AU2018413356B2 - Computing system with superconducting and non-superconducting components located on a common substrate - Google Patents

Computing system with superconducting and non-superconducting components located on a common substrate Download PDF

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Publication number
AU2018413356B2
AU2018413356B2 AU2018413356A AU2018413356A AU2018413356B2 AU 2018413356 B2 AU2018413356 B2 AU 2018413356B2 AU 2018413356 A AU2018413356 A AU 2018413356A AU 2018413356 A AU2018413356 A AU 2018413356A AU 2018413356 B2 AU2018413356 B2 AU 2018413356B2
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AU
Australia
Prior art keywords
components
substrate
functionality
computing system
superconducting
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AU2018413356A
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English (en)
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AU2018413356A1 (en
Inventor
Leonard G. Chorosinski
Martin B. Christiansen
Harlan C. Heffner
Stanley K. Wakamiya
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Microsoft Technology Licensing LLC
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Microsoft Technology Licensing LLC
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Publication date
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Publication of AU2018413356A1 publication Critical patent/AU2018413356A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20372—Cryogenic cooling; Nitrogen liquid cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
AU2018413356A 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate Active AU2018413356B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/921,311 2018-03-14
US15/921,311 US10165667B1 (en) 2018-03-14 2018-03-14 Computing system with superconducting and non-superconducting components located on a common substrate
PCT/US2018/063509 WO2019177673A1 (en) 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate

Publications (2)

Publication Number Publication Date
AU2018413356A1 AU2018413356A1 (en) 2020-08-20
AU2018413356B2 true AU2018413356B2 (en) 2023-08-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
AU2018413356A Active AU2018413356B2 (en) 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate

Country Status (14)

Country Link
US (1) US10165667B1 (https=)
EP (1) EP3765939B1 (https=)
JP (1) JP7304872B2 (https=)
KR (1) KR102609929B1 (https=)
CN (1) CN111837093B (https=)
AU (1) AU2018413356B2 (https=)
BR (1) BR112020016789A2 (https=)
CA (1) CA3092180A1 (https=)
IL (1) IL277082B2 (https=)
MX (1) MX2020009402A (https=)
MY (1) MY209223A (https=)
PH (1) PH12020551509A1 (https=)
SG (1) SG11202008357XA (https=)
WO (1) WO2019177673A1 (https=)

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US12253205B1 (en) 2018-09-28 2025-03-18 Montana Instruments Corporation Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods
US20200109764A1 (en) 2018-10-09 2020-04-09 Montana Instruments Corporation Cryocooler Assemblies and Methods
US10575437B1 (en) * 2019-03-20 2020-02-25 Northrop Grumman Systems Corporation Temperature control method, system, and apparatus
US10595441B1 (en) * 2019-04-03 2020-03-17 Northrop Grumman Systems Corporation Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment
US12181202B2 (en) 2019-06-04 2024-12-31 Montana Instruments Corporation Thermal connection assemblies and methods
US10785891B1 (en) * 2019-06-17 2020-09-22 Microsoft Technology Licensing, Llc Superconducting computing system in a liquid hydrogen environment
US10944039B2 (en) 2019-06-19 2021-03-09 International Business Machines Corporation Fabricating transmon qubit flip-chip structures for quantum computing devices
US11032935B1 (en) * 2019-12-10 2021-06-08 Northrop Grumman Systems Corporation Support structure for a flexible interconnect of a superconductor
US11956924B1 (en) 2020-08-10 2024-04-09 Montana Instruments Corporation Quantum processing circuitry cooling systems and methods
US11917794B2 (en) * 2020-10-30 2024-02-27 Advanced Micro Devices, Inc. Separating temperature domains in cooled systems
US11533825B2 (en) * 2020-12-08 2022-12-20 Microsoft Technology Licensing, Llc Systems with indium application to heat transfer surfaces
KR20220096437A (ko) * 2020-12-31 2022-07-07 삼성전자주식회사 전력 관리 방법 및 장치
EP3958188B8 (en) * 2021-03-08 2023-07-19 Quantum Motion Technologies Limited Compact silicon qubit cell with embedded readout
EP4496441A1 (en) * 2023-07-17 2025-01-22 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO System and method for operating a set of qubits at a cryogenic operating temperature
US12426210B2 (en) * 2023-08-14 2025-09-23 Microsoft Technology Licensing, Llc Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane using a superconducting rigid-flex circuit

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Also Published As

Publication number Publication date
JP7304872B2 (ja) 2023-07-07
PH12020551509A1 (en) 2021-09-06
RU2020133484A (ru) 2022-04-14
KR20200131233A (ko) 2020-11-23
WO2019177673A1 (en) 2019-09-19
KR102609929B1 (ko) 2023-12-04
EP3765939B1 (en) 2025-11-12
AU2018413356A1 (en) 2020-08-20
IL277082A (en) 2020-10-29
CN111837093A (zh) 2020-10-27
EP3765939A1 (en) 2021-01-20
CA3092180A1 (en) 2019-09-19
IL277082B1 (en) 2024-03-01
JP2021517294A (ja) 2021-07-15
BR112020016789A2 (pt) 2020-12-15
US10165667B1 (en) 2018-12-25
CN111837093B (zh) 2022-07-15
MX2020009402A (es) 2020-10-28
MY209223A (en) 2025-06-29
IL277082B2 (en) 2024-07-01
SG11202008357XA (en) 2020-09-29

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