JP2021186886A - Cutting blade, cutting blade manufacturing method and electronic material manufacturing method - Google Patents

Abstract

To provide a cutting blade that can efficiently cut a substrate into pieces, in cutting an electronic material as a material to be processed, a cutting blade manufacturing method and an electronic material manufacturing method.SOLUTION: A cutting blade 100 comprises: a blade main body 10 in which diamond super-abrasives are dispersedly located in a metal bond phase formed in a discoid shape and a cutting blade 11A is arranged in an outer periphery part 11 thereof; a surface-treatment blade 20 for treating a surface of a work-piece, in which diamond super-abrasives are dispersedly located in a resin bond phase formed in a discoid-shape and which is set to be larger in abrasion speed than the blade main body 10 and which is formed to be smaller in diameter than the blade main body 10; and an adhesive resin layer 30. The surface-treatment blade 20 is connected to side surfaces at both sides of the blade main body 10 by the adhesive resin layer 30.SELECTED DRAWING: Figure 2

Description

The present invention relates to a cutting blade, a cutting blade manufacturing method, and an electronic material manufacturing method capable of improving production efficiency.

As is well known, when a substrate such as a semiconductor material is cut into pieces into chips, for example, when a metal bond phase containing Cu—Sn as a main component is formed by sintering, abrasive grains are dispersed and arranged. A cutting blade (metal blade) is used (see, for example, Patent Document 1).

Further, as a cutting blade for separating a substrate such as a semiconductor material, a metal blade having a metal bond phase, a resin blade having a resin bond phase, and a vitrified blade having a vitrified bond phase are used. (See, for example, Patent Documents 2 and 3.).

In such a cutting blade, the abrasive grains dispersed in the bond phase (for example, the metal bond phase) cut into the material to be cut and cut, and the abrasive grains held in the bond phase are used for cutting load. The cutting edge is spontaneously generated by falling off from the outer peripheral edge of the cutting blade due to wear or wear, and the cutting performance of the cutting blade is ensured.

Japanese Unexamined Patent Publication No. 2003-094341 Japanese Unexamined Patent Publication No. 2013-154424 Japanese Unexamined Patent Publication No. 61-178181

However, when cutting the material to be cut, burrs and the like generally protrude on the surface of the material to be cut. Therefore, after cutting the material to be processed, it is necessary to remove burrs and the like protruding from the surface of the material to be cut when the material is cut.

The present invention has been made in consideration of such circumstances, and is a cutting blade capable of cutting a substrate and efficiently individualizing it when cutting an electronic material as a work material. It is an object of the present invention to provide a method for manufacturing a cutting blade and a method for manufacturing an electronic material.

In order to solve the above problems, the present invention proposes the following means.
(1) The first aspect of the present invention is a cutting blade that is rotated around an axis and processes a work piece by a cutting edge, in which abrasive grains are dispersed and arranged in a bond phase formed in a disk shape. Abrasive grains are dispersedly arranged in the blade body in which the cutting edge is arranged on the outer peripheral portion and the bond phase formed in a disk shape, the wear rate is set higher than that in the blade body, and the diameter is smaller than that in the blade body. The surface-treated blade is provided with at least one surface-treated blade formed on the blade to treat the surface of the material to be processed, and the surface-treated blade is arranged on at least one side surface of the blade body in the axial direction. It is a feature.

According to the cutting blade according to the present invention, the blade main body in which the abrasive grains are dispersed and arranged in the bond phase formed in the disk shape and the cutting edge is arranged in the outer peripheral portion, and the bond phase formed in the disk shape. The abrasive grains are distributed and arranged, the wear rate is set higher than that of the blade body, and the surface treatment blade is formed to have a smaller diameter than the blade body and treats the surface of the work material. The surface treatment blade is the blade body. Since it is arranged on at least one side surface in the axial direction of the machine, protrusions such as burrs generated when cutting the work material can be surface-treated (removed) at the same time as cutting.
As a result, when cutting an electronic material as a work material, the substrate can be cut and efficiently separated into individual pieces.

Here, the cutting blade may be arbitrarily set for the connection between the blade body and the surface treatment blade. For example, it may be connected (attached) by a connecting member (adhesive, adhesive, adhesive (double-sided, single-sided) tape), or may be connected by using a fastening member. Further, the blade body and the surface treatment blade may be integrally formed.

Further, the treatment of the surface of the material to be processed (surface treatment) means, for example, removing protrusions (for example, burrs generated by cutting) in contact with the surface of the material to be cut, as well as protrusions of burrs and the like. It means to make the part below a certain height from the surface of the material to be cut.

Further, the fact that the wear rate of the surface-treated blade is set to be higher than that of the blade body means that the surface-treated blade follows the wear of the blade body when the cutting blade cuts the material to be machined. It does not mean that the surface-treated blade wears prior to the blade body during processing).

Further, the fact that the diameter is smaller than that of the blade body means that the outer diameter (radius) of the blade body> (thickness of the material to be cut) + (outer diameter (radius) of the surface-treated blade), in other words, the surface treatment. The amount of protrusion of the blade body from the surface of the blade (= amount of protrusion of the cutting edge)> the thickness of the material to be cut. With the above configuration, the surface treatment blade follows the wear of the blade body in the cutting process, so that the cutting blade has the outer diameter (radius) of the blade body> (to be cut) even at the end of its life. The thickness of the material) + (outer diameter (radius) of the surface treatment blade) is maintained, but the life of the cutting blade can be set arbitrarily.

The bond phase constituting the blade body and the surface treatment blade may be formed of a different type from the metal phase, the resin phase, and the vitrified phase, or may be formed of the same type of material.

(2) The cutting blade according to (1) above, wherein the surface treatment blade is arranged on both side surfaces of the blade main body in the axial direction.

According to the cutting blade according to the present invention, since the surface treatment blades are arranged on both side surfaces of the blade body in the axial direction, when cutting the material to be cut, both the left and right sides of the cut portion of the material to be cut The surface of the surface can be efficiently surface-treated.
In addition, the load associated with the surface treatment of the cutting blade can be balanced and stably cut on both sides in the axial direction of the cutting blade.

(3) The cutting blade according to (1) or (2) above, wherein the bond phase of the surface-treated blade is made of a material having a hardness lower than that of the bond phase of the blade body. And.

According to the cutting blade according to the present invention, since the bond phase of the surface-treated blade is made of a material having a hardness lower than that of the bond phase of the blade body, it wears following the blade body when cutting. .. Therefore, when the blade body is worn during cutting and the cutting amount is increased, it is possible to prevent the surface-treated blade from biting into the surface of the material to be cut and removing it excessively.

Here, low hardness means that it is intended to be soft, for example, when the surface treatment blade is brought into contact with the surface of the planned material to be cut (under the same conditions as the surface treatment), the surface treatment blade is used. It may be verified that the wear rate is smaller than the wear rate of the cutting blade when cutting the material to be cut. Further, for example, Vickers hardness (JIS Z 2244: 2009) or the like may be applied.

(4) The cutting blade according to any one of (1) to (3) above, wherein the bond phase of the blade body is a metal bond phase, and the bond phase of the surface treatment blade is a resin. It is characterized by being a bond phase.

According to the cutting blade according to the present invention, since the bond phase of the blade body is a metal bond phase and the bond phase of the surface-treated blade is a resin bond phase, it can be efficiently manufactured.

(5) The cutting blade according to any one of (1) to (3) above, comprising a connecting member for connecting the blade main body and the surface treatment blade, and the connecting member is an adhesive. Is characterized by being composed of a cured resin.

According to the cutting blade according to the present invention, the blade body and the surface-treated blade are connected by a resin having a cured adhesive, so that the blade can be efficiently manufactured. Further, the connection interval between the blade body and the surface-treated blade in the axial direction can be reduced to stably cut the material to be cut.

The adhesive refers to an adhesive that connects the blade body and the surface-treated blade by being cured by physical conditions such as aging, drying, and temperature, chemical reaction, etc., and is an adhesive resin having fluidity and normal temperature. Includes those that do not have fluidity, have fluidity depending on physical conditions such as temperature, and function as an adhesive by being cured, an ultraviolet curable resin that is cured by ultraviolet rays, an anaerobic adhesive, and the like.
Further, the adhesive resin portion (adhesive) may be composed of a plurality of substances such that a mixture such as a conductive substance is dispersed.

(6) The cutting blade according to any one of (1) to (4) above, comprising a connecting member for connecting the blade main body and the surface treatment blade, and the connecting member is an adhesive. It is characterized by being composed of.

According to the cutting blade according to the present invention, since the blade main body and the surface treatment blade are connected by an adhesive, it is not necessary to cure the blade main body and the surface treatment blade efficiently. Can be produced.

(7) The cutting blade according to any one of (1) to (4) above, comprising a connecting member for connecting the blade main body and the surface treatment blade, and the connecting member is a double-sided tape. It is characterized by being composed of.

According to the cutting blade according to the present invention, since the blade main body and the surface treatment blade are connected by double-sided tape, it can be efficiently manufactured.

Here, the double-sided tape is a tape in which an adhesive resin is arranged on both sides of a tape base material, and an adhesive resin (hereinafter referred to as an adhesive resin) is formed in a sheet shape on both sides. Includes those having an adhesive structure, those having an adhesive arranged on both sides of a tape base material, those having a sheet-like adhesive resin formed in a sheet shape, and the like.

(8) The second aspect of the present invention is the cutting blade manufacturing method according to (5) above, wherein the blade main body forming step for forming the blade main body and the surface treatment blade forming step for forming the surface treatment blade An anaerobic adhesive is placed (applied) between the blade body and the surface treatment blade, the blade body and the surface treatment blade are arranged coaxially, and the blade body and the surface treatment blade are aligned with each other. It is characterized by comprising a surface treatment blade connecting step of attaching the surface treatment blade to the blade body by pressing in a direction.

According to the cutting blade manufacturing method according to the present invention, the blade body is formed in the blade body forming step, the surface treatment blade is formed in the surface treatment blade forming step, and the blade body and the surface treatment blade are formed in the surface treatment blade connection step. An anaerobic adhesive is placed (for example, applied) between the blades, the blade body and the surface treatment blade are arranged coaxially, and the blade body and the surface treatment blade are attached by pressing in the axial direction, so that the blade body and the surface treatment blade are cut. Blades can be manufactured efficiently.

Here, arranging the anaerobic adhesive between the blade body and the surface-treated blade means arranging the anaerobic adhesive on at least one of the facing surfaces of the blade body and the surface-treated blade. In addition, when arranging the anaerobic adhesive, various means such as coating by stretching with a dispenser, printing, a brush, a doctor blade, etc., arranging by spin coating, spraying by spraying, etc., etc. May be applied.

(9) A third aspect of the present invention is an electronic material manufacturing method for manufacturing an individualized electronic material by using the cutting blade according to any one of (1) to (7) above. Then, the work material preparation process for preparing the work material on which a plurality of electronic materials are arranged and the work material are installed on the work table according to the path line in which the cutting blade and the work table move relative to each other. The work material installation process, the cutting blade setting step of setting the outer peripheral surface of the surface treatment blade of the cutting blade to a set height with respect to the surface of the work material, and the cutting blade and the processing table. The material to be processed is relatively moved to surface-treat the material to be processed by the surface-treated blade while cutting the material to be processed in the thickness direction.

According to the electronic material manufacturing method according to the present invention, a work material preparation process for preparing a work material in which a plurality of electronic materials are arranged and a pass line in which a blade for cutting the work material and a processing table move relative to each other. The processing material installation process to be installed on the processing table according to the above, the cutting blade setting process to set the outer peripheral surface of the surface treatment blade of the cutting blade to the set height with respect to the surface of the processing material, and the cutting blade. And the processing table are moved relative to each other, and the material to be processed is surface-treated by the surface treatment blade while cutting the material to be processed in the thickness direction.
As a result, when cutting an electronic material as a work material, the substrate can be cut and efficiently separated into individual pieces.

According to the cutting blade, the cutting blade manufacturing method, and the electronic material manufacturing method according to the present invention, when cutting an electronic material as a work material, cutting and surface treatment of the work material can be performed at the same time.

It is a figure which shows typically the cross section including the axis which explains the schematic structure of the cutting blade which concerns on 1st Embodiment of this invention. It is a perspective view explaining the schematic structure of the cutting blade which concerns on 1st Embodiment. It is an enlarged view partially showing explaining the schematic structure of the cutting blade which concerns on 1st Embodiment. It is a flowchart explaining the outline of the manufacturing method of the cutting blade which concerns on 1st Embodiment. It is a conceptual diagram seen along the axis explaining the operation of the cutting blade which concerns on 1st Embodiment. It is a conceptual diagram which looked at the state which the workpiece was cut which explains the operation of the cutting blade which concerns on 1st Embodiment, along the cutting direction. It is a conceptual diagram seen along the axis explaining the operation of the cutting blade which concerns on 1st Embodiment. It is a conceptual diagram which looked at the state which the workpiece is surface-treated along the cutting direction which explains the operation of the cutting blade which concerns on 1st Embodiment. It is an enlarged view partially showing explaining the schematic structure of the cutting blade which concerns on 2nd Embodiment of this invention. It is a flowchart explaining the outline of the manufacturing method of the cutting blade which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, the cutting blade according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a diagram schematically showing a cross section including an axis of the cutting blade according to the first embodiment, FIG. 2 is a perspective view illustrating a schematic configuration of the cutting blade, and FIG. 3 is a perspective view of the cutting blade. It is an enlarged view partially showing explaining the schematic structure.
In addition, the drawings used for explaining the embodiments of the present invention may be shown by enlarging, emphasizing, or excerpting the main parts and the dimensional ratios of each component in order to make the features of the invention easy to understand. It shall be.

In FIGS. 1 to 3, reference numeral 100 is a cutting blade, reference numeral 10 is a blade body, reference numeral 11 is an outer peripheral surface, reference numeral 11A is a cutting edge, reference numeral 15 is a metal bond phase, and reference numeral 16 is a superabrasive grain. Reference numeral 20 is a surface treatment blade, reference numeral 21 is an outer peripheral surface, reference numeral 21A is a surface treatment portion, reference numeral 25 is a resin bond phase, and reference numeral 26 is a superabrasive grain (abrasive grain). Reference numeral 30 indicates an adhesive resin layer (connection portion).

As shown in FIGS. 1 and 2, the cutting blade 100 according to the first embodiment is rotated, for example, around the axis O. Then, the blade main body 10 cuts the material to be cut (not shown) by the cutting edge 11A, and the surface treatment blade 20 removes burrs and the like generated on the surface of the material to be cut by the surface treatment portion 21A (surface treatment). It is a cutting blade that is individualized.

Further, the cutting blade 100 is used for precision cutting of brittle materials (hard and brittle materials) such as glass, ceramics and quartz used for semiconductor devices (electronic material parts), and materials to be cut such as compound semiconductor devices and electronic component substrates. Used for.
Specifically, the cutting blade 100 is used as a material to be cut (material to be processed), for example, silicon carbide (SiC) used for a power device or high-purity alumina (Al ₂ O _{3) which is a base material for an in-vehicle LED.} ), Aluminum nitride (AlN), sapphire, which is the base material for LED chips, etc., which have extremely high hardness and are used for precision cutting made of so-called difficult-to-cut materials.

Further, although not particularly shown, the cutting blade 100 has a central circular hole 100H attached to the main shaft of the cutting device via a flange, and is rotated around the axis (central axis) O in a direction perpendicular to the axis O. For example, by moving in the height direction), the material to be cut is cut by the cutting edge 11A at the outer peripheral edge portion that protrudes radially outward from the flange. After that, the surface treatment blade 20 removes (surface treatment) burrs and the like generated on the surface of the material to be cut at the time of cutting.
Here, in the present specification, the direction along the central axis O direction of the blade main body 10 is referred to as a thickness direction or a width direction, and the direction orthogonal to the central axis O is referred to as a radial direction, and the blade body 10 orbits around the central axis O. The direction may be referred to as the circumferential direction.

As shown in FIGS. 1 to 3, the cutting blade 100 includes, for example, a disk-shaped blade main body 10, a cutting blade 11A, a disk-shaped surface treatment blade 20, and surface treatment. A portion 21A and an adhesive resin layer (connecting member) 30 are provided, and the surface treatment blade 20 is connected to both side surfaces 12A and 12B (12) of the blade main body 10 in the axial direction O by the adhesive resin layer 30.

Further, a circular hole 100H penetrating in the thickness direction (axis O direction) is formed in the central portion when the cutting blade 100 is viewed along the axis O, and is formed into a substantially circular ring plate shape. Here, the disk shape referred to in the present embodiment includes an annular plate shape having a hole in the center of the disk.

The main shaft of the cutting machine can be inserted into the circular hole 100H, and a flange member (not shown) for fixing the cutting blade 100 to the main shaft of the cutting device at the outer peripheral edge of the circular hole 100H. Is attached, and the cutting blade 100 is pressed and fixed from both sides in the O direction of the axis.
Then, the cutting blade 100 is rotated around the axis O, and the material to be cut (material to be processed, not shown) is cut (processed) by the cutting blade 11A.

Here, the dimensions of the blade main body 10, the surface treatment blade 20, and the adhesive resin layer 30 can be arbitrarily set, but in this embodiment, for example, the blade main body 10 has an outer diameter of 52.6 mm. The blade thickness (dimension in the axis O direction) is 50 μm, the dimensions of the surface treatment blade 20 are 50.6 mm in outer diameter, 150 μm in thickness, 40 mm in inner diameter of the circular hole 100H, and 10 μm in thickness of the adhesive resin layer 30. It is formed. That is, the protrusion amount of the cutting edge 11A is set to 1 mm, and the total thickness (dimension in the axis O direction) of the cutting blade 100 is set to 360 μm.

As shown in FIGS. 1 to 3, the blade body 10 has, for example, a metal bond phase 15 formed in a disk shape and made of metal, and diamond superabrasive grains (abrasive grains) 16 dispersedly arranged in the metal bond phase 15. And a cutting edge 11A formed on the outer peripheral surface 11 of the blade main body 10. Further, a circular hole 100H is formed in the central portion when viewed along the axis O.

The metal constituting the metal bond phase 15 can be arbitrarily set, but for example, an alloy containing nickel (Ni) or a nickel alloy as a main component is suitable. Further, as the alloy containing nickel as a main component, for example, nickel-phosphorus (Ni-P), nickel-cobalt (Ni-Co), and nickel-boron (Ni-B) are preferably applied.

Further, the diamond superabrasive grain 16 is composed of, for example, diamond having a concentration of 3 to 10 μm (average particle size of 5 μm) and a concentration ratio of 50 to 125. The average particle size and the degree of concentration of the superabrasive grains 16 can be arbitrarily set.
Further, as shown in FIG. 3, the diamond superabrasive grain 16 is exposed to, for example, about 2 μm on the outer peripheral portion of the blade main body 10 (the outer peripheral surface 11 and the outer side surface in the vicinity of the outer peripheral surface 11 in the axis O direction). ..

Here, the "concentration ratio" is an index showing the amount of abrasive grains in the tool. In the case of a cutting blade, the concentration level is defined as 100 when the volume of the abrasive grains occupies 25 vol% with respect to the volume of the entire blade body. (Therefore, when all of the blade body is composed of abrasive grains, the concentration ratio is 400.)

Here, the above "average particle size" represents an average value of the particle sizes of a large number of superabrasive grains 16, and for example, superabrasive grains 16 having a certain particle size range are manufactured by Microtrac (registered trademark). The average particle size is measured by the model MT3300EXII-SDC or the like, and the average particle size is calculated by the particle size display based on the mesh size (see JIS B 4130: 1998).

Further, for the purpose of improving various functions such as workability and rigidity of the blade body 10, molybdenum disulfide (MoS ₂ ), hollow fine particles such as silica balloon and glass balloon, and silicon carbide (SiC) are added to the metal bond phase 15. ), Tungsten carbide (WC) and other fillers (not shown) may be dispersed. Whether or not to disperse the filler (not shown) in the metal bond phase 15 and the type of the filler in the case of dispersing the filler can be arbitrarily set.

As shown in FIGS. 1 to 3, the surface treatment blade 20 includes, for example, a resin bond phase 25 formed in a disk shape and made of a resin, diamond superabrasive grains 26 dispersed in the resin bond phase 25, and a resin bond. A surface treatment portion 21A formed on the outer peripheral surface (outer peripheral portion) 21 of the phase 25 is provided. Further, a circular hole 100H is formed in the central portion when viewed along the axis O.
That is, the surface-treated blade 20 is made of a soft material having a hardness lower than that of the blade main body 10, so that the surface-treated blade 20 has a higher wear rate than the blade main body 10 when cutting the material to be processed. Is set to.

As shown in FIG. 3, the surface treatment portion 21A of the surface treatment blade 20 is formed on the outer peripheral surface 21 of the surface treatment blade 20 having a width equal to the thickness of the surface treatment blade 20.
The diamond superabrasive grain 26 is exposed from the surface of the surface treatment portion 21A by about 2 μm.

The resin bond phase 25 is formed of, for example, a thermosetting resin such as a phenol resin. As shown in FIGS. 1 and 2, the resin bond phase 25 has a disk shape (annular plate shape) centered on the central axis O.

Further, the diamond superabrasive grain 26 has, for example, an average particle size of 0.5 to 120 μm and a concentration ratio of 25 to 200. Although not particularly shown, the outer surface (surface) of the diamond superabrasive grain (abrasive grain) 26 may be coated with a metal material such as Ti.
Since the average particle size of the diamond superabrasive grain 26 is the same as that of the diamond superabrasive grain 16, the description thereof will be omitted.
Further, instead of the diamond superabrasive grain 26, for example, a hard material other than cBN or cBN (however, a material harder than the resin bond phase 25) may be used.

Further, for the purpose of improving various functions such as workability and rigidity of the surface treatment blade 20, the resin bond phase 25 is filled with fillers such as silicon carbide (SiC), tungsten carbide (WC) and zinc oxide (ZnO). (Not shown) may be dispersed. Whether or not to disperse the filler (not shown) in the resin bond phase 25 and the type of the filler in the case of dispersing the filler can be arbitrarily set.

The adhesive resin layer (connecting member) 30 can be arbitrarily set as long as practicality (for example, strength and heat resistance in cutting and surface treatment, water resistance, etc.) is ensured, but the blade body 10 and the surface treatment blade 20 can be arbitrarily set. For example, an anaerobic adhesive is suitable because it is effective efficiently in the space sandwiched between the two. When an anaerobic adhesive is used, for example, the side surface 12 of the blade body 10 and the side surface 22 of the surface treatment blade 20 have a smooth surface roughness Rmax0 to 20 μm (JIS B0601-1982). Is suitable.
Instead of the anaerobic adhesive, for example, an adhesive containing an epoxy resin or a cyanoacrylate resin as a main component, an ultraviolet curable adhesive, or the like may be applied. In this case, it is preferable that the surface roughness of the side surface 12 of the blade main body 10 and the side surface 22 of the surface treatment blade 20 is formed to Rmax5 to 50 μm.

Further, it can be arbitrarily set whether or not the diamond superabrasive grains 26 are exposed on the side surfaces 102A and 102B (102) on both sides of the cutting blade 100.

Next, with reference to FIG. 4, an outline example of the manufacturing process of the cutting blade according to the first embodiment will be described. FIG. 4 is a flowchart illustrating an outline of a method for manufacturing a cutting blade according to the first embodiment.
As shown in FIG. 4, the cutting blade manufacturing process according to the first embodiment is, for example, a blade body forming step (S01), a surface treatment blade forming step (S02), an adhesive application step (S03), and alignment ( A coaxialization) step (S04), pressing, and fixing step (S05) are provided, and the cutting blade 100 is completed through these steps.

(1) Blade body forming step (S01)
To form the blade body (metal blade), for example, the SUS base metal is subjected to dispersion plating containing diamond superabrasive grains 16 to form the original plate of the blade material (dispersed nickel plating layer (nickel layer in which diamond superabrasive grains are dispersed). )) Is formed.
Instead of the nickel plating solution, a Ni-P or Ni-B plating solution containing diamond superabrasive grains 16 may be used to form the original plate of the blade material.
Further, the original plate of the blade material of the dispersed nickel plating layer does not require heat treatment. When the original plate of the blade material is formed from the Ni-P or Ni-B plating layer, heat treatment (for example, 250 ° C. × 1 hr) is effective. The dispersed nickel plating layer may be formed by an electroless plating method.
Then, the original plate of the blade material is etched to expose (dress) the diamond superabrasive grains 16 from the metal bond phase 15.
After that, the blade main body 10 is formed (manufactured) by grinding the inner peripheral portion and the outer peripheral portion of the original plate of the blade material sharpened in the etching step to predetermined diameter dimensions.
The method for forming the blade body (metal blade) can be arbitrarily set, and is not limited to the above. Further, the above forming method may be applied to the formation of a surface treatment blade (metal blade).

(2) Surface treatment blade forming step (S02)
For the formation of the surface treatment blade (resin blade), for example, a mixed powder obtained by mixing the powder used as the raw material of the resin bond phase 25 and the diamond superabrasive grains 26 is filled in a mold (not shown), and the mixed powder is filled in the mold. Cold press is performed inside to form a disk-shaped resin blade original plate. Then, this resin blade original plate is hot-pressed and sintered.
After that, the surface-treated blade (resin blade) 20 is formed (manufactured) by grinding the inner peripheral portion and the outer peripheral portion of the sintered resin blade original plate to predetermined diameters.
The method for forming the surface treatment blade (resin blade) can be arbitrarily set and is not limited to the above. Further, the above-mentioned forming method may be applied to the formation of a blade main body (resin blade).

(3) Adhesive application step (S03)
Next, for example, an adhesive is applied (arranged) on the side surface 22 of the surface treatment blade 20.
When applying the adhesive forming the adhesive resin layer 30 to the side surface 22 of the surface treatment blade 20, it is preferable to apply the adhesive to a uniform thickness by, for example, a printing means or a dispenser.
The application of the adhesive is not limited to the printing means and the dispenser, and the physical properties of the adhesive such as application by stretching with a brush or a doctor blade, placement by spin coating, spraying by spraying, etc. ( For example, various well-known coating means can be applied depending on the viscosity and the like.
Further, depending on the type of adhesive, it is preferable to perform appropriate surface treatment on the surface roughness and surface properties of the side surface 12 of the blade main body 10 and the side surface 22 of the surface treatment blade 20.
Instead of the side surface 22 of the surface treatment blade 20, the adhesive may be applied to the side surface 12 of the blade body 10, or the adhesive may be applied to both the surface treatment blade 20 and the side surfaces 22 and 12 of the blade body 10. good.

(4) Alignment (coaxialization) step (S04)
Next, for example, using a jig (not shown), the axis O of the blade body 10 and the axis O of the surface treatment blade 20 are aligned (coaxially), and the blade body 10 and the surface treatment blade 20 are aligned in the axis O direction. Move relative to each other and superimpose.
To coaxialize the blade body 10 and the surface treatment blade 20, the axes of the blade body 10 and the two surface treatment blades 20 may be aligned at the same time, or after the blade body 10 and the surface treatment blade 20 are aligned, the blade body 10 and the surface treatment blade 20 may be aligned. Another surface treatment blade 20 may be combined.
It is preferable to adjust the adhesive application timing according to the coaxialization procedure.

(5) Pressing and fixing process (S05)
Next, after applying the adhesive and superimposing the layers, the blade body 10 and the surface treatment blade 20 are pressed along the axis O direction on a stable flat portion such as a surface plate (not shown). Paste and fix.
The pressing of the blade body 10 and the surface treatment blade 20 is carried out within the range coaxialized in (4) above.

(6) Completion of cutting blade After fixing the blade body 10 and the surface treatment blade 20, the cutting blade 100 is completed by performing outer diameter processing, dicer dressing, inspection and the like as necessary.
The steps S01 to S05 are shown as an example and can be changed or omitted as appropriate.
Further, the manufacturing method according to the first embodiment may be applied to, for example, manufacturing a cutting blade using an adhesive instead of the adhesive (adhesive resin).

Next, the operation of the cutting blade and the method for manufacturing an electronic material will be described with reference to FIGS. 5A to 6B.
5A to 6B are conceptual diagrams illustrating the operation of the cutting blade according to the first embodiment, FIGS. 5A and 6A are conceptual diagrams viewed along an axis, and FIGS. 5B and 6B are diagrams. 5A and 6A are cross-sectional views shown by arrow VB-VB and arrow VIB-VIB. It is a conceptual diagram which looked at the state at the time of cutting a work material along the cutting direction.

The electronic material manufacturing method includes, for example, a work material preparation step, a work material installation step, a cutting blade setting step, and a cutting step. Hereinafter, the work material preparation process, the work material installation process, the cutting blade setting process, and the cutting process will be described.

(1) Process for preparing a work material A work material in which a plurality of electronic materials are arranged is prepared.
Examples of the work material include silicon carbide (SiC) used for power devices, high-purity alumina (Al ₂ O ₃ ) and aluminum nitride (AlN) which are base materials for in-vehicle LEDs, and LED chip base materials. It has a very high hardness such as sapphire, and can be used for so-called difficult-to-cut materials. It is also particularly effective for workpieces that are prone to burrs due to cutting, such as QFN (quadflatnon-leaded package) and IrDA (Infrared Data Association) standard optical transmission modules.

(2) Work material installation process (S2)
The material to be machined is installed on the machining table according to the path line in which the cutting blade 100 and the machining table move relative to each other.

(3) Cutting blade setting step The surface treatment portion 21A of the surface treatment blade 20 of the cutting blade 100 is set to a set height with respect to the surface of the work material.
For example, when the height of the burr is set to zero, the surface treatment portion 21A is set so as to be in contact with the surface of the work material. Further, when removing protrusions such as burrs within an allowable range, the surface treatment portion 21A is arranged so as to have a constant height from the surface of the material to be cut, and a constant height from the surface of the material to be cut. The burrs and the like formed above the above contact with the surface treatment portion 21A so as to be below the allowable height.
Further, the protrusion amount of the blade main body 10 with respect to the surface treatment blade 20 is set to a dimension larger than the thickness of the work material.

(4) Cutting step (S4)
The cutting blade 100 and the processing table on which the work material is placed are relatively moved in the horizontal direction (direction along the surface of the work material), and the work material is cut in the thickness direction by the blade body 10. However, the surface treatment blade 20 is used to surface-treat the material to be processed.

As shown in FIGS. 5A and 5B, for cutting the work material by the cutting blade 100, for example, the blade body 10 advances in the arrow T direction while rotating in the arrow R direction, so that the cutting edge 11A is the work material. Cut W in the thickness direction.
As shown in FIG. 5A, the cutting groove A is formed on the rear side in the traveling direction of the cutting blade 100, and protrusions B such as burrs may be formed on both side edges of the cutting groove A (in FIG. 5A). The part indicated by the arrow S, etc.).

When protrusions B such as burrs are formed on both side edges of the cutting groove A, the surface treatment blade 20 advances behind the blade body 10 in the arrow T direction as shown in FIGS. 6A and 6B.
Then, as shown in FIG. 6B, the surface treatment portion 21A of the surface treatment blade 20 comes into contact with the surface of the work material W, so that the protrusion B such as burrs is removed.

In the electronic material manufacturing method according to the first embodiment, as described above, by using the cutting blade 100, the work material W is cut and both side edges of the cut groove (cut portion) A of the work W are formed. It can be surface-treated to produce an individualized electronic material.

Therefore, when a separate surface treatment is performed after cutting with a cutting blade, two manufacturing steps are required, but in the electronic material manufacturing method according to the first embodiment, cutting and deburring are performed in one pass. Can be implemented to improve production efficiency. In addition, it is possible to reduce the installation space of production equipment and the capital investment.

According to the cutting blade 100 according to the first embodiment, since the blade main body 10 and the surface treatment blade 20 arranged on the side surface 12 of the blade main body 10 are provided, when cutting the work material, the work material is cut. The protrusions such as burrs generated by cutting can be surface-treated (removed) immediately after cutting.
As a result, when cutting an electronic material as a work material, the substrate can be efficiently separated into individual pieces.

According to the cutting blade 100 according to the first embodiment, the surface treatment blade 20 is arranged on both side surfaces 12 of the blade main body 10 in the axis O direction, so that when cutting the material to be cut, the cutting groove is formed. The surfaces on both the left and right sides of A can be stably surface-treated (deburring).
Further, according to the cutting blade 100 according to the first embodiment, the load associated with the surface treatment of the cutting blade 100 can be stably cut by balancing on both sides of the cutting blade 100 in the axis O direction. ..

According to the cutting blade 100 according to the first embodiment, the bond phase of the surface treatment blade 20 is made of a resin material having a hardness lower than that of the bond phase of the blade body 10, so that the blade body is formed when cutting. It wears following 10. Therefore, it is possible to prevent the surface treatment blade 20 from biting into the surface of the material to be cut.

According to the cutting blade 100 according to the first embodiment, the bond phase is the metal bond phase 15 and the bond phase of the surface treatment blade 20 is the resin bond phase 25, so that the product can be efficiently manufactured. ..

According to the cutting blade 100 according to the first embodiment, since the blade main body 10 and the surface treatment blade 20 are connected by the adhesive resin layer 30 in which the adhesive is cured, efficient production can be achieved.
Further, the connection interval between the blade main body 10 and the surface treatment blade 20 in the axial direction can be reduced to stably cut the material to be cut.

According to the electronic material manufacturing method according to the first embodiment, the work material W cutting process and the surface treatment (deburring) can be performed in one pass, so that the productivity can be improved.
As a result, it is possible to reduce the installation space of equipment and capital investment.

[Second Embodiment]
Hereinafter, the cutting blade according to the second embodiment of the present invention will be described with reference to FIGS. 1, 2, 7, and 8. It is an enlarged view partially showing explaining the schematic structure of the cutting blade which concerns on 2nd Embodiment of this invention.

In FIGS. 1, 2, and 7, reference numeral 200 indicates a cutting blade, and reference numeral 40 indicates a double-sided adhesive tape (double-sided tape, connection portion).

As shown in FIGS. 1, 2, and 7, the cutting blade 200 includes, for example, a blade body 10 formed in a disk shape, a cutting edge 11A, and a surface treatment blade 20 formed in a disk shape. A surface-treated portion 21A and a double-sided adhesive tape (double-sided tape, connecting portion) 40 are provided, and the surface-treated blade 20 has double-sided adhesive tape (double-sided adhesive tape) on both side surfaces 12A and 12B (12) of the blade body 10 in the axial direction O. It is connected by double-sided tape (connecting part) 40.

As shown in FIG. 7, the double-sided adhesive tape (double-sided tape, connecting portion) 40 is configured such that, for example, an adhesive (adhesive resin) 42 having adhesiveness is applied (arranged) on both sides of the tape base material 41. ing.
The second embodiment is different from the first embodiment in that the double-sided adhesive tape (double-sided tape, connecting portion) 40 is provided instead of the adhesive resin layer 30. Others are the same as those in the first embodiment, and thus the description thereof will be omitted.

Next, with reference to FIG. 8, an outline example of the manufacturing process of the cutting blade according to the second embodiment will be described. FIG. 8 is a flowchart illustrating an outline of a method for manufacturing a cutting blade according to a second embodiment.
As shown in FIG. 8, the cutting blade manufacturing process according to the second embodiment is, for example, a blade body forming step (S11), a surface treatment blade forming step (S12), a double-sided tape arranging step (S13), and alignment ( A coaxialization) step (S14), pressing, and fixing step (S15) are provided, and the cutting blade is completed through these steps.

(1) Blade body forming step (S11)
(2) Surface treatment blade forming step (S12)
Since the blade body forming step (S11) and the surface treatment blade forming step (S12) are the same as the blade body forming step (S01) and the surface treatment blade forming step (S02) of the first embodiment, the description thereof will be omitted.

(3) Double-sided tape placement process (S13)
Next, for example, the double-sided adhesive tape 40 is attached (arranged) to the side surface 22 of the surface treatment blade 20 in which the blade body 10 and the axis O are coaxialized by using a jig or the like.
Here, the double-sided adhesive tape 40 refers to a tape base material on which a resin having adhesiveness is arranged on both sides.
When the double-sided adhesive tape is attached to the side surface of the surface-treated blade 20, for example, it is preferable that the surface roughness Rmax0 to 20 μm of the side surface 22 of the surface-treated blade 20 and the side surface 12 of the blade main body 10 is set.
Instead of the side surface 22 of the surface treatment blade 20, a double-sided adhesive tape may be attached to the side surface 12 of the blade body 10.
Further, instead of the double-sided adhesive tape, an adhesive resin (adhesive resin) is formed in the form of a sheet to have adhesive on both sides, or an adhesive is applied to both sides of the tape base material. A sheet-like adhesive resin formed in the form of a sheet may be applied.

(4) Alignment (coaxialization) step (S14)
(5) Pressing and fixing process (S15)
The alignment (coaxial) step (S14), pressing, and fixing step (S15) are the same as the alignment (coaxial) step (S04), pressing, and fixing step (S05) in the first embodiment. Is omitted.
Further, the manufacturing method according to the second embodiment may be applied to, for example, manufacturing a cutting blade using an adhesive resin formed in a sheet shape or an adhesive resin formed in a sheet shape.

(6) Completion of cutting blade After fixing the blade body 10 and the surface treatment blade 20, the cutting blade 200 is completed by performing outer diameter processing, dicer dressing, inspection and the like as necessary.
The steps S11 to S15 are shown as an example and can be changed or omitted as appropriate.

According to the cutting blade according to the second embodiment, since the blade main body 10 and the surface treatment blade 20 are connected by the double-sided adhesive tape 40, it can be efficiently manufactured in a short time.

Hereinafter, examples of the present invention will be described with reference to Table 1. Table 1 is a table illustrating examples of the present invention.
In Examples, the effects of the present invention were confirmed by taking Comparative Examples 1 and 2 and Examples 1 to 9 of the present invention as examples.
In Examples 1 to 9 of the present invention, a surface-treated blade formed of a phenol resin bond phase is attached to both side surfaces of a blade body having a thickness of 0.050 mm formed of a nickel bond phase with an adhesive for cutting. It was created.
Examples are shown below in Table 1.

Further, in the examples, as shown in Table 1, the presence / absence of the surface-treated blade of the cutting blade used for cutting, the thickness of the surface-treated blade, the abrasive particle size, the degree of concentration, and the amount of protrusion of the blade body are changed. I made a cutting blade. In addition, as shown in Table 1, Comparative Example 1 is an example not provided with a surface treatment blade. Further, Comparative Example 2 is an example in which the blade body and the surface-treated blade are separated, that is, an example in which the surface is treated after cutting.

Then, the material to be cut was cut (processed) using a cutting blade, and the working time ratio and the surface burr size (μm) were confirmed. Here, the working time ratio is the ratio of the time during which the cutting blade actually cuts the work material.
In the evaluation, a working time ratio of 1 and a surface burr size of ≤5 μm was set as “◯”, a working time ratio of 1 and a surface burr size of ≦ 2 μm was set as “◎”, and the others were set as “×”. ..

The material to be cut and the cutting conditions used in the examples are as follows.
Material to be cut: MEMS (3-layer silicon)
Blade peripheral speed: 100m / S
Blade feed rate: 2 mm / S

[Comparative Example 1]
Comparative Example 1 is a cutting blade having only a blade body, as shown in Table 1. In Comparative Example 1, the material to be cut was cut under the same conditions as in Examples 1 to 10 of the present invention.
Therefore, the working time ratio of Comparative Example 1 is the same as that of Examples 1 to 10 of the present invention, and the working time ratio is 1.
On the other hand, since the surface was not treated, burrs of 20 μm were generated on the surface of the material to be cut during the cutting operation and remained as they were.
As a result, the evaluation was "x".

[Comparative Example 2]
In Comparative Example 2, the material to be cut was cut using a blade main body and a surface-treated blade which was separated from the blade main body shown by a thick frame in the column of Comparative Example 2 in Table 1. Specifically, after cutting the work material with the blade main body according to Comparative Example 2, the surface treatment of both side edges of the cutting groove was carried out with the surface treatment blade shown in the thick frame.
The rotation speed and feed rate of the surface-treated blade in Comparative Example 2 were the same as the rotation speed and feed rate of Examples 1 to 10 of the present invention.
The burr size of the surface in Comparative Example 2 was 0 μm, but the working time ratio was 2 because cutting and surface treatment were performed separately.
As a result, the working time ratio was 2, so the evaluation was "x".

[Example 1 of the present invention]
Example 1 of the present invention is a cutting blade having a blade body and a surface-treated blade.
In Example 1 of the present invention, the thickness of the surface-treated blade is 0.15 mm, the grain size is 30 to 40 μm, the concentration ratio is 100, and the protrusion amount of the blade body is 1 mm. Then, under the above conditions, cutting and surface treatment were carried out at the same time.
Therefore, the working time ratio was 1, and the burr size was 0 μm.
As a result, the evaluation was "◎".

[Examples 2 to 9 of the present invention]
Examples 2 to 9 of the present invention are cutting blades having a blade body and a surface-treated blade.
The cutting blade according to the example of the present invention is as shown in Table 1.
Then, in Examples 2 to 9 of the present invention, cutting and surface treatment were carried out at the same time under the above conditions.
Therefore, the working time ratio was 1.
Further, the burr size was 3 μm, which was less than the standard setting of 50 μm.
As a result, the evaluation was "○".

As described above, it was confirmed that the example of the present invention obtained good results in terms of working time ratio and burr size. In particular, in Example 1 of the present invention, the burr size was 0 (zero), and an extremely good effect was confirmed.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention, for example, as described below.
For example, in the above embodiment, the case where the surface treatment blades are arranged on the side surfaces 12A and 12B (12) on both sides of the blade body 10 in the axis O direction has been described, but one side surface of the blade body 10 has been described. The surface treatment blade 20 may be arranged only on the twelve.

Further, in the above embodiment, the case where the cutting blade 100 and the blade main body 10 and the surface treatment blade 20 are connected by the adhesive (adhesive resin) 30 or the double-sided adhesive tape has been described. , May be connected by double-sided adhesive tape. Further, for example, the blade main body and the surface treatment blade may be connected by fastening members (for example, screws, rivets, etc.), welding, or the like, or may be integrally formed by sintering or the like.

Further, in the above embodiment, the case where the blade main body is provided with the metal bond phase and the surface treatment blade is a cutting blade provided with the resin bond phase has been described, but the blade main body and the bond phase forming the surface treatment blade are described. The configuration can be set arbitrarily. For example, the blade body may have a resin bond phase or the indicated vitrified bond phase instead of the metal bond phase, or the surface treated blade may have a metal bond phase or a vitrified bond phase instead of the resin bond phase. You may.
Further, the combination of the blade body and the bond phase constituting the surface treatment blade in the cutting blade may be arbitrarily set.
Here, the vitrified bond phase is a bond phase made of a porous glassy substance, and can be formed by the following method.

When the bond phase forms a blade of a vitrified bond phase (blade body or surface treatment blade), the material powder forming the bond phase and the abrasive grains are mixed to form a material powder, and this material powder is set in a mold. Then, a vitrified bond molded product was formed, and the vitrified bond molded product was sintered (for example, placed in a sintering furnace and heated) to have a large number (plural) pores to form a three-dimensional crosslinked structure. It forms a blade material consisting of a porous vitrified bond phase. When the superabrasive particles and the filler are dispersed in the vitrified bond phase, the binder, the superabrasive particles and the filler are mixed at the time of the above mixing. In addition, if necessary, inner diameter processing, outer diameter processing, wrap processing, etc. are performed.
The method for forming the blade (blade body or surface treatment blade) of the vitrified bond phase can be arbitrarily set, and is not limited to the above.

Further, regarding the combination of the bond phase of the blade body and the surface treatment blade in the cutting blade, it is possible to arbitrarily set whether to use the same type or a different material among metal, resin and glass.
That is, when the blade body and the surface-treated blade are a combination of bond phases of different materials [bond phase of the blade body-bond phase of the surface-treated blade], for example, instead of the metal bond phase-resin bond phase, a metal bond is used. It may be a phase-vitrified bond phase, a vitrified bond phase-metal bond phase, a vitrified bond phase-resin bond phase, a resin bond phase-metal bond phase, or a resin bond phase-bitrified bond phase.
Further, the combination of the bond phase of the blade body and the surface treatment blade may be a combination of the same type of bond phase such as metal bond phase-metal bond phase, resin bond phase-resin bond phase, and vitrified bond phase-bitrified bond phase.

Further, in the above embodiment, the case where the abrasive grains dispersed in the metal bond phase (bond phase) 15 are diamond superabrasive grains 16 has been described, but the abrasive grains can be arbitrarily set. Instead of the diamond superabrasive grain 16, for example, other abrasive grains such as CBN (cubic boron nitride) may be dispersed in the metal bond phase 15.
Further, the average particle size and the degree of concentration of the abrasive grains can be arbitrarily set.

Further, in the above embodiment, the case where the abrasive grains dispersed in the resin bond phase (bond phase) 25 are diamond superabrasive grains 26 has been described, but the abrasive grains can be arbitrarily set. For example, instead of the diamond superabrasive grain 26, other abrasive grains such as cBN may be dispersed in the resin bond phase 25. Further, the average particle size and the degree of concentration of the abrasive grains can be arbitrarily set.

Further, in the above embodiment, the case where the resin constituting the resin bond phase 25 is a phenol resin has been described, but the resin constituting the resin bond phase 25 is not limited to the phenol resin and may be arbitrarily set. May be good.

Further, in the above embodiment, the case where the cutting blade 100 is used as a material to be cut for cutting a hard and brittle material such as glass and quartz (ceramics) has been described. Or DA (Infrared Data Association) standard optical transmission module or other electronic component material may be used for cutting as a material to be cut.

In addition, as long as it does not deviate from the gist of the present invention, each configuration (component) described in the above-described embodiments, modifications, and notes may be combined, and addition, omission, replacement, and other configurations may be added. It can be changed. Further, the present invention is not limited to the above-described embodiments.

According to the cutting blade, the cutting blade manufacturing method, and the electronic material manufacturing method according to the present invention according to the present invention, when cutting an electronic material as a work material, the substrate is cut and efficiently individualized. It is industrially available because it can be used.

O-axis line 10 Blade body 11 Outer peripheral surface 11A Cutting edge 12, 12A, 12B Side surface (blade body)
15 Metal bond phase (bond phase)
16 Diamond super-abrasive grain (abrasive grain)
20 Surface treatment blade 21 Outer peripheral surface (outer peripheral part)
21A Surface treatment part 22 Side surface (surface treatment blade)
25 Resin bond phase (bond phase)
26 Diamond superabrasive grains (abrasive grains)
30 Adhesive resin layer (cured adhesive, connecting member)
40 Double-sided adhesive tape (double-sided tape, connecting member)
41 Tape base material 42 Adhesive (adhesive resin)
100, 200 cutting blade

Claims (9)

A cutting blade that is rotated around the axis and processes the work material with a cutting edge.
A blade body in which abrasive grains are dispersedly arranged in a bond phase formed in a disk shape and a cutting edge is arranged in the outer peripheral portion.
Abrasive grains are dispersed and arranged in the bond phase formed in a disk shape, the wear rate is set higher than that of the blade body, and the surface is formed to have a smaller diameter than the blade body and treats the surface of the work piece. With the processing blade,
Equipped with
The surface treatment blade is
A cutting blade, which is arranged on at least one side surface of the blade body in the axial direction. The cutting blade according to claim 1.
The surface treatment blade is
A cutting blade characterized by being arranged on both sides of the blade body in the axial direction. The cutting blade according to claim 1 or 2.
The bond phase of the surface treatment blade is
A cutting blade characterized in that it is made of a material having a hardness lower than that of the bond phase of the blade body. The cutting blade according to any one of claims 1 to 3.
The bond phase of the blade body is a metal bond phase.
The cutting blade characterized in that the bond phase of the surface treatment blade is a resin bond phase. The cutting blade according to any one of claims 1 to 4.
A connecting member for connecting the blade body and the surface treatment blade is provided.
The connecting member is
A cutting blade characterized in that the adhesive is composed of a cured resin. The cutting blade according to any one of claims 1 to 4.
A connecting member for connecting the blade body and the surface treatment blade is provided.
The connecting member is
The blade body and the surface treatment blade are
A cutting blade characterized by being composed of an adhesive. The cutting blade according to any one of claims 1 to 4.
A connecting member for connecting the blade body and the surface treatment blade is provided.
The connecting member is
A cutting blade characterized by being composed of double-sided tape. A cutting blade manufacturing method for manufacturing the cutting blade according to claim 5.
The blade body forming process that forms the blade body and
The surface treatment blade forming process for forming the surface treatment blade and
An anaerobic adhesive is placed between the blade body and the surface treatment blade, the blade body and the surface treatment blade are arranged coaxially, and the blade body and the surface treatment blade are pressed in the axial direction. Thereby, in the surface treatment blade connecting step of attaching the surface treatment blade to the blade body,
A method for manufacturing a cutting blade, which comprises. A method for manufacturing an electronic material, which manufactures an individualized electronic material by using the cutting blade according to any one of claims 1 to 7.
A work material preparation process that prepares a work material in which multiple electronic materials are arranged,
The work material installation process of installing the work material on the work table according to the path line where the cutting blade and the work table move relative to each other.
A cutting blade setting step of setting the outer peripheral surface of the surface-treated blade of the cutting blade to a set height with respect to the surface of the work piece, and a cutting blade setting step.
A method for producing an electronic material, which comprises relatively moving the cutting blade and a processing table to surface-treat the material to be processed by the surface-treated blade while cutting the material to be processed in the thickness direction.

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