JP2021165432A - 成膜装置、成膜装置の制御装置及び成膜方法 - Google Patents

成膜装置、成膜装置の制御装置及び成膜方法 Download PDF

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Publication number
JP2021165432A
JP2021165432A JP2021037846A JP2021037846A JP2021165432A JP 2021165432 A JP2021165432 A JP 2021165432A JP 2021037846 A JP2021037846 A JP 2021037846A JP 2021037846 A JP2021037846 A JP 2021037846A JP 2021165432 A JP2021165432 A JP 2021165432A
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JP
Japan
Prior art keywords
process chamber
film
film forming
getter
targets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021037846A
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English (en)
Japanese (ja)
Other versions
JP2021165432A5 (zh
Inventor
弘士 薬師神
Hiroshi Yakushigami
怜士 坂本
Reiji Sakamoto
雅弘 芝本
Masahiro Shibamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021512593A external-priority patent/JP6932873B1/ja
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of JP2021165432A publication Critical patent/JP2021165432A/ja
Publication of JP2021165432A5 publication Critical patent/JP2021165432A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Drying Of Semiconductors (AREA)
  • Magnetic Heads (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2021037846A 2020-04-01 2021-03-09 成膜装置、成膜装置の制御装置及び成膜方法 Pending JP2021165432A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020065522 2020-04-01
JP2020065522 2020-04-01
JP2021512593A JP6932873B1 (ja) 2020-04-01 2020-11-11 成膜装置、成膜装置の制御装置及び成膜方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2021512593A Division JP6932873B1 (ja) 2020-04-01 2020-11-11 成膜装置、成膜装置の制御装置及び成膜方法

Publications (2)

Publication Number Publication Date
JP2021165432A true JP2021165432A (ja) 2021-10-14
JP2021165432A5 JP2021165432A5 (zh) 2023-10-17

Family

ID=77928387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021037846A Pending JP2021165432A (ja) 2020-04-01 2021-03-09 成膜装置、成膜装置の制御装置及び成膜方法

Country Status (3)

Country Link
JP (1) JP2021165432A (zh)
TW (2) TWI807269B (zh)
WO (1) WO2021199479A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637074A (ja) * 1992-07-17 1994-02-10 Fujitsu Ltd 半導体製造装置のクリーニング方法
JP3593363B2 (ja) * 1994-08-10 2004-11-24 株式会社東芝 半導体薄膜を具備するアクティブマトリックス型液晶表示装置の製造方法
JPH09320963A (ja) * 1996-05-20 1997-12-12 Applied Materials Inc Ｃｖｄチャンバを清掃した後に調整するための方法
CN101492811B (zh) * 2009-02-20 2012-01-25 电子科技大学 一种自吸气真空镀膜方法
JP6013901B2 (ja) * 2012-12-20 2016-10-25 東京エレクトロン株式会社 Ｃｕ配線の形成方法
KR101991187B1 (ko) * 2014-10-10 2019-06-19 캐논 아네르바 가부시키가이샤 성막 장치
JP7117332B2 (ja) * 2017-06-14 2022-08-12 アプライド マテリアルズ インコーポレイテッド フレキシブル基板をコーティングするための堆積装置、及びフレキシブル基板をコーティングする方法

Also Published As

Publication number Publication date
TW202336253A (zh) 2023-09-16
WO2021199479A1 (ja) 2021-10-07
TWI837004B (zh) 2024-03-21
TWI807269B (zh) 2023-07-01
TW202140828A (zh) 2021-11-01

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