JP2021166284A5 - - Google Patents
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- JP2021166284A5 JP2021166284A5 JP2021043156A JP2021043156A JP2021166284A5 JP 2021166284 A5 JP2021166284 A5 JP 2021166284A5 JP 2021043156 A JP2021043156 A JP 2021043156A JP 2021043156 A JP2021043156 A JP 2021043156A JP 2021166284 A5 JP2021166284 A5 JP 2021166284A5
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- 239000000758 substrate Substances 0.000 claims 51
- 238000000034 method Methods 0.000 claims 23
- 238000001878 scanning electron micrograph Methods 0.000 claims 5
- 238000010801 machine learning Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/821,831 US11321835B2 (en) | 2020-03-17 | 2020-03-17 | Determining three dimensional information |
| US16/821,831 | 2020-03-17 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021166284A JP2021166284A (ja) | 2021-10-14 |
| JP2021166284A5 true JP2021166284A5 (https=) | 2024-03-27 |
| JP7648410B2 JP7648410B2 (ja) | 2025-03-18 |
Family
ID=77677735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021043156A Active JP7648410B2 (ja) | 2020-03-17 | 2021-03-17 | 3次元情報の決定 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11321835B2 (https=) |
| JP (1) | JP7648410B2 (https=) |
| KR (1) | KR102765100B1 (https=) |
| CN (1) | CN113405493B (https=) |
| TW (1) | TWI859429B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11288174B2 (en) | 2020-02-19 | 2022-03-29 | Applied Materials Israel Ltd. | Testing a code using real time analysis |
| US11443420B2 (en) * | 2020-12-28 | 2022-09-13 | Applied Materials Israel Ltd. | Generating a metrology recipe usable for examination of a semiconductor specimen |
| US12480898B2 (en) | 2022-09-01 | 2025-11-25 | Applied Materials Israel Ltd. | Z-profiling of wafers based on X-ray measurements |
| JP7754058B2 (ja) * | 2022-11-11 | 2025-10-15 | トヨタ自動車株式会社 | 情報処理装置、情報処理方法、及び情報処理プログラム |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3490490B2 (ja) * | 1994-01-28 | 2004-01-26 | 株式会社東芝 | パターン画像処理装置及び画像処理方法 |
| US6246787B1 (en) * | 1996-05-31 | 2001-06-12 | Texas Instruments Incorporated | System and method for knowledgebase generation and management |
| JP3961657B2 (ja) * | 1998-03-03 | 2007-08-22 | 株式会社東芝 | パターン寸法測定方法 |
| US6670610B2 (en) | 2001-11-26 | 2003-12-30 | Applied Materials, Inc. | System and method for directing a miller |
| WO2005008223A2 (en) * | 2003-07-18 | 2005-01-27 | Applied Materials Israel, Ltd. | Methods for defect detection and process monitoring based on sem images |
| WO2005036464A2 (en) * | 2003-10-08 | 2005-04-21 | Applied Materials Israel, Ltd. | A measurement system and a method |
| US8098926B2 (en) * | 2007-01-10 | 2012-01-17 | Applied Materials Israel, Ltd. | Method and system for evaluating an evaluated pattern of a mask |
| US7667858B2 (en) * | 2007-01-12 | 2010-02-23 | Tokyo Electron Limited | Automated process control using optical metrology and a correlation between profile models and key profile shape variables |
| US7511835B2 (en) * | 2007-04-12 | 2009-03-31 | Tokyo Electron Limited | Optical metrology using a support vector machine with simulated diffraction signal inputs |
| US8709269B2 (en) | 2007-08-22 | 2014-04-29 | Applied Materials Israel, Ltd. | Method and system for imaging a cross section of a specimen |
| KR101286240B1 (ko) * | 2007-10-23 | 2013-07-15 | 삼성전자주식회사 | 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법 |
| US20090296073A1 (en) | 2008-05-28 | 2009-12-03 | Lam Research Corporation | Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope |
| JP5479782B2 (ja) * | 2009-06-02 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法 |
| US8375032B2 (en) * | 2009-06-25 | 2013-02-12 | University Of Tennessee Research Foundation | Method and apparatus for predicting object properties and events using similarity-based information retrieval and modeling |
| JP2011027461A (ja) * | 2009-07-22 | 2011-02-10 | Renesas Electronics Corp | パターン形状計測方法、半導体装置の製造方法、およびプロセス制御システム |
| BR112014009093B1 (pt) * | 2011-10-14 | 2021-08-17 | Ingrain, Inc | Método para gerar uma imagem multidimensional de uma amostra, método de criar um volume tridimensional, método para gerar uma imagem digital tridimensional de uma amostra, e, sistema para gerar imagens digitais tridimensionais de uma amostra |
| US8838422B2 (en) * | 2011-12-11 | 2014-09-16 | Tokyo Electron Limited | Process control using ray tracing-based libraries and machine learning systems |
| EP3336608A1 (en) * | 2016-12-16 | 2018-06-20 | ASML Netherlands B.V. | Method and apparatus for image analysis |
| WO2019006222A1 (en) * | 2017-06-30 | 2019-01-03 | Kla-Tencor Corporation | SYSTEMS AND METHODS FOR PREDICTING DEFECTS AND CRITICAL DIMENSION USING DEEP LEARNING IN A SEMICONDUCTOR MANUFACTURING PROCESS |
| EP3451061A1 (en) * | 2017-09-04 | 2019-03-06 | ASML Netherlands B.V. | Method for monitoring a manufacturing process |
| EP3682376A1 (en) * | 2017-09-15 | 2020-07-22 | Saudi Arabian Oil Company | Inferring petrophysical properties of hydrocarbon reservoirs using a neural network |
| JP6937254B2 (ja) * | 2018-02-08 | 2021-09-22 | 株式会社日立ハイテク | 検査システム、画像処理装置、および検査方法 |
| JP6995191B2 (ja) | 2018-04-10 | 2022-01-14 | 株式会社日立製作所 | 加工レシピ生成装置 |
| TWI694537B (zh) * | 2018-07-08 | 2020-05-21 | 香港商康代影像技術方案香港有限公司 | 用於失準補償之系統及方法 |
| US10811219B2 (en) | 2018-08-07 | 2020-10-20 | Applied Materials Israel Ltd. | Method for evaluating a region of an object |
| US20200027021A1 (en) * | 2019-09-27 | 2020-01-23 | Kumara Sastry | Reinforcement learning for multi-domain problems |
-
2020
- 2020-03-17 US US16/821,831 patent/US11321835B2/en active Active
-
2021
- 2021-03-15 TW TW110109090A patent/TWI859429B/zh active
- 2021-03-17 KR KR1020210034550A patent/KR102765100B1/ko active Active
- 2021-03-17 CN CN202110287046.6A patent/CN113405493B/zh active Active
- 2021-03-17 JP JP2021043156A patent/JP7648410B2/ja active Active
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