JP2021190524A5 - - Google Patents
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- Publication number
- JP2021190524A5 JP2021190524A5 JP2020093283A JP2020093283A JP2021190524A5 JP 2021190524 A5 JP2021190524 A5 JP 2021190524A5 JP 2020093283 A JP2020093283 A JP 2020093283A JP 2020093283 A JP2020093283 A JP 2020093283A JP 2021190524 A5 JP2021190524 A5 JP 2021190524A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- metal foil
- substrate
- built
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020093283A JP7514655B2 (ja) | 2020-05-28 | 2020-05-28 | 電子部品内蔵基板及びその製造方法 |
| US17/303,049 US11735560B2 (en) | 2020-05-28 | 2021-05-19 | Electronic-component-embedded substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020093283A JP7514655B2 (ja) | 2020-05-28 | 2020-05-28 | 電子部品内蔵基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021190524A JP2021190524A (ja) | 2021-12-13 |
| JP2021190524A5 true JP2021190524A5 (https=) | 2022-12-14 |
| JP7514655B2 JP7514655B2 (ja) | 2024-07-11 |
Family
ID=78705344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020093283A Active JP7514655B2 (ja) | 2020-05-28 | 2020-05-28 | 電子部品内蔵基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US11735560B2 (https=) |
| JP (1) | JP7514655B2 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA3195228A1 (en) | 2020-09-18 | 2022-03-24 | Nubis Communications Inc. | Data processing systems including optical communication modules |
| US11988874B2 (en) | 2020-10-07 | 2024-05-21 | Nubis Communications, Inc. | Data processing systems including optical communication modules |
| TW202238198A (zh) | 2020-11-20 | 2022-10-01 | 美商紐比斯通訊股份有限公司 | 用於具有光通訊模組之機架安裝系統的熱設計 |
| US12066653B2 (en) | 2021-04-22 | 2024-08-20 | Nubis Communications, Inc. | Communication systems having optical power supplies |
| WO2022259763A1 (ja) * | 2021-06-11 | 2022-12-15 | 株式会社村田製作所 | 高周波モジュール、通信装置及び高周波モジュールの製造方法 |
| US12405433B2 (en) | 2021-06-17 | 2025-09-02 | Nubis Communications, Inc. | Communication systems having pluggable modules |
| US12461322B2 (en) | 2021-06-17 | 2025-11-04 | Nubis Communications, Inc. | Communication systems having pluggable modules |
| US12250024B2 (en) | 2021-09-16 | 2025-03-11 | Nubis Communications, Inc. | Data processing systems including optical communication modules |
| EP4152065A1 (en) | 2021-09-16 | 2023-03-22 | Nubis Communications, Inc. | Communication systems having co-packaged optical modules |
| WO2023215315A1 (en) | 2022-05-02 | 2023-11-09 | Nubis Communications, Inc. | Communication systems having pluggable optical modules |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4843188A (en) * | 1986-03-25 | 1989-06-27 | Western Digital Corporation | Integrated circuit chip mounting and packaging assembly |
| US5157589A (en) * | 1990-07-02 | 1992-10-20 | General Electric Company | Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's |
| JP3351312B2 (ja) | 1997-09-26 | 2002-11-25 | 日立電線株式会社 | Ｔ−ｂｇａ用ｔａｂテープの製造方法 |
| JP2002151615A (ja) | 2000-11-07 | 2002-05-24 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2012204831A (ja) | 2011-03-23 | 2012-10-22 | Ibiden Co Ltd | 電子部品内蔵配線板及びその製造方法 |
| JP5167516B1 (ja) | 2011-11-30 | 2013-03-21 | 株式会社フジクラ | 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体 |
| DE102014206601A1 (de) * | 2014-04-04 | 2015-10-08 | Siemens Aktiengesellschaft | Verfahren zum Montieren eines elektrischen Bauelements, bei der eine Haube zum Einsatz kommt, und zur Anwendung in diesem Verfahren geeignete Haube |
| JP6626697B2 (ja) | 2015-11-24 | 2019-12-25 | 京セラ株式会社 | 配線基板およびその製造方法 |
| JP6610612B2 (ja) | 2017-04-28 | 2019-11-27 | 味の素株式会社 | 支持体付き樹脂シート |
| CN121815845A (zh) * | 2019-01-29 | 2026-04-07 | 奥斯兰姆奥普托半导体股份有限两合公司 | 微型发光二极管、微型发光二极管装置、显示器及其方法 |
| US11101191B2 (en) * | 2019-11-22 | 2021-08-24 | International Business Machines Corporation | Laminated circuitry cooling for inter-chip bridges |
-
2020
- 2020-05-28 JP JP2020093283A patent/JP7514655B2/ja active Active
-
2021
- 2021-05-19 US US17/303,049 patent/US11735560B2/en active Active
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