/en unknown
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