JP2021502846A5 - - Google Patents

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JP2021502846A5
JP2021502846A5 JP2020526267A JP2020526267A JP2021502846A5 JP 2021502846 A5 JP2021502846 A5 JP 2021502846A5 JP 2020526267 A JP2020526267 A JP 2020526267A JP 2020526267 A JP2020526267 A JP 2020526267A JP 2021502846 A5 JP2021502846 A5 JP 2021502846A5
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ultrasonic device
asic
serdes
circuit
pcb
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JP2020526267A
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Japanese (ja)
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JP2021502846A (ja
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Priority claimed from PCT/US2018/061238 external-priority patent/WO2019099638A1/en
Publication of JP2021502846A publication Critical patent/JP2021502846A/ja
Publication of JP2021502846A5 publication Critical patent/JP2021502846A5/ja
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JP2020526267A 2017-11-15 2018-11-15 超音波装置および超音波デバイスを製造するための方法 Pending JP2021502846A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762586716P 2017-11-15 2017-11-15
US62/586,716 2017-11-15
US201862687189P 2018-06-19 2018-06-19
US62/687,189 2018-06-19
PCT/US2018/061238 WO2019099638A1 (en) 2017-11-15 2018-11-15 Ultrasound apparatuses and methods for fabricating ultrasound devices

Publications (2)

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JP2021502846A JP2021502846A (ja) 2021-02-04
JP2021502846A5 true JP2021502846A5 (enExample) 2021-12-16

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JP2020526267A Pending JP2021502846A (ja) 2017-11-15 2018-11-15 超音波装置および超音波デバイスを製造するための方法

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US (4) US20190142387A1 (enExample)
EP (1) EP3709894A4 (enExample)
JP (1) JP2021502846A (enExample)
KR (1) KR20200088380A (enExample)
CN (1) CN111479514A (enExample)
AU (1) AU2018369882A1 (enExample)
CA (1) CA3081760A1 (enExample)
TW (1) TW201923378A (enExample)
WO (1) WO2019099638A1 (enExample)

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