JP2021184407A - Multi-piece wiring board and wiring board - Google Patents

Abstract

To provide a configuration of an edge face of a wiring board that can reduce an exposure area of each connection part for connecting with a wire for plating, the wiring board is obtained by dividing a multi-piece wiring board.SOLUTION: A multi-piece wiring board 1 has a lamination construction in which a plurality of ceramic sheets 31 (insulation layers) are laminated, and when viewed in a lamination direction D3, a plurality of board element sections 11 are arranged side by side in a first direction D1 and a second direction D2. A plurality of wires for plating to be electrically connected to a plurality of plating parts are arranged around each of the board element sections 11. Two wires for plating, which are adjacent to each other, among the plurality of wires for plating 22a-22f are arranged in the first direction D1 in a manner of sandwiching one board element section 11. Two board element sections, which are adjacent to each other in the second direction D2, among the plurality of board element sections 11 are arranged with only an insulating layer between them.SELECTED DRAWING: Figure 1

Description

The present invention relates to a large number of wiring boards. Further, the present invention relates to a wiring board obtained by dividing a large number of wiring boards.

A multi-layered wiring board including a plurality of substrate element portions has a substrate region (also referred to as a product area) which is a wiring board of individual pieces, and an outer peripheral region located outside the substrate region. By cutting a large number of wiring boards into individual board regions, a single-piece wiring board can be obtained.

The multi-layer wiring board is manufactured by laminating a plurality of ceramic sheets on which a metal layer is printed and formed to form a plate-shaped laminate, and sintering the plate-shaped laminate. After that, a plating layer is formed on the metal layer formed on the surface of the plate-shaped laminate by electrolytic plating.

A method for reducing the variation in the thickness of the plating layer formed by electrolytic plating in a multi-layered wiring board having such a configuration has been proposed. For example, Patent Document 1 discloses a configuration capable of suppressing variation in the thickness of a plating layer coated on a metallized layer in a multi-layer wiring board having a product area A in which a plurality of packages p are arranged. There is. The multi-layer wiring board disclosed in Patent Document 1 includes a tie bar 12 connecting between the surface metallizing layer 10 of each package p adjacent to the first direction X, and an internal metallizing layer 11 of each adjacent package p. It has a tie bar 13 along a second direction Y connecting between the two.

Japanese Unexamined Patent Publication No. 2008-186967

The multi-layer wiring board disclosed in Patent Document 1 is capable of conducting a plating electrode provided in a peripheral region of the board and a wiring layer (metallized layer) in each board element portion (package p). As the plating wiring to be used, it has a tie bar extending in two directions, a first direction X and a second direction Y. In a wiring board obtained by dividing a large number of wiring boards having such a configuration, individual board elements for connecting to a plating wiring (that is, a tie bar) are provided on each of the cut end faces of the individual wiring boards. There is a place where the wiring layer in the part is exposed.

In each wiring board obtained by dividing a large number of wiring boards, such an exposed portion of the wiring layer requires post-treatment such as coating. If there are exposed parts of the plating wiring on each end surface of the wiring board, the post-processing work becomes troublesome.

In addition, some wiring boards having a large number of pieces have a plurality of electrically independent plated parts in each board element part. In such a configuration, if an attempt is made to reduce the number of exposed end faces of the plating wiring while making the plating thickness of each substrate element portion uniform, there is a problem that the wiring structure becomes complicated.

Therefore, the present invention provides a configuration capable of reducing the exposed portion of the connection portion (wiring layer) for connecting to the plating wiring on the end face of the wiring board obtained by dividing a large number of wiring boards. The purpose.

The multi-layered wiring board according to one aspect of the present invention has a laminated structure in which a plurality of insulating layers are laminated, and when viewed in the stacking direction, the plurality of substrate element portions are in the first direction and A plurality of plated portions arranged side by side in a second direction perpendicular to the first direction and formed on the respective surfaces of the plurality of substrate element portions, and a plurality of plated portions arranged around the substrate element portions. It is arranged between the insulating layers of the above, and is provided with a plurality of plating wirings electrically connected to the plurality of plating portions. In this multi-layered wiring board, the plurality of plating wirings extend in a second direction perpendicular to the first direction when viewed in the stacking direction, and two of the plurality of plating wirings adjacent to each other. The two plating wirings are all arranged in the first direction so as to sandwich the one substrate element portion, and the two substrate element portions adjacent to each other in the second direction among the plurality of substrate element portions are laminated. When viewed in the direction, the plurality of plated portions are all arranged via only the insulating layer, and the plurality of plated portions form a first plated portion and a second plated portion that are electrically independent of each other in one of the substrate element portions. The plating wiring, which is provided for each of the substrate element portions, includes a first plating wiring formed on the first insulating layer of the plurality of insulating layers and a second insulation of the plurality of insulating layers. A second plated wiring formed on the layer is included, and at least one first metal portion is provided on each of the substrate element portions on the first insulating layer, and the second insulating layer is provided with at least one first metal portion. Is provided with a plurality of second metal portions in each of the substrate element portions, and the at least one first metal portion is electrically connected to the first plating portion in one of the substrate element portions. In addition, the two first-plated wirings sandwiching the substrate element portion are connected to each other via the first connection portion, and the plurality of second metal portions are one of the substrate element portions, one of which is said. One of the two second-plated wirings that are electrically connected to the first plating portion and the first metal portion, the other one is electrically connected to the second plating portion, and sandwiches the substrate element portion. One is connected to each other via the second connection portion.

According to the above configuration, the first metal portion 41 is connected to each of the two first plated wires sandwiching the substrate element portion via the first connection portion, so that the first metal portion 41 is arranged on both sides of the substrate element portion 11. A feeding path can be formed between the two first plated wires. Further, since the second metal portion having the above configuration is formed in the insulating layer different from the first metal portion 41, a feeding path to the second metal portion is formed via the first metal portion. be able to.

Further, according to the above configuration, the two substrate element portions adjacent to each other in the second direction among the plurality of substrate element portions are all lined up via only the insulating layer when viewed in the stacking direction. This makes it possible to reduce the number of exposed end faces of the plating wiring while making the plating thickness of each substrate element portion uniform.

In the multi-layered wiring board according to one aspect of the present invention, the plurality of plated portions have a third plating that is electrically independent of the first plating portion and the second plating portion in one of the substrate element portions. Each of the substrate element portions has a portion, and a third metal portion is further provided on the first insulating layer, and the third metal portion is the third plating on one of the substrate element portions. It may be electrically connected to the portion and may be connected to either one of the two first-plated wirings sandwiching the substrate element portion via the third connection portion.

According to the above configuration, the wiring structure becomes complicated even in a multi-layered wiring board having a relatively complicated wiring structure in which each board element portion has a plurality of electrically independent plating portions. It is possible to reduce the number of exposed end faces of the plating wiring while keeping the plating thickness of each substrate element uniform.

In the multi-layered wiring board according to one aspect of the present invention, the plurality of plated portions have a fourth plating that is electrically independent of the first plating portion and the second plating portion in one of the substrate element portions. Each of the substrate element portions has a portion, and the other one of the plurality of second metal portions is electrically connected to the fourth plating portion in one of the substrate element portions. , It may be connected to any one of the two second plated wirings sandwiching the substrate element portion via the connecting portion. Further, in the configuration in which the multi-layered wiring board has the third plated portion, the plated portion is electrically independent of the first plated portion, the second plated portion, and the third plated portion. You may.

According to the above configuration, the wiring structure becomes complicated even in a multi-layered wiring board having a relatively complicated wiring structure in which each board element portion has a plurality of electrically independent plating portions. It is possible to reduce the number of exposed end faces of the plating wiring while keeping the plating thickness of each substrate element uniform.

The multi-layer wiring board according to one aspect of the present invention may further include a connection via for electrically connecting the first-plated wiring and the second-plated wiring.

According to the above configuration, it is possible to make it easier to energize between the first-plated wiring and the second-plated wiring formed on different insulating layers. This makes it possible to reinforce the power supply between the layers during the electrolytic plating process.

Another aspect of the present invention relates to a wiring board having a laminated structure in which a plurality of insulating layers are laminated and having a plated portion formed on the surface. In this wiring board, the plated portion has a first plated portion and a second plated portion that are electrically independent of each other. Further, the wiring board is arranged between at least one first metal portion arranged between the plurality of insulating layers and the plurality of insulating layers different from the positions where the first metal portions are arranged. It has a plurality of second metal portions. The at least one first metal portion is electrically connected to the first plating portion and is exposed only to two side surfaces facing each other among the outer side surfaces of the wiring board. One of the second metal portions is electrically connected to the first plating portion and the first metal portion, the other one is electrically connected to the second plating portion, and any of the two side surfaces thereof. It is exposed only on one side.

According to the above configuration, even in a wiring board having a relatively complicated wiring structure having a plurality of electrically independent plating portions, the plating wiring can be obtained while suppressing the complicated wiring structure. The number of exposed sides can be reduced. As a result, it is possible to reduce the labor of post-processing of the exposed portion of the wiring layer on the side surface of the wiring board.

Further, in the wiring substrate according to another aspect of the present invention, the plated portion further has a first plated portion and a third plated portion electrically independent of the second plated portion, and the first metal. A third metal portion is further provided on the first insulating layer in which the portions are arranged, and the third metal portion is electrically connected to the third plating portion and is provided with either of the two side surfaces. It may be exposed to only one side.

According to the above configuration, even in a wiring board having a more complicated wiring structure having a first plating portion and a third plating portion electrically independent of the second plating portion, the wiring structure becomes complicated. While suppressing it, the number of end faces where the plating wiring is exposed can be reduced.

In the wiring board according to the other aspect of the present invention, the plated portion further includes a first plated portion and a fourth plated portion electrically independent of the second plated portion, and the plurality of first plated portions. The other one of the two metal portions may be electrically connected to the fourth plating portion and may be exposed to only one of the two side surfaces.

According to the above configuration, even in a wiring board having a more complicated wiring structure having a first plating portion and a fourth plating portion electrically independent of the second plating portion, the wiring structure becomes complicated. While suppressing it, the number of end faces where the plating wiring is exposed can be reduced.

In the wiring substrate according to the other aspect of the present invention, the plated portion further includes a first plated portion, a second plated portion, and a fourth plated portion electrically independent of the third plated portion. However, the other one of the plurality of second metal portions may be electrically connected to the fourth plating portion and may be exposed to only one of the two side surfaces. ..

According to the above configuration, even a wiring board having a more complicated wiring structure having a first plating portion, a second plating portion, and a fourth plating portion electrically independent of the third plating portion has a wiring structure. It is possible to reduce the number of exposed end faces of the plating wiring while suppressing the complication of the plating.

According to the present invention, it is possible to provide a configuration capable of reducing the exposed portion of the connection portion for connecting to the plating wiring on the end face of the wiring board obtained by dividing the large number of wiring boards.

It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the multi-component wiring board which concerns on 1st Embodiment. It is a plane schematic diagram which shows the structure on the 2nd ceramic sheet of the multi-component wiring board which concerns on 1st Embodiment. It is sectional drawing which shows typically the internal structure of the board element part included in the multi-component wiring board which concerns on 1st Embodiment. It is a perspective view which shows the schematic structure of the wiring board manufactured from the multi-component wiring board which concerns on 1st Embodiment. FIG. 3 is a perspective view showing a state in which the wiring board shown in FIG. 4 is viewed from another direction. It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the wiring board which concerns on 1st Embodiment. It is a plane schematic diagram which shows the structure on the 2nd ceramic sheet of the wiring board which concerns on 1st Embodiment. It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the wiring board which concerns on the modification of 1st Embodiment. It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the multi-component wiring board which concerns on 2nd Embodiment. It is a plan schematic diagram which shows the structure on the 2nd ceramic sheet of the multi-component wiring board which concerns on 2nd Embodiment. It is a top view which shows the structure of the multi-component wiring board which concerns on 3rd Embodiment. It is a top view which shows the structure of the wiring board which concerns on 3rd Embodiment. It is sectional drawing which shows typically the internal structure of the board element part included in the multi-component wiring board which concerns on 3rd Embodiment. It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the wiring board which concerns on 3rd Embodiment. It is a plane schematic diagram which shows the structure on the 2nd ceramic sheet of the wiring board which concerns on 3rd Embodiment. It is a plane schematic diagram which shows the structure on the other 2nd ceramic sheet of the wiring board which concerns on 3rd Embodiment. It is a plane schematic diagram which shows the structure on the ceramic sheet of the lowermost layer of the wiring board which concerns on 3rd Embodiment. It is a plane schematic diagram which shows the structure on the 1st ceramic sheet of the multi-component wiring board which concerns on other embodiment. It is a plane schematic diagram which shows the structure of the multi-component wiring board which concerns on other embodiment. It is a plane schematic diagram which shows the structure of the multi-component wiring board which concerns on other embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same members are designated by the same reference numerals. Their names and functions are the same. Therefore, the detailed description of them will not be repeated.

[First Embodiment]
In this embodiment, a large number of wiring boards 1 will be described as an example. The wiring board 10 obtained by separating a large number of wiring boards 1 into individual pieces is used as a wiring board, a circuit board, or the like for electronic devices.

(Structure of a large number of wiring boards)
1 and 2 show a planar configuration of a large number of wiring boards 1. FIG. 1 schematically shows the configuration of each conductive pattern formed on the first ceramic sheet 31a of the multi-layer wiring board 1. Further, FIG. 2 schematically shows the configuration of each conductive pattern formed on the second ceramic sheet 31b of the multi-layer wiring board 1. FIG. 3 is a diagram showing a cross-sectional configuration of a substrate element portion 11 constituting the multi-layer wiring board 1. FIG. 3 is a diagram showing a cross-sectional configuration when one substrate element portion 11 included in the multi-layer wiring board 1 shown in FIG. 1 is cut by the alternate long and short dash line X. In addition, in FIGS. 1 and 2, the illustration of the connection via (for example, connection via 57, connection via 58, etc.) with the plated portion formed on the surface (upper surface or lower surface) of the multi-layer wiring board 1 is omitted. ing.

The multi-piece wiring board 1 has a substantially flat plate-like outer shape. The multi-layer wiring board 1 has a product area including a plurality of board element portions 11 and an outer peripheral area 3 located outside the product area.

The product area constitutes the central part of the board. In the product area, a plurality of board element portions 11 which are divided into individual wiring boards 10 are arranged vertically and horizontally. In the present embodiment, regarding the arrangement direction of the plurality of substrate element portions 11, the horizontal direction shown in FIG. 1 is defined as the first direction D1, and the vertical direction perpendicular to the first direction D is defined as the second direction D2. Further, as shown in FIG. 3, the stacking direction of the plurality of ceramic sheets (insulating layers) 31 constituting the multi-layer wiring board 1 is defined as the third direction D3.

An internal circuit element is formed in each substrate element portion 11 by a conductive pattern made of various conductive metal layers or the like. Further, a plurality of plated portions (for example, first plated portions 61 to fourth plated portions 64) are formed on the surface of each substrate element portion 11. Each plated portion functions as a connection terminal (joint portion) with the outside. As shown in FIG. 3, each plated portion is provided so as to cover the surface metal layer 12.

The outer peripheral area 3 constitutes the outer peripheral portion of the substrate. The outer peripheral area 3 is provided so as to surround the product area. Since the outer peripheral area 3 is not an element of the wiring board 10, no internal circuit element is formed in the outer peripheral area 3. A plurality of plating terminals 21, plating wiring 22, and the like are formed in the outer peripheral area 3.

The plating terminal 21 is formed at the end of the multi-layered wiring board 1. In the present embodiment, a plurality of plating terminals 21 are arranged at substantially equal intervals on each end side extending in the longitudinal direction (second direction D2 in FIG. 1) of the multi-layered wiring board 1 having a substantially rectangular flat plate shape. They are arranged side by side. The plating terminal 21 is electrically connected to the plating power supply. Further, the plating terminal 21 is connected to the plating wiring 22.

The plating wiring 22 is arranged around the product area where the substrate element portion 11 is arranged. The plating wiring 22 is arranged between the plurality of ceramic sheets (insulating layers) 31. The plating wiring 22 is electrically connected to a plurality of plating portions (for example, first plating portions 61 to fourth plating portions 64) formed on the surface of each substrate element portion 11.

The plating wiring 22 is branched into a plurality of plating wirings 22a to 22f in the product area. In the present embodiment, the plurality of plating wirings 22a to 22f extend in the second direction D2 when viewed in the third direction (stacking direction) (that is, in the top view). The two adjacent plating wirings 22a to 22f among the plurality of plating wirings 22a to 22f are all arranged in the first direction D1 so as to sandwich one substrate element portion 11. For example, a plurality of substrate element portions 11 arranged along the second direction D2 are arranged between two adjacent plating wirings 22a and 22b. As will be described later, the plating wiring 22 is formed on two or more ceramic sheets 31 among the plurality of ceramic sheets 31.

The substrate element portion 11 has a rectangular shape such as a rectangle or a square. When the multi-cavity wiring board 1 is manufactured, the multi-cavity wiring board 1 is subsequently cut and divided into individual substrate element portions 11. As a result, the individual wiring boards 10 are obtained. 4 and 5 show an external configuration of the wiring board 10.

Further, as shown in FIG. 1 and the like, there is a planned cutting area 4 between the adjacent substrate element portions 11 in the product area. A plurality of plating wirings (for example, plating wirings 22b to 22e) are arranged in the planned cutting area 4. When the wiring board 10 is manufactured from the multi-cavity wiring board 1, the multi-cavity wiring board 1 is cut along the planned cutting line C, and the planned cutting area 4 is cut off. The planned cutting line C may be formed with slits, cuts, grooves and the like extending vertically and horizontally in order to individually partition the substrate element portion 11.

The multi-layer wiring board 1 has a laminated structure in which a plurality of ceramic sheets (insulating layers) 31 (for example, 31a, 31b, 31c, etc.) are laminated (see FIG. 3). The ceramic sheet 31 can be formed of, for example, a high temperature fired ceramic containing _{alumina (Al 2} O _{3) as a main component.} In another aspect, the ceramic sheet 31 may be formed of a medium temperature fired ceramic (MTCC) such as glass-ceramic.

FIG. 3 has three ceramic sheets 31 (specifically, a first ceramic sheet (first insulating layer) 31a, a second ceramic sheet (second insulating layer) 31b, and a third ceramic sheet 31c). Although the multi-layer wiring board 1 is illustrated, the number of ceramic sheets is not limited to this. The number of ceramic sheets 31 is appropriately determined according to the application, specifications, and the like of the finally obtained wiring board 10.

A metal layer serving as a conductive pattern is formed between the plurality of ceramic sheets 31. The metal layer may be copper (Cu), tungsten (W), silver (Ag), palladium (Pd), gold (Au), platinum (Pt), molybdenum (Mo), nickel (Ni), manganese (Mn), or the like. It can be formed of a metal material of the above, or an alloy material containing these metal materials as a main component. The metal layer is printed on each ceramic sheet 31 so as to have an arbitrary shape (pattern) according to the desired circuit configuration on the finally obtained wiring board 10.

A surface metal layer 12 is formed on the surface of the multi-layer wiring board 1. In the example shown in FIG. 3, the surface metal layer 12 is formed on the uppermost third ceramic sheet 31c and under the lowermost first ceramic sheet 31a. The surface metal layer 12 can be formed of the same material as the metal layer formed inside the multi-layer wiring board 1.

A plated portion is formed on the surface of the surface metal layer 12. The plated portion is formed by plating the surface of the surface metal layer 12 made of, for example, copper (Cu), tungsten (W), molybdenum (Mo), silver (Ag), etc. with nickel (Ni) plating and gold (Au) plating. It is formed by applying such things. The plated portion can be formed, for example, by a conventionally known electrolytic plating method.

In the present embodiment, a plurality of plated portions electrically independent of each other are formed in one substrate element portion 11. These plurality of plated portions are formed in each substrate element portion 11. Specifically, one substrate element portion 11 is formed with a first plating portion 61, a second plating portion 62, a third plating portion 63, and a fourth plating portion 64 that are electrically independent of each other (1). See FIG. 4). Here, the fact that the plurality of plated portions are electrically independent of each other in one substrate element portion 11 means that the multi-layered wiring board 1 is separated into individual pieces (the state of the wiring board 10 shown in FIG. 4 and the like). ) Means that the plated portions such as the first plated portion 61, the second plated portion 62, the third plated portion 63, and the fourth plated portion 64 are electrically independent of each other.

Each plated portion is electrically connected to the plating wiring 22 inside the multi-layer wiring board 1. Specifically, as shown in FIG. 3, the surface metal layer 12 formed under each plating portion (for example, the first plating portion 61, the second plating portion 62, the fourth plating portion 64, etc.) is formed. , Is electrically connected to an internal metal layer (for example, the second metal portion 42, etc.) via a connecting via 57 penetrating the third ceramic sheet 31c. Further, the surface metal layer 12 formed under each plated portion (for example, the third plated portion 63 or the like) has an internal metal layer (for example, a first metal layer) via a connecting via 58 penetrating the first ceramic sheet 31a. 3 It is electrically connected to the metal part 43, etc.). Each metal layer is electrically connected to the first plated wiring 23 or the second plated wiring 24 formed on the ceramic sheet 31.

The plating wiring 22 is formed on two or more ceramic sheets 31 out of a plurality of ceramic sheets 31. For example, as shown in FIG. 3, in the case of a multi-layered wiring board 1 having three layers of ceramic sheets 31 (that is, a first ceramic sheet 31a, a second ceramic sheet 31b, and a third ceramic sheet 31c), The plating wiring 22 includes a first plating wiring 23 formed on the first ceramic sheet 31a and a second plating wiring 24 formed on the second ceramic sheet 31b.

As shown in FIG. 1, the first plating wiring 23 includes the first plating wirings 23a to 23f constituting the respective plating wirings 22a to 22f extending in the second direction D2. Further, as shown in FIG. 2, the second plated wiring 24 includes the second plated wirings 24a to 24f constituting the respective plating wirings 22a to 22f extending in the second direction D2. The first plated wirings 23a to 23f and the second plated wirings 24a to 24f are printed on a predetermined ceramic sheet 31 so as to have a predetermined shape (pattern).

The formation positions of the first plating wiring 23 and the second plating wiring 24 constituting the plating wiring 22 are not limited to those described above. The first plated wiring 23 is formed only on one ceramic sheet (for example, the first ceramic sheet 31a). On the other hand, the second plated wiring 24 may be formed on a plurality of ceramic sheets. That is, the multi-layer wiring board 1 may have a plurality of second ceramic sheets 31b.

For example, when the multi-layer wiring board 1 is composed of the eight-layer ceramic sheet 31, the first-plated wiring 23 or the second-plated wiring is attached to the three-layer ceramic sheet 31 of the eight-layer ceramic sheet 31. 24 is formed. Then, the first plated wiring 23 is formed on one layer (that is, the first ceramic sheet 31a) of the three layers of ceramic sheets 31, and the remaining two layers of ceramic sheets (that is, the second ceramic sheet 31b) are formed. The second plated wiring 24 is formed on the surface.

As shown in FIGS. 1 and 2, each of the plated wirings 23 and 24 also extends to the outer peripheral area 3. In the outer peripheral area 3, each of the plated wirings 23 and 24 is connected to the plating terminal 21. Thereby, the electric power supplied from the plating power source at the time of the electrolytic plating process can be supplied to the surface metal layer 12 via the plating wirings 23 and 24.

Each of the plated wirings 23 and 24 can be formed of the same material as the metal layer formed inside the multi-layer wiring board 1. For example, the plated wires 23 and 24 can be made of copper (Cu), tungsten (W), molybdenum (Mo), silver (Ag), or the like.

A metal layer serving as a conductive pattern is formed between the ceramic sheets 31 constituting the multi-layer wiring board 1. These metal layers include a first metal portion 41, a second metal portion 42 (specifically, second metal portions 42a, 42b, 42c), a third metal portion 43, and the like. The first metal portion 41, the second metal portion 42, and the third metal portion 43 are surface metal layers formed on the third ceramic sheet 31c of the uppermost layer or under the first ceramic sheet 31a of the lowermost layer. It is electrically connected to 12.

The first metal portion 41 is formed on the first ceramic sheet 31a. The first metal portion 41 is provided in each substrate element portion 11. The first metal portion 41 is electrically connected to the first plating portion 61 via connecting vias (for example, connecting vias 51, connecting vias 57, connecting vias 58, etc.) in one substrate element portion 11. Further, as shown in FIG. 1, the first metal portion 41 is connected to two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11 via the first connecting portions 53a and 53b, respectively. ing. For example, in the case of the substrate element portion 11 located between the first plated wiring 23a and the first plated wiring 23b, the first metal portion 41 and the first plated wiring 23a are connected via the first connecting portion 53a. The first metal portion 41 and the first plated wiring 23b are connected to each other via the first connecting portion 53b.

The second metal portion 42 is formed on the second ceramic sheet 31b. The second metal portion 42 is provided in each substrate element portion 11. In one substrate element portion 11, the second metal portion 42 includes a plurality of metal portions. In the present embodiment, the second metal portion 42 has three second metal portions 42a, 42b, and 42c. These second metal portions 42 are connected to only one of the two second plated wirings 24 arranged on the left and right sides of the substrate element portion 11.

One of the second metal portions 42 (in this embodiment, the second metal portion 42a) is the first in one substrate element portion 11 (that is, in the state of the wiring board 10 shown in FIG. 4 or the like). It is electrically connected to the plated portion 61 and the first metal portion 41. For example, as shown in FIG. 3, the second metal portion 42a is connected to the first metal portion 41 via the connecting via 51, and the first plating portion 61 is connected via the connecting via 57 and the surface metal layer 12. Is connected to. Further, the second metal portion 42a is connected to one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54a. For example, in the case of the substrate element portion 11 arranged between the two second plated wirings 24a and 24b, the second metal portion 42a in the substrate element portion 11 is the second plated wiring 24a and the second connecting portion 54a. It is connected via.

The other one of the second metal portions 42 (in this embodiment, the second metal portion 42b) is located in one substrate element portion 11 (that is, in the state of the wiring board 10 shown in FIG. 4 or the like). It is electrically connected to the second plating portion 62. For example, the second metal portion 42b is connected to the second plating portion 62 via the connecting via 57 and the surface metal layer 12. Further, the second metal portion 42b is connected to one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54b. For example, in the case of the substrate element portion 11 arranged between the two second plated wirings 24a and 24b, the second metal portion 42b in the substrate element portion 11 is the second plated wiring 24a and the second connecting portion 54b. It is connected via.

Yet another one of the second metal portions 42 (in this embodiment, the second metal portion 42c) is in one substrate element portion 11 (that is, in the state of the wiring board 10 shown in FIG. 4 or the like). , Is electrically connected to the fourth plating portion 64. For example, the second metal portion 42c is connected to the fourth plating portion 64 via the connecting via 57 and the surface metal layer 12. Further, the second metal portion 42c is connected to any one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54c. For example, in the case of the substrate element portion 11 arranged between the two second plated wirings 24a and 24b, the second metal portion 42c in the substrate element portion 11 is secondly connected to the second plated wiring 24b. It is connected via the portion 54c.

The third metal portion 43 is formed on the first ceramic sheet 31a. The third metal portion 43 is provided in each substrate element portion 11. The third metal portion 43 is electrically connected to the third plating portion 63 in one substrate element portion 11 (that is, in the state of the wiring board 10 shown in FIG. 4 and the like). Further, the third metal portion 43 is connected to one of the two first plated wirings 23 arranged so as to sandwich the substrate element portion 11 via the third connecting portion 55. For example, in the case of the substrate element portion 11 arranged between the two first plated wirings 23a and 23b, the third metal portion 43 in the substrate element portion 11 is the first plated wiring 23b and the third connecting portion 55. It is connected via.

As described above, in the multi-layer wiring board 1 according to the present embodiment, one of the plurality of ceramic sheets 31 on which the plated wiring is formed (that is, the first ceramic sheet 31a) is the substrate element portion 11. It has a first metal portion 41 connected to each of the two first plated wirings 23 arranged on the left and right sides of the above. As a result, it is possible to form a feeding path between the two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11.

Further, the multi-layer wiring board 1 is connected to the other of the plurality of ceramic sheets 31 on which the plated wiring is formed (that is, the second ceramic sheet 31b) via the first metal portion 41 and the connection via 51. It has a second metal portion 42a that is plated. The second metal portion 42a is connected to either one of the two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11. The other ceramic sheet 31 (that is, the second ceramic sheet 31b) is formed with a second metal portion (that is, the second metal portions 42b and 42c) different from the second metal portion 42a. These second metal portions 42b and 42c are connected to either one of the two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11. As a result, electricity from the plating power source can be sent to the other second metal portions 42b and 42c via the second metal portion 42a connected to the first metal portion 41.

Therefore, according to the multi-layer wiring board 1 according to the present embodiment, the second metal portion 42 formed on the ceramic sheet 31 (for example, the second ceramic sheet 31b) different from the first ceramic sheet 31a. It can send electricity from the plating power supply. As a result, it is possible to reduce the variation in the plating thickness of each substrate element portion 11 in the multi-layer wiring board 1 having a plurality of electrically independent plating portions in each substrate element portion 11.

Further, since the multi-layer wiring board 1 has the first metal portion 41 as described above, it is located in the substrate element portion 11 between the two first plated wirings 23 adjacent to each other in the first direction D1. A feeding path is formed. This reduces the need to provide a plating wiring, a wiring layer connected to the plating wiring, and the like between the two substrate element portions 11 adjacent to each other in the second direction D2.

Therefore, in the multi-layer wiring board 1 according to the present embodiment, when the two board element portions 11 adjacent to the second direction D2 among the plurality of board element portions 11 are viewed in the third direction D3, all of them are present. It can be configured to be arranged side by side only through the ceramic sheet 31. In other words, the connection portion (wiring layer) for connecting to the plated wiring 23 or 24 can be not exposed between the two substrate element portions 11 adjacent to each other in the second direction D2.

(Configuration of wiring board)
Subsequently, the configuration of the wiring board 10 will be described with reference to FIGS. 4 to 7. FIG. 4 schematically shows the appearance configuration of the wiring board 10 according to the present embodiment. FIG. 5 is a perspective view of the wiring board 10 shown in FIG. 4 when viewed from another direction. FIG. 6 shows a planar configuration on the first ceramic sheet 31a constituting the wiring board 10. FIG. 7 shows a planar configuration on the second ceramic sheet 31b constituting the wiring board 10. Note that in FIGS. 6 and 7, connection vias other than the connection via 51 are not shown.

The wiring board 10 according to the present embodiment can be manufactured by firing a large number of individual wiring boards 1 according to the present embodiment, subjecting them to electrolytic plating, and dividing them by dicing or the like. As shown in FIG. 4, the wiring board 10 has a substantially rectangular parallelepiped outer shape. Here, the names of the respective surfaces of the substantially rectangular parallelepiped wiring board 10 are defined as the upper surface 10a and the lower surface 10b where the plated portions are formed, and the lower surface 10b, the first side surface 10c, the second side surface 10d, and the third side surface. 10e and the fourth side surface 10f.

The first side surface 10c and the second side surface 10d extend along the first direction D1 and the third direction D3. The third side surface 10e and the fourth side surface 10f extend along the second direction D2 and the third direction D3. The upper surface 10a and the lower surface 10b are arranged on a plane orthogonal to the third direction D3.

As shown in FIGS. 4 and 5, the wiring board 10 has a laminated structure in which a plurality of ceramic sheets (insulating layers) 31 (for example, 31a, 31b, 31c, etc.) are laminated.

FIG. 4 has three ceramic sheets 31 (specifically, a first ceramic sheet (first insulating layer) 31a, a second ceramic sheet (second insulating layer) 31b, and a third ceramic sheet 31c). Although the wiring board 10 is exemplified, the number of ceramic sheets is not limited to this. The number of ceramic sheets 31 is appropriately determined according to the application, specifications, and the like of the wiring board 10.

As the internal configuration of the wiring board 10, the same configuration as that of the substrate element portion 11 described above can be applied. For example, the wiring board 10 has a cross-sectional structure as shown in FIG. FIG. 3 is a diagram showing a cross-sectional configuration when the wiring board 10 is cut by the alternate long and short dash line X shown in FIG. 7.

A surface metal layer 12 is formed on the surface of the wiring board 10 (that is, the upper surface 10a and the lower surface 10b of the wiring board 10). A plated portion is formed on the surface of the surface metal layer 12. The plated portion includes a plurality of plated portions that are electrically independent of each other. Specifically, on the upper surface 10a or the lower surface 10b of the wiring board 10, a first plating portion 61, a second plating portion 62, a third plating portion 63, and a fourth plating portion 64 are formed electrically independent of each other. (See Fig. 4). In this embodiment, the first plating portion 61, the second plating portion 62, and the fourth plating portion 64 are provided on the upper surface 10a of the wiring board 10, and the third plating portion 63 is the wiring board 10. It is provided on the lower surface 10b.

A metal layer serving as a conductive pattern is formed between the ceramic sheets 31 constituting the wiring board 10. These metal layers include a first metal portion 41, a second metal portion 42 (specifically, second metal portions 42a, 42b, 42c), a third metal portion 43, and the like. The first metal portion 41, the second metal portion 42, and the third metal portion 43 are surface metal layers formed on the third ceramic sheet 31c of the uppermost layer or under the first ceramic sheet 31a of the lowermost layer. It is electrically connected to 12.

The first metal portion 41 is formed on the first ceramic sheet 31a. The first metal portion 41 is electrically connected to the first plating portion 61 via a connecting via (for example, a connecting via 51, a connecting via 57, etc.). Further, the first metal portion 41 has two side surfaces (for example, the first side surface 10c, the second side surface 10d, the third side surface 10e, and the fourth side surface 10f) facing each other among the outer side surfaces of the wiring board 10. For example, it is exposed only on the third side surface 10e and the fourth side surface 10f).

In this embodiment, as shown in FIGS. 4 and 6, the first metal portion 41 is exposed on the third side surface 10e of the wiring board 10 as the first connection portion 53a connected to the first metal portion 41. doing. Further, as shown in FIGS. 4 and 6, the first metal portion 41 is exposed on the fourth side surface 10f of the wiring board 10 as the first connection portion 53b connected to the first metal portion 41. However, the metal portion (wiring layer) is not exposed on the first side surface 10c and the second side surface 10d of the wiring board 10.

The second metal portion 42 is formed on a ceramic sheet (for example, a second ceramic sheet 31b) different from the first ceramic sheet 31a. The second metal portion 42 includes a plurality of metal portions. In this embodiment, the second metal portion 42 has three second metal portions 42a, 42b, and 42c (see FIG. 7).

One of the second metal portions 42 (in this embodiment, the second metal portion 42a) is electrically connected to the first plating portion 61 and the first metal portion 41. For example, the second metal portion 42a is connected to the first metal portion 41 via the connecting via 51, and is also connected to the first plating portion 61 via the connecting via 57 and the surface metal layer 12. Further, the second metal portion 42a is one of two side surfaces (for example, the third side surface 10e and the fourth side surface 10f) where the first connection portions 53a and 53b are exposed (for example, the third side surface). It is exposed only in 10e). In this embodiment, as shown in FIGS. 4 and 7, the second metal portion 42a is exposed on the third side surface 10e of the wiring board 10 as the second connection portion 54a connected to the second metal portion 42a. doing.

The other one of the second metal portions 42 (in this embodiment, the second metal portion 42b) is electrically connected to the second plating portion 62. For example, the second metal portion 42b is connected to the second plating portion 62 via the connecting via 57 and the surface metal layer 12. Further, the second metal portion 42b has one of two side surfaces (for example, the third side surface 10e and the fourth side surface 10f) where the first connection portions 53a and 53b are exposed (for example, the third side surface). It is exposed only in 10e). In this embodiment, as shown in FIGS. 4 and 7, the second metal portion 42b is exposed on the third side surface 10e of the wiring board 10 as the second connection portion 54b connected to the second metal portion 42b. doing.

Yet another one of the second metal portions 42 (in this embodiment, the second metal portion 42c) is electrically connected to the fourth plating portion 64. For example, the second metal portion 42c is connected to the fourth plating portion 64 via the connecting via 57 and the surface metal layer 12. Further, the second metal portion 42c has one of two side surfaces (for example, the third side surface 10e and the fourth side surface 10f) where the first connection portions 53a and 53b are exposed (for example, the fourth side surface). It is exposed only in 10f). In this embodiment, as shown in FIGS. 5 and 7, the second metal portion 42c is the fourth wiring board 10 as the second connection portion 54c (connection portion) connected to the second metal portion 42c. It is exposed on the side surface 10f.

The third metal portion 43 is formed on the first ceramic sheet 31a. The third metal portion 43 is electrically connected to the third plating portion 63 under the first ceramic sheet 31a via a connecting via or the like. Further, the third metal portion 43 has one of two side surfaces (for example, the third side surface 10e and the fourth side surface 10f) where the first connection portions 53a and 53b are exposed (for example, the fourth side surface). It is exposed only in 10f). In this embodiment, as shown in FIGS. 5 and 6, the third metal portion 43 is exposed on the fourth side surface 10f of the wiring board 10 as the third connection portion 55 connected to the third metal portion 43. doing.

As described above, in the wiring board 10 according to the present embodiment, both ends of the first metal portion 41 (that is, the first connection portions 53a and 53b) are the outer side surfaces (for example, the first side surface 10c) of the wiring board 10. , 2nd side surface 10d, 3rd side surface 10e, and 4th side surface 10f), and only two side surfaces facing each other (for example, 3rd side surface 10e and 4th side surface 10f) are exposed. Further, in the wiring board 10, the end portions of the second metal portions 42a, 42b, 42c (that is, the second connection portions 54a, 54b, 54c) and the end portions of the third metal portion 43 (that is, the third connection portion). 55) is exposed on either of the two side surfaces where both ends of the first metal portion 41 are exposed (for example, either the third side surface 10e and the fourth side surface 10f).

In this way, in the wiring board 10, the exposed end faces of each metal portion (the connection portion with the plated wiring provided with the multi-layer wiring board 1) contained in the board are made into two facing surfaces. It is possible to reduce the risk of short-circuiting between the metal portions when the wiring board 10 is mounted. In addition, it is possible to reduce the time and effort required for post-processing of the end faces of each wiring board 10 after cutting the large number of wiring boards 1.

(Summary of the first embodiment)
As described above, the multi-layer wiring board 1 according to the present embodiment has the first ceramic sheet 31a on which the first metal portion 41 is formed. The first metal portion 41 is connected to two first plated wirings 23 arranged on both the left and right sides of the substrate element portion 11 via the first connecting portions 53a and 53b, respectively. As a result, it is possible to form a feeding path between the two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11.

Further, the multi-layer wiring board 1 has a second ceramic sheet 31b on which a second metal portion 42a electrically connected to the first metal portion 41 is formed. Further, other second metal portions 42b and 42c are formed on the second ceramic sheet 31b. These second metal portions 42a, 42b, and 42c are connected to one second plated wiring 24 via the second connecting portions 54a, 54b, and 54c.

As a result, the current transmitted from the first metal portion 41 formed in another layer to the second metal portion 42a can be transmitted to the other second metal portions 42b and 42c via the second plating wiring 24. ..

As described above, according to the configuration according to the present embodiment, power can be supplied in the first direction D1 via the first metal portion 41 in the substrate element portion 11, so that the power can be supplied between the substrate element portions 11. It is possible to reduce the variation in plating thickness.

Further, in the multi-layer wiring board 1 according to the present embodiment, a power supply path at the time of electrolytic plating is provided in the first direction D1 on a plurality of ceramic sheets (that is, the first ceramic sheet 31a and the second ceramic sheet 31b). On the other hand, the second direction D2 is not provided with a connecting portion for connecting the adjacent substrate element portions 11. That is, of the plurality of substrate element portions 11, the two substrate element portions 11 adjacent to the second direction D2 are both via only the insulating layer (ceramic sheet) when viewed in the stacking direction (third direction D3). Lined up.

As a result, in the individual wiring boards 10 obtained by dividing the multi-layer wiring board 1, the four side surfaces having a substantially rectangular parallelepiped shape (for example, the first side surface 10c, the second side surface 10d, the third side surface 10e, and the first side surface 10e). Of the four side surfaces 10f), the connection portion with the plating wiring is exposed only on the two facing side surfaces (for example, the third side surface 10e and the fourth side surface 10f). That is, out of the four side surfaces of the wiring board 10 having a substantially rectangular parallelepiped shape, the wiring layer can be configured so that there are no exposed portions on the two side surfaces. Therefore, it is possible to reduce the labor of post-processing of the exposed portion of the wiring layer, which is performed after cutting into the individual wiring boards 10.

As described above, according to the present embodiment, even in a multi-layered wiring board having a relatively complicated wiring structure in which each substrate element portion has a plurality of electrically independent plating portions, the wiring structure It is possible to reduce the number of exposed end faces of the plating wiring while making the plating thickness of each substrate element portion uniform while suppressing the complexity of the plating.

(Modification example)
In the above-mentioned first embodiment, a configuration in which one first metal portion 41 is formed on the first ceramic sheet 31a has been described as an example. However, a plurality of first metal portions formed on the first ceramic sheet 31a may exist. Therefore, in the following, as a modification of the first embodiment, a configuration in which the first metal portion is divided into a plurality of parts will be described.

FIG. 8 shows a wiring board 110 according to a modified example. The wiring board 110 is obtained by dividing each board element portion of the multiple wiring board 1. FIG. 8 is a schematic plan view showing the configuration of the wiring board 110 on the first ceramic sheet 31a.

As shown in FIG. 8, the wiring board 110 has two first metal portions 141a and 141b. The two first metal portions 141a and 141b are electrically connected to the metal portion formed on the ceramic sheet 31 different from the first ceramic sheet 31a via the connecting vias 158 and 158. In FIG. 8, the connection vias other than the connection via 51 and the connection via 158 are not shown.

In the state of the multi-piece wiring board 1 before being separated into the wiring board 110, one of the first metal portions 141a has two first-plated wirings 23 (for example, the first-plated wirings) sandwiching the substrate element portion 11. It is connected to one of 23a and 23b) (for example, the first plated wiring 23a) via the first connecting portion 53a. Further, the other first metal portion 141b is the other of the two first plated wirings 23 (for example, the first plated wirings 23a and 23b) sandwiching the substrate element portion 11 (for example, the first plated wiring 23b). It is connected via the first connection portion 53b.

As described above, the first metal portion is divided into a plurality of parts on the first ceramic sheet 31a, and each of the divided parts is a metal formed on a ceramic sheet 31 different from the first ceramic sheet 31a. It may be electrically connected to the portion via the connecting via.

[Second Embodiment]
In the second embodiment, a large number of wiring boards 201 will be described as an example. 9 and 10 show a planar configuration of a large number of wiring boards 201. FIG. 9 schematically shows the configuration of each conductive pattern formed on the first ceramic sheet 31a of the multi-layer wiring board 201. Further, FIG. 10 schematically shows the configuration of each conductive pattern formed on the second ceramic sheet 31b of the multi-layer wiring board 201. In addition, in FIGS. 9 and 10, the illustration of the connection via with the plated portion formed on the surface (that is, the upper surface or the lower surface) of the multi-layered wiring board 201 is omitted.

The multi-layer wiring board 201 according to the second embodiment has a plating wiring 22. The plating wiring 22 has a first plating wiring 223 and a second plating wiring 224. More specifically, the first plated wirings 223a to 223f are formed on the first ceramic sheet 31a (see FIG. 9), and the second plated wirings 224a to 224f are formed on the second ceramic sheet 31b. (See FIG. 10). As the basic configuration of the plating wiring 22, the same configuration as that of the first embodiment can be applied.

As shown in FIGS. 9 and 10, the first plated wiring 223a to 223f and the second plated wiring 224a to 224f arranged along the second direction D2 are connected to electrically connect each other. A plurality of vias 226 are provided. With this configuration, it is possible to make it easier to energize between the first plated wirings 223a to 223f and the second plated wirings 224a to 224f formed on different ceramic sheets 31. This makes it possible to reinforce the power supply between the layers during the electrolytic plating process.

The same configuration as that of the first embodiment can be applied to the configurations other than the above of the multi-element wiring board 201.

[Third Embodiment]
In the third embodiment, a multi-cavity wiring board 301 having a plurality of second ceramic sheets (second insulating layer) 31b will be described as an example.

FIG. 11 is a plan view of the multi-layer wiring board 301 when viewed in the stacking direction (third direction D3). FIG. 12 is a top view showing a configuration of a wiring board 310 obtained by dividing a large number of wiring boards 301. FIG. 13 is a diagram showing a cross-sectional configuration of a substrate element portion 11 constituting a large number of wiring boards 301.

As shown in FIG. 11, the multi-layer wiring board 301 has a product area including a plurality of board element portions 11 and an outer peripheral area 3 located outside the product area. In the multi-cavity wiring board 301, the members to which the same configuration as that of the first embodiment can be applied are designated by the same reference numerals as those of the multi-cavity wiring board 1. However, the detailed configuration of the conductive pattern in the multi-layer wiring board 301 is different from that of the first embodiment.

The substrate element portion 11 and the wiring board 310 of the multi-layer wiring board 301 according to the present embodiment have a through hole 313 in the central portion of the substrate (see FIGS. 12 and 13). The through hole 313 can be formed by laminating the ceramic sheets 31 on which the conductive pattern is printed, crimping them, and then performing a punching process (punching process) or the like.

As shown in FIG. 12, the multi-layer wiring board 301 has a laminated structure in which five ceramic sheets (insulating layers) 31 are laminated. Specifically, in the multi-cavity wiring board 301, the fourth ceramic sheet 31d, the second ceramic sheet 31b-2, the second ceramic sheet 31b-1, the first ceramic sheet 31a, and the third ceramic sheet are arranged in this order from the lower layer. It has 31c.

A metal layer (for example, a first metal portion 41, a second metal portion, etc.) forming a conductive pattern is formed between the plurality of ceramic sheets 31. A surface metal layer 12 is formed on the surface of the multi-layer wiring board 301.

In the wiring board 310 according to the present embodiment, the surface metal layer 12 is formed on the uppermost third ceramic sheet 31c, and the surface of the lowermost fourth ceramic sheet 31d is also partially exposed. The metal layer 12 is formed. A plated portion 60 is formed on the surface of the surface metal layer 12.

In the present embodiment, a plurality of plating portions 60 that are electrically independent of each other are formed in one substrate element portion 11. These plurality of plated portions 60 are formed in each substrate element portion 11. Specifically, one substrate element portion 11 and one wiring substrate 310 have a plurality of plating portions (for example, a first plating portion 61, a second plating portion 62, and a third plating portion 63) that are electrically independent of each other. , 4th plating part 64, 5th plating part 65, 6th plating part 66, 7th plating part 67, 8th plating part 68, 9th plating part 69, 10th plating part 69-1 and 11th plating part. 69-2, etc.) are formed (see FIG. 12).

Each plating portion 60 is electrically connected to the plating wiring 22 inside the multi-layer wiring board 1. Specifically, as shown in FIG. 13, the surface metal layer 12 formed under each plating portion 60 has an internal metal layer (for example, an internal metal layer) via a connecting via 57 penetrating the third ceramic sheet 31c. It is electrically connected to the first metal portion 41, the second metal portion 42, etc.). Each metal layer is electrically connected to the first plated wiring 23 or the second plated wiring 24 formed on the ceramic sheet 31.

The plating wiring 22 is formed on two or more ceramic sheets 31 out of a plurality of ceramic sheets 31. FIG. 14 shows a conductive pattern on the first ceramic sheet 31a on which the first plated wiring 23 is formed. FIG. 15 shows a conductive pattern on the second ceramic sheet 31b-1 on which the second plated wiring 24 is formed. FIG. 16 shows a conductive pattern on the second ceramic sheet 31b-2 on which the second plated wiring 24 is formed. FIG. 17 shows a conductive pattern on the fourth ceramic sheet 31d in which the plating wiring 22 connected to the plating terminal 21 is formed.

The plated connection 22 on the fourth ceramic sheet 31d is connected to the plated connection 24 and the second ceramic sheet 31b on the second ceramic sheet 31b-2 via the connecting via 326 (see FIGS. 14, 15, 16 and 17). It is electrically connected to the plated connection 24 on -1 and the plated connection 23 on the first ceramic sheet 31a. As a result, power is supplied from the plating terminal to each plating connection.

As shown in FIG. 14, a first metal portion 41, a third metal portion 43, and the like are formed on the first ceramic sheet 31a. In the example shown in FIG. 14, at least two third metal portions 43 are formed. Similar to the first embodiment, the first metal portion 41 includes two first plated wirings 23 (for example, the first plated wirings 23e and 23f) arranged on the left and right sides of the substrate element portion 11 and the first. They are connected via the connection portions 53a and 53b, respectively. Further, as in the first embodiment, the third metal portion 43 is one of two first plated wirings 23 (for example, the first plated wirings 23e and 23f) arranged so as to sandwich the substrate element portion 11. On the other hand (for example, the first plated wiring 23f) is connected via the third connecting portion 55.

As shown in FIG. 15, a second metal portion 42 is formed on the second ceramic sheet 31b-1. The second metal portion 42 includes a plurality of metal portions. In the present embodiment, the second metal portion 42 has, for example, the second metal portions 42a, 42b, 42c, and the like. These second metal portions 42 are formed on either one of the two second plated wirings 24 (for example, the second plated wirings 24e and 24f) arranged on the left and right sides of the substrate element portion 11 (for example, the second plated wiring). It is connected only to 24f).

As shown in FIG. 16, the second metal portion 42 is also formed on the other second ceramic sheet 31b-2. The second metal portion 42 includes a plurality of metal portions. In the present embodiment, the second metal portion 42 has, for example, the second metal portions 42a, 42b, 42c, and the like. These second metal portions 42 are connected to only one of the two second plated wirings 24 arranged on the left and right sides of the substrate element portion 11.

In the above two second ceramic sheets 31b-1 and 31b-2, one of the second metal portions 42 (in this embodiment, the second metal portion 42a) is placed in one substrate element portion 11. It is electrically connected to the first plating portion 61 and the first metal portion 41 via a connecting via (for example, a connecting via 51, a connecting via 57, etc.). Further, the second metal portion 42a is connected to one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54a.

In the above two second ceramic sheets 31b-1 and 31b-2, the other one of the second metal portions 42 (in this embodiment, the second metal portion 42b) is inside one substrate element portion 11. In, it is electrically connected to the second plating portion 62 via a connecting via (for example, a connecting via 57 or the like). Further, the second metal portion 42b is connected to one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54b.

In the above two second ceramic sheets 31b-1 and 31b-2, the other one of the second metal portions 42 (in this embodiment, the second metal portion 42c) is one substrate element portion 11. Inside, it is electrically connected to the fourth plating portion 64 via a connecting via (for example, a connecting via 57, etc.). Further, the second metal portion 42c is connected to any one of the two second plated wirings 24 arranged so as to sandwich the substrate element portion 11 via the second connecting portion 54c.

As described above, in the multi-layer wiring board 301 according to the present embodiment, the first plated wiring 23 is formed on only one ceramic sheet (for example, the first ceramic sheet 31a). On the other hand, the second plated wiring 24 is formed on two or more ceramic sheets (for example, the second ceramic sheets 31b-1 and 31b-2). As described above, the second plated wiring 24 may be formed on a plurality of ceramic sheets. That is, the multi-layer wiring board may have a plurality of second ceramic sheets 31b.

As described above, the multi-layer wiring board 301 has a first ceramic sheet 31a on which the first metal portion 41 is formed. The first metal portion 41 is connected to two first plated wirings 23 arranged on both the left and right sides of the substrate element portion 11 via the first connecting portions 53a and 53b, respectively. As a result, as shown by the arrows in FIG. 14, it is possible to form a feeding path between the two first plated wirings 23 arranged on the left and right sides of the substrate element portion 11.

Further, the multi-layer wiring board 301 has second ceramic sheets 31b-1 and 31b-2 on which a second metal portion 42a electrically connected to the first metal portion 41 is formed. Further, other second metal portions 42b and 42c are formed on the second ceramic sheets 31b-1 and 31b-2. These second metal portions 42a, 42b, and 42c are connected to one second plated wiring 24 via the second connecting portions 54a, 54b, and 54c.

As a result, as shown by the arrows in FIGS. 15 and 16, the current transmitted from the first metal portion 41 formed in another layer to the second metal portion 42a is passed through the second plating wiring 24 to another. It can be transmitted to the second metal portions 42b and 42c.

As described above, according to the configuration according to the present embodiment, power can be supplied in the first direction D1 via the first metal portion 41 in the substrate element portion 11, so that the power can be supplied between the substrate element portions 11. It is possible to reduce the variation in plating thickness.

Further, the multi-layer wiring board 301 according to the present embodiment is electrolyzed in the first direction D1 on a plurality of ceramic sheets (that is, the first ceramic sheet 31a and the second ceramic sheets 31b-1 and 31b-2). While the feeding path for plating is formed, the second direction D2 is not provided with a connecting portion for connecting the adjacent substrate element portions 11. That is, of the plurality of substrate element portions 11, the two substrate element portions 11 adjacent to the second direction D2 are both via only the insulating layer (ceramic sheet) when viewed in the stacking direction (third direction D3). Lined up.

As a result, in the individual wiring boards 310 obtained by dividing the large number of wiring boards 301, the connection portion with the plating wiring is exposed only on the two facing side surfaces out of the four sides having a substantially rectangular parallelepiped shape. .. That is, out of the four side surfaces of the wiring board 310 having a substantially rectangular parallelepiped shape, the wiring layer can be configured so that there are no exposed portions on the two side surfaces. Therefore, it is possible to reduce the labor of post-processing of the exposed portion of the wiring layer, which is performed after cutting into the individual wiring boards 310.

[Other embodiments]
18 to 20 show the configurations of a large number of wiring boards 401, 501, and 601 according to other embodiments.

FIG. 18 schematically shows the configuration of each conductive pattern formed on the first ceramic sheet 31a of the multi-layer wiring board 401. FIG. 18 shows the configuration of a part of the multi-component wiring board 401. In the multi-cavity wiring board 401, the members to which the same configuration as that of the first embodiment is applicable are designated by the same reference numerals as those of the multi-cavity wiring board 1. However, the detailed configuration of the conductive pattern in the multi-layer wiring board 401 is different from that of the first embodiment.

The multi-layer wiring board 401 shown in FIG. 18 has a third plated wiring 425 arranged along the first direction D1 in addition to the first plated wirings 23a to 23f arranged along the second direction D2. have. The third plated wiring 425 is provided between the substrate element portions 11 adjacent to the second direction D2. Although not shown, the second ceramic sheet 31b is also provided with plated wiring at a position corresponding to the third plated wiring 425. According to this configuration, the power supply between the layers during the electrolytic plating process can be further reinforced.

FIG. 19 schematically shows the configuration of each conductive pattern formed on one ceramic sheet 31 of the multi-cavity wiring board 501. In the multi-cavity wiring board 501, the members to which the same configuration as that of the first embodiment is applicable are designated by the same reference numerals as those of the multi-cavity wiring board 1. However, the detailed configuration of the conductive pattern in the multi-layer wiring board 501 is different from that of the first embodiment.

A plurality of plating terminals 521, plating wiring 22, and the like are formed in the outer peripheral area 3 of the multi-layer wiring board 501 shown in FIG. The plating terminal 521 is formed at the end of a large number of wiring boards 501. In the first embodiment, a plurality of plating terminals 21 are arranged at substantially equal intervals on each end side extending in the longitudinal direction (second direction D2) of the multi-layered wiring board 1 having a substantially rectangular flat plate shape. Have been placed. On the other hand, in the multi-layered wiring board 501 shown in FIG. 19, a plurality of platings are formed on each end of the multi-layered wiring board 1 having a substantially rectangular flat plate shape extending in the lateral direction (first direction D1). Terminals 521 are arranged side by side at substantially equal intervals.

The plating terminal 521 is electrically connected to the plating power supply. Further, the plating terminal 521 is connected to the plating wiring 22. The plating terminal 521 may be formed only on one layer of the plurality of ceramic sheets 31 (for example, the layer on which the plating wiring 22 is formed), or may be formed on the plurality of ceramic sheets 31. It may be formed in each layer.

FIG. 20 schematically shows the configuration of each conductive pattern formed on one ceramic sheet 31 of the multi-layer wiring board 601. In the multi-cavity wiring board 601 the members to which the same configuration as that of the first embodiment can be applied are designated by the same reference numerals as those of the multi-cavity wiring board 1. However, the detailed configuration of the conductive pattern in the multi-layer wiring board 601 is different from that of the first embodiment.

A plurality of plating terminals 21 and 521, a plating wiring 22, and the like are formed in the outer peripheral area 3 of the multi-layer wiring board 601 shown in FIG. 20. The plating terminals 21 and 521 are formed at the ends of a large number of wiring boards 501.

The plurality of plating terminals 21 are arranged side by side at substantially equal intervals on each end side in the longitudinal direction (second direction D2) of the multi-layered wiring board 1 having a substantially rectangular flat plate shape. Further, the plurality of plating terminals 521 are arranged side by side at substantially equal intervals on each end side in the lateral direction (first direction D1) of the multi-layered wiring board 1 having a substantially rectangular flat plate shape. ..

It should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims. Further, a configuration obtained by combining the configurations of different embodiments described in the present specification with each other is also included in the scope of the present invention.

1 ・ 201 ・ 301 ・ 401 ・ 501 ・ 601: Multiple pieces wiring board 10 ・ 110 ・ 310: Wiring board 11: Board element part 21 ・ 521: Plating terminal 22: Plating wiring 23: First plating wiring 24: Second plated wiring 31: Ceramic sheet (insulation layer)
31a: 1st ceramic sheet 31b: 2nd ceramic sheet 41: 1st metal part 42: 2nd metal part 43: 3rd metal part 53a / 53b: 1st connection part 54a / 54b / 54c: 2nd connection part 55: 3rd connection part 60: Plating part 61: 1st plating part 62: 2nd plating part 63: 3rd plating part 64: 4th plating part D1: 1st direction D2: 2nd direction D3: 3rd direction (stacking direction) )

Claims (8)

It has a laminated structure in which a plurality of insulating layers are laminated, and when viewed in the stacking direction, the plurality of substrate element portions are arranged side by side in the first direction and the second direction perpendicular to the first direction. Being done
A plurality of plated portions formed on the respective surfaces of the plurality of substrate element portions, and
A large number of wirings arranged around the substrate element portion, arranged between the plurality of insulating layers, and provided with a plurality of plating wirings electrically connected to the plurality of plating portions. It ’s a board,
The plurality of plating wirings extend in a second direction perpendicular to the first direction when viewed in the stacking direction, and two adjacent plating wirings among the plurality of plating wirings are both. They are arranged in the first direction so as to sandwich one of the substrate element portions.
Of the plurality of substrate element portions, the two substrate element portions adjacent to each other in the second direction are arranged side by side only through the insulating layer when viewed in the stacking direction.
The plurality of plated portions have a first plating portion and a second plating portion that are electrically independent of each other in one of the substrate element portions, and each of the substrate element portions has a first plating portion and a second plating portion.
The plating wiring includes a first plating wiring formed on the first insulating layer among the plurality of insulating layers and a second insulating layer formed on the second insulating layer among the plurality of insulating layers. Including plated wiring
At least one first metal portion is provided on each of the substrate element portions on the first insulating layer.
A plurality of second metal portions are provided on the second insulating layer in each of the substrate element portions.
The at least one first metal portion is electrically connected to the first plating portion in one substrate element portion, and the two first plating wirings and the first connection portion sandwiching the substrate element portion are connected. Each is connected via
In one of the substrate element portions, one of the plurality of second metal portions is electrically connected to the first plating portion and the first metal portion, and the other one is electrically connected to the second plating portion. At the same time, they are connected to either one of the two second plated wirings sandwiching the substrate element portion via the second connection portion.
Multi-piece wiring board. The plurality of plating portions have a first plating portion and a third plating portion electrically independent of the second plating portion in one substrate element portion for each substrate element portion.
A third metal portion is further provided on the first insulating layer.
The third metal portion is electrically connected to the third plating portion in one of the substrate element portions, and is connected to either one of the two first plating wirings sandwiching the substrate element portion and the third connection portion. The multi-layered wiring board according to claim 1, which is connected to each other via the above. The plurality of plating portions have a first plating portion and a fourth plating portion electrically independent of the second plating portion in one substrate element portion for each substrate element portion.
The other one of the plurality of second metal portions is electrically connected to the fourth plating portion in one substrate element portion, and the two second metal portions sandwich the substrate element portion. The multi-component wiring board according to claim 1 or 2, which is connected to either one of the plated wirings via a connection portion, respectively. The multi-layer wiring board according to any one of claims 1 to 3, further comprising a connection via for electrically connecting the first-plated wiring and the second-plated wiring. A wiring board having a laminated structure in which a plurality of insulating layers are laminated and having a plated portion formed on the surface thereof.
The plated portion has a first plated portion and a second plated portion that are electrically independent of each other.
With at least one first metal portion arranged between the plurality of insulating layers,
A plurality of second metal portions arranged between the plurality of insulating layers different from the positions where the first metal portions are arranged,
Have,
The at least one first metal portion is electrically connected to the first plating portion and is exposed only on two side surfaces facing each other among the outer side surfaces of the wiring board.
One of the plurality of second metal portions is electrically connected to the first plating portion and the first metal portion, the other one is electrically connected to the second plating portion, and the two are. A wiring board that is exposed on only one of the sides. The plated portion further has a first plated portion and a third plated portion that is electrically independent of the second plated portion.
A third metal portion is further provided on the first insulating layer in which the first metal portion is arranged.
The wiring board according to claim 5, wherein the third metal portion is electrically connected to the third plating portion and is exposed to only one of the two side surfaces. The plated portion further has a first plated portion and a fourth plated portion that is electrically independent of the second plated portion.
Yet another one of the plurality of second metal portions is electrically connected to the fourth plated portion and is exposed to only one of the two side surfaces.
The wiring board according to claim 5. The plated portion further includes a first plated portion, a second plated portion, and a fourth plated portion that is electrically independent of the third plated portion.
Yet another one of the plurality of second metal portions is electrically connected to the fourth plated portion and is exposed to only one of the two side surfaces.
The wiring board according to claim 6.

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