JP2021516286A - 複数の基板をコーティングする装置 - Google Patents
複数の基板をコーティングする装置 Download PDFInfo
- Publication number
- JP2021516286A JP2021516286A JP2020542564A JP2020542564A JP2021516286A JP 2021516286 A JP2021516286 A JP 2021516286A JP 2020542564 A JP2020542564 A JP 2020542564A JP 2020542564 A JP2020542564 A JP 2020542564A JP 2021516286 A JP2021516286 A JP 2021516286A
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- coating
- shutter
- holding device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 238000000576 coating method Methods 0.000 title claims abstract description 71
- 239000011248 coating agent Substances 0.000 title claims abstract description 55
- 238000005229 chemical vapour deposition Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000004050 hot filament vapor deposition Methods 0.000 claims description 3
- 238000007735 ion beam assisted deposition Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000000313 electron-beam-induced deposition Methods 0.000 claims description 2
- 238000007733 ion plating Methods 0.000 claims description 2
- 238000001659 ion-beam spectroscopy Methods 0.000 claims description 2
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 2
- 238000005546 reactive sputtering Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 20
- 230000033001 locomotion Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000000541 cathodic arc deposition Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018204033.8A DE102018204033A1 (de) | 2018-03-16 | 2018-03-16 | Vorrichtung zur Beschichtung einer Vielzahl von Substraten |
| DE102018204033.8 | 2018-03-16 | ||
| PCT/EP2019/056525 WO2019175372A1 (de) | 2018-03-16 | 2019-03-15 | Vorrichtung zur beschichtung einer vielzahl von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2021516286A true JP2021516286A (ja) | 2021-07-01 |
Family
ID=65812319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020542564A Pending JP2021516286A (ja) | 2018-03-16 | 2019-03-15 | 複数の基板をコーティングする装置 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3765651A1 (de) |
| JP (1) | JP2021516286A (de) |
| DE (1) | DE102018204033A1 (de) |
| WO (1) | WO2019175372A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699662B (zh) * | 2019-10-21 | 2022-05-27 | 江苏菲沃泰纳米科技股份有限公司 | 镀膜方法及其膜层 |
| DE102022003486A1 (de) | 2022-09-21 | 2024-03-21 | Rodenstock Gmbh | Abschattungsvorrichtung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0633225A (ja) * | 1992-07-21 | 1994-02-08 | Murata Mfg Co Ltd | 真空蒸着装置 |
| JPH06336672A (ja) * | 1993-05-31 | 1994-12-06 | Mitsubishi Electric Corp | 蒸着装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4022939A (en) * | 1975-12-18 | 1977-05-10 | Western Electric Company, Inc. | Synchronous shielding in vacuum deposition system |
| CH650028A5 (de) * | 1980-09-26 | 1985-06-28 | Balzers Hochvakuum | Anordnung zum gleichfoermigen beschichten von rotationsflaechen durch bedampfen im hochvakuum. |
| US6733640B2 (en) * | 2002-01-14 | 2004-05-11 | Seagate Technology Llc | Shutter assembly having optimized shutter opening shape for thin film uniformity |
| CN1243279C (zh) * | 2002-07-30 | 2006-02-22 | 佳能电子株式会社 | 滤光片制造方法、有该滤光片的光通量光阑装置和照相机 |
-
2018
- 2018-03-16 DE DE102018204033.8A patent/DE102018204033A1/de active Pending
-
2019
- 2019-03-15 WO PCT/EP2019/056525 patent/WO2019175372A1/de active Application Filing
- 2019-03-15 JP JP2020542564A patent/JP2021516286A/ja active Pending
- 2019-03-15 EP EP19711579.3A patent/EP3765651A1/de active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0633225A (ja) * | 1992-07-21 | 1994-02-08 | Murata Mfg Co Ltd | 真空蒸着装置 |
| JPH06336672A (ja) * | 1993-05-31 | 1994-12-06 | Mitsubishi Electric Corp | 蒸着装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3765651A1 (de) | 2021-01-20 |
| DE102018204033A1 (de) | 2019-09-19 |
| WO2019175372A1 (de) | 2019-09-19 |
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