JP2021508182A - ライトエンジンを備える封止デバイス - Google Patents
ライトエンジンを備える封止デバイス Download PDFInfo
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- JP2021508182A JP2021508182A JP2020543938A JP2020543938A JP2021508182A JP 2021508182 A JP2021508182 A JP 2021508182A JP 2020543938 A JP2020543938 A JP 2020543938A JP 2020543938 A JP2020543938 A JP 2020543938A JP 2021508182 A JP2021508182 A JP 2021508182A
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- central region
- light engine
- housing
- light
- elastomer
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- 238000005538 encapsulation Methods 0.000 title description 2
- 229920001971 elastomer Polymers 0.000 claims abstract description 52
- 239000000806 elastomer Substances 0.000 claims abstract description 52
- 238000000465 moulding Methods 0.000 claims abstract description 45
- 230000002093 peripheral effect Effects 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- -1 polydimethylsiloxane Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000000428 dust Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 230000003595 spectral effect Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 208000029497 Elastoma Diseases 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims (14)
- デバイスであり、
ライトエンジンを含むハウジングであって、前記デバイスのパーツに接触するハウジングと、
前記ハウジング上のエラストマ成形部であって、前記ライトエンジンによって発される光のための光出射窓の役割を果たす中央領域、及び前記中央領域の周囲の周辺領域であって、前記パーツに接触し、封止部の役割を果たす周辺領域を含むエラストマ成形部とを有するデバイスであって、
前記中央領域が前記周辺領域よりも高い硬度を有するように、前記中央領域は硬化され、前記周辺領域は硬化されないデバイス。 - 前記ライトエンジンによって発される前記光の少なくとも一部が、前記中央領域を硬化させることが可能な波長を有する請求項1に記載のデバイス。
- 前記ライトエンジンが、UV放射線を発することが可能な発光ダイオードを有する請求項2に記載のデバイス。
- 前記ハウジングが、可視光を発することが可能な更なるライトエンジンを有する請求項2又は3に記載のデバイス。
- 前記エラストマ成形部が、シリコーンを含む請求項1乃至4のいずれか一項に記載のデバイス。
- 前記シリコーンが、ポリジメチルシロキサンである請求項5に記載のデバイス。
- 前記デバイスが、電子デバイスである請求項1乃至6のいずれか一項に記載のデバイス。
- 前記電子デバイスが、家電機器又は携帯型電子デバイスである請求項7に記載のデバイス。
- ライトエンジンを含むハウジングを有するデバイスを封止する方法であり、前記ハウジングが前記デバイスのパーツに接触する方法であって、
前記ハウジングの上にエラストマ成形部を設けるステップであって、前記エラストマ成形部が、前記ライトエンジンによって発される光のための光出射窓の役割を果たす中央領域、及び前記中央領域の周囲の周辺領域であって、前記パーツに接触し、封止部の役割を果たす周辺領域を含むようなエラストマ成形部を設けるステップと、
硬化された前記中央領域が、硬化されていない前記周辺領域よりも高い硬度を有するように、前記エラストマ成形部の前記中央領域を選択的に硬化させるステップとを有する方法。 - 前記選択的に硬化させるステップが、前記デバイスの外部の光源でマスクを介して前記中央領域に選択的に放射線を照射するステップを含む請求項9に記載の方法。
- 前記選択的に硬化させるステップが、前記ライトエンジンで前記中央領域に選択的に放射線を照射するステップを含む請求項9に記載の方法。
- 前記中央領域に選択的に放射線を照射するステップが、前記中央領域に選択的にUV放射線を照射するステップを含む請求項10又は11に記載の方法。
- 前記エラストマ成形部が、シリコーンである請求項9乃至12のいずれか一項に記載の方法。
- 前記シリコーンが、ポリジメチルシロキサンである請求項13に記載の方法。
Priority Applications (1)
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JP2021139300A JP2021193741A (ja) | 2018-02-19 | 2021-08-27 | ライトエンジンを備える封止デバイス |
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EP18157471.6 | 2018-02-19 | ||
EP18157471 | 2018-02-19 | ||
PCT/EP2019/053684 WO2019158648A1 (en) | 2018-02-19 | 2019-02-14 | Sealed device with light engine |
Related Child Applications (1)
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JP2021139300A Division JP2021193741A (ja) | 2018-02-19 | 2021-08-27 | ライトエンジンを備える封止デバイス |
Publications (2)
Publication Number | Publication Date |
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JP2021508182A true JP2021508182A (ja) | 2021-02-25 |
JP7218378B2 JP7218378B2 (ja) | 2023-02-06 |
Family
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Family Applications (2)
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JP2020543938A Active JP7218378B2 (ja) | 2018-02-19 | 2019-02-14 | ライトエンジンを備える封止デバイス |
JP2021139300A Withdrawn JP2021193741A (ja) | 2018-02-19 | 2021-08-27 | ライトエンジンを備える封止デバイス |
Family Applications After (1)
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JP2021139300A Withdrawn JP2021193741A (ja) | 2018-02-19 | 2021-08-27 | ライトエンジンを備える封止デバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210376203A1 (ja) |
EP (1) | EP3756226B1 (ja) |
JP (2) | JP7218378B2 (ja) |
CN (1) | CN111758168B (ja) |
WO (1) | WO2019158648A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021193741A (ja) * | 2018-02-19 | 2021-12-23 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | ライトエンジンを備える封止デバイス |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
JP2003046140A (ja) * | 2001-07-26 | 2003-02-14 | Matsushita Electric Works Ltd | 発光装置およびその製造方法 |
US6635363B1 (en) * | 2000-08-21 | 2003-10-21 | General Electric Company | Phosphor coating with self-adjusting distance from LED chip |
US20100163909A1 (en) * | 2007-09-27 | 2010-07-01 | Ming-Hung Chen | Manufacturing method and structure of light-emitting diode with multilayered optical lens |
JP2010532929A (ja) * | 2007-07-06 | 2010-10-14 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
US20100276716A1 (en) * | 2008-01-07 | 2010-11-04 | Sunghoon Kwon | Light emitting diode coating method |
WO2011057831A1 (en) * | 2009-11-13 | 2011-05-19 | Tridonic Jennersdorf Gmbh | Light-emitting diode module and corresponding manufacturing method |
WO2011132805A1 (ko) * | 2010-04-23 | 2011-10-27 | 우리엘에스티 주식회사 | 발광다이오드의 코팅 방법 |
US20120299017A1 (en) * | 2011-05-24 | 2012-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Batwing led with remote phosphor configuration |
US20150097206A1 (en) * | 2013-10-09 | 2015-04-09 | Genesis Photonics Inc. | Method of manufacturing package component for light emitting diode and package structure thereof |
US20160126430A1 (en) * | 2014-11-03 | 2016-05-05 | Avago Technologies General Ip (Singapore) Pte. Ltd | Light-emitting device with hardened encapsulant islands |
JP2017208468A (ja) * | 2016-05-19 | 2017-11-24 | キヤノン株式会社 | 電子部品 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002218871B2 (en) * | 2001-01-10 | 2004-03-04 | Silverbrook Research Pty Ltd | Light emitting semiconductor package |
DE10118231A1 (de) * | 2001-04-11 | 2002-10-17 | Heidenhain Gmbh Dr Johannes | Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung |
JP4245822B2 (ja) * | 2001-05-01 | 2009-04-02 | 株式会社リコー | Iii族窒化物結晶の製造方法 |
JP2005101458A (ja) * | 2003-09-26 | 2005-04-14 | Sharp Corp | 半導体発光装置 |
CN100585880C (zh) * | 2004-09-14 | 2010-01-27 | 索尼化学&信息部件株式会社 | 功能元件安装模块及其制造方法 |
US7452737B2 (en) * | 2004-11-15 | 2008-11-18 | Philips Lumileds Lighting Company, Llc | Molded lens over LED die |
US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
US7105863B1 (en) * | 2005-06-03 | 2006-09-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source with improved life |
US7646035B2 (en) * | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
WO2007050484A1 (en) * | 2005-10-24 | 2007-05-03 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
JP2007258667A (ja) * | 2006-02-21 | 2007-10-04 | Seiko Epson Corp | 光電気複合基板及び電子機器 |
CN101345278B (zh) * | 2007-07-13 | 2011-01-12 | 陈金汉 | Led芯片封装方法 |
EP2185621A1 (en) | 2007-09-27 | 2010-05-19 | Nippon Shokubai Co., Ltd. | Curable resin composition for molded bodies, molded body, and production method thereof |
US8842219B2 (en) * | 2008-07-23 | 2014-09-23 | Entropic Communications, Inc. | Frame rate up-conversion |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
JP6155261B2 (ja) * | 2011-07-15 | 2017-06-28 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体パッケージ樹脂組成物及びその使用方法 |
JP5827834B2 (ja) * | 2011-07-22 | 2015-12-02 | 日東電工株式会社 | シリコーン樹脂組成物、シリコーン樹脂シート、シリコーン樹脂シートの製造方法および光半導体装置 |
EP2587560A1 (en) * | 2011-10-26 | 2013-05-01 | Forschungsverbund Berlin e.V. | Light emitting diode |
CN103094264B (zh) * | 2011-10-31 | 2016-03-02 | 光宝电子(广州)有限公司 | 高功率发光二极管 |
JP2015181140A (ja) | 2012-07-27 | 2015-10-15 | 三菱化学株式会社 | 半導体発光装置用の波長変換コンポーネント、その製造方法、および、熱硬化性シリコーン組成物 |
DE102013207243B4 (de) * | 2013-04-22 | 2019-10-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung |
US9423832B2 (en) * | 2014-03-05 | 2016-08-23 | Lg Electronics Inc. | Display device using semiconductor light emitting device |
US9579868B2 (en) * | 2014-07-01 | 2017-02-28 | Isola Usa Corp. | Prepregs and laminates having a UV curable resin layer |
US10746379B2 (en) * | 2015-08-20 | 2020-08-18 | Signify Holding B.V. | Luminaire having pliable container with restricting light exit structure and manufacturing method therof |
WO2019158648A1 (en) * | 2018-02-19 | 2019-08-22 | Signify Holding B.V. | Sealed device with light engine |
-
2019
- 2019-02-14 WO PCT/EP2019/053684 patent/WO2019158648A1/en unknown
- 2019-02-14 CN CN201980014025.8A patent/CN111758168B/zh active Active
- 2019-02-14 JP JP2020543938A patent/JP7218378B2/ja active Active
- 2019-02-14 US US16/968,150 patent/US20210376203A1/en active Pending
- 2019-02-14 EP EP19712686.5A patent/EP3756226B1/en active Active
-
2021
- 2021-08-27 JP JP2021139300A patent/JP2021193741A/ja not_active Withdrawn
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6635363B1 (en) * | 2000-08-21 | 2003-10-21 | General Electric Company | Phosphor coating with self-adjusting distance from LED chip |
JP2003046140A (ja) * | 2001-07-26 | 2003-02-14 | Matsushita Electric Works Ltd | 発光装置およびその製造方法 |
JP2010532929A (ja) * | 2007-07-06 | 2010-10-14 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
US20100163909A1 (en) * | 2007-09-27 | 2010-07-01 | Ming-Hung Chen | Manufacturing method and structure of light-emitting diode with multilayered optical lens |
US20100276716A1 (en) * | 2008-01-07 | 2010-11-04 | Sunghoon Kwon | Light emitting diode coating method |
WO2011057831A1 (en) * | 2009-11-13 | 2011-05-19 | Tridonic Jennersdorf Gmbh | Light-emitting diode module and corresponding manufacturing method |
WO2011132805A1 (ko) * | 2010-04-23 | 2011-10-27 | 우리엘에스티 주식회사 | 발광다이오드의 코팅 방법 |
US20120299017A1 (en) * | 2011-05-24 | 2012-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Batwing led with remote phosphor configuration |
US20150097206A1 (en) * | 2013-10-09 | 2015-04-09 | Genesis Photonics Inc. | Method of manufacturing package component for light emitting diode and package structure thereof |
US20160126430A1 (en) * | 2014-11-03 | 2016-05-05 | Avago Technologies General Ip (Singapore) Pte. Ltd | Light-emitting device with hardened encapsulant islands |
JP2017208468A (ja) * | 2016-05-19 | 2017-11-24 | キヤノン株式会社 | 電子部品 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021193741A (ja) * | 2018-02-19 | 2021-12-23 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | ライトエンジンを備える封止デバイス |
Also Published As
Publication number | Publication date |
---|---|
JP7218378B2 (ja) | 2023-02-06 |
CN111758168A (zh) | 2020-10-09 |
JP2021193741A (ja) | 2021-12-23 |
US20210376203A1 (en) | 2021-12-02 |
EP3756226A1 (en) | 2020-12-30 |
WO2019158648A1 (en) | 2019-08-22 |
CN111758168B (zh) | 2024-05-17 |
EP3756226B1 (en) | 2021-10-27 |
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