JP2021500111A - 低周波数で低インピーダンスを有する電極を含むカテーテルの大量生産 - Google Patents
低周波数で低インピーダンスを有する電極を含むカテーテルの大量生産 Download PDFInfo
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Abstract
Description
一部のタイプのカテーテルなどの医療機器は、例えば、患者組織に又は患者組織から電気信号を伝導するために使用される電極を含む。場合によっては、低周波数で低インピーダンスを示すために電極が必要とされる。この種の電極は、例えば、低振幅信号を感知し、感知された信号に付随するノイズレベルを低減するのに有用である。
図1は、本発明の一実施形態による、カテーテル法システム20の概略描写図である。システム20は、本実施例では心カテーテル22であるプローブと、制御コンソール24と、を含む。本明細書で説明される実施形態では、カテーテル22は、患者28の心臓(図示せず)からの信号の感知などの、任意の好適な治療及び/又は診断目的で使用することができる。
図2は、本発明の一実施形態による、複数の区画48のアレイを含む基板55の概略描写図である。
(1) 医療機器の遠位端アセンブリを製造するための方法であって、
第1の層を、可撓性基板の1つ以上の区画のうち所与の区画の少なくとも一部に配置することと、
前記医療機器の前記遠位端アセンブリ上の電極として機能する、前記所与の区画上の1つ以上の選択された位置において、組織と接触すると、所定の周波数範囲で前記組織に又は前記組織から電気信号を伝達するための、前記第1の層と比較して低減されたインピーダンスを有する第2の層を配置することと、
前記所与の区画を、前記遠位端アセンブリを形成するように成形することと、を含む、方法。
(2) 前記所与の区画を成形することは、前記可撓性基板を切断して、前記所与の区画を1つ以上の隣接する区画から分離することを含む、実施態様1に記載の方法。
(3) 前記所与の区画を成形することは、前記医療機器の遠位端に前記所与の区画を巻き付けることを含む、実施態様1に記載の方法。
(4) 前記第1の層を配置することは、金層を前記所与の区画上に堆積させることと、前記所与の区画の前記少なくとも一部に前記金層の一部のみを保持するように前記金層をパターニングすることと、を含む、実施態様1に記載の方法。
(5) 前記第2の層を配置することは、窒化チタン(TiN)、酸化イリジウム(IrOx)、及び白金黒からなるリストから選択される材料の1つ以上の副層を配置することを含む、実施態様1に記載の方法。
(7) 前記第2の層を配置することは、物理蒸着(PVD)プロセスを使用して前記第2の層を堆積させることを含む、実施態様1に記載の方法。
(8) 前記医療機器はカテーテルの挿入管を含む、実施態様1に記載の方法。
(9) 前記可撓性基板は可撓性プリント回路基板(PCB)を含む、実施態様1に記載の方法。
(10) 前記可撓性基板は電気的相互接続部を含み、前記第1及び第2の層を配設することは、前記電気的相互接続部のうちの少なくとも1つと接触するように前記第1の層及び第2の層のうちの少なくとも1つを配置することを含む、実施態様1に記載の方法。
(12) 前記所定の周波数範囲は0.01〜1000Hzを含む、実施態様1に記載の方法。
Claims (12)
- 医療機器の遠位端アセンブリを製造するための方法であって、
第1の層を、可撓性基板の1つ以上の区画のうち所与の区画の少なくとも一部に配置することと、
前記医療機器の前記遠位端アセンブリ上の電極として機能する、前記所与の区画上の1つ以上の選択された位置において、組織と接触すると、所定の周波数範囲で前記組織に又は前記組織から電気信号を伝達するための、前記第1の層と比較して低減されたインピーダンスを有する第2の層を配置することと、
前記所与の区画を、前記遠位端アセンブリを形成するように成形することと、を含む、方法。 - 前記所与の区画を成形することは、前記可撓性基板を切断して、前記所与の区画を1つ以上の隣接する区画から分離することを含む、請求項1に記載の方法。
- 前記所与の区画を成形することは、前記医療機器の遠位端に前記所与の区画を巻き付けることを含む、請求項1に記載の方法。
- 前記第1の層を配置することは、金層を前記所与の区画上に堆積させることと、前記所与の区画の前記少なくとも一部に前記金層の一部のみを保持するように前記金層をパターニングすることと、を含む、請求項1に記載の方法。
- 前記第2の層を配置することは、窒化チタン(TiN)、酸化イリジウム(IrOx)、及び白金黒からなるリストから選択される材料の1つ以上の副層を配置することを含む、請求項1に記載の方法。
- 前記選択された位置に前記第2の層を配置することは、前記第2の層を前記所与の区画上及び前記第1の層上に堆積させることと、前記選択された位置上に前記第2の層の一部のみを保持するように前記第2の層をパターニングすることと、を含む、請求項1に記載の方法。
- 前記第2の層を配置することは、物理蒸着(PVD)プロセスを使用して前記第2の層を堆積させることを含む、請求項1に記載の方法。
- 前記医療機器はカテーテルの挿入管を含む、請求項1に記載の方法。
- 前記可撓性基板は可撓性プリント回路基板(PCB)を含む、請求項1に記載の方法。
- 前記可撓性基板は電気的相互接続部を含み、前記第1及び第2の層を配設することは、前記電気的相互接続部のうちの少なくとも1つと接触するように前記第1の層及び第2の層のうちの少なくとも1つを配置することを含む、請求項1に記載の方法。
- 灌注孔を形成するように前記可撓性基板に穿孔することを含む、請求項1に記載の方法。
- 前記所定の周波数範囲は0.01〜1000Hzを含む、請求項1に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US15/786,968 | 2017-10-18 | ||
US15/786,968 US10874824B2 (en) | 2017-10-18 | 2017-10-18 | High-volume manufacturing of catheters comprising electrodes having low impedance at low frequency |
PCT/US2018/055125 WO2019079081A1 (en) | 2017-10-18 | 2018-10-10 | HIGH VOLUME MANUFACTURE OF CATHETERS COMPRISING LOW FREQUENCY LOW IMPEDANCE ELECTRODES |
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JP2021500111A true JP2021500111A (ja) | 2021-01-07 |
JP7237954B2 JP7237954B2 (ja) | 2023-03-13 |
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US (1) | US10874824B2 (ja) |
EP (1) | EP3697485B1 (ja) |
JP (1) | JP7237954B2 (ja) |
CN (1) | CN111225707B (ja) |
IL (1) | IL273505B2 (ja) |
WO (1) | WO2019079081A1 (ja) |
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US12031850B2 (en) | 2018-12-16 | 2024-07-09 | Magnisity Ltd. | Magnetic localization using a DC magnetometer |
CN114040724B (zh) * | 2019-07-02 | 2024-08-13 | 圣犹达医疗用品心脏病学部门有限公司 | 降低阻抗电极设计 |
US11547477B2 (en) * | 2019-11-26 | 2023-01-10 | Biosense Webster (Israel) Ltd. | Heat transfer through an ablation electrode |
US20230190366A1 (en) * | 2021-12-17 | 2023-06-22 | Biosense Webster (Israel) Ltd. | High-frequency tissue ablation using coated electrodes |
US20230210580A1 (en) * | 2021-12-30 | 2023-07-06 | Biosense Webster (Isreal) Ltd. | Coated Microelectrodes |
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JP2011507656A (ja) * | 2007-12-28 | 2011-03-10 | リズミア メディカル インコーポレイテッド | 非接触マッピングカテーテル |
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- 2018-10-10 CN CN201880067926.9A patent/CN111225707B/zh active Active
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WO2019079081A1 (en) | 2019-04-25 |
US10874824B2 (en) | 2020-12-29 |
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IL273505B2 (en) | 2023-08-01 |
US20190111233A1 (en) | 2019-04-18 |
IL273505B1 (en) | 2023-04-01 |
CN111225707B (zh) | 2022-07-22 |
EP3697485B1 (en) | 2022-01-12 |
EP3697485A1 (en) | 2020-08-26 |
CN111225707A (zh) | 2020-06-02 |
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