JP2021189400A - Optical module and optical waveguide connection method - Google Patents

Abstract

To provide an optical module capable of achieving highly efficient optical connection with low cost and simple configuration, and an optical waveguide connection method.SOLUTION: An optical module 100 includes: a fiber 11; a fiber guide holding the fiber; a guide holder 22 that holds the fiber guide and has a first alignment mark; and an optical circuit board 2 that has an optical input/output part 61 and a second alignment mark, in which the second alignment mark is bonded to the guide holder in a state facing the first alignment mark via an adhesive 81.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a method of connecting an optical module and an optical waveguide.

In recent years, the use of light has been studied in fields such as high-speed / large-capacity communication and sensing. In particular, a technique called "silicon photonics" that forms a fine optical circuit having an optical control function on a silicon substrate by a CMOS (Complementary Metal Oxide Semiconductor) process, similar to a semiconductor electronic circuit, is attracting attention. The fine circuit on the optical circuit board formed by the silicon photonics technology includes an optical input / output unit, an optical modulator, and the like. These are connected by a fine wire waveguide on the order of submicron. In addition, various optical interfaces are being actively developed in order to connect an external transmitter such as an optical fiber to a thin wire waveguide with high accuracy (Fiber-to-Chip connection). A diffraction grating type optical coupler is generally used for an optical input / output unit (a mechanism for inputting light from the outside of the optical circuit) provided on the optical circuit side. When an optical circuit is connected to an optical fiber, "passive alignment" that aligns by image recognition without emitting light or operating a light receiving element is indispensable for cost reduction. It has become.

In Patent Document 1, a diffraction grating, which is a diffraction grating type optical input / output unit, is provided on an optical wiring substrate, a hydrophobic film having an opening is formed at a position corresponding to the diffraction grating, and a hydrophobic film having an opening is formed and adhered in the opening. A method and a module for self-aligning an optical fiber by forming a layer and using the surface tension of the adhesive layer to self-align the optical fiber are disclosed. The optical fiber is connected to the opening by an adhesive layer, which enables self-alignment of the optical fiber and secures the tip of the optical fiber core to the coupling position with the diffraction grating. .. As a result, the optical fiber is optically connected to the diffraction grating with low loss and high accuracy.

Japanese Unexamined Patent Publication No. 2018-17927

However, in the prior art of Patent Document 1, when the optical fibers are self-aligned by the surface tension of the adhesive layer, the alignment accuracy largely depends on the positional accuracy of the adhesive layer and the hydrophobic film. , Expensive equipment such as high-precision micro-coating equipment is required. Further, since the adhesive layer is interposed on the optical path of the optical fiber, there is a problem that connection loss occurs due to the influence of the refractive index of the adhesive layer.

The non-limiting examples of the present disclosure contribute to the provision of an optical module and an optical waveguide connection method that realize a highly efficient optical connection with a low cost and a simple configuration.

The optical module according to an embodiment of the present disclosure includes a fiber, a fiber guide that holds the fiber, a guide holder that holds the fiber guide and has a first alignment mark, an optical input / output unit, and a second. An optical circuit board having an alignment mark and having the second alignment mark facing the first alignment mark and being adhered to the guide holder via an adhesive is provided.

According to one embodiment of the present disclosure, it is possible to construct an optical module and an optical waveguide connection method that realize highly efficient optical connection with a low cost and a simple configuration.

Further advantages and effects in one embodiment of the present disclosure will be apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and the features described in the specification and drawings, respectively, but not all are provided in order to obtain one or more identical features. There is no need.

Cross-sectional view of the optical module 100 according to the embodiment of the present disclosure along the XZ plane. A plan view of the fiber unit 1 shown in FIG. 1 from below. A plan view of the optical circuit board 2 shown in FIG. 1 from above. The figure which shows the application position of the adhesive 81 to the optical circuit board 2. The figure which shows the state before the alignment of an optical circuit board 2 and a fiber unit 1 is performed. The figure which shows the state after the alignment of an optical circuit board 2 and a fiber unit 1 is performed. The figure for demonstrating the effect of the damming groove 31 Cross-sectional view of a modified example of the optical module 100 according to the embodiment of the present disclosure along the XZ plane. A plan view of the fiber unit 10 shown in FIG. 8 from below.

Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the present specification and the drawings, components having substantially the same function are designated by the same reference numerals, and duplicate description will be omitted. In the following figures, the shapes, thicknesses, lengths, etc. of the constituent members shown in each are different from the actual shapes, thicknesses, lengths, etc. of the constituent members in drawing. Further, the material of each constituent member is not limited to the material described in this embodiment.

In FIGS. 1 and 1, the X-axis direction, the Y-axis direction, and the Z-axis direction represent a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. The X-axis direction and the Y-axis direction are orthogonal to each other. The X-axis direction and the Z-axis direction are orthogonal to each other. The Y-axis direction and the Z-axis direction are orthogonal to each other. The XY plane represents a virtual plane parallel to the X-axis direction and the Y-axis direction. The XZ plane represents a virtual plane parallel to the X-axis direction and the Z-axis direction. The YZ plane represents a virtual plane parallel to the Y-axis direction and the Z-axis direction. Of the X-axis directions, the direction indicated by the arrow is the plus X-axis direction, and the direction opposite to the direction is the minus X-axis direction. Of the Y-axis directions, the direction indicated by the arrow is the plus Y-axis direction, and the direction opposite to the direction is the minus Y-axis direction. Of the Z-axis directions, the direction indicated by the arrow is the plus Z-axis direction, and the direction opposite to the direction is the minus Z-axis direction. The Z-axis direction is, for example, equal to the vertical direction, the stacking direction, or the vertical direction, and the X-axis direction and the Y-axis direction are equal to, for example, the horizontal direction or the left-right direction. For example, the direction perpendicular to the main surface of the optical circuit board 2 described later is equal to the Z-axis direction, and the optical axial direction of the optical waveguide 51 is equal to the X-axis direction in the XY plane orthogonal to the Z-axis direction.

[Embodiment]
First, with reference to FIGS. 1, 2 and 3, the main parts constituting the optical module 100 according to the embodiment of the present disclosure will be described. FIG. 1 is a cross-sectional view taken along the XZ plane of the optical module 100 according to the embodiment of the present disclosure, and FIG. 2 is a plan view of the fiber unit 1 shown in FIG. 1 from below. FIG. 3 is a plan view of the optical circuit board 2 shown in FIG. 1 from above.

<Configuration of optical module 100>
The optical module 100 includes a fiber unit 1 and an optical circuit board 2. The fiber unit 1 includes a fiber 11 having a core 12 and a clad 13, a fiber guide 21 which is a component for holding the fiber 11, and a guide holder 22 which is a component for holding the fiber guide 21.

Examples of the fiber 11 include a single mode fiber, a multimode fiber, a quartz fiber, and a plastic fiber.

At the center of the fiber guide 21, an opening 21a having an inner diameter larger than the outer diameter of the clad 13 is formed. The dimension of the inner diameter is, for example, about 10 [μm] to 15 [μm] larger than the outer diameter of the clad 13.

For example, an adhesive is provided between the outer peripheral surface 13a of the clad 13 and the inner peripheral surface 21a1 forming the opening 21a of the fiber guide 21. The fiber 11 inserted into the fiber guide 21 is held on the inner peripheral surface 21a1 of the fiber guide 21 via this adhesive.

The end face 21b of the fiber guide 21 in the minus Z-axis direction is mechanically polished by, for example, a method such as CMP (chemical mechanical polishing). The end surface 21b is a surface of the optical circuit board 2 facing the end surface 2a in the plus Z-axis direction. By polishing the end surface 21b, the processing angle θ, which is the angle formed by the end surface 21b and the outer peripheral surface 21c of the fiber guide 21, is set to, for example, 45 ° to 90 °.

The guide holder 22 is a member that holds the fiber guide 21. The guide holder 22 is made of a transparent material in the visible range, for example, polyvinyl chloride, acrylic resin, melamine resin, urea resin, phenol resin, epoxy resin, acrylic epoxy resin, polyimide resin, urethane resin, polyester resin, silicon resin. It is a part that is molded into a plate shape. The guide holder 22 has an opening having an inner diameter larger than the outer diameter of the fiber guide 21 at the center on the XY plane. The dimension of the inner diameter is, for example, about 10 [μm] to 15 [μm] larger than the outer diameter of the fiber guide 21.

For example, an adhesive is provided between the outer peripheral surface 21c of the fiber guide 21 and the inner peripheral surface 22b of the opening of the guide holder 22. With this adhesive, the fiber guide 21 inserted in the guide holder 22 is held on the inner peripheral surface 22b of the guide holder 22.

The guide holder 22 has an end surface 22c in the plus Z-axis direction, an end surface 22a in the minus Z-axis direction, and an inner peripheral surface 22b. The end face 22a of the guide holder 22 in the minus Z-axis direction is flattened by mechanical polishing while the processing angle θ of the fiber guide 21 described above is secured. The end surface 22a is a surface of the optical circuit board 2 facing the end surface 2a in the plus Z-axis direction. The angle formed by the end surface 22a and the inner peripheral surface 22b forming the opening of the guide holder 22 is set to, for example, 45 ° to 90 °.

The guide holder 22 is formed with a damming groove 31 and a pair of holder alignment marks 41 and 42. Hereinafter, the pair of holder alignment marks 41 and 42 are simply referred to as holder alignment marks 41 and 42.

The dam 31 is formed on the end surface 22a of the guide holder 22, that is, on the lower surface of the guide holder 22. The damming groove 31 is an annular groove formed so as to surround the inner peripheral surface 22b of the opening of the guide holder 22 by, for example, mechanical cutting using a single crystal diamond bite. The shape of the annular dam groove 31 viewed in a plan view in the plus Z-axis direction is, for example, a circular shape or an elliptical shape.

The holder alignment marks 41 and 42 are a pair of metal films formed on the end face 22a of the guide holder 22 by, for example, patterning by photolithography. Photolithography is a technology to generate patterns such as circuits by irradiating a silicon substrate coated with a photosensitive agent (photoresist) with a pattern (photomask, reticle) as an original plate with light radiation such as ultraviolet rays and exposing it. Is.

The holder alignment marks 41 and 42 are marks for aligning the fiber unit 1 with the optical circuit board 2 coated with the adhesive 81. The holder alignment marks 41 and 42 are formed at positions symmetrical with respect to the second virtual line 6 on the first virtual line 5, for example, so as to straddle the center point CP of the guide holder 22. The first virtual line 5 is a virtual line parallel to the end surface 22a of the guide holder 22 and passing through the center point CP of the guide holder 22. The second virtual line 6 is a virtual line parallel to the end surface 22a of the guide holder 22, orthogonal to the first virtual line 5, and further passing through the center point CP of the guide holder 22.

The center point CP is provided at a position facing the end of the core 12 of the fiber 11. The holder alignment marks 41 and 42 are formed so as to sandwich the core 12 with the center point CP as the center of the core 12. Further, the pair of substrate alignment marks 71 and 72 shown in FIG. 3 are accurately patterned at positions facing each other in the Z-axis direction. Hereinafter, the pair of substrate alignment marks 71 and 72 are simply referred to as substrate alignment marks 71 and 72. Details of the substrate alignment marks 71 and 72 will be described later.

The shape of the holder alignment marks 41 and 42 is, for example, a cross shape. However, the shape of the holder alignment marks 41 and 42 is not limited to the cross shape, and the center position (center point) of each of the holder alignment marks 41 and 42 such as a quadrangular shape, an annular circle, a round dot shape, and a triangular shape is used. Any shape may be used as long as it is easily visible. The size of the holder alignment marks 41 and 42 is 0.1 to 500 [μm] for each of the four sides in the case of a square shape, and each of the two lines orthogonal to each other in the case of a cross shape. The length is 0.1 to 500 [μm], the diameter is 0.1 to 500 [μm] when it is circular, and the diameter is 0.1 to 500 [μm] when it is round and dotted. ]. Further, the size of the holder alignment marks 41 and 42 is 0.1 to 500 [μm] in the case of a triangular shape, and the length of each of the three sides is 0.1 to 500 [μm]. By forming the holder alignment marks 41 and 42 in such a size, each of the holder alignment marks 41 and 42 is easy to recognize and the alignment accuracy is improved, which is preferable. When the depths of the holder alignment marks 41 and 42 are, for example, 0.01 to 100 [μm], the alignment accuracy is improved, which is preferable.

The number of holder alignment marks 41 and 42 is not limited to two, and may be one or three or more. In order to improve the alignment accuracy, two are preferable, and three or more are more preferable.

For example, when one holder alignment mark 41 is used, if the holder alignment mark 41 has a square shape and one substrate alignment mark corresponding to the holder alignment mark has a cross shape, the holder alignment mark 41 can be placed in each of the four sides of the square. By superimposing the holder alignment mark 41 on the substrate alignment mark 71 so that the two cross-shaped lines orthogonal to each other fit together, the guide holder 22 can be accurately aligned in the X-axis direction and the Y-axis direction. can.

As another example, if one holder alignment mark has a triangular shape and one board alignment mark corresponding to the triangle shape, any one of the three sides of the triangle and the four sides of the square will be formed. By superimposing the holder alignment mark on the substrate alignment mark so that any one of the sides overlaps with each other, the guide holder 22 can be accurately aligned in the X-axis direction and the Y-axis direction.

When the three holder alignment marks are used, for example, the three holder alignment marks are coaxially around the center point CP and in the circumferential direction of each other so as to straddle the center point CP of the guide holder 22. Arranged so that the positions are equal. Then, by arranging the three substrate alignment marks corresponding to these in the same manner, the three holder alignment marks can be superimposed on the three substrate alignment marks. This makes it possible to more accurately align the guide holder 22 in the X-axis direction and the Y-axis direction.

The optical circuit board 2 includes substrate alignment marks 71 and 72, an optical waveguide 51, and an optical input / output unit 61.

The substrate alignment marks 71 and 72 are a pair of metal films formed on the end face 2a of the optical circuit board 2 by, for example, patterning by photolithography. The substrate alignment marks 71 and 72 are marks for aligning the fiber unit 1 with the optical circuit board 2. The substrate alignment marks 71 and 72 are formed at positions symmetrical with respect to the second virtual line 6a on the first virtual line 5a so as to straddle the optical input / output unit 61, for example. The first virtual line 5a is a virtual line parallel to the end surface 2a of the optical circuit board 2 and passing through the optical input / output unit 61. The second virtual line 6a is a virtual line parallel to the end surface 2a of the optical circuit board 2, orthogonal to the first virtual line 5a, and further passing through the centers of the optical input / output unit 61 and the optical waveguide 51. be. The second virtual line 6 is equal to the optical axis of the optical waveguide 51.

The shapes of the substrate alignment marks 71 and 72 are, for example, a quadrangular shape. However, the shapes of the substrate alignment marks 71 and 72 are not limited to the square shape, and the center positions (center points) of the substrate alignment marks 71 and 72 such as a cross shape, an annular circle, a round dot shape, and a triangular shape are different. Any shape may be used as long as it is easily visible. The size of the substrate alignment marks 71 and 72 is 0.1 to 500 [μm] for each of the four sides in the case of a square shape, and each of the two lines orthogonal to each other in the case of a cross shape. When the length is 0.1 to 500 [μm] and it is circular, its diameter is 0.1 to 500 [μm], and when it is round and dotted, its diameter is 0.1 to 500 [μm]. Is. Further, in the case of the size of the substrate alignment marks 71 and 72, in the case of a triangular shape, the length of each of the three sides is 0.1 to 500 [μm]. It is preferable that the substrate alignment marks 71 and 72 are formed in such a size because they can be easily recognized and the alignment accuracy is improved. When the depths of the substrate alignment marks 71 and 72 are, for example, 0.01 to 100 [μm], the alignment accuracy is improved, which is preferable.

The number of substrate alignment marks 71 and 72 is not limited to two, and may be one or three or more. In order to improve the alignment accuracy, two are preferable, and three or more are more preferable.

An adhesive 81 is applied to the optical circuit board 2, and the adhesive 81 is, for example, a photocurable resin. The details of the position where the adhesive 81 is applied will be described later.

After the adhesive 81 is applied to the optical circuit board 2, the fiber unit 1 is aligned with the holder alignment marks 41 and 42 with respect to the substrate alignment marks 71 and 72, via the adhesive 81. It is bonded to the optical circuit board 2.

At this time, the adhesive 81 spreads toward the center of the guide holder 22, but since a part of the adhesive 81 enters the dam groove 31, the tip of the core 12 of the fiber 11 arranged in the center of the guide holder 22 It is possible to prevent the adhesive 81 from adhering to the portion.

<Optical waveguide connection method>
Next, the optical waveguide connection method for realizing the optical module 100 of the present disclosure will be described in detail with reference to FIG. 4 and the like. FIG. 4 is a diagram showing a position where the adhesive 81 is applied to the optical circuit board 2.

First, as shown in FIG. 4, the adhesive 81 is applied in an annular shape on the end face 2a of the optical circuit board 2. Specifically, the inner diameter 81a of the adhesive 81 is larger than the outer diameter of the annular dam groove 31 formed in the guide holder 22 shown in FIG. 2, and the outer diameter 81b of the adhesive 81 is the guide holder 22. It is applied so that it is smaller than the outer diameter.

Next, the fiber unit 1 is bonded to the optical circuit board 2 coated with the adhesive 81, and the optical circuit board 2 and the fiber unit 1 are aligned. Alignment will be described with reference to FIGS. 5 and 6.

FIG. 5 is a diagram showing a state before the alignment between the optical circuit board 2 and the fiber unit 1 is performed, and FIG. 6 is a diagram showing a state after the alignment between the optical circuit board 2 and the fiber unit 1 is performed. Is.

The fiber unit 1 is installed on the optical circuit board 2 so that the positions of the substrate alignment marks 71 and 72 of the fiber unit 1 coincide with the approximate positions of the holder alignment marks 41 and 42 of the optical circuit board 2. As a result, the fiber unit 1 is bonded onto the optical circuit board 2 in a state where the annular adhesive 81 applied to the optical circuit board 2 is located outside the dam 31 of the fiber unit 1.

At this time, since the guide holder 22 is a transparent material in the visible region, for example, by using an image pickup means such as a camera from above the guide holder 22 shown in FIG. 5, the fiber unit 1 in a direction parallel to the XY plane is used. And the amount of deviation between the optical circuit board 2 and the optical circuit board 2 can be observed. Since this deviation amount can be calculated from the distance from the center position of the holder alignment marks 41 and 42 to the center position of the substrate alignment marks 71 and 72, the deviation amount can be calculated based on these positional relationships captured by a camera or the like. .. Then, based on the calculated deviation amount, the fiber unit 1 is aligned in the direction 101 of the arrow shown in FIG. At this time, since the adhesive 81 is interposed between the fiber unit 1 and the optical circuit board 2, alignment can be easily performed under the liquid by utilizing this fluidity.

Here, an example of aligning the fiber unit 1 is shown, but if the position can be adjusted, the optical circuit board 2 may be aligned.

When the position is corrected by the alignment, as shown in FIG. 6, the center positions of the holder alignment marks 41 and 42 and the substrate alignment marks 71 and 72 match, and as a result, the core 12 and the optical input / output unit 61 are optical. The optical connection will be made with high accuracy so that the transmission efficiency of the light will be high.

Next, the effect of the dam 31 will be described with reference to FIG. 7. FIG. 7 is a diagram for explaining the effect of the damming groove 31. A cross-sectional view of the optical module 100 before the alignment operation is shown on the upper side of FIG. 7. The lower side of FIG. 7 shows a cross-sectional view of the optical module 100 after the alignment operation.

When the fiber unit 1 is adhered to an approximate position on the optical circuit board 2, the adhesive 81 is present outside the dam 31 as shown in the upper diagram of FIG. 7. After that, when the position of the fiber unit 1 is corrected in the direction 101 indicated by the arrow, a part of the adhesive 81 penetrates into the damming groove 31 as shown in the lower figure of FIG. 7, and the damming groove 31 The inflow of the adhesive 81 into the inside of the is dammed. This makes it possible to prevent the adhesive 81 from entering the region where the core 12 of the fiber 11 and the optical circuit board 2 face each other. Therefore, the optical connection between the core 12 of the fiber 11 and the optical input / output unit 61 on the optical circuit board 2 becomes possible. As a result, highly efficient optical connection can be realized without being affected by the refractive index of the adhesive 81 or the like.

Finally, by curing the adhesive 81, the fiber unit 1 is fixed to the optical circuit board 2. As a result, an optical connection between the core 12 of the fiber 11 and the optical waveguide 51 on the optical circuit board 2 is realized. Further, according to the connection method of the optical module and the optical waveguide according to the present embodiment, the fiber can be used by using the alignment mark without using an expensive device such as a high-precision micro-coating device as in the prior art. Since the clad 13 of 11 can be aligned with the optical input / output unit 61, highly efficient optical connection can be realized with a low cost and a simple configuration.

<Modification example of optical module 100>
Hereinafter, a modified example of the present embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a cross-sectional view taken along the XZ plane of a modified example of the optical module 100 according to the embodiment of the present disclosure. FIG. 9 is a plan view of the fiber unit 10 shown in FIG. 8 from below. In FIGS. 8 and 9, the same reference numerals are used for the same components as those shown in FIGS. 1 and 2, and the description thereof will be omitted.

The optical module 100 according to the modified example includes a fiber unit 1A instead of the fiber unit 1.

The guide holder 22 of the fiber unit 1A is formed with a stepped portion 31A instead of the damming groove 31. The step portion 31A is formed so as to surround the inner peripheral surface 22b of the opening of the guide holder 22, for example, by mechanical cutting using a single crystal diamond bite. The radial thickness from the inner peripheral surface 22b of the opening to the stepped portion 31A is, for example, 0.5 to 5 [mm]. By forming the stepped portion 31A, an inner region and an outer region having different thicknesses in the Z-axis direction are formed in 22a of the guide holder 22. The thickness of the inner region of the guide holder 22 is larger than the thickness of the outer region of the guide holder 22.

By providing the stepped portion 31A, when the position of the fiber unit 1 is corrected after the fiber unit 1 is adhered to an approximate position on the optical circuit board 2, the stepped portion 31A causes an inner region of the stepped portion 31A. The inflow of the adhesive 81 to the adhesive 81 is blocked. Therefore, it is possible to prevent the adhesive 81 from entering the region where the core 12 of the fiber 11 and the optical circuit board 2 face each other.

By providing the stepped portion 31A in this way, the same effect as when the damming groove 31 is provided can be obtained. Further, as compared with the case where the damming groove 31 is provided, the surface on which the holder alignment marks 41 and 42 and the substrate alignment marks 71 and 72 can be formed becomes wider, so that the fiber unit 1 while improving the degree of freedom in designing the guide holder 22. The fixing strength to the optical circuit board 2 is improved.

It should be noted that, for example, the following aspects are also understood to belong to the technical scope of the present disclosure.

(1) The optical module 100 holds a fiber 11, a fiber guide 21 that holds the fiber 11, and a guide holder 22 that holds the fiber guide 21 and has a first alignment mark (holder alignment marks 41, 42). And, with the optical input / output unit 61 and the second alignment mark (board alignment marks 71, 72), and the second alignment mark facing the first alignment mark, the said via the adhesive 81. The optical circuit board 2 adhered to the guide holder 22 is provided.

(2) The end surface (second end surface 22a) of the guide holder 22 facing the optical circuit board 2 has a damming portion (damping groove 31, A step portion 31A) is formed.

(3) The damming portion is an annular groove formed so as to surround the central portion of the guide holder 22.

(4) The damming portion is a step formed so as to surround the central portion of the guide holder 22.

(5) The guide holder 22 is made of a transparent material in the visible region.

(6) The first alignment mark and the second alignment mark are formed of a metal film.

(7) The optical waveguide connection method holds a coating step of applying an adhesive 81 to an optical circuit board 2 having an input / output unit 61 and a first alignment mark (board alignment marks 71, 72) and a fiber guide 21. The mounting process of mounting the guide holder 22 having the second alignment mark (holder alignment marks 41, 42) facing the first alignment mark on the adhesive 81, and the second alignment mark. 1 Includes an alignment step of aligning to the position of the alignment mark.

(8) On the end surface (second end surface 22a) of the guide holder 22 facing the optical circuit board 2, damming portions 31, 31A are formed to prevent the adhesive 81 from entering the central portion of the guide holder 22. Then, in the alignment step, when the second alignment mark is aligned with the position of the first alignment mark, the adhesive 81 penetrates into the portion where the core of the fiber 11 faces the optical input / output section 61. Is dammed by the damming portion 31.

(9) The damming portion used in the optical waveguide connection method is an annular groove formed so as to surround the central portion of the guide holder 22.

(10) The damming portion used in the optical waveguide connection method is a step formed so as to surround the central portion of the guide holder 22.

(11) The guide holder 22 used in the optical waveguide connection method is made of a transparent material in the visible region.

(12) The first alignment marks 71 and 72 and the second alignment marks 41 and 42 used in the optical waveguide connection method are formed of a metal film.

One embodiment of the present disclosure is suitable for semiconductor devices. Further, since the optical module and the optical waveguide connection method according to the present disclosure can permanently connect the fiber and the optical waveguide on the optical circuit board with high accuracy, high-speed optical communication or laser light as represented by silicon photonics is used. It can be applied in the field of high-precision sensing.

1,1A: Fiber unit 2: Optical circuit board 2a: End face 10: Fiber unit 11: Fiber 12: Core 13: Clad 13a: Outer peripheral surface 21: Fiber guide 21a: Opening 21a1: Inner peripheral surface 21b: End face 21c: Outer circumference Surface 22: Guide holder 22a: End surface 22b: Inner peripheral surface 22c: End surface 31: Dam stop groove 31A: Step portion 41, 42: Holder alignment mark 51: Optical waveguide 61: Optical input / output portion 71, 72: Board alignment mark 81: Adhesive 100: Optical module

Claims (12)

With fiber
A fiber guide for holding the fiber and
A guide holder that holds the fiber guide and has the first alignment mark,
An optical circuit board having an optical input / output unit and a second alignment mark and being adhered to the guide holder via an adhesive with the second alignment mark facing the first alignment mark.
Optical module with. The optical module according to claim 1, wherein a damming portion for damming the infiltration of the adhesive into the central portion of the guide holder is formed on an end surface of the guide holder facing the optical circuit board. The optical module according to claim 2, wherein the dam is an annular groove formed so as to surround the central portion of the guide holder. The optical module according to claim 2, wherein the damming portion is a step formed so as to surround the central portion of the guide holder. The optical module according to any one of claims 1 to 4, wherein the guide holder is made of a transparent material in the visible region. The optical module according to any one of claims 1 to 5, wherein the first alignment mark and the second alignment mark are formed of a metal film. The coating process of applying an adhesive to the input / output section and the optical circuit board having the first alignment mark,
A mounting process of mounting a guide holder that holds a fiber guide and has a second alignment mark facing the first alignment mark on the adhesive.
An alignment step of aligning the second alignment mark with the position of the first alignment mark, and
Optical waveguide connection method including. A damming portion is formed on the end surface of the guide holder facing the optical circuit board to prevent the adhesive from entering the central portion of the guide holder.
In the alignment step, when the second alignment mark is aligned with the position of the first alignment mark, the adhesive penetrates into the portion where the core of the fiber faces the optical input / output portion, and the damming portion. The optical waveguide connection method according to claim 7, which is dammed by. The optical waveguide connection method according to claim 8, wherein the damming portion is an annular groove formed so as to surround the central portion of the guide holder. The optical waveguide connection method according to claim 8, wherein the damming portion is a step formed so as to surround the central portion of the guide holder. The optical waveguide connection method according to any one of claims 7 to 10, wherein the guide holder is made of a transparent material in the visible region. The optical waveguide connection method according to any one of claims 7 to 11, wherein the first alignment mark and the second alignment mark are formed of a metal film.

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