JP2000308971A - Super-abrasive grain cutting wheel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower cutting resistance and to reduce dispersion and chipping of thickness of a work by covering all or a part of an exposed surface of a disc base plate made of high speed steel with a chrome plated film. SOLUTION: A high speed steel made base plate 1 is set in a mold. A diamond layer 2 is fastened on an outer peripheral surface of the high speed steel made base plate by blending diamond abrasive grains in a resin bond with polyimide resin as a main component and silicon carbide powder as a filler, filling a uniformly mixed mixture in the mold, heating and pressurizing it. This diamond layer 2 is applied with truing dressing by a dressing machine. Thereafter, this diamond layer 2 of a diamond cutting wheel and a base plate hole part are marked with insulating varnish, only both surfaces of the base plate are covered with chrome plating, a chromium plated film 4 is formed, and a resin bond diamond cutting wheel is made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001] The present invention relates to a superabrasive cutting wheel used for precision cutting and grooving of optical glass, ceramics, quartz, magnetic materials, semiconductor materials and the like.

[0002]

2. Description of the Related Art The base material of conventional superabrasive cutting wheels is mainly steel, for example, carbon tool steel, alloy tool steel, and high-speed steel. Also, as a binder,
Resin bond, copper, tin, mainly composed of thermosetting resin,
Metal bond mainly composed of alloys such as iron, cobalt and nickel, vitrified bond mainly composed of inorganic material such as glass, electrodeposition bond mainly composed of metal deposited by electroplating and chemical plating, etc. are used. Have been.

[0003] A superabrasive cutting wheel is often used, for example, for cutting or grooving magnetic materials, optical glass and ceramics. When used to form grooves in ferrite blocks or neodymium magnets, which are the cores of magnetic heads, or as superabrasive cutting wheels used to cut and separate prisms from optical glass materials, the outer diameter is Those having a diameter of Φ50 mm to Φ300 mm, a thickness of a blade portion of 0.1 mm to 4.0 mm, and a diamond substrate adhered to the outer periphery of a steel substrate with a resin bond, a metal bond, and an electrodeposition bond are often used.

[0004] A super-abrasive cutting wheel is rarely used with a single blade. In particular, in a mass production line of electronic parts, optical parts, etc., a plurality of super-abrasive cutting wheels are used so that a large number of cutting or grooving can be performed at the same time. Abrasive cutting wheel incorporated into the wheel flange of the slicing machine, or several types of superabrasive wheels with different cutting edge shapes, each incorporated into the wheel flange, grooving and Many products can be cut at the same time. The above combination wheel is generally called a multi-set wheel.

When processing magnetic materials, optical glasses, semiconductor materials and optical glasses with a superabrasive cutting wheel, high efficiency and high precision processing are required. In particular, the requirements for processing accuracy are severe, and the single pitch accuracy, cumulative pitch accuracy, and grooving width accuracy of the assembled multiset wheel must each satisfy several microns.

However, when performing high-efficiency machining, a large grinding stress is generated, and the distortion of the substrate of the superabrasive cutting wheel often becomes a problem. When the distortion of the base increases, the superabrasive cutting wheel meanders, and it becomes impossible to satisfy required accuracy such as right angle accuracy, width accuracy, and plane accuracy of a cut surface and a groove of a processed workpiece. When the grinding stress is further increased, the base generates a larger strain, a large chipping occurs at a corner of the work, and the processed work becomes defective and suffers a great deal of damage.

Further, when cutting and grooving with a superabrasive cutting wheel, frictional heat may be generated due to contact between the substrate of the superabrasive cutting wheel and the workpiece. This frictional heat causes thermal expansion of the superabrasive layer and the substrate, but in most cases, the thermal expansion coefficient of the superabrasive layer and the substrate is different, causing thermal strain on the entire superabrasive cutting wheel, which also affects processing accuracy. This was the cause of drop and chipping.

These problems become more remarkable as the cutting and grooving conditions become harder, in other words, as the material is removed at a higher feed rate and a higher cutting speed and the material removal rate becomes larger. Not even. In particular, when the depth of cut is large, for example, in the case of heavy cutting with a depth of cut of 20 mm or more, the frequency of contact between the substrate and the workpiece increases, which causes scratches on the substrate and causes large distortion.

[0009]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. That is, an object of the present invention is to further enhance the performance of a superabrasive grain cutting wheel for a high-speed steel substrate used for cutting and grooving of optical glass, ceramics, quartz, magnetic materials, semiconductor materials, and the like.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a superabrasive cutting wheel in which superabrasives are fixed to the outer periphery of a disk-shaped substrate made of high-speed steel with a binder. A super-abrasive cutting wheel characterized in that all or a part of the exposed surface of the substrate is covered with a chromium plating film.

[0011] It has been conceived that by coating the surface of a high-speed steel substrate with a chromium plating film to improve the abrasion resistance of the substrate and reduce the friction coefficient, cutting accuracy and processing efficiency can be improved. This has led to the present application.
Here, the part of the substrate covered with the chrome plating film is
At least a part of both side surfaces where the substrate and the workpiece may come into contact with each other, and generally, the entire surface of both surfaces of the substrate excluding the holes of the superabrasive cutting wheel. Of course, the entire exposed surface of the substrate may be used, and is appropriately determined depending on the processing purpose, processing conditions, processing machine specifications, and the like.

The thickness of the chromium plating film is 1 μm
３０30 μm. Chromium plating can be easily coated without impairing the accuracy of the finished super-abrasive cutting wheel, and in areas where plating is not required, only masking with tape or insulating paint is sufficient, and it is easy to produce. There are features. Moreover, since the hardness is as high as Hv750 to 900 and the coefficient of friction is small, it is considered that it is optimal as a coating that reduces heat generation during cutting and protects the substrate from contact with a workpiece and cutting chips. The thickness of the coating is 1 μm to 1 for general use.
The purpose can be sufficiently achieved if 0 μm, but the cutting powder is hard,
When the substrate is easily eroded, the thickness is set to 30 μm, and in some cases, the thickness is further increased.

[0013] Further, the binder is characterized in that it is any one of a resin bond, a metal bond, a vitrified bond and an electrodeposition bond, or a composite binder thereof. Conventionally used resin bond, metal bond, vitrified bond or electrodeposited bond and resin-metal composite binder, resin-vitrified, because the bondability between the substrate and the binder is good and the binder is not restricted at all. Composite binders can be applied.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in Examples.

[0015]

(Example 1) A high-speed steel substrate with an outer diameter of Φ14
A sample having a size of 4 mm, a thickness of 0.7 mm and a hole diameter of 40 mm was prepared and set in a mold. Resin bond containing polyimide resin as the main component and silicon carbide powder as filler, particle size # 140 (average particle size 107 μm)
The mixture obtained by mixing the diamond abrasive grains of the above and uniformly mixed was filled in a mold, heated to 230 ° C., and 700 kgf / cm.
The diamond layer was fixed to the outer periphery of the high-speed steel substrate by applying a pressure of 2. This diamond layer was truing-dressed by a dressing machine to obtain a resin-bonded diamond cutting wheel. Next, the diamond layer of the diamond cutting wheel and the hole of the substrate were masked with an insulating paint, and only the both surfaces of the substrate were coated with chrome plating to a thickness of 2 μm.
A resin-bonded diamond cutting wheel of the present invention having a size of -40H, a specification of SD140 and a concentration of 100-B was completed.

(Example 2) A high-speed steel substrate having an outer diameter of Φ1
A substrate having a size of 44 mm, a thickness of 0.7 mm, and a hole diameter of Φ40 mm was prepared, and chromium plating with a thickness of 3 μm was applied to the entire surface of the substrate. This was set in a mold, and a diamond bond having a particle size of # 140 (average particle size: 107 μm) was blended with a resin bond containing a polyimide resin as a main component and a silicon carbide powder as a filler, and the mixture obtained by mixing uniformly was mixed with a metal. Fill mold and heat to 230 ° C, 700Kgf / cm2
The diamond layer was fixed to the outer peripheral portion of the high-speed steel substrate. Trueing and dressing this diamond layer with a dressing machine to obtain
The resin-bonded diamond cutting wheel of the present invention having -0.8t-3x-40H, specification, SD140-concentration 100-B was completed.

(Embodiment 3) A high-speed steel substrate having an outer diameter of Φ1
A sample having a size of 44 mm, a thickness of 0.7 mm, and a hole diameter of Φ40 mm was prepared. Masking was performed on both sides up to Φ100 mm with a tape, and only a portion of the substrate protruding from the wheel flange was plated with chrome having a thickness of 3 μm. This was set in a mold, and a resin bond containing a polyimide resin as a main component and a silicon carbide powder as a filler was provided with a particle size of # 1.
A mixture of 40 (average particle diameter: 107 μm) diamond abrasive grains, and a uniformly mixed mixture was filled in a mold, heated to 230 ° C., and pressurized at a pressure of 700 kgf / cm 2, thereby forming an outer peripheral portion of a high-speed steel substrate. A diamond layer was fixed on the substrate. This diamond layer was subjected to truing and dressing with a dressing machine to obtain a size of Φ150-0.8t-3x-40.
H, specification, resin bond diamond cutting wheel of the present invention of SD140-concentration 100-B was completed.

Table 1 shows the sizes of the three types of resin-bonded diamond cutting wheels according to the present invention obtained above and the conventional resin-bonded cutting wheels.
It shows the specifications and the results of each test.

[0021]

[Table 1]

[0022]

According to the results shown in Table 1, the substrates of the superabrasive cutting wheel made of a high-speed steel substrate were coated with a chromium plating film. The grinding resistance is lower than that of the conventional example 1), and the thickness variation and chipping of the workpiece are small. Also, JIS SK-
Compared with the five substrates (Comparative Example 2), the grinding resistance is similarly low, and the variation in the thickness of the workpiece and the chipping are also small.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment.

FIG. 2 is a sectional view of one embodiment.

FIG. 3 is a schematic partial cross-sectional view of one embodiment.

[Explanation of symbols]

 Reference Signs List 1 substrate 2 superabrasive layer 3 superabrasive cutting wheel 4 chrome plating film

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[Procedure amendment]

[Submission date] June 15, 1999 (1999.6.1
5)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 3

[Correction method] Change

[Correction contents]

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B24D 3/14 B24D 3/14 3/28 3/28 5/12 5/12 Z

Claims (3)

[Claims] 1. A superabrasive grain cutting wheel in which superabrasive grains are fixed to the outer periphery of a disk-shaped substrate made of high-speed steel with a binder, wherein all or a part of the exposed surface of the substrate is a chromium plating film. A superabrasive cutting wheel, characterized by being coated with: 2. The method according to claim 1, wherein said chromium plating film has a thickness of 1 μm or less.
The superabrasive cutting wheel according to claim 1, wherein the diameter is 30 µm. 3. The bonding material according to claim 1, wherein the bonding material is any one of a resin bond, a metal bond, a vitrified bond, and an electrodeposition bond, or a composite bond thereof. Super abrasive cutting wheel.