JP2021176006A - Display device - Google Patents

Abstract

To provide a display device which can prevent breaking in an environment where a high temperature and a low temperature are repeated.SOLUTION: A display device for displaying an image in a display area includes: an insulation substrate; a plurality of wires which is arranged on the insulation substrate and stretched from the display area to a frame area located outside the display area; a driver which is arranged on the frame area and connected to the wires; an organic protective film which is superposed on the wires and arranged from the display area to an area between the display area and the driver; an anisotropic conductive film which is superposed on the driver and covering an end of the organic protective film between the display area and the driver; and a moisture-proof resin film being superposed on the anisotropic conductive film between the display area and the driver and covering the end of the organic protective film.SELECTED DRAWING: Figure 3

Description

The following disclosure relates to a display device.

Conventionally, various display devices such as a liquid crystal display device and an organic electroluminescence (EL) display device have been widely used as devices for displaying moving images (moving images and still images).

For example, a liquid crystal display device is a display device that uses a liquid crystal composition for display, and a typical display method thereof is a TFT substrate provided with a thin film transistor (TFT) and a TFT substrate facing the TFT substrate. A liquid crystal panel having a facing substrate to be arranged and a liquid crystal layer enclosed between the TFT substrate and the facing substrate is irradiated with light from a backlight, and a voltage is applied to the liquid crystal molecules contained in the liquid crystal layer. The amount of light transmitted is controlled by changing the orientation state of the liquid crystal molecules. Such a liquid crystal display device is used in a wide range of fields by taking advantage of its features such as thinness, light weight, and low power consumption.

Further, the organic EL display device is, for example, a TFT substrate provided with a TFT, an organic EL element provided on the TFT substrate and connected to the TFT, and an adhesion provided in a frame shape so as to surround the organic EL element. It includes a layer and a sealing substrate arranged so as to cover the organic EL element. An organic EL display device for a full-color display generally includes three color organic EL elements of red (R), green (G), and blue (B) as sub-pixels, and these sub-pixels have a matrix shape. One pixel is composed of sub-pixels of three colors. Then, the image is displayed by selectively causing these organic EL elements to emit light at a desired brightness.

The TFT substrate includes a plurality of gate wirings extending parallel to each other and a plurality of source wirings extending parallel to each other in a direction intersecting each gate wiring via an insulating film, and each source wiring and each gate. A TFT as a switching element is arranged at the intersection with the wiring. The drive of the liquid crystal display device is controlled by a source driver electrically connected to the source wiring and a gate driver electrically connected to the gate wiring.

A driver such as a source driver for driving a liquid crystal display device is composed of a semiconductor chip. As a technique related to a semiconductor chip, for example, in Patent Document 1, the wire bond portion is coated and reinforced with an epoxy resin having a low coefficient of thermal expansion except for at least the end portion of the upper surface of the semiconductor chip, and the linear expansion coefficient close to that of solder is obtained from above. A structure sealed with an epoxy-based filling resin having a structure is disclosed.

Japanese Unexamined Patent Publication No. 2005-311019

In liquid crystal display devices for in-vehicle use, the amount of heat generated by the driver increases due to higher definition, and the amount of heat generated from the light source increases due to higher brightness (multi-lamping), so that the amount of heat generated by the entire liquid crystal display device increases. It has become. On the other hand, liquid crystal display devices for in-vehicle use are required to have high performance in reliability tests. For example, the liquid crystal display device for in-vehicle use is used in a high temperature environment and a low temperature environment for a period of more than 1800 hours in total. A Endurance Thermal Cycle (TCE) test, which is repeatedly exposed to the bottom, is performed. This TCE test exceeding 1800 hours is guided based on driving 300,000 km for 15 years and driving a car for 8,000 hours, and it is required by the final user to clear it as a necessary condition in the future. It is a thing. However, when the TCE test was carried out, it was found that the liquid crystal display device for in-vehicle use had a disconnection defect after more than 1200 hours, and the wiring of the TFT substrate was cracked together with the protective layer covering it.

Such cracks can occur in an organic EL display device as well as in a liquid crystal display device. Such cracks are considered to occur for the following reasons. A comparative liquid crystal display device will be described as an example. FIG. 15 is a view in the frame region of the liquid crystal display device in the comparative form, and is a schematic cross-sectional view showing a state in which the moisture-proof resin film included in the liquid crystal display device is cracked. FIG. 16 is a schematic enlarged cross-sectional view of the region surrounded by the dotted line in FIG. FIG. 17 is a photograph showing a state in which the wiring included in the liquid crystal display device of the comparative form is broken.

As shown in FIG. 15, the liquid crystal display device 1R of the comparative form includes a display area 10A for displaying an image and a frame area 10B provided around the display area 10A. As shown in FIG. 15, the liquid crystal display device 1R includes an insulating substrate 110 and a plurality of source wirings provided on the insulating substrate 110 and extended from the display area 10A to the frame area 10B outside the display area 10A. 141, a source driver 300 provided in the frame area 10B and connected to a plurality of source wirings 141, and superimposed on the source wiring 141, between the display area 10A and the display area 10A and the source driver 300. The organic protective film 160 provided up to the region 10C and the moisture-proof resin film 500 covering the end portion 161 of the organic protective film 160 between the display region 10A and the source driver 300 are provided. The inorganic film 150 and the organic protective film 160 that cover the source wiring 141 are also referred to as protective layers.

When the moisture-proof resin film 500 of the comparative form is oxidatively deteriorated by heat and hardened, and then exposed to a low temperature, cracks 500X are generated in the moisture-proof resin film 500 as shown in FIG. Is added. As a result, the film below the moisture-proof resin film 500 is destroyed from the surface to the inside. As a result, it is considered that a crack as shown in FIG. 16 occurs, the source wiring 141 is broken together with the protective layer covering the crack, and the source wiring indicated by the white arrow in FIG. 17 is broken.

In Patent Document 1, the filling resin is filled so as to cover the entire parts inside the case. In such an embodiment, the deterioration of the filling resin is selectively promoted in the portion where the temperature rises, and when this is cooled and cracked, a large stress is exerted on the substrate, which becomes a problem. Further, since the cracking of the filling resin progresses particularly quickly when the high temperature and the low temperature are repeated as compared with those under a constant temperature condition, it becomes a problem from the viewpoint of reliability even in actual use.

The present invention has been made in view of the above situation, and an object of the present invention is to provide a display device capable of suppressing the occurrence of disconnection in an environment where high temperature and low temperature are repeated.

The present inventors have found that the crack 500X of the moisture-proof resin film 500 included in the liquid crystal display device 1R of the comparative embodiment is generated when the following three conditions (condition 1) to (condition 3) are satisfied. ..

(Condition 1) The structure is such that the moisture-proof resin film 500 covers the end portion 161 of the organic protective film 160 (for example, an acrylic resin film).
(Condition 2) The moisture-proof resin film 500 is oxidatively deteriorated and cured by receiving heat from the source driver 300 and the light source included in the liquid crystal display device 1R of the comparative form.
(Condition 3) The cured moisture-proof resin film 500 generates thermal stress at a low temperature.

Furthermore, the present inventors have provided an anisotropic conductive film between the end of the organic protective film and the moisture-proof resin film, or between the end of the acrylic resin film and the styrene-butadiene resin film. It has been found that it is possible to avoid the above (condition 1) and suppress the occurrence of disconnection by providing the epoxy resin film on the surface. It has also been found that by not covering at least a part of the top surface of the driver with a moisture-proof resin film, it is possible to avoid the above (condition 2) and suppress the occurrence of disconnection. In addition, by providing wiring by bypassing the location where the moisture-proof resin film generates thermal stress at low temperatures, wiring is provided to avoid the location where cracks occur due to the above (Condition 3), and the occurrence of disconnection is suppressed. Found that it is possible. As a result, we came up with the idea that the above problems can be solved brilliantly, and arrived at the present invention.

(1) One embodiment of the present invention is a display device for displaying an image in a display area, which is provided on an insulating substrate and the insulating substrate, and is a frame area outside the display area from the display area. A plurality of wirings extending to the above, a driver provided in the frame area and connected to the plurality of wirings, and the above-mentioned display area to the above-mentioned display area and the above-mentioned driver superimposing on the above-mentioned plurality of wirings. An organic protective film provided up to an area between the two, an anisotropic conductive film that superimposes on the driver and covers the end of the organic protective film between the display area and the driver, and the above. A display device including a moisture-proof resin film that superimposes on the anisotropic conductive film between the display area and the driver and covers the end portion of the organic protective film.

(2) Further, in an embodiment of the present invention, in addition to the configuration of (1) above, the organic protective film is an acrylic resin film, and the anisotropic conductive film is an epoxy resin film. The moisture-proof resin film is a display device which is a styrene-butadiene resin film.

(3) Further, in an embodiment of the present invention, in addition to the configuration of (1) or (2) above, the moisture-proof resin film does not cover at least a part of the top surface of the driver.

(4) Further, in an embodiment of the present invention, in addition to the configuration of (3) above, the moisture-proof resin film does not cover 60% or more and 100% or less of the total area of the top surface of the driver. ..

(5) Further, in addition to the configuration of (3) or (4) above, an embodiment of the present invention is further attached to a portion of the top surface of the driver that is not covered with the moisture-proof resin film. A display device equipped with a heat dissipation sheet.

(6) Further, in an embodiment of the present invention, in addition to the configuration of the above (1), the above (2), the above (3), the above (4) or the above (5), the driver goes to the display area. When the direction is forward, the plurality of wirings extend diagonally forward from the driver to the display area, bypassing the diagonally forward region superimposed on the end of the organic protective film. A display device that includes the wiring that has been made.

(7) Further, in an embodiment of the present invention, in addition to the configuration of (6) above, the driver is provided along the display area, and the diagonally forward area is directed from the driver to the display area. A display device that is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction.

(8) Further, in an embodiment of the present invention, in addition to the configuration of (6) or (7) above, the driver is provided along the display area, and the diagonally forward region is described from the driver. A display device that is an area from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the above direction toward the display area.

(9) In addition, certain embodiments of the present invention include the above (1), the above (2), the above (3), the above (4), the above (5), the above (6), the above (7) or the above ( In addition to the configuration of 8), a display device further comprising an inorganic film between the plurality of wirings and the organic protective film, the inorganic film extending to an outer region of the end portion of the organic protective film.

(10) Further, another embodiment of the present invention is a display device for displaying an image in a display area, which is provided on an insulating substrate and the insulating substrate, and from the display area to the display area. A plurality of wires extending to the outer frame area, a driver provided in the frame area and connected to the plurality of wires, and a display superimposed on the plurality of wires and displayed from the display area. An acrylic resin film provided up to an area between the region and the driver, an epoxy resin film covering the end of the acrylic resin film between the display area and the driver, and the display area. A display device including a styrene-butadiene resin film that superimposes on the epoxy resin film with the driver and covers the end portion of the acrylic resin film.

(11) Further, in an embodiment of the present invention, in addition to the configuration of (10) above, the styrene-butadiene resin film does not cover at least a part of the top surface of the driver.

(12) Further, in an embodiment of the present invention, in addition to the configuration of (11) above, the moisture-proof resin film does not cover 60% or more and 100% or less of the total area of the top surface of the driver. ..

(13) Further, in addition to the configuration of (11) or (12) above, an embodiment of the present invention is further attached to a portion of the top surface of the driver that is not covered with the styrene-butadiene resin film. A display device with a heat-dissipating sheet.

(14) Further, in an embodiment of the present invention, in addition to the configuration of the above (10), the above (11), the above (12) or the above (13), the direction from the driver toward the display area is set forward. When, the plurality of wirings are diagonally forward of the driver, bypassing the diagonally forward region overlapping the end portion of the acrylic resin film, and extending the wiring from the driver to the display region. Including display device.

(15) Further, in an embodiment of the present invention, in addition to the configuration of (14), the driver is provided along the display area, and the diagonally forward area is directed from the driver to the display area. A display device that is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction.

(16) Further, in an embodiment of the present invention, in addition to the configuration of (14) or (15) above, the driver is provided along the display area, and the diagonally forward region is described from the driver. A display device that is an area from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the above direction toward the display area.

(17) Further, an embodiment of the present invention has the configuration of the above (10), the above (11), the above (12), the above (13), the above (14), the above (15) or the above (16). In addition, a display device further comprising an inorganic film between the plurality of wirings and the acrylic resin film, and the inorganic film extends to an outer region of the end portion of the acrylic resin film.

(18) Further, another embodiment of the present invention is a display device for displaying an image in a display area, which is provided on an insulating substrate and the insulating substrate, and from the display area to the display area. A plurality of wirings extending to the outer frame area, a driver provided in the frame area and connected to the plurality of wirings, and a display superimposed on the plurality of wirings and displayed from the display area. An organic protective film provided up to an area between the region and the driver, and an end portion of the organic protective film between the display area and the driver, and at least a part of the top surface of the driver. A display device including a moisture-proof resin film that does not cover.

(19) Further, in an embodiment of the present invention, in addition to the configuration of (18), the moisture-proof resin film does not cover 60% or more and 100% or less of the total area of the top surface of the driver. ..

(20) Further, in addition to the configuration of (18) or (19) above, an embodiment of the present invention is further attached to a portion of the top surface of the driver that is not covered with the moisture-proof resin film. A display device equipped with a heat dissipation sheet.

(21) Further, in an embodiment of the present invention, in addition to the above (18), the above (19), or the above (20), when the direction from the driver toward the display area is forward, a plurality of the above. A display device that includes wiring that is diagonally forward of the driver and that extends from the driver to the display area, bypassing the diagonally forward area that overlaps the end of the organic protective film.

(22) Further, in an embodiment of the present invention, in addition to the configuration of (21), the driver is provided along the display area, and the diagonally forward area is directed from the driver to the display area. A display device that is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction.

(23) Further, in an embodiment of the present invention, in addition to the configuration of (21) or (22) above, the driver is provided along the display area, and the diagonally forward region is described from the driver. A display device that is an area from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the above direction toward the display area.

(24) Further, in an embodiment of the present invention, in addition to the above (18), the above (19), the above (20), the above (21), the above (22), or the above (23), further, the above. A display device comprising an inorganic film between a plurality of wirings and the organic protective film, the inorganic film extending to an outer region of the end portion of the organic protective film.

(25) Further, another embodiment of the present invention is a display device for displaying an image in a display area, which is provided on an insulating substrate and the insulating substrate, and from the display area to the display area. A plurality of wirings extending to the outer frame area, a driver provided in the frame area and connected to the plurality of wirings, and a display superimposed on the plurality of wirings and displayed from the display area. An organic protective film provided up to an area between the region and the driver, and a moisture-proof resin film covering an end portion of the organic protective film between the display area and the driver are provided, and the driver provides the above. When the direction toward the display area is set to the front, the plurality of wirings are diagonally forward of the driver, bypassing the diagonally forward area superimposed on the end portion of the organic protective film, and the display from the driver. A display device that includes wiring that extends to the area.

(26) Further, in an embodiment of the present invention, in addition to the configuration of (25), the driver is provided along the display area, and the diagonally forward area is directed from the driver to the display area. A display device that is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction.

(27) Further, in an embodiment of the present invention, in addition to the configuration of (25) or (26) above, the driver is provided along the display area, and the diagonally forward region is described from the driver. A display device that is an area from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the above direction toward the display area.

(28) Further, in an embodiment of the present invention, in addition to the configuration of the above (25), the above (26) or the above (27), an inorganic film is further provided between the plurality of wirings and the organic protective film. A display device comprising the inorganic film, which extends to the outer region of the end of the organic protective film.

(29) In addition, certain embodiments of the present invention include the above (1), the above (2), the above (3), the above (4), the above (5), the above (6), the above (7), and the above ( 8), the above (9), the above (10), the above (11), the above (12), the above (13), the above (14), the above (15), the above (16), the above (17), the above ( 18), the above (19), the above (20), the above (21), the above (22), the above (23), the above (24), the above (25), the above (26), the above (27) or the above ( In addition to the configuration of 28), the display device is a display device which is a liquid crystal display device.

(30) Further, certain embodiments of the present invention include the above (1), the above (2), the above (3), the above (4), the above (5), the above (6), the above (7), and the above ( 8), the above (9), the above (10), the above (11), the above (12), the above (13), the above (14), the above (15), the above (16), the above (17), the above ( 18), the above (19), the above (20), the above (21), the above (22), the above (23), the above (24), the above (25), the above (26), the above (27) or the above ( In addition to the configuration of 28), the display device is a display device which is an organic electroluminescence display device.

According to the present invention, it is possible to provide a display device capable of suppressing the occurrence of disconnection in an environment where high temperature and low temperature are repeated.

FIG. 5 is a schematic plan view of the liquid crystal display device of the first embodiment. It is another planar schematic view of the liquid crystal display device of Embodiment 1. FIG. FIG. 5 is a schematic cross-sectional view of an overhanging region of the liquid crystal display device of the first embodiment. This is an example of a photograph showing cracks that occur when a comparative liquid crystal display device is exposed to an environment where low temperature and high temperature are repeated. It is a photograph which observed the cross section on the X1-X2 line of FIG. 4 with a scanning electron microscope. FIG. 5 is a schematic plan view of a liquid crystal display device according to a modification of the first embodiment. FIG. 5 is a schematic plan view illustrating an arrangement of a moisture-proof resin film and a source driver included in the liquid crystal display device of the first modification of the first embodiment. FIG. 5 is a schematic cross-sectional view of a liquid crystal display device according to a modification of the first embodiment. FIG. 5 is a schematic plan view of a frame region of the liquid crystal display device according to the second modification of the first embodiment. It is an enlarged plan schematic view of the frame area of the liquid crystal display device of the modification 2 of Embodiment 1. FIG. It is a map showing the location where the disconnection occurred in the endurance thermodynamic cycle test conducted using the liquid crystal display device of the comparative form, and is a schematic plan view in which the results of the three liquid crystal display devices are superimposed on one liquid crystal display device. be. It is a plane schematic diagram of the organic EL display device of Embodiment 2. FIG. 5 is a schematic cross-sectional view of an overhanging region of the organic EL display device of the second embodiment. FIG. 5 is a schematic cross-sectional view of an overhanging region of the organic EL display device of the second embodiment. It is a photograph which shows the crack of the liquid crystal display device of Example 1 which occurred in the endurance thermodynamic cycle test. It is a figure which shows the temperature distribution of the source driver of the liquid crystal display device of Example 2. It is a figure in the frame area of the liquid crystal display device of the comparative form, and is the sectional schematic diagram which shows the state in which the moisture-proof resin film provided in the liquid crystal display device is cracked. It is an enlarged cross-sectional schematic diagram of the region surrounded by the dotted line of FIG. It is a photograph which shows the state which the wiring provided with the liquid crystal display device of a comparative form is broken.

Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the contents described in the following embodiments, and the design can be appropriately changed within a range that satisfies the configuration of the present invention. The configurations described in the embodiments may be appropriately combined or modified as long as they do not deviate from the gist of the present invention.

<Embodiment 1>
In the present embodiment, a liquid crystal display device will be described as an example of the display device. In the present embodiment, an embodiment in which the above (condition 1) is avoided and the occurrence of disconnection is suppressed by providing an anisotropic conductive film between the end portion of the organic protective film and the moisture-proof resin film will be described. FIG. 1 is a schematic plan view of the liquid crystal display device of the first embodiment. FIG. 2 is another schematic plan view of the liquid crystal display device of the first embodiment. FIG. 3 is a schematic cross-sectional view of an overhanging region of the liquid crystal display device of the first embodiment. FIG. 3 is a schematic cross-sectional view taken along the line A1-A2 of FIG. The portion whose outline is represented by a broken line in FIG. 2 indicates that it is covered with another layer. Further, although FIG. 3 shows in detail the structure around the source driver at the right end, other source drivers also have the same structure.

As shown in FIGS. 1 to 3, the liquid crystal display device 1 of the present embodiment includes a display area 10A for displaying an image and a frame area 10B provided around the display area 10A, and has an observation surface from the back side. A thin film transistor (TFT) substrate 100, a liquid crystal layer, and a color filter (CF) substrate 200 are provided in this order toward the side.

In the liquid crystal display device 1, the display area 10A is located at a position offset to one end side (lower side shown in FIG. 1) in the short side direction and one end side (left side shown in FIG. 1) in the long side direction. Is placed. The frame region 10B includes an overhanging region 10B1 of the TFT substrate 100 that is exposed without being superimposed on the CF substrate 200, and various drivers are mounted on the overhanging region 10B1. A printed wiring board (PWB: Printed Wired Board) 900 is connected to the overhanging area 10B1 via a flexible printed circuit board (FPC) 800.

The TFT substrate 100 includes an insulating substrate 110, a base coat film 120 provided on the insulating substrate 110, a plurality of gate wiring 142 provided on the base coat film 120, and gate insulation provided on the plurality of gate wiring 142. The film 130, the plurality of source wirings 141 provided on the gate insulating film 130 and as the plurality of wirings, the inorganic film 150 provided on the plurality of source wirings 141, and the frame area 10B, especially the overhanging area. The source driver 300 as the driver provided in the 10B1 and connected to the plurality of source wirings 141, and the gate driver provided in the frame area 10B, particularly the overhanging area 10B1 and connected to the plurality of gate wirings 142. The 350, the organic protective film 160 provided on the inorganic film 150, superimposed on the plurality of source wirings 141, and provided from the display area 10A to the area 10C between the display area 10A and the source driver 300, and the source. Anisotropic conductive film (ACF) 400 that superimposes on the driver 300 and covers the end 161 of the organic protective film 160 between the display area 10A and the source driver 300, the display area 10A and the source. A moisture-proof resin film 500 that superimposes on the anisotropic conductive film 400 with the driver 300 and covers the end portion 161 of the organic protective film 160 is provided.

The liquid crystal display device 1 of the present embodiment is provided with a moisture-proof resin film 500 having a moisture-proof / waterproof property so as to cover the entire overhanging region 10B1 in order to improve reliability with respect to the humidity of the environment. However, a place where the structure and physical properties of the base film arranged on the back side of the moisture-proof resin film 500 change (for example, a place where the physical properties change from the organic protective film 160 to the inorganic film 150, the organic protective film 160). When the moisture-proof resin film 500 is further covered (where the structure of the end portion 161 etc. changes), the stress tends to concentrate on the portion where the structure and physical properties of the base film change when the moisture-proof resin film 500 is cured due to deterioration. .. Therefore, it is necessary to devise a structure so that stress is not directly applied to the base film.

Here, the cracks generated in the liquid crystal display device 1R of the comparative form will be described in more detail. FIG. 4 is an example of a photograph showing cracks that occur when the liquid crystal display device of the comparative form is exposed to an environment where low temperature and high temperature are repeated. FIG. 5 is a photograph of the cross section of FIG. 4 on the X1-X2 line observed with a scanning electron microscope. The solid line arrow in FIG. 4 indicates the source wiring 141 in which the disconnection has occurred, and the broken line arrow indicates the scanning electron microscope observation direction. By exposing the liquid crystal display device 1R of the comparative form to an environment where low temperature and high temperature are repeated, the extremely hard inorganic film 150 is damaged by the cracks of the upper layer moisture-proof resin film 500, and the cracks shown in FIGS. 4 and 5 are shown. Occurs. When the moisture-proof resin film 500 in the upper layer deteriorates due to high temperature and is exposed to a low temperature in a cured state, the inorganic film 150 cracks due to a large stress applied to the base film when the moisture-proof resin film 500 cracks. It is conceivable that the high adhesion of each layer of the undercoat film is also considered to be a condition for the cracking to progress deeply.

Therefore, in the present embodiment, the end portion 161 of the organic protective film 160 is covered with the anisotropic conductive film 400 between the display area 10A and the source driver 300, and the display area 10A and the source driver 300 are different. A moisture-proof resin film 500 is superposed on the rectangular conductive film 400. The adhesion between the anisotropic conductive film 400 and the organic protective film 160 and / or the adhesion between the anisotropic conductive film 400 and the moisture-proof resin film 500 is the adhesion between the organic protective film 160 and the moisture-proof resin film 500. Therefore, by arranging the anisotropic conductive film 400 between the end portion 161 of the organic protective film 160 and the moisture-proof resin film 500, the end portion 161 of the organic protective film 160 and the moisture-proof resin film 500 can be separated from each other. Peeling between the films is likely to occur between them. As a result, it becomes possible to prevent the crack 500X of the moisture-proof resin film 500 from propagating to the wiring (for example, the source wiring 141) provided on the insulating substrate 110 side of the organic protective film 160 and the organic protective film 160. It is possible to suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

In this way, the end portion 161 of the organic protective film 160 is covered with the anisotropic conductive film 400 between the display region 10A and the source driver 300, and the anisotropic conductivity between the display region 10A and the source driver 300. The method of suppressing the occurrence of disconnection of the source wiring 141 by superimposing the moisture-proof resin film 500 on the film 400 is also referred to as workaround 1 below. Hereinafter, the present embodiment will be described in detail.

As shown in FIG. 1, the TFT substrate 100 has a plurality of gate wirings 142 extending parallel to each other in the horizontal direction of the screen on the insulating substrate 110 in the display area 10A, and each gate wiring via an insulating film. A plurality of source wirings 141 extending parallel to each other in a direction intersecting with 142 (vertical direction of the screen) are provided. The plurality of gate wirings 142 and the plurality of source wirings 141 are formed in a grid pattern as a whole so as to partition each pixel.

A TFT 143 as a switching element is arranged at the intersection of each source wiring 141 and each gate wiring 142. The TFT substrate 100 has a pixel electrode 144, and the pixel electrode 144 is arranged in each region surrounded by two source wirings 141 adjacent to each other and two gate wirings 142 adjacent to each other, and is a semiconductor included in the TFT 143. It is electrically connected to the corresponding source wire 141 via a layer.

The CF substrate 200 includes an insulating substrate 210, a common electrode, a CF layer, and a black matrix layer. The CF layer included in the CF substrate 200 is composed of a red color filter, a green color filter, and a blue color filter, and each pixel has a picture element having a red color filter, a picture element having a green color filter, and a picture having a blue color filter. Three elements are provided in a stripe shape, and a desired color can be obtained in each pixel by mixing colors while controlling the amount of color light transmitted through the red color filter, the green color filter, and the blue color filter.

The black matrix layer included in the CF substrate 200 is a member having a light-shielding property arranged in a grid pattern so as to partition each color filter provided in the color filter layer. In this embodiment, the common electrode is provided on the CF substrate 200, but the common electrode may be provided on the TFT substrate 100. When the common electrode is provided on the TFT substrate 100, the common electrode is provided on the observation surface side or the back surface side of the pixel electrode 144 via an insulating film.

The liquid crystal layer contains a liquid crystal material, and the amount of light transmitted is controlled by applying a voltage to the liquid crystal layer and changing the orientation state of the liquid crystal molecules in the liquid crystal material according to the applied voltage. It is a thing. The liquid crystal molecule may have a dielectric anisotropy (Δε) defined by the following formula (L) having a positive value or a negative value. A liquid crystal molecule having a positive dielectric anisotropy is also called a positive liquid crystal, and a liquid crystal molecule having a negative dielectric anisotropy is also called a negative liquid crystal. The major axis direction of the liquid crystal molecule is the direction of the slow phase axis. Further, the liquid crystal molecules are homogenically oriented in a state where no voltage is applied (state in which no voltage is applied), and the direction of the long axis of the liquid crystal molecules in the state where no voltage is applied is also the direction of the initial orientation of the liquid crystal molecules. say.
Δε = (dielectric constant in the major axis direction of the liquid crystal molecule)-(dielectric constant in the minor axis direction of the liquid crystal molecule) (L)

An alignment film having a function of controlling the orientation of liquid crystal molecules contained in the liquid crystal layer is arranged between the TFT substrate 100 and the liquid crystal layer and between the CF substrate 200 and the liquid crystal layer, respectively.

The liquid crystal display device 1 of the present embodiment includes a source driver 300 electrically connected to the source wiring 141 and a gate driver electrically connected to the gate wiring 142 in the frame area 10B of the TFT substrate 100, particularly the overhanging area 10B1. It is equipped with 350 and a controller. The gate driver 350 sequentially supplies scanning signals to the gate wiring 142 under the control of the controller. The source driver 300 supplies a data signal to the source wiring 141 under the control of the controller at the timing when the TFT 143 is in the voltage applied state by the scanning signal.

Each of the pixel electrodes 144 is set to a potential corresponding to the data signal supplied via the corresponding TFT 143, an electric field is generated between the pixel electrode 144 and the common electrode, and the orientation of the liquid crystal molecules in the liquid crystal layer is controlled. Will be done. Then, in the liquid crystal display device 1, the image is displayed by adjusting the light transmittance in the liquid crystal layer by changing the orientation state of the liquid crystal molecules according to the magnitude of the voltage applied to the liquid crystal layer in each pixel.

The insulating substrates 110 and 210 are colorless and transparent substrates having an insulating property. Examples of the insulating substrates 110 and 210 include substrates such as glass substrates and plastic substrates. Examples of the material of the glass substrate include glass such as float glass and soda glass. Examples of the material of the plastic substrate include plastics such as lithium ethylene terephthalate, polybutylene terephthalate, polyether sulfone, polycarbonate, and alicyclic polyolefin. In this embodiment, a glass substrate is used as the insulating substrate 110.

The base coat film 120 is a colorless and transparent film provided on the observation surface side of the insulating substrate 110. The gate insulating film 130 is a colorless and transparent film provided on the observation surface side of the base coat film 120. As the base coat film 120 and the gate insulating film 130, for example, an inorganic insulating film can be used. As the inorganic insulating film, for example, silicon nitride _(SiN X), silicon oxide _(SiO 2), or an insulating film including an inorganic material such as silicon nitride oxide (SiNO), can be used a laminated film thereof.

The gate wiring 142 is provided on the insulating substrate 110, more specifically on the observation surface side of the base coat film 120, and extends in the horizontal direction of the screen from the display area 10A to the frame area 10B outside the display area 10A, particularly the overhanging area 10B1. Will be set up. The gate wiring 142 is provided radially from the surface 370 of the gate driver 350 provided along the display area 10A toward the display area 10A.

The source wiring 141 is provided on the insulating substrate 110, more specifically on the observation surface side of the gate insulating film 130, in the vertical direction of the screen from the display area 10A to the frame area 10B outside the display area 10A, particularly the overhanging area 10B1. It will be extended. The source wiring 141 is provided radially from the surface 320 of the source driver 300 provided along the display area 10A toward the display area 10A.

The material of the gate wiring 142 and the source wiring 141 is not particularly limited, but it is preferably metal, and the gate wiring 142 and the source wiring 141 are preferably metal wiring. The gate wiring 142 and the source wiring 141 may be composed of a single layer formed of the same material, a plurality of layers are laminated, and two adjacent layers of the plurality of layers are attached to each other. It may be made of different materials. As the gate wiring 142 and the source wiring 141, for example, wiring containing titanium (Ti), wiring containing copper (Cu), and wiring in which they are laminated can be used.

The gate wiring 142 and the source wiring 141 are formed by forming a metal such as copper, titanium, aluminum, molybdenum, or tungsten, or an alloy thereof in a single layer or a plurality of layers by a sputtering method or the like, and subsequently, a photolithography method. It can be formed by patterning with or the like.

The inorganic film 150 is a colorless and transparent film, is provided between the source wiring 141 and the organic protective film 160, and extends to the outer region 160A of the end portion 161 of the organic protective film 160. In such an embodiment, since the inorganic film 150 is arranged under the end portion 161 of the organic protective film 160, both the structure and the physical properties change around the end portion 161 of the organic protective film 160, and the stress becomes higher. It makes it easier to concentrate.

However, in the present embodiment, the anisotropic conductive film 400 that superimposes on the source driver 300 and covers the end portion 161 of the organic protective film 160 between the display area 10A and the source driver 300, and the display area 10A. By providing a moisture-proof resin film 500 that superimposes on the anisotropic conductive film 400 with the source driver 300 and covers the end portion 161 of the organic protective film 160, the crack 500X of the moisture-proof resin film 500 is organically protected. Since it is possible to suppress propagation to the layer provided on the insulating substrate 110 side of the film 160 and the organic protective film 160, the organic protective film 160 is provided between the source wiring 141 and the organic protective film 160. Even when the inorganic film 150 extending to the outer region 160A of the end portion 161 is provided, it is possible to effectively suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

The inorganic film 150 extends from the display region 10A to the outer region 160A of the end portion 161 of the organic protective film 160, and is usually formed on the entire surface of the insulating substrate 110 except for the contact hole portion for ensuring electrical connection. There is.

The inorganic film 150, for example, silicon nitride _(SiN X), silicon oxide _(SiO 2), or an insulating film including an inorganic material such as silicon nitride oxide (SiNO), a laminated film thereof (e.g., an insulating film containing silicon oxide And a laminated film of an insulating film containing silicon nitride) can be used.

The organic protective film 160 is a colorless and transparent film provided on the inorganic film 150, and has a function of flattening the surface of the TFT substrate 100. The organic protective film 160 is superposed on the source wiring 141 and is provided from the display area 10A to the area between the display area 10A and the source driver 300. The end portion 161 of the organic protective film 160 is arranged so as to face the surface 320 of the source driver 300 facing the display area 10A. The organic protective film 160 is usually formed on the entire surface of the display area 10A and the peripheral edge of the display area 10A, except for the contact hole portion for ensuring the electrical connection.

The organic protective film 160 is preferably an acrylic resin film (a film mainly containing acrylic as a resin component).

The anisotropic conductive film 400 has a function of electrically and mechanically connecting the source driver 300 to the TFT substrate 100. The anisotropic conductive film 400 is a film that can have conductivity in the thickness direction of the film while maintaining insulation in the in-plane direction of the film, and is provided for each source driver 300, and each source wiring 141 is provided. Connect to the corresponding bump of the source driver 300.

The anisotropic conductive film 400 is superimposed on the source driver 300 and covers the end portion 161 of the organic protective film 160 between the display region 10A and the source driver 300. With such an embodiment, peeling between the organic protective film 160 and the moisture-proof resin film 500 is likely to occur. As a result, it becomes possible to prevent the crack 500X of the moisture-proof resin film 500 from propagating to the wiring (for example, the source wiring 141) provided on the insulating substrate 110 side of the organic protective film 160 and the organic protective film 160. It is possible to suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

The anisotropic conductive film 400 extends from below the source driver 300 toward the display region 10A and covers the end portion 161 of the organic protective film 160. In the present embodiment, in order to expand the anisotropic conductive film 400 used for mounting the source driver 300 on the TFT substrate 100 toward the display region 10A and cover the end portion 161 of the organic protective film 160, the end portion 161 is formed. It is not necessary to additionally provide a layer for covering, and the occurrence of disconnection can be suppressed more easily.

The direction from the source driver 300 toward the display area 10A (the direction parallel to the vertical direction of the screen) is defined as the direction 10Y, and the direction orthogonal to the direction 10Y (the direction parallel to the horizontal direction of the screen) is defined as the direction 10X. 10Y is the front. When defined in this way, the anisotropic conductive film 400 is preferably arranged so as to cover the end portion 161 of the organic protective film 160 existing in the region of the obliquely forward region 10D. Since the diagonally forward region 10D is a place where thermal stress is concentrated, the occurrence of disconnection is effectively suppressed by covering the end portion 161 of the organic protective film 160 existing in this region with the anisotropic conductive film 400. can do.

In the present embodiment, the width of the anisotropic conductive film 400 is widened because it is easy to change, but if possible by design, the organic protective film 160 is extended close to the source driver 300 to form the organic protective film 160. The same effect as that of the present embodiment can be obtained by bringing the end portion 161 closer to the source driver 300 and covering the end portion 161 with the covering region of the anisotropic conductive film 400 generated when the source driver 300 is mounted on the insulating substrate 110. Can be obtained. Further, the anisotropic conductive film 400 covering the end portion 161 of the organic protective film 160 and the anisotropic conductive film 400 superimposed on the source driver 300 may be formed independently of each other.

The anisotropic conductive film 400 is preferably an epoxy-based resin film (a film mainly containing epoxy as a resin component), and the epoxy-based resin film contains conductive fine particles.

The moisture-proof resin film 500 has a function of suppressing the invasion of moisture. In the frame region 10B, since the organic protective film 160, the anisotropic conductive film 400 and the source driver 300 are covered with the moisture-proof resin film 500 from the observation surface side, it is possible to prevent moisture from entering the liquid crystal display device 1. be able to. In the present embodiment, the entire top surface 310 of the source driver 300 is covered with the moisture-proof resin film 500.

The moisture-proof resin film 500 is superimposed on the anisotropic conductive film 400 between the display region 10A and the source driver 300, and covers the end portion 161 of the organic protective film 160. That is, the anisotropic conductive film 400 and the moisture-proof resin film 500 are provided on the end portion 161 of the organic protective film 160 in this order from the back surface side to the observation surface side. With such an embodiment, peeling between the film is likely to occur between the end portion 161 of the organic protective film 160 and the moisture-proof resin film 500. As a result, it becomes possible to prevent the crack 500X of the moisture-proof resin film 500 from propagating to the wiring (for example, the source wiring 141) provided on the insulating substrate 110 side of the organic protective film 160 and the organic protective film 160. It is possible to further suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

Examples of the moisture-proof resin film 500 include a styrene copolymer resin film (a film mainly containing a styrene copolymer as a resin component), an epoxy resin film (a film mainly containing epoxy as a resin component), and a urethane acrylate resin. A film (a film mainly containing urethane acrylate as a resin component) can be used. As the styrene copolymer resin film, for example, a styrene butadiene resin film (a film mainly containing styrene butadiene as a resin component) can be used, and the moisture-proof resin film 500 is preferably a styrene butadiene resin film. .. As the moisture-proof resin film 500, for example, a toffee (trade name) manufactured by Hitachi Kasei Kogyo Co., Ltd. can be used.

When the moisture-proof resin film 500 is a styrene-butadiene resin film, for example, the Young's modulus at the initial stage (immediately after film formation) at −40 ° C. is 100 MPa or more and 120 MPa or less, and the Young's modulus when held at 100 ° C. for 500 hours. Is 50 MPa or more and 60 MPa or less, and the Young's modulus when held at 100 ° C. for 1000 hours is 2000 MPa or more and 3000 MPa or less. Further, the moisture-proof resin film 500 has an initial Young's modulus of 10 MPa or more and 20 MPa or less at 20 ° C., and a Young's modulus of 10 MPa or more and 20 MPa or less when held at 100 ° C. for 500 hours, and is held at 100 ° C. for 1000 hours. The Young's modulus in this case is 2000 MPa or more and 3000 MPa or less. The moisture-proof resin film 500 has an initial Young's modulus of 1 MPa or more and 10 MPa or less at 80 ° C., and a Young's modulus of 1 MPa or more and 10 MPa or less when held at 100 ° C. for 500 hours, and is held at 100 ° C. for 1000 hours. The Young's modulus in this case is 1500 MPa or more and 2500 MPa or less.

In the initial stage (immediately after film formation), the moisture-proof resin film 500 has, for example, a linear expansion coefficient of 150 ppm / ° C or higher and 200 ppm / ° C or lower at -40 ° C, and a linear expansion coefficient of 200 ppm / ° C or higher and 300 ppm / ° C at 20 ° C. It is below ° C., and the coefficient of linear expansion at 80 ° C. is 8500 ppm / ° C. or higher and 9500 ppm / ° C. or lower.

When the organic protective film 160 is an acrylic resin film and the moisture-proof resin film 500 is a styrene-butadiene resin film, the adhesion between the organic protective film 160 and the moisture-proof resin film 500 is high, and the crack 500X of the moisture-proof resin film 500 is formed. It is easier to propagate to the underlying layer containing the organic protective film 160. Here, the adhesion between the epoxy resin film and the acrylic resin film and / or the adhesion between the epoxy resin film and the styrene butadiene resin film is the adhesion between the acrylic resin film and the styrene butadiene resin film. Lower than force. In the present embodiment, by using the anisotropic conductive film 400 as an epoxy resin film, it is possible to effectively suppress the propagation of cracks 500X of the moisture-proof resin film 500 to the underlying layer, and it is possible to effectively suppress the propagation of the cracks 500X to the underlying layer, so that the temperature and temperature are high and low. It is possible to effectively suppress the occurrence of disconnection of the source wiring 141 in an environment in which the above is repeated.

(Modification 1 of Embodiment 1)
FIG. 6A is a schematic plan view of the liquid crystal display device of the first modification of the first embodiment. FIG. 6B is a schematic plan view illustrating the arrangement of the moisture-proof resin film and the source driver included in the liquid crystal display device of the first modification of the first embodiment. FIG. 6C is a schematic cross-sectional view of the liquid crystal display device of the first modification of the first embodiment. FIG. 6C is a schematic cross-sectional view taken along the line B1-B2 of FIG. 6A. In the above embodiment, the entire top surface 310 of the source driver 300 is covered with the moisture-proof resin film 500, but the moisture-proof resin film 500 included in the liquid crystal display device 1 of the modified example is as shown in FIGS. 6A to 6C. It does not cover at least a part of the top surface 310 of the source driver 300. More specifically, as shown in FIG. 6B, the top surface 310 of the source driver 300 has a portion 311 that is not covered by the moisture-proof resin film 500.

In the liquid crystal display device, the moisture-proof resin film is oxidatively deteriorated and hardened due to the influence of the heat generated by the source driver, and cracks occur. However, as in this modification, the moisture-proof resin film 500 is the top surface of the source driver 300. By not covering at least a part of 310, it is possible to suppress the heat generated from the source driver 300 from being transmitted to the moisture-proof resin film 500 (for example, it is possible to suppress the temperature rise of the moisture-proof resin film 500 by about 5 degrees. Therefore, it is possible to suppress the occurrence of cracks 500X in the moisture-proof resin film 500. As a result, it is possible to further suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated. From the same viewpoint, it is preferable that the moisture-proof resin film 500 does not cover the entire top surface 310 of the source driver 300. Here, the top surface 310 of the source driver 300 is the surface of the source driver 300 opposite to the insulating substrate 110.

In this way, the method of suppressing the occurrence of disconnection of the source wiring 141 by not covering at least a part of the top surface 310 of the source driver 300 with the moisture-proof resin film 500 is also referred to as workaround 2 below.

The fact that the moisture-proof resin film 500 does not cover at least a part of the top surface 310 of the source driver 300 means that the moisture-proof resin film 500 does not cover 60% or more of the entire area of the top surface 310 of the source driver 300. That is, it means that the area of the portion 311 not covered with the moisture-proof resin film 500 is 60% or more of the area of the entire top surface 310 of the source driver 300. The moisture-proof resin film 500 preferably does not cover 60% or more and 100% or less of the total area of the top surface 310 of the source driver 300, and more preferably does not cover 100%.

The portion 311 not covered by the moisture-proof resin film 500 includes the central portion of the top surface 310 of the source driver 300 in the direction 10X, and is a region of 60% or more of the total area of the top surface 310 of the source driver 300. Is preferable. By adopting such an embodiment, it is possible to more effectively suppress the disconnection of the source wiring 141.

As shown in FIGS. 6A to 6C, the liquid crystal display device 1 of the present modification further includes a heat radiating sheet 600 attached to a portion 311 of the top surface 310 of the source driver 300 that is not covered with the moisture-proof resin film 500. .. With such an embodiment, the heat generated from the source driver 300 can be dissipated by the heat radiating sheet 600 (for example, the temperature rise of the moisture-proof resin film 500 can be suppressed by about 5 degrees), and the moisture-proof resin film can be suppressed. It is possible to further suppress the occurrence of cracks 500X in 500. As a result, it is possible to further suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

When the heat radiating sheet 600 is installed in order to increase the efficiency of heat diffusion, it is preferable that the source driver 300 and the heat radiating sheet 600 are in direct contact with each other in order to obtain stable heat dissipation. If the portion of the source driver 300 that is in direct contact with the heat radiating sheet 600 includes the central portion of the top surface 310 of the source driver 300 and is 60% or more of the total area of the top surface 310 of the source driver 300, the source driver 300 It is estimated that the performance (for example, the effect of suppressing the temperature rise of the moisture-proof resin film 500 by about 5 degrees) can be obtained, which is almost the same as the case where the entire top surface 310 is in direct contact with the heat radiating sheet 600.

The heat radiating sheet 600 is a heat radiating member, and is a heat conductive sheet made of an insulating resin material having high thermal conductivity. As the heat radiating sheet 600, for example, a laminated heat radiating sheet of graphite and resin called a graphite sheet can be used. The thermal conductivity of the heat radiating sheet 600 is, for example, 600 W / m · K or more and 2000 W / m · K or less.

One end 610 of the heat radiating sheet 600 is in contact with the top surface 310 of the source driver 300, and the other end 620 of the heat radiating sheet 600 is in contact with the metal chassis 700 accommodating the liquid crystal display device 1. The source driver 300 is thermally and mechanically connected to the metal chassis 700 via the heat dissipation sheet 600. The heat generated by the source driver 300 is conducted to the metal chassis 700 through the heat radiating sheet 600 and radiated.

(Modification 2 of Embodiment 1)
FIG. 7 is a schematic plan view of a frame region of the liquid crystal display device according to the second modification of the first embodiment. FIG. 8 is an enlarged plan schematic view of a frame region of the liquid crystal display device of the second modification of the first embodiment. FIG. 8 is an enlarged view of the area surrounded by the dotted line in FIG. 7. In the above embodiment, the source wiring 141 is provided radially from the source driver 300 toward the display area 10A, but in the liquid crystal display device 1 of this modified example, as shown in FIGS. 7 and 8, the source driver 300 is provided. When the direction 10Y from the display area 10A to the display area 10A (direction parallel to the vertical direction of the screen) is set to the front, the plurality of source wirings 141 are diagonally forward of the source driver 300 and are connected to the end portion 161 of the organic protective film 160. The source wiring 141 (detour source wiring 1410) extending from the source driver 300 to the display area 10A by bypassing the superimposed diagonally forward region 10D is included.

The diagonally forward region 10D is a portion where the moisture-proof resin film 500 is cured by heat and thermal stress is concentrated when the temperature is lowered. However, the source wiring 141 (bypassing source wiring 1410) bypasses the diagonally forward region 10D. ) Is provided, it is possible to further suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated. Therefore, it is preferable that the source wiring 141 is locally arranged at a wide distance in the diagonally forward region 10D so as to avoid the diagonally forward region 10D.

In this way, the plurality of source wirings 141 bypass the diagonally forward region 10D and include the source wirings 141 (bypassing source wirings 1410) extending from the source driver 300 to the display area 10A, so that the source wirings 141 are disconnected. The method of suppressing the occurrence of the above is also referred to as workaround 3 below.

It can be seen that the magnitude of the thermal stress generated when the moisture-proof resin film 500 is cured and the temperature is low depends on the location as shown in FIGS. 7 and 8. In FIG. 8, the portion surrounded by the broken line is the portion where the stress is concentrated, and the portion indicated by the alternate long and short dash line is the boundary that can be the starting point of the crack. The diagonally forward region 10D surrounded by the solid quadrangle is a place where the formation of the source wiring 141 should be avoided, and the arrow indicates the route of the source wiring 141 to be detoured.

As shown in FIGS. 7 and 8, the location where the thermal stress is concentrated is not the region directly directed from the source driver 300 to the display region 10A, but the diagonally forward region 10D slightly separated diagonally forward. By forming the source wiring 141 so as to avoid the diagonally forward region 10D, it is possible to prevent cracks generated by the concentration of thermal stress from causing disconnection.

From the requirement that cracks occur in the moisture-proof resin film 500, the locations where the cracks occur are defined as follows.

(1) It is included in the area where the moisture-proof resin film 500 is provided.
(2) Area where thermal stress (thermal stress) is concentrated when the cured moisture-proof resin film 500 becomes low temperature (3) Boundary between the organic protective film 160 and the inorganic film 150 on the TFT substrate

If the source wiring 141 is formed in the area satisfying the above (1) to (3), the wire is directly affected by the crack of the moisture-proof resin film 500 in the upper layer, and thus the disconnection occurs. By providing wiring while avoiding the places where the requirements of (3) are met, it is possible to take measures so that a defect in reliability does not cause a display defect. By setting the portion where the above requirements (1) to (3) are satisfied as the diagonally forward region 10D, the occurrence of cracks can be effectively suppressed.

FIG. 9 is a map showing the locations where disconnection occurred in the endurance thermodynamic cycle test conducted using the liquid crystal display device of the comparative form, and the results of the three liquid crystal display devices were superimposed on one liquid crystal display device. It is a plan view. As shown in FIG. 9, in the liquid crystal display device 1R of the comparative form, a printed wiring board (PWB: Printed Wild Board) 900 is connected to the frame area 10B via a flexible printed circuit board (FPC) 800. There is.

As shown in FIG. 9, when a plurality of (specifically, three) occurrence position maps are taken for the locations where the disconnection occurred in the endurance thermodynamic cycle test conducted using the liquid crystal display device of the comparative form, the temperature rises. It can be seen that the source wiring 141 is concentrated in the diagonally forward region 10D extending from the source driver 300.

Deterioration causes cracks 500X in the moisture-proof resin film 500, which applies a large stress to the underlying film, resulting in disconnection. Considering simply the place where the curing of the moisture-proof resin film 500 is promoted, this is equal to the region where the temperature rises, and the vicinity of the source driver 300 is the place where the deterioration and curing of the resin progresses violently. However, the portion where the base wiring (source wiring 141 in this modification) is damaged occurs at a position slightly distant from this. This is because the durability thermal cycle test has an effect, and the deterioration of the moisture-proof resin film 500 is promoted at a high temperature, and the crack itself occurs due to shrinkage at a low temperature. When a stress simulation was performed with the physical properties of each constituent material at a low temperature, the location where the stress was concentrated and the location where the disconnection occurred coincided.

Therefore, when the source wiring 141 is directed toward this specific narrow area, that is, the direction from the source driver 300 toward the display area 10A, the plurality of source wirings 141 are diagonally forward of the source driver 300, and the organic protective film 160 is provided. By avoiding the diagonally forward region 10D superimposed on the end portion 161 of the moisture-proof resin film 500, the influence of cracks due to curing / deterioration of the moisture-proof resin film 500 can be avoided.

As shown in FIG. 8, the obliquely forward region 10D is a region from a position 1.5 mm away from the source driver 300 to a position 2.5 mm away from the source driver in the direction 10X. That is, in the direction 10X, the end portion 300X on the diagonally forward region 10D side of the source driver 300 and the end portion 10DX1 on the source driver 300 side of the diagonally forward region 10D are separated by 1.5 mm, and the diagonally forward region of the source driver 300. The end portion 300X on the 10D side and the end portion 10DX2 on the opposite side of the source driver 300 in the diagonally forward region 10D are separated by 2.5 mm. By adopting such an aspect, it is possible to arrange the source wiring 141 while avoiding a place where stress concentration is observed, so that the source wiring 141 is disconnected in an environment where high temperature and low temperature are repeated. It can be suppressed more. Here, the direction 10Y is the direction of the source driver 300 from the surface 320 facing the display area 10A toward the display area 10A.

As shown in FIG. 8, the obliquely forward region 10D is a region from a position 0.5 mm away from the source driver 300 to a position 1.0 mm away from the source driver in the direction 10Y. That is, in the direction 10Y, the end portion 300Y on the diagonally forward region 10D side of the source driver 300 and the end portion 10DY1 on the source driver 300 side of the diagonally forward region 10D are separated by 0.5 mm, and the diagonally forward region of the source driver 300. The end portion 300Y on the 10D side and the end portion 10DY2 on the opposite side of the source driver 300 in the diagonally forward region 10D are separated by 1.0 mm. By adopting such an aspect, it is possible to arrange the source wiring 141 while avoiding a place where stress concentration is observed, so that the source wiring 141 is disconnected in an environment where high temperature and low temperature are repeated. It can be suppressed more.

(Modification 3 of Embodiment 1)
As described in the above embodiment, the organic protective film 160, the anisotropic conductive film 400 covering the end portion 161 of the organic protective film 160, and the organic protective film 160 superimposed on the anisotropic conductive film 400 and By providing the moisture-proof resin film 500 that covers the end portion 161 of the moisture-proof resin film 500, it is possible to suppress the crack 500X of the moisture-proof resin film 500 from propagating to the base layer, and it is possible to suppress the occurrence of disconnection in the source wiring 141. Can be done. In particular, it is preferable to use an acrylic resin film as the organic protective film 160, an epoxy resin film as the anisotropic conductive film 400, and a styrene butadiene resin film as the moisture-proof resin film 500.

From the above, a film similar to the acrylic resin film is arranged in the portion where the organic protective film 160 is arranged, and a film similar to the epoxy resin film is arranged in the portion where the anisotropic conductive film 400 is arranged to prevent moisture. The same effect as in the first embodiment can be obtained when a film similar to the styrene-butadiene resin film is arranged in the portion where the resin film 500 is arranged. That is, an acrylic resin film (corresponding to the organic protective film 160 as shown in FIG. 1) which is superimposed on the source wiring 141 and is provided from the display area 10A to the area 10C between the display area 10A and the source driver 300. An epoxy resin film that covers the end of the acrylic resin film (corresponding to the end 161 of FIG. 1) between the display area 10A and the source driver 300 (corresponding to the anisotropic conductive film 400 of FIG. 1). A styrene-butadiene resin film that overlaps the epoxy resin film between the display area 10A and the source driver 300 and covers the end of the acrylic resin film (corresponding to the moisture-proof resin film 500 shown in FIG. 1 and the like). By providing the above, it is possible to suppress the occurrence of disconnection of the source wiring 141.

In this way, the end of the acrylic resin film is covered with the epoxy resin film between the display area 10A and the source driver 300, and styrene butadiene is formed on the epoxy resin film between the display area 10A and the source driver 300. The method of suppressing the occurrence of disconnection of the source wiring 141 by superimposing the based resin film on the surface is also referred to as workaround 4 below.

By using each of the workarounds 1 to 4 shown above independently, it is possible to suppress the occurrence of disconnection of the source wiring 141. Further, two or more workarounds may be used in an appropriate combination, and in that case, it is possible to more effectively suppress the occurrence of disconnection of the source wiring 141.

(Embodiment 2)
In the above embodiment, the case where the display device is a liquid crystal display device has been described, but in the present embodiment, the case where the display device is an organic electroluminescence (EL) display device will be described.

FIG. 10 is a schematic plan view of the organic EL display device of the second embodiment. 11 and 12 are schematic cross-sectional views of the overhanging region of the organic EL display device of the second embodiment. 11 is a schematic cross-sectional view taken along the line C1-C2 of FIG. 10, FIG. 12 is a schematic cross-sectional view taken along the line D1-D2 of FIG. 10, and is 1.5 mm to 1.5 mm from the source driver 300 in the direction 10X. It shows a range 2.5 mm apart. FIG. 12 is a schematic cross-sectional view in the diagonally forward region 10D. In the organic EL display device, a current supply line or the like may be formed and become a heat generation source, but this is omitted in the description of the present embodiment. Further, similarly to the first embodiment, the inorganic film exists between the organic protective film 160 and the source wiring 141, but it is omitted in the description of the present embodiment.

The organic EL display device 2 of the present embodiment shown in FIGS. 10 to 12 includes a TFT substrate 100 provided with a TFT, an organic EL element provided on the TFT substrate 100 and connected to the TFT, and an organic EL element. It includes an adhesive layer provided in a frame shape so as to surround the organic EL element, and a sealing substrate 200E arranged so as to cover the organic EL element. In the adhesive layer, the peripheral edge portion of the TFT substrate 100 and the peripheral edge portion of the sealing substrate 200E are bonded to each other. As the sealing substrate 200E, for example, an insulating substrate such as a glass substrate or a plastic substrate having a thickness of 0.4 to 1.1 mm is used.

By adhering the sealing substrate 200E and the TFT substrate 100 on which the organic EL element is laminated by using an adhesive layer, the organic EL element is sealed between the pair of substrates 100 and 200E. This prevents oxygen and water from entering the organic EL element from the outside.

As the configuration of the organic EL element, for example, the layer configurations shown in the following (1) to (8) can be adopted.
(1) 1st electrode / light emitting layer / 2nd electrode (2) 1st electrode / hole transport layer / light emitting layer / electron transport layer / 2nd electrode (3) 1st electrode / hole transport layer / light emitting layer / Hole blocking layer / electron transport layer / second electrode (4) first electrode / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / electron injection layer / second electrode (5) first electrode / Hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / second electrode (6) First electrode / hole injection layer / hole transport layer / light emitting layer / hole blocking layer / electron Transport layer / second electrode (7) first electrode / hole injection layer / hole transport layer / light emitting layer / hole blocking layer / electron transport layer / electron injection layer / second electrode (8) first electrode / positive Hole injection layer / hole transport layer / electron blocking layer (carrier blocking layer) / light emitting layer / hole blocking layer / electron transport layer / electron injection layer / second electrode As described above, the hole injection layer and the positive The hole transport layer may be integrated. Further, the electron transport layer and the electron injection layer may be integrated.

Further, the configuration of the organic EL element is not particularly limited to the layer configurations (1) to (8) above, and a desired layer configuration can be adopted according to the required characteristics of the organic EL element.

The organic EL display device 2 is an active matrix type display device for RGB full-color display, and each area partitioned by the source wiring and the gate wiring is divided into red (R), green (G), or blue (B) subs. Pixels (dots) are arranged. The sub-pixels are arranged in a matrix. An organic EL element and a light emitting region of the corresponding color are formed in the sub-pixels of each color.

The organic EL display device 2 includes a display area 10A for displaying an image and a frame area 10B provided around the display area 10A. The frame region 10B includes an overhanging region 10B1 of the TFT substrate 100 that is exposed without being overlapped with the sealing substrate 200E, and various drivers are mounted on the overhanging region 10B1. A printed wiring board (PWB: Printed Wired Board) 900 is connected to the overhanging area 10B1 via a flexible printed circuit board (FPC) 800.

The TFT substrate 100 includes an insulating substrate 110, a base coat film provided on the insulating substrate 110, a plurality of gate wirings provided on the base coat film, a gate insulating film provided on the plurality of gate wirings, and a gate. A plurality of source wirings 141 provided on the insulating film and as the plurality of wirings, an inorganic film provided on the plurality of source wirings 141, and a frame area 10B, particularly an overhanging area 10B1. The source driver 300 as the driver connected to the plurality of source wirings 141, the gate driver provided in the frame area 10B, particularly the overhanging area 10B1 and connected to the plurality of gate wirings, and the gate driver provided on the inorganic film. , The organic protective film 160 which is superimposed on the plurality of source wirings 141 and is provided from the display area 10A to the area 10C between the display area 10A and the source driver 300, and is superimposed on the source driver 300 and is superimposed on the display area. An anisotropic conductive film 400 covering the end portion 161 of the organic protective film 160 between 10A and the source driver 300 and an anisotropic conductive film 400 between the display area 10A and the source driver 300 are superimposed on the anisotropic conductive film 400. It also includes a moisture-proof resin film 500 that covers the end portion 161 of the organic protective film 160.

In the present embodiment, as shown in FIGS. 10A to 12, the end portion 161 of the organic protective film 160 is covered with the anisotropic conductive film 400 between the display area 10A and the source driver 300, and the display area 10A and the source are covered with the anisotropic conductive film 400. A moisture-proof resin film 500 is superposed on the anisotropic conductive film 400 with the driver 300. The adhesion between the anisotropic conductive film 400 and the organic protective film 160 and / or the adhesion between the anisotropic conductive film 400 and the moisture-proof resin film 500 is the adhesion between the organic protective film 160 and the moisture-proof resin film 500. Therefore, by arranging the anisotropic conductive film 400 between the end portion 161 of the organic protective film 160 and the moisture-proof resin film 500, the end portion 161 of the organic protective film 160 and the moisture-proof resin film 500 can be separated from each other. Peeling between the films is likely to occur between them. As a result, it becomes possible to prevent the crack 500X of the moisture-proof resin film 500 from propagating to the wiring (for example, the source wiring 141) provided on the insulating substrate 110 side of the organic protective film 160 and the organic protective film 160. It is possible to suppress the occurrence of disconnection of the source wiring 141 in an environment where high temperature and low temperature are repeated.

As for the organic EL display device, it is possible to suppress the occurrence of disconnection of the source wiring 141 by using the above-mentioned workarounds 1 to 4 independently. Further, two or more workarounds may be used in an appropriate combination, and in that case, it is possible to more effectively suppress the occurrence of disconnection of the source wiring 141.

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

(Example 1)
FIG. 13 is a photograph showing a crack in the liquid crystal display device of Example 1 that occurred in the endurance thermodynamic cycle test. The liquid crystal display device of the first embodiment is the liquid crystal display device of the first embodiment, in which an acrylic resin film is used as the organic protective film 160, an epoxy resin film is used as the anisotropic conductive film 400, and the moisture-proof resin film 500 is used. A styrene-butadiene resin film was used.

The liquid crystal display device of Example 1 was operated at 85 ° C. for 75 minutes and then stored at −40 ° C. for 75 minutes. The endurance thermodynamic cycle test was repeated for 522 cycles (1849 hours) to further accelerate the high temperature to 110 ° C. The endurance thermodynamic cycle test was carried out, and cracks in the liquid crystal display device of Example 1 were observed. The temperature was changed at 4 ° C./min.

Under this condition, the moisture-proof resin film of the liquid crystal display device of Example 1 was cured after about 350 hours, and the moisture-proof resin film was peeled off from the anisotropic conductive film in the region surrounded by the thick black line in FIG. The cracks were generated as shown by the thick white dashed line in FIG. Further, the dotted line in the region surrounded by the alternate long and short dash line in FIG. 13 indicates the end portion of the organic protective film, and the region surrounded by the alternate long and short dash line is a place where the anisotropic conductive film gets over the step of the base film. In the area surrounded by the alternate long and short dash line, the anisotropic conductive film may not completely cover the substrate, and the portion where the anisotropic conductive film floats is thin in the area surrounded by the alternate long and short dash line. Even it appears as a white line.

In the case of a comparative liquid crystal display device not provided with the anisotropic conductive film 400, a number of severe cracks leading to disconnection are observed, but the moisture-proof resin film in Example 1 is peeled off on the anisotropic conductive film. The cracks in the moisture-proof resin film did not affect the thin film and wiring (for example, inorganic film, source wiring, etc.) on the TFT substrate in the layer below the anisotropic conductive film. From the above, it was shown that it is very effective to widen the anisotropic conductive film and provide the anisotropic conductive film between the end portion of the organic protective film and the moisture-proof resin film.

(Example 2)
FIG. 14 is a diagram showing the temperature distribution of the source driver of the liquid crystal display device of the second embodiment. The liquid crystal display device of the second embodiment is the liquid crystal display device of the first modification of the first embodiment, and uses an acrylic resin film as the organic protective film 160 and an epoxy resin film as the anisotropic conductive film 400 to prevent moisture. A styrene butadiene resin film was used as the resin film 500. Further, the thickness of the liquid crystal panel portion of the liquid crystal display device of Example 2 was 0.2 mm.

When the liquid crystal display device of Example 2 was driven at an ambient temperature of 85 ° C. for 1 hour, the backlight was turned on, and the temperature distribution of the source driver was measured, the results shown in FIG. 14 were obtained. As shown in FIG. 14, it was confirmed that the temperature rise near the center of the source driver was remarkable, and the temperature rise decreased toward the edges. The temperature of the top surface of the source driver at the first point P1 near the center was 98.1 ° C., and the temperature of the top surface of the source driver at the second point P2 near the end was 92.7 ° C.

Since the temperature is high in the region within -4 degrees from the maximum temperature near the center, it is preferable not to cover the region with a moisture-proof resin film in order to enhance the heat dissipation effect. From the results of FIG. 14, it was found that the region includes the central portion of the top surface 310 of the source driver 300 in the direction 10X and is 60% or more of the area of the entire top surface 310 of the source driver 300. ..

1, 1R: Liquid crystal display device 2: Organic EL display device 10A: Display area 10B: Frame area 10B1: Overhang area 10C: Between area 10D: Diagonal front area 10DX1, 10DX2, 10DY1, 10DY2, 300X, 300Y: End 10X : Orthogonal direction 10Y: Direction toward the display area 100: TFT substrate 110, 210: Insulation substrate 120: Base coat film 130: Gate insulating film 141: Source wiring 142: Gate wiring 143: TFT
144: Pixel electrode 150: Inorganic film 161: End 160: Organic protective film 160A: Outer region 200: CF substrate 200E: Encapsulating substrate 300: Source driver 310: Top surface 311: Uncovered portion 320, 370: Opposite Surface 350: Gate driver 400: Anisotropic conductive film 500: Moisture-proof resin film 500X: Crack
600: Heat dissipation sheet 610: One end 620: Another end 700: Metal chassis 800: Flexible printed circuit board 900: Printed wiring board 1410: Detour source wiring P1: 1st point P2: 2nd point

Claims (22)

A display device that displays an image in the display area.
Insulated substrate and
A plurality of wirings provided on the insulating substrate and extending from the display area to the frame area outside the display area.
A driver provided in the frame area and connected to the plurality of wirings,
An organic protective film that is superimposed on the plurality of wirings and is provided from the display area to the area between the display area and the driver.
An anisotropic conductive film that superimposes on the driver and covers the end portion of the organic protective film between the display area and the driver.
A display device comprising: a moisture-proof resin film that superimposes on the anisotropic conductive film between the display area and the driver and covers the end portion of the organic protective film. The organic protective film is an acrylic resin film and is
The anisotropic conductive film is an epoxy resin film, and is
The display device according to claim 1, wherein the moisture-proof resin film is a styrene-butadiene resin film. The display device according to claim 1 or 2, wherein the moisture-proof resin film does not cover at least a part of the top surface of the driver. The display device according to claim 3, wherein the moisture-proof resin film does not cover 60% or more and 100% or less of the total area of the top surface of the driver. The display device according to claim 3 or 4, further comprising a heat radiating sheet attached to a portion of the top surface of the driver that is not covered with the moisture-proof resin film. When the direction from the driver to the display area is forward
The plurality of wirings include wirings that are diagonally forward of the driver and extend from the driver to the display area, bypassing the diagonally forward region that overlaps the end of the organic protective film. The display device according to any one of claims 1 to 5. The driver is provided along the display area.
The diagonally forward region is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction from the driver toward the display area. The display device according to claim 6. The driver is provided along the display area.
The diagonally forward region is a region from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the direction from the driver toward the display area. The display device according to 6 or 7. Further, an inorganic film is provided between the plurality of wirings and the organic protective film.
The display device according to any one of claims 1 to 8, wherein the inorganic film extends to an outer region of the end portion of the organic protective film. A display device that displays an image in the display area.
Insulated substrate and
A plurality of wirings provided on the insulating substrate and extending from the display area to the frame area outside the display area.
A driver provided in the frame area and connected to the plurality of wirings,
An organic protective film that is superimposed on the plurality of wirings and is provided from the display area to the area between the display area and the driver.
A display device comprising: a moisture-proof resin film that covers an end portion of the organic protective film between the display area and the driver and does not cover at least a part of the top surface of the driver. The display device according to claim 10, wherein the moisture-proof resin film does not cover 60% or more and 100% or less of the total area of the top surface of the driver. The display device according to claim 10 or 11, further comprising a heat radiating sheet attached to a portion of the top surface of the driver that is not covered with the moisture-proof resin film. When the direction from the driver to the display area is forward
The plurality of wirings include wirings that are diagonally forward of the driver and extend from the driver to the display area, bypassing the diagonally forward region that overlaps the end of the organic protective film. The display device according to any one of claims 9 to 12. The driver is provided along the display area.
The diagonally forward region is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction from the driver toward the display area. The display device according to claim 13. The driver is provided along the display area.
The diagonally forward region is a region from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the direction from the driver toward the display area. The display device according to 13 or 14. Further, an inorganic film is provided between the plurality of wirings and the organic protective film.
The display device according to any one of claims 10 to 15, wherein the inorganic film extends to an outer region of the end portion of the organic protective film. A display device that displays an image in the display area.
Insulated substrate and
A plurality of wirings provided on the insulating substrate and extending from the display area to the frame area outside the display area.
A driver provided in the frame area and connected to the plurality of wirings,
An organic protective film that is superimposed on the plurality of wirings and is provided from the display area to the area between the display area and the driver.
A moisture-proof resin film that covers the end of the organic protective film between the display area and the driver is provided.
When the direction from the driver to the display area is forward
The plurality of wirings include wirings that are diagonally forward of the driver and extend from the driver to the display area, bypassing the diagonally forward region that overlaps the end of the organic protective film. Characteristic display device. The driver is provided along the display area.
The diagonally forward region is a region from a position 1.5 mm away from the driver to a position 2.5 mm away from the driver in a direction orthogonal to the direction from the driver toward the display area. The display device according to claim 17. The driver is provided along the display area.
The diagonally forward region is a region from a position 0.5 mm away from the driver to a position 1.0 mm away from the driver in the direction from the driver toward the display area. The display device according to 18. Further, an inorganic film is provided between the plurality of wirings and the organic protective film.
The display device according to any one of claims 17 to 19, wherein the inorganic film extends to an outer region of the end portion of the organic protective film. The display device according to any one of claims 1 to 20, wherein the display device is a liquid crystal display device. The display device according to any one of claims 1 to 20, wherein the display device is an organic electroluminescence display device.

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